JP2010541217A - 放射放出用の半導体ボディ - Google Patents
放射放出用の半導体ボディ Download PDFInfo
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- JP2010541217A JP2010541217A JP2010526149A JP2010526149A JP2010541217A JP 2010541217 A JP2010541217 A JP 2010541217A JP 2010526149 A JP2010526149 A JP 2010526149A JP 2010526149 A JP2010526149 A JP 2010526149A JP 2010541217 A JP2010541217 A JP 2010541217A
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- 230000005855 radiation Effects 0.000 title claims abstract description 160
- 239000004065 semiconductor Substances 0.000 title claims abstract description 125
- 230000004888 barrier function Effects 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims description 19
- 230000003595 spectral effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 8
- 239000003086 colorant Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 description 19
- 150000001875 compounds Chemical class 0.000 description 8
- -1 nitride compound Chemical class 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 230000018109 developmental process Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000004936 stimulating effect Effects 0.000 description 1
- 238000005309 stochastic process Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
Abstract
Description
− 活性層において第1の波長(λ1)の好ましくはインコヒーレントな放射を発生させるステップと、
− バリア層構造において、第1の波長(λ1)の放射の少なくとも一部分を吸収するステップと、
− 量子層構造において、第2の波長(λ2)のインコヒーレントな放射を発生させるステップと、
によって行われる。
Claims (15)
- 放射放出用の半導体ボディ(1)であって、
第1の波長(λ1)の放射を発生させる活性層(2)と、
量子層構造(5)とバリア層構造(6)とを有する量子井戸構造(5)を備える再放出層(3)と、
を備え、
前記再放出層が、前記第1の波長の前記放射が前記バリア層構造において吸収されることによって、第2の波長(λ2)のインコヒーレントな放射を発生させるように設けられている、
放射放出用の半導体ボディ。 - 前記第1の波長の前記放射がインコヒーレントである、請求項1に記載の放射放出用の半導体ボディ。
- 前記量子層構造(5)が少なくとも1つの量子層(7)を備え、前記バリア層構造(6)が少なくとも1つのバリア層(8)を備える、請求項1に記載の放射放出用の半導体ボディ。
- 前記第2の波長(λ2)の前記放射が前記量子層構造において発生する、請求項1〜3のいずれか1項に記載の放射放出用の半導体ボディ。
- 前記活性層(2)がInGaNを含み、前記バリア層構造がGaNを含む、請求項1〜4のいずれか1項に記載の放射放出用の半導体ボディ。
- 前記第1の波長(λ1)が360nm〜400nmである、請求項1〜5のいずれか1項に記載の放射放出用の半導体ボディ。
- 前記第1の波長(λ1)が青色のスペクトル領域内であり、前記放射放出半導体ボディが白色光を放出する、請求項1〜6のいずれか1項に記載の放射放出用の半導体ボディ。
- 前記再放出層(3)が、前記第1の波長(λ1)の前記放射の一部分を前記第2の波長(λ2)の放射に変換し、前記放射放出半導体ボディが、前記第1の波長の放射および前記第2の波長の放射を放出する、請求項1〜7のいずれか1項に記載の放射放出用の半導体ボディ。
- 前記再放出層が、前記第1の波長(λ1)の前記放射を完全に前記第2の波長(λ2)の放射に変換する、請求項1〜7のいずれか1項に記載の放射放出用の半導体ボディ。
- 薄膜半導体ボディである、請求項1〜9のいずれか1項に記載の放射放出用の半導体ボディ。
- 前記第1の波長の前記放射もしくは前記第2の波長の前記放射またはその両方に対して透過性である成長基板(9)を備えている、請求項1〜9のいずれか1項に記載の放射放出用の半導体ボディ。
- 前記再放出層(3)の横方向の長さが、前記活性層(2)の対応する横方向の長さよりも小さい、請求項1〜11のいずれか1項に記載の放射放出用の半導体ボディ。
- 前記活性層(2)および前記再放出層(3)が前記半導体ボディの中にモノリシックに集積化されている、請求項1〜12のいずれか1項に記載の放射放出用の半導体ボディ。
- 半導体ボディ(1)によって混合色の放射を発生させる、または放射を変換する方法であって、
前記半導体ボディ(1)が活性層(2)および再放出層(3)を含み、
前記再放出層が、量子層構造(5)とバリア層構造(6)とを有する量子井戸構造(5)を備える量子井戸構造(4)を有し、
− 前記活性層において第1の波長(λ1)の好ましくはインコヒーレントな放射を発生させるステップと、
− 前記バリア層構造において、第1の波長(λ1)の前記放射の少なくとも一部分を吸収するステップと、
− 前記量子層構造において、第2の波長(λ2)のインコヒーレントな放射を発生させるステップと、
を含む方法。 - 請求項1〜13の少なくとも1項に記載の半導体ボディを備えている、請求項14に記載の方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007046499.3 | 2007-09-28 | ||
| DE102007046499 | 2007-09-28 | ||
| PCT/DE2008/001447 WO2009039815A1 (de) | 2007-09-28 | 2008-08-28 | Strahlungsemittierender halbleiterkörper |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010541217A true JP2010541217A (ja) | 2010-12-24 |
| JP2010541217A5 JP2010541217A5 (ja) | 2011-07-07 |
| JP5289448B2 JP5289448B2 (ja) | 2013-09-11 |
Family
ID=40104644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010526149A Active JP5289448B2 (ja) | 2007-09-28 | 2008-08-28 | 放射放出用の半導体ボディ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8426843B2 (ja) |
| EP (1) | EP2193550B1 (ja) |
| JP (1) | JP5289448B2 (ja) |
| KR (1) | KR101441168B1 (ja) |
| CN (1) | CN101809764B (ja) |
| DE (1) | DE112008003200A5 (ja) |
| WO (1) | WO2009039815A1 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014116549A (ja) * | 2012-12-12 | 2014-06-26 | Stanley Electric Co Ltd | 多重量子井戸半導体発光素子 |
| JP2017513225A (ja) * | 2014-04-01 | 2017-05-25 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク | 半導体画素、このような画素のマトリクス、このような画素を製造するための半導体構造、およびそれらの製作方法 |
| WO2021020378A1 (ja) * | 2019-07-30 | 2021-02-04 | キヤノン株式会社 | 発光素子及び発光素子の製造方法 |
| JP2024001892A (ja) * | 2022-06-22 | 2024-01-10 | 納微朗科技(深▲せん▼)有限公司 | 完全窒化物によるエピタキシャルチップ構造及び発光機器 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2433314A1 (en) | 2009-04-20 | 2012-03-28 | 3M Innovative Properties Company | Non-radiatively pumped wavelength converter |
| US8455904B2 (en) | 2009-04-20 | 2013-06-04 | 3M Innovative Properties Company | Non-radiatively pumped wavelength converter |
| DE102009023351A1 (de) * | 2009-05-29 | 2010-12-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
| FR3003402B1 (fr) * | 2013-03-14 | 2016-11-04 | Centre Nat Rech Scient | Dispositif monolithique emetteur de lumiere. |
| DE102014107472A1 (de) | 2014-05-27 | 2015-12-03 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement und Beleuchtungsvorrichtung |
| FR3066045A1 (fr) * | 2017-05-02 | 2018-11-09 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Diode electroluminescente comprenant des couches de conversion en longueur d'onde |
| FR3075468B1 (fr) * | 2017-12-19 | 2019-12-20 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'un dispositif optoelectronique par report d'une structure de conversion sur une structure d'emission |
| DE102018101089A1 (de) | 2018-01-18 | 2019-07-18 | Osram Opto Semiconductors Gmbh | Epitaktisches konversionselement, verfahren zur herstellung eines epitaktischen konversionselements, strahlungsemittierender halbleiterchip und verfahren zur herstellung eines strahlungsemittierenden halbleiterchips |
| DE102018124473A1 (de) * | 2018-10-04 | 2020-04-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauteil, verfahren zur ansteuerung eines optoelektronischen bauteils und beleuchtungsvorrichtung |
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2008
- 2008-08-28 EP EP08801254.7A patent/EP2193550B1/de active Active
- 2008-08-28 US US12/680,620 patent/US8426843B2/en active Active
- 2008-08-28 JP JP2010526149A patent/JP5289448B2/ja active Active
- 2008-08-28 KR KR1020107005552A patent/KR101441168B1/ko active Active
- 2008-08-28 WO PCT/DE2008/001447 patent/WO2009039815A1/de active Application Filing
- 2008-08-28 CN CN2008801088756A patent/CN101809764B/zh active Active
- 2008-08-28 DE DE112008003200T patent/DE112008003200A5/de not_active Withdrawn
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| JP2014116549A (ja) * | 2012-12-12 | 2014-06-26 | Stanley Electric Co Ltd | 多重量子井戸半導体発光素子 |
| JP2017513225A (ja) * | 2014-04-01 | 2017-05-25 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク | 半導体画素、このような画素のマトリクス、このような画素を製造するための半導体構造、およびそれらの製作方法 |
| WO2021020378A1 (ja) * | 2019-07-30 | 2021-02-04 | キヤノン株式会社 | 発光素子及び発光素子の製造方法 |
| JP2021022688A (ja) * | 2019-07-30 | 2021-02-18 | キヤノン株式会社 | 発光素子及び発光素子の製造方法 |
| KR20220018017A (ko) * | 2019-07-30 | 2022-02-14 | 캐논 가부시끼가이샤 | 발광 소자 및 발광 소자의 제조방법 |
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| JP7414419B2 (ja) | 2019-07-30 | 2024-01-16 | キヤノン株式会社 | 発光素子及び発光素子の製造方法 |
| KR102647549B1 (ko) | 2019-07-30 | 2024-03-14 | 캐논 가부시끼가이샤 | 발광 소자 및 발광 소자의 제조방법 |
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| CN114175281B (zh) * | 2019-07-30 | 2024-12-31 | 佳能株式会社 | 发光元件和发光元件的制造方法 |
| JP2024001892A (ja) * | 2022-06-22 | 2024-01-10 | 納微朗科技(深▲せん▼)有限公司 | 完全窒化物によるエピタキシャルチップ構造及び発光機器 |
| JP7564576B2 (ja) | 2022-06-22 | 2024-10-09 | 納微朗科技(深▲せん▼)有限公司 | 完全窒化物によるエピタキシャルチップ構造及び発光機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101441168B1 (ko) | 2014-09-17 |
| WO2009039815A1 (de) | 2009-04-02 |
| JP5289448B2 (ja) | 2013-09-11 |
| CN101809764A (zh) | 2010-08-18 |
| CN101809764B (zh) | 2012-05-23 |
| US20100294957A1 (en) | 2010-11-25 |
| US8426843B2 (en) | 2013-04-23 |
| DE112008003200A5 (de) | 2010-09-16 |
| EP2193550A1 (de) | 2010-06-09 |
| EP2193550B1 (de) | 2017-03-08 |
| KR20100059854A (ko) | 2010-06-04 |
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