JP2011189695A - In-mold coating molding device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the productivity of a finished product to be formed by performing a film forming process on a resin molded form. <P>SOLUTION: This in-mold coating molding device comprises the following components: (1) a rotational mold mechanism 30 which is arranged between a fixed head 10 and a moving head 20, and movable to the fixed head 10 and the moving head 20 in a mold opening/closing direction and besides, rotatable centering on a rotating shaft 38 which is orthogonal to the mold opening/closing direction, and includes two rotational molds 34 and 36 opposite to the cavity side half 12 and the movable half 22 respectively at a first rotating position and a second rotating position which is located 180° around the first rotating position; (2) an injection unit 40 which is mounted on the fixed head 10 side in such a state that the injection unit 40 can be connected with the cavity side half 12 and further, which injects and packs a resin in a first cavity to be formed by clamping the cavity side half 12 and one of the rotational molds 34 of the rotational mold mechanism 30; and (3) a film forming device 50 which is arranged at the movable half 22 of the moving head 20 and forms a second cavity between the other rotational mold 34 of the rotational mold mechanism 30 and the movable half 22 and forms a film on a resin molded form inside a second cavity. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an in-mold coating molding apparatus and an in-mold coating molding method for molding a resin molded body and forming a metal film on the resin molded body.

  As a film forming method for forming a metal film on a part of the surface of a resin molded body such as plastic, for example, the resin molded body and the target are opposed to each other, and the target is several kV in a rare gas atmosphere of several Pa to several tens Pa. A sputtering method in which a negatively charged negative gas gas is discharged to cause a gas particle of a positively charged rare gas to collide with the target, and metal atoms are released from the target to form a film on a resin molded body. Vacuum deposition method for forming a film by housing a resin molded body and a vapor deposition source, and ion plating method for applying a negative voltage of several kV to the resin molded body and performing vacuum film formation under a pressure of a rare gas of several Pa In addition, a chemical film forming method for forming a metal film using a chemical reaction using a compound gas containing metal atoms is known.

  Conventionally, when a metal film is formed on the surface of a resin molded body by such a film forming method, batch processing is performed in which a plurality of pre-molded resin molded bodies are placed in a film forming apparatus and a plurality of films are simultaneously formed. The method is done. However, this batch processing method requires a large film forming apparatus, an excessive vacuum equipment capacity, a long film forming time, and uniform product quality. There is a problem of not becoming.

  On the other hand, there is known an in-mold coating molding apparatus capable of molding a resin molded body and forming a metal film on the resin molded body in one apparatus (see Patent Documents 1 and 2). In this in-mold coating molding apparatus, a movable mechanism is provided with a slide mechanism, a plurality of combinations of cavities are formed between the movable mold and the fixed mold, and a resin molded body is molded by filling the cavities with resin. Thereafter, a metal film is formed on a part of the resin molded body by sliding the movable mold to which the resin molded body is adhered to a position of a film forming apparatus provided on the fixed mold side.

  On the other hand, as a laminating and forming apparatus used for molding a laminated molded product in which a plurality of materials or colors of resins are laminated, a fixed platen, a rotating plate and a movable platen are arranged in the mold opening / closing direction, and a mold is placed on both sides of the rotating plate. In addition to the above, there is known a structure in which a rotating disk is configured to be capable of rotating a shaft (see Patent Documents 3 and 4). In this laminated molding apparatus, in either one of a cavity formed by a fixed plate mold and one mold of a rotating plate and a cavity formed by a mold of a movable plate and the other mold of the rotating plate Primary injection molding is performed, and at the same time, secondary injection molding is performed in the other cavity.

JP 2004-338328 A JP 2008-73897 A Japanese Patent Publication No. 03-51207 JP 2006-168223 A

  However, in the in-mold coating molding apparatus described in Patent Documents 1 and 2, the molding of the resin molded body and the film forming process on the resin molded body cannot be performed at the same time, and it is necessary to perform these processes separately. Therefore, there is a problem that the molding cycle time for producing one product becomes long and the productivity is poor. Moreover, the lamination molding apparatus of patent document 3 and 4 can only perform shaping | molding of a lamination molded product, and cannot perform the film-forming process to a resin molding.

  Therefore, an object of the present invention is to provide an in-mold coating molding apparatus and an in-mold coating molding method in which the productivity of a product formed by performing a film forming process on a resin molded body is improved.

  In order to achieve the above object, an in-mold coating molding apparatus according to the present invention includes a stationary platen to which a stationary die is attached, and a movable die attached to a surface opposite to the stationary die, with respect to the stationary platen. A movable plate provided to be movable in the mold opening / closing direction, and disposed between the fixed plate and the movable plate, movable in the mold opening / closing direction with respect to the fixed plate and the movable plate, and orthogonal to the mold opening / closing direction. There are two rotary molds provided so as to be rotatable about a rotation axis and facing the fixed mold and the movable mold at a first rotation position and a second rotation position rotated by 180 ° from the first rotation position, respectively. A first rotating die mechanism is mounted on the fixed platen side so as to be connectable to the fixed die, and is formed by clamping the fixed die and one of the rotary die mechanisms. Injection filling resin into the cavity Forming a second cavity between the injection unit and the movable mold of the movable plate, and forming a film on the resin molded body in the second cavity. And a film forming apparatus for performing the process.

  In the in-mold coating molding apparatus according to the present invention, the film forming apparatus includes: a decompression unit that puts the second cavity in a vacuum state; a gas injection unit that injects a rare gas into the second cavity in the vacuum state; It is preferable to include a target capable of releasing a gas, and a voltage applying unit that applies a voltage between the target and the resin molded body.

  In the in-mold coating molding apparatus according to the present invention, it is preferable that the rotary mold of the rotary mold mechanism is formed with a circulation path through which cooling water for cooling the rotary mold can be circulated.

  According to the in-mold coating molding apparatus of the present invention, a rotatable rotation provided with two rotary molds capable of forming a first cavity and a second cavity by clamping with a fixed mold and a film forming apparatus, respectively. The mold mechanism is provided, and the film forming apparatus is provided on the movable mold of the movable platen, so that the resin molded body molded in the first cavity is conveyed to the film forming apparatus side by the rotation operation of the rotary mold mechanism, and the second cavity In addition, a new resin molded body can be formed by forming a first cavity between another rotary mold and a fixed mold of the rotary mold mechanism. One product obtained by performing the film forming process can be produced for each mold opening / closing operation, and the productivity of the product can be improved.

  An in-mold coating molding method according to the present invention is an in-mold coating molding method performed using the in-mold coating molding apparatus, wherein the fixed mold, the movable mold, and the rotating mold of the rotating mold mechanism are respectively provided. A mold clamping step of clamping and forming the first cavity and the second cavity, a resin molding step of filling a resin into the first cavity and molding a resin molded body after the mold clamping step, and the resin In parallel with the molding step, a film forming step of performing a film forming process on the resin molded body formed in the rotary mold of the rotary mold mechanism in the resin molding step of the previous step in the second cavity, the resin molding step, After the film formation step, the movable platen and the rotary type mechanism are opened, and a product take-out step for taking out the resin molded body subjected to the film formation process in the film formation step, and the rotary type mechanism are rotated. The resin molded body formed by serial resin molding process, characterized in that it comprises a rotating step of conveying the film forming apparatus.

  In the in-mold coating molding method according to the present invention, the film forming step includes a depressurization step of bringing the second cavity into a vacuum state, and a gas injection step of injecting a rare gas into the second cavity after the depressurization step, And a voltage applying step of applying a voltage between the target and the resin molding after the gas injection step.

  According to the in-mold coating molding method of the present invention, the resin molding step of molding the resin molded body in the first cavity and the film forming step of performing the film forming process on the resin molded body in the second cavity are performed in parallel. Therefore, one product obtained by performing a film forming process on the resin molded body can be produced for each mold opening / closing operation, and the productivity of the product can be improved.

  As described above, according to the present invention, it is possible to provide an in-mold coating molding apparatus and an in-mold coating molding method that improve the productivity of a product formed by performing a film forming process on a resin molded body. .

It is explanatory drawing which shows the whole main structure of the in-mold coating shaping | molding apparatus which concerns on one Embodiment of this invention. It is explanatory drawing which shows the initial mold clamping process of the in-mold coating shaping | molding method which concerns on this embodiment. It is explanatory drawing which shows the rotation process of the in-mold coating shaping | molding method which concerns on this embodiment. It is explanatory drawing which shows the clamping process of the in-mold coating shaping | molding method which concerns on this embodiment. It is explanatory drawing which shows the pressure_reduction | reduced_pressure process of the resin molding process and the film-forming process of the in-mold coating molding method which concerns on this embodiment. It is explanatory drawing which shows the gas injection | pouring process of the resin molding process and film-forming process of the in-mold coating molding method which concerns on this embodiment. It is explanatory drawing which shows the voltage application process of the resin molding process and the film-forming process of the in-mold coating molding method which concerns on this embodiment. It is explanatory drawing which shows the state which shape | molded the resin molding of the in-mold coating shaping | molding method concerning this embodiment, and formed the metal film. It is explanatory drawing which shows the mold opening process of the in-mold coating shaping | molding method which concerns on this embodiment. It is explanatory drawing which shows the product taking-out process of the in-mold coating shaping | molding method which concerns on this embodiment.

  Next, an in-mold coating molding apparatus and an in-mold coating molding method according to an embodiment of the present invention will be described with reference to the drawings. First, the configuration of the in-mold coating molding apparatus 1 according to the present embodiment will be described with reference to FIG. FIG. 1 is an explanatory view showing the entire main structure of the in-mold coating molding apparatus according to this embodiment.

  An in-mold coating molding apparatus 1 according to the present embodiment is an in-mold coating molding apparatus that performs a film forming process by a sputtering method. As illustrated in FIG. 1, a stationary platen 10 fixed to a bed 2 and a stationary platen 10. A movable platen 20 movably provided in the mold opening / closing direction, a rotary type mechanism 30 provided between the fixed platen 10 and the movable platen 20 so as to be movable and rotatable in the mold opening / closing direction, and a fixed platen. 10 is provided with an injection unit 40 mounted on the back surface side, and a film forming apparatus 50 provided on the movable platen 20.

  A fixed mold 12 is attached to the fixed platen 10 at the center of the surface on the front side (the side facing the movable platen 20), and the nozzle 42 of the injection unit 40 is directed to the fixed mold 12 from the back side to the front side. A through-hole 16 for mounting is formed. The fixed mold 12 is formed with a resin flow path 13 for introducing the resin injected from the injection unit 40 into the first cavity formed by the fixed mold 12.

  A movable mold 22 constituting the film forming apparatus 50 is attached to the movable platen 20 at the center of the surface of the fixed platen 10 facing the fixed mold 12, and the fixed platen 10 is fixed by a mold clamping mechanism (not shown). The rotary mold mechanism 30 is installed so as to be movable in the mold opening / closing direction. The movable mold 22 has a concave portion 27 for forming a second cavity serving as a film forming chamber at the center thereof, an outflow passage 23 for exhausting from the second cavity, and for introducing gas into the second cavity. Inflow passage 24 is formed. Further, the movable mold 22 has an O-ring 25 that seals between the rotary mold mechanism 30 when the mold is clamped, and a region of the surface of the resin molded body that is a film formation target that is not subjected to film formation. A sealing member 26 for masking is provided.

  The rotary mechanism 30 includes a rotary plate 32 having surfaces facing the fixed platen 10 and the movable platen 20, and a convex first rotary die 34 and a rotary plate 32 provided at the center of one surface of the rotary plate 32. A convex second rotary mold 36 provided at the center of the other surface of the second rotary die 36, and a rotary shaft 38 connected to the rotary disk 32. The rotary type mechanism 30 includes a rotary mechanism 37 that rotates the rotary plate 32 around the rotary shaft 38, and a moving mechanism 39 that supports the rotary plate 32 so as to be movable in the mold opening / closing direction. Further, the rotary mechanism 30 is provided with an unillustrated extrusion device, and the resin molded body can be removed from the rotary mold. The first rotary mold 34 and the second rotary mold 36 are formed in the same shape and size. The first rotary mold 34 and the second rotary mold 36 are formed with circulation paths 35a and 35b through which cooling water for cooling them is circulated. The rotation mechanism 37 has a support mechanism constituted by, for example, a circumferential guide that can support and rotate the load of the rotating disk 32 including the first rotation mold 34 and the second rotation mold 36. It is preferable that the rotating disk 32 can be rotated around the rotation shaft 38 at an arbitrary movement position by an independent driving device such as a servo motor. The moving mechanism 39 has a linear guide mechanism composed of, for example, a combination of a ball screw, a ball screw nut, and a linear guide, and moves the rotating disk 32 in the mold opening / closing direction. It is preferable that it can hold | maintain.

  The fixed mold 12 of the fixed platen 10 and the first rotary mold 34 and the second rotary mold 36 of the rotary mold mechanism 30 are each formed so that a first cavity capable of molding a resin molded body is formed when the mold is clamped. It is formed in a simple shape. Further, the movable mold 22 of the movable platen 20, the first rotating mold 34 and the second rotating mold 36 of the rotating mechanism 30 are the first rotating mold 34 and the second rotating mold 36 of the rotating mold mechanism 30 to be clamped. When the mold is clamped in a state where the resin molded body remains as a semi-finished product, the surface of the resin molded body to be subjected to the film forming process and the concave portion 27 of the movable mold 22 of the movable platen 20 It is formed in a shape that forms a second cavity that functions as a film forming chamber.

  The injection unit 40 includes a nozzle 42 that is connected to the fixed mold 12 by being inserted into the through hole 16 of the fixed platen 10, and injects and fills the molten resin into the first cavity via the resin flow path 13 of the fixed mold 12. Is. The injection unit 40 may be configured to perform an advance / retreat operation with respect to the fixed mold 12 or may be configured to be always connected to the fixed mold 12.

  The film forming apparatus 50 performs a film forming process in the second cavity. In addition to the movable mold 22 attached to the movable platen 20, the film forming apparatus 50 circulates through the outflow passage 23 of the movable mold 22, and the second cavity is evacuated. The pressure reducing means 52 to be in a state, the gas injection means 54 for injecting a rare gas such as argon gas into the second cavity, and the inflow path 24 of the movable mold 22 of the movable plate 20; A target 56 provided at the bottom and capable of releasing metal atoms, and a voltage applying means 58 capable of applying a negative high voltage to the target 56 are provided. The decompression means 52 includes a vacuum tank 52a and a vacuum pump 52b, and drives the vacuum pump 52b to bring the second cavity into a vacuum state. The gas injection means 54 is provided with a gas tank 54a and a valve 54b for opening and closing the gas tank 54a, and injecting and stopping rare gas by opening and closing the valve 54a. The target 56 is made of, for example, a metal such as titanium or chromium, and emits metal atoms by collision with rare gas particles when a high voltage is applied to the second cavity. The voltage applying means 58 applies a negative high voltage to the target 56.

  Next, an in-mold coating molding method using the in-mold coating molding apparatus 1 according to the present embodiment will be described with reference to FIG. 2A to I are process diagrams showing a molding method using the in-mold coating molding apparatus according to this embodiment.

  First, as shown in FIG. 2A, the movable platen 20 and the rotary mold mechanism 30 are moved in the mold clamping direction by a mold clamping mechanism (not shown), and the fixed mold 12 of the fixed platen 10 and the first rotary mold 34 of the rotary mold mechanism 30. The second rotary mold 36 of the rotary mold mechanism 30 and the movable mold 22 of the movable board 20 are clamped. Thereafter, resin is injected and filled from the injection unit 40 into the first cavity C1 formed by clamping the fixed mold 12 and the first rotating mold 34 through the resin flow path 13 of the fixed mold 12, and the resin molded body 62 is filled. Is molded. After the cooling and solidifying time of the resin molded body 62 elapses, the movable plate 20 and the rotary mold mechanism 30 are moved from the fixed plate 10 in a state where the resin molded body 62 remains as a semi-finished product in the first rotary mold 34 by a mold clamping mechanism (not shown). The fixed mold 12, the first rotating mold 34, the second rotating mold 36, and the movable mold 22 are opened by moving in the separating direction.

  Next, as shown in FIG. 2B, the rotation mechanism 37 of the rotary mold mechanism 30 is rotated by 180 °, and the resin molded body 62 remaining as a semi-finished product on the first rotary mold 34 of the rotary mold mechanism 30 is formed into a film forming apparatus. It conveys to the 50 side (rotation process).

  Next, as shown in FIG. 2C, the movable platen 20 and the rotary mold mechanism 30 are moved in the mold clamping direction by a mold clamping mechanism (not shown), and the fixed mold 12 of the fixed platen 10 and the second rotary mold of the rotary mold mechanism 30 are moved. 36. The first rotary mold 34 of the rotary mold mechanism 30 and the movable mold 22 of the movable platen 20 are clamped (mold clamping process). Thus, a first cavity C1 is formed between the fixed mold 12 and the second rotary mold 36, and specifically between the movable mold 22 and the first rotary mold 34, specifically, the movable mold 22 and the first rotary mold. A second cavity C <b> 2 is formed between the surface of the resin molded body 62 attached to 34. At this time, a gap between the movable mold 22 and the first rotating mold 34 is sealed by an O-ring 25 provided in the movable mold 22 so that noble gas leaks, and the movable mold 22 and the first rotating mold 34 are semi-finished. By sealing with the sealing member 26 provided in the movable mold | type 22 between the surfaces of the remaining resin molding 62, the area | region which does not perform film-forming processing among the surfaces of the resin molding 62 is masked. .

  Next, as shown in FIGS. 2D to 2G, the first cavity C1 formed by clamping of the fixed mold 12 and the second rotary mold 36 enters the first cavity C1 from the injection unit 40 via the resin flow path 13 of the fixed mold 12. Resin is injected and filled to mold the resin molded body 62 'in the first cavity C1 (resin molding step). At the same time, a film is formed on a part of the surface of the resin molded body 62 attached to the first rotary mold 34 in the second cavity C2 formed by clamping the movable mold 22 and the first rotary mold 34. Processing is performed (film formation step).

  Specifically, in this film forming process, first, as shown in FIG. 2D, the vacuum pump 52b of the decompression means 52 of the film forming apparatus 50 is driven, thereby causing the second through the outflow passage 23 of the movable mold 22. The inside of the cavity C2 is depressurized, and the inside of the second cavity C2 sealed by the O-ring 25 is evacuated (decompression step). Next, as shown in FIG. 2E, by opening the valve 54b of the gas injection means 54 of the film forming apparatus 50, a first vacuum state from the gas tank 54a of the gas injection means 54 via the inflow path 24 of the movable mold 22 is obtained. A rare gas is injected into the two cavities C2, and the second cavity C2 is set to a rare gas atmosphere of about several Pa to several tens Pa (gas injection step). Next, as shown in FIG. 2F, the cooling water is circulated through the circulation path 35b of the second rotary mold 36 of the rotary mechanism 30 to suppress the generation of heat in the second cavity C2, and the film forming apparatus 50 By applying a negative voltage of about several kV to the target 56 provided in the concave portion 27 of the movable mold 22 of the movable platen 20 by the voltage applying means 58, the second cavity C2 is discharged (voltage application step). Then, the noble gas particles that are ionized by the discharge in the second cavity C2 and have a positive charge are attracted to and collide with the target 56 to which a negative voltage is applied. The formed metal atoms adhere to the unmasked surface of the resin molded body 62 attached to the first rotary mold 34, and a metal film 64 is formed on the surface of the resin molded body 62 (see FIG. 2G).

  Next, after the cooling and solidifying time of the resin molded body 62 ′ has elapsed, as shown in FIG. 2H, a product 60 formed by applying a metal film 64 to the surface of the resin molded body 62 by a mold clamping mechanism (not shown). Is moved to the direction away from the fixed plate 10 with the resin mold 62 'remaining on the second rotary die 36 and the fixed mold 12 being moved away from the fixed plate 10. The second rotating mold 36, the first rotating mold 34, and the movable mold 22 are opened.

  Next, as shown in FIG. 2I, the product 60 remaining in the first rotary mold 34 is taken out by an unillustrated extrusion device and product take-out device (product take-out step). After the product 60 is taken out, the rotation mechanism 37 of the rotary mold mechanism 30 is rotated, and the resin molded body 62 ′ remaining as a semi-finished product in the second rotary mold 36 of the rotary mold mechanism 30 is conveyed to the film forming apparatus 50 side. (See FIG. 2B). In this way, after that, by repeating the molding cycle from the state of FIG. 2B to the state of FIG. 2I, the product 60 formed by applying the metal film 64 to a part of the surface of the resin molded bodies 62, 62 ′. Can be formed continuously.

  According to the in-mold coating molding apparatus 1 according to the present embodiment, the resin molded bodies 62 and 62 ′ molded in the first cavity C1 by the rotation operation of the rotary mold mechanism 30 are conveyed to the film forming apparatus 50 side, and the first A film forming process can be performed in the two cavities C2, and the first cavity C1 is formed between one of the first rotary mold 34 and the second rotary mold 36 of the rotary mold mechanism 30 and the fixed mold, and a new resin is formed. Since the molded bodies 62 and 62 ′ can be molded, one product 60 obtained by performing a film forming process on the resin molded bodies 62 and 62 ′ can be produced for each mold opening and closing operation. Product productivity can be improved.

  Further, in the conventional batch processing method, when a film forming process is partially performed on the surface of the resin molded body, it is necessary to mask each individual resin molded body in advance. According to the coating molding apparatus 1, the movable mold 22 attached to the movable platen 20 includes the concave portion 27 and the sealing member 26 having a function of sealing and masking, so that each resin molded body is masked in advance. Without any problem, the shape of the concave portion 27 of the movable mold 22 and the seal member 26 can mask the areas of the resin molded bodies 62 and 62 ′ that are not subjected to film formation.

  Furthermore, in the conventional batch processing method, since a plurality of resin molded bodies are put into a film forming apparatus to perform the film forming process, a large chamber volume is required, and accordingly, an excessive pressure reducing means (vacuum equipment capacity) is required. However, according to the in-mold coating molding apparatus 1 according to the present embodiment, the movable mold 22 attached to the movable platen 20 and one of the first rotating mold 34 and the second rotating mold 36 of the rotating mold mechanism 30. Since the film forming process is performed in the second cavity formed by clamping, the chamber (cavity) volume can be made compact, the vacuum suction time can be shortened, and the pressure reducing means can be downsized.

  According to the in-mold coating molding method according to the present embodiment, since the film forming process is performed in the second cavity immediately after the resin molding process in the first cavity by the rotational operation of the rotary mold mechanism 30, the resin molding by the resin molding process is performed. The adhesion force of the metal film 64 in the film forming process can be obtained by utilizing the resin latent heat of the bodies 62 and 62 '.

  Further, according to the in-mold coating molding method according to the present embodiment, since the resin molding process in the first cavity and the film forming process in the second cavity can be performed simultaneously, for example, as shown in FIG. Mold cooling for cooling the bodies 62 and 62 'can be combined with cooling for suppressing heat generation due to sputtering (molecular collision), and the molding cycle can be shortened.

  The in-mold coating molding apparatus according to the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the technical idea of the present invention. For example, the first rotary type and the second rotary type of the rotary type mechanism 30 may be configured not to include the first rotary type and the second rotary type by forming the shape of the rotary disk into a cavity shape.

  Moreover, although the in-mold coating molding apparatus 1 according to the present embodiment is an in-mold coating molding apparatus that performs a film forming process by a sputtering method, the present invention is not limited thereto, and examples thereof include a vacuum deposition method, an ion plating method, and An in-mold coating molding apparatus that performs a film forming process by a known film forming method such as a chemical film forming method may be used. In this case, the film forming apparatus 50 of the in-mold coating molding apparatus 1 may employ a film forming apparatus that is generally used for known film forming methods such as a vacuum deposition method, an ion plating method, and a chemical film forming method.

  DESCRIPTION OF SYMBOLS 1 In-mold coating molding apparatus, 10 Fixed platen, 12 Fixed type | mold, 20 Movable platen, 22 Movable type | mold, 30 Rotary type | mold mechanism, 32 Rotary platen, 34 1st rotary type | mold, 36 2nd rotary type | mold, 40 Injection unit, 50 formation Membrane device

Claims (5)

A fixed plate with a fixed mold attached thereto;
A movable plate is attached to a surface facing the fixed die, and is provided so as to be movable in a mold opening / closing direction with respect to the fixed plate;
The first plate is disposed between the fixed plate and the movable plate, is movable in a mold opening / closing direction with respect to the fixed plate and the movable plate, and is rotatable about a rotation axis perpendicular to the mold opening / closing direction. A rotary mechanism provided with two rotary molds respectively facing the fixed mold and the movable mold at a rotational position and a second rotational position rotated 180 ° from the first rotational position;
Injection injecting and filling resin into a first cavity that is mounted on the fixed platen side so as to be connectable to the fixed mold, and is formed by clamping the fixed mold and one rotary mold of the rotary mold mechanism. Unit,
A film forming apparatus that is provided on the movable mold of the movable plate and forms a second cavity with the other rotary mold of the rotary mechanism and performs a film forming process on the resin molded body in the second cavity And an in-mold coating molding apparatus. The film forming apparatus includes:
Decompression means for evacuating the second cavity;
A gas injection means for injecting a rare gas into the second cavity in the vacuum state;
A target capable of releasing metal atoms,
The in-mold coating molding apparatus according to claim 1, further comprising: a voltage applying unit that applies a voltage between the target and the resin molded body.   3. The in-mold coating molding apparatus according to claim 1, wherein the rotary mold of the rotary mold mechanism is provided with a circulation path through which cooling water for cooling the rotary mold can be circulated. An in-mold coating molding method performed using the in-mold coating molding apparatus according to claim 1,
A mold clamping step of clamping the fixed mold and the movable mold and the rotary mold of the rotary mold mechanism, respectively, to form the first cavity and the second cavity;
After the mold clamping step, a resin molding step of filling the first cavity with resin to mold a resin molded body,
In parallel with the resin molding step, a film forming step of performing a film forming process on the resin molded body formed on the rotary mold of the rotary mold mechanism in the resin molding step of the previous step in the second cavity;
After the resin molding step and the film forming step, the movable plate and the rotary mold mechanism are opened, and a product take-out step for taking out the resin molded body that has been subjected to film formation in the film forming step;
A rotation step of rotating the rotary mold mechanism and transporting the resin molded body molded in the resin molding step to the film forming apparatus side. The film forming step includes
A depressurizing step of evacuating the second cavity;
A gas injection step of injecting a rare gas into the second cavity after the decompression step;
5. The in-mold coating molding method according to claim 4, further comprising a voltage application step of applying a voltage between the target and the resin molded body after the gas injection step.

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