JP2011258606A - Led light emitting element and led light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light emitting element capable of improving luminous efficiency by reducing components exposed on a light emitting surface side while reducing the number of manufacturing steps in manufacturing an LED light emitting device using the LED light emitting element.SOLUTION: The LED light emitting element includes: an LED chip emitting light in a predetermined wavelength range from a visible light region to a near ultraviolet region; a wiring board having a plurality of through holes formed therein and having a wiring pattern for mounting the LED chip thereon to constitute an electric circuit including the LED chip; and a plurality of metal pin members, each of which is inserted in each of the through holes and electrically connected with the wiring pattern.

Description

  The present invention relates to an LED light emitting element using an LED chip that emits light in a predetermined wavelength range from a visible light region to a near ultraviolet region, and an LED light emitting device using the LED light emitting element.

  LED light emitting elements using LED chips have been widely used as light sources for various lighting devices and display devices. In addition, a plurality of LED light emitting elements that employ LED chips having different emission colors, such as a red LED light emitting element, a green LED light emitting element, and a blue LED light emitting element, are combined, and the drive current supplied to each LED light emitting element is adjusted. Thus, Patent Document 1 discloses a light-emitting device that obtains desired white light by synthesizing light emitted from each LED light-emitting element.

  In addition, an LED light emitting element has been developed in which light emitted from an LED chip is converted after being wavelength-converted by a phosphor, and a light emitting device in which such LED light emitting elements are combined is disclosed in, for example, Patent Document 2. . In the light emitting device of Patent Document 2, a blue LED light emitting element that emits blue light using a blue LED chip and a green phosphor that emits green light when excited by the blue light emitted from the blue LED chip are combined with the blue LED chip. A green LED light emitting element and a red LED light emitting element in which a red phosphor that is excited by blue light emitted from a blue LED chip and emits red light is combined with the blue LED chip are used. The blue LED light emitting element, the green LED light emitting element and the red LED light emitting element each ensure excellent color rendering by combining light emitted from each of the blue LED light emitting elements and the light emission color of the light emitting device by adjusting the light output of each light emitting unit. Can be changed in various ways.

  In addition, instead of the light emitting device that obtains white light by combining the light emitted by the blue LED light emitting element, the green LED light emitting element, and the red LED light emitting element, a red phosphor, a green phosphor, and a blue phosphor are mixed. Patent Document 3 discloses a light-emitting device that obtains desired white light by wavelength-converting light emitted from an LED light-emitting element with a formed wavelength conversion member. In this light-emitting device, a near-ultraviolet LED chip that emits near-ultraviolet light is used, and a red phosphor, a green phosphor, and a blue phosphor so as to convert the wavelength of the near-ultraviolet light emitted from the near-ultraviolet LED chip into desired white light. A wavelength conversion member combined with is used. The wavelength conversion member has a first wavelength conversion member in which phosphors are combined so that white light having a desired color temperature can be obtained, and white light having a color temperature different from that of the first wavelength conversion member can be obtained. Thus, it consists of the 2nd wavelength conversion member with which each fluorescent substance was combined. In correspondence with the first wavelength conversion member and the second wavelength conversion member, a plurality of near-ultraviolet LED chips are arranged in a row to constitute a light emitting device.

  In the light emitting device configured in this manner, the fluorescence of the first wavelength conversion member is adjusted by adjusting the power supplied to the near-ultraviolet LED chips in one row and the power supplied to the near-ultraviolet LED chips in the other row. White light adjusted to an arbitrary color temperature between the color temperature of white light emitted by the body and the color temperature of white light emitted by the phosphor of the second wavelength conversion member can be obtained.

JP 2006-4839 A JP 2007-122950 A International Publication No. 2009/063915 Pamphlet

  In these light emitting devices, not only the LED chip and the wavelength conversion member are arranged on the wiring pattern formed on the wiring substrate to configure the LED light emitting element, but also this substrate is fixed in the light emitting device, Wiring with a colored coated electric wire for supplying power to the LED light emitting element or the like must be performed from the outside on the wiring pattern on the wiring board. For this reason, the manufacturing man-hour of a light-emitting device increases, and it becomes a hindrance to cost reduction, and also there exists a problem that the light emission efficiency of a light-emitting device falls because wiring is exposed to the light emission surface side of a light-emitting device.

  Further, when a plurality of LED light emitting elements are used in combination as in the above-described light emitting device, wiring from the outside is required for each LED light emitting element. The problem of decline becomes significant.

  This invention is made | formed in view of such a subject, The place made into the objective reduces while reducing the manufacturing man-hour at the time of manufacturing an LED light-emitting device using an LED light-emitting element, and it exposes to the light emission surface side. An object of the present invention is to provide an LED light-emitting element capable of improving luminous efficiency by reducing members, and an LED light-emitting device using such an LED light-emitting element.

  In order to achieve the above object, an LED light emitting device of the present invention includes an LED chip that emits light in a predetermined wavelength range from a visible light region to a near ultraviolet region, and an electric device including the LED chip to which the LED chip is attached. A wiring board having a wiring pattern for constituting a circuit, and a plurality of metal pin members which are respectively inserted into the through holes and electrically connected to the wiring pattern, and a wiring board having a plurality of through holes formed therein It is characterized by providing.

  According to the LED light-emitting element configured as described above, when manufacturing a light-emitting device using the LED light-emitting element, the electrical connection between the LED light-emitting element and the outside is a metal inserted in the through hole of the wiring board. This can be done via a pin member.

  Moreover, the LED light emitting element comprised in this way may further be provided with the wavelength conversion member which carries out wavelength conversion of the light which the said LED chip emits, and radiates | emits. In this case, the LED light emitting element wavelength-converts the light emitted from the LED chip with the wavelength conversion member, and radiates the light after wavelength conversion to the outside.

  The wiring board used for the LED light emitting element may include a substrate body made of a metal plate and an insulating film formed on the surface of the substrate body to electrically insulate the wiring pattern from the substrate body. It is. In this case, the metal pin member is inserted into the through hole with an insulator interposed between the metal pin member and the substrate body.

  Alternatively, instead of this, a wiring board used for the LED light emitting element can be formed by forming the wiring pattern on a substrate body made of an insulator. In this case, the substrate body may be further formed of an electrically insulating flexible body.

  The metal pin member may have a flat flange portion at one end and may be tapered at the other end side. In this case, the metal pin member is inserted into the through hole from the other end side, and the flange portion is in contact with the wiring board.

  The wiring board includes a first surface on which the LED chip is mounted and a second surface on the back side of the first surface, and the metal pin member is the first surface of the wiring board. The flange may be located at the same time, and the other end may protrude from the second surface of the wiring board. In this case, electrical connection between the outside of the LED light emitting element and the metal pin member is performed on the back side of the first surface on which the LED chip is mounted, that is, the side opposite to the light emitting surface of the LED light emitting element.

  In place of this, a metal that corresponds to the case where electrical connection with the outside of the LED light emitting element must be performed on the light emitting surface side of the LED light emitting element due to the convenience of the other party incorporating the LED light emitting element, etc. In the pin member, the flange may be located on the second surface of the wiring board, and the other end may protrude from the first surface of the wiring board. In this case, electrical connection between the outside of the LED light emitting element and the metal pin member is performed on the first surface on which the LED chip is mounted, that is, the light emitting surface side of the LED light emitting element.

  Moreover, both ends of the metal pin member may be tapered, and the metal pin member may be fitted into the through hole so as to protrude from both surfaces of the wiring board.

  When mounting a plurality of LED chips, which are divided into a first LED chip and a second LED chip, on the wiring board as LED chips, there are various modes of LED light emitting elements according to the number of metal pin members mounted on the wiring board. can get.

  For example, four through holes are formed in the wiring board, and the metal pin member is a first metal pin member, a second metal pin member, and a third metal pin member that are inserted into the four through holes. And the fourth metal pin member, the first metal pin member and the second metal pin member are used for power supply to the first LED chip, and the third metal pin member and the fourth metal pin member are You may use for the electric power supply to a 2nd LED chip.

  The wiring board has three through holes, and the metal pin member includes a first metal pin member, a second metal pin member, and a third metal pin member that are inserted into the three through holes. The first metal pin member and the second metal pin member are used to supply power to the first LED chip, and the second metal pin member and the third metal pin member are used to supply power to the second LED chip. It may be used for supply.

  The wiring board has two through holes, and the metal pin member includes a first metal pin member and a second metal pin member that are fitted into the two through holes. The 1 LED chip and the second LED chip may be connected between the first metal pin member and the second metal pin member with their polarities reversed. Here, for example, if the first LED chip is connected so that the first LED chip emits light when a current flows from the first metal pin member to the second metal pin member, the second LED chip emits light at this time. do not do. And if an electric current is sent from a 2nd metal pin member to a 1st metal pin member, while a 2nd LED chip will light-emit, a 1st LED chip will not light-emit.

  As described above, when a plurality of LED chips classified into the first LED chip and the second LED chip are mounted on the wiring board, the first wavelength emitted from the light emitted from the first LED chip is converted into the first wavelength region. It is also possible to use as the wavelength conversion member a conversion member and a second wavelength conversion member that converts the wavelength of light emitted from the second LED chip into a second wavelength region different from the first wavelength region and emits the light.

  Of the plurality of metal pin members, only one metal pin member may be different in length from the other metal pin members.

  A film having a reflectance of 90% or more in the wavelength region of light emitted from the LED light emitting element may be formed on the surface of the wiring board on which the LED chip is mounted.

The wavelength conversion member may be disposed in close contact with the LED chip, or may be disposed apart from the LED chip.
And when arrange | positioning a wavelength conversion member spaced apart from the said LED chip, the said metal pin member is inserted and inserted in the said through-hole so that it may protrude from the surface where the said LED chip of the said wiring board is mounted | worn, The wavelength conversion member may be supported by the metal pin member protruding from the surface on which the LED chip is mounted.

  The LED light emitting element further includes an optical lens having an incident surface parallel to a surface on which the LED chip of the wiring board is mounted, and disposed so that the LED chip is positioned between the LED light emitting element and the wiring board. It may be. In this case, the light emitted from the LED chip or the wavelength conversion member is emitted through the optical lens.

  When the LED light emitting element has such an optical lens, the metal pin member protrudes from the surface of the wiring board on which the LED chip is mounted and is inserted into the through hole, and the optical lens is connected to the wiring board. You may make it support by the said metal pin member protruded from the surface which mounts the said LED chip.

  In the case of the LED light emitting device including the LED light emitting element as described above, the LED light emitting device may include a receiving member that receives the metal pin member of the LED light emitting element and conducts electricity. In such an LED light emitting device, energization to the LED light emitting element in the LED light emitting device is performed via a receiving member.

  In this case, the receiving member may be a wiring board provided in the LED light emitting device or a connector provided in the LED light emitting device.

  According to the LED light-emitting element of the present invention, the electrical connection between the LED light-emitting element and the outside can be performed via the metal pin member inserted in the through hole of the wiring board. There is no need to wire colored coated wires directly, and the number of manufacturing steps can be reduced, and a reduction in luminous efficiency due to the wiring being exposed on the light emitting surface side can be prevented. Such an effect becomes particularly remarkable when a plurality of LED light emitting elements are used in combination.

  The above-described effects can be similarly obtained when the LED light emitting device further includes a wavelength conversion member that converts the wavelength of the light emitted from the LED chip and emits the light.

  When the wiring board used for the LED light emitting element includes a board body made of a metal plate and an insulating film formed on the surface of the board body to electrically insulate the wiring pattern from the board body, Due to the good heat dissipation characteristics of the main body, excessive temperature rise of the LED chip during light emission can be prevented. Further, since the metal pin member is inserted into the through hole with an insulator interposed between the metal pin member and the substrate body, good electrical insulation can be ensured between the metal pin member and the substrate body. .

  Alternatively, when the wiring board used for the LED light emitting element is such that the wiring pattern is formed on a substrate body made of an insulator, an insulator is provided between the metal pin member and the substrate body. There is no need to intervene, and the number of parts can be reduced.

  When the metal pin member has a flat flange portion at one end and the other end side is tapered, the metal pin member is inserted into the through hole from the other end side having the taper shape, thereby penetrating the metal pin member. Easy insertion into the hole. In addition, since the flange portion functions as a stopper, the metal pin member can be securely attached to the wiring board, and variations in the length of the metal pin member protruding from the wiring board can be suppressed.

  The wiring board includes a first surface on which the LED chip is mounted and a second surface on the back side of the first surface, and the metal pin member is the first surface of the wiring board. And the other side of the wiring board protrudes from the second surface of the wiring board, that is, the back side of the first surface on which the LED chip is mounted, that is, the light emitting surface of the LED light emitting element. On the opposite side, since the outside of the LED light emitting element is electrically connected to the metal pin member, it is possible to prevent the light emitting efficiency of the LED light emitting element from being lowered due to the wiring being exposed on the light emitting surface side. Become.

  Alternatively, the metal pin member is attached to the wiring board so that the flange is located on the second surface of the wiring board and the other end side protrudes from the first surface of the wiring board. If attached, LED light emission corresponding to the case where it is necessary to make an electrical connection to the outside of the LED light emitting element on the light emitting surface side of the LED light emitting element, depending on the specification or structure of the LED light emitting element assembly destination. It can be set as an element.

  When both ends of the metal pin member are formed in a taper shape and are inserted into the through holes so as to protrude from both sides of the wiring board, the LED light emitting element on the side opposite to the light emitting surface of the LED light emitting element as described above Both of the case where an electrical connection is made between the outside of the LED and the metal pin member, and the case where an electrical connection is made between the outside of the LED light emitting element and the metal pin member on the light emitting surface side of the LED light emitting element. It becomes possible. Moreover, depending on the case, the external connection of the LED light emitting element and the metal pin member can be performed on both sides of the light emitting surface side and the opposite side of the LED light emitting element. Further, on the side opposite to the light emitting surface of the LED light emitting element, the outside of the LED light emitting element is electrically connected to the metal pin member, and the metal pin member protruding to the light emitting surface side of the LED light emitting element is used. It is also possible to support a wavelength conversion member that converts the wavelength of the light emitted from the LED chip and emits it, or a member such as an optical lens. In this case, since the end portion of the metal pin member is tapered, positioning of the member is facilitated if a concave portion for positioning is formed on a member such as a wavelength conversion member or an optical lens.

  When a plurality of LED chips that are divided into first LED chips and second LED chips are mounted on a wiring board as LED chips, various effects are obtained according to the number of metal pin members mounted on the wiring board.

  For example, when four metal pin members of a first metal pin member, a second metal pin member, a third metal pin member, and a fourth metal pin member are used, the first metal pin member and the second metal pin member are used as the first LED chip. If the third metal pin member and the fourth metal pin member are used for power supply to the second LED chip, the power supply to the first LED chip and the power supply to the second LED chip are used. It can be performed independently in an electrically separated state.

  Therefore, when the light emitted from the first LED chip and the second LED chip is emitted from the LED light emitting element, it is possible to change the synthesis ratio of the light emitted from the first LED chip and the light emitted from the second LED chip, and the LED light emitting element The color temperature, chromaticity, luminance, or saturation of the light emitted from the can be switched or continuously changed.

  Further, as the wavelength conversion member, a first wavelength conversion member that converts the wavelength of the light emitted from the first LED chip into the first wavelength region and radiates the light, and the light emitted from the second LED chip is different from the first wavelength region. In the case of using the second wavelength conversion member that radiates by converting the wavelength into the wavelength region of 2, it is possible to change the synthesis ratio of the light emitted from the first wavelength conversion member and the light emitted from the second wavelength conversion member Become. Therefore, also in this case, the color temperature, chromaticity, luminance, or saturation of the light emitted from the LED light emitting element can be switched or continuously changed.

  Also, when using three metal pin members, the first metal pin member, the second metal pin member, and the third metal pin member, the first metal pin member and the second metal pin member are used for supplying power to the first LED chip. In addition, if the second metal pin member and the third metal pin member are used for power supply to the second LED chip, the number of metal pin members can be reduced by using the second metal pin member as a common terminal. The power supply to the first LED chip and the power supply to the second LED chip can be performed independently.

  Therefore, as described above, in both cases where the light emitted from the first LED chip and the second LED chip is emitted from the LED light emitting element, and when the first wavelength conversion member and the second wavelength conversion member are used in combination, the LED is used as described above. The color temperature, chromaticity, luminance, or saturation of the light emitted from the light emitting element can be switched or continuously changed.

  In addition, when two metal pin members of the first metal pin member and the second metal pin member are used, the first LED pin and the second LED chip are opposite in polarity to each other, and the first metal pin member and the second metal pin member The number of metal pin members can be further reduced if they are connected to each other. Then, by switching the direction of the current flowing between the first metal pin member and the second metal pin member, the power supply to the first LED chip and the power supply to the second LED chip can be performed independently. It becomes.

  Therefore, as described above, in both cases where the light emitted from the first LED chip and the second LED chip is emitted from the LED light emitting element, and when the first wavelength conversion member and the second wavelength conversion member are used in combination, the LED is used as described above. The color temperature, chromaticity, luminance, or saturation of the light emitted from the light emitting element can be switched or continuously changed.

  When only one metal pin member of the plurality of metal pin members has a different length from the other metal pin members, each of the plurality of metal pin members is configured in the LED light emitting element. It is possible to easily identify which part of the metal pin member corresponds to which part. Therefore, for example, when the light emitting device is assembled using the LED light emitting element, it is possible to easily identify the correct mounting direction of the LED light emitting element, and to prevent erroneous attachment.

  When a film having a reflectance of 90% or more is formed on the surface of the wiring board on which the LED chip is mounted, in the wavelength region of light emitted from the LED light emitting element, the light emission efficiency of the LED light emitting element can be improved.

  When the wavelength conversion member is supported by the metal pin member protruding from the surface on which the LED chip of the wiring board is mounted, there is no need to separately provide a support member for supporting the wavelength conversion member, and the number of parts and manufacturing man-hours are reduced. Can be reduced.

  When the LED light emitting element has an optical lens, if the optical lens is supported by a metal pin member protruding from the surface on which the LED chip of the wiring board is mounted, it is necessary to separately provide a support member for supporting the optical lens. The number of parts and manufacturing man-hours can be reduced.

  In the case of the LED light-emitting device including the LED light-emitting element as described above, the LED light-emitting device is provided with a receiving member that receives the metal pin member of the LED light-emitting element and energizes the LED light-emitting device via the receiving member. If the LED light emitting element is energized, the connection of the LED light emitting element in the LED light emitting device can be simplified.

1 is an overall perspective view of an LED light emitting device according to a first embodiment of the present invention. It is a schematic sectional drawing along the plane containing the central axis of two metal pin members located diagonally in the LED light emitting element of FIG. It is an electric circuit diagram of the LED light emitting element of FIG. It is a plane schematic diagram of the LED light emitting element of FIG. It is a schematic sectional drawing which follows the VV line in FIG. It is a schematic sectional drawing which shows the mounting state of the LED chip in the LED light emitting element of FIG. It is a schematic sectional drawing which shows an example at the time of attaching the LED light emitting element of FIG. 1 to the light-emitting device. FIG. 2 is a schematic plan view showing an example in which a plurality of LED light emitting elements of FIG. 1 are arranged on a wiring board of a light emitting device. It is a schematic plan view which shows the example which arranged the several light emission part on the wiring board. It is a schematic sectional drawing which illustrates the insertion state of the metal pin member when a wiring board is made from metal. It is a schematic perspective view which shows the 1st modification of the LED light emitting element of FIG. It is a schematic sectional drawing which shows the 2nd modification of the LED light emitting element of FIG. It is an electric circuit diagram of the LED light emitting element concerning the 2nd example of the present invention. It is a plane schematic diagram of the LED light emitting element which concerns on 2nd Example of this invention. It is an electric circuit diagram of the LED light emitting element concerning the 3rd example of the present invention. It is a plane schematic diagram of the LED light emitting element which concerns on 3rd Example of this invention. It is an electric circuit diagram of the LED light emitting element concerning the 4th example of the present invention. It is a plane schematic diagram of the LED light emitting element which concerns on 4th Example of this invention. FIG. 6 is an electric circuit diagram of an LED light emitting device according to a fifth embodiment of the present invention. FIG. 6 is a schematic plan view of an LED light emitting element according to a fifth embodiment of the present invention. It is an electric circuit diagram which shows the modification of the LED light emitting element which concerns on 5th Example of this invention.

  Hereinafter, embodiments of the present invention will be described in detail based on some examples with reference to the drawings. In addition, this invention is not limited to the content of each Example demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement.

<First embodiment>
FIG. 1 is an overall perspective view of an LED light emitting device 101 according to a first embodiment of the present invention. As shown in FIG. 1, in this embodiment, the LED light-emitting element 101 is a disc-shaped substrate body having a diameter of 20 mm and a thickness of 1 to 3 mm made of an alumina-based ceramic having excellent electrical insulation and good heat dissipation. The light emitting unit 103 that emits visible light in a direction away from the first surface 102 a is provided on the first surface 102 a of the wiring substrate 102. Therefore, the first surface 102a side is the light emitting surface side of the LED light emitting element 101, and the second surface 102b is the back side of the light emitting surface. Further, a white paint (not shown) is applied to the first surface 102 a of the wiring board 102, and the color of the paint is white, so that 90% or more of reflection with respect to visible light emitted from the light emitting unit 103 is performed. The rate is ensured and the light emission efficiency of the LED light emitting element 101 is improved. In addition, fixing holes 102 c and 102 d for fixing the LED light emitting element 101 are provided in the wiring board 102. Details of the light emitting unit 103 will be described later.

  Four through holes 104, 105, 106, and 107 are formed in the wiring substrate 102 at intervals of 90 degrees in the circumferential direction of the wiring substrate 102. In FIG. 1, the through hole 107 is not displayed because the through hole 107 is hidden behind the light emitting unit 103. In these through holes 104, 105, 106 and 107, a first pin member (first metal pin member) 108, a second pin member (second metal pin member) 109, a third pin member (third metal pin member), respectively. ) 110 and a fourth pin member (fourth metal pin member) 111 are inserted.

  The first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 are standard in which the interval between adjacent pin members is applied to a general wiring board design. The size is a multiple of 2.54 mm, for example, 15.24 mm. Thus, the interval between the pin members adjacent to each other is set to a multiple of 2.54 mm, or 1/2, 1/4, 1/8, etc. of 2.54 mm, depending on the shape and size of the wiring board 102. Thus, when the LED light emitting element 101 is mounted on another wiring board or the like, it is possible to ensure good matching with the counterpart wiring board.

  The first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 are all made of metal and have the same shape. For example, the first pin member 108 has a circular flat flange portion 108a at one end and a tapered portion 108b formed in a tapered shape at the other end side. Similarly, the second pin member 109 has a flange portion 109a and a taper portion 109b, the third pin member 110 has a flange portion 110a and a taper portion 110b, and the fourth pin member 111 has a taper portion and a flange portion 111a. Part 111b.

  Note that the shapes of the flange portions 108a, 109a, 110a, and 111a are not limited to a circular shape, and may be a polygon such as a quadrangle or a hexagon, or may be an ellipse. Further, the shapes of the tapered portions 108b, 109b, 110b, and 111b are not limited to the shapes as shown in FIG. 1, and various shapes can be adopted.

  Further, the mounting method of the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 to the wiring board 102 is the same, and the first pin member 108 will be specifically described as an example. . The first pin member 108 is inserted into the through-hole 104 from the first surface 102a side of the wiring member 102 with the tapered portion 108a as the head. The diameter of the through hole 104 is slightly larger than the diameter of the cylindrical portion between the flange portion 108a and the taper portion 108b of the first pin member 108 so that the first product member 108 can be press-fitted. The 1-pin member 108 is press-fitted until the flange portion 108 a comes into contact with the first surface 102 a of the wiring board 102. As a result, the first pin member 108 is fitted into the through hole 104 in a state of protruding from the second surface 102b which is the back side of the first surface 102a of the wiring board 102.

  As described above, the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 are provided with the tapered portions 108b, 109b, 110b, and 111b. , 106 and 107, the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 can be easily inserted. Further, by providing flange portions 108a, 109a, 110a and 111a on the first pin member 108, the second pin member 109, the third pin member 110 and the fourth pin member 111, respectively, the flange portions 108a, 109a, 110a and Since 111a functions as a stopper, the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 can be securely attached to the wiring board 102, and the second surface of the wiring board 102 Variation in the amount of protrusion from 102b can be suppressed.

  FIG. 2 is a schematic cross-sectional view along a plane including the central axis of each of the first pin member 108 and the third pin member 110 located diagonally in the LED light emitting device 101 of the present embodiment. As shown in FIG. 2, on the first surface 102a of the wiring board 102, wiring patterns 112 and 113 made of copper foil are formed corresponding to the through holes 104 and 106, respectively. As described above, the first pin member 108 and the third pin member 110 are inserted into the corresponding through holes 104 and 106, respectively, so that the flange portion 108a of the first pin member 108 is electrically connected to the wiring pattern 112. The flange portion 110 a of the third pin member 110 is electrically connected to the wiring pattern 113. In order to make such electrical connection more reliable, soldering, caulking, welding, welding, or crimping to the corresponding wiring patterns 112 and 113 is applied to the flange portion 108a and the flange portion 110a. preferable.

  Similarly to the first pin member 108 and the third pin member 110 described above, the second pin member 109 and the fourth pin member 111 also correspond to the first through holes 105 and 107 of the first wiring board 102. A wiring pattern made of copper foil is formed on the surface 102a of the second pin member 109, and the second pin member 109 and the fourth pin member 111 are inserted into the through holes 105 and 107, respectively. And the flange part 111a of the 4th pin member 111 is electrically connected with respect to each corresponding wiring pattern. For the flange portion 109a and the flange portion 111a, it is preferable to apply soldering, caulking, welding, welding, or crimping to the corresponding wiring pattern in order to make electrical connection more reliable.

  Next, in this embodiment, an electric circuit of the LED light emitting element 101 configured through the wiring pattern as described above will be described in detail. FIG. 3 is an electric circuit diagram of the LED light-emitting element 101 in the present embodiment, and FIG. 4 shows a wiring pattern formed on the first surface 102a of the wiring board 102 in order to realize the electric circuit shown in FIG. It is a plane schematic diagram to show.

  As shown in FIG. 3, the LED light emitting device 101 of this embodiment includes four first LED chips 116, 117, 118 and 119 connected in parallel, and these first LED chips 116 to 119 are electrically independent. And four second LED chips 120, 121, 122, and 123 connected in parallel. Each of the first LED chips 116 to 119 and the second LED chips 120 to 123 is an LED chip that emits near-ultraviolet light having an emission peak wavelength of 380 to 400 nm. In this embodiment, an InGaN semiconductor is used for the light-emitting layer, and the near-ultraviolet light is emitted. A GaN LED chip that emits light in a region is used. Note that the types and emission wavelength characteristics of the first LED chips 116 to 119 and the second LED chips 120 to 123 are not limited thereto, and various LED chips can be used as long as the gist of the present invention is not changed. .

  As shown in FIG. 3, the anode side of the first LED chips 116 to 119 is electrically connected to the first pin member 108, and the cathode side of the first LED chips 116 to 119 is electrically connected to the second pin member 109. It is connected. The anode sides of the second LED chips 120 to 123 are electrically connected to the third pin member 110, and the cathode sides of the second LED chips 120 to 123 are electrically connected to the fourth pin member 111.

  Accordingly, when a current flows from the first pin member 108 toward the second pin member 109, a forward current flows through the first LED chips 116 to 119, and the first LED chips 116 to 119 emit light. On the other hand, when a current flows from the third pin member 110 toward the fourth pin member 111, a forward current flows through the second LED chips 120 to 123, and the second LED chips 120 to 123 emit light. As described above, in the LED light emitting device 101 of the present embodiment, power supply to the first LED chips 116 to 119 and power supply to the second LED chips 120 to 123 are performed independently in an electrically separated state. Can do.

  In order to configure such an electric circuit, a wiring pattern as shown in FIG. 4 is formed on the first surface 102a of the wiring substrate 102. That is, on the first surface 102 a of the wiring substrate 102, the wiring pattern 112 extending from the position of the through hole 104 and electrically connected to the first pin member 108, and extending from the position of the through hole 105 are provided. And a wiring pattern 114 electrically connected to the second pin member 109, a wiring pattern 113 extending from the position of the through hole 106 and electrically connected to the third pin member 110, and a through hole A wiring pattern 115 extending from the position 107 and electrically connected to the fourth pin member 111 is formed.

  As described above, the light emitting portion 103 is provided on the first surface 102a of the wiring substrate 102. In FIG. 4, the light emitting portion 103 is indicated by a two-dot chain line. The first LED chips 116 to 119 and the second LED chips 120 to 123 form part of the light emitting unit 103, and the first LED chips 116 to 119 are connected to the wiring pattern 112, the wiring pattern 114, and the like in the light emitting unit 103. Are connected in parallel. At this time, each anode of the first LED chips 116 to 119 is connected to the wiring pattern 112, and each cathode of the first LED chips 116 to 119 is connected to the wiring pattern 114. The second LED chips 120 to 123 are connected in parallel between the wiring pattern 113 and the wiring pattern 115 in the light emitting unit 103, each anode is connected to the wiring pattern 113, and each cathode is connected to the wiring pattern 115. Yes.

  Next, the light emitting unit 103 will be described in detail with reference to FIGS. FIG. 5 is a schematic cross-sectional view of the LED light-emitting element 101 taken along line VV in FIG. As shown in FIG. 5, in addition to the first LED chips 116 to 119 and the second LED chips 120 to 123 described above, the light emitting unit 103 includes a reflector 124 formed so as to surround these LED chips, and the inside of the reflector 124 includes a first one. A partition 127 that bisects the first region 125 and the second region 126 is provided.

  The partition 127 is provided at a position that separates the first LED chips 116 to 119 and the second LED chips 120 to 123. The first LED chips 116 to 119 are located in the first region 125, and the second LED chip. 120 to 123 are positioned in the second region 126. The first region 125 includes a first fluorescent member (first fluorescent member) including a first phosphor 128 that converts the wavelength of light emitted from the first LED chips 116 to 119 and a filler 129 that disperses and holds the first phosphor 128. Wavelength conversion member) 130 is filled and covers the first LED chips 116 to 119 in close contact with the first LED chips 116 to 119. On the other hand, in the second region 126, a second fluorescent member (which includes a second phosphor 131 that converts the wavelength of light emitted from the second LED chips 120 to 123 and a filler 132 that disperses and holds the second phosphor 131). (Second wavelength conversion member) 133 is filled and covers the second LED chips 120 to 123 while being in close contact with the second LED chips 120 to 123.

  In the present embodiment, the first phosphor 128 and the second phosphor 131 have different wavelength conversion characteristics. Various combinations of such different wavelength conversion characteristics are possible. In this embodiment, as the first phosphor 128 and the second phosphor 131, all three kinds of phosphors of a red phosphor, a green phosphor and a blue phosphor are used, and these three kinds of phosphors are mixed. Dispersed in the respective fillers 129 and 132.

  The near-ultraviolet light emitted from the first LED chips 116 to 119 is red, green, and blue by the red phosphor, the green phosphor, and the blue phosphor that are dispersed and held in the first phosphor member 130 as the first phosphor 128, respectively. White light obtained by wavelength conversion into blue light and combining the red light, green light, and blue light is emitted from the first fluorescent member 130. Further, near-ultraviolet light emitted from the second LED chips 120 to 123 is red, green, and green by the red phosphor, the green phosphor, and the blue phosphor that are dispersedly held as the second phosphor 131 in the second phosphor member 133, respectively. The light is converted into light and blue light, and white light obtained by combining the red light, green light, and blue light is emitted from the second fluorescent member 133. Here, in the first phosphor 128 and the second phosphor 131, the mixing ratio of the three kinds of phosphors of the red phosphor, the green phosphor and the blue phosphor is changed, and the first phosphor 128 and the second phosphor 131 are emitted from the first phosphor member 130. The first color temperature T1 of the white light to be emitted is different from the second color temperature T2 of the white light emitted from the second fluorescent member 133.

  In addition, the 1st fluorescent substance 128 and the 2nd fluorescent substance 131 are not limited to what mixed the above-mentioned red fluorescent substance, green fluorescent substance, and blue fluorescent substance. For example, near ultraviolet light emitted from the first LED chips 116 to 119 is converted into blue light by the first phosphor 128, and near ultraviolet light emitted from the second LED chips 120 to 123 is converted into yellow light by the second phosphor 131. If the wavelength conversion is performed, it is possible to obtain white light having various color temperatures by combining the blue light and the yellow light. Alternatively, the near-ultraviolet light emitted from the first LED chips 116 to 119 is converted into blue-green light by the first phosphor 128, and the near-ultraviolet light emitted from the second LED chips 120 to 123 is converted to red by the second phosphor 131. White light having various color temperatures can also be obtained by converting the wavelength into light and synthesizing the blue-green light and the red light.

  In addition, the light obtained by combining the light emitted from the first fluorescent member 130 and the second fluorescent member 133 is not limited to white light, but the color temperature of the emitted light required for the LED light emitting element 101, The types of the first phosphor 128 and the second phosphor 131 may be appropriately selected according to chromaticity, luminance, or saturation.

  In the present embodiment, the first fluorescent member 130 and the second fluorescent member 133 are arranged using the reflector 124 and the partition 127 as described above, but the first fluorescent member 130 and the second fluorescent member 133 are disposed. The arrangement method of the fluorescent member 133 is not limited to this, and various methods can be adopted instead. For example, the first fluorescent member 130 is supplied onto the first LED chips 116 to 119 to cover the first LED chips 116 to 119 by potting or the like, and the second fluorescent member 133 is supplied onto the second LED chips 120 to 123. The second LED chips 120 to 123 may be covered.

  In the present embodiment, the first fluorescent member 130 and the second fluorescent member 133 are disposed so as to be in close contact with the first LED chips 116 to 119 and the second LED chips 120 to 123, respectively. The first fluorescent member 130 and the second fluorescent member 133 may be disposed so as to be separated from the first LED chips 116 to 119 and the second LED chips 120 to 123, respectively. In this case, for example, the first fluorescent member 130 and the second fluorescent member 133 may be fixed to the wiring substrate 102 via a spacer, or the first fluorescent member 130 on the first surface 102a side of the wiring substrate 102 as will be described later. The end portions of the first to fourth pin members 108 to 111 may be extended, and the first fluorescent member 130 and the second fluorescent member 133 may be supported by the end portions.

  Next, mounting of the first LED chips 116 to 119 and the second LED chips 120 to 123 on the wiring board 102 will be described. These LED chip mounting methods are the same, and here, the first LED chip 116 will be described as an example with reference to FIG. FIG. 6 is a schematic cross-sectional view showing a mounting state of the first LED chip 116. The first LED chip 116 has a p-electrode and an n-electrode on two opposing surfaces. In this embodiment, the n-electrode directly connects the wiring pattern 114 using eutectic solder 134 as shown in FIG. The p-electrode is connected to the wiring pattern 112 through a metal wire 135.

  Note that the method of mounting the first LED chips 116 to 119 and the second LED chips 120 to 123 on the wiring substrate 102 is not limited to this, and various methods can be applied. For example, a p-electrode and an n-electrode may be provided on the same surface of the LED chip, and each electrode and the wiring pattern may be connected via a metal bump, or each LED chip may be connected to the first surface 102a of the wiring substrate 102. Then, the metal wire may be used as described above, and both the p electrode and the n electrode may be connected to the corresponding wiring patterns.

  In the present embodiment, the light emitting unit 103 is configured as described above, and the first LED chips 116 to 119 and the second LED chips 120 to 123 are disposed on the wiring board 102 as shown in FIG. By adjusting the magnitude of the current flowing from the member 108 toward the second pin member 109 and the magnitude of the current flowing from the third pin member 110 toward the fourth pin member 111, the radiation from the first fluorescent member 130 is achieved. White light having an arbitrary color temperature from the first color temperature T1 of the white light emitted to the second color temperature T2 of the white light emitted from the second fluorescent member 133 can be emitted from the LED light emitting element 101. Become.

  When the LED light-emitting element 101 of this embodiment is applied to a light-emitting device, the electrical connection with the LED light-emitting element 101 in the light-emitting device is the first pin member 108, the second pin member 109, the third pin member 110, and the fourth. This is done via the pin member 111. FIG. 7 is a schematic cross-sectional view showing an example when the LED light emitting element 101 is assembled to the light emitting device. The light emitting device is provided with a wiring board (receiving member) 136 on which an electric circuit for supplying power to the LED light emitting element 101 and controlling it is provided. The first pin member 108 and the second pin member 109 are provided. Through holes 137, 138, 139 and 140 (through holes 138 and 140 are not shown) capable of receiving the third pin member 110 and the fourth pin member 111 are provided at the same arrangement intervals as these pin members. ing. The through holes 137, 138, 139 and 140 are provided with wiring patterns 141, 142, 143 and 144 (the wiring patterns 142 and 144 are not shown), respectively.

  When the LED light emitting element 101 is assembled to the light emitting device, the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 are inserted into the corresponding through holes 137, 138, 139, and 140, respectively. Then, the wiring board 102 of the LED light emitting element 101 is brought into contact with the wiring board 136 of the light emitting device. At this time, the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 protrude downward from the corresponding through holes 137, 138, 139, and 140, respectively. The first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 that protrude in this manner are soldered to the corresponding wiring patterns 141, 142, 143, and 144, respectively. Assembling of the LED light-emitting element 101 is completed.

  If necessary, the fixing holes 102c and 102d provided in the wiring board 102 may be used and screwed to the wiring board 136 on the light emitting device side. In this case, in addition to the contact of the LED light emitting element 101 with the wiring board 102, the heat generated by the LED light emitting element 101 is transmitted to the wiring board 136 on the light emitting device side through a screw for fixing the LED light emitting element 101. The heat from the LED light emitting element 101 can be radiated well, and an excessive temperature rise of the LED light emitting element 101 can be prevented.

  The method for assembling the LED light emitting element 101 is not limited to this, and various methods can be used as long as the gist of the present invention is not changed. For example, the LED light emitting element 101 is fixed to a support member, a heat sink or the like using fixing holes 102c and 102d provided in the wiring substrate 102, and the first pin member 108, the second pin member 109, the third pin member 110, and the first pin A connector may be connected to the 4-pin member 111.

  As described above, since the electrical connection between the LED light emitting element 101 and the outside can be performed via the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111, the LED light emission. There is no need to wire colored coated wires directly to the element 101, and the number of manufacturing steps can be reduced. Further, the LED light emitting element 101 is externally provided via a first pin member 108, a second pin member 109, a third pin member 110, and a fourth pin member 111 protruding from the second surface 102b opposite to the light emitting surface side. Therefore, it is possible to prevent a decrease in luminous efficiency due to the wiring being exposed to the light emitting surface side of the LED light emitting element 101 of the wiring substrate 102.

  When the LED light-emitting element 101 is assembled to a light-emitting device or the like, depending on the structure of the assembly destination and usage conditions, the LED light-emitting element 101 is electrically connected to the outside on the light-emitting surface side of the LED light-emitting element 101, that is, on the first surface 102a side of the wiring board 102. In some cases, it is necessary to make a general connection. In such a case, the flange portions 108a, 109a, and 110a are reversed with the insertion direction of the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 with respect to the wiring board 102 being reversed. And 111a are positioned on the second surface 102b side of the wiring board 102 and are in contact with the second surface 102b. The first pin member 108, the second pin member 109, the second pin member 109 are disposed on the first surface 102a side of the wiring board 102. You may make it make the 3 pin member 110 and the 4th pin member 111 protrude.

  Although the LED light emitting element 101 of the present embodiment can be used alone, for example, a plurality of LED light emitting elements 101 can be used in combination in order to increase the light emission amount. FIG. 8 is a schematic plan view showing an example in which a plurality of LED light emitting elements 101 are mounted and arranged on the wiring board 136 of the light emitting device as described above. As shown in FIG. 8, in this example, seven LED light emitting elements 101 are arranged on a wiring board 136. Each LED light emitting element 101 is configured as described above, and for each LED light emitting element 101, the color temperature of the emitted white light can be changed between the first color temperature T1 and the second color temperature T2. ing. Therefore, the color temperature of white light of all the LED light emitting elements 101 can be made the same, or white light of different color temperatures can be emitted from each LED light emitting element 101.

  When a plurality of LED light-emitting elements 101 are used in combination as described above, each LED light-emitting element 101 can emit light in various wavelength regions as well as white light as described above. Instead, it is possible to obtain light of various color temperatures, chromaticity, luminance, or saturation by synthesis. In the above example, the seven LED light emitting elements 101 are arranged on the wiring board 136. However, the number and arrangement of the LED light emitting elements 101 are not limited to the above example, and may be various according to necessity. It can be changed.

  In the example of FIG. 8, the plurality of LED light emitting elements 101 are mounted and arranged on the wiring board 136 of the light emitting device, but it is also possible to provide a plurality of light emitting units on the wiring board of the LED light emitting elements. An example of such a case is shown in FIG. In the example of FIG. 9, four light emitting portions 103 'are arranged in a row with respect to the wiring substrate 102' of the LED light emitting element 101 '. The configuration of each light emitting portion 103 ′ is the same as that of the light emitting portion 103 in the first embodiment described above, and for each light emitting portion 103 ′, the first pin member 108 ′ and the second pin member are the same as in the first embodiment. 109 ′, a third pin member 110 ′, and a fourth pin member 111 ′ are provided, and a wiring pattern is formed.

  In the example of FIG. 9 as well, as in the example of FIG. 8, the color temperature of the emitted white light can be changed between the first color temperature T1 and the second color temperature T2 for each light emitting unit 103 ′. ing. Accordingly, the color temperature of white light of all the light emitting units 103 ′ can be made the same, or white light of different color temperatures can be emitted from each light emitting unit 103 ′. Also in this case, as in the example of FIG. 8, each light emitting unit 103 ′ can emit light in various wavelength regions as well as white light, so that not only the amount of emitted light but also various colors can be emitted. Light with temperature, chromaticity, luminance, or saturation can be obtained. In the example of FIG. 9, four light emitting units 103 ′ are arranged in a line on the wiring board 102 ′. However, the number and arrangement of the light emitting units 103 ′ are not limited to this, and are necessary. Various changes can be made accordingly.

  In the first embodiment described above, the wiring board 102 using an alumina-based ceramic excellent in electrical insulation as the board body is used, but the material of the board body of the wiring board 102 is not limited to this. For example, the substrate body of the wiring substrate 102 may be formed using a material selected from resin, glass epoxy, a composite resin containing a filler in the resin, and the like as a material having excellent electrical insulation. In addition, the substrate body of the wiring substrate 102 can be formed using a flexible material.

  On the other hand, in order to obtain better heat dissipation, the wiring board may be formed by a metal board body. In this case, it is necessary to electrically insulate the wiring pattern on the wiring board, the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 from the board body of the wiring board. is there.

  FIG. 10 shows an example in which a wiring board is constituted by such a metal substrate body, taking the periphery of the first pin member 108 in the first embodiment as an example. As shown in FIG. 10, the wiring board 102 ″ electrically insulates the board main body 145 made of a metal plate such as aluminum and the wiring pattern such as the wiring pattern 112 provided on the wiring board 102 ″ from the board main body 145. Therefore, an insulating film 146 formed on the surface of the substrate body 145 is provided. The first pin member 108 is inserted into the through hole 104 formed in the wiring board 102 ″, but electrical insulation is provided between the first pin member 108 and the wiring board 102 ″ in the through hole 104. An insulating bush (insulator) 147 made of an excellent material is interposed, and the first pin member 108 is electrically insulated from the board body 145 of the wiring board 102 ″.

  The second pin member 109, the third pin member 110, and the fourth pin member 111 are also mounted on the wiring board 102 ″ in the same manner as the first pin member 108, and each is attached to the board body 145 of the wiring board 102 ″. It is electrically insulated from it. The wiring board 102 ″ is provided with a metal board body 145 and an insulating film 146, and the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 are insulated from each other. Except that a bush is provided, it is the same as the first embodiment described above.

  Although the description regarding the first embodiment is as described above, the LED light emitting device 101 according to the first embodiment can be variously modified as described above, and some of them can be modified according to the first embodiment. This will be described below as a modified example.

<First Modification>
In the first embodiment, the shapes of the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 are all circular plate-shaped flange portions 108a, 109a, 110a, and 111a at one end. In addition, the tapered portions 108b, 109b, 110b, and 111b are formed on the other end side so that the flange portions 108a, 109a, 110a, and 111a are in contact with the first surface 102a of the wiring board 102. However, the first to fourth pin members may be extended from the end where these flange portions are located on the first surface 102a side of the wiring board 102.

  An example of extending the first to fourth pin members in this way is shown in FIG. 11 as a first modification. In the first modified example, members substantially the same as those in the first embodiment are denoted by the same reference numerals. As shown in FIG. 11, the LED light emitting device 148 of the first modified example includes the wiring board 102 and the light emitting unit 103 similar to those of the first embodiment. Further, in the LED light emitting device 148, the first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152 are inserted into the wiring board 102 in the same manner as in the first embodiment, respectively. The flange portions 149a, 150a, 151a and 152a are in contact with the first surface 102a of the wiring board 102.

  As described above, the first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152 are further extended from the flange portions 149a, 150a, 151a, and 152a. Tapered portions 149c, 150c, 151c and 152c formed in a tapered shape are provided at the end portions. The first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152 are the first pin member 108 of the first embodiment, except that they are extended as described above. The same as the second pin member 109, the third pin member 110, and the fourth pin member 111. In FIG. 11, the tapered portion 152 c is not shown because it is hidden behind the light emitting portion 103.

  The tapered portions 149c, 150c, 151c and 152c of the first pin member 149, the second pin member 150, the third pin member 151 and the fourth pin member 152 thus provided are emitted from the light emitting unit 103. An optical lens 153 for distributing light well is placed. The optical lens 153 has an incident surface parallel to the first surface 102a of the wiring board 102 on which the first LED chips 116 to 119 and the second LED chips 120 to 123 are mounted in the same manner as in the first embodiment. By being supported by the first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152, the light emitting unit 103, that is, the first LED chip is interposed between the optical lens 153 and the wiring substrate 102. 116 to 119 and the second LED chips 120 to 123, and the first fluorescent member 130 and the second fluorescent member 133 are arranged.

  On the light receiving surface of the optical lens 153 facing the first surface 102a of the wiring board 102, recesses 153a, 153b, 153c and 153d are formed at positions corresponding to the tapered portions 149c, 150c, 151c and 152c. The optical lenses 153 can be easily positioned with respect to the wiring board 102 by fitting the tapered portions 149c, 150c, 151c and 152c into the recesses 153a, 153b, 153c and 153d. In this modification, the tapers 149c, 150c, 151c, and 152c are fixed to the recesses 153a, 153b, 153c, and 153d using an adhesive.

  In this manner, the optical lens 153 is supported and fixed by using the first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152, thereby supporting and fixing the optical lens 153. Therefore, it is not necessary to separately prepare a member for the purpose, and the number of parts and the number of manufacturing steps of the LED light emitting element 148 can be reduced. In addition, by using the optical lens 153, the light distribution of the LED light emitting element 148 can be improved. The first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152 are provided with flange portions 149a, 150a, 151a, and 152a, respectively, as in the first embodiment. Therefore, these flange portions 149a, 150a, 151a and 152a function as stoppers, and the first pin member 149, the second pin member 150, the third pin member 151 and the fourth pin member 152 are securely attached to the wiring board 102. In addition, variation in the amount of protrusion from the first surface 102a and the second surface 102b of the wiring substrate 102 can be suppressed.

  The method for fixing and supporting the optical lens 153 is not limited to this, and various methods can be applied. For example, the first pin member 149 and the second pin directly on the light receiving surface of the optical lens 153 without providing the tapered portions 149c, 150c, 151c and 152c and the recesses 153a, 153b, 153c and 153d as in the first modification described above. The flat ends of the pin member 150, the third pin member 151, and the fourth pin member 152 may be fixed. In this modification, the optical lens 153 is fixed to the first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152 with an adhesive, but the fixing method is limited to this. It is not a thing. For example, various methods such as press-fitting and fitting of each pin member into a recess provided in the optical lens 153, and welding of the optical lens 153 to each pin member can be applied.

  In the first modification, the optical lens 153 is supported by the first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152. However, instead of the optical lens 153, the optical lens 153 is described above. As described above, the first fluorescent member 130 and the second fluorescent member 133 may be supported. Instead of providing the first fluorescent member 130 and the second fluorescent member 133 in close contact with the first LED chips 116 to 119 and the second LED chips 120 to 123 as in the first embodiment, the first LED chips 116 to 119 are spaced apart from the first LED chips. Such a support method is effective when the fluorescent member 130 and the second fluorescent member 133 are to be disposed.

  Further, if the first pin member 149, the second pin member 150, the third pin member 151, and the fourth pin member 152 are projected on both surfaces of the wiring board 102 as in the first modification, the first embodiment described above. As described above, when the external connection is made on the second surface 102b side of the wiring board 102 opposite to the light emitting surface of the LED light emitting element 148, and the wiring on the light emitting surface side of the LED light emitting element 148 It is possible to cope with both the case where the first surface 102a side of the substrate 102 is electrically connected to the outside. Furthermore, if necessary, electrical connection with the outside can be performed on both sides of the first surface 102a side and the second surface 102b side of the wiring board 102.

<Second Modification>
Next, a second modification of the first embodiment will be described. The lengths of the first pin member 108, the second pin member 109, the third pin member 110, and the fourth pin member 111 need not all be the same as in the first embodiment. As an example, an example in which one of these pin members has a different length from the other pin members is shown in FIG. 12 as a second modification. FIG. 12 is a schematic cross-sectional view showing the LED light emitting element of the second modified example in the same manner as FIG. In the second modified example, as shown in FIG. 2, the length of the third pin member 110 ″ is different from the lengths of the first pin member 108, the second pin member 109, and the fourth pin member 111. The pin member 110 "is longer. Although the second pin member 109 and the fourth pin member 111 are not shown in FIG. 12, the length of the second pin member 109 and the fourth pin member 111 in this modification is the same as the length of the first pin member 108. It is the same. In the present modification, only the length of the third pin member 110 ″ is different from that of the first embodiment, and the rest is configured in the same manner as in the first embodiment.

  Thus, by making the length of only the third pin member 110 ″ different from that of other pin members, the third pin member 110 ″ can be easily identified. Since the arrangement order of the pin members in the LED light-emitting element is known in advance, if the position of the third pin member 110 ″ can be identified in this way, the remaining first pin member 108, second pin member 109, and fourth pin The member 111 can also be easily identified. In addition, by identifying the position of the third pin member 110 ″ in this way, for example, when the light emitting device is assembled using the LED light emitting element, the LED light emitting element is correctly mounted. It becomes possible to easily recognize the direction, and to prevent erroneous mounting.

  In this modification, only the third pin member 110 ″ is longer than the other pin members. Instead, only the third pin member 110 ″ is shorter than the other pin members. However, the same effect can be obtained.

<Second embodiment>
In the LED light emitting device 101 of the first embodiment, the four first LED chips 116, 117, 118, and 119 connected in parallel, and the first LED chips 116 to 119 are electrically separated and connected in parallel. Although the four second LED chips 120, 121, 122, and 123 are used, the circuit configuration using these LED chips is not limited to this, and various circuits can be configured. . An example thereof will be described below as a second embodiment of the present invention.

  FIG. 13 is an electric circuit diagram of the LED light-emitting element 201 in the present embodiment, and FIG. 14 shows a wiring pattern formed on the first surface 202a of the wiring board 202 in order to realize the electric circuit shown in FIG. It is a plane schematic diagram to show. The material and size of the wiring board 202 are the same as those of the wiring board 101 of the first embodiment. As will be described below, the wiring pattern formed on the wiring board 202 and the metal mounted on the wiring board 202 are described. The number of made pin members is different.

  As shown in FIG. 14, three through holes 204, 205 and 206 are formed in the wiring substrate 202 at intervals of 90 degrees in the circumferential direction of the wiring substrate 102. Therefore, the angular interval between the through hole 205 and the through hole 206 in the circumferential direction of the wiring board 102 is 180 degrees. In these through holes 204, 205 and 206, a first pin member (first metal pin member) 208, a second pin member (second metal pin member) 209 and a third pin are respectively formed in the same manner as in the first embodiment. A pin member (third metal pin member) 210 is inserted. As shown in FIG. 14, the wiring board 202 is provided with fixing holes 202c and 202d for fixing the LED light emitting element 201 as in the first embodiment.

  The first pin member 208, the second pin member 209, and the third pin member 210 are all made of metal and have the same shape as each pin member of the first embodiment. The mounting method of the first pin member 208, the second pin member 209, and the third pin member 210 to the wiring board 202 is the same as that of the first embodiment, and the flange portions 208a, 209a, and 210a are provided on the wiring board 202. It press-fits until it contacts the first surface 202a. As a result, the first pin member 208, the second pin member 209, and the third pin member 210 are fitted into the corresponding through holes 204, 205, and 206 in a state of protruding from the back side of the first surface 102a of the wiring board 202. It will be inserted.

  As shown in FIG. 13, the LED light-emitting element 201 of the present embodiment is connected in parallel separately from the four first LED chips 216, 217, 218 and 219 connected in parallel, and the first LED chips 216 to 219. And four second LED chips 220, 221, 222, and 223. Each of these first LED chips 216 to 219 and second LED chips 220 to 223 is an LED chip that emits near-ultraviolet light having an emission peak wavelength of 380 to 400 nm, as in the first embodiment. In this embodiment, InGaN A GaN LED chip is used in which a semiconductor is used for the light emitting layer and emits light in the near ultraviolet region. Note that the types and emission wavelength characteristics of the second LED chips 216 to 219 and the second LED chips 220 to 223 are not limited thereto, and various LED chips can be used as long as the gist of the present invention is not changed. .

  As shown in FIG. 13, the cathode side of the first LED chips 216 to 219 is electrically connected to the first pin member 208, and the anode side of the first LED chips 216 to 219 is electrically connected to the second pin member 209. It is connected. The cathode sides of the second LED chips 220 to 223 are electrically connected to the second pin member 209, and the anode sides of the second LED chips 220 to 223 are electrically connected to the third pin member 210. Therefore, in this embodiment, the anode side of the first LED chips 216 to 219 and the cathode side of the second LED chips 220 to 223 use the second pin member 209 as a common terminal.

  In the LED light emitting element 201 of the present embodiment, a forward current flows through the first LED chips 216 to 219 by causing a current to flow from the second pin member 209 toward the first pin member 208, and the first LED chips 216 to 219 Emits light. On the other hand, when a current flows from the third pin member 210 toward the second pin member 209, a forward current flows through the second LED chips 220 to 223, and the second LED chips 220 to 223 emit light. As described above, in the LED light emitting element 201 of the present embodiment, the power supply to the first LED chips 216 to 219 and the power supply to the second LED chips 220 to 223 are independent from each other using the second pin member 209 as a common terminal. Can be done.

  In order to configure such an electric circuit, a wiring pattern as shown in FIG. 14 is formed on the first surface 202a of the wiring board 202. That is, on the first surface 202 a of the wiring board 202, the wiring pattern 212 that extends from the position of the through hole 204 and is electrically connected to the first pin member 208 and the position of the through hole 205 are extended. And a wiring pattern 214 electrically connected to the second pin member 209 and a wiring pattern 213 extending from the position of the through hole 206 and electrically connected to the third pin member 210 are formed. ing.

  Similar to the first embodiment, a light emitting portion 203 is provided on the first surface 202a of the wiring board 202, and in FIG. 14, this light emitting portion 203 is indicated by a two-dot chain line. The first LED chips 216 to 219 and the second LED chips 220 to 223 form a part of the light emitting unit 203, and the first LED chips 216 to 219 are connected to the wiring pattern 212, the wiring pattern 214, and the like in the light emitting unit 203. Are connected in parallel. At this time, each cathode of the first LED chips 216 to 219 is connected to the wiring pattern 212, and each anode of the first LED chips 216 to 219 is connected to the wiring pattern 214. The second LED chips 220 to 223 are connected in parallel between the wiring pattern 213 and the wiring pattern 214 in the light emitting unit 203, each anode is connected to the wiring pattern 213, and each cathode is connected to the wiring pattern 214. Yes.

  Similarly to the light emitting unit 103 of the first embodiment, the light emitting unit 203 is provided with a first fluorescent member (first wavelength conversion member) in the first region 225 and in the second region 226. 2nd fluorescent member (2nd wavelength conversion member) is arrange | positioned, 1st LED chip 216-219 is located in the 1st area | region 225, and 2nd LED chip 220-223 is located in the 2nd area | region 226. It is supposed to be. Further, the configurations of the first fluorescent member and the second fluorescent member are the same as those of the first embodiment, and all use three types of phosphors, a red phosphor, a green phosphor and a blue phosphor, and a filler. . Accordingly, as in the first embodiment, near-ultraviolet light emitted from the first LED chips 216 to 219 is wavelength-converted by the first fluorescent member, and white light is emitted from the first fluorescent member, while the second LED chips 220 to 223 are emitted. The near-ultraviolet light emitted from is subjected to wavelength conversion by the second fluorescent member, and white light is emitted from the second fluorescent member.

  In the present embodiment, similarly to the first embodiment, by changing the mixing ratio of the three types of phosphors of the red phosphor, the green phosphor and the blue phosphor in the first phosphor and the second phosphor, The first color temperature T1 of the white light emitted from the first fluorescent member is made different from the second color temperature T2 of the white light emitted from the second fluorescent member. Therefore, by adjusting the magnitude of the current flowing from the second pin member 209 toward the first pin member 208 and the magnitude of the current flowing from the third pin member 210 toward the second pin member 209, respectively, White light having an arbitrary color temperature from the first color temperature T1 of white light emitted from the fluorescent member to the second color temperature T2 of white light emitted from the second fluorescent member is emitted from the LED light emitting element 201. Is possible.

  As described above, in this embodiment, the power supply to the first LED chips 216 to 219 and the power supply to the second LED chips 220 to 223 can be performed independently, and the same effect as the first embodiment can be obtained. In addition, the number of pin members can be reduced by using the second pin member 209 as a common terminal.

  In this embodiment, similarly to the first embodiment described above, the wiring board 202, the light emitting portion 203 (first fluorescent member and second fluorescent member), or the first pin member 208, second pin member 209, and The third pin member 210 and the like can be variously changed without changing the gist of the present invention.

<Third embodiment>
An example in which the LED chip connection direction in the second embodiment described above is different from the second embodiment will be described below as a third embodiment. FIG. 15 is an electric circuit diagram of the LED light emitting element 301 in this embodiment, and FIG. 16 shows a wiring pattern formed on the first surface 302a of the wiring board 302 in order to realize the electric circuit shown in FIG. It is a plane schematic diagram to show. As described above, the LED light emitting element 301 of the present embodiment differs from the LED light emitting element 201 of the second embodiment only in the electrical connection direction of the LED chip.

  Therefore, in this embodiment, the wiring board 302, the first pin member (first metal pin member) 308, the second pin member (second metal pin member) 309, the third pin member (third metal pin member) 310, The fluorescent portion 303 and the wiring patterns 312, 313, and 314 are all configured in the same manner as the corresponding members in the second embodiment.

  As shown in FIG. 15, the LED light emitting element 301 of the present embodiment is connected in parallel separately from the four first LED chips 316, 317, 318 and 319 connected in parallel, and the first LED chips 316 to 319. And four second LED chips 320, 321, 322, and 323. The first LED chips 316 to 319 and the second LED chips 320 to 323 are the same LED chips as the first LED chips 216 to 219 and the second LED chips 220 to 223 of the second embodiment.

  As shown in FIG. 15, the cathode side of the first LED chips 316 to 319 is electrically connected to the first pin member 308, and the anode side of the first LED chips 316 to 319 is electrically connected to the second pin member 309. It is connected. The cathode sides of the second LED chips 320 to 323 are electrically connected to the third pin member 310, and the anode sides of the second LED chips 320 to 323 are electrically connected to the second pin member 309. Therefore, in this embodiment, the anode side of the first LED chips 316 to 319 and the anode side of the second LED chips 320 to 323 use the second pin member 309 as a common terminal.

  In the LED light emitting element 301 of the present embodiment, a forward current flows through the first LED chips 316 to 319 by causing a current to flow from the second pin member 309 to the first pin member 308, and the first LED chips 316 to 319 Emits light. On the other hand, when a current flows from the second pin member 309 toward the third pin member 310, a forward current flows through the second LED chips 320 to 323, and the second LED chips 320 to 323 emit light. Thus, also in the LED light emitting element 301 of the present embodiment, power supply to the first LED chips 316 to 319 and power supply to the second LED chips 320 to 323 are performed using the second pin member 309 as a common terminal. Can be done independently.

  As described above, in the present embodiment, the first LED chips 316 to 319 and the second LED chips 320 to 323 are different in electrical connection direction from the second pin member 309 to the second example. As in the case of the second embodiment, by adjusting the magnitude of the current flowing toward the first pin member 308 and the magnitude of the current flowing from the second pin member 309 toward the third pin member 310, respectively. White light having an arbitrary color temperature from the first color temperature T1 of white light emitted from one fluorescent member to the second color temperature T2 of white light emitted from the second fluorescent member is emitted from the LED light emitting element 301. It becomes possible.

  Therefore, also in the present embodiment, power supply to the first LED chips 316 to 319 and power supply to the second LED chips 320 to 323 can be performed independently, and the same effect as in the first embodiment can be obtained. In addition, the number of pin members can be reduced by using the second pin member 309 as a common terminal.

  In this embodiment, as in the first embodiment, the wiring board 302, the light emitting unit 303 (first fluorescent member and second fluorescent member), or the first pin member 308, the second pin member 309, and the like. The third pin member 310 and the like can be variously changed without changing the gist of the present invention.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described with reference to FIGS. This embodiment is an example in which the number of pin members is further reduced to two. FIG. 17 is an electric circuit diagram of the LED light-emitting element 401 in the present embodiment, and FIG. 18 shows a wiring pattern formed on the first surface 402a of the wiring board 402 in order to realize the electric circuit shown in FIG. It is a plane schematic diagram to show. The material and size of the wiring board 402 are the same as those of the wiring board 101 of the first embodiment. As will be described below, the wiring pattern formed on the wiring board 402 and the metal mounted on the wiring board 402 are described. The number of made pin members is different.

  As shown in FIG. 18, the wiring board 402 is formed with two through holes 404 and 405 that are separated by an angle of 90 degrees in the circumferential direction of the wiring board 102. A first pin member (first metal pin member) 408 and a second pin member (second metal pin member) 409 are respectively inserted into the through holes 404 and 405 by the same method as in the first embodiment. Yes. As shown in FIG. 18, the wiring board 402 is provided with fixing holes 402c and 402d for fixing the LED light emitting element 401, as in the first embodiment.

  The first pin member 408 and the second pin member 409 are both made of metal and have the same shape as each pin member of the first embodiment. The mounting method of the first pin member 408 and the second pin member 409 to the wiring board 402 is the same as that of the first embodiment, and the flange portions 408a and 409a abut against the first surface 402a of the wiring board 402. It is press-fit. Accordingly, the first pin member 408 and the second pin member 409 are inserted into the corresponding through holes 404 and 405 in a state of protruding from the back side of the first surface 402a of the wiring board 402.

  As shown in FIG. 17, the LED light-emitting element 401 of the present embodiment includes four first LED chips 416, 417, 418 and 419 connected in parallel, and four second LED chips 420, 421, connected in parallel. 422 and 423. The first LED chips 416 to 419 and the second LED chips 420 to 423 are LED chips that emit near-ultraviolet light having an emission peak wavelength of 380 to 400 nm, as in the first embodiment. In this embodiment, InGaN A GaN LED chip is used in which a semiconductor is used for the light emitting layer and emits light in the near ultraviolet region. Note that the types and emission wavelength characteristics of the second LED chips 416 to 419 and the second LED chips 420 to 423 are not limited thereto, and various LED chips can be used as long as the gist of the present invention is not changed. .

  As shown in FIG. 17, the cathode sides of the first LED chips 416 to 419 are electrically connected to the first pin member 408, and the anode sides of the first LED chips 416 to 419 are electrically connected to the second pin member 409. It is connected. The cathode sides of the second LED chips 420 to 423 are electrically connected to the second pin member 409, and the anode sides of the second LED chips 420 to 423 are electrically connected to the first pin member 408. Accordingly, in the present embodiment, the first LED chips 416 to 419 and the second LED chips 420 to 423 are electrically connected between the first pin member 408 and the second pin member 409 with the polarities reversed. It will be.

  In the LED light-emitting element 401 of the present embodiment, a forward current flows through the first LED chips 416 to 419 by causing a current to flow from the second pin member 409 toward the first pin member 408, and the first LED chips 416 to 419 Emits light. On the other hand, when a current flows from the first pin member 408 toward the second pin member 409, a forward current flows through the second LED chips 420 to 423, and the second LED chips 420 to 423 emit light. . As described above, in the LED light emitting element 401 of this embodiment, both the first pin member 408 and the second pin member 409 are used as a common terminal, and the power supply to the first LED chips 416 to 419 and the second LED chip 420 to Power supply to 423 can be performed independently.

  In order to configure such an electric circuit, a wiring pattern as shown in FIG. 18 is formed on the first surface 402 a of the wiring substrate 402. That is, the wiring pattern 412 that extends from the position of the through hole 404 and is electrically connected to the first pin member 408 and the position of the through hole 405 extend from the first surface 402 a of the wiring board 402. In addition, a wiring pattern 414 electrically connected to the second pin member 409 is formed.

  As in the first embodiment, a light emitting unit 403 is provided on the first surface 402a of the wiring board 402. In FIG. 18, the light emitting unit 403 is indicated by a two-dot chain line. The first LED chips 416 to 419 and the second LED chips 420 to 423 form part of the light emitting unit 403, and the first LED chips 416 to 419 are connected to the wiring pattern 412 and the wiring pattern 414 in the light emitting unit 403. Are connected in parallel. At this time, each cathode of the first LED chips 416 to 419 is connected to the wiring pattern 412, and each anode of the first LED chips 416 to 419 is connected to the wiring pattern 414. The second LED chips 420 to 423 are also connected in parallel between the wiring pattern 412 and the wiring pattern 414 in the light emitting unit 403, but each anode is connected to the wiring pattern 412 and each cathode is connected to the wiring pattern 414. It is connected to the.

  In the light emitting unit 403, in the same manner as the light emitting unit 103 of the first embodiment, a first fluorescent member (first wavelength converting member) is disposed in the first region 425, and in the second region 426. 2nd fluorescent member (2nd wavelength conversion member) is arrange | positioned, 1st LED chip 416-419 is located in the 1st area | region 425, and 2nd LED chip 420-423 is located in the 2nd area | region 426. It is supposed to be. Further, the configurations of the first fluorescent member and the second fluorescent member are the same as those of the first embodiment, and all use three types of phosphors, a red phosphor, a green phosphor and a blue phosphor, and a filler. . Therefore, as in the first embodiment, near-ultraviolet light emitted from the first LED chips 416 to 419 is wavelength-converted by the first fluorescent member, and white light is emitted from the first fluorescent member, while the second LED chips 420 to 423 are emitted. The near-ultraviolet light emitted from is subjected to wavelength conversion by the second fluorescent member, and white light is emitted from the second fluorescent member.

  In the present embodiment, similarly to the first embodiment, by changing the mixing ratio of the three types of phosphors of the red phosphor, the green phosphor and the blue phosphor in the first phosphor and the second phosphor, The first color temperature T1 of the white light emitted from the first fluorescent member is made different from the second color temperature T2 of the white light emitted from the second fluorescent member. Therefore, by adjusting the magnitude of the current flowing from the second pin member 409 toward the first pin member 408 and the magnitude of the current flowing from the first pin member 408 toward the second pin member 409, respectively, White light having an arbitrary color temperature from the first color temperature T1 of white light emitted from the fluorescent member to the second color temperature T2 of white light emitted from the second fluorescent member is emitted from the LED light emitting element 201. Is possible.

  As described above, also in this embodiment, the power supply to the first LED chips 216 to 219 and the power supply to the second LED chips 220 to 223 can be performed independently, and the same effect as the first embodiment is obtained. In addition, the number of pin members can be further reduced by using both the first pin member 408 and the second pin member 409 as a common terminal.

  Also in this embodiment, as in the first to third embodiments described above, the wiring board 402, the light emitting unit 403 (first fluorescent member and second fluorescent member), or the first pin member 408 and second pin. The member 409 and the like can be variously changed without changing the gist of the present invention.

<Fifth embodiment>
The second to fourth embodiments show various examples when the number of pin members is reduced. However, when four pin members are used as in the first embodiment, various circuits are provided. An example thereof will be described below as a fifth embodiment of the present invention.

  FIG. 19 is an electric circuit diagram of the LED light emitting element 501 in the present embodiment, and FIG. 20 shows a wiring pattern formed on the first surface 502a of the wiring board 502 in order to realize the electric circuit shown in FIG. It is a plane schematic diagram to show. The material and size of the wiring board 502 are the same as those of the wiring board 101 of the first embodiment. As will be described below, a wiring pattern formed on the wiring board 202, that is, a circuit using LED chips. Only the configuration is different. That is, in this embodiment, the wiring board 502, the first pin member (first metal pin member) 508, the second pin member (second metal pin member) 509, the third pin member (third metal pin member) 510, The fourth pin member (fourth metal pin member) 511, the light emitting portion 503, and the like are all configured in the same manner as the corresponding members in the first embodiment.

  As shown in FIG. 19, the LED light emitting device 501 of the present embodiment includes four first LED chips 516, 517, 518, and 519 connected in series, and these first LED chips 516 to 519 are electrically independent. And four second LED chips 520, 521, 522, and 523 connected in series. These first LED chips 516 to 519 and second LED chips 520 to 523 are LED chips that emit near-ultraviolet light having an emission peak wavelength of 380 to 400 nm, as in the first embodiment. In this embodiment, InGaN A GaN LED chip is used in which a semiconductor is used for the light emitting layer and emits light in the near ultraviolet region. The types and emission wavelength characteristics of the second LED chips 516 to 519 and the second LED chips 520 to 523 are not limited thereto, and various LED chips can be used as long as the gist of the present invention is not changed. .

  As shown in FIG. 19, the anode side of the first LED chip 516 is electrically connected to the first pin member 508, and the cathode side of the first LED chip 519 is electrically connected to the second pin member 509. . The anode side of the second LED chip 520 is electrically connected to the third pin member 510, and the cathode side of the second LED chip 523 is electrically connected to the fourth pin member 511.

  Therefore, in the LED light emitting element 501 of the present embodiment, by flowing a current from the first pin member 508 toward the second pin member 509, a forward current flows through the first LED chips 516 to 519 and the first LED chip 516 to 516. 519 emits light. On the other hand, when a current flows from the third pin member 510 toward the fourth pin member 511, a forward current flows through the second LED chips 520 to 523, and the second LED chips 520 to 523 emit light. Thus, in the LED light emitting element 501 of the present embodiment, power supply to the first LED chips 516 to 519 and power supply to the second LED chips 520 to 523 can be performed independently.

  In this embodiment, the first LED chips 516 to 519 are connected in series, and the second LED chips 520 to 523 are connected in series, so that the amount of current supplied to the first LED chips 516 to 519 and the second LED The amount of current supplied to the chips 520 to 523 can be reduced. Therefore, the current capacity of the power source that supplies power to the LED light emitting element 501 can be kept low.

  In order to configure such an electric circuit, a wiring pattern as shown in FIG. 20 is formed on the first surface 502a of the wiring board 502. That is, on the first surface 502 a of the wiring substrate 502, the wiring pattern 512 that extends from the position of the through hole 504 and is electrically connected to the first pin member 508, and the position that extends from the position of the through hole 505. And a wiring pattern 514 electrically connected to the second pin member 509, a wiring pattern 513 extending from the position of the through hole 506 and electrically connected to the third pin member 510, and a through hole A wiring pattern 515 extending from the position 507 and electrically connected to the fourth pin member 511 is formed. In addition to these wiring patterns 512 to 515, wiring patterns 554, 555 and 556 for connecting the first LED chips 516 to 519 in series are formed as described above, and the second LED chips 520 to 523 are connected in series. Wiring patterns 557, 558, and 559 for connecting to are formed.

  In FIG. 20, a light emitting unit 503 configured in the same manner as the light emitting unit 203 of the first embodiment is indicated by a two-dot chain line. The first LED chips 516 to 519 and the second LED chips 520 to 523 form a part of the light emitting unit 503, and the first LED chips 516 to 519 are disposed in the first region 525 of the light emitting unit 503 and the second LED. The chips 520 to 523 are respectively disposed in the second region 526 of the light emitting unit 503.

  The first LED chip 516 is connected between the wiring pattern 512 and the wiring pattern 554 with the anode side on the wiring pattern 512 side, and the first LED chip 517 has the anode side on the wiring pattern 554 side. Thus, the wiring pattern 554 and the wiring pattern 555 are connected. The first LED chip 518 is connected between the wiring pattern 555 and the wiring pattern 556 with the anode side facing the wiring pattern 555, and the first LED chip 519 has the anode side facing the wiring pattern 556 side. The wiring pattern 556 and the wiring pattern 514 are connected.

  On the other hand, the second LED chip 520 is connected between the wiring pattern 513 and the wiring pattern 557 with the anode side facing the wiring pattern 513, and the second LED chip 521 has the anode side facing the wiring pattern 557. Thus, the wiring pattern 557 and the wiring pattern 558 are connected. The second LED chip 522 is connected between the wiring pattern 558 and the wiring pattern 559 with the anode side facing the wiring pattern 558, and the second LED chip 523 has the anode side facing the wiring pattern 559. The wiring pattern 559 and the wiring pattern 515 are connected.

  The light emitting section 503 is provided with a first fluorescent member and a second fluorescent member as in the first embodiment, and all of them are three types of phosphors, a red phosphor, a green phosphor and a blue phosphor, and a filler. And are used. Accordingly, as in the first embodiment, near-ultraviolet light emitted from the first LED chips 516 to 519 is wavelength-converted by the first fluorescent member, and white light is emitted from the first fluorescent member, while the second LED chips 520 to 523 are emitted. The near-ultraviolet light emitted from is subjected to wavelength conversion by the second fluorescent member, and white light is emitted from the second fluorescent member.

  In the present embodiment, similarly to the first embodiment, by changing the mixing ratio of the three types of phosphors of the red phosphor, the green phosphor and the blue phosphor in the first phosphor and the second phosphor, The first color temperature T1 of the white light emitted from the first fluorescent member is made different from the second color temperature T2 of the white light emitted from the second fluorescent member. Therefore, by adjusting the magnitude of the current that flows from the first pin member 508 toward the second pin member 509 and the magnitude of the current that flows from the third pin member 510 toward the fourth pin member 511, respectively, White light having an arbitrary color temperature from the first color temperature T1 of the white light emitted from the fluorescent member to the second color temperature T2 of the white light emitted from the second fluorescent member is emitted from the LED light emitting element 501. Is possible.

  As described above, in this embodiment, the power supply to the first LED chips 516 to 519 and the power supply to the second LED chips 520 to 523 can be performed independently, and the same effect as the first embodiment is obtained. In addition, the current amount of the first LED chips 516 to 519 and the current amount of the second LED chips 520 to 523 can be kept low.

  Also in this embodiment, as in the first embodiment described above, the wiring board 502, the light emitting portion 503 (first fluorescent member and second fluorescent member), or the first pin member 508 and the second pin member 509 The 3 pin member 510 and the fourth pin member 511 can be variously changed without changing the gist of the present invention.

  Further, as in the case of connecting the first LED chips 516 to 519 in series and connecting the second LED chips 520 to 523 in series as in the present embodiment, as in the fourth embodiment described above, the pins are connected. It is also possible to construct a circuit of an LED light emitting element using only two members.

  FIG. 21 is an electric circuit diagram showing such a modification. As shown in FIG. 21, the LED light-emitting element 501 'of this modification uses two pin members, a first pin member 508' and a second pin member 509 '. The first pin member 508 'and the second pin member 509' are mounted on a wiring board (not shown) as in the fourth embodiment. Also in this modification, the first LED chips 516 ′ to 519 ′ are connected in series similarly to the first LED chips 516 to 519 of the fifth embodiment, and similarly to the second LED chips 520 to 523 of the fifth embodiment. Second LED chips 520 ′ to 523 ′ are connected in series.

  As shown in FIG. 21, the anode side of the first LED chip 516 ′ is electrically connected to the first pin member 508 ′, and the cathode side of the first LED chip 519 ′ is electrically connected to the second pin member 509 ′. ing. The cathode side of the second LED chip 520 'is electrically connected to the first pin member 508', and the anode side of the second LED chip 523 'is electrically connected to the second pin member 509'. Accordingly, in the present modification, the first LED chips 516 ′ to 519 ′ and the second LED chips 520 ′ to 523 ′ are electrically connected between the first pin member 508 ′ and the second pin member 509 ′ with the polarities reversed. Will be connected.

  In such a circuit configuration of the LED light emitting element 501 ′, a forward current flows through the first LED chips 516 ′ to 519 ′ by flowing a current from the first pin member 508 ′ toward the second pin member 509 ′. The first LED chip chips 516 ′ to 519 ′ emit light. On the other hand, when a current flows from the second pin member 509 ′ to the first pin member 508 ′, a forward current flows through the second LED chips 520 ′ to 523 ′, and the second LED chip 520 ′. ~ 523 'emits light.

  As described above, in the LED light emitting element 501 ′ of the present modification, both the first pin member 508 ′ and the second pin member 509 ′ are used as common terminals, and power is supplied to the first LED chips 516 ′ to 519 ′. The power supply to the second LED chips 520 ′ to 523 ′ can be performed independently. As in the fifth embodiment, the current amount of the first LED chips 516 'to 519' and the current amount of the second LED chips 520 'to 523' can be kept low.

  Although the description of the LED light emitting element according to the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without changing the gist of the present invention. For example, in each of the above-described embodiments and modifications, a fluorescent member for converting the wavelength of light emitted from each LED chip is provided in the light emitting unit. However, such a fluorescent member is not used, and the LED chip is not used. The emitted light may be emitted from the LED light emitting element.

  In this case, for example, a blue LED chip that emits blue light (wavelength 400 nm to 490 nm) is a first LED chip, and a yellow LED chip that emits yellow light (wavelength 560 nm to 590 nm) is a second LED chip. May be combined to obtain white light. Further, blue-green light and red are obtained by using a blue-green LED chip emitting blue-green light (wavelength 480 nm to 500 nm) as a first LED chip and a red LED chip emitting red light (wavelength 580 nm-700 nm) as a second LED chip. White light may be obtained by combining light.

  Alternatively, LED chips having different emission colors can be combined in various ways according to the color temperature, chromaticity, luminance, or saturation of the emitted light required for the LED light emitting element. Therefore, the LED chips used as the first LED chip or the second LED chip are not all the same, and different LED chips can be mixed.

  In addition, the number of LED chips employed in each of the above-described embodiments and modifications is not limited, and can be increased or decreased according to specifications required for the LED light-emitting elements. Furthermore, the electric circuit configured using the LED chip is not limited to the embodiments and the modifications.

  In addition, when the fluorescent member for converting the wavelength of the light emitted from each LED chip is provided in the light emitting unit as in the above-described embodiments and modifications, the fluorescent member is brought into close contact with the LED chip in each embodiment and modification. However, a gap may be provided between the fluorescent member and the LED chip while covering each LED chip in the same manner as in each example and modification.

  In addition, although the shape of the wiring board in each of the above-described embodiments and modifications is a disk shape, it can be variously changed without changing the gist of the present invention, and can be changed in many ways such as a quadrangular shape and a hexagonal shape. Various shapes such as a square shape and an oval shape can be adopted depending on the usage state of the LED light emitting element.

  The shape of the pin member in each of the embodiments and modifications described above can be variously changed without changing the gist of the present invention. For example, a prismatic pin member can be used instead of the columnar pin member. Is also possible. Similarly, regarding the through hole into which the pin member is inserted, various shapes can be adopted as long as the pin member can be inserted. Further, the position where the through hole is disposed is not limited to the position employed in each of the embodiments and modifications, and can be variously changed as necessary.

101, 101 ′, 201, 301, 401, 501, 501 ′ LED light emitting element 102, 102 ′, 102 ″, 202, 302, 402, 502 Wiring substrate 104-107 Through hole 204-206 Through hole 304-306 Through hole 404, 405 Through hole 504 to 507 Through hole 108, 108 ', 149 First pin member (first metal pin member)
208, 308, 408, 508, 508 ′ first pin member (first metal pin member)
109, 109 ′, 150 Second pin member (second metal pin member)
209, 309, 409, 509, 509 ′ second pin member (second metal pin member)
110, 110 ′, 151 Third pin member (third metal pin member)
210, 320, 510 Third pin member (third metal pin member)
111, 111 ′, 152, 511 Fourth pin member (fourth metal pin member)
116-119, 216-219, 316-319 1st LED chip 416-419, 516-519, 516′-519 ′ 1st LED chip 120-123, 220-223, 320-323 2nd LED chip 420-423, 520 523, 520 ′ to 523 ′ second LED chip

Claims (21)

An LED chip that emits light in a predetermined wavelength range between the visible light region and the near ultraviolet region;
A wiring board having a wiring pattern for constituting an electric circuit including the LED chip by mounting the LED chip, and a plurality of through holes formed therein,
An LED light emitting element comprising: a plurality of metal pin members that are inserted into the through holes and electrically connected to the wiring pattern.   The LED light emitting element according to claim 1, further comprising a wavelength conversion member that converts the wavelength of light emitted from the LED chip and emits the light. The wiring board is
A substrate body made of a metal plate, and an insulating film formed on the surface of the substrate body to electrically insulate the wiring pattern from the substrate body,
The LED light emitting element according to claim 1, wherein the metal pin member is inserted into the through hole with an insulator interposed between the metal pin member and the substrate body.   The LED light-emitting element according to claim 1, wherein the wiring board has the wiring pattern formed on a substrate body made of an insulator.   The LED light-emitting element according to claim 4, wherein the substrate body is made of an electrically insulating flexible body.   The metal pin member has a flat flange portion at one end and is tapered at the other end. The metal pin member is inserted into the through hole from the other end, and the flange portion contacts the wiring board. The LED light-emitting element according to claim 1, wherein the LED light-emitting element is in contact with the LED light-emitting element. The wiring board includes a first surface on which the LED chip is mounted, and a second surface that is the back side of the first surface,
7. The metal pin member is characterized in that the flange portion is located on the first surface side of the wiring board and the other end side protrudes from the second surface of the wiring board. LED light emitting element as described in 2. The wiring board includes a first surface on which the LED chip is mounted, and a second surface that is the back side of the first surface,
7. The metal pin member is characterized in that the flange portion is located on the second surface side of the wiring board and the other end side protrudes from the first surface of the wiring board. LED light emitting element as described in 2.   3. The LED light emitting device according to claim 1, wherein both ends of the metal pin member are formed in a tapered shape, and are inserted into the through holes so as to protrude from both surfaces of the wiring board. element. As the LED chip, a plurality of LED chips divided into a first LED chip and a second LED chip are mounted on the wiring board,
Four through holes are formed in the wiring board,
The metal pin member includes a first metal pin member, a second metal pin member, a third metal pin member, and a fourth metal pin member that are inserted into the four through holes.
The first metal pin member and the second metal pin member are used for power supply to the first LED chip, and the third metal pin member and the fourth metal pin member are used for power supply to the second LED chip. The LED light-emitting device according to claim 1, wherein As the LED chip, a plurality of LED chips divided into a first LED chip and a second LED chip are mounted on the wiring board,
Three through holes are formed in the wiring board,
The metal pin member includes a first metal pin member, a second metal pin member, and a third metal pin member that are fitted into the three through holes.
The first metal pin member and the second metal pin member are used for supplying power to the first LED chip, and the second metal pin member and the third metal pin member are used for supplying power to the second LED chip. The LED light-emitting device according to claim 1, wherein As the LED chip, a plurality of LED chips divided into a first LED chip and a second LED chip are mounted on the wiring board,
Two through holes are formed in the wiring board,
The metal pin member comprises a first metal pin member and a second metal pin member that are fitted into the two through holes,
The first LED chip and the second LED chip are connected between the first metal pin member and the second metal pin member with opposite polarities. LED light emitting element. As the LED chip, a plurality of LED chips divided into a first LED chip and a second LED chip are mounted on the wiring board,
Four through holes are formed in the wiring board,
The metal pin member includes a first metal pin member, a second metal pin member, a third metal pin member, and a fourth metal pin member that are inserted into the four through holes.
The wavelength conversion member is different from the first wavelength region in which the first wavelength conversion member that converts the wavelength of the light emitted from the first LED chip into a first wavelength region and emits the light, and the light emitted from the second LED chip. A second wavelength conversion member that radiates by converting the wavelength into the second wavelength region;
The first metal pin member and the second metal pin member are used for power supply to the first LED chip, and the third metal pin member and the fourth metal pin member are used for power supply to the second LED chip. The LED light emitting device according to claim 2, wherein As the LED chip, a plurality of LED chips divided into a first LED chip and a second LED chip are mounted on the wiring board,
Three through holes are formed in the wiring board,
The metal pin member includes a first metal pin member, a second metal pin member, and a third metal pin member that are fitted into the three through holes.
The wavelength conversion member is different from the first wavelength region in which the first wavelength conversion member that converts the wavelength of the light emitted from the first LED chip into a first wavelength region and emits the light, and the light emitted from the second LED chip. A second wavelength conversion member that radiates by converting the wavelength into the second wavelength region;
The first metal pin member and the second metal pin member are used for supplying power to the first LED chip, and the second metal pin member and the third metal pin member are used for supplying power to the second LED chip. The LED light emitting device according to claim 2, wherein As the LED chip, a plurality of LED chips divided into a first LED chip and a second LED chip are mounted on the wiring board,
Two through holes are formed in the wiring board,
The metal pin member comprises a first metal pin member and a second metal pin member that are fitted into the two through holes,
The wavelength conversion member is different from the first wavelength region in which the first wavelength conversion member that converts the wavelength of the light emitted from the first LED chip into a first wavelength region and emits the light, and the light emitted from the second LED chip. A second wavelength conversion member that radiates by converting the wavelength into the second wavelength region;
The first LED chip and the second LED chip are connected between the first metal pin member and the second metal pin member with opposite polarities. LED light emitting element.   The LED light-emitting element according to claim 2, wherein the wavelength conversion member is disposed in close contact with the LED chip.   The LED light emitting element according to claim 2, wherein the wavelength conversion member is disposed apart from the LED chip. The metal pin member protrudes from the surface of the wiring board on which the LED chip is mounted, and is inserted into the through hole.
The LED light emitting device according to claim 17, wherein the wavelength conversion member is supported by the metal pin member protruding from a surface of the wiring board on which the LED chip is mounted.   An optical lens having an incident surface parallel to a surface of the wiring board on which the LED chip is mounted and disposed so that the LED chip is positioned between the wiring board and the wiring board. The LED light emitting element according to claim 1. The metal pin member protrudes from the surface of the wiring board on which the LED chip is mounted, and is inserted into the through hole.
The LED light emitting device according to claim 19, wherein the optical lens is supported by the metal pin member protruding from a surface of the wiring board on which the LED chip is mounted.   21. An LED light-emitting device comprising the LED light-emitting element according to claim 1 and a receiving member configured to receive the metal pin member of the LED light-emitting element and to conduct electricity.

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