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JP2011172299A - Non-contact power transmission and communication system - Google Patents

Non-contact power transmission and communication system Download PDF

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JP2011172299A
JP2011172299A JP2010030768A JP2010030768A JP2011172299A JP 2011172299 A JP2011172299 A JP 2011172299A JP 2010030768 A JP2010030768 A JP 2010030768A JP 2010030768 A JP2010030768 A JP 2010030768A JP 2011172299 A JP2011172299 A JP 2011172299A
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coil
power transmission
communication
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terminal
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JP5551465B2 (en
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Naoki Wakao
直樹 若生
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Tokin Corp
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NEC Tokin Corp
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact power transmission, along with a communication system, capable of commonalizing a coil for communication, and a first coil at a power transmission side and a second coil at a power reception side, and capable of preventing application of overvoltage to a communication circuit connected to the second coil. <P>SOLUTION: The non-contact power transmission and communication system includes a transmission-side device 19 including the first coil and a reception-side device 20 including the second coil 7, and performs non-contact power transmission and communication of a data signal by electromagnetic coupling between the first coil and the second coil 7. The reception-side device 20 includes the communication circuit for receiving and transmitting the data signal and an input connection circuit 24 for connecting the communication circuit to the second coil 7. The input connection circuit 24 includes MOSFET semiconductor switches 41, 42, 43 operated according to voltage generated in the second coil 7, and an operation of the MOSFET semiconductor switches changes a voltage to be applied to the communication circuit. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、2次電池を内蔵した携帯型電子機器や接触による給電が難しい環境下で用いられる電子機器に電磁誘導により非接触で電力を送電する機能を有する非接触電力伝送システムに関し、特に通信機能を内蔵した非接触電力伝送及び通信システムに関する。   The present invention relates to a non-contact power transmission system having a function of transmitting power in a non-contact manner by electromagnetic induction to a portable electronic device having a built-in secondary battery or an electronic device used in an environment where power supply by contact is difficult. The present invention relates to a contactless power transmission and communication system with built-in functions.

近年、電子部品の小型化に伴い、携帯電話や携帯型音楽プレーヤ等に代表される携帯電子機器は、小型化や軽量化が図られ、広く普及している。更に近年、携帯電子機器は多機能化及び高速処理化が図られ、それに伴い電子機器が必要とする電力量が増加傾向にある。しかし、一般に、携帯電子機器は、専用のアダプターを内蔵せず、内蔵した2次電池に充電した電力により駆動されており、2次電池の電力が不足する度に2次電池を充電しなければならない。   In recent years, with the miniaturization of electronic components, portable electronic devices typified by mobile phones and portable music players are becoming more and more popular due to the reduction in size and weight. Furthermore, in recent years, portable electronic devices have been made multifunctional and high-speed processing, and accordingly, the amount of power required by the electronic devices has been increasing. However, in general, portable electronic devices do not have a dedicated adapter and are driven by the power charged in the built-in secondary battery, and the secondary battery must be charged each time the power of the secondary battery is insufficient. Don't be.

一般に、携帯電子機器の2次電池への充電は、携帯電子機器の充電端子と充電台(クレードル)の充電端子を接触させて電気的に接続し、充電台から電力を供給して内蔵する2次電池に充電する。   In general, the charging of the secondary battery of the portable electronic device is performed by bringing the charging terminal of the portable electronic device and the charging terminal of the charging stand (cradle) into contact with each other and supplying the electric power from the charging stand. Charge the next battery.

しかしながら、充電端子同士を接触させて接続する充電方式では、充電端子の汚れや、充電端子間への異物侵入により充電ができない場合がある。このような接触による給電が難しい環境下で用いられる可能性がある電子機器に対しては、最近は電磁誘導の原理を利用した非接触の電力供給を行うシステム、すなわち非接触電力伝送システムの需要が増加している。   However, in the charging method in which the charging terminals are connected to each other, charging may not be possible due to contamination of the charging terminals or entry of foreign matter between the charging terminals. For electronic devices that may be used in environments where power supply by contact is difficult, demand for systems that perform contactless power supply using the principle of electromagnetic induction, that is, contactless power transmission systems, has recently been increasing. Has increased.

非接触電力伝送システムでは、一般に、充電器等の送電側に第1のコイルを有する送信側装置を備え、携帯電子機器などの受電側に前記第1のコイルに電磁結合可能な第2のコイルを有する受信側装置を備え、前記第1のコイルと前記第2のコイル間の電磁結合を介して、前記送信側装置から前記受信側装置へ非接触の電力伝送を行っている。さらに、特許文献1に記載の非接触電力伝送システムでは、非接触電力伝送の安全性を確保するため、受電側の要求電力や異常時の送電停止等の情報を、前記第1のコイルと第2のコイル間を介して通信を行っている。具体的には、送信側装置から受信側装置に間欠的な仮送電を実行させ、仮送電の開始時点から所定時間内に、送信側装置が、仮送電を受けた受信側装置からのID認証情報を受信し、ID認証に成功すると、送信側装置から受信側装置に通常送電を実行するシステムである。   In a non-contact power transmission system, a second coil that generally includes a transmission-side device having a first coil on a power transmission side such as a charger and can be electromagnetically coupled to the first coil on a power reception side such as a portable electronic device. A non-contact power transmission is performed from the transmission side device to the reception side device via electromagnetic coupling between the first coil and the second coil. Furthermore, in the non-contact power transmission system described in Patent Document 1, in order to ensure the safety of non-contact power transmission, information such as the required power on the power receiving side and the power transmission stop in the event of an abnormality is transmitted to the first coil and Communication is performed between the two coils. Specifically, intermittent temporary power transmission is executed from the transmission-side apparatus to the reception-side apparatus, and the ID authentication from the reception-side apparatus that received the temporary power transmission is performed by the transmission-side apparatus within a predetermined time from the start of temporary power transmission. When the information is received and the ID authentication is successful, the system executes normal power transmission from the transmission side device to the reception side device.

特開2009−189231号公報JP 2009-189231 A

しかしながら、上記の特許文献1のシステムでは、ID認証に成功して送電状態になった後に、近傍に同様の受電側の製品を置いてしまった場合、その製品に内蔵されたコイルには第1のコイルからの電磁誘導により電圧が発生してしまう懸念がある。同様にID認証成功後に送電状態となった受電側の本体をすばやく入れ替える等の動作を行うと、通信を行わなければならない状態にも関わらず、受電側の製品は送電状態の環境下に晒されることになる。   However, in the system of Patent Document 1 described above, if a similar product on the power receiving side is placed in the vicinity after successful ID authentication and a power transmission state, the first coil is included in the coil incorporated in the product. There is a concern that voltage is generated by electromagnetic induction from the coil. Similarly, if an operation such as quickly replacing the power receiving side main body that has entered the power transmission state after successful ID authentication, the product on the power receiving side is exposed to the environment in the power transmission state regardless of the state in which communication must be performed. It will be.

非接触電力伝送における第2のコイルに発生する電圧は、標準的には20Vo−p〜60Vo−p程度であるのに対し、Felica(登録商標)方式やNFC方式に代表される非接触通信の場合、第2のコイルに発生する電圧は最大20Vo−p程度である。したがって非接触電力伝送中に近傍に通信状態の受電側の製品を置いた場合には、通信回路に印加される電圧が過電圧状態になり通信回路が破壊される可能性がある。   The voltage generated in the second coil in non-contact power transmission is typically about 20 Vo-p to 60 Vo-p, whereas non-contact communication represented by the Felica (registered trademark) system and the NFC system. In this case, the maximum voltage generated in the second coil is about 20 Vo-p. Therefore, when a product on the power receiving side in communication is placed in the vicinity during non-contact power transmission, the voltage applied to the communication circuit becomes an overvoltage state and the communication circuit may be destroyed.

一方、電力専用のコイルと通信専用のコイルを別々に設け、それぞれの機能を分離した場合は、過電圧による通信回路の破壊の可能性は殆どないが、製品コストの上昇を招き、コイル寸法の拡大により製品の小型化が制限される。   On the other hand, if a power-dedicated coil and a communication-dedicated coil are provided separately and their functions are separated, there is almost no possibility of destruction of the communication circuit due to overvoltage, but the product cost will increase and the coil size will increase. This limits the downsizing of the product.

本発明はこのような状況に鑑みてなされたものであり、本発明の課題は、通信用コイルと送電側の第1のコイル及び受電側の第2のコイルとの共通化が可能であって、かつ、第2のコイルに接続された通信回路への非接触電力伝送時における過電圧の印加を防ぎ、非接触電力伝送を行っていない時間では通信が可能となる非接触電力伝送及び通信システムを提供することにある。   The present invention has been made in view of such a situation, and the problem of the present invention is that the communication coil, the first coil on the power transmission side, and the second coil on the power reception side can be shared. And a non-contact power transmission and communication system capable of preventing application of overvoltage during non-contact power transmission to a communication circuit connected to the second coil and enabling communication in a time when non-contact power transmission is not performed. It is to provide.

上記課題を解決するため、本発明による非接触電力伝送及び通信システムは、第1のコイルを有する送信側装置と、前記第1のコイルに電磁結合可能な第2のコイルを有する受信側装置とを備え、前記第1のコイルと前記第2のコイル間の電磁結合を介して、前記送信側装置から前記受信側装置への非接触の電力伝送と、前記送信側装置と前記受信側装置間でのデータ信号の通信を行う非接触電力伝送及び通信システムにおいて、前記受信側装置は、前記データ信号を受信および送信する通信回路と、該通信回路と前記第2のコイルとを接続する入力接続回路とを備え、該入力接続回路は前記第2のコイルに発生する電圧に応じて動作するMOSFET半導体スイッチを備え、前記MOSFET半導体スイッチの動作によって前記通信回路に印加される電圧が変化することを特徴とする。   In order to solve the above-described problems, a non-contact power transmission and communication system according to the present invention includes a transmission-side device having a first coil, and a reception-side device having a second coil that can be electromagnetically coupled to the first coil. Non-contact power transmission from the transmitting device to the receiving device via electromagnetic coupling between the first coil and the second coil, and between the transmitting device and the receiving device In the non-contact power transmission and communication system for performing communication of data signals, the receiving-side device has a communication circuit that receives and transmits the data signal, and an input connection that connects the communication circuit and the second coil And the input connection circuit includes a MOSFET semiconductor switch that operates according to a voltage generated in the second coil, and the communication circuit is connected to the communication circuit by the operation of the MOSFET semiconductor switch. Wherein the voltage to be pressurized is changed.

ここで、前記通信回路は、少なくとも、前記データ信号が入力されるデータ読取端子、前記データ信号が出力されるデータ送信端子、およびグランドに接続された接地端子を有し、前記データ読取端子、前記データ送信端子および前記接地端子は前記入力接続回路に接続されていてもよい。   Here, the communication circuit includes at least a data reading terminal to which the data signal is input, a data transmission terminal to which the data signal is output, and a ground terminal connected to a ground, the data reading terminal, The data transmission terminal and the ground terminal may be connected to the input connection circuit.

この場合、前記入力接続回路の前記データ読取端子に直接、またはコンデンサまたはインダクタを介して接続される信号ラインとグランド間、および前記入力接続回路の前記データ送信端子に直接、またはコンデンサまたはインダクタを介して接続される信号ラインと前記グランド間には、それぞれ、抵抗値が10kΩ以下の抵抗と前記MOSFET半導体スイッチとが直列に挿入されていてもよい。   In this case, the signal line connected to the data reading terminal of the input connection circuit directly or between the signal line and the ground connected via a capacitor or inductor, and directly to the data transmission terminal of the input connection circuit or via the capacitor or inductor. A resistor having a resistance value of 10 kΩ or less and the MOSFET semiconductor switch may be inserted in series between the signal line connected to each other and the ground.

また、前記第2のコイルに発生した電圧を整流化し、該整流化した電圧を、抵抗により調整された分圧比による分圧と、コンデンサによる応答時定数の調整を行った後、前記MOSFET半導体スイッチのゲート端子に印加してもよい。   Further, after rectifying the voltage generated in the second coil, dividing the rectified voltage by a voltage dividing ratio adjusted by a resistor and adjusting a response time constant by a capacitor, the MOSFET semiconductor switch It may be applied to the gate terminal.

以上のように、本発明では、通信回路に接続される入力接続回路において、MOSFET半導体スイッチの動作によって通信回路に印加される電圧が変化することにより通信回路への過電圧印加を防止している。   As described above, according to the present invention, in the input connection circuit connected to the communication circuit, the voltage applied to the communication circuit is changed by the operation of the MOSFET semiconductor switch, thereby preventing the overvoltage application to the communication circuit.

本発明による非接触電力伝送及び通信システムは、上記のように送電側の第1のコイルと受電側の第2のコイル間を介して非接触電力伝送と通信の両方を行うことが可能であり、通信用コイルと第1のコイル及び第2のコイルを共用し、非接触電力伝送と通信を時分割で実施するシステムである。第2のコイルと通信回路とを接続する入力接続回路は、前記第2のコイルに発生する電圧に応じて通信回路へ印加される電圧を変化させるMOSFET半導体スイッチを備えており、その結果、通信回路への過電圧の印加を防止している。   The contactless power transmission and communication system according to the present invention can perform both contactless power transmission and communication through the first coil on the power transmission side and the second coil on the power reception side as described above. The communication coil, the first coil, and the second coil are shared, and non-contact power transmission and communication are performed in a time-sharing manner. An input connection circuit that connects the second coil and the communication circuit includes a MOSFET semiconductor switch that changes a voltage applied to the communication circuit in accordance with a voltage generated in the second coil. The application of overvoltage to the circuit is prevented.

すなわち、本発明により、通信用コイルと送電側の第1のコイル及び受電側の第2のコイルとの共通化が可能であって、かつ、第2のコイルに接続された通信回路への非接触電力伝送時における過電圧の印加を防ぎ、非接触電力伝送を行っていない時間では通信が可能となる非接触電力伝送及び通信システムが得られる。   That is, according to the present invention, the communication coil, the first coil on the power transmission side, and the second coil on the power reception side can be shared, and the communication circuit connected to the second coil is not connected to the second coil. An application of overvoltage during contact power transmission is prevented, and a contactless power transmission and communication system is obtained that enables communication in a time when contactless power transmission is not performed.

本発明による非接触電力伝送及び通信システムの一実施の形態の基本構成を示すブロック図。The block diagram which shows the basic composition of one Embodiment of the non-contact electric power transmission and communication system by this invention. 本実施の形態の非接触電力伝送及び通信システムの入力接続回路およびそれと通信回路との接続の具体的な一実施例を示す回路図。The circuit diagram which shows one specific Example of the connection of the input connection circuit of the non-contact electric power transmission and communication system of this Embodiment, and it and a communication circuit.

図1は、本発明による非接触電力伝送及び通信システムの一実施の形態の基本構成を示すブロック図である。図1に示すように、本実施の形態は、第1のコイル6を有する送信側装置19と、第1のコイル6に電磁結合可能な第2のコイル7を有する受信側装置20とを備え、第1のコイル6と第2のコイル7間の電磁結合を介して、送信側装置19から受信側装置20への非接触の電力伝送と、送信側装置19と受信側装置20間でのデータ信号の通信を行う非接触電力伝送及び通信システムであり、受信側装置20は、データ信号を受信および送信する通信回路23と、その通信回路23と第2のコイル7とを接続する入力接続回路24とを備え、入力接続回路24は第2のコイル7に発生する電圧に応じて動作するMOSFET半導体スイッチを備え、このMOSFET半導体スイッチの動作によって前記通信回路23に印加される電圧が変化するように構成されている。   FIG. 1 is a block diagram showing a basic configuration of an embodiment of a contactless power transmission and communication system according to the present invention. As shown in FIG. 1, the present embodiment includes a transmission side device 19 having a first coil 6 and a reception side device 20 having a second coil 7 that can be electromagnetically coupled to the first coil 6. , Non-contact power transmission from the transmission side device 19 to the reception side device 20 via the electromagnetic coupling between the first coil 6 and the second coil 7, and between the transmission side device 19 and the reception side device 20 It is a non-contact power transmission and communication system that performs communication of a data signal, and the receiving side device 20 receives and transmits a data signal, and an input connection that connects the communication circuit 23 and the second coil 7 The input connection circuit 24 includes a MOSFET semiconductor switch that operates in accordance with the voltage generated in the second coil 7, and the voltage applied to the communication circuit 23 varies depending on the operation of the MOSFET semiconductor switch. It is configured so that.

送信側装置19において、第1のコイル6に交流の磁界を発生させるため、これを励磁するための電力回路が、送電側電源1に接続されたインダクタ2、コンデンサ3、コンデンサ4及びスイッチング素子5により構成されている。この送電電力を発生させる電力回路をオンオフして電力波形にデータ信号を重畳させるため、およびデータ信号を受信するための回路が、受信用直列抵抗8に接続された信号送受信制御回路9、電力制御回路11及びスイッチング回路10により構成されている。   In the transmission side device 19, in order to generate an alternating magnetic field in the first coil 6, the power circuit for exciting this is the inductor 2, the capacitor 3, the capacitor 4 and the switching element 5 connected to the power transmission side power source 1. It is comprised by. A signal transmission / reception control circuit 9 connected to the receiving series resistor 8, a power transmission control circuit 9 for superimposing a data signal on the power waveform by turning on / off the power circuit for generating the transmission power and receiving the data signal, power control The circuit 11 and the switching circuit 10 are included.

受信側装置20では、第1のコイル6からの交流磁界を受ける第2のコイル7により非接触で受電した電力を二次電池18に充電するための受電回路が、整流回路15、DC/DCコンバータ16、電池充電制御回路17により構成されている。また、受信側装置20から送信側装置19へ充電情報等のデータを伝達するための通信回路23が、Loadスイッチ12、信号受信復調回路13、通信制御回路14により構成されている。   In the receiving-side device 20, the power receiving circuit for charging the secondary battery 18 with the non-contact power received by the second coil 7 that receives the AC magnetic field from the first coil 6 is the rectifier circuit 15, DC / DC A converter 16 and a battery charge control circuit 17 are included. In addition, a communication circuit 23 for transmitting data such as charging information from the reception side device 20 to the transmission side device 19 includes a load switch 12, a signal reception demodulation circuit 13, and a communication control circuit 14.

図2は、本実施の形態の非接触電力伝送及び通信システムの入力接続回路およびそれと通信回路との接続の具体的な一実施例を示す回路図である。図2に示すように入力接続回路24は、第2のコイル7の両端子に接続されたインピーダンスマッチング回路21及び過電圧保護回路22から構成されている。また、通信回路23として、通信回路23の機能を集積した通信制御集積回路25を設け、通信制御集積回路25はデータ信号が入力されるデータ読取端子としてRX端子26、データ信号が出力されるデータ送信端子としてTX1端子27及びTX2端子28、およびグランド(GND)に接続された接地端子29を有しており、これらの端子は入力接続回路24に接続されている。   FIG. 2 is a circuit diagram showing a specific example of the contactless power transmission and input connection circuit of the communication system according to the present embodiment and the connection between the input connection circuit and the communication circuit. As shown in FIG. 2, the input connection circuit 24 includes an impedance matching circuit 21 and an overvoltage protection circuit 22 connected to both terminals of the second coil 7. Further, as the communication circuit 23, a communication control integrated circuit 25 in which the functions of the communication circuit 23 are integrated is provided. The transmission terminal includes a TX1 terminal 27 and a TX2 terminal 28 and a ground terminal 29 connected to the ground (GND). These terminals are connected to the input connection circuit 24.

インピーダンスマッチング回路21はデータ読取端子のRX端子26及びデータ送信端子のTX1端子27及びTX2端子28に入力または出力される電圧波形のインピーダンスマッチングを取るために必要な回路である。   The impedance matching circuit 21 is a circuit necessary for impedance matching of voltage waveforms input to or output from the RX terminal 26 of the data reading terminal and the TX1 terminal 27 and the TX2 terminal 28 of the data transmission terminal.

Felica方式やNFC方式等による非接触通信中は、第2のコイル7の両端子に生じる電圧は最大20Vo−p程度であるが、非接触電力伝送中の電力受電時は、20Vo−p〜60Vo−p程度の電圧が発生している。非接触電力伝送中は、インピーダンスマッチング回路21のみの場合、通信制御集積回路25のRX端子26、TX1端子27及びTX2端子28に過電圧が印加され、最悪の場合は通信制御集積回路25の破損が考えられる。   During non-contact communication using the Felica method, NFC method, or the like, the voltage generated at both terminals of the second coil 7 is about 20 Vo-p at the maximum, but when receiving power during non-contact power transmission, 20 Vo-p to 60 Vo. A voltage of about −p is generated. During the non-contact power transmission, when only the impedance matching circuit 21 is used, an overvoltage is applied to the RX terminal 26, the TX1 terminal 27, and the TX2 terminal 28 of the communication control integrated circuit 25. In the worst case, the communication control integrated circuit 25 is damaged. Conceivable.

過電圧保護回路22は、通信制御集積回路25のRX端子、TX1及びTX2端子への過電圧の印加を防止する機能を有する回路である。入力接続回路24において、データ読取端子であるRX端子26にコンデンサを介して接続される信号ラインとグランド間、およびデータ送信端子であるTX1端子27及びTX2端子28にそれぞれインダクタを介して接続される信号ラインとグランド間には、それぞれ、抵抗値が10kΩ以下の抵抗31、32、33とMOSFET半導体スイッチ41、42、43とが直列に挿入されている。また、第2のコイル7に発生した電圧を整流化し、その整流化した電圧を、抵抗により調整された分圧比による分圧と、コンデンサによる応答時定数の調整を行った後、MOSFET半導体スイッチ41、42、43のゲート端子にそれぞれ印加している。   The overvoltage protection circuit 22 is a circuit having a function of preventing application of overvoltage to the RX terminal, the TX1 and the TX2 terminals of the communication control integrated circuit 25. In the input connection circuit 24, the signal line connected to the RX terminal 26, which is a data reading terminal, and the ground, and the TX1 terminal 27 and the TX2 terminal 28, which are data transmission terminals, are connected to each other via an inductor. Between the signal line and the ground, resistors 31, 32, 33 having a resistance value of 10 kΩ or less and MOSFET semiconductor switches 41, 42, 43 are inserted in series, respectively. Further, the voltage generated in the second coil 7 is rectified, and the rectified voltage is divided by the voltage division ratio adjusted by the resistor and the response time constant by the capacitor is adjusted, and then the MOSFET semiconductor switch 41 , 42 and 43 are respectively applied to the gate terminals.

図2において、第2のコイル7の両端子電圧が上昇すると、抵抗、ダイオード及びコンデンサを通してMOSFET半導体スイッチ41、42、43のそれぞれのゲート端子電位が上昇し、MOSFET半導体スイッチ41、42、43のそれぞれのドレイン端子とソース端子が導通する。その際、各信号ラインのMOSFET半導体スイッチ41、42、43が接続された点、すなわち図2のa、b、c点から、新たに過電圧保護回路22を経由してグランドに電流が流出する経路が生じる。この結果、通信制御集積回路25に接続された信号ラインのa、b、c点の電位が低下し、通信制御集積回路25に印加される電圧が低下する動作が得られる。なお、実用上、有効な電圧低下を得るためには、抵抗31、32、33の抵抗値は10kΩ以下であることが望ましい。   In FIG. 2, when both terminal voltages of the second coil 7 rise, the respective gate terminal potentials of the MOSFET semiconductor switches 41, 42, 43 rise through resistors, diodes and capacitors, and the MOSFET semiconductor switches 41, 42, 43 Each drain terminal and source terminal are conducted. At that time, a path through which current flows out to the ground newly via the overvoltage protection circuit 22 from the point where the MOSFET semiconductor switches 41, 42, 43 of each signal line are connected, that is, the points a, b, c in FIG. Occurs. As a result, an operation in which the potentials at points a, b, and c of the signal line connected to the communication control integrated circuit 25 are reduced and the voltage applied to the communication control integrated circuit 25 is reduced is obtained. In order to obtain a practically effective voltage drop, it is desirable that the resistance values of the resistors 31, 32, and 33 be 10 kΩ or less.

上記の実施の形態では、図2のa、b、c点の電位を低下させる場合を説明したが、通信制御集積回路25のRX、TX1、TX2端子に過電圧が印加されないようにすることを目的とする場合、RX、TX1、TX2端子に直結された信号ラインとグランド間に抵抗とMOSFET半導体スイッチを直列に接続しても同様の効果が得られる。   In the above embodiment, the case where the potentials at points a, b, and c in FIG. 2 are lowered has been described. However, the purpose is to prevent an overvoltage from being applied to the RX, TX1, and TX2 terminals of the communication control integrated circuit 25. In this case, the same effect can be obtained by connecting a resistor and a MOSFET semiconductor switch in series between the signal line directly connected to the RX, TX1, and TX2 terminals and the ground.

以上、本発明の実施の形態について説明したが、本発明は、上記の実施の形態以外にも、磁界を発生するコイルを備えたリーダライタ機能を有する通信装置と、磁界を電流に変換するコイルと充電可能なバッテリとを備えるデジタルカメラや携帯型音楽プレーヤなどの通信端末、または非接触ICカードとから構成される通信システムなどに広く適用することができる。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and the communication device having a reader / writer function including a coil that generates a magnetic field, and a coil that converts a magnetic field into an electric current. And a communication terminal such as a digital camera or a portable music player provided with a rechargeable battery or a non-contact IC card.

また、本発明の実施の形態は、上述した実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更が可能である。   The embodiments of the present invention are not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

1 送電側電源
2 インダクタ
3、4 コンデンサ
5 スイッチング素子
6 第1のコイル
7 第2のコイル
8 受信用直列抵抗
9 信号送受信制御回路
10 スイッチング回路
11 電力制御回路
12 Loadスイッチ
13 信号受信復調回路
14 通信制御回路
15 整流回路
16 DC/DCコンバータ
17 電池充電制御回路
18 二次電池
19 送信側装置
20 受信側装置
21 インピーダンスマッチング回路
22 過電圧保護回路
23 通信回路
24 入力接続回路
25 通信制御集積回路
26 RX端子
27 TX1端子
28 TX2端子
29 接地端子
31、32、33 抵抗
41、42、43 MOSFET半導体スイッチ
DESCRIPTION OF SYMBOLS 1 Power transmission side power supply 2 Inductor 3, 4 Capacitor 5 Switching element 6 1st coil 7 2nd coil 8 Receiving series resistance 9 Signal transmission / reception control circuit 10 Switching circuit 11 Power control circuit 12 Load switch 13 Signal reception demodulation circuit 14 Communication Control circuit 15 Rectifier circuit 16 DC / DC converter 17 Battery charge control circuit 18 Secondary battery 19 Transmission side device 20 Reception side device 21 Impedance matching circuit 22 Overvoltage protection circuit 23 Communication circuit 24 Input connection circuit 25 Communication control integrated circuit 26 RX terminal 27 TX1 terminal 28 TX2 terminal 29 Ground terminals 31, 32, 33 Resistors 41, 42, 43 MOSFET semiconductor switch

Claims (4)

第1のコイルを有する送信側装置と、前記第1のコイルに電磁結合可能な第2のコイルを有する受信側装置とを備え、前記第1のコイルと前記第2のコイル間の電磁結合を介して、前記送信側装置から前記受信側装置への非接触の電力伝送と、前記送信側装置と前記受信側装置間でのデータ信号の通信とを行う非接触電力伝送及び通信システムにおいて、前記受信側装置は、前記データ信号を受信および送信する通信回路と、該通信回路と前記第2のコイルとを接続する入力接続回路とを備え、該入力接続回路は前記第2のコイルに発生する電圧に応じて動作するMOSFET半導体スイッチを備え、該MOSFET半導体スイッチの動作によって前記通信回路に印加される電圧が変化することを特徴とする非接触電力伝送及び通信システム。   A transmission-side device having a first coil; and a reception-side device having a second coil that can be electromagnetically coupled to the first coil; and electromagnetic coupling between the first coil and the second coil. In the contactless power transmission and communication system for performing contactless power transmission from the transmission side device to the reception side device and communication of data signals between the transmission side device and the reception side device, The reception-side device includes a communication circuit that receives and transmits the data signal, and an input connection circuit that connects the communication circuit and the second coil, and the input connection circuit is generated in the second coil. A contactless power transmission and communication system comprising a MOSFET semiconductor switch that operates in response to a voltage, and the voltage applied to the communication circuit varies depending on the operation of the MOSFET semiconductor switch. 前記通信回路は、少なくとも、前記データ信号が入力されるデータ読取端子、前記データ信号が出力されるデータ送信端子、およびグランドに接続された接地端子を有し、前記データ読取端子、前記データ送信端子および前記接地端子は前記入力接続回路に接続されていることを特徴とする請求項1に記載の非接触電力伝送及び通信システム。   The communication circuit includes at least a data reading terminal to which the data signal is input, a data transmission terminal to which the data signal is output, and a ground terminal connected to a ground, and the data reading terminal and the data transmission terminal The contactless power transmission and communication system according to claim 1, wherein the ground terminal is connected to the input connection circuit. 前記入力接続回路の前記データ読取端子に直接、またはコンデンサまたはインダクタを介して接続される信号ラインとグランド間、および前記入力接続回路の前記データ送信端子に直接、またはコンデンサまたはインダクタを介して接続される信号ラインと前記グランド間には、それぞれ、抵抗値が10kΩ以下の抵抗と前記MOSFET半導体スイッチとが直列に挿入されていることを特徴とする請求項2に記載の非接触電力伝送及び通信システム。   Connected directly to the data reading terminal of the input connection circuit or between the signal line and ground connected via a capacitor or inductor, and directly to the data transmission terminal of the input connection circuit or via a capacitor or inductor 3. The contactless power transmission and communication system according to claim 2, wherein a resistor having a resistance value of 10 kΩ or less and the MOSFET semiconductor switch are inserted in series between each signal line and the ground. . 前記第2のコイルに発生した電圧を整流化し、該整流化した電圧を、抵抗により調整された分圧比による分圧と、コンデンサによる応答時定数の調整を行った後、前記MOSFET半導体スイッチのゲート端子に印加することを特徴とする請求項1〜3のいずれか1項に記載の非接触電力伝送及び通信システム。   The voltage generated in the second coil is rectified, and the rectified voltage is divided by a voltage dividing ratio adjusted by a resistor and a response time constant is adjusted by a capacitor, and then the gate of the MOSFET semiconductor switch The contactless power transmission and communication system according to claim 1, wherein the contactless power transmission and the communication system are applied to a terminal.
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