JP2011054477A - Organic electroluminescent display device and method of manufacturing organic electroluminescent display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL display device maintaining the reliability of the device and having a favorable yield. <P>SOLUTION: The organic EL display device 10 includes a device substrate 1 on which at least one of metal wiring and an electrode is provided, an opposite substrate 5 facing the device substrate 1, and a seal material sealing the device substrate 1 and the opposite substrate 5. The region having the seal material is separated into a first seal region between a region of the device substrate 1 where the metal wiring and the electrode are not provided and the opposite substrate 5, and a second seal region between the region of the device substrate 1 where at least one of the metal wiring and the electrode is provided, and the opposite substrate 5. The seal material in the first seal region contains a glass frit, and the seal material in the second seal region contains curing resin. Thus, the organic EL display device can maintain the reliability of the device and has the high yield. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic electroluminescence display device and a method for manufacturing an organic electroluminescence display device.

  In recent years, the need for flat panel displays has increased with the advancement of information technology. As the flat panel display, a non-self-luminous liquid crystal display (LCD), a self-luminous plasma display (PDP), an inorganic electroluminescence (inorganic EL) display, or an organic electroluminescence (hereinafter referred to as “organic EL” or “ A display or the like is also known. Among these flat panel displays, the progress of the organic EL display is remarkable.

  As a sealing method for an organic EL display (organic EL element) composed of two substrates, there is a laser welding technique using glass frit. However, the light emission characteristics of the organic EL device produced by this method have already been significantly reduced from the initial stage. This is because the metal wiring (or the electrode itself) serving as the power supply line of the organic EL element is directly under the glass frit, so that the laser at the time of welding is also irradiated to the metal wiring and the electrode is damaged through the metal wiring. To do. In this case, since normal power supply cannot be performed, the light emission characteristics are deteriorated.

  In addition, when the organic planarization film is located below the glass frit that seals the substrate, when the glass frit is irradiated with a laser, the planarization film made of an organic material is damaged by the high heat of the laser. As a result, the adhesive surface between the glass frit and the planarizing film is peeled off, and the adhesive force between the substrates is reduced.

  In order to solve these problems, various methods have been considered so far. 6 to 8 are cross-sectional views showing the configuration of a conventional organic EL display device. For example, in the organic light emitting display device 20 disclosed in Patent Document 1, as shown in FIG. It is formed narrower than the width. Further, in the organic light emitting display device 30 disclosed in Patent Document 2, the organic planarization film 33 under the glass frit 32 is removed as shown in FIG. Further, as shown in FIG. 8, the organic light emitting display device 40 disclosed in Patent Document 3 removes the organic planarizing film 43 below the glass frit 42, and connects the metal wiring 41 to the bottom of the glass frit 42. Instead, it is positioned below the second electrode power supply line 45, which is a region not irradiated with laser.

JP 2007-200843 A (released on August 9, 2007) JP 2007-200787 A (published on August 9, 2007) JP 2007-200890 A (released on August 9, 2007)

  However, in the techniques of Patent Documents 1 and 2, since the glass frit and the metal wiring are in contact with each other, high heat due to laser irradiation when the glass frit is cured is also transmitted to the metal wiring directly below. This heat propagates to the inside of the organic EL element through the metal wiring and causes damage. Further, in Patent Document 1, since the width of the metal wiring is narrower than the width of the glass frit, there is a concern that the adhesion between the element substrate and the sealing substrate attached so as to face the element substrate is insufficient.

  In the technique of Patent Document 3, since it is necessary to arrange the second electrode power supply line immediately above the metal wiring, the size and position of the second electrode power supply line are limited, and the margin is reduced.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an organic EL display device that maintains the reliability of the element and has a high yield.

  In order to solve the above problems, an organic electroluminescence display device according to the present invention includes an element substrate on which at least one of metal wiring and electrodes is provided on a substrate, a counter substrate facing the element substrate, A sealing material that seals between the element substrate and the counter substrate, and the region where the sealing material is present is a region between the element substrate and the counter substrate and the region where the metal wiring and the electrode are not provided. And a second sealing region between the counter substrate and the region provided with at least one of the metal wiring and the electrode in the element substrate, The sealing material in the first sealing region includes glass frit, and the sealing material in the second sealing region includes a cured resin.

  According to the above configuration, the sealing material is provided between the element substrate and the counter substrate, and the space between the element substrate and the counter substrate is sealed. Thereby, mixing of moisture or oxygen into the inside of the organic electroluminescence (organic EL) display device from the outside can be prevented, and the lifetime of the organic EL display device can be improved. An organic layer is provided in the space sealed with the sealing material. Therefore, deterioration of the light emission characteristics of the organic layer can be prevented by preventing the entry of moisture or oxygen from the outside.

  The sealing material used in the present invention includes a glass frit and a cured resin. By sealing using these two kinds of sealing materials, sealing with excellent flexibility can be performed. That is, when the sealing frame is formed using only the glass frit, the region between the region where the electrode is formed on the element substrate and the counter substrate, and the region between the region where the electrode is not formed and the counter substrate 5 are formed. In this area, fine irregularities occur in the height of the sealing frame. Therefore, by using a glass frit and a curable resin rich in flexibility, the sealing force can be maintained and a long life can be realized.

  In addition, the region with the sealing material includes a first sealing region between the region where the metal wiring and the electrode are not provided on the element substrate and the counter substrate, and a region where the metal wiring and the electrode are provided on the element substrate. The sealing material in the first sealing region includes a glass frit, and the sealing material in the second sealing region includes a cured resin. . Thus, the glass frit is not in contact with the metal wiring and the electrode.

  That is, when sealing between the element substrate and the counter substrate, the glass frit is cured by applying heat, but since the heat at this time is very high, this heat is directly applied from the glass frit to the electrode. If it is transmitted to the electrode via the metal wiring, the electrode is damaged and power cannot be supplied normally. Therefore, if the glass frit is not in contact with the metal wiring and the electrode, the electrode is not damaged and the reliability of the element can be maintained.

  Moreover, since the area | region in which the metal wiring and the electrode were formed is sealed with cured resin, the arrangement and size of the metal wiring or the electrode are not limited. Therefore, a decrease in yield can be prevented.

  In the organic electroluminescence display device according to the present invention, the curable resin is preferably an ultraviolet curable resin. Thereby, sealing in a short time can be achieved.

  In the organic electroluminescence display device according to the present invention, the first sealing region and the second sealing region are located in a peripheral portion of a surface facing the element substrate in the counter substrate. It is preferable. According to said structure, mixing of the water | moisture content or oxygen into the element from the outside can be prevented suitably.

  In the organic electroluminescence display device according to the present invention, it is preferable that the curable resin is also formed in a region protruding from the second sealing region to the first sealing region.

  According to the above configuration, it is not necessary to form the glass frit provided in the first sealing region and the cured resin provided in the second sealing region on the same plane. Accuracy can be reduced, and the sealing region provided with the sealing material can be reliably sealed.

  In the organic electroluminescence display device according to the present invention, it is preferable that the element substrate further includes a thin film transistor element. Thereby, an active matrix organic electroluminescence display device can be realized.

  A method for manufacturing an organic electroluminescence display device according to the present invention is a method for manufacturing an organic electroluminescence display device including an element substrate including at least one of a metal wiring and an electrode, and a counter substrate facing the element substrate. A first coating step of coating a glass frit on a region of the counter substrate facing a region where the metal wiring and the electrode on the element substrate are not provided; and the metal of the counter substrate on the element substrate A second application step of applying an ultraviolet curable resin to a region facing at least one of the wiring and the electrode; and curing the glass frit and the ultraviolet curable resin to form the element substrate and the counter substrate. And a sealing step for sealing between the two.

  According to the above configuration, since the sealing frame made of two kinds of sealing materials is formed by applying the glass frit and the ultraviolet curable resin to the counter substrate, it is possible to perform sealing with excellent flexibility. In addition, since the glass frit is not in contact with the metal wiring and the electrode during the sealing process, the electrode is not damaged and the reliability of the element can be maintained.

  Moreover, in the manufacturing method of the organic electroluminescence display device according to the present invention, the sealing step includes a first curing step of applying heat to the counter substrate to cure the glass frit, and the first curing step. Thereafter, it is preferable to include a second curing step of irradiating the counter substrate with ultraviolet rays to cure the ultraviolet curable resin.

  According to the above configuration, when the ultraviolet curable resin is cured and sealed after the glass frit is cured, a more flexible ultraviolet curable resin has fine irregularities generated between the glass frit and the ultraviolet curable resin. Can be absorbed and filled without gaps. Therefore, it is possible to completely seal between the element substrate and the counter substrate.

  Moreover, in the manufacturing method of the organic electroluminescence display device according to the present invention, in the second application step, the region to which the ultraviolet curable resin is applied is a region in which at least one of the metal wiring and the electrode is provided. It is preferable that the metal wiring and the electrode are provided so as to include a region protruding from the region where the electrode is not provided.

  According to the above configuration, it is not necessary to form the glass frit provided in the first sealing region and the cured resin provided in the second sealing region on the same plane. Accuracy can be reduced, and the sealing region provided with the sealing material can be reliably sealed.

  An organic electroluminescence display device according to the present invention includes an element substrate provided with at least one of metal wiring and electrodes on a substrate, a counter substrate facing the element substrate, and a gap between the element substrate and the counter substrate. A sealing material for sealing, and the region having the sealing material is a first sealing region between the counter substrate and the region where the metal wiring and the electrode are not provided in the element substrate, And a second sealing region between at least one of the metal wiring and the electrode on the element substrate and the counter substrate, and the sealing in the first sealing region. The stopper material includes a glass frit, and the sealing material in the second sealing region includes a cured resin. Therefore, it is possible to provide an organic EL display device that maintains the reliability of the element and has a high yield.

It is sectional drawing which shows schematic structure of the organic electroluminescent display apparatus which concerns on one Embodiment of this invention. It is a top view which shows schematic structure of the organic electroluminescent display apparatus which concerns on one Embodiment of this invention. It is a top view which shows the modification of the area | region which forms the ultraviolet curable resin line of the organic electroluminescent display apparatus shown in FIG. It is a top view which shows the modification of the area | region which forms the ultraviolet curable resin line of the organic electroluminescent display apparatus shown in FIG. It is a top view which shows the modification of the area | region which forms the glass frit line and ultraviolet curable resin line of the organic electroluminescent display apparatus shown in FIG. It is sectional drawing which shows the structure of the conventional organic electroluminescent display apparatus. It is sectional drawing which shows the structure of the conventional organic electroluminescent display apparatus. It is sectional drawing which shows the structure of the conventional organic electroluminescent display apparatus.

  One embodiment of an organic electroluminescence (organic EL) display device according to the present invention will be described below with reference to FIGS.

[1. Configuration of organic EL display device]
FIG. 1 is a cross-sectional view showing a schematic configuration of an organic EL display device according to an embodiment of the present invention.

  As shown in FIG. 1, the organic EL display device 10 according to this embodiment includes an element substrate 1, a lower electrode 2, an organic layer 3, an upper electrode 4, and a counter substrate 5.

  The organic EL display device 10 according to this embodiment includes a passive matrix in which an organic layer 3 is sandwiched between an element substrate 1 in which a lower electrode 2 and an upper electrode 4 are provided vertically and horizontally, and a counter substrate 5 facing the element substrate 1. Type organic EL display device. Specifically, a sealing material is provided between the element substrate 1 and the counter substrate 5, and a space between the element substrate 1 and the counter substrate 5, that is, the lower electrode 2, the organic layer 3, and the upper electrode. The space provided with 4 is sealed.

  As shown in FIG. 2, the region having the sealing material includes a first sealing region between the region where the lower electrode 2 and the upper electrode 4 are not provided in the element substrate 1 and the counter substrate 5, and the element substrate. 1 is divided into a region where the lower electrode 2 and the upper electrode 4 are provided and a second sealing region between the counter substrate 5. FIG. 2 is a top view showing a schematic configuration of an organic EL display device according to an embodiment of the present invention, and FIG. 1 is a cross-sectional view taken along the line A-A ′ in FIG. 2. In the present embodiment, a glass frit line 6 is provided in the first sealing region, and an ultraviolet curable resin line 7 is provided in the second sealing region.

  As described above, the sealing region of the present embodiment is located in the peripheral portion of the surface of the counter substrate 5 facing the element substrate 1.

  The element substrate 1 is a substrate in which a lower electrode 2, an organic layer 3, and an upper electrode 4 are provided on a substrate serving as a base material. Although the organic EL display device 10 of the present embodiment is a passive matrix type, the present invention is not limited to this and may be an active matrix type. In this case, the element substrate 1 may be provided with, for example, a TFT (thin film transistor) element and a metal wiring.

  The lower electrode 2 is an electrode for injecting holes into the organic layer 3. As shown in FIG. 2, a plurality of lower electrodes 2 are arranged on the element substrate 1 in a matrix at predetermined intervals. Each of the plurality of lower electrodes 2 arranged in this way constitutes a pixel region of the organic EL display device 10.

  The organic layer 3 is a layer that emits light by recombination of holes injected from the lower electrode 2 and electrons injected from the upper electrode 4. The organic layer 7 may be an organic layer composed of a single light emitting layer as shown in FIG. 1, for example, a carrier injection layer such as a hole injection layer or an electron injection layer, and a hole transport layer or an electron transport layer. A laminated structure in which the light emitting layer is held by a carrier transporting layer such as the above may be used.

  The upper electrode 4 is an electrode for injecting electrons into the organic layer 3, and is formed on the organic layer 3. In the organic EL display device 10 according to the present embodiment, the upper electrode 4 is provided so as to be orthogonal to the lower electrode 2 as shown in FIG.

  The counter substrate 5 is a substrate bonded so as to face the element substrate 1. In the present embodiment, the size of the counter substrate 5 is smaller than that of the element substrate 1, but is not limited thereto. Further, a sealing material that seals the space between these substrates is provided between the counter substrate 5 and the element substrate 1. Here, the sealing frame formed from the sealing material in the organic EL display device 10 according to the present embodiment will be described.

(Sealing frame of the organic EL display device 10)
As described above, the sealing material is provided between the element substrate 1 and the counter substrate 5 to seal the space between the element substrate 1 and the counter substrate 5. In this specification, a frame formed of a sealing material that seals the space is called a sealing frame. Thereby, it is possible to prevent moisture or oxygen from entering the organic EL display device 10 from the outside, and to improve the life of the organic EL display device 10. An organic layer 3 is provided in the space sealed with the sealing material. Therefore, the deterioration of the light emission characteristics of the organic layer 3 can be prevented by preventing the entry of moisture or oxygen from the outside.

  The sealing material used in the present embodiment includes glass frit and ultraviolet curable resin. By sealing using these two kinds of sealing materials, sealing with excellent flexibility can be performed. That is, when the sealing frame is formed using only the glass frit, the region between the region where the electrode is formed in the element substrate 1 and the counter substrate 5, the region where the electrode is not formed, and the counter substrate 5 In the region between, fine irregularities may occur in the height of the sealing frame. Therefore, by using a glass frit and a flexible ultraviolet curable resin in combination, the sealing force can be maintained and a long life can be realized.

  Further, the sealing frame of the present embodiment is provided at the peripheral edge of the counter substrate 5, and this region is divided into a glass frit line 6 and an ultraviolet curable resin line 7. Specifically, as shown in FIG. 2, the glass frit line 6 is a region between the region where the lower electrode 2 and the upper electrode 4 are not provided in the element substrate 1 and the counter substrate 5, and is an ultraviolet curable resin. The line 7 is a region between the region of the element substrate 1 where the lower electrode 2 and the upper electrode 4 are provided and the counter substrate 5.

  Thus, the glass frit line 6 is not in contact with the lower electrode 2 and the upper electrode 4, and the ultraviolet curable resin line 7 is provided in the region where the lower electrode 2 and the upper electrode 4 are formed. With such a configuration, the organic EL display device 10 with high element yield and high yield can be obtained.

  That is, when sealing between the element substrate 1 and the counter substrate 5, the glass frit is heated and cured. Since the heat at this time is very high, if this heat is directly transmitted from the glass frit to the electrode or is transmitted to the electrode through the metal wiring, the electrode is damaged and power cannot be supplied normally. Therefore, if the glass frit is not in contact with the electrode and the metal wiring, the electrode is not damaged, and the reliability of the element can be maintained.

  Moreover, since the area | region in which the lower electrode 2 and the upper electrode 4 were formed is sealed with ultraviolet curable resin, arrangement | positioning and a magnitude | size of an electrode (or metal wiring) are not limited. Therefore, a decrease in yield can be prevented.

  The region where the sealing frame is provided is not limited to the peripheral edge of the counter substrate 5, and an ultraviolet curable resin is provided between the region where the lower electrode 2 and the upper electrode 4 are provided and the counter region 5. What is necessary is just to be provided. Further, for example, in the case of an active matrix organic EL display device, an ultraviolet curable resin may be provided in a region between the counter substrate and a region provided with electrodes and metal wiring in the element substrate.

  The glass frit material may include fine glass particles, but is not particularly limited, and may include, for example, a filler or an additive.

  The glass is not particularly limited, and examples thereof include borosilicate glass and vanadate glass. One kind of these materials may be used for the glass frit, or a plurality of kinds may be used in combination. Moreover, although the magnitude | size of these glass particles is not specifically limited, For example, it is more preferable that it is 1-10 micrometers.

  When the glass frit contains a filler or additive, a ceramic filler such as quartz glass may be used as the filler or additive. Thereby, the space between the two substrates can be suitably sealed.

  Further, when the glass frit line 6 is formed using glass frit, an organic binder or an organic solvent can be added to the glass frit to form a paste. At this time, the organic binder or the organic solvent is not particularly limited, and for example, a cellulose binder / butyl carbitol acetate solvent, a cellulose binder / terpineol solvent, or the like may be used.

  The ultraviolet curable resin is not particularly limited. For example, an acrylic resin or an epoxy resin may be used, and a silicone resin or the like may be used. In this embodiment, an ultraviolet curable resin is used as a sealing material that can be provided between the electrode and the counter substrate 5, but other visible light curable resin, thermosetting resin, electron beam curable resin, or the like may be used. it can.

[2. Manufacturing method of organic EL display device]
Next, a method for manufacturing the organic EL display device 10 according to this embodiment will be described.

  In the method of manufacturing the organic EL display device 10 according to the present embodiment, a glass frit application step (first application step) for applying the glass frit 7 to the counter substrate 5 and an ultraviolet ray for applying the ultraviolet curable resin 6 to the counter substrate 5 are performed. A cured resin coating process (second coating process) and a sealing process for sealing between the element substrate 1 and the counter substrate 5 may be included.

  The glass frit application step is a step of forming a glass frit line 6 by applying a glass frit to a region of the counter substrate 5 that faces the region of the element substrate 1 where the lower electrode 2 and the upper electrode 4 are not provided.

  The ultraviolet curable resin coating step is a step of forming the ultraviolet curable resin line 7 by applying the ultraviolet curable resin to a region of the counter substrate 5 facing the region where the lower electrode 2 and the upper electrode 4 are provided on the element substrate 1. is there.

  The sealing step is a step of sealing between the element substrate 1 and the counter substrate 5 by curing the glass frit and the ultraviolet curable resin.

  Here, the flow of the manufacturing method of the organic EL display device 10 according to the present embodiment will be described below.

(Preparation of element substrate 1)
First, a substrate to be a base material for the element substrate 1 is prepared. The substrate is not particularly limited, and for example, an insulating material such as glass or plastic may be used. A lower electrode 2 is formed on this substrate.

  The material for the lower electrode 2 is not particularly limited. For example, Au (gold), Ni (nickel), Pt (platinum), ITO (indium-tin oxide), or the like may be used. The lower electrode 2 may be formed by patterning an electrode material film on the substrate using, for example, a sputtering method. This pattern may be provided, for example, such that a plurality of lower electrodes 2 are formed in a matrix at predetermined intervals on the substrate.

  Next, the organic layer 3 is formed on the lower electrode 2. The organic layer 3 only needs to contain a light emitting material, and examples thereof include a light emitting material that emits one of red (R), green (G), and blue (B). Further, as described above, it may be an organic layer composed of a single light emitting layer, or a multilayer structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer are laminated. It may be an organic layer.

  When the organic layer 3 has a multilayer structure, the hole injection layer and the hole transport layer each function to enhance the injection of holes into the light emitting layer. The electron transport layer and the electron injection layer function to transport electrons injected from the upper electrode 4 to the light emitting layer. The light emitting layer is a layer that emits light. Specifically, in the light emitting layer, when the voltages of the lower electrode 2 and the upper electrode 4 are applied, holes and electrons are injected from the respective electrodes and recombined to generate excitons. The excitons provide energy to the organic light emitting material in the light emitting layer, so that the organic light emitting material emits light.

  Examples of the material for the hole injection layer and the hole transport layer include benzine, styrylamine, triphenylamine, porphyrin, triazole, imidazole, oxadiazole, polyarylalkane, phenylenediamine, arylamine, oxazole, anthracene, and fluorenone. Hydrazone, stilbene, triphenylene, azatriphenylene, or derivatives thereof can be used. Alternatively, a heterocyclic conjugated monomer, oligomer, or polymer such as a polysilane compound, a vinyl carbazole compound, a thiophene compound, or an aniline compound may be used.

  Examples of the material for the electron transport layer and the electron injection layer include quinoline, perylene, phenanthroline, bisstyryl, pyrazine, triazole, oxazole, oxadiazole, fluorenone, and derivatives and metal complexes thereof. Examples thereof include tris (8-hydroxyquinoline) aluminum, anthracene, naphthalene, phenanthrene, pyrene, anthracene, perylene, butadiene, coumarin, acridine, stilbene, 1,10-phenanthroline, and derivatives or metal complexes thereof.

  As the light-emitting layer, it is more preferable to use a material having high light emission efficiency, and examples thereof include organic materials such as low-molecular fluorescent dyes, fluorescent polymers, and metal complexes. Examples of such organic materials include anthracene, naphthalene, indene, phenanthrene, pyrene, naphthacene, triphenylene, anthracene, perylene, picene, fluoranthene, acephenanthrylene, pentaphen, pentacene, coronene, butadiene, coumarin, acridine, stilbene, Or a derivative thereof, a tris (8-quinolinolato) aluminum complex, a bis (benzoquinolinolato) beryllium complex, or a tri (dibenzoylmethyl) phenanthroline europium complex ditoluyl vinyl biphenyl.

  If the charge transporting light emitting layer doped in place with the acceptor, donor and organic light emitting material as dopants is applied to the organic layer 3, the organic layer 3 has a single layer structure. Can do. As a charge-transporting material that can be used for the charge-transporting light-emitting layer, a known charge-transporting material for organic EL can be used. Such charge transporting materials are classified into low molecular materials or high molecular materials, and specific compounds thereof are exemplified below, but are not limited to these materials.

  Examples of the charge transport material include benzofuran derivatives such as bis (carbazoyl) benzodifuran (CZBDF), cyclopentadiene derivatives, tetraphenylbutadiene derivatives, triphenylamine derivatives, oxadiazole derivatives, bathophenanthroline derivatives, and pyrazoloquinoline derivatives. , Styrylbenzene derivatives, styrylarylene derivatives, aminostyryl derivatives, silole derivatives, thiophene ring compounds, pyridine ring compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squalium derivatives, porphyrin derivatives, styryl Dyes, tetracene derivatives, pyrazoline derivatives, trifumanylamine derivatives, anthracene derivatives, diphenylanthracene derivatives Body, pyrene derivative, carbazole derivative, oxadiazole dimer, virazoline dimer, aluminum quinolinol complex, benzoquinolinol beryllium complex, benzoxazole zinc complex, benzothiazole zinc complex, azomethyl zinc complex, porphyrin zinc complex, eurobium complex, iridium complex, It has platinum, etc., metal such as Al, Zn, Be, Pt, Ir, Tb, Eu, Dy as the central metal, and oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, quinoline structure, etc. as the ligand And low molecular weight materials such as metal complexes.

  Examples of the polymer light emitting material include poly (oxadiazole) (Poly-OXZ), polystyrene derivative (PSS), polyaniline-camphor sulfonic acid (PANI-CSA), and poly (triphenylamine-oxadiazizole) derivative. And polymer materials such as (Poly-TPD-OXD) and poly (carbazole-triazole) derivatives (Poly-Cz-TAZ).

  Here, in particular, in order to obtain high luminous efficiency, excitation energy is obtained by using a dual charge transporting material having a singlet excitation level (S1) higher than the triplet excitation level (T1) of the phosphorescent material. Must be confined in a phosphorescent material. That is, it is more preferable that the relationship of S1 (both charge transport materials)> T1 (organic light emitting material) is satisfied. Therefore, it is more preferable to use a carbazole group, a triazole group, or a benzofuran group having a high excitation level and a high hole mobility as the both charge transporting material.

On the other hand, as the acceptor, a known acceptor material for organic EL can be used. Although these specific compounds are illustrated below, it is not limited to these materials.
Acceptor materials include Au, Pt, W, Ir, POCl ₃ , AsF ₆ , Cl, Br, I, vanadium oxide (V ₂ O ₅ ), molybdenum oxide (MoO ₂ ) and other inorganic materials, TCNQ (7, 7 , 8,8, -tetracyanoquinodimethane), TCNQF ₄ (tetrafluorotetracyanoquinodimethane), TCNE (tetracyanoethylene), HCNB (hexacyanobutadiene), DDQ (dicyclodicyanobenzoquinone), etc. And compounds having a nitro group such as TNF (trinitrofluorenone) and DNF (dinitrofluorenone), and organic materials such as fluoranyl, chloranil and bromanyl. Among these, compounds having a cyano group such as TCNQ, TCNQF ₄ , TCNE, HCNB, DDQ and the like are more preferable because they can increase the carrier concentration more effectively.

  On the other hand, a known donor material for organic EL can be used as the donor. Although these specific compounds are illustrated below, it is not limited to these materials.

  As donor materials, inorganic materials such as alkali metals, alkaline earth metals, rare earth elements, Al, Ag, Cu, and In, anilines, phenylenediamines, benzidines (N, N, N ′, N′-tetraphenyl) Benzidine, N, N′-bis- (3-methylphenyl) -N, N′-bis- (phenyl) -benzidine, N, N′-di (naphthalen-1-yl) -N, N′-diphenyl- Benzidine, etc.), triphenylamines (triphenylamine, 4,4′4 ″ -tris (N, N-diphenyl-amino) -triphenylamine, 4,4′4 ″ -tris (N-3- Methylphenyl-N-phenyl-amino) -triphenylamine, 4,4′4 ″ -tris (N- (1-naphthyl) -N-phenyl-amino) -triphenylamine, etc.), triphenyldiamine Compounds having aromatic tertiary amine skeleton such as (N, N′-di- (4-methyl-phenyl) -N, N′-diphenyl-1,4-phenylenediamine), phenanthrene, pyrene, perylene, anthracene And condensed polycyclic compounds such as tetracene and pentacene (wherein the condensed polycyclic compound may have a substituent), organic materials such as TTF (tetrathiafulvalene), dibenzofuran, phenothiazine and carbazole. Among these, a compound having an aromatic tertiary amine in the skeleton, a condensed polycyclic compound, or an alkali metal is more preferable because it can increase the carrier concentration more effectively.

  As an organic light emitting material that can be used for the charge transporting light emitting layer, a known organic light emitting material for organic EL can be used. Although these specific compounds are illustrated below, it is not limited to these materials.

Examples of such an organic light-emitting material include fluorescent materials such as styryl derivatives, perylene, iridium complexes, coumarin derivatives, lumogen F red, dicyanomethylenepyran, phenoxazone, and porphyrin derivatives, bis [(4,6-difluorophenyl)- Pyridinato-N, C2 ′] picolinate iridium (III) (FIrpic), tris (2-phenylpyridyl) iridium (III) (Ir (ppy) ₃ ), tris (1-phenylisoquinoline) iridium (III) (Ir (piq ₃ ), phosphorescent organic metal complexes such as tris (biphenylquinoxalinato) iridium (III) (Q3Ir), and the like. Among these, it is particularly preferable to use a phosphorescent material for the purpose of dramatically reducing power consumption.

  For example, the organic layer 3 may be formed by depositing an organic material on the lower electrode 2 using mask vapor deposition.

  Next, the upper electrode 4 is formed on the organic layer 3. As a material of the upper electrode 4, for example, a magnesium alloy (for example, MgAg), an aluminum alloy (for example, AlLi, AlCa, AlMg, etc.), metallic calcium, or other metal having a small work function may be used. Moreover, the formation method of the upper electrode 4 should just form the film | membrane of an electrode material on a board | substrate, for example using mask vapor deposition. Thereby, the element substrate 1 is obtained.

  In addition, the manufacturing method of the element substrate 1 described above is not particularly limited, and can be manufactured using a conventionally known method.

(Preparation of counter substrate 5)
First, a substrate to be a base material for the counter substrate 5 is prepared. The substrate is not particularly limited, and an insulating material such as glass or plastic may be used similarly to the element substrate 1. A glass frit line 6 and an ultraviolet curable resin line 7 are formed on the substrate.

  As a method for forming the glass frit line 6, for example, a dispenser technique may be used to apply glass frit to a region facing the region where the lower electrode 2 and the upper electrode 4 are not provided in the element substrate 1. The method for forming the glass frit line 6 is not limited to this, and other methods such as a screen printing method or an ink jet method can also be used.

  The width of the glass frit line 6 is not particularly limited, and may be appropriately set according to the size of the substrate. Moreover, after apply | coating glass frit, the glass frit line 6 can be formed by heating a board | substrate to 300-450 degreeC and carrying out temporary hardening, for example. At this time, the heating method of the substrate includes, for example, atmospheric heating or reduced pressure heating.

  The ultraviolet curable resin line 7 is formed by, for example, applying a UV curable resin to a region facing the region where the lower electrode 2 and the upper electrode 4 are provided in the element substrate 1 by using a dispenser technique. Line 7 can be formed. The method of forming the ultraviolet curable resin line 7 is not limited to this, and other methods such as a screen printing method or an ink jet method can also be used.

  The width of the ultraviolet curable resin line 7 is not particularly limited, and may be set as appropriate according to the size of the substrate. Thereby, the counter substrate 5 is obtained.

(Sealing process)
Sealing between the element substrate 1 and the counter substrate 5 is performed after the glass frit curing step (first curing step) in which the counter substrate 5 is heated to cure the glass frit and the glass frit curing step. 5 includes an ultraviolet curing resin curing step (second curing step) in which ultraviolet rays are irradiated to cure the ultraviolet curing resin. Thereby, it is possible to completely seal between the element substrate 1 and the counter substrate 5.

  That is, the organic EL display device 10 uses two types of sealing materials. Therefore, when these sealing materials are cured, if the glass frit is cured after the ultraviolet curable resin is cured, minute unevenness may occur between the cured ultraviolet curable resin and the glass frit. . On the other hand, when the ultraviolet curable resin is cured after the glass frit is cured, the ultraviolet curable resin rich in flexibility can absorb unevenness that may occur between the cured glass frit and can be filled without a gap. . Therefore, unevenness hardly occurs between the cured ultraviolet curable resin and the glass frit, and the gap between the element substrate 1 and the counter substrate 5 can be completely sealed.

  As a method for sealing the glass frit, for example, the glass frit may be cured by applying heat along the glass frit line 6. Here, the heating method is not particularly limited. For example, the heating method may be performed by laser irradiation / scanning. In addition, when using a laser, what can irradiate light with a wavelength of 800-1500 nm is preferable, for example, a YAG (yttrium, aluminum, garnet) laser may be used.

  As a sealing method of the ultraviolet curable resin, for example, an ultraviolet irradiation device that irradiates ultraviolet rays is used, and a part or all of the element substrate 1 other than the ultraviolet curable resin line 7 is masked along the ultraviolet curable resin line 7. Then, the entire surface of the substrate may be irradiated with ultraviolet rays having a wavelength of 200 to 400 nm to be cured. Thereby, the space between the element substrate 1 and the counter substrate 5 is sealed, and the organic EL display device 10 according to the present embodiment is obtained.

  In the organic EL display device 10 according to the present embodiment, the glass frit line 6 provided in the first sealing region and the ultraviolet curable resin line 7 provided in the second sealing region are flush with each other. Although an example was shown, the present invention is not limited to this, and it is more preferable that the ultraviolet curable resin line 7 is formed in a region that protrudes beyond the first sealing region to the first sealing region. preferable. 3 and 4 are top views showing modifications of the region where the ultraviolet curable resin line 7 of the organic electroluminescence display device shown in FIG. 2 is formed.

  For example, as shown in FIG. 3, if the ultraviolet curable resin line 7 is formed so as to surround the glass frit line 6, the alignment accuracy required for the glass frit line 6 and the ultraviolet curable resin line 7 is lowered. Thus, a sealed sealing frame can be formed reliably.

  The formation region of the ultraviolet curable resin line 7 may be for each electrode (or metal wiring) as shown in FIG. 3, or encloses the electrodes provided on one side as shown in FIG. You may form as follows. That is, it is sufficient that the ultraviolet curable resin line 7 is formed at least in the second sealing region.

  Furthermore, the sealing frame of the present invention may be formed such that the ultraviolet curable resin line 7 protrudes from the first sealing region as shown in FIG. FIG. 5 is a top view showing a modification of a region where the organic electroluminescent glass frit line 6 and the ultraviolet curable resin line 7 shown in FIG. 2 are formed.

  In the example shown in FIG. 5, the glass frit line 6 is formed inside the first sealing region from the point where the first sealing region and the second sealing region are in contact. Further, the ultraviolet curable resin line 7 is an area inside the first sealing area from the point where the first sealing area and the second sealing area are in contact, and the glass frit line 6 is not formed. It is formed up to. Thus, the glass frit line 6 is not formed near the contact point between the first sealing region and the second sealing region, and the glass frit line 6 is not in contact with the electrode. Therefore, for example, when the glass frit is cured by irradiating a laser, there is no possibility that the heat of laser irradiation is transmitted to the electrode through the glass frit, and the electrode can be prevented from being damaged.

  EXAMPLES Hereinafter, although this invention is demonstrated based on an Example, this invention is not limited to this Example. In this example, an organic EL display device was produced by the following method.

First, an ITO film was patterned on a glass insulating substrate having a substrate size of 50 mm ² and a thickness of 0.7 mm to form a lower electrode. At this time, the film thickness of the lower electrode was set to 150 nm. Thereafter, the luminescent material was patterned on the lower electrode by mask vapor deposition to obtain an organic layer. Finally, the upper electrode was formed by patterning aluminum on the insulating substrate by mask vapor deposition to obtain an element substrate.

Next, an insulating substrate made of glass having a substrate size of 40 mm ² and a thickness of 0.7 mm is prepared, and in the sealing frame forming region on the substrate, glass is placed in a region not including the upper electrode and the lower electrode of the element substrate. A frit line was formed. Specifically, first, vanadate glass was applied by a dispenser method so as to form a glass frit line having a width of 2 mm and a thickness of 1 mm. After the application was completed, the entire insulating substrate was heated in an electric furnace at 400 ° C. for 1 hour to temporarily cure the glass frit.

  Thereafter, an ultraviolet curable resin line was formed in a region including the upper electrode and the lower electrode of the element substrate in a region where a sealing frame (consisting of a glass frit line and an ultraviolet curable resin line) was formed on the insulating substrate. Specifically, first, an epoxy resin was applied by a dispenser method so as to form an ultraviolet curable resin line having a width of 2 mm and a thickness of 1 mm. Thereby, a counter substrate was obtained.

  The element substrate thus obtained and the counter substrate were bonded together under an inert gas atmosphere.

  As a bonding method, first, temporary bonding using a glass frit was performed first. Specifically, bonding was performed by irradiating and scanning a YAG laser having a wavelength of 1040 to 1,080 nm from the counter substrate side along the glass frit line.

  After the temporary bonding by the glass frit was completed, the entire surface of the substrate was irradiated with ultraviolet light having a wavelength of 365 nm from the opposite substrate side with an ultraviolet irradiation device at an ultraviolet irradiation amount of 6,000 mJ. As a result, the ultraviolet curable resin was cured and the bonding was completed.

  In this embodiment, the glass frit is temporarily sealed, and then the main sealing is performed with the ultraviolet curable resin. However, it is more preferable to seal in this order. That is, the glass frit after temporary sealing is poor in flexibility. Therefore, for example, when the ultraviolet curable resin is first cured and temporarily sealed, the glass frit cannot absorb minute irregularities generated between the ultraviolet curable resin and the glass frit when the glass frit is subsequently sealed. There is a risk of incomplete sealing. On the other hand, if the glass frit is temporarily sealed and then finally sealed with an ultraviolet curable resin, the ultraviolet curable resin absorbs the unevenness, and thus complete sealing becomes possible.

  The organic EL display device obtained as described above was free from electrode damage during laser welding. For this reason, it has the characteristics of high luminous efficiency and long life.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims, and the embodiments can be obtained by appropriately combining technical means disclosed in different embodiments. The form is also included in the technical scope of the present invention.

  The present invention can be used for various display devices, and can be used for televisions, games, computers, and the like.

DESCRIPTION OF SYMBOLS 1 Element substrate 2 Lower electrode 3 Organic layer 4 Upper electrode 5 Opposite substrate 6 Glass frit line 7 UV curable resin line 10 Organic EL display device

Claims (8)

An element substrate provided with at least one of metal wiring and electrodes on the substrate;
A counter substrate facing the element substrate;
A sealing material for sealing between the element substrate and the counter substrate;
The region having the sealing material includes the metal wiring and the first sealing region between the region where the electrode is not provided and the counter substrate, and the metal wiring and the above in the element substrate. Divided into a second sealing region between a region where at least one of the electrodes is provided and the counter substrate;
The organic electroluminescence display device, wherein the sealing material in the first sealing region includes a glass frit, and the sealing material in the second sealing region includes a cured resin.   The organic electroluminescence display device according to claim 1, wherein the curable resin is an ultraviolet curable resin.   The said 1st sealing area | region and the said 2nd sealing area | region are located in the peripheral part of the surface which is facing the said element substrate in the said opposing board | substrate. Organic electroluminescence display device.   The organic electroluminescence according to any one of claims 1 to 3, wherein the cured resin is also formed in a region protruding from the second sealing region to the first sealing region. Display device.   The organic electroluminescence display device according to claim 1, wherein the element substrate further includes a thin film transistor element. An element substrate including at least one of a metal wiring and an electrode, and a manufacturing method of an organic electroluminescence display device including a counter substrate facing the element substrate,
A first coating step of coating a glass frit on a region of the counter substrate facing a region where the metal wiring and the electrode are not provided on the element substrate;
A second application step of applying an ultraviolet curable resin to a region of the counter substrate facing a region where at least one of the metal wiring and the electrode is provided in the element substrate;
And a sealing step of sealing the gap between the element substrate and the counter substrate by curing the glass frit and the ultraviolet curable resin. The sealing step
A first curing step of curing the glass frit by applying heat to the counter substrate;
The organic electroluminescence display device according to claim 6, further comprising a second curing step of irradiating the counter substrate with ultraviolet rays after the first curing step to cure the ultraviolet curable resin. Production method.   In the second application step, the region to which the ultraviolet curable resin is applied is a region that protrudes beyond the region in which at least one of the metal wiring and the electrode is provided in the region in which the metal wiring and the electrode are not provided. The method for manufacturing an organic electroluminescence display device according to claim 6, wherein the organic electroluminescence display device is provided.

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