JP2010135830A - Manufacturing method of laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated ceramic electronic component, which includes a process which obtains a laminate by supplying a mother ceramic green sheet supported by a carrier film and laminating the same highly accurately using a transfer/pressure bonding method for the mother ceramic green sheet. <P>SOLUTION: The manufacturing method of the laminated ceramic electronic component includes a process wherein the mother ceramic green sheet 1, supported by the carrier film 2, is bonded by pressure to the outer peripheral surface of the first retaining roll 7 from the side of the mother ceramic green sheet 1 and only the mother ceramic green sheet 1 retained by the retaining roll 7 is laminated on the outer peripheral surface of the laminated roll 11 as a lamination stage after peeling the carrier film 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor, and more specifically, includes a step of laminating a long ceramic green sheet supported by a carrier film while peeling the carrier film. The present invention relates to a method for manufacturing a laminated ceramic electronic component.

  Conventionally, when a multilayer ceramic electronic component such as a multilayer ceramic capacitor is manufactured, a plurality of mother ceramic green sheets are laminated to obtain a mother laminate. An example of a method for manufacturing a multilayer ceramic electronic component including a step of obtaining such a mother laminate is disclosed in Patent Document 1 below.

  FIG. 10 is a front cross-sectional view for explaining the mother ceramic green sheet laminating step described in Patent Document 1.

  As shown in FIG. 10, a long mother ceramic green sheet 102 is supported on a carrier film 101. An internal electrode 103 is printed on the mother ceramic green sheet 102. The long mother ceramic green sheet 102 is supplied to the heating roll 104 while being supported by the carrier film 101. The heating roll 104 presses the mother ceramic green sheet 102 toward the lamination stage 105 as indicated by an arrow A. In this manner, the mother ceramic green sheet 102 is thermocompression bonded to the mother ceramic green sheet 102A that has been laminated.

  Thereafter, the carrier film 101 is peeled from the upper part of the laminate using the peeling claws 106 and the peeling roll 107.

  In the manufacturing method described in this prior art, the carrier film 101 is peeled off from the ceramic green sheet 102 by changing the direction so as to form a predetermined peeling angle with the upper surface of the laminate using the peeling claws 106. It is said that it can be peeled off without difficulty.

  On the other hand, the following Patent Document 2 shows a manufacturing process of the mother laminate shown in FIG. As shown in FIG. 11, here, a mother ceramic green sheet 121 supported by a carrier film is supplied from a feeding roll 122. The long ceramic green sheet 121 supported by the carrier film is supplied between the laminating roll 123 and the peeling roll 124. Then, the ceramic green sheet 121 is thermocompression bonded onto the ceramic green sheet previously laminated on the lamination roll 123, and the carrier film 125 is peeled off from the ceramic green sheet 121 and taken up on the take-up roll 126.

  Further, the internal electrode pattern is printed on the laminated roll 123 by the printing device 127. In this way, the ceramic green sheets on which the internal electrode patterns are printed are sequentially laminated on the lamination roll 123 to obtain a mother laminate. After the predetermined number of mother ceramic green sheets are laminated, the mother laminate is removed from the lamination roll 123. Next, this laminated body of mothers is extended in a planar shape and cut.

JP 2000-252161 A Japanese Patent Laid-Open No. 9-129483

  In the manufacturing methods described in Patent Document 1 and Patent Document 2, since the long mother ceramic green sheets are stacked, the manufacturing efficiency of the mother stacked body can be increased. Further, since it is only necessary to control the feeding direction of the elongated mother ceramic green sheets, the laminating apparatus and the like can be simplified as compared with the case of stacking rectangular mother ceramic green sheets.

  Furthermore, when laminating the next mother ceramic green sheet on the mother ceramic green sheet that has been previously laminated, the linear crimping part will move in sequence, so that when crimping on the surface In comparison, the pressure-bonding force can be reduced. Therefore, the lamination can be performed using a manufacturing facility with a small crimping force. In addition, since the linear crimping portion moves in the length direction of the ceramic green sheet and lamination is performed, it is difficult for air to be caught between the ceramic green sheets, and the ceramic green sheet is hardly damaged.

  However, in the methods described in Patent Document 1 and Patent Document 2, the ceramic green sheets are handled in a state of being supported on a carrier film during lamination. Therefore, after laminating the ceramic green sheets, the carrier film has to be peeled from the ceramic green sheets.

  That is, in a state where the mother ceramic green sheet was supported by the carrier film, the carrier film was peeled off from the mother ceramic green sheet after being pressed onto the mother ceramic green sheet previously laminated. Therefore, in order to peel off the carrier film, the above-described pressure bonding step and peeling step have to be performed. In addition, the adhesion between the ceramic green sheets must be higher than the adhesion between the ceramic green sheets and the carrier film. As a result, the pressure and temperature at the time of provisional pressure bonding using a pressure roller or the like have to be set high. For this reason, high pressure has been repeatedly applied to the already laminated ceramic green sheets at high temperatures. Accordingly, there has been a problem that the mother ceramic green sheets that have already been laminated are spread in a direction perpendicular to the crimping direction, causing a positional shift in the surface direction of the internal electrode pattern.

  Further, as described above, since the crimping-peeling process has to be performed many times, the manufacturing apparatus tends to be complicated. In addition, since the adhesion between the mother ceramic green sheets must be higher than the adhesion between the carrier film and the mother ceramic green sheets, the composition of the ceramic green sheets is also limited.

  The object of the present invention is to eliminate the above-mentioned disadvantages of the prior art and to use a long ceramic green sheet supported by a carrier film to obtain a mother laminate with high accuracy and efficiency. An object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component provided.

  The present invention provides a step of preparing a long ceramic green sheet held on a long carrier film, and the long ceramic green sheet held on the long carrier film can be rotated. And holding the ceramic green sheet while holding the ceramic green sheet, the step of peeling the carrier film from the ceramic green sheet, and the ceramic green sheet held by the holding roll from the holding roll Peeling, laminating at the laminated portion, obtaining a mother laminated body, cutting the mother laminated body to obtain a laminated body of individual multilayer ceramic electronic component units from the mother laminated body, and cutting And a step of firing the obtained laminated body.

  In the step of peeling the carrier film from the ceramic green sheet while holding the ceramic green sheet on the holding roll, as long as the carrier film is peeled from the ceramic green sheet while the ceramic green sheet is held on the holding roll, the ceramic green The position on the holding roll where the sheet is held and the position where the carrier film is peeled off from the ceramic green sheet may be either upstream or downstream.

  In a specific aspect of the present invention, in the step of peeling the carrier film from the ceramic green sheet while holding the ceramic green sheet on the holding roll, the ceramic green sheet is first held on the holding roll, and the ceramic green sheet is Peeling of the carrier film is started at any position within the held position range.

  In this case, the carrier film may be peeled off at the position where the holding of the ceramic green sheet is started on the holding roll. Preferably, the carrier film starting position is higher than the holding start position of the ceramic green sheet. Is located on the downstream side of the outer peripheral surface. Thereby, the carrier film can be peeled off more reliably.

  In a specific aspect of the present invention, each step of holding the ceramic green sheet, peeling the carrier film, and peeling the ceramic green sheet from the holding roll for lamination to the laminated portion is performed on the outer periphery of the holding roll. Performed simultaneously or sequentially on the surface.

  In another specific aspect of the present invention, the holding roll is a suction roll or an adhesive roll having an adhesive outer peripheral surface.

  In still another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, the ceramic green sheet is laminated in the laminated portion by temporarily pressing the ceramic green sheet with a holding roll in the laminated portion, and then holding the ceramic green sheet. It is performed by peeling from the roll.

  In still another specific aspect of the method for producing a multilayer ceramic electronic component according to the present invention, after the ceramic green sheet is peeled off from the holding roll at the stacking portion and stacked, the ceramic green sheet is pressed by a pressing roll other than the holding roll. Temporary pressure bonding between sheets is performed.

  In another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, the multilayer part is heated, and a plurality of ceramic green sheets are thermocompression bonded in the multilayer part.

  In still another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, the ceramic green sheet held by the holding roll is cooled.

  In still another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, a plurality of the holding rolls are used for one laminated portion.

  In still another specific aspect of the method for producing a multilayer ceramic electronic component of the present invention, among the plurality of holding rolls, a stacking direction by an odd-numbered holding roll and a stacking direction by an even-numbered holding roll are 180. ° It is different.

  In still another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, A (Pa) is a pressure-bonding force during stacking in a stacking portion, B (Pa) is an adhesive force between green sheets after stacking, and stacking When the minimum pressure for deforming the body is C (Pa), C> A> B.

  In still another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, the multilayer portion includes a multilayer roll on which ceramic green sheets are stacked on the outer peripheral surface.

  According to still another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, the peripheral speed of the holding roll and the peripheral speed of the multilayer roll are the same.

  In still another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, in the longitudinal direction of the ceramic green sheet, the tension of the ceramic green sheet increases the curvature of the portion to which the ceramic green sheet is pressed. It is gradually increased according to.

  In another specific aspect of the method for manufacturing a multilayer ceramic electronic component according to the present invention, the multilayer part is configured using a flat multilayer stage.

  According to still another specific aspect of the method of manufacturing a multilayer ceramic electronic component according to the present invention, the multilayer stage is configured to be moved along the length direction of the ceramic green sheet, and the multilayer stage And the peripheral speed of the holding roll are equal.

  In the method for manufacturing a multilayer ceramic electronic component according to the present invention, the carrier film is peeled from the ceramic green sheet while the long ceramic green sheet held on the carrier film is held on a holding roll. And the ceramic green sheet currently hold | maintained at the holding roll is peeled from this holding roll, and is laminated | stacked in a lamination | stacking part, and the laminated body of a mother is obtained. When laminating, the ceramic green sheet supported by the carrier film is pressure-bonded to the previously laminated ceramic green sheet, and the carrier film is peeled off in the conventional method, so the carrier film needs to be peeled off. A great deal of pressure had to be applied. On the other hand, in the present invention, the carrier film is separated from the ceramic green sheet prior to the lamination in the lamination part as described above. Therefore, since only the long ceramic green sheet has to be laminated at the laminated portion, the pressure-bonding force at the time of lamination can be reduced. Therefore, it is difficult to apply a large pressure to the ceramic green sheet many times at a high temperature, so that the ceramic green sheet is difficult to spread. In addition, it is difficult to cause positional deviation or lamination deviation in the surface direction of the internal electrode in the mother laminate. Therefore, it is possible to provide a multilayer ceramic electronic component having high accuracy and excellent reliability.

  In the conventional method in which the ceramic green sheet supported by the carrier film is pressure-bonded to the previously laminated ceramic green sheet and the carrier film is peeled off, the adhesion between the ceramic green sheets is increased between the carrier film and the ceramic green sheet. It had to be set to be higher than the adhesion. On the other hand, in the present invention, since the carrier film is separated from the ceramic green sheet prior to lamination, it is not necessary to increase the adhesion between the ceramic green sheets than the adhesion between the carrier film and the ceramic green sheet. . Therefore, ceramic green sheets having various compositions can be used.

  In the method for manufacturing a multilayer ceramic electronic component according to the present invention, when the ceramic green sheet is first held by the holding roll, and the peeling of the carrier film is started within the position range where the ceramic green sheet is held on the holding roll. Even when a ceramic green sheet having a thin film thickness is used, the carrier film can be reliably and easily peeled without damaging the ceramic green sheet.

  The long ceramic green sheet held by the carrier film is held by the holding roll, and the carrier film is peeled from the ceramic green sheet. And only the ceramic green sheet currently hold | maintained at the holding roll is peeled from this holding roll, and is laminated | stacked in a lamination | stacking part, and a laminated body of mother is obtained. When laminating, the ceramic green sheet supported by the carrier film is pressure-bonded to the previously laminated ceramic green sheet, and the carrier film is peeled off in the conventional method, so the carrier film needs to be peeled off. A great deal of pressure had to be applied. On the other hand, in the present invention, the carrier film is separated from the ceramic green sheet prior to the lamination in the lamination part as described above. Therefore, since only the long ceramic green sheet has to be laminated at the laminated portion, the pressure-bonding force at the time of lamination can be reduced. Therefore, it is difficult to apply a large pressure to the ceramic green sheet many times at a high temperature, so that the ceramic green sheet is difficult to spread. In addition, it is difficult to cause positional deviation or lamination deviation in the surface direction of the internal electrode in the mother laminate. Therefore, it is possible to provide a multilayer ceramic electronic component having high accuracy and excellent reliability. In addition, the conventional method in which the ceramic green sheet supported by the carrier film is pressure-bonded to the previously laminated ceramic green sheet and the carrier film is peeled off, the adhesion between the ceramic green sheets is determined by the carrier film and the ceramic green sheet. In the present invention, the carrier film is separated from the ceramic green sheet prior to lamination, so that the carrier film and the ceramic green sheet are in close contact with each other. There is no need to increase the adhesion between ceramic green sheets compared to the strength. Therefore, ceramic green sheets having various compositions can be used.

  When each step of holding the ceramic green sheet, peeling the carrier film, and peeling the ceramic green sheet from the holding roll for lamination to the laminated part is performed simultaneously or continuously on the outer peripheral surface of the holding roll The productivity of the method for manufacturing a multilayer ceramic electronic component according to the present invention can be increased.

  When the holding roll is a suction roll or an adhesive roll whose outer peripheral surface is adhesive, the ceramic green sheet can be reliably held on the outer peripheral surface of the holding roll using suction or adhesive force.

  In the lamination of the ceramic green sheet, the ceramic green sheet held in the holding roll is temporarily pressed onto the ceramic green sheet previously laminated in the lamination part, and then the ceramic green sheet is peeled off from the holding roll. When this is done, the ceramic green sheets can be securely adhered to each other. In this case, the carrier film does not need to be peeled off, so that the temporary pressure bonding force can be made lower than the pressure bonding force in the conventional method. Accordingly, it is difficult for the stacking displacement and the internal electrode position shifting in the obtained mother laminate to occur.

  After the ceramic green sheets are peeled off from the holding rolls at the stacking portion and laminated, when the ceramic green sheets are pressed with a pressing roll other than the holding rolls, the ceramic green sheets are bonded to each other using the pressing roll. Is firmly attached. Also in this case, since the crimping force by the crimping roll may be lower than the crimping force in the case of the conventional manufacturing method, the stacking deviation in the mother laminate and the positional deviation of the internal electrodes are unlikely to occur.

  The laminated part may be heated, and therefore a plurality of ceramic green sheets may be thermocompression bonded in the laminated part. Thus, when a plurality of ceramic green sheets are thermocompression bonded, the adhesion between the ceramic green sheets can be increased.

  When the ceramic green sheet held by the holding roll is cooled, it is possible to suppress the elongation of the ceramic green sheet on the holding roll, and to transfer the ceramic green sheet having excellent dimensional accuracy from the holding roll to the laminated portion. Can be supplied.

  A plurality of holding rolls may be used for one laminated portion. In that case, ceramic green sheets having various internal electrode patterns and the like are supplied by supplying ceramic green sheets from the plurality of holding rolls to the laminated portions, respectively. Sheets can be laminated.

  Among the plurality of holding rolls, when the stacking direction of the odd-numbered holding rolls and the stacking direction of the even-numbered holding rolls are different from each other by 180 °, the ceramic green sheets can be stacked from both sides of the stacking portion. This can increase the efficiency of the lamination process.

  When the pressure at the time of lamination in the lamination part is A (Pa), the adhesion between the green sheets after lamination is B (Pa), and the minimum pressure for deforming the laminated body is C (Pa), C> When A> B, the ceramic green sheets can be brought into close contact with each other by pressure bonding without causing deformation of the mother laminate.

  When the laminated portion has a laminated roll in which ceramic green sheets are laminated on the outer peripheral surface, a mother laminate in which a plurality of ceramic green sheets are laminated on the laminated roll can be efficiently obtained, And the laminated body of mother can be taken out continuously from a lamination roll.

  When the peripheral speed of the holding roll and the peripheral speed of the laminated roll are the same, the ceramic green sheet can be reliably laminated on the outer peripheral face of the laminated roll from the outer peripheral face of the holding roll.

  When the tension of the ceramic green sheet in the longitudinal direction of the ceramic green sheet is gradually increased in accordance with the increase in the curvature of the portion to which the ceramic green sheet is to be crimped, the portion to which the ceramic green sheet is crimped, that is, the tip In the case where the curvature of the surface of the portion to be pressure-bonded is increased, the ceramic green sheets are extended and laminated according to the curvature. Therefore, a plurality of layers of ceramic green sheets can be laminated with high accuracy on the lamination roll.

  In the case where the stacking section is configured using a flat stacking stage, a mother stack is obtained on the flat stacking stage. Therefore, a mother laminate in an unmixed state can be obtained immediately, and there is no need to force bending of the mother laminate.

  When the lamination stage is configured along the length direction of the ceramic green sheet and the moving speed of the lamination stage is equal to the peripheral speed of the holding roll, the holding stage is rotated and held. The ceramic green sheets can be efficiently laminated on the lamination stage.

BRIEF DESCRIPTION OF THE DRAWINGS Schematic block diagram for demonstrating the manufacturing method of the multilayer ceramic electronic component which concerns on the 1st Embodiment of this invention. The partial notch front view which shows the ceramic green sheet of the 1st mother supported by the mother carrier film and mother carrier film which are supplied in 1st Embodiment. The schematic partial notch front view which expands and shows the part shown with the dashed-two dotted line B of FIG. The schematic front view for demonstrating the manufacturing method of the multilayer ceramic electronic component which concerns on 2nd Embodiment. The schematic front view for demonstrating the manufacturing method of the multilayer ceramic electronic component which concerns on the 3rd Embodiment of this invention. The schematic front view for demonstrating the modification of the manufacturing method shown in FIG. The schematic front view for demonstrating the lamination process using the manufacturing apparatus shown in FIG. The schematic front view for demonstrating the manufacturing method using the modification of the manufacturing apparatus shown in FIG. The schematic front view for demonstrating the modification of the manufacturing method of the multilayer ceramic capacitor shown in FIG. The partial notch front sectional drawing for demonstrating an example of the manufacturing method of the conventional multilayer ceramic capacitor. The schematic front view for demonstrating the other example of the manufacturing method of the conventional multilayer ceramic capacitor.

  Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of a laminating apparatus for explaining a method for producing a monolithic ceramic electronic component according to an embodiment of the present invention.

  In the present embodiment, the first and second mother ceramic green sheets 1 and 3 supported by the carrier film are supplied in the directions indicated by the arrows A1 and B1 in the drawing. As shown in FIG. 2, the first mother ceramic green sheet 1 is supported by a long first carrier film 2. An internal electrode pattern 5 is formed on the first mother ceramic green sheet 1. The internal electrode pattern 5 is formed on the ceramic green sheet 1 by screen printing of a conductive paste or the like. In this embodiment, a multilayer ceramic capacitor is manufactured as a multilayer ceramic electronic component. Therefore, the internal electrode pattern 5 is provided in order to constitute the internal electrode of the multilayer ceramic capacitor.

  On the other hand, the ceramic green sheet 3 of the second mother is laminated to constitute an outer layer portion of the multilayer ceramic capacitor, that is, a ceramic layer portion where no internal electrode is formed. Therefore, the internal electrode pattern is not printed on the mother ceramic green sheet 3.

  As shown in FIG. 1, the ceramic green sheet 1 of the first mother is supplied between the holding roll 7 and the peeling roll 8 through the roll 6a and the cutter 6b. The cutter 6b is provided in order to cut the excess part outside the both side edges of the ceramic green sheet 1 of the mother. The peeling roll 8 acts to press the mother ceramic green sheet 1 against the outer peripheral surface of the holding roll 7.

  The holding roll 7 is prepared to temporarily hold the mother ceramic green sheet 1 on its outer peripheral surface, and is rotated clockwise as shown. Since the holding roll 7 is used to hold the mother ceramic green sheet 1 on the outer peripheral surface thereof, the holding roll 7 is preferably configured to have a large number of suction holes opened on the outer peripheral surface. By sucking through the suction holes, the mother ceramic green sheet 1 can be reliably sucked and held on the outer peripheral surface of the holding roll 7. Alternatively, the outer peripheral surface of the holding roll 7 may be an adhesive surface, and the mother ceramic green sheet 1 may be held using the adhesive force of the adhesive surface. However, suction holes may not be provided on the outer peripheral surface of the holding roll 7, and an adhesive surface need not necessarily be formed. That is, as long as the mother ceramic green sheet 1 can be held on the outer peripheral surface of the holding roll 7, the outer peripheral surface of the holding roll 7 can have various forms.

  The mother ceramic green sheet 1 is pressed against the outer peripheral surface of the holding roll 7 by the peeling roll 8, and the carrier film 2 supporting the mother ceramic green sheet 1 is peeled off. The carrier film 2 is wound up through a roll 9.

  On the other hand, only the long mother ceramic green sheet 1 from which the carrier film 2 is peeled is held on the outer peripheral surface of the holding roll 7. A cutter 10 is arranged at a predetermined position in the circumferential direction of the holding roll 7. The cutter 10 is disposed to cut the ceramic green sheet 1 into a length that is used for lamination.

  On the other hand, the ceramic green sheet 3 of the second mother is similarly passed between the roll 11a and the cutter 11b while being supported by the second carrier film 4. By this cutter 11b, the excess portion outside the both side edges of the mother ceramic green sheet 3 is cut.

  Thereafter, the mother ceramic green sheet 3 supported by the carrier film is supplied between the holding roll 12 and the peeling roll 13, and the mother ceramic green sheet 3 is pressure-bonded to the holding roll 12. Then, the carrier film 4 supporting the mother ceramic green sheet 3 is peeled off by the peeling roll 13. The carrier film 4 is wound up via a roll 14.

  On the outer peripheral surface of the holding roll 12, only the mother ceramic green sheet 3 is held, and the second ceramic green sheet 3 is laminated at the laminated portion by a cutter 15 provided at a position in the circumferential direction of the holding roll 12. Is cut to length.

  Between the 1st holding roll 7 and the 2nd holding roll 12, the lamination roll 16 which comprises the lamination part is arrange | positioned. A first mother ceramic green sheet 1A (see FIG. 3) that is held on the outer peripheral surface of the holding roll 7 on the outer peripheral surface 16a of the multi-layer roll 16 and is cut to an appropriate length for stacking, and the second The second mother ceramic green sheet 3A (see FIG. 3) which is held on the outer peripheral surface of the holding roll 12 and cut to a length suitable for lamination is laminated.

  A plurality of grooves 16b extending in parallel to the axial direction of the laminated rolls are provided on the outer peripheral surface 16a of the laminated rolls 16 with appropriate intervals. Between the grooves 16b, 16b constitutes a lamination stage in which a single mother laminate is laminated. That is, the mother ceramic green sheet 1A and the mother ceramic green sheet 3A are laminated on the outer peripheral surface portion of the laminated roll between the grooves 16b and 16b.

  An under film 16d is attached to the outer peripheral surface of the laminated roll 16 so as to be removable from the outer peripheral surface 16a.

  The under film 16d is provided in order to facilitate removal of the laminated body of the mother after lamination from the outer peripheral surface of the lamination roll 16. As such an under film 16d, it is desirable to use a strong plastic film such as a polyethylene terephthalate film. However, the under film 16d may be made of a resin film other than polyethylene terephthalate as long as the mother ceramic laminate can be taken out.

  In general, ceramic green sheets tend to shrink after being peeled from the carrier film. Accordingly, when the mother ceramic green sheets 1A, 3A are laminated on the under film 16d, the shrinkage amount of the ceramic green sheets 1A, 3A after lamination does not match the shrinkage amount of the under film. There is a risk of deformation that becomes convex toward the green sheet. In order to suppress such deformation, when the under film is fixed on the laminated roll 16a, a tension for correcting the shrinkage difference portion may be applied to the under film 16d and fixed.

  Furthermore, in order to increase the fixing force of the ceramic green sheet 1A on the under film 16d, an anchor process such as a method of roughening the surface roughness of the under film 16d or applying an adhesive to the surface of the under film 16d is performed. You may give it.

  At the time of lamination, first, an appropriate number of second mother ceramic green sheets held on the second holding roll 12 are laminated on the outer peripheral surface of the lamination roll 16 in order to form the outer layer portion. The appropriate number of first mother ceramic green sheets 1A held on the first holding roll 7 were pressed and laminated in the same manner, and finally held on the outer peripheral surface of the second holding roll 12. An appropriate number of second ceramic green sheets 3A are laminated again.

  FIG. 1 illustrates a process in which the first mother ceramic green sheet 1 </ b> A held on the outer peripheral surface of the first holding roll 7 is laminated on the outer peripheral surface of the laminating roll 16. In this state, the first holding roll 7 is indicated by an arrow X1 so that the mother ceramic green sheet 1A held on the outer peripheral face of the first holding roll 7 is pressed against the outer peripheral face 16a of the laminated roll 16. It has been moved in the direction shown.

  On the other hand, when laminating the second mother ceramic green sheet 3A on the second holding roll 12, as shown by the arrow X2 in FIG. Close to the outer peripheral surface 16a.

  A press roll 17 is disposed below the laminated roll 16. The pressure roll 17 is provided in order to pressure-bond the mother laminate laminated on the outer peripheral surface of the multilayer roll 16 and firmly adhere the ceramic green sheets to each other. Therefore, the crimping roll 17 is configured to be moved toward the outer peripheral surface 16a side of the laminated roll 16 as indicated by an arrow X3.

  The cameras 18 a and 18 b are provided for confirming the position of the mother ceramic green sheet held on the outer peripheral surface of the first holding roll 7.

  As described above, in the present embodiment, a mother laminate is formed on the outer peripheral surface 16 a of the laminate roll 16. FIG. 3 is a partially cutaway front view showing the portion indicated by the two-dot chain line B in FIG. 1 in an enlarged manner. Here, the second portion that has been cut to an appropriate length on the outer peripheral surface 16a of the laminated roll 16 is shown. A state is shown in which a plurality of first mother ceramic green sheets 1A that have been cut to an appropriate length are stacked on the mother ceramic green sheet 3A.

  Thus, in the present embodiment, a mother laminate is configured on the laminate roll 16. The obtained mother laminated body is taken out from the outer peripheral surface 16a of the laminated roll 16 by removing the fixation by the under film 16d. Thereafter, the mother multilayer body is placed on a flat stage and then cut into multilayer ceramic capacitor unit multilayer bodies. And a sintered compact is obtained by baking this laminated body, and a multilayer ceramic capacitor can be obtained by forming an external electrode on the outer surface of the obtained ceramic sintered body. The external electrode may be formed by applying a conductive paste to the outer surface of the laminate prior to firing and baking the external electrode along with the firing.

  In this embodiment, the mother ceramic green sheets 1 and 3 are temporarily held by the holding rolls 7 and 12, and the carrier films 2 and 4 are peeled off simultaneously with the holding of the mother ceramic green sheets 1 and 3. Accordingly, the mother ceramic green sheets 1A and 3A are not supported by the carrier film in the step of laminating the mother ceramic green sheets 1A and 3A in the laminating roll 16 which is a laminating portion. Therefore, the mother ceramic green sheets 1A and 3A can be stacked with a light pressure. Therefore, it is difficult for the internal electrode pattern 5 to be displaced.

  Therefore, it is preferable that the pressing force A (Pa) at the time of stacking in the stacking roll 16 that is a stacking portion, the adhesive force B (Pa) between the mother ceramic green sheets after stacking, and the minimum pressure C that deforms the stacked body of the mother. When (Pa), C> A> B.

  In addition, the mother ceramic green sheets 1A and 3A can be laminated with a light pressure, and it is not always necessary to strongly bond at high temperatures. Therefore, distortion and spreading of the ceramic green sheet are unlikely to occur. Therefore, a multilayer ceramic capacitor excellent in accuracy can be obtained.

  The temporary pressure bonding force during the lamination may be as small as about 0.5 to 3 MPa. Moreover, although it is not necessarily heated at the time of temporary pressure bonding, the outer peripheral surface 16a of the laminated roll 16 is heated to a temperature of about 40 to 80 ° C., and is pressure-bonded under heating, thereby increasing the pressure-bonding force between the ceramic green sheets. Can do. However, the temperature of 40 to 80 ° C. and the conditions of 0.5 to 3 MPa are considerably higher than those of the conventional method in which a mother ceramic green sheet supported on a carrier film is pressure-bonded, laminated, and the carrier film is peeled off. It is a mild condition. Therefore, distortion due to heat of the ceramic green sheet, expansion during pressure bonding, or displacement of the internal electrode pattern is unlikely to occur.

  In the present embodiment, preferably, in order to reliably stack the mother ceramic green sheet 1A between the grooves 16b and 16b, the position of the mother ceramic green sheet 1A is detected by the cameras 18a and 18b, The position of the groove 16b, that is, the circumferential position of the laminated roll 16 is detected by the camera 18c. And the circumferential speed of the holding roll 7 and the circumferential speed when the lamination roll 16 rotates counterclockwise are made equal. Based on the information detected from the cameras 18a to 18c, the mother ceramic green sheet 1A is reliably stacked in the outer peripheral surface portion between the groove 16b and the next groove 16b. Similarly, the position of the second mother ceramic green sheet 3A is controlled by using a camera (not shown).

  Since the ceramic green sheets are not laminated on the groove 16b, the rotation of the holding roll 7 is temporarily stopped when the groove 16b is positioned at the contact portion between the holding roll 7 and the lamination roll 16, and the groove 16b passes the contact. You may comprise so that the holding | maintenance roll 7 may be rotated immediately after doing.

  Further, the creepage distance between the groove 16b and the next groove 16b is preferably longer than the length of the mother ceramic green sheet 1A, so that there is a margin in the outer peripheral surface portion between the groove 16b and the groove 16b. The mother ceramic green sheet 1A can be pressure-bonded.

  Further, in order to stack the plurality of internal electrode patterns 5 with high accuracy, the internal electrode pattern 5 on the ceramic green sheet 1A of the first mother or positioning marks provided separately from the internal electrode patterns 5 are attached to the camera 18a, Based on the circumferential position on the holding roll 7 of the internal electrode pattern 5 detected by the internal electrode pattern 5 or the detection mark, the mother ceramic green sheet is formed from the holding roll 7 to the outer peripheral surface of the laminated roll 16. A crimping start position for crimping 1A may be obtained, and crimping of the mother ceramic green sheet 1A may be started based on the crimping start position.

  In this case, as described above, in order to prevent the crimping in the groove 16b, when the method of temporarily stopping the rotation of the holding roll 7 and rotating the holding roll 7 after the groove 16b passes through the contact point is employed. The crimping position may be corrected using this stop time. In addition, when it is necessary to shift the positions of the internal electrode pattern 5 and the internal electrode pattern 5 stacked in the next layer at the same time, the correction of the crimping start position is also performed for the shift between the internal electrode patterns 5 and 5. It can be done in the same way.

  On the other hand, the correction in the rotation direction of the holding roll 7 can be performed by the re-rotation timing of the holding roll 7 or the phase correction of the laminated roll 16. Further, the correction in the width direction can be performed by changing the position in the width direction of the holding roll 7 and / or the lamination roll 16. Correction of the rotation direction and the width direction of the second holding roll 12 can also be performed in the same manner as in the case of the first holding roll 7.

  As described above, in this embodiment, the mother ceramic green sheets 1 and 3 supported by the carrier film are held by the holding rolls 7 and 12, and at the same time, the carrier films 2 and 4 are peeled off. However, in the present invention, it is not always necessary to peel the carrier film from the ceramic green sheet at the above timing. That is, the position where the ceramic green sheet is held as long as the carrier film is peeled off from the ceramic green sheet in a state where the ceramic green sheet is held by the holding roll with an adhesion force equal to or greater than the adhesion force between the ceramic green sheet and the carrier film. And the relationship of the position where a carrier film peels is not specifically limited, Any may exist in an upstream and any may exist in a downstream.

  Preferably, the ceramic green sheet is first held by the holding roll, and the carrier film is peeled within the position range of the outer peripheral surface of the holding roll where the ceramic green sheet is held by the holding roll. In this case, peeling of the carrier film is started in a position range where the ceramic green sheet is securely held on the holding roll. Therefore, even when a thin ceramic green sheet is used, the carrier film can be easily and reliably peeled without damaging the ceramic green sheet.

  FIG. 4 is a schematic configuration diagram for explaining a method of manufacturing a multilayer ceramic electronic component according to the second embodiment of the present invention. In the second embodiment, the stacking apparatus is configured in the same manner as the stacking apparatus of the first embodiment. However, the difference is that the ceramic green sheets 1 and 3 of the first and second mothers are not cut into strips on the outer peripheral surfaces of the first and second holding rolls 7 and 12, and are laminated in a long shape. It is in the point which is supplied to 16A and is laminated | stacked on the outer peripheral surface of the lamination roll 16A.

  4 that are the same as those in FIG. 1 are denoted by the same reference numerals, and the description given with reference to FIG.

  In the second embodiment, the elongated first and second mother ceramic green sheets 1 and 3 are respectively supported by the elongated carrier films 2 and 4 in the same manner as in the first embodiment. Prepared in a state and supplied to the first and second holding rolls 7 and 12, respectively. Also in the second embodiment, the ceramic green sheets 1 and 3 of the first and second mothers are peeled from the carrier films 2 and 4 when being held by the holding rolls 7 and 12.

  As shown in FIG. 4, the first mother ceramic green sheet 1 is continuously supplied to the outer peripheral surface of the holding roll 7, but the mother ceramic green sheet 1 is not cut into strips, but is laminated. Laminated on the outer peripheral surface 16a of 16A. Grooves 16b (see FIG. 1) are not provided on the outer peripheral surface of the laminated roll 16A. An under film (not shown) is detachably attached to the outer peripheral surface 16a of the laminated roll 16A. This under film can be configured similarly to the under film 16d used in the first embodiment. Also in this embodiment, the mother ceramic green sheets 1 and 3 are held on the holding rolls 7 and 12 in the same manner as in this embodiment.

  Also in the present embodiment, first, the first mother ceramic green sheets 3 supplied to the outer peripheral surface of the second holding roll 12 are laminated, and then the first mother on which the internal electrode pattern is printed. The ceramic green sheets 1 are laminated as shown in FIG.

  Also in this embodiment, the mother ceramic green sheets 1 and 3 are held on the holding rolls 7 and 12 in the same manner as in this embodiment.

  An under film (not shown) is detachably attached to the outer peripheral surface 16a of the laminated roll 16A. This under film can be configured similarly to the under film 16d used in the first embodiment.

  In the lamination, the second mother ceramic green sheet 3 constituting the outer layer portion is first laminated on the outer peripheral surface 16a. In this case, the second mother ceramic green sheet in which the second holding roll 12 is brought close to the outer peripheral surface 16 a of the laminated roll 16 and is held on the outer peripheral surface of the second holding roll 12 as indicated by an arrow X <b> 2. 3 are laminated on the outer peripheral surface 16 a of the lamination roll 16. In this case, the second mother ceramic green sheet 3 is not cut to a predetermined length. Therefore, the ceramic green sheets 3 of the second mother are sequentially stacked on the outer peripheral surface 16a according to the number of stacked layers. In other words, the second mother ceramic green sheet 3 can be laminated on the outer peripheral surface 16 a of the laminated roll 16 over several turns.

  In addition, at the time of lamination, a minimum pressure for holding the mother ceramic green sheet 3 on the outer peripheral surface 16 a of the lamination roll 16 may be applied. That is, the force at the time of temporary pressure bonding by the temporary pressure bonding roll 17 may be relatively low.

  After the second mother ceramic green sheet 3 is laminated on the outer peripheral surface 16 a by a predetermined number, the second holding roll 12 is moved away from the lamination roll 16. Instead, the first holding roll 7 is moved to the lamination roll 16 side as indicated by the arrow X1, and the ceramic green sheets 1 of the first mother are laminated. In this case, in the vicinity of the first holding roll 7, the position of the internal electrode pattern provided on the upper surface of the ceramic green sheet 1 of the first mother is detected by the cameras 18a and 18b. Based on the detected position information, the circumferential position on the outer peripheral surface 16a of the laminated roll 16 of the ceramic green sheet 1 of the first mother is obtained. Then, based on the obtained circumferential position, the first mother ceramic green sheet 1 is pressure-bonded to the outer circumferential surface 16 a of the laminating roll 16 and laminated.

  By the way, the mother ceramic green sheet 1 is wound and pressure-bonded on the outer peripheral surface 16a of the lamination roll 16 so as to have an appropriate number of laminations according to the number of lamination of the internal electrode patterns. In this case, as the lamination proceeds, the outer diameter of the portion where the mother ceramic green sheets 1 are laminated increases. That is, as the number of mother ceramic green sheets 1 that have been previously laminated increases, the outer diameter of the lamination stage, that is, the curvature of the portion to be laminated increases. Here, the lamination stage means a structure including the lamination roll 16 and the mother ceramic green sheet 3 and the second mother ceramic green sheet 1 which are laminated on the outer peripheral surface of the lamination roll 16 in advance. And

  Therefore, when the ceramic green sheets 1 of the first mother are stacked, the position of the first ceramic green sheets 1 in the conveying direction is increased according to the increase in the outer diameter of the stacking stage, that is, the curvature of the stacked portions. It is desirable to correct This correction increases the tension in the conveying direction of the first mother ceramic green sheet 1 to be supplied in accordance with the increase in the outer diameter of the stacking stage, thereby reducing the length of the first mother ceramic green sheet 1. This can be done by stretching. The fine adjustment of the conveying direction of the ceramic mother sheet 1 of the first mother to be laminated is performed by feedback control based on position information obtained from the camera 18c of the ceramic green sheet 1 that is pressure-bonded on the lamination roll 16. Can be done.

  Further, the correction of the position in the width direction when the first mother ceramic green sheets 1 are stacked can be performed by changing the position of the holding roll 7 and / or the stacking roll 16 in the width direction.

  Furthermore, in order to construct a multilayer ceramic capacitor, it is necessary to shift the positions of the upper and lower internal electrode patterns. To correct this shift amount, the circumferential length of the multilayer roll 16 is set to the internal electrode pitch × (n + 1/2). Just set it up.

  In the printing process, the printing position of the internal electrode pattern 5 on the first mother ceramic green sheet 1 may be shifted in advance so as to correspond to the shift amount.

  In the present embodiment, as in the case of the first embodiment, when the ceramic green sheets 1 and 3 are laminated on the laminated roll 16 side from the holding rolls 7 and 12, the ceramic green sheets 1 and 3 are laminated on the laminated roll 16. What is necessary is just to apply the minimum pressure which can be hold | maintained on the outer peripheral surface 16a, and to transfer. And the crimping force by the crimping | compression-bonding roll 17 may be comparatively low as mentioned above. Preferably, it is desirable to raise the temperature of the laminated roll 16 and the pressure roll 17 so that the pressure bonding is promoted. The holding rolls 7 and 12 are desirably arranged at room temperature in order to suppress deformation of the mother ceramic green sheets 1 and 3. In particular, when the holding rolls 7 and 12 may be heated during the lamination due to heat conduction from the lamination stage, the holding rolls 7 and 12 may be cooled in some cases.

  In the present embodiment, the first mother ceramic green sheets 1 are laminated on the outer peripheral surface of the lamination roll 16 so as to have a predetermined number of layers, and then the second mother ceramic green sheets 3 are again laminated in a predetermined number. It is laminated so that it may become number.

  Thereafter, on the outer peripheral surface of the laminate roll 16, the laminate is cut at appropriate lengths in the circumferential direction, the laminate is fixed by the under film, and the laminate is taken out. The multilayer body thus obtained is cut in the thickness direction so as to be a multilayer body of individual multilayer ceramic capacitor units, and the multilayer ceramic capacitor is obtained using the obtained multilayer body in the same manner as in the first embodiment. Can be obtained.

  When cutting on the multi-layer roll 16, the multi-layer ceramic capacitor unit may be cut off on the multi-layer roll 16 so that the multi-layer ceramic capacitor unit is taken out from the outer peripheral surface of the multi-layer roll 16.

  However, preferably, since the cutting can be easily performed, as described above, the mother laminate is obtained by cutting the outer peripheral surface of the laminate roll 16 at a predetermined length in the circumferential direction to obtain a mother laminate. It is desirable to cut the laminate into laminates of individual multilayer ceramic capacitor units outside the multilayer roll 16.

  Also in the second embodiment, as described above, when the first and second mother ceramic green sheets 1 and 3 are stacked, the mother ceramic green sheets 1 and 3 may be stacked at a relatively low pressure. it can. Therefore, the internal electrode pattern is hardly displaced, and the first and second mother ceramic green sheets 1 and 3 can be laminated with high accuracy. Compared to the first embodiment, since the long mother ceramic green sheets 1 and 3 are laminated on the lamination roll 16 without being cut in advance, the lamination efficiency can be increased.

  FIG. 5 is a schematic front view for explaining the method for manufacturing the multilayer ceramic electronic component according to the third embodiment of the present invention. In the third embodiment, a flat laminated stage 31 is used. An under film 32 is disposed on the upper surface 31 a of the flat stacking stage 31. As this under film 32, a relatively strong plastic film such as a polyethylene terephthalate film can be appropriately used. But the under film 32 may be comprised with resin films other than a polyethylene terephthalate film.

  As will be described later, a mother ceramic green sheet is laminated on the under film 32. Generally, the ceramic green sheet shrinks after peeling from the carrier film. Accordingly, when the ceramic green sheets are laminated on the under film 32, the shrinkage amount of the ceramic green sheet after lamination does not match the shrinkage amount of the under film 32, so that the laminated ceramic green sheet side becomes convex. Deformation may occur. In order to suppress such deformation, when the under film 32 is fixed on the upper surface 31a of the lamination stage 31, a tension for correcting the shrinkage difference is applied to the under film 32 to fix the under film 32. Is desirable.

  Further, in order to increase the adhesion of the ceramic green sheet to the under film 32, an anchor process such as increasing the surface roughness of the upper surface of the under film 32 or applying an adhesive to the surface of the under film 32 is performed. May be. As shown in FIG. 5, an appropriate number of second mother ceramic green sheets 3 </ b> A and an appropriate number of first mother ceramic green sheets 1 </ b> A are laminated on an under film 32. The first mother ceramic green sheet 1 </ b> A has a plurality of internal electrode patterns 5 on its upper surface.

  As shown in FIG. 5, also in the present embodiment, a long mother ceramic green sheet 1 is supplied as indicated by an arrow C. A plurality of internal electrode patterns 5 are formed on the mother ceramic green sheet 1 as described above. The long first ceramic green sheet 1 of the mother is supported by a long first carrier film 2. In this way, the mother ceramic green sheet 1 supported by the carrier film 2 is passed between the roll 6a and the cutter 6b, and the cutter 6b causes an excess portion on the outer side of both side edges of the first mother ceramic green sheet 1. Is removed. Thereafter, the long mother ceramic green sheet 1 is supplied between the first holding roll 7 and the peeling roll 8. And like the case of 1st Embodiment, while the ceramic green sheet 1 of a mother is crimped | bonded to the outer peripheral surface of the 1st holding roll 7, the carrier film 2 is peeled. The carrier film 2 is wound up through a roll 9.

  On the other hand, the ceramic green sheet 1 of the first mother is pressure-bonded to the outer peripheral surface of the first holding roll 7, and a rectangular mother having a predetermined length is formed on the outer peripheral surface of the first holding roll 7 by the cutter 10. It cut | disconnects so that it may become the ceramic green sheet 1A. Further, cameras 18 a and 18 b are arranged in the vicinity of the outer peripheral surface of the first holding roll 7.

  In this embodiment, the first mother ceramic green sheets 1 </ b> A cut from the first holding roll 7 to a predetermined length are stacked on the stacking stage 31. The cameras 18a and 18b are used to control the stacking positions of the internal electrode patterns 5 and 5 when stacking the first mother ceramic green sheets 1A. That is, the cameras 18 a and 18 b photograph the internal electrode pattern 5 or the detection mark provided in association with the internal electrode pattern 5, thereby obtaining the position of the internal electrode pattern 5. The mother ceramic green sheets 1A are laminated so that the internal electrode patterns 5 are laminated at predetermined positions based on the positional information obtained in this manner. The correction of the stacking position based on the position information is performed by pressing the mother ceramic green sheet 1A on the stacking stage and adjusting the pressing start position when stacking, or moving the stacking stage 31 in the surface direction. Can be done.

  In the present embodiment, the first mother ceramic green sheet 1A can be crimped by applying a low pressure of about 0.05 to 3 MPa because it is not necessary to peel off the carrier film after the crimping. And the lamination | stacking stage 31 is moved as shown by the arrow X, and crimping | compression-bonding advances. Instead of moving the stacking stage 31 in the direction of the arrow X, the structure including the holding roll 7 and the peeling roll 8 may be moved in the direction opposite to the arrow X to stack the mother ceramic green sheets 1A. However, in order to simplify the stacking apparatus, it is desirable to move the stacking stage 31 in the arrow X direction.

  It is desirable that the moving speed of the stacking stage in the arrow X direction at the time of stacking and the peripheral speed when the holding roll 7 is rotated in the clockwise direction are matched.

  Further, when the mother ceramic green sheets 1A are laminated, it is desirable to raise the temperature so that the laminated ceramic green sheets are sufficiently adhered to each other. Therefore, it is desirable to raise the temperature of the lamination stage 31 to a temperature of about 40 to 80 ° C.

  However, when the mother ceramic green sheet 1 </ b> A is heated on the outer peripheral surface of the holding roll 7, the internal electrode pattern 5 may be misaligned. Therefore, the mother ceramic green sheet 1 </ b> A may be cooled on the outer peripheral surface of the holding roll 7 by arranging the cooling roll 33 shown in FIG. 5.

  However, depending on the composition, thickness, and the like of the mother ceramic green sheet 1A, the mother ceramic green sheet 1A is 40 to 40 mm on the outer peripheral surface of the holding roll 7 in order to increase the pressure-bonding force between the mother ceramic green sheets after lamination. You may heat up to the temperature of about 80 degreeC.

  In addition, in the peeling roll 8, in order to suppress a deformation | transformation of the ceramic green sheet 1 of a mother, it is desirable that the peeling roll 8 is arrange | positioned at normal temperature.

  In the present embodiment, as described above, lamination is performed in the same manner as in the first embodiment, except that a flat plate-like lamination stage 31 that is moved in the arrow X direction is used instead of the lamination roll. Is done. Accordingly, after a suitable number of second green ceramic green sheets 3A are stacked, a plurality of first green ceramic green sheets 1A are stacked as described above, and again a predetermined length constituting the outer layer portion. By laminating the second mother ceramic green sheets 3A, a mother laminate is obtained. A multilayer ceramic capacitor can be obtained in the same manner as in the first embodiment, using the mother laminate obtained in this manner.

  Also in the third embodiment, only the mother ceramic green sheet 1 is first held by the first holding roll 7, and the mother ceramic green sheet 1A cut to a predetermined length is laminated on the lamination stage 31. The lamination proceeds by being pressed onto the mother ceramic green sheet 3A or the mother ceramic green sheet 1A. Accordingly, the crimping force during crimping can be made relatively low, so that the positional deviation between the internal electrode patterns 5 and 5 can be suppressed, and the mother ceramic green sheets 1A and 3A can be laminated with high accuracy. it can.

  Similarly to the first and second embodiments, also in the third embodiment, when the ceramic green sheets 1A and 3A are pressed and stacked, the linear pressure-bonded portions gradually become the ceramic green sheets 1A and 3A. The pressure bonding is performed while moving in the length direction. Therefore, the ceramic green sheets can be brought into close contact with each other as compared with the conventional method in which rectangular ceramic green sheets are laminated and pressure-bonded. Further, it is difficult for air or the like to be caught between the ceramic green sheets.

  6 and 7 are structural front sectional views for illustrating a modification of the method for manufacturing the multilayer ceramic electronic component of the third embodiment. In the production of the multilayer ceramic capacitor, the mother ceramic green sheets on which the internal electrode pattern is printed are laminated after the mother ceramic green sheets constituting the outer layer portion are laminated. In this case, the first mother ceramic green sheet 1A on which the first internal electrode patterns 5A and 5A are printed as shown in FIG. The first mother ceramic green sheets 1C on which the second mother internal electrode patterns 5B and 5B are printed may be alternately stacked. Here, after a predetermined number of second mother ceramic green sheets 3A are stacked on the upper surface 31a of the stacking stage 31, the first mother ceramic green sheets 1B and 1C are stacked alternately. . In order to realize such lamination, the first mother ceramic green sheet 1B is used as the first holding roll 7A, and the first mother ceramic green sheet 1C is used as the other first holding roll. 7B is configured to be supplied. In other words, two sets of the first mother ceramic green sheet supply mechanism having the peeling roll 8 and the first holding roll 7 shown in FIG. 5 are arranged, and the first mother ceramic green sheet is supplied from one supply mechanism. The sheet 1B is supplied, the first mother ceramic green sheet 1C is supplied from another supply mechanism, and the first and second mother ceramic green sheets 1B and 1C are alternately stacked. Yes. The first mother ceramic green sheet 1B and the first mother ceramic green sheet 1C are both cut to a predetermined length on the holding rolls 7A and 7B using the cutters 10A and 10B. ing.

  Further, the rotation direction of the first holding roll 7B is counterclockwise as shown in the figure. Therefore, when laminating, as shown in FIG. 7, when laminating the first mother ceramic green sheets 1B, the holding roll 7A is rotated clockwise, so that the laminating stage 32 is in the direction of the arrow X shown in the figure. Moved to. On the other hand, when the first mother ceramic green sheets 1C are stacked, the holding roll 7B is rotated counterclockwise, and therefore the stacking stage 31 is moved in the −X direction, which is the direction opposite to the arrow X. Thus, the process of laminating the first mother ceramic green sheet 1B from the first holding roll 7A and the process of laminating the first mother ceramic green sheet 1C on the first holding roll 7B are repeated. Thus, the first mother ceramic green sheets 1B and the first mother ceramic green sheets 1C are alternately laminated. Therefore, as shown in FIG. 6, the internal electrode patterns 5A and 5B can be arranged so that the shift amounts of the upper and lower internal electrode patterns 5A and 5B become the shift amounts for obtaining the multilayer ceramic capacitor.

  As described above, in the present invention, a plurality of mother ceramic green sheet supply mechanisms for stacking the mother ceramic green sheets on which the internal electrode patterns are printed are used, whereby the plurality of internal electrode patterns are arranged at predetermined positions. They can be stacked so that they are in a relationship.

  In the present embodiment, the first mother ceramic green sheet 1B and the first mother ceramic green sheet 1C are pressure-bonded from different directions by 180 °, and therefore, in the pressure-bonding direction in the obtained laminate. Distortion can be suppressed and the amount of distortion at both ends in the direction of arrow X in FIG. 6 can be made uniform.

  6 and 7, the first mother ceramic green sheet 1B on which the internal electrode pattern 5A is formed and the first mother ceramic green sheet on which the internal electrode pattern 5B is formed. Two mother ceramic green sheet supply mechanisms were used to alternately stack 1C and 1C to supply the first mother ceramic green sheet 1 on which the internal electrode pattern 5 was printed. The other mechanism may be used as a mother ceramic green sheet supply mechanism for supplying the second mother ceramic green sheet 3A.

  FIG. 8 is a schematic front view for explaining still another modification of the method for manufacturing a multilayer ceramic electronic component of the present invention. In addition to the configuration shown in FIGS. 6 and 7, a third mother ceramic green sheet supply mechanism 41 may be arranged as shown in FIG. 8. That is, on the lamination stage 31, first, the second mother ceramic green sheet 3A is supplied from the third mother ceramic green sheet supply mechanism 41, and an appropriate number of mother ceramic green sheets 3A are laminated. Thereafter, as arranged on the left side of FIG. 8, the first mother ceramic green sheet 1 </ b> B and the first mother ceramic green sheet 1 </ b> C are the same as the modification shown in FIGS. 6 and 7. And are stacked alternately. Thereafter, as shown by an arrow X3 in FIG. 8, the stacking stage 31 is moved again below the third supply mechanism 43. Then, the second mother ceramic green sheet 3A having a predetermined length is laminated again from the third mother ceramic green sheet supply mechanism 41.

  In this way, three types of mother ceramic green sheet supply mechanisms may be used to press-bond three types of ceramic green sheets.

  Similarly, as shown in FIG. 1, a plurality of mother ceramic green sheet supply mechanisms may also be arranged in the manufacturing method using laminated rolls. FIG. 9 is a schematic front view showing such a modification. In the manufacturing apparatus shown in FIG. 9, four mother ceramic green sheet supply mechanisms 51 to 54 are arranged around the laminated roll 16. Each of the mother ceramic green sheet supply mechanisms 51 to 54 includes holding rolls 51a to 51d that hold only the mother ceramic green sheet peeled from the carrier film on the outer peripheral surface. Therefore, also in this modified example, the mother ceramic green sheet can be laminated by pressure bonding without applying a larger pressure bonding force on the outer peripheral surface 16 a of the lamination roll 16.

  As described above, in the method for manufacturing a multilayer ceramic electronic component according to the present invention, the mother ceramic green sheet having only the peeled mother ceramic green sheet and the peeling roll for peeling the mother ceramic green sheet from the carrier film. An appropriate number of supply mechanisms of 2 or more may be provided.

  Furthermore, in the present invention, as to the timing of peeling the carrier film from the mother ceramic green sheet, the mother ceramic green sheet is pressure-bonded to the holding roll as described above, and at the same time the carrier film is peeled from the mother ceramic green sheet. Alternatively, after the mother ceramic green sheet is pressure-bonded to the holding roll, the carrier film may be peeled from the ceramic green sheet of the carrier film.

  In any case, only the mother ceramic green sheet is held on the holding roll. Therefore, the mother ceramic green sheet can be pressure-bonded and laminated on the lamination stage under relatively mild conditions.

  In addition, this invention is not limited to the manufacturing method of a multilayer ceramic capacitor, It can utilize for the manufacturing method of various multilayer ceramic electronic components, such as a ceramic multilayer substrate.

DESCRIPTION OF SYMBOLS 1 ... Ceramic green sheet of 1st mother 1A ... Ceramic green sheet of 1st mother 1B ... Ceramic green sheet of 1st mother 1C ... Ceramic green sheet of 1st mother 2 ... Carrier film 3 ... 2nd mother Ceramic green sheet 3A ... Ceramic green sheet of second mother 4 ... Carrier film 5 ... Internal electrode pattern 5A, 5B ... Internal electrode pattern 6a ... Roll 6b ... Cutter 7 ... First holding roll 8 ... Peeling roll 9 ... Roll DESCRIPTION OF SYMBOLS 10 ... Cutter 11a ... Roll 11b ... Cutter 12 ... 2nd holding roll 13 ... Release roll 14 ... Roll 15 ... Cutter 16, 16A ... Laminate roll 16a ... Outer peripheral surface 16b ... Groove 16d ... Under film 17 ... Crimp roll 18a-18c ... Camera 31 ... Laminated Stage 31a ... Upper surface 32 ... Under film 33 ... Cooling roll 41 ... Mother ceramic green sheet supply mechanism 51-54 ... Mother ceramic green sheet supply mechanism

Claims (16)

Preparing a long ceramic green sheet held on a long carrier film;
While holding the long ceramic green sheet held on the long carrier film on a holding roll that can rotate and hold the ceramic green sheet, the carrier film is removed from the ceramic green sheet. A peeling step;
Separating the ceramic green sheet held by the holding roll from the holding roll, and laminating at a lamination part, and obtaining a mother laminate; and
Cutting a mother laminate to obtain a laminate of individual multilayer ceramic electronic component units from the mother laminate;
The manufacturing method of a multilayer ceramic electronic component provided with the process of baking the laminated body obtained by cutting | disconnection.   In the step of peeling the carrier film from the ceramic green sheet while holding the ceramic green sheet on the holding roll, the ceramic green sheet is first held on the holding roll, and any of the positions within the range where the ceramic green sheet is held The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein peeling of the carrier film is started at that position.   The steps of holding the ceramic green sheet, peeling the carrier film, and peeling the ceramic green sheet from the holding roll for lamination are performed simultaneously or continuously on the outer peripheral surface of the holding roll. A method for producing a multilayer ceramic electronic component according to 1 or 2.   The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-3 whose said holding | maintenance roll is a suction roll or the adhesion roll in which an outer peripheral surface has adhesiveness.   The lamination in the laminated part of the ceramic green sheet is performed by temporarily pressing the ceramic green sheet with a holding roll in the laminated part, and then peeling from the holding roll. The manufacturing method of the multilayer ceramic electronic component of description.   In any one of Claims 1-5, after the said ceramic green sheet is peeled and laminated | stacked from the holding roll in the lamination | stacking part, the temporary bonding of ceramic green sheets is performed by crimping rolls other than the said holding roll. The manufacturing method of the multilayer ceramic electronic component of description.   The method for producing a multilayer ceramic electronic component according to claim 1, wherein the multilayer part is heated, and a plurality of ceramic green sheets are thermocompression bonded in the multilayer part.   The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-7 by which the ceramic green sheet currently hold | maintained at the said holding roll is cooled.   The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-8 in which the said some holding | maintenance roll is used with respect to one laminated part.   10. The method for manufacturing a multilayer ceramic electronic component according to claim 9, wherein among the plurality of holding rolls, a stacking direction by an odd-numbered holding roll is different from a stacking direction by an even-numbered holding roll by 180 °.   C> A>, where A (Pa) is the pressing force during lamination in the laminated part, B (Pa) is the adhesion between the green sheets after lamination, and C (Pa) is the minimum pressure to deform the laminated body. The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-10 made into B.   The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-11 in which the said lamination | stacking part has a lamination roll by which a ceramic green sheet is laminated | stacked on an outer peripheral surface.   The method for manufacturing a multilayer ceramic electronic component according to claim 12, wherein a peripheral speed of the holding roll and a peripheral speed of the multilayer roll are the same.   14. The multilayer ceramic electronic according to claim 12, wherein in the length direction of the ceramic green sheet, the tension of the ceramic green sheet is gradually increased according to an increase in curvature of a portion to which the ceramic green sheet is pressed. A manufacturing method for parts.   The manufacturing method of the multilayer ceramic electronic component of any one of Claims 1-11 with which the said laminated part is comprised using the flat laminated stage.   The stacking stage is configured to be moved along the length direction of the ceramic green sheet, and the moving speed of the stacking stage is equal to the peripheral speed of the holding roll. The manufacturing method of the multilayer ceramic electronic component of description.

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