JP2011023140A - Lighting tool for vehicle - Google Patents

Abstract

It is important to securely and securely hold an attachment (power supply member) that supplies power to an LED (semiconductor light source) without rattling due to impact or vibration of a vehicle.
In the present invention, a rectangular opening 56 is provided at a location where a central portion of a semiconductor light source 10 and a power feeding member 40 is located in a central portion of a fixing member 50. On the four sides around the opening 56 of the fixing member 50, pressing portions 52 that press the peripheral portion of the power supply member 40 against the heat sink member 20 are provided. As a result, according to the present invention, the power supply member 40 that supplies power to the semiconductor-type light source 10 can be reliably and securely held and fixed without rattling due to the impact or vibration of the vehicle.
[Selection] Figure 1

Description

  The present invention relates to a vehicular lamp that uses a semiconductor-type light source such as an LED as a light source. In particular, the present invention relates to a vehicular lamp provided with an optical axis adjusting device.

  This type of vehicular lamp is conventionally known (for example, Patent Document 1). Hereinafter, this conventional vehicle lamp will be described. A conventional vehicular lamp is configured such that an LED is attached to an attachment so that power can be supplied, and the attachment is fixed to a fixing portion of a metal lamp via a spring plate. When the LED is turned on and emitted, light from the LED is irradiated in a predetermined direction with a predetermined light distribution pattern.

  In the conventional vehicular lamp described above, it is important to securely and firmly hold the attachment for supplying power to the LED without rattling due to the impact or vibration of the vehicle.

JP 2006-302714 A

  The problem to be solved by the present invention is that, in a vehicular lamp, an attachment (feeding member) that feeds power to an LED (semiconductor light source) is securely and securely held and fixed without shaking due to impact or vibration of the vehicle. Is that it is important.

  This invention (invention according to claim 1) is a heat sink member, a semiconductor light source set on the heat sink member, temporarily fixed to the heat sink member, temporarily fixing the semiconductor light source to the heat sink member, and A power supply member that supplies power to the semiconductor light source; and a fixing member that is fixed to the heat sink member and holds and fixes the semiconductor light source and the power supply member to the heat sink member. A rectangular opening is provided at a location where the central portion of the member is located, and pressing portions that press the peripheral edge of the power supply member against the heat sink member are provided on the four sides around the opening of the fixing member. It is characterized by that.

  Further, according to the present invention (the invention according to claim 2), a spring having a curved shape (arch shape) in which two opposing pressing portions of one of the four pressing portions elastically contact the peripheral edge portion of the power supply member. And the other two pressing parts opposite to each other among the four pressing parts are formed of plate-shaped stoppers that abut against the peripheral edge of the power supply member.

  Further, according to the present invention (the invention according to claim 3), the heat sink member and the fixing member are provided with locking protrusions and locking holes for detachably mounting and fixing the fixing member to the heat sink member by locking each other. It is provided, It is characterized by the above-mentioned.

  In the vehicular lamp according to the present invention (the invention according to claim 1), the four pressing portions respectively provided on the four sides around the rectangular opening of the fixing member press the peripheral portion of the power feeding member against the heat sink member. Therefore, four locations corresponding to the four sides around the rectangular opening of the fixing member in the peripheral portion of the power supply member are pressed against the heat sink member. As a result, the vehicular lamp of the present invention (the invention according to claim 1) can securely and securely hold and fix the power supply member to the heat sink member without rattling due to impact or vibration of the vehicle. In other words, the power supply member does not rattle against the heat sink member due to impact or vibration of the vehicle.

  In addition, the vehicular lamp according to the present invention (the invention according to claim 1) can securely and securely hold and fix the semiconductor-type light source to the heat sink member through the power supply member without shaking due to the impact or vibration of the vehicle. Therefore, the power supply member and the semiconductor-type light source can be securely and securely held and fixed without being rattled by the impact or vibration of the vehicle. As a result, in the vehicular lamp of the present invention (the invention according to claim 1), since the electrical connection between the power supply member and the semiconductor-type light source is surely and firmly established, power is reliably supplied from the power-supply member to the semiconductor-type light source. Thus, non-lighting and chattering of the semiconductor light source can be prevented.

  In addition, in the vehicular lamp of the present invention (the invention according to claim 1), the periphery of the square opening at the center of the fixing member is connected by the four pressing portions. The strength and dimensional accuracy are improved as compared with the fixing member lacking the pressing portion on one side. As a result, the vehicular lamp according to the present invention (the invention according to claim 1) is improved in assemblability and quality by improvement in strength and dimensional accuracy.

  Further, the vehicle lamp of the present invention (the invention according to claim 2) includes a bending amount and a plate of a curved spring portion (arch shape) of one of the two pressing portions opposed to each other among the four pressing portions. Since the spring force (weight value) can be controlled (controlled) by the thickness, dimensions, etc., the power feeding member can be pressed and held against the heat sink member with a desired pressing force (pressing value, contact pressure value).

  In addition, the vehicular lamp according to the present invention (the invention according to claim 2) uses the other two pressing portions opposite to each other among the four pressing portions as a stopper portion, so that among the four pressing portions. Two opposing pressing parts can be curved spring parts. As a result, the vehicle lamp of the present invention (the invention according to claim 2) does not need to use all the four pressing portions as spring portions, so the power supply member is held and fixed by the pressing force required for the heat sink member. Thus, an excessive pressing force is not applied to the power supply member, and the durability of the power supply member can be improved.

  Furthermore, the vehicular lamp of the present invention (the invention according to claim 3) can detachably mount and fix the fixing member to the heat sink member by mutually locking the locking projection and the locking hole. . As a result, the vehicular lamp according to the present invention (the invention according to claim 3) can detachably mount the fixing member to the heat sink member easily and inexpensively without using a mounting member such as a screw.

  Moreover, since the vehicular lamp of the present invention (the invention according to claim 3) can visually check the locking state of the locking protrusion and the locking hole, the mounting and fixing state of the fixing member and the heat sink member is fixed. Can be visually checked, and quality control becomes easy.

FIG. 1 is an exploded perspective view showing a lamp unit in an embodiment of the present invention. FIG. 2 is a cross-sectional view of the lamp unit. FIG. 3 is a perspective view showing a positioning state of the semiconductor-type light source. FIG. 4 is a cross-sectional perspective view showing an arrangement relationship between the semiconductor light source and the leaf spring terminal of the power feeding member. FIG. 5 is a perspective view showing an assembled state of the power feeding member. FIG. 6 is a perspective view showing an assembled state of the fixing member. FIG. 7 is a perspective view showing a power supply member. FIG. 8 is a perspective view showing the power feeding member in an inverted manner. FIG. 9 is an enlarged view showing a small protrusion portion forming portion of FIG. FIG. 10 is an enlarged perspective view showing a connector portion forming portion of the power supply member. FIG. 11 is an enlarged perspective view showing a portion where the leaf spring member is formed. FIG. 12 is an enlarged perspective view showing the fixing member. FIG. 13 is a longitudinal sectional view (vertical sectional view) showing a state before the fixing member is mounted and fixed to the heat sink member. FIG. 14 is a longitudinal sectional view (vertical sectional view) showing a state where the fixing member is mounted and fixed to the heat sink member.

  Embodiments of a vehicular lamp according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

  The vehicular lamp in this embodiment is a headlamp lamp unit 1 shown in FIGS. The headlamp lamp unit 1 includes an optical system unit 2 and a heat sink member 20 in which the optical system unit 2 is disposed. The lamp unit 1 is disposed in a lamp chamber formed by a lamp housing (not shown) and a transparent outer lens, thereby forming a headlamp.

  The optical system unit 2 is configured as a projector type, and includes a semiconductor light source 10, a reflector 11 having a concave reflecting surface 11 a that reflects a part of light emitted from the semiconductor light source 10, and a semiconductor light source 10. A projection lens 12 that condenses direct light and reflected light of the reflector 11 and irradiates the light forward.

  The reflection surface 11a of the reflector 11 in the optical system unit 2 is formed of an ellipse or a reflection surface based on an ellipse, for example, a free-form surface based on an ellipsoid or an ellipse. In the vertical cross section of FIG. 2, the reflecting surface 11a of the reflector 11 has, for example, a semi-elliptical shape in which an ellipse is halved along its long axis, and the front end side of the reflecting surface 11a is a semicircular hood portion 11A. It is said that. The reflector 11 is formed of, for example, a light-impermeable synthetic resin material, and the reflective surface 11a is formed by performing aluminum vapor deposition or silver coating on the inner surface of the reflector 11. The reflecting surface 11a of the reflector 11 includes a first focal point F1 and a second focal point F2, and the light emitting unit 10a of the semiconductor-type light source 10 is disposed at or near the first focal point F1. Thereby, of the light emitted from the semiconductor-type light source 10, the light reflected by the reflecting surface 11 a of the reflector 11 is collected at the second focal point F <b> 2 of the reflector 11 or in the vicinity thereof.

  The semiconductor light source 10 is a light source using luminescence (light emission phenomenon) obtained by applying a voltage to a semiconductor, such as a light emitting diode (LED) or an electroluminescence (EL) including an organic EL and an inorganic EL. This semiconductor-type light source 10 has a planar rectangular substrate 10A, and positive and negative terminals constituting the light source side terminal 10b are disposed in a strip shape in the front-rear direction on the left and right upper surfaces of the substrate 10A. A transparent dome-shaped cover 10c is attached to cover the light emitting portion 10a.

  The projection lens 12 is a convex lens having a spherical or substantially spherical shape on at least one side surface. In this embodiment, both side surfaces of the projection lens 12 have a convex substantially spherical shape, and the side surface (front surface) on the front side of the lamp has a smaller radius of curvature than the side surface (rear surface) on the rear side of the lamp. The shape of the projection lens 12 is not limited to this, and may be any convex lens whose thickness in the lens optical axis direction becomes thinner from the center to the outer periphery. For example, a plano-convex lens whose side surface (rear surface) on the rear side of the lamp is a substantially flat surface. It may be. The projection lens 12 has a horizontal or substantially horizontal lens optical axis Z1, and the first focal point F1 and the second focal point F2 of the reflector 11 are set on the lens optical axis Z1. As a result, the light focused at or near the second focal point F2 of the reflector 11 is condensed into a light beam parallel or substantially parallel to the lens optical axis Z1 when passing through the projection lens 12, and is projected forward of the lamp. The

  Since the semiconductor-type light source 10 generates less heat than halogen lamps or HID lamps (high-intensity discharge lamps), a synthetic resin lens that is lighter than a glass lens, such as an acrylic lens, is used as the projection lens 12. The The periphery of the projection lens 12 is held and fixed to the lens holder 13 and is attached to the heat sink member 20 via the lens holder 13.

  The lens holder 13 is made of a suitable heat-resistant synthetic resin material, and includes a rising wall 13a at the rear end of the substantially semi-cylindrical body. The rising wall 13a is a shelf of a vertical wall 21 (to be described later) of the heat sink member 20. A boss portion 26 projecting below the portion 23 is fastened with a screw 18 and attached to the heat sink member 20. At the upper end of the rising wall 13a of the lens holder 13, a substantially horizontal flange 13b is extended toward the rear of the lamp. The flange 13b substantially coincides with the lens optical axis Z1 of the projection lens 12, and the front edge constitutes the shade 14.

  The shade 14 is set at the second focal point F2 position of the reflector 11 or a position near the second focal point F2, and blocks a part of the reflected light emitted from the semiconductor light source 10 and reflected by the reflecting surface 11a of the reflector 11. Then, a predetermined light distribution pattern having a cutoff line is formed by the remaining reflected light, for example, a passing light distribution pattern (low beam). Further, the rear flat surface of the shade 14 on the general upper surface of the flange portion 13b is located behind the lamp 14 in the first reflective surface 11a when the reflective surface 11a of the reflector 11 is the first reflective surface. It is formed as a second reflecting surface 15 that reflects the reflected light reflected at the position toward the upper part of the projection lens 12 in an obliquely upward direction.

On the other hand, a part of the light emitted from the semiconductor-type light source 10 is reflected on the upper portion of the front end portion of the hood portion 11A of the reflector 11 toward the position immediately before the shade 14 (front position of the lamp). A reflective surface 16 is formed. Slope The third reflecting surface 16, the front end upper portion of the hood portion 11A, by forming the bulge portions 11A ₁ projecting section inverted triangular shape toward the inside, which is inclined forward of the rear of the inner Formed with.

  Further, a fourth reflection surface 17 that reflects the reflected light reflected by the third reflection surface 16 toward the upper portion of the projection lens 12 is formed immediately before the shade 14 (front position of the lamp). Yes. The fourth reflection surface 17 is formed as an inclined surface inclined obliquely downward, and the third and fourth reflection surfaces 16 and 17 are used for overhead sign forming a light distribution pattern at a position above the low beam light distribution pattern. This constitutes the reflective surface.

  The second reflecting surface 15 and the fourth reflecting surface 17 on the side of the lens holder 13 are formed by applying aluminum vapor deposition or silver coating similarly to the first reflecting surface 11a and the third reflecting surface 16 of the reflector 11. Further, the body of the lens holder 13 is composed of the lower half of the semi-cylindrical shape as described above, and the upper half is opened so that heat does not accumulate in the lens holder 13. Has been.

  The heat sink member 20 is configured as a metal material having high thermal conductivity, for example, aluminum die casting. The heat sink member 20 also serves as a base on which the semiconductor light source 10, the reflector 11, and the projection lens 12 constituting the optical system unit 2 are optically aggregated and arranged as described above. A plurality of vertical fins 22 for heat dissipation are arranged at equal intervals in the left-right direction at least on the rear surface (also on the front surface in this embodiment) of the vertical wall 21. .

  The vertical wall 21 of the heat sink member 20 is integrally formed with a shelf 23 that protrudes substantially horizontally toward the front of the lamp at an intermediate position in the vertical direction, and the optical system unit 2 is assembled on the shelf 23. ing. In the present embodiment, a pair of left and right shelves 23 are provided, and a two-lamp type lamp unit 1 is configured by assembling the optical system unit 2 on each shelf 23.

  The left and right shelves 23 and the vertical walls 21 are formed with different phases in the front-rear direction, that is, shifted by an arbitrary dimension in the front-rear direction. Moreover, the shelf 23 may be formed with different phases in the left and right directions. The difference between the phases of the left and right shelf portions 23 is due to the design reasons of the headlamps determined by the character line of the vehicle body. Of course, the left and right shelf portions 23 may be formed in the same phase. One of the optical system units 2 assembled to the left and right shelf portions 23 is configured as a reference optical unit serving as a reference for optical axis adjustment, and the other is configured as an additional optical unit.

  The reference optical unit forms, for example, a light distribution pattern having a cut line that rises obliquely at the upper edge, while the additional optical unit forms a light distribution pattern whose upper edge is a horizontal cut line. These light distribution patterns and the light distribution pattern of the additional optical unit are combined to form a passing light distribution pattern having a predetermined cut-off line at the upper edge.

  In order to adjust the optical axis of the lamp unit 1, the longitudinal wall 21 of the heat sink member 20 has a predetermined portion of the vertical wall 21 and a connecting portion 24 of a front and rear direction aiming adjustment bolt and a horizontal direction aiming adjustment bolt, and tilting of the optical axis adjustment. A pivot 25 serving as a fulcrum is provided. Further, as described above, the boss portion 26 for attaching the lens holder 13 protrudes from the vertical wall 21 at the lower portion of the shelf portion 23 as described above.

  On the other hand, as shown in FIG. 3, a pedestal 30 for placing the semiconductor light source 10 is formed on the upper surface of the shelf 23 so as to protrude. The pedestal portion 30 is formed in a flat rectangular shape, and the width dimension in the left-right direction is substantially the same as or slightly shorter than the width dimension in the left-right direction of the substrate 10A of the semiconductor light source 10. A stopper portion 31 extending in the left-right direction is erected on the rear side portion of the pedestal portion 30. The stopper portion 31 is formed in a cross-sectional shape having at least a front surface thereof as a vertical surface, for example, a rectangular cross-sectional shape, and is configured to engage with the rear end surface of the substrate 10A of the semiconductor light source 10 in a plane. .

  An opening 32 is formed in the rear side of the shelf 23, specifically, in the region extending from the rear side of the pedestal 30 to the vertical wall 21, and the opening 32 is formed in front of the shelf 23 and A connector portion 42 of a power supply member 40 described later can be inserted and engaged obliquely from above. On the front wall of the opening 32, as shown in FIG. 4, a projecting portion 33 with which a later-described abutting surface 42a of the connector portion 42 abuts is integrally formed extending in the left-right direction.

  Also, a pair of left and right guide rail portions 34 for slidingly guiding the power supply member 40 when the connector portion 42 of the power supply member 40 is inserted into the opening 32 are formed on the upper surface of the shelf portion 23 in a protruding manner. Has been. The guide rail portion 34 is disposed so as to extend in the front-rear direction along both sides of the pedestal portion 30. Further, the front end portion of the guide rail portion 34 is formed to extend forward from the position where the stopper portion 31 is formed, and at least the inner side surfaces of the front end portion are formed vertically, and these guides are formed. The front end portion of the rail portion 34 is engaged with the left and right side end surfaces of the substrate 10A of the semiconductor type light source 10 in a plane, and has a function as a stopper for positioning the semiconductor type light source 10 in the left and right direction. Has been.

  Further, on the upper surface of the shelf portion 23, a holder portion 41, which will be described later, of the power feeding member 40 is mounted on the upper surface of the shelf portion 23 at a position spaced apart from each other of the pair of guide rail portions 34. A pair of left and right seat surfaces 35 to be placed extend in the front-rear direction and are integrally formed. Further, a stepped portion 36 is integrally formed along the corner of the upper surface of the shelf 23 and the front surface of the vertical wall 21, and when the feeding member 40 is inserted into the opening 32, An insertion restricting rib 46 projecting from the rear end of the holder portion 41 is brought into contact with the connector portion 42 so that the insertion of the connector portion 42 can be restricted.

  Locking projections 37 and 38 for locking and fixing a fixing member 50 described later are integrally formed on the upper surface of the stepped portion 36 and the front end surface of the shelf portion 23. A pair of left and right engaging projections 37 on the upper surface of the stepped portion 36 are provided with the opening 38 interposed therebetween, and hook claws 37a are formed at the upper ends facing the rear, while the front end surface of the shelf 23 is engaged. The stop protrusion 38 is provided in a horizontally long manner toward the front at the center in the left-right direction of the front end surface of the shelf 23. In the present embodiment, the guide rail portion 34, the seat surface 35, and the locking projections 37 and 38 are all formed symmetrically on the left and right lines with respect to the center in the left and right direction of the pedestal portion 30.

  The semiconductor-type light source 10 mounts the substrate 10A on the pedestal portion 30 of the shelf 23, and the rear end surface and the left and right end surfaces of the substrate 10A are connected to the stopper portion 31 and the pair of left and right guide rail portions 34, respectively. An arrangement reference position of the semiconductor-type light source 10 is determined by bringing it into contact with the inner side surface of the front end portion and abutting and locking it. The semiconductor light source 10 is firmly fixed to the heat sink member 20 by a power supply member 40 and a fixing member 50 that are sequentially assembled on the shelf 23 from above. At this time, the substrate 10A of the semiconductor-type light source 10 is opposed and pressed in the front-rear direction of the lamp by the stopper portion 31 and a leaf spring member 43 (to be described later) of the power supply member 40, and the front-rear direction affects the light distribution performance. Are properly positioned, and the arrangement position of the semiconductor-type light source 10 is determined.

  The power supply member 40 is made of an appropriate heat-resistant synthetic resin material. As shown in FIGS. 7 to 10, the peripheral portion of the semiconductor-type light source 10, specifically, the peripheral portion of the substrate 10A is viewed from above. A holder part 41 to be pressed, and a connector part 42 that protrudes toward the rear of the lamp at the rear end of the holder part 41 and to which a power supply side connector 48 (see FIG. 2) is connected.

  The holder part 41 is formed in a flat plate-like flat plate shape, and has a flange part 41a which is formed in a stepped shape integrally with the peripheral part of the holder part 41 and is abutted and polymerized on the seating surface 35 of the shelf part 23 in the heat sink member 20. I have. In the central portion of the holder portion 41, a flat rectangular opening 41b is formed through which the dome-shaped cover 10c of the semiconductor-type light source 10 and the light source side terminal 10b on the upper surface of the substrate 10A can be exposed.

  In addition, a plurality of pairs of leaf spring terminals 41c that can be electrically connected to the light source side terminals 10b provided on the left and right upper surfaces of the substrate 10A of the semiconductor-type light source 10 are provided on the left and right side edge portions of the window portion 41b. Integrated. These leaf spring terminals 41c have a plurality of positive electrode side terminals and negative electrode side terminals in the front-rear direction of the lamp corresponding to the positive electrode side terminals and the negative electrode side terminals that are spaced apart from each other and constitute the light source side terminal 10b. They are arranged in an orderly manner so as to be opposed to the left and right.

  Furthermore, at the center of the front edge portion of the window portion 41b, the stopper portion 31 on the shelf portion 23 of the heat sink member 20 faces the stopper portion 31 and protrudes toward the center side of the window portion 41b. A plate spring member 43 that elastically contacts the front end face of the ten substrates 10A is integrally provided. As shown in FIG. 11, the leaf spring member 43 includes a base portion 43a fixed to the front edge portion of the window portion 41b, and a pair of left and right branches branched from the end of the base portion 43a and bent into a substantially concave shape on the side surface. The leaf spring piece 43b and the pair of leaf spring pieces 43b and 43b are connected to the front end portions of the plate spring piece 43b and 43b. And a piece 43c. The pair of left and right leaf spring pieces 43b are formed in an approximately eight-plane shape in which a separation interval increases from the end of the base portion 43a to the tip, and the pressing piece 43c is configured to be wider than the base portion 43a. Yes.

  Further, as shown in FIG. 8, the lower surface of the holder portion 41, specifically the lower surface of the rear side of the flange portion 41a, is in sliding contact with the outer surfaces of the pair of left and right guide rail portions 34, 34. A groove 44 is formed. As shown in FIG. 9, the lower surface side of the front and rear edge portions of the open window portion 41b is stepped and formed higher than the light source side terminal 10b on the upper surface of the substrate 10A of the semiconductor-type light source 10. For example, a plurality of small protrusions 45 are formed to abut on the four corner surfaces of the substrate 10A in a spot manner and press the substrate 10A. In addition, at the rear end of the holder portion 41, the insertion base of the connector portion 42 to the opening 32 is restricted by contacting the molding base of the shelf portion 23 of the heat sink member 20, that is, the front surface of the stepped portion 36. A plurality of insertion restricting ribs 46 projecting in the vertical direction.

  On the other hand, the connector part 42 is projected in a straight shape from the rear end of the holder part 41 in the left-right direction toward the rear of the lamp, so that the power supply member 40 is connected to the leaf spring terminal 41c, The holder part 41 provided with the spring member 43 and the like and the connector part 42 are formed symmetrically on the left and right lines. As shown in FIG. 10, the connector portion 42 is formed in a rectangular tube shape whose upper surface is flush with the upper surface of the holder portion 41, and protrudes downward from the holder portion 41. The front end of the connector portion 42 protruding downward from the holder portion 41 is formed as a substantially vertical abutting surface 42a that abuts the projection 33 provided on the front wall of the opening 32 of the heat sink member 20 in a plane. Has been. The connector part 42 is provided with a connector terminal 42b, and the positive terminal and the negative terminal of the connector terminal 42b are electrically connected to the positive terminal and the negative terminal of the leaf spring terminal 41c of the holder part 41. Conducted.

  The leaf spring terminal 41c, the leaf spring member 43, and the connector terminal 42b extend from the four peripheries of the opening portion 41b of the holder portion 41 to the connector portion 42 as shown in FIGS. The power supply member 40 is connected to a single metal plate 47 that is insert-molded on the synthetic resin base material. A portion of the metal plate 47 where the positive terminal and the negative terminal of the connector terminal 42 b are connected is punched and divided by press working after insert molding of the metal plate 47. Further, the connecting portion between the positive terminal of the leaf spring terminal 41c and the leaf spring member 43 in the metal plate 47 and the connecting portion between the negative terminal of the leaf spring terminal 41c and the leaf spring member 43 are the same. The metal plate 47 is cut and punched after insert molding.

  As a result, the positive terminals and the negative terminals of the connector terminal 42b and the leaf spring terminal 41c are electrically connected to each other, and the leaf spring member 43 is not electrically connected to the connector terminal 42b and the leaf spring terminal 41c. It is said that. In order to facilitate punching and cutting of the metal plate 47, a plate exposure hole 40a in which the metal plate 47 is partially exposed in the vertical direction is formed at a required portion of the synthetic resin base material of the power supply member 40. The metal plate 47 is partially punched and cut by a press machine (not shown) at the exposed hole 40a.

  The fixing member 50 is formed of a metal plate material having a required rigidity. As shown in FIGS. 6 and 12, a rectangular (rectangular) shape is formed at a position where the central portion (that is, the holder portion 41) of the semiconductor light source 10 and the power feeding member 40 is located in the central portion of the fixing member 50. ) Opening 56 is provided. On the four sides around the opening portion 56 of the fixing member 50, pressing portions 52 that press the peripheral portion of the power supply member 40 against the heat sink member 20 are provided.

  Of the four (four sides) pressing portions 52, one of the two opposing left and right (two short sides) pressing portions 52 is a peripheral portion of the power feeding member 40 (that is, the flange portion 41a of the holder portion 41). The curved spring portion 55 is in elastic contact with the upper surface of the right and left side edges. On the other hand, of the four (four sides) pressing parts 52, the other two opposing (two long sides) pressing parts 52 are the peripheral parts of the power feeding member 40 (that is, the flanges of the holder part 41). It consists of plate-shaped stopper portions 51a and 57 that come into contact with the upper surface of the front side of the portion 41a and the upper surface of the rear side of the holder portion.

  Of the four (four sides) pressing portions 52, the plate-shaped stopper portion 57 that abuts on the peripheral portion of the power feeding member 40 (that is, the upper surface of the rear side of the holder portion) is the other three (three sides). The lower part 52 (55, 55, 51a) is raised upward at a substantially right angle (vertical) and bent forward at a substantially right angle (horizontal). The height of the vertical plate of the stopper portion 57 substantially coincides with the height of the holder portion 41 of the power supply member 40.

  Further, the front end portion of the plate-shaped stopper portion 51a that contacts the peripheral edge portion of the power feeding member 40 (that is, the upper surface of the front side edge of the flange portion 41a of the holder portion) of the four pressing portions 52 (four sides) is A front wall 51 that is bent substantially at a right angle (vertical) downward and abuts against the front edge of the shelf 23 of the heat sink member 20 is provided.

  At the center part in the left-right direction of the front wall 51 of the fixing member 50 and the rear terminal part of the pair of left and right pressing parts 52, horizontally long locking holes 53 and 54 are provided, respectively. Therefore, the fixing member 50 inserts and engages the engaging holes 54 of the pair of left and right pressing portions 52 above the shelf 23 into the engaging protrusions 37 on the corresponding shelf 23 from above and at the front wall. By inserting and engaging the locking holes 53 of 51 to the locking protrusions 38 on the front end surface of the shelf 23, the locking holes 53 are mounted on the flange portion 41 a of the power supply member 40.

  In order to ensure engagement between the locking projections 37 and 38 and the locking holes 53 and 54, the pair of left and right pressing parts 52 are curved so that the center part is convex toward the holder part 41 side. The spring portion 55 is formed. The spring portion 55 is elastically brought into contact with the surface of the flange portion 41a of the power supply member 40 to bend and deform so that an urging force in the engagement direction between the locking projections 37 and 38 and the locking holes 53 and 54 is obtained. ing. As a result, the power supply member 40 and the semiconductor-type light source 10 are permanently fixed onto the shelf 23.

  The semiconductor light source 10 is assembled to the heat sink member 20 as follows. First, the semiconductor-type light source 10 is placed on the pedestal portion 30 of the shelf portion 23 of the heat sink member 20 with the light emitting portion 10a facing upward, and the substrate 10A is slid on the pedestal portion 30 so that the substrate 10A. The rear end surface and the left and right side end surfaces are set in contact with the stopper portion 31 and the front end side surface of the guide rail portion 34 by surface contact, respectively (see FIG. 3).

  Next, the connector portion 42 of the power supply member 40 is inserted into the opening 32 on the rear side portion of the shelf portion 23 while being inclined obliquely from the upper front, and the holder portion 41 is lowered by lowering the posture of the power supply member 40 to a horizontal state. The dome-shaped cover 10c is passed over the peripheral edge of the substrate 10A of the semiconductor-type light source 10 from above and passes through the open window 41b, and the pressing piece 43c of the leaf spring member 43 of the holder 41 is moved to the substrate 10A. The front end face is slidably engaged from above. As a result, the pressing piece 43c of the leaf spring member 43 is brought into elastic contact with the front end surface of the substrate 10A, and the substrate 10A is sandwiched between the stopper portion 31 and the leaf spring member 43 in the front-rear direction, so The mounting position in the front-rear direction is defined, and the mounting position in the left-right direction is defined by the front end portions of the left and right guide rail portions 34 (see FIG. 5).

  At this time, the power feeding member 40 is positioned in the left-right direction by the groove 44 on the lower surface of the holder portion 41 being engaged with the guide rail portion 34, while the connector portion is caused by the spring reaction force of the leaf spring member 43. The abutting surface 42a of 42 is elastically abuttingly engaged with the protrusion 33 on the front wall of the opening 32 to perform positioning in the front-rear direction. Accordingly, the leaf spring terminal 41c of the holder portion 41 is elastically contacted with the light source side terminal 10b of the substrate 10A so that the power supply member 40 and the semiconductor-type light source 10 are electrically connected, and the substrate 10A is placed on the pedestal portion 30. The semiconductor light source 10 and the power supply member 40 are temporarily fixed (see FIG. 4).

  Therefore, as shown in FIGS. 13 and 14, the fixing member 50 has a pair of left and right pressing portions 52, 52 as described above, and the locking holes 54 at the rear end portions of the locking projections 37 on the shelf portion 23. The hook claw 37 a is passed through and engaged with the locking projection 37, and the lower end side of the front wall 51 is bent slightly forward using the elasticity so that the locking hole 53 is formed on the front end surface of the shelf 23. The four pressing parts 52 (four sides) (the left and right spring parts 55 and 55, the front and rear stopper parts 51a and 57) are inserted into and engaged with the locking projection 38, and the three sides ( The semiconductor-type light source 10 is mounted on the shelf 23 by mounting the semiconductor-type light source 10 and the power-feeding member 40 on the rear side of the holder portion 41 of the power supply member 40 by attaching the semiconductor-type light source 10 and the power supply member 40 to each other. With respect to the heat sink member 20 With ends (see FIG. 6).

  After the semiconductor light source 10 is assembled to the heat sink member 20 as described above, the reflector 11 is fixedly fastened or fastened to a fixed position by a positioning means (not shown) on the shelf 23 and projected similarly. The lens 12 is assembled to the heat sink member 20 by fixing the screw 18 to the end of the boss portion 26 of the heat sink member 20 through the lens holder 13 as described above.

  The (lamp unit 1 of the headlamp) in this embodiment is configured as described above, and the operation thereof will be described below.

  First, the power supply side connector 48 is inserted into the connector portion 42 of the power feeding member 40. Next, the semiconductor light source 10 is turned on to emit light. Then, light is emitted from the semiconductor-type light source 10. This light is reflected by the reflecting surface 11 a of the reflector 11, and a part of the reflected light is cut off by the shade 14. The reflected light that has not been cut off by the shade 14 forms a predetermined light distribution pattern having a cutoff line, for example, a passing light distribution pattern (low beam). The predetermined light distribution pattern passes through the projection lens 12 and is projected (irradiated) in front of the automobile (vehicle) to illuminate the road surface and the like.

  The vehicular lamp (headlamp lamp unit 1) in this embodiment is configured and operated as described above, and the effects thereof will be described below.

  The vehicular lamp (headlamp lamp unit 1) in this embodiment has four (four sides) pressing portions 52 provided on four sides around a square (rectangular) opening 56 of the fixing member 50, respectively. Since the four sides of the peripheral portion of the power supply member 40, that is, the three sides of the flange portion 41a of the power supply member 40 (the left and right sides and the front side) and the rear side of the holder portion 41 of the power supply member 40 are pressed against the heat sink member 20. Of the peripheral edge of the power supply member 40, four locations respectively corresponding to the four sides around the rectangular opening 56 of the fixing member 50 are pressed against the heat sink member 20. As a result, the vehicular lamp (lamp unit 1 of the headlamp) in this embodiment can securely and securely hold and fix the power supply member 40 to the heat sink member 20 without rattling due to the impact or vibration of the vehicle. That is, the power supply member 40 does not rattle with respect to the heat sink member 20 due to impact or vibration of the vehicle.

  Moreover, the vehicular lamp (headlamp lamp unit 1) in this embodiment securely and securely holds the semiconductor-type light source 10 on the heat sink member 20 via the power supply member 40 without being rattled by the impact or vibration of the vehicle. Since they can be fixed, the power supply member 40 and the semiconductor light source 10 can be securely held and fixed without shaking due to the impact or vibration of the vehicle. As a result, in the vehicle lamp (headlamp lamp unit 1) in this embodiment, the electrical connection between the power supply member 40 and the semiconductor-type light source 10 is reliably and firmly established. Thus, the semiconductor light source 10 can be prevented from being unlit or chattered.

  Moreover, in the vehicle lamp (headlamp lamp unit 1) in this embodiment, the periphery of the square (rectangular) opening 56 at the center of the fixing member 50 is connected by the pressing parts 52 on four sides. The strength and dimensional accuracy are improved as compared with a fixing member lacking one of the four side pressing portions. As a result, the vehicular lamp (lamp unit 1 of the headlamp) in this embodiment is improved in assemblability and quality due to improvement in strength and dimensional accuracy.

  Further, the vehicular lamp (lamp unit 1 of the headlamp) in this embodiment has a curved shape (arch) of the two pressing parts 52 (two short sides on the left and right sides) of the four pressing parts 52 facing each other. The spring force (weight value) can be controlled by the amount of bending, plate thickness, dimensions, etc. of the spring portion 55 of the shape), so that the power supply member 40 is pressed against the heat sink member 20 by a desired pressing force (press value, contact value). Pressure value) and can be held and fixed.

  Moreover, the vehicular lamp (lamp unit 1 of the headlamp) in this embodiment has two pressing parts 52 (52 on the front and rear) opposite to each other among the four pressing parts 52 as stopper parts. By using 51a and 57, two opposing pressing parts 52 (two short sides on the left and right sides) of the four pressing parts 52 can be curved spring parts 55. As a result, the vehicular lamp (the lamp unit 1 of the headlamp) in this embodiment does not require the four pressing portions 52 to be all spring portions, and therefore the pressing force that requires the power supply member 40 to the heat sink member 20. The power supply member 40 is not subjected to excessive pressing force, and the durability of the power supply member 40 can be improved.

  Furthermore, the vehicular lamp (lamp unit 1 of the headlamp) in this embodiment has the fixing member 50 attached to the heat sink member 20 by locking the locking projections 37 and 38 and the locking holes 54 and 53 to each other. It can be detachably mounted and fixed. As a result, the vehicular lamp (lamp unit 1 of the headlamp) in this embodiment can be detachably mounted on and fixed to the heat sink member 20 at a low cost without using a mounting member such as a screw. it can.

  Moreover, since the vehicular lamp (lamp unit 1 of the headlamp) in this embodiment can visually check the mutual locking state of the locking projections 37 and 38 and the locking holes 54 and 53, the fixing member 50. It is possible to visually check the mounting and fixing state between the heat sink member 20 and the heat sink member 20, and quality control is simplified.

  According to the headlamp of the present embodiment having the above-described configuration, the rear end surface of the semiconductor light source 10 is brought into contact with the stopper portion 31 projecting on the shelf portion 23 of the heat sink member 20 and brought into surface contact with the stopper portion 31. An arrangement reference position of the semiconductor-type light source 10 on the portion 23 is determined, and the semiconductor-type light source 10 is formed by a sandwiching pressure that opposes the stopper portion 31 and the leaf spring member 43 of the holder portion 41 of the power supply member 40 in the front-rear direction. Unlike the case where the semiconductor light source is assembled in advance in the conventional power supply attachment and the power supply attachment is assembled in the heat sink member, the semiconductor light source 10 is directly attached to the predetermined position of the heat sink member 20. The assembly accuracy of the semiconductor light source 10 can be increased.

  In addition, since it is sufficient to obtain the accuracy of mutual surface contact between the stopper portion 31 and the semiconductor-type light source 10, the processing accuracy can be easily controlled, and the semiconductor-type light source 10 can be accurately positioned in the front-rear direction. Thus, the optical positional relationship with respect to the optical position does not get out of order, thereby improving the light distribution performance.

  In addition to the above-described effects on the light distribution performance, the leaf spring member 43 is integrally provided on the holder portion 41 of the power supply member 40 as described above. Unlike what is assembled to the heat sink member, the number of parts can be reduced and the number of assembling steps can be reduced.

  In addition, since the power supply member 40 can be temporarily held and fixed with respect to the heat sink member 20 by using the spring reaction force of the plate spring member 43 of the holder portion 41, The assembling property of the power supply member 40 can be improved.

  An opening 32 is formed in a corner portion extending from the rear side portion of the shelf portion 23 of the heat sink member 20 to the vertical wall 21, and the power supply member 40 is formed in a rectangular tube shape projecting from the rear end of the holder portion 41. The connector portion 42 is inserted into the opening portion 32 from the front and obliquely above the shelf portion 23, and the abutting surface 42 a at the front end of the connector portion 42 is placed on the protrusion portion 33 on the front wall of the opening portion 32. The spring force of the member 43 is brought into contact with the front and rear direction and elastically engaged. For this reason, the rectangular cylindrical connector portion 42 itself is inserted into and engaged with the opening 32, and the abutting surface 42a and the protruding portion 33 are brought into abutment engagement with each other, thereby supplying the power supply member. Positioning in the lamp front-rear direction with respect to the 40 heat sink members 20 and temporary holding and fixing can be appropriately performed.

  In addition, since the abutting surface 42a is elastically abuttingly engaged with the protrusion 33, the power feeding member 40 can be prevented from rattling due to vehicle body vibration or the like, and the power connector 48 is connected to the connector 42. When the lamp is inserted from the rear of the lamp, the insertion restriction can be performed to prevent the power supply member 40 from being displaced. In addition, since the connector part 42 projects rearward from the rear end of the holder part 41, the power connector 48 can be easily attached / detached from the rear of the lamp, thereby improving workability. It is possible to avoid dropping off the own weight due to vibration of the vehicle body or the like.

  Further, when the holder portion 41 of the power supply member 40 is inserted into the opening 32 from the front of the lamp, a plurality of insertion restriction vertical ribs 46 at the rear end of the holder portion 41 are formed on the base portion of the shelf portion 23. Because of the abutment engagement with the front surface of the step portion 36, the leaf spring member 43 is pressed when the power feeding member 40 is excessively pushed rearward of the lamp and when the power source connector 48 is detached. It is possible to eliminate the pressing load and prevent the leaf spring member 43 from becoming loose.

  Further, on the shelf 23 of the heat sink member 20, a pair of guide rail portions 34, 34 extending in the front-rear direction is raised and formed, and the connector portion 42 of the power supply member 40 is connected to the opening 32. At the time of insertion, the groove portion 44 formed on the lower surface of the rear end portion of the holder portion 41 of the power supply member 40 engages with the guide rail portions 34, 34, so that the insertion operation of the connector portion 42 into the opening portion 32 is smooth. In addition, the horizontal displacement of the holder portion 41, that is, the lateral displacement of the power supply member 40 can be eliminated, and the semiconductor light source 10 can be properly pressed by the power supply member 40.

  In addition, the front end portions of the guide rail portions 34 and 34 extend forward from the stopper portion 31 and are engaged with the left and right end surfaces of the substrate 10A of the semiconductor light source 10 for positioning in the left-right direction. In order to function as a stopper to perform, in addition to improving the positional accuracy in the front-rear direction of the semiconductor light source 10 that affects the light distribution performance by the stopper portion 31 and the leaf spring member 43, the positional accuracy in the left-right direction is also increased. Thus, the optical positional relationship between the shade 14, the semiconductor light source 10 and the reflector 11 can be performed as designed, and the light distribution performance can be further improved.

  Further, the shelf 23 of the heat sink member 20 is provided with locking projections 37 and 38 on the rear side and the front end surface of the upper surface thereof, and the fixing member 50 is provided on the locking projections 37 and 38 on the front and rear sides. Since the fixing is performed across the belt, the fixing member 50 can be attached with a single touch unlike the fastening with screws, and the mounting workability can be improved. In addition, since a hook claw 37a is formed at the front end of the locking projection 37 on the upper surface side of the shelf portion 23, the rear end portion of the fixing member 50 is hooked on the hook claw 37a obliquely from above. Then, it is sufficient to rotate the front end portion of the fixing member 50 downward with the engaging portion as a fulcrum and engage with the locking projection 38 on the front end surface of the shelf portion 23. Thus, the fixing member 50 is not detached from the locking projection 37, and the mounting workability can be more easily performed.

  The power feeding member 40 is provided with the connector part 42 projecting rearward from the rear end of the holder part 41 and the leaf spring member 43 at the center in the left-right direction of the flat rectangular holder part 41, Since the power feeding member 40 is formed symmetrically on the left and right lines, when the optical system unit 2 is configured as a pair of left and right on the heat sink member 20 as in this embodiment, there is no specification division and can be diverted to the left and right optical system units. Assembling work can be simplified without inducing misassembly.

  The holder portion 41 is integrally provided with a leaf spring terminal 41c that elastically contacts the light source side terminal 10b provided on the left and right side edges of the substrate 10A of the semiconductor-type light source 10. By arranging 41c in the center part of the holder part 41 symmetrically to the left and right lines, the power feeding member 40 can be easily unified.

  The leaf spring member 43 provided integrally with the holder portion 41 of the power supply member 40 has a pair of left and right leaf spring pieces 43b and 43b branched from the end of the base portion 43a of the base, and is bent into a substantially concave shape on the side surface. The pressing pieces 43c that are provided between the tip portions and rise substantially vertically are configured so as to abut on the front end surface of the substrate 10A of the semiconductor-type light source 10 in a plane. By setting 43b and 43b, the leaf spring member 43 can be easily designed to a predetermined low spring load value. Thereby, metal fatigue of the metal plate 47 constituting the leaf spring member 43 can be eliminated, and the elastic clamping pressure holding in the front-rear direction of the semiconductor light source 10 can be appropriately performed.

  Further, the leaf spring pieces 43b, 43b are formed in an approximately eight-plane shape in which the separation interval increases from the end of the base portion 43a to the tip, and the pressing piece 43c is formed wider than the base portion 43a. The holding area of the semiconductor light source 10 can be sufficiently secured without forming the entire plate spring member 43 wide, and the size of the plate spring member 43 can be reduced. The design of 40 can be easily performed without difficulty in structure.

  As described above, the holder portion 41 is integrally provided with a leaf spring terminal 41c that elastically contacts the light source side terminal 10b on the substrate 10A of the semiconductor-type light source 10, and the light source side terminal 10b and the leaf spring terminal 41c are connected to each other. Since the power supply member 40 and the semiconductor light source 10 are electrically connected to each other by contact, the spring action of the leaf spring terminal 41c can eliminate the movement of the semiconductor light source 10 and hold it appropriately. .

  Further, on the lower surface of the holder portion 41, a plurality of small protrusions 45 are formed on the substrate 10A of the semiconductor light source 10 so as to come into spot contact with the four corners removed from the light source side terminal 10b. By concentrating the spring force of the leaf spring terminal 41c on the contact portion of the substrate 10A with these small protrusions 45, the required holding force of the semiconductor light source 10 can be secured and the pressing load of the leaf spring terminal 41c can be reduced. It can be reduced to prevent settling.

  The leaf spring terminal 41c, the leaf spring member 43, and the connector terminal 42b are insert-molded into the synthetic resin base material of the power supply member 40 from the four peripheries of the opening portion 41b of the holder portion 41 to the connector portion 42. The metal plate 47 is integrally connected to the metal plate 47, the connection portion of the positive terminal and the negative terminal of the connector terminal 42b on the metal plate 47, the positive terminal of the leaf spring terminal 41c, and The negative electrode side terminal and the continuous portion of the leaf spring member 43 are cut and cut after insert molding of the metal plate 47, and the positive electrode side terminals and the negative electrode side terminals of the connector terminal 42b and the leaf spring terminal 41c are electrically connected. The leaf spring member 43 is configured to be electrically non-conductive with the connector terminal 42b and the leaf spring terminal 41c. Connector terminal 42b, the plate spring terminals 41c, and a leaf spring member 43 when the integrally formed by insert molding, it is possible that in can reduce the molding steps moldability is improved, which greatly contributes to cost reduction.

  Further, as described above, the connector terminal 42b, the leaf spring terminal 41c, and the leaf spring member 43 are integrally connected to the single metal plate 47 in advance, so that the connector terminal 42b, the leaf spring terminal 41c, There is no deviation in the arrangement position of the spring member 43, and the quality of the power supply member 40 can be improved.

  In addition, in the metal plate 47, the leaf spring member 43 and the positive and negative terminals of the leaf spring terminal 41c and the connector terminal 42b are symmetrical with respect to the center line in the left-right direction of the power supply member 40. Thus, the unification of the parts having the left-right line symmetrical configuration of the power feeding member 40 described above can be realized without hindrance.

  On the other hand, as shown in FIG. 13 and FIG. 14, the fixing member 50 has the locking holes 54 at the end portions of the pair of left and right pressing portions 52, 52 on the locking projections 37 on the shelf portion 23 of the heat sink member 20. In addition to engaging and engaging, the locking holes 53 of the front wall 51 are inserted and engaged with the engaging protrusions 38 on the front end surface of the shelf 23, whereby four (four sides) pressing portions 52 (left and right spring portions 55). 55, front and rear stopper portions 51a, 57) are peripheral portions of the power supply member 40, that is, the three sides (the left and right sides and the front side) of the flange portion 41a of the power supply member 40 and the rear side of the holder portion 41 of the power supply member 40. The side can be pressed and mounted on the shelf 23, and the assembly member can be assembled with one touch without using a fastening member or the like, thereby improving the assembly workability.

  In addition, the curved spring portion 55 formed in the pair of left and right pressing portions 52 and 52 can strengthen the engagement holding force between the locking holes 53 and 54 and the locking projections 37 and 38, and Since the presser foot can be strengthened, there is no backlash and a stronger assembly can be performed.

  Then, as in the above-described embodiment, the assembly of the semiconductor light source 10, the power feeding member 40, and the fixing member 50 onto the shelf 23 of the heat sink member 20 is sequentially placed from above, inserted, or engaged. Since the fastening member is unnecessary, the assembly work can be simplified to improve workability, and there is an advantage that the assembly by the robot can be easily automated.

  In the above-described embodiment, the structure in which the two optical system units 2 are arranged is illustrated. However, it is needless to say that a multi-lamp type or a single lamp type structure including three or more optical system units 2 may be used. It is.

  The optical system unit 2 can also be applied to a lamp configuration other than the projector type in the embodiment.

DESCRIPTION OF SYMBOLS 1 Lamp unit 2 Optical system unit 10 Semiconductor type light source 10b Light source side terminal 11 Reflector 12 Projection lens 20 Heat sink member 21 Vertical wall 23 Shelf part 31 Stopper part 32 Opening part 33 Projection part 34 Guide rail part 36 Step part (formation of shelf part) base)
37, 38 Locking protrusion 40 Power supply member 41 Holder portion 41a Flange portion 41c Leaf spring terminal 42 Connector portion 42b Connector terminal 43 Leaf spring member 44 Groove portion 50 Fixing member 51 Front wall 52 Pressing portion 53, 54 Locking hole 55 Spring portion 56 Opening 51a, 57 Stopper

Claims (3)

In a vehicle lamp that uses a semiconductor-type light source as a light source,
A heat sink member;
A semiconductor light source set on the heat sink member;
A power supply member that is temporarily fixed to the heat sink member, temporarily fixes the semiconductor type light source to the heat sink member, and supplies power to the semiconductor type light source;
A fixing member that is fixed to the heat sink member and holds and fixes the semiconductor light source and the power supply member to the heat sink member;
With
A rectangular opening is provided at a location where the semiconductor light source and the central portion of the feeding member are located in the central portion of the fixing member,
The four sides around the opening of the fixing member are provided with pressing portions that press the peripheral edge of the power supply member against the heat sink member, respectively.
A vehicular lamp characterized by that. Two opposing pressing parts of the four pressing parts consist of curved spring parts that elastically contact the peripheral edge of the power supply member,
Of the four pressing portions, the other two opposing pressing portions are formed of a plate-shaped stopper portion that comes into contact with the peripheral edge portion of the power supply member.
The vehicular lamp according to claim 1. The heat sink member and the fixing member are provided with a locking projection and a locking hole for detachably mounting and fixing the fixing member to the heat sink member by locking each other.
The vehicular lamp according to claim 1 or 2.

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