JP2011018479A - Organic electroluminescent display device and method of manufacturing the same - Google Patents

Abstract

An organic electroluminescence display device having a low cost, high productivity, and a sufficient sealing effect and a method for manufacturing the same are provided.
A sealing substrate 260 and a substrate 210 that face each other, an anode and a cathode, and an organic light emitting layer that emits light in accordance with a voltage applied between the anode and the cathode, the sealing substrate 260 and the substrate 210 are provided. The organic EL element 220 and the organic EL element 220 are formed so as to surround the organic EL element 220, and the organic EL element 220 is connected together with the sealing substrate 260 and the substrate 210 by connecting the sealing substrate 260 and the substrate 210. The cut surface of the frit glass 240 in a plane parallel to the sealing substrate 260 has a band shape along the periphery of the rectangular region where the organic EL element 220 is formed. Of the 240 cut surfaces, the cut surface in the section corresponding to one side of the rectangular region has a strip shape excluding a straight line.
[Selection] Figure 2

Description

  The present invention relates to an organic electroluminescence display device and a manufacturing method thereof, and more particularly, to an organic electroluminescence display device including an organic light emitting element sealed using two substrates and frit glass and a manufacturing method thereof.

  Conventionally, display devices have been required to be bright, vivid, thin, light, and have a large area, and technological development has been steadily advanced. Liquid crystal displays and plasma displays have been commercialized as display devices that satisfy the demand for thin, light, and large area, and are still evolving after more than 10 years have passed since the start.

  In such an environment, in recent years, displays using electroluminescence (hereinafter referred to as EL) elements whose emission intensity is controlled according to the amount of current and whose response speed is very fast have been commercialized, and technological development has progressed significantly. It is out. Among them, an organic EL display using an organic EL element has been attracting attention as a next-generation flat panel display having the advantages of good viewing angle characteristics, brightness, vividness, and low power consumption.

  Generally, an organic EL element is deteriorated by impurities such as moisture and oxygen. Therefore, in order to prevent the deterioration of the organic EL element, various techniques for protecting the organic EL element from moisture, oxygen and the like are currently proposed.

For example, a technique for protecting an organic EL element from moisture and oxygen by forming a passivation film on the organic EL element (that is, sealing the organic EL element with a thin film) is known. In order to sufficiently protect the organic EL element, for example, the condition that the oxygen permeability per day is 10 ⁻³ cc / m ² or less and the moisture permeability is 10 ⁻⁶ g / m ² or less is satisfied. It is necessary to form a passivation film. In order to satisfy this condition, conventionally, a silicon nitride film (SiN) or silicon oxynitride film (SiON) having a thickness of 5 μm to 10 μm is laminated on the organic EL element as a passivation film.

  Patent Documents 1 and 2 describe a technique for sealing an organic EL element using two substrates and frit glass.

  FIG. 1A is a plan view showing a configuration of a conventional organic EL display device 100 described in Patent Document 1. FIG. FIG.1 (b) is sectional drawing which shows the structure of the conventional organic electroluminescence display 100 of patent document 1 when cut | disconnecting by the AA direction shown to Fig.1 (a).

  As shown in FIGS. 1A and 1B, the organic EL display device 100 includes glass substrates 110 and 120, an organic EL element 130, and a frit glass 140. The frit glass 140 is bonded to the glass substrates 110 and 120 so as to surround the organic EL element 130. The organic EL element 130 is formed in a space sealed by the glass substrate 110, the glass substrate 120, and the frit glass 140.

  As described above, the organic EL display device 100 described in Patent Document 1 protects the organic EL element 130 from moisture and oxygen by sealing the organic EL element 130 using the frit glass 140.

  Patent Document 2 describes a technique for improving the strength and sealing effect of doubled frit glass.

Japanese Patent Laid-Open No. 2007-200845 JP 2008-117767 A JP 2007-220647 A

However, according to the above prior art, there are the following problems.
First, the technique of encapsulating an organic EL element with a thin film has a problem of high cost and poor productivity. This is because forming a thick passivation film not only takes a very long time (for example, it takes 10 minutes to form a 1 μm passivation film), but also costs a lot.

  Moreover, in the technique of sealing an organic EL element using the two substrates and frit glass described in Patent Document 1 and Patent Document 2, the strength of the frit glass is not sufficiently secured, and a sufficient sealing effect is obtained. There is a problem that it cannot be obtained. Specifically, it is as follows.

  When frit glass is bonded to a glass substrate, bonding is usually performed by melting the glass by laser annealing. Residual distortion occurs in the frit glass due to the heat generated at this time. Due to the stress generated in the frit glass due to the residual strain, the frit glass is peeled off from the glass substrate, or the frit glass or the glass substrate is broken.

  Certainly, even if one of the frit glasses is broken by double the frit glass as in the technique described in Patent Document 2, it is possible to seal the organic EL element with the other frit glass. it can. However, since the strength itself of one frit glass does not change, it cannot be said that a sufficient sealing effect is obtained.

  As described above, in order to achieve high productivity at low cost, it is desirable to seal the organic EL element using frit glass. However, in the conventional technology using frit glass, the frit glass is used. There exists a subject that the intensity | strength of itself and the adhesive strength of a frit glass and a board | substrate are not enough. That is, the conventional technique using frit glass cannot obtain a sufficient sealing effect.

  Accordingly, the present invention has been made to solve the above problems, and provides an organic electroluminescence display device having a low cost, high productivity, and a sufficient sealing effect, and a method for manufacturing the same. The purpose is to provide.

  In order to solve the above problems, an organic electroluminescence display device according to the present invention emits light according to a first substrate and a second substrate facing each other, an anode and a cathode, and a voltage applied between the anode and the cathode. An organic light emitting layer, and an organic light emitting device formed between the first substrate and the second substrate, a light emitting region having the organic light emitting device, and surrounding the light emitting region, By connecting the first substrate and the second substrate, the first substrate and the second substrate, and a sealing portion that seals the light emitting region together with the first substrate, the surface in a plane parallel to the first substrate The cut surface of the sealing portion has a band shape along the periphery of the rectangular region where the light emitting region is formed, and the cut surface of the section corresponding to one side of the rectangular region out of the cut surface excludes a straight line. It is a band shape.

  Thereby, since the cut surface in the surface direction of the sealing portion is a strip shape that is not a straight line, the stress generated on the sealing portion itself or the bonding surface between the sealing portion and the substrate can be dispersed. Thus, it can prevent that a sealing part will be destroyed or a sealing part will peel from a board | substrate because a sealing part is a shape which disperse | distributes stress. Therefore, a sufficient sealing effect can be obtained and the organic light emitting element can be protected, so that the life of the organic electroluminescence display device of the present invention can be extended.

  In addition, the cut surface of the sealing portion is a band shape having a line width equal to or greater than a first value, and the area of the cut surface of the section corresponding to one side of the rectangular region of the cut surface of the sealing portion is The section may be larger than the area of the cut surface when formed by a straight line having the line width of the first value.

  Accordingly, when attention is paid to the adhesion surface between the sealing portion and the substrate, the sealing portion and the substrate of the present invention adhere to each other in an area larger than the adhesion surface in contact with the substrate when the sealing portion is formed in a linear shape. Therefore, the adhesive strength can be further increased.

  Here, “the cut surface of the sealing portion is a band shape having a line width equal to or greater than the first value, and the section of the cut surface of the sealing portion corresponding to one side of the rectangular region is cut. The area of the surface may be larger than the area of the cut surface in the case where the section is formed by a straight line having the line width of the first value. Specifically, the surface includes the shapes described below. It is a waste.

  For example, the cut surface of the sealing portion may have a shape in which a predetermined shape that is not a straight line is periodically repeated along the sealing portion.

The cut surface of the sealing portion may have a wavy shape with a line width equal to or greater than the first value.
The wavy line shape may include a sine wave, a triangular wave, a square wave, or a sawtooth wave.

  Further, the line width of the wavy line shape may be periodically repeated between the first value and a second value larger than the first value along the wavy line shape.

  Further, the cut surface of the sealing portion may have a shape having a convex portion that is periodically repeated on at least one side of a band shape having a line width equal to or greater than the first value.

Further, the cut surface of the sealing portion may be a chain shape.
Further, the organic electroluminescence display device is further formed so as to surround the organic light emitting element, and by connecting the first substrate and the second substrate, the sealing portion, the first substrate, and the The 1st adhesion part which forms the sealed 1st space with the 2nd substrate is provided, and the pressure of the 1st space may be lower than atmospheric pressure.

  As a result, by making the pressure in the first space an atmospheric pressure lower than the atmospheric pressure (for example, vacuum), a force that always keeps the sealing portion and the first substrate and the second substrate in close contact is applied to the vicinity of the sealing portion. It is done. Therefore, the close contact between the sealing portion and the first substrate and the second substrate is more easily and reliably performed, so that a sufficient sealing effect can be obtained and the organic light emitting device can be protected. The lifetime of the organic electroluminescence display device of the present invention can be extended.

  Further, the method of manufacturing an organic electroluminescence display device of the present invention includes a light emitting region having an organic light emitting element having an anode and a cathode, and an organic light emitting layer that emits light according to a voltage applied between the anode and the cathode. A sealing portion forming step for forming a sealing portion for sealing on the first substrate, and the second substrate on which the first substrate and the organic light emitting element are formed are under atmospheric pressure lower than atmospheric pressure. A surface parallel to the first substrate, wherein the light emitting region is surrounded by the sealing portion and is bonded between the first substrate and the second substrate. The cut surface of the sealing portion in FIG. 4 is a band shape along the periphery of the rectangular region where the light emitting region is formed, and the cut surface of the section corresponding to one side of the rectangular region is a straight line. It is a band shape excluding.

  According to the present invention, since the organic light emitting element can be sufficiently sealed, deterioration of the organic light emitting element can be prevented, and the life of the organic electroluminescence display device can be extended. Furthermore, an organic electroluminescence display device having such a sufficient sealing effect can be manufactured at low cost and with high productivity.

It is sectional drawing which shows the structure of the conventional organic EL display apparatus. It is sectional drawing which shows an example of a structure of the organic electroluminescent display apparatus of this Embodiment. (A) It is a top view which shows an example of the positional relationship of the frit glass of this Embodiment, and a sealing substrate. (B) It is a top view which shows an example of the positional relationship of the frit glass of this Embodiment, and a sealing substrate. (A) It is a figure which shows an example (wave line) of the shape of the cut surface of the frit glass of this Embodiment. (B) It is a figure which shows an example (the wavy line from which line width differs) of the shape of the cut surface of the frit glass of this Embodiment. (C) It is a figure which shows an example (sine wave) of the shape of the cut surface of the frit glass of this Embodiment. (D) It is a figure which shows an example (rectangular wave) of the shape of the cut surface of the frit glass of this Embodiment. (E) It is a figure which shows an example (triangular wave) of the shape of the cut surface of the frit glass of this Embodiment. (F) It is a figure which shows an example (sawtooth wave) of the shape of the cut surface of the frit glass of this Embodiment. (G) It is a figure which shows an example (the convex part on both sides) of the shape of the cut surface of the frit glass of this Embodiment. (H) It is a figure which shows an example (chain shape) of the shape of the cut surface of the frit glass of this Embodiment. It is the perspective view and sectional drawing which show an example of the manufacturing process of the organic electroluminescence display of this Embodiment. It is sectional drawing which shows an example of the process of forming the frit glass of this Embodiment. It is sectional drawing in the application | coating process of the sealing compound for comprising the double seal structure of this Embodiment. (A) It is a top view which shows an example of the positional relationship of the frit glass of this Embodiment, a sealing agent, and a sealing substrate. (B) It is a top view which shows an example of the positional relationship of the frit glass of this Embodiment, a sealing agent, and a sealing substrate. It is sectional drawing in an example of the dripping process of the filler of this Embodiment. (A) It is a top view which shows an example of the positional relationship of the frit glass of this Embodiment, a sealing agent, a filler, and a sealing substrate. (B) It is a top view which shows an example of the positional relationship of the frit glass of this Embodiment, a sealing agent, a filler, and a sealing substrate. It is sectional drawing in the sealing process of the organic EL element of this Embodiment. It is sectional drawing in the laser annealing process of this Embodiment.

  Below, the organic electroluminescent display apparatus of this invention and its manufacturing method are demonstrated in detail based on embodiment.

  The organic electroluminescence display device of the present embodiment (hereinafter referred to as an organic EL display device) is a display device including a light emitting region sealed using two substrates and frit glass, and is parallel to the substrate. The cut surface of the frit glass on the surface is a strip shape excluding a straight line.

  FIG. 2 is a cross-sectional view showing an example of the configuration of the organic EL display device 200 of the present embodiment. As shown in the figure, a substrate 210, an organic EL element 220, a passivation film 230, a frit glass 240, peripheral seals 250a and 250b, a sealing substrate 260, and a filling portion 270 are provided. In the present embodiment, a double seal structure is formed so as to surround the frit glass 240 with the peripheral seals 250a and 250b.

  The substrate 210 is a substrate having a flat main surface including a drive circuit (not shown) constituted by a TFT (Thin Film Transistor) that controls light emission of the organic light emitting element. In particular, in order to protect the organic EL element 220 from oxygen or moisture, a substrate having low oxygen permeability and moisture permeability is desirable. A color filter or the like may be formed on the sealing substrate 260.

  The substrate 210 and the sealing substrate 260 face each other, and for example, glass can be used as the substrate material. Note that the substrate 210 and the sealing substrate 260 may be plastic substrates, but in this case, it is preferable that heat resistance is ensured.

  The organic EL element 220 includes an anode and a cathode, and a light emitting layer made of an organic compound and emitting light according to a voltage applied between the anode and the cathode, and is formed between the substrate 210 and the sealing substrate 260. . The organic EL element 220 constitutes a display (light emitting region) that emits light by controlling the applied voltage for each pixel. The organic EL element 220 may be driven by either an active matrix method or a passive matrix method. Further, either a top emission structure or a bottom emission structure may be used.

  For example, a TFT array layer, an electrode layer, and a passivation film are sequentially stacked on the substrate 210, and the organic EL element 220 is formed thereon. The organic EL element 220 includes, for example, a planarizing film, a reflective electrode, a hole injection layer, a light emitting layer, an electron injection layer, and a transparent electrode.

  The TFT array layer is a layer in which thin film transistors (TFTs) for controlling light emission of the light emitting layer for each pixel by an active matrix method are formed in an array.

The electrode layer is a layer in which scanning lines, signal lines, and the like are formed.
The planarizing film is a layer that planarizes the upper surface of the electrode layer. For example, a silicon oxide film (SiO _x ) is formed by a CVD method or a sputtering method, and is planarized by a CMP (Chemical Mechanical Polishing) method or the like. Is formed.

  The reflective electrode (anode) contains a reflective metal and injects holes into the light emitting layer through the hole injection layer. Reflective metals include, for example, silver, aluminum, nickel, chromium, molybdenum, copper, iron, platinum, tungsten, lead, tin, antimony, strontium, titanium, manganese, indium, zinc, vanadium, tantalum, niobium, lanthanum, Any one of cerium, neodymium, samarium, europium, palladium, copper, nickel, cobalt, molybdenum, platinum, and silicon, an alloy of these metals, or a laminate of these metals can be used.

  The hole injection layer assists the generation of holes and injects holes into the light emitting layer. For example, the hole injection layer is made of polyaniline, polypyrrole, copper phthalocyanine (CuPc), or the like.

  The light emitting layer is a layer containing an organic material that emits light by carriers (electrons and holes) injected from the anode and the cathode. The light emitting layer is made of, for example, a low molecular light emitting material such as an aluminum-kylinol complex (Alq3), or a polymer light emitting material such as polythiophene or polyparaphenylene.

  The electron injection layer assists the generation of electrons and injects electrons into the light emitting layer. For example, the electron injection layer is a metal layer mainly composed of at least one of alkali metal and alkaline earth metal, and may contain two or more kinds of alkali metal and alkaline earth metal. This includes the case of containing both alkali metals and alkaline earth metals. The electron injecting layer is not particularly limited, but preferably lithium, rubidium, cesium, calcium, or barium can be used.

  The transparent electrode (cathode) injects electrons into the light emitting layer through the electron injection layer. Further, light from the light emitting layer is transmitted. For the transparent electrode, for example, indium tin oxide or indium zinc oxide is used.

  In the organic EL element 220, the layers are laminated on the substrate 210 in the order of the anode (reflecting electrode), the hole injection layer, the light emitting layer, the electron injection layer, and the cathode (transparent electrode). It may be.

  In addition, each layer with which the organic EL element 220 is provided is formed by methods, such as application | coating, such as a printing method, and vapor deposition. The details of the process of forming the organic EL element 220 on the substrate 210 are described in various documents such as Patent Document 3 and may be formed by any method.

  The passivation film 230 is a protective film that protects the organic EL element 220. For example, the passivation film 230 is made of a silicon nitride film (SiN) or a silicon oxynitride film (SiON), and is formed by plasma CVD (Chemical Vapor Deposition) or sputtering. The film thickness is, for example, 50 nm to 200 nm. Note that the passivation film 230 may not be formed depending on the material of the filling portion 270. As an example, in the case where the filling portion 270 is formed using a material that does not easily generate outgas that degrades the organic EL element 220, for example, the passivation film 230 may not be formed.

  The frit glass 240 is formed so as to surround the organic EL element 220, and has a function of sealing the organic EL element 220 together with the substrate 210 and the sealing substrate 260 by connecting the substrate 210 and the sealing substrate 260. It is glass and is an example of a sealing part. Thereby, oxygen and moisture from the outside can be prevented from reaching the organic EL element 220. In addition, the bottom surface of the frit glass 240 (the adhesive surface to the substrate 210 and the adhesive surface to the sealing substrate 260) is preferably flat. The reason for this is that the substrate and the frit glass are securely bonded to make it difficult for moisture and the like to enter the organic EL element, and the bonding strength of the substrate is ensured.

  Moreover, it is preferable that the cross section of the frit glass 240 in the cut surface perpendicular | vertical to the surface where the board | substrate 210 and the sealing substrate 260 oppose is trapezoid as shown in FIG. The reason for this is also described in FIG. 12, for example. When frit glass is melted by laser irradiation and the substrate is bonded, at least one bottom surface of the frit glass is made larger than the area of the other bottom surface. This is because the irradiation can be easily performed, and the effect of containing the outgas can be more easily exhibited by ensuring a space as large as possible between the frit glass and the peripheral seal.

  The width of the frit glass 240 is determined by the width of the frit glass paste applied on the sealing substrate 260 at the time of formation, and can be about 100 μm to 2 mm. The height of the frit glass 240 can be about 5 μm to 50 μm.

  The shape of the frit glass 240 in the planar direction (the surface direction of the substrate 210) will be described later with reference to FIGS.

  The peripheral seal 250 a is formed so as to surround the frit glass 240, and connects the substrate 210 and the sealing substrate 260, thereby forming a sealed space together with the frit glass 240, the substrate 210, and the sealing substrate 260. It is an example. The air pressure in the space sealed by the peripheral seal 250a, the frit glass 240, the substrate 210, and the sealing substrate 260 is lower than atmospheric pressure, and is preferably a vacuum (for example, 10 Pa or less).

  The width of the peripheral seal 250a is determined by the width of the sealing agent (adhesive) applied on the sealing substrate 260 at the time of formation, and can be about 500 μm to 3 mm. The height of the peripheral seal 250a is almost the same as that of the frit glass 240. The peripheral seal 250a is an ultraviolet (hereinafter referred to as UV) curable or thermosetting adhesive, and for example, an adhesive such as an epoxy resin or an acrylic resin can be used.

  The peripheral seal 250b is formed so as to surround the organic EL element 220 and between the frit glass 240 and the organic EL element 220. By connecting the substrate 210 and the sealing substrate 260, the frit glass 240 and the substrate A sealed space is formed together with 210 and the sealing substrate 260. The air pressure in the space sealed by the peripheral seal 250b, the frit glass 240, the substrate 210, and the sealing substrate 260 is lower than atmospheric pressure, and is preferably a vacuum (for example, 10 Pa or less).

  The width of the peripheral seal 250b is determined by the width of the sealant (adhesive) applied on the sealing substrate 260 at the time of formation, and can be about 500 μm to 3 mm. The height of the peripheral seal 250b is almost the same as that of the frit glass 240. The peripheral seal 250b is a UV curable or thermosetting adhesive, and for example, an adhesive such as an epoxy resin or an acrylic resin can be used. The peripheral seals 250a and 250b are preferably made of the same material.

The sealing substrate 260 has a flat main surface and is optically transparent, but a color filter or the like may be formed as necessary. In particular, in order to protect the organic EL element 220 from oxygen or moisture, a substrate having low oxygen permeability and moisture permeability is desirable. For example, it is desirable that the oxygen permeability per day is 10 ⁻³ cc / m ² or less and the moisture permeability is 10 ⁻⁶ g / m ² or less. As an example, here, the sealing substrate 260 is a glass substrate made of an alkali-free glass that satisfies the transmittance condition and has a high melting point. The sealing substrate 260 may be a plastic substrate or the like. In this case, it is preferable that heat resistance is ensured.

  The filling unit 270 fills a region sealed by the substrate 210, the sealing substrate 260, and the peripheral seal 250b, that is, a region where the organic EL element 220 is formed with a filler. The refractive index of the filling portion 270 is desirably not less than the sealing substrate 260 and not more than the passivation film 230. Thereby, reflection of light at the interface between the filling portion 270 and the sealing substrate 260 can be prevented, and the light extraction efficiency from the organic EL element 220 can be increased. For example, when the refractive index of the sealing substrate 260 (glass substrate) is 1.5 and the refractive index of the passivation film 230 (SiN) is 1.9, the refractive index of the filling portion 270 is 1.6. Can do.

  Moreover, the filler used for the filling part 270 is a UV curable or thermosetting adhesive, for example, an epoxy resin or an acrylic resin. In order to simplify the manufacturing process, the filler is preferably cured by the same means as the sealant used for forming the peripheral seals 250a and 250b.

  As described above, in the organic EL display device 200 of the present embodiment, the organic EL element 220 is sealed with the frit glass 240 and the peripheral seals 250a and 250b constituting the double seal structure. Furthermore, since the space between the frit glass 240 and the peripheral seal 250a and the peripheral seal 250b is in a vacuum state, even if a defect such as a crack occurs in the frit glass 240, impurities are confined in the vacuum space. Therefore, deterioration of the organic EL element 220 can be prevented. That is, the lifetime of the organic EL display device 200 of the present embodiment can be extended.

  FIGS. 3A and 3B are plan views showing the positional relationship between the frit glass 240 and the sealing substrate 260 of the present embodiment.

  As shown in FIG. 3A and FIG. 3B, the cut surface of the frit glass 240 in the plane parallel to the sealing substrate 260 is a line having a predetermined value or more formed along the periphery of the rectangular region. It is a width band shape. Specifically, in the section corresponding to one side of the rectangular region, the cut surface of the frit glass 240 has a band shape excluding a straight line. More specifically, among the cut surfaces of the frit glass 240, the area of the cut surface of the section corresponding to one side of the rectangular region is the cut surface when the section is formed by a straight line having a predetermined line width. Greater than area. For example, as shown in FIG. 3A, the shape of the cut surface of the frit glass 240 is a wavy shape with a predetermined width.

  Here, the organic EL element 220 is formed on the rectangular region. For example, when a plurality of pixels constituting the organic EL element 220 are arranged in a matrix, that is, when the organic EL element 220 is a rectangle, the side of the rectangular area is one of a row and a column of the plurality of pixels. Parallel to the direction.

  As described above, by making the cut surface of the frit glass 240 larger than the straight cut surface in a predetermined section, that is, by changing the shape of the cut surface of the frit glass 240 to a shape different from the straight line, Can be dispersed. Thereby, it can prevent that the frit glass 240 will be destroyed by stress.

  Further, when attention is paid to the adhesion surface between the frit glass 240 and the sealing substrate 260 or the substrate 210, the area of the adhesion surface is larger than the area of the linear adhesion surface. The separation from the sealing substrate 260 or the substrate 210 can be prevented.

  The shape of the cut surface of the frit glass 240 may be any shape as long as it is not a linear shape. FIG. 4A to FIG. 4H are diagrams showing an example of the shape of the cut surface of the frit glass 240 of the present embodiment. As shown in these drawings, the cut surface of the frit glass 240 has a shape in which a predetermined shape that is not a straight line is periodically repeated along the frit glass 240.

  For example, as shown in FIGS. 4A to 4F, the shape of the cut surface is a wavy line shape having a line width equal to or larger than a predetermined value. Examples of the wavy line shape include a sine wave (see FIGS. 4A and 4C), a square wave (see FIG. 4D), a triangular wave (see FIG. 4E), or a sawtooth wave (see FIG. 4). 4 (f)). The wavy line width may not be uniform. For example, as shown in FIG. 4B, the wavy line width may be periodically repeated between the minimum value and the maximum value along the wavy line shape.

  Moreover, as shown in FIG.4 (g), the shape which has the convex part periodically repeated on both sides of the linear shape which has a line | wire width more than a predetermined value may be sufficient. In addition, the convex part should just be on the at least one side of a linear shape. In addition, in FIG. 4G, the shape of the convex portion is a rectangle, but it may be a polygonal shape such as a triangle or a shape surrounded by a curve such as a semicircle.

  Moreover, as shown in FIG.4 (h), the shape of an adhesion surface may be chain | strand shape. FIG. 4 (h) shows a chain shape combining two triangular waves having a predetermined line width, but a chain shape combining other waveforms such as a sine wave may be used. .

  4A and 4C to 4H show an example in which the line width is constant, the line width may not be constant. As an example, the triangular wave shown in FIG. 4 (e) may be formed in a wavy shape as shown in FIG. 4 (b).

  When a plurality of organic EL elements 220 (organic EL display) are formed on one sealing substrate 260, a plurality of frit glasses 240 are formed as shown in FIG.

  Then, the outline | summary of the manufacturing process of the organic electroluminescent display apparatus 200 of this Embodiment is demonstrated using FIG. FIG. 5 is a perspective view and a cross-sectional view showing an example of the manufacturing process of the organic EL display device 200 of the present embodiment.

In the organic EL display device 200 according to the present embodiment, the sealing substrate 260 is cut out (FIG. 5A), the frit glass 240 is formed (FIG. 5B), the sealing agents 251a and 251b are applied, and the filler 271 is formed. (Fig. 5 (c)), bonding of substrates in a vacuum (Fig. 5 (d)), bonding of substrates by atmospheric pressure pressing (Fig. 5 (e)), UV or thermal curing (Fig. 5 ( f)), sealing by laser annealing (FIG. 5 (g)), and various inspections (FIG. 5 (h)) in order. The above treatment is performed in a nitrogen (N ₂ ) atmosphere. In addition, you may perform in other atmosphere which does not affect the organic EL element 220 not only in nitrogen atmosphere, ie, does not contain oxygen and moisture.

  Below, the detail of the manufacturing process of the organic electroluminescence display 200 of this Embodiment is demonstrated.

  First, as shown in FIG. 5A, a sealing substrate 260 is prepared. Here, as an example, an alkali-free glass substrate with dimensions of 370 mm × 470 mm × 0.7 mm was used as the sealing substrate 260. The dimensions are not limited to this.

  Next, as shown in FIG. 5B, frit glass 240 is formed on the sealing substrate 260. The frit glass 240 is formed in the order of printing, drying and pre-baking. Here, FIG. 5 is a cross-sectional view showing an example of a process for forming the frit glass 240 of the present embodiment. The cross-sectional view shown in FIG. 5 is a cross-sectional view taken along the BB direction shown in FIG.

  First, a frit glass paste 241 is applied on the sealing substrate 260 (see FIG. 6A). For example, the frit glass paste 241 is applied on the sealing substrate 260 using a dispenser, a screen printing apparatus, a die coating apparatus, or the like. At this time, as shown in FIG. 3A, the frit glass paste 241 is applied on the sealing substrate 260 so as to form a rectangular region in which the organic EL element 220 is formed. Further, the frit glass paste 241 is applied by a dispenser or the like so as to have a shape other than a linear shape as shown in FIGS. 4 (a) to 4 (h).

  Specifically, the frit glass paste 241 having a desired shape is applied by controlling the movement of the tip nozzle of the dispenser that discharges the frit glass paste 241 in the planar direction. Further, the line width of the frit glass paste 241 may be changed by changing the discharge amount of the frit glass paste 241. Thus, by setting the shape of the frit glass paste 241 in the planar direction to a desired shape that is not a linear shape, the frit glass 240 having a desired shape can be formed after firing.

  The frit glass paste 241 applied on the sealing substrate 260 has, for example, a width of 100 μm to 2 mm and a height of 5 μm to 50 μm. Note that since the height of the frit glass 240 is a gap between the substrate 210 and the sealing substrate 260, the height of the frit glass paste 241 needs to be at least equal to or higher than the height of the frit glass 240. Here, as an example, the height of the frit glass 240 is 20 μm, the height of the frit glass paste 241 is 30 μm, and the width is 1 mm.

  The frit glass paste 241 is a paste containing a frit, a binder, and a solvent. For example, the melting points of the frit, binder and solvent are approximately 400 ° C., 250 ° C. and 120 ° C., respectively.

For example, the frit includes, in addition to components that form a glass skeleton such as silicon oxide (SiO ₂ ), zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), tin oxide (SnO), bismuth oxide (Bi ₂ ). O ₃ ), vanadium oxide (V ₂ O ₃ ), aluminum oxide (Al ₂ O ₃ ), tungsten oxide (WO ₃ ), molybdenum oxide (MoO ₃ ), niobium oxide (Nb ₂ O ₃ ), titanium oxide (TiO ₂₎ ), Zirconium oxide (ZrO ₂ ), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), potassium oxide (K ₂ O), cesium oxide (Cs ₂ O), copper oxide (CuO), manganese dioxide ( It contains components such as MnO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO). In order to absorb infrared light, the frit desirably contains at least one kind of transition metal. In order to prevent damage to the organic EL element 220, the frit is alkali-free.

  The binder is a material for adjusting the viscosity of the frit glass paste 241. For example, an acrylic resin using cellulose such as nitrocellulose or ethylcellulose, methyl methacrylate, propyl methacrylate, or butyl methacrylate as a raw material monomer is used. In this embodiment, nitrocellulose having a low decomposition temperature by baking is used.

  As the solvent, terpionol, butyl carbitol, isobornyl acetate, butyl carbitol acetate, cyclohexane, methyl ethyl ketone, toluene, xylene, ethyl acetate, butyl stearate, or the like may be used.

  Next, the frit glass paste 241 is molded by a mechanical press using the mold 300 (see FIG. 6B) (see FIG. 6C). Specifically, the upper surface of the frit glass 240 is flattened by flattening the upper surface of the frit glass paste 241. In the mold 300, a digging 301 is formed in a region where the frit glass 240 is to be formed (that is, a region where the frit glass paste 241 is applied), and the height of the digging 301 is the height of the frit glass 240. (Here, 20 μm).

  Further, the coating layer 302 is exposed on the bottom surface of the digging 301. The coating layer 302 has water repellency so as to prevent the frit glass paste 241 from adhering to the mold 300. For example, fluorine polyimide resin.

  Finally, the shaped frit glass paste 241 is heated at a crystallization temperature of the frit glass (for example, about 400 ° C.) (preliminary baking treatment), thereby forming a trapezoidal frit glass 240 (FIG. 6D). )reference). The frit glass 240 has a trapezoidal shape because the frit glass paste 241 is crushed by a mechanical press as shown in FIGS. 6B and 6C and does not necessarily have a trapezoidal shape. . However, since the upper surface of the frit glass 240 is bonded to the substrate 210, it needs to be flat.

  As described above, the frit glass 240 is formed in a predetermined region on the sealing substrate 260 (FIG. 5B).

  The position where the frit glass 240 is formed is determined by the size and position of the organic EL element 220 formed in the region surrounded by the frit glass 240 and the size and position of the peripheral seals 250a and 250b. That is, the position of the frit glass 240 is determined so that the peripheral seal 250 a can be formed at least outside the frit glass 240 and the peripheral seal 250 b and the organic EL element 220 can be formed inside the frit glass 240.

  Subsequently, as shown in FIG. 5C, a sealing agent 251 a is applied on the outer side of the frit glass 240 and a sealing agent 251 b is applied on the inner side of the frit glass 240 on the sealing substrate 260. At this time, the sealing agents 251a and 251b are applied separately from the frit glass 240 to form a vacuum space. Here, FIG. 7 is a cross-sectional view in the application process of the sealing agents 251a and 251b for constituting the double seal structure of the present embodiment. The cross-sectional view shown in FIG. 7 is a cross-sectional view when cut in the BB direction shown in FIG.

  As shown in FIG. 7, sealants 251 a and 251 b are applied onto the sealing substrate 260 using a dispenser or a screen printing apparatus. The sealing agents 251a and 251b are UV curable or thermosetting adhesives, and are, for example, epoxy resins or acrylic resins. The viscosity of the sealing agents 251a and 251b is 100,000 mPa · s to 1,000,000 mPa · s. The height of the sealing agents 251a and 251b is at least equal to or higher than the height of the frit glass 240, and the width is 100 μm to 300 μm. In this embodiment, as an example, a UV curable epoxy resin having a viscosity of 500,000 mPa · s, a height of 50 nm, and a width of 200 μm is used as the sealing agents 251a and 251b, and a dispenser is used in a predetermined region on the sealing substrate 260. Apply.

  8A and 8B are plan views showing an example of the positional relationship among the frit glass 240, the sealing agents 251a and 251b, and the sealing substrate 260 of the present embodiment. When a plurality of organic EL elements 220 (organic EL display) are formed on one sealing substrate 260, a plurality of sealing agents 251a and 251b are applied as shown in FIG. 8B.

  A vacuum space is formed between the frit glass 240 and the sealing agents 251a and 251b shown in the figure, and the organic EL element 220 is formed inside the sealing agent 251b.

  Further, as illustrated in FIG. 5C, a filler 271 is dropped on a region surrounded by the sealing agent 251 b on the sealing substrate 260. Here, FIG. 9 is a cross-sectional view in the dropping step of the filler 271 of the present embodiment. The cross-sectional view shown in FIG. 9 is a cross-sectional view when cut in the BB direction shown in FIG.

  As shown in FIG. 9, the filler 271 is dropped on the sealing substrate 260 by using a jet dispenser or the like (ODF (One Drop Filling) method). The filler 271 is a UV curable or thermosetting adhesive, and is, for example, an epoxy resin or an acrylic resin. Note that the filler 271 is desirably the same property and the same material as the sealing agents 251a and 251b.

  The viscosity of the filler 271 is 100 mPa · s to 500 mPa · s. The drop amount per drop is 0.2 μL to 2.0 μL. The number of drops is calculated by the total resin drop amount / drop amount per drop. The total resin dripping amount is calculated from the gap between the substrate 210 and the sealing substrate 260, the area of the region surrounded by the sealing agent 251b, and the volume occupied by the organic EL element 220. Specifically, it is calculated by (Equation 1) shown below.

(Formula 1)
(Total resin dripping amount) = (Gap between substrates) × (Area of region surrounded by sealing agent 251b) − (Volume occupied by organic EL element 220)

  In this embodiment, as an example, a UV curable epoxy resin having a viscosity of 200 mPa · s is dropped as a filler 271 at a drop amount of 1.0 μL per drop and a drop interval of 7 mm.

  10A and 10B are plan views showing an example of the positional relationship among the frit glass 240, the sealing agents 251a and 251b, the filler 271 and the sealing substrate 260 of the present embodiment. As shown in FIG. 10A, a filler 271 is dropped into a region surrounded by the sealing agent 251a on the sealing substrate 260. Further, when a plurality of organic EL elements 220 (organic EL display) are formed on one sealing substrate 260, the filler 271 is surrounded by a plurality of sealing agents 251a as shown in FIG. Drip into the area.

  Next, as shown in FIGS. 5D to 5F, the organic EL element 220 is sealed by bonding the substrate 210 and the sealing substrate 260 together. Here, FIG. 11 is a cross-sectional view showing a sealing process of the organic EL element 220 of the present embodiment. FIG. 11 is a cross-sectional view taken along the BB direction shown in FIGS. 5 (d) to 5 (f).

  As shown in FIG. 11A, the organic EL element 220 is formed on the substrate 210, and the alignment between the substrate 210 on which the organic EL element 220 is formed and the sealing substrate 260 is in a vacuum (for example, 10 Pa or less). To do. At this time, alignment marks can be accurately performed by previously forming alignment marks on both the substrate 210 and the sealing substrate 260. Note that the substrate 210 used at this time preferably has the same dimensions as the sealing substrate 260.

  Note that details of the process of forming the organic EL element 220 on the substrate 210 are described in various documents such as Patent Document 3 and the like, and thus the description thereof is omitted here. Further, vacuuming may be performed after the alignment is completed.

  Next, as shown in FIG. 11B, the substrate 210 and the sealing substrate 260 are bonded to such an extent that the sealing agents 251a and 251b are crushed. This adhesion is performed by, for example, a mechanical press. When the sealing agents 251a and 251b are crushed, the substrate 210, the sealing substrate 260, the sealing agent 251a, and the sealing agent 251b form a closed space (closed loop). The frit glass 240 is sealed in the formed closed space.

  Subsequently, as shown in FIG. 11 (c), the substrate 210 and the sealing substrate 260 are further brought into close contact with each other by introducing nitrogen and returning from vacuum to atmospheric pressure, that is, by releasing to the atmosphere. Specifically, the upper surface of the frit glass 240 and the substrate 210 are bonded by atmospheric pressure. Since a vacuum space is formed between the substrate 210 and the sealing substrate 260, a uniform force (differential pressure between atmospheric pressure and vacuum) is applied from the upper part of the substrate 210 and the lower part of the sealing substrate 260.

  At this time, the gap between the two substrates is determined by the height of the frit glass. That is, in the example of the present embodiment, it is 30 μm.

  Thus, while it is difficult to apply a uniform force with a mechanical press, an equal pressure can be easily and reliably applied with an atmospheric pressure press. Therefore, a decrease in yield can be prevented and high productivity can be maintained.

  Note that the filler 271 is adjusted at the time of dropping so as to fill the region surrounded by the sealing agent 251b, the substrate 210, and the sealing substrate 260 without any gap (see (Expression 1)). When the amount of the filler 271 is too small, a vacuum space is created in the space where the organic EL element 220 is formed. Therefore, the sealing substrate 260 may be deformed or damaged when released to the atmosphere. On the other hand, when the amount of the filler 271 is too large, the sealing agent 251b may be destroyed.

Finally, as shown in FIG. 11 (d), the peripheral seals 250a and 250b are cured by irradiating the entire surface from the sealing substrate 260 side with UV to cure the sealants 251a and 251b and the filler 271. The filling portion 270 is formed. Here, as an example, UV with an intensity of ² J / cm ² is irradiated.

  Thus, in order to form the peripheral seals 250a and 250b and the filling portion 270 in one process, it is desirable that the sealants 251a and 251b and the filler 271 are made of the same material.

  In this embodiment mode, UV is radiated because the UV curable epoxy resin is used for the sealing agents 251a and 251b and the filler 271. However, when a thermosetting resin is used, heat treatment is performed. This is done to cure the resin.

  Next, as shown in FIG. 5G, the frit glass 240 and the substrate 210 are sealed by irradiating the frit glass 240 with laser (laser annealing). Here, FIG. 12 is a cross-sectional view in the laser annealing step of the present embodiment. FIG. 12 is a cross-sectional view taken along the BB direction shown in FIG.

  As shown in the figure, the laser is irradiated from the sealing substrate 260 side toward the frit glass 240. Thereby, the glass of the bonding portion between the frit glass 240 and the substrate 210 is melted, and the bonding strength can be further increased.

  When irradiation is performed from the substrate 210 side, since wiring layers such as scanning lines and signal lines are formed on the substrate 210, there are places where the frit glass 240 is not irradiated with laser because of the obstacles. Therefore, it is desirable to irradiate a laser from the sealing substrate 260 side.

  The wavelength of the laser beam used at this time is a wavelength that is absorbed by the frit glass 240 and is a wavelength that is not absorbed by the peripheral seals 250a and 250b, the filling portion 270, the passivation film 230, and the like. Therefore, it is necessary to select the frit glass paste 241 and the materials for the sealing agents 251a and 251b, the filler 271 and the passivation film 230 so that the wavelengths to be absorbed are different.

  From the viewpoint of minimizing the influence of the damage of the electrode wiring, the thermal damage to the organic EL element 220, the deterioration of the filling portion 270 and the peripheral seals 250a and 250b, the output of the laser beam is frit glass. It is desirable to make it as low as possible for melting. Note that in this embodiment mode, a semiconductor laser is used to irradiate a laser beam having a wavelength of about 900 nm and an output of 30 W.

  Finally, as shown in FIG. 5 (h), the manufactured organic EL display device 200 is subjected to various tests such as film thickness measurement, appearance inspection, chromatic aberration (CA) test, and the like. The EL display device 200 is completed.

  As described above, in the organic EL display device 200 of the present embodiment, the shape of the cut surface of the frit glass 240 that bonds the substrate 210 and the sealing substrate 260 is different from the linear shape. That is, the shape when the frit glass 240 is viewed from the sealing substrate 260 side (or the substrate 210 side) is not a shape along the periphery of the rectangular region. Specifically, the shape is such that the cross-sectional area is larger than the case where it is formed in a linear shape.

  Thereby, since the stress which generate | occur | produces inside the frit glass 240 can be disperse | distributed, it can prevent that the frit glass 240 is destroyed by stress. In addition, since the bonding area is large, the bonding strength between the frit glass 240 and the substrate can be increased.

  The organic EL display device 200 of the present embodiment is manufactured by forming the frit glass 240 and the sealing agents 251a and 251b apart from each other, and bonding the substrate 210 and the sealing substrate 260 together in a vacuum. The Thus, a sealed space is formed by the frit glass 240, the sealing agent 251a or 251b, the substrate 210, and the sealing substrate 260.

  Accordingly, since the formed space is a vacuum, the frit glass 240 is always in close contact with the substrate 210 and the sealing substrate 260 because the atmospheric pressure is applied. Therefore, the frit glass 240 and the substrate 210 can be securely bonded by melting and curing the bonding surface between the frit glass 240 and the substrate 210 by laser annealing.

  Conventionally, in a portion melted by the laser annealing treatment, the substrate sinks and local residual strain is likely to occur. For this reason, peeling of the frit glass 240 from the substrate, cracking of the frit glass 240, and the like have occurred.

  On the other hand, in the organic EL display device 200 of the present embodiment, since the peripheral seals 250a and 250b are formed on both sides of the frit glass 240, the substrate is formed not only by the frit glass 240 but also by the peripheral seals 250a and 250b. A gap between 210 and the sealing substrate 260 can be maintained. Therefore, the subsidence of the substrate hardly occurs, and the occurrence of residual distortion can be reduced.

  Further, in the organic EL display device 200 of the present embodiment, the space between the frit glass 240 and the peripheral seals 250a and 250b is a vacuum, so that heat during the laser annealing process is not easily transmitted to the peripheral seals 250a and 250b. Therefore, unlike the conventional case, the heat during the laser annealing process is transmitted to the resin such as the sealant through the gas in the space, and the resin is not deteriorated, and the organic EL display device 200 of the present embodiment is long. Life can be extended.

  Further, as described above, the frit glass paste 241 contains a binder and a solvent, and laser annealing may be performed while containing the binder and the solvent that have not been evaporated or sublimated during the drying process. In this case, there is a problem that outgas that adversely affects the organic EL element 220 is generated.

  On the other hand, since the organic EL display device 200 of the present embodiment has a vacuum space between the frit glass 240 and the organic EL element 220, the generated outgas can be confined. Thereby, deterioration of the organic EL element 220 can be prevented.

Further, in order to lower the melting temperature of the frit glass 240, phosphoric acid (P ₂ O ₅ ), which is a low melting point material, is often mixed with the frit glass paste 241. However, since phosphoric acid easily hydrates when exposed to the atmosphere, frit glass containing phosphoric acid has low reliability in terms of strength and the like.

  On the other hand, in the organic EL display device 200 of the present embodiment, the frit glass 240 is formed in a vacuum, so that the possibility of hydration is low. Therefore, since a large amount of phosphoric acid can be contained in the frit glass 240, the melting temperature of the frit glass 240 can be further lowered. As a result, the intensity of the laser beam in the laser annealing treatment can be suppressed, so that damage to the electrode wiring and the like due to heat can be prevented, the organic EL element 220 and the filling portion 270 can be prevented from being deteriorated, and residual strain of the glass substrate can be reduced. Can be achieved.

  As mentioned above, although the organic electroluminescent display apparatus and its manufacturing method of this invention were demonstrated based on embodiment, this invention is not limited to these embodiment. Unless it deviates from the meaning of this invention, what made the various deformation | transformation which those skilled in the art can consider to the said embodiment is also contained in the scope of the present invention.

  For example, the organic EL display device 200 according to the present embodiment includes the peripheral seals 250a and 250b on both sides of the frit glass 240 to enhance the sealing effect of the organic EL element 220. It may be configured to include only one of them. Even in this case, since the vacuum space is formed, adhesion between the frit glass 240 and the substrate 210 and the sealing substrate 260 is ensured.

  However, it is desirable to form a vacuum space by forming a peripheral seal between the frit glass 240 and the organic EL element 220. That is, it is desirable that the organic EL display device 200 includes the peripheral seal 250b. According to this configuration, the outgas that can be generated from the frit glass 240 when performing the laser annealing treatment can be confined in the vacuum space. It is also possible to prevent the heat during the laser annealing process from being transmitted to the filling portion 270. Note that a space depressurized from the atmospheric pressure may be formed instead of the vacuum space.

  Further, the organic EL display device 200 of the present embodiment may include a porous frit glass instead of the frit glass 240. Water molecules and the like are confined in the pores of the porous frit glass, that is, the porous frit glass can adsorb moisture, so that a higher sealing effect can be obtained.

  In order to form a porous frit glass, first, particles that are soluble in an acid such as aluminum (Al) are mixed in the frit glass paste as a material. Then, after preliminary firing (see FIG. 6D), the porous frit glass is formed by melting aluminum appearing on the surface of the frit glass using an acid or the like.

  Further, the organic EL display device 200 of the present embodiment may not include the filling unit 270. In this case, it is desirable to provide a bank that supports the substrate 210 and the sealing substrate 260 instead of the filling portion 270. This is because the space in which the organic EL element 220 is formed becomes a vacuum. Specifically, since force is applied to the substrate 210 and the sealing substrate 260 from the outside due to atmospheric pressure, the flatness of the substrate cannot be maintained, or there is a possibility that the substrate 210 and the sealing substrate 260 may be cracked and broken. In order to prevent these problems, the organic EL display device 200 desirably includes a bank having the same height as the frit glass 240.

  The bank is a barrier that is used in an application process of an organic material when forming the organic EL element 220 and forms a region for accurately applying the organic material to a desired position. The bank is formed for each pixel or for each line including a plurality of pixels. For example, the bank is an acrylic resin.

  In addition, the organic EL display device 200 according to the present embodiment has been described with respect to the case where the organic EL element 220 includes a plurality of pixels arranged in a matrix, that is, the case where the organic EL element 220 is rectangular. The element 220 may have other shapes such as a circle. For example, in this case, the shape when the frit glass 240 is viewed from the sealing substrate 260 side (or from the substrate 210 side) may not be rectangular. For example, the cut surface in the surface direction of the frit glass 240 may be an annular shape. The annular shape corresponds to a case where the section corresponding to each side of the rectangular area is an arc shape.

  Thus, the shape of the cut surface in the surface direction of the frit glass 240 may be any shape as long as it is not a straight line. That is, the shape of the cut surface of the frit glass 240 may be any shape as long as the shape is not along the rectangular region.

  According to the organic electroluminescence display device of the present invention, the organic electroluminescence element is sufficiently sealed to achieve a long life, and can be used for displays such as digital televisions and digital cameras. it can.

100, 200 Organic EL display device 110, 120 Glass substrate 130, 220 Organic EL element 140, 240 Frit glass 210 Substrate 230 Passivation film 241 Frit glass paste 250a, 250b Peripheral seal 251a, 251b Sealant 260 Sealing substrate 270 Filling portion 271 Filler 300 Mold 301 Dimming 302 Coating layer

Claims (10)

A first substrate and a second substrate facing each other;
An organic light emitting element having an anode and a cathode, and an organic light emitting layer that emits light according to a voltage applied between the anode and the cathode, and formed between the first substrate and the second substrate;
A light emitting region having the organic light emitting element;
A sealing portion that is formed so as to surround the light emitting region, and seals the light emitting region together with the first substrate and the second substrate by connecting the first substrate and the second substrate;
The cut surface of the sealing portion in a plane parallel to the first substrate has a band shape along the periphery of the rectangular region where the light emitting region is formed,
The cut surface of the section corresponding to one side of the rectangular region among the cut surfaces is a band shape excluding a straight line. The organic electroluminescence display device. The cut surface of the sealing portion is a band shape having a line width equal to or greater than the first value,
Of the cut surface of the sealing portion, the area of the cut surface of the section corresponding to one side of the rectangular region is more than the area of the cut surface when the section is formed by a straight line having the line width of the first value. The organic electroluminescence display device according to claim 1. The organic electroluminescence display device according to claim 2, wherein the cut surface of the sealing portion is a shape in which a predetermined shape that is not a straight line is periodically repeated along the sealing portion. The organic electroluminescence display device according to claim 3, wherein a cut surface of the sealing portion has a wavy shape with a line width equal to or greater than the first value. The organic electroluminescence display device according to claim 4, wherein the wavy line shape includes a sine wave, a triangular wave, a square wave, or a sawtooth wave. The organic electroluminescence display device according to claim 5, wherein the line width of the wavy line shape periodically repeats between the first value and a second value larger than the first value along the wavy line shape. . 4. The organic electroluminescence display device according to claim 3, wherein the cut surface of the sealing portion has a convex portion that is periodically repeated on at least one side of a band shape having a line width equal to or greater than the first value. The organic electroluminescence display device according to claim 3, wherein a cut surface of the sealing portion is in a chain shape. The organic electroluminescence display device further includes:
Formed so as to surround the light emitting region, and the first substrate and the second substrate are connected to form a sealed first space together with the sealing portion, the first substrate, and the second substrate. A first adhesive part
The organic electroluminescence display device according to claim 1, wherein the atmospheric pressure in the first space is lower than atmospheric pressure. A sealing portion for sealing a light emitting region having an organic light emitting element having an anode and a cathode and an organic light emitting layer that emits light according to a voltage applied between the anode and the cathode is provided on the first substrate. A sealing part forming step to be formed;
The light emitting region is surrounded by the sealing portion in the first substrate and the second substrate on which the organic light emitting element is formed at a pressure lower than atmospheric pressure, and the first substrate and the second substrate An adhesive step of adhering to be formed between and
The cut surface of the sealing portion in a plane parallel to the first substrate has a band shape along the periphery of the rectangular region where the light emitting region is formed,
Of the cut surfaces, a cut surface in a section corresponding to one side of the rectangular region has a strip shape excluding a straight line.

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