JP2011203494A - Method of forming pattern and method of manufacturing color filter - Google Patents

Abstract

The present invention provides a pattern forming method capable of accurately patterning a resin layer on a plastic substrate.
A pattern forming method according to the present invention first prepares a plastic substrate 2 and heat-treats the plastic substrate 2 to converge the dimensional change of the plastic substrate 2. Next, the resin layer 3a is provided in a predetermined pattern on the heat-treated plastic substrate 2. Thereafter, the plastic substrate 2 provided with the resin layer 3a is subjected to heat treatment to cure the resin layer 3a.
[Selection] Figure 2

Description

  The present invention relates to a pattern forming method for forming a patterned resin layer on a plastic substrate and a method for manufacturing a color filter including the method, and more particularly, a pattern capable of forming a patterned resin layer with high accuracy. The present invention relates to a forming method and a manufacturing method of a color filter.

  In recent years, a liquid crystal display panel has been developed using a plastic material instead of glass as a base material, and a patterned black matrix and a color filter having a plurality of red pixels, green pixels, and blue pixels arranged on one side. ing. Thus, by making the base material made of plastic, the color filter is reduced in thickness and cost, and the base material is prevented from cracking (see Patent Documents 1 and 2).

JP 2003-177551 A JP 2003-66423 A

  However, in such a plastic substrate, there is a problem that a dimensional change rate due to a temperature change at the time of heat treatment is larger by one digit than that of a generally used glass substrate. This is considered to be due to the fact that the uncured component in the plastic substrate is cured to cause heat shrinkage or the residual stress is removed. In addition, the dimensions of the plastic substrate also change by absorbing moisture in the air. For this reason, when a resin layer for forming a black matrix or the like is patterned on a plastic substrate and then heat treatment is applied to cure the resin layer, the dimensions of the pattern may be shifted. As a result, it has been difficult to accurately form a patterned resin layer on the plastic substrate.

  The present invention has been made in consideration of such points, and provides a pattern forming method and a color filter manufacturing method capable of accurately forming a patterned resin layer on a plastic substrate. With the goal.

  The present invention provides a pattern forming method for forming a patterned resin layer on a plastic substrate, a step of preparing the plastic substrate, and heat-treating the plastic substrate to change the dimensions of the plastic substrate. A pre-heat treatment step for converging, a step of providing a resin layer in a predetermined pattern on the heat-treated plastic base material, and heat-treating the plastic base material provided with the resin layer to cure the resin layer A pattern forming method comprising: a heat treatment step.

  The present invention is the pattern forming method, wherein the temperature of the heat treatment in the preliminary heat treatment step is equal to or higher than the temperature of the heat treatment in the heat treatment step of curing the resin layer.

  In the present invention, the step of providing the resin layer in a predetermined pattern includes a step of applying a photosensitive resin material on a plastic substrate and drying to form a resin layer, and forming the resin layer in a predetermined pattern. It is a pattern formation method characterized by including the process of exposing and the process of developing and patterning the exposed resin layer.

  In the present invention, the plastic substrate is placed in an atmosphere of normal temperature and humidity between the preliminary heat treatment step and the step of forming the resin layer, or between the step of forming the resin layer and the step of exposing the resin layer in a predetermined pattern. The pattern forming method is characterized in that the temperature and water absorption rate of the plastic substrate are equilibrated with a normal temperature and humidity atmosphere by exposure to water.

  The present invention is a pattern forming method characterized in that in the step of providing a resin layer in a predetermined pattern, a resin layer is formed by applying ink in a predetermined pattern on a plastic substrate by an inkjet method. .

  The present invention is a pattern forming method in which, in the step of providing a resin layer in a predetermined pattern, a resin layer having a predetermined pattern is transferred onto a plastic substrate by a transfer method.

  The present invention exposes the plastic substrate to a normal temperature and humidity atmosphere between the preliminary heat treatment step and the step of providing the resin layer in a predetermined pattern, and sets the temperature and water absorption rate of the plastic substrate to a normal temperature and normal humidity atmosphere. It is a pattern formation method characterized by making it equilibrate.

  In the present invention, in the step of providing the resin layer in a predetermined pattern, a wiring layer made of a conductive material is provided on the plastic substrate, the resin layer is provided in a predetermined pattern on the wiring layer, and the resin layer is cured. After the heat treatment step, the wiring layer is etched and patterned using the resin layer as a resist.

  The present invention includes a step of forming a resin layer for a plurality of color pixels patterned so as to constitute a plurality of color pixels on a plastic substrate by the pattern forming method described above, and obtaining a color filter. This is a method for producing a color filter.

  According to the present invention, since the dimensional change of the plastic substrate is converged by the heat treatment of the preliminary heat treatment step, the dimensional change amount of the plastic substrate due to the heat treatment of the heat treatment step of curing the resin layer can be suppressed. Accordingly, when the resin layer is cured by heat treatment, the plastic substrate can be prevented from changing in dimensions, and the patterned resin layer can be accurately formed on the plastic substrate.

  Further, according to the present invention, a color filter in which a plurality of pixel resin layers patterned so as to constitute a plurality of color pixels is formed on a plastic substrate with high accuracy can be obtained. Thereby, the accuracy of the display image of the color filter can be improved.

FIG. 1 is a diagram illustrating an example of a cross-sectional configuration of a color filter according to a first embodiment of the present invention. FIG. 2 is a diagram showing a pattern forming apparatus according to the first embodiment of the present invention. FIG. 3 is a diagram showing a process of the pattern forming method according to the first embodiment of the present invention. FIG. 4 is a diagram showing a pattern forming apparatus according to a second embodiment of the present invention. FIG. 5 is a diagram showing a process of a pattern forming method according to the second embodiment of the present invention. FIG. 6 is a diagram showing a pattern forming apparatus according to the third embodiment of the present invention. FIG. 7 is a diagram showing a pattern forming apparatus according to the fourth embodiment of the present invention. FIG. 8 is a diagram showing a process of a pattern forming method according to the fourth embodiment of the present invention. FIG. 9 is a diagram showing the behavior of dimensional change in the embodiment of the present invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment Hereinafter, an embodiment of the invention will be described with reference to the drawings. Here, FIGS. 1 to 3 are diagrams showing a pattern forming method and a color filter manufacturing method according to the first embodiment of the present invention.

  First, the cross-sectional configuration of the color filter 1 obtained by the pattern forming method and the color filter manufacturing method in the present embodiment will be described with reference to FIG. Among these, the pattern forming method is for forming the patterned resin layer 3 on the plastic substrate 2.

  As shown in FIG. 1, a color filter 1 obtained by the method for producing a color filter in the present embodiment includes a plastic substrate 2 and a plurality of banks (partition walls) 3b formed on the plastic substrate 2. And a black matrix 3. Among these, the black matrix 3 has a plurality of substantially rectangular openings 3c (see FIG. 6) formed by a plurality of banks 3b. Such a black matrix 3 includes a photosensitive material layer (resin layer) 3a patterned with a photosensitive material (resin material) having photosensitivity.

  Usually, a plurality of color pixels are formed in each opening 3 c of the black matrix 3 on the plastic substrate 2. That is, a plurality of red pixels 4 are formed in each opening 3c of the black matrix 3 by a photosensitive material for red (R) pixels, a photosensitive material for green (G) pixels, and a photosensitive material for blue (B) pixels. , Green pixel 5 and blue pixel 6 are formed. The arrangement of the pixels 4, 5, 6 is not shown, but may be a known arrangement such as a stripe arrangement, a delta arrangement (triangle arrangement), a square arrangement (four pixel arrangement), or the like. Thus, one display pixel on the screen is formed by three adjacent pixels having different colors. Further, yellow pixels (not shown) or the like may be added to form four or more color pixels.

  Further, these pixels 4, 5, 6 are covered with a protective layer 7. A transparent electrode film 8 made of indium tin oxide (ITO) is formed on the protective layer 7.

  Such a color filter 1 is combined with, for example, a liquid crystal element including a switching element (for example, TFT) and a liquid crystal layer arranged corresponding to each of the pixels 4, 5, and 6, and a surface light source. LCD) or electronic paper. In this configuration, the liquid crystal is controlled by the switching element to function as a shutter, and emits light from the surface light source only through pixels of a desired color. In this way, a color image is displayed on the screen.

  Next, the material of each component of the color filter 1 will be described.

  As a material used for the plastic substrate 2, cycloolefin polymer and polycarbonate are preferable for LCD applications because of high heat resistance, low water absorption, and low retardation. For electronic paper applications, polyethylene terephthalate and polyethylene naphthalate are preferable because they are mass-produced products and low cost. Besides these, polyethersulfone, polyethylene naphthol, polyimide, and organic-inorganic composite resin can be used because of high heat resistance. Moreover, it is preferable that the thickness of the plastic base material 2 is 50-300 micrometers, and it is preferable that it is about 100 micrometers especially from the ease of handling. As a result, handling on a single sheet becomes easy, and it can be wound around a supply roll 11 and a take-up roll 18 of the pattern forming apparatus 10 described later, and a necessary strength can be ensured.

  As the photosensitive material for forming the photosensitive material layer 3a, it is preferable to use a pigment-dispersed photosensitive resin composition containing a black pigment having a light shielding property, a solvent, and a bonding resin (binder). Similarly, it is preferable to use a photosensitive resin composition in which a pigment of each color is dispersed as the photosensitive material for each color pixel.

  Next, a pattern forming apparatus 10 for carrying out the pattern forming method in the present embodiment using the photolithography method will be described with reference to FIG.

  As shown in FIG. 2, the pattern forming apparatus 10 is provided on a supply roll 11 around which a continuous belt-shaped plastic substrate 2 is wound, and on the downstream side in the traveling direction of the supply roll 11, and is fed from the supply roll 11. And a preliminary heat treatment section 12 for performing heat treatment on the plastic substrate 2. The temperature of the heat treatment in the preliminary heat treatment portion 12 is substantially the same as the temperature of the heat treatment in the heat treatment portion 17 described later for curing the photosensitive material layer (resin layer) 3a. That is, here, the plastic substrate 2 is dried at about 160 ° C. for about 1 hour to converge its dimensional change.

  On the downstream side of the preliminary heat treatment part 12, a resist application part 13 for applying a photosensitive material in the form of a film on the plastic substrate 2 is provided. The resist coating unit 13 is configured to apply a photosensitive material on the plastic substrate 2 by a coating method such as a gravure coater or a die coater to form a photosensitive material layer 3a.

  A prebake processing unit 14 for drying the photosensitive material layer 3 a is provided on the downstream side of the resist coating unit 13. The pre-baking processing unit 14 is configured to dry the photosensitive material layer 3a at a temperature of about 50 to 120 ° C. for about 1 to 5 minutes.

  An exposure processing unit 15 that exposes the photosensitive material layer 3a in a predetermined pattern is provided on the downstream side of the pre-baking processing unit. Here, exposure is performed using a black mask 3 having a predetermined shape and a photomask 15a for forming alignment marks (not shown).

  On the downstream side of the exposure processing unit 15, a development processing unit 16 that develops and patterns the exposed photosensitive material layer 3 a is provided. The development processing unit 16 develops the photosensitive material layer 3a using, for example, a 0.05 to 10% solution of potassium hydroxide (KOH) as a developer. In this manner, the photosensitive material layer 3a is patterned to define a predetermined pattern, that is, a plurality of substantially rectangular openings 3c.

  A heat treatment section 17 is provided on the downstream side of the development processing section 16 to heat treat the plastic base material 2 on which the photosensitive material layer 3a is patterned to cure the photosensitive material layer 3a. In the heat treatment section 17 for curing the photosensitive material layer 3a, the plastic substrate 2 is preferably heat treated at a predetermined temperature near the glass transition point for a predetermined time. For example, when polyethylene naphthalate is used for the plastic substrate 2, the plastic substrate 2 is photosensitive at a temperature of about 160 ° C. near 155 ° C., which is the glass transition point of polyethylene naphthalate, together with the photosensitive material layer 3 a. In order to thermally cure the conductive material layer 3a, heat treatment is performed for about 60 minutes. In this way, the photosensitive material layer 3a is cured (post-bake).

  On the downstream side of the heat treatment section 17 for curing the photosensitive material layer 3a, a take-up roll 18 for winding up the heat-treated plastic substrate 2 is provided. Further, a plurality of guide rolls 19 for guiding the plastic substrate 2 are provided at appropriate positions between the supply roll 11 and the take-up roll 18.

  Next, the operation of the present embodiment having such a configuration, that is, the pattern forming method and the color filter manufacturing method according to the present embodiment will be described with reference to FIGS.

  First, the plastic base material 2 is prepared (step S11). In this case, as shown in FIG. 2, a supply roll 11 around which a continuous belt-shaped plastic substrate 2 made of polyethylene naphthalate is wound is prepared.

  Next, the plastic substrate 2 is unwound from the supply roll 11, and the plastic substrate 2 is subjected to heat treatment by the preliminary heat treatment unit 12 (step S12). In this case, the plastic substrate 2 is heat-treated at a temperature of about 160 ° C. for about 1 hour. Thus, the dimensional change can be converged by removing the residual internal stress of the plastic substrate 2 and curing the uncured component.

  A photosensitive material is applied in the form of a film by the resist application unit 13 on the heat-treated plastic substrate 2 to form a photosensitive material layer 3a (step S13).

  The photosensitive material layer 3a is dried (prebaked) by the prebaking processing unit 14 (step S14). In this case, it is dried at a temperature of about 50 ° C. to 120 ° C. for about 1 to 5 minutes. Thereby, the solvent contained in the photosensitive material layer 3a evaporates, and the adhesiveness of the photosensitive material layer 3a to the plastic substrate 2 can be improved.

  The pre-baked plastic base material 2 is exposed to an atmosphere of normal temperature and normal humidity (about 23 ° C., about 50%) to equilibrate the temperature and water absorption rate of the plastic base material 2 with the normal temperature and normal humidity atmosphere (step S15). ). Thereby, the dimensional change of the plastic base material 2 by dehydration at the time of prebaking can be eliminated. In this case, it is preferable to select the pre-baking temperature and time within a range where the developability of the photosensitive material does not deteriorate.

  Next, in the exposure processing unit 15, the photosensitive material layer 3a is exposed with a predetermined pattern (step S16). In this case, exposure is performed using a black matrix 3 having a predetermined shape and a photomask 15a for forming alignment marks.

  The exposed photosensitive material layer 3a is developed in the development processing unit 16 (step S17). Thus, the photosensitive material layer 3a can be patterned so as to define a predetermined pattern, that is, a plurality of substantially rectangular openings 3c.

  Next, the heat treatment unit 17 for curing the photosensitive material layer 3a heat-treats the plastic base material 2 on which the photosensitive material layer 3a is patterned (step S18). In this case, the plastic substrate 2 is heat-treated at about 160 ° C. for about 60 minutes together with the photosensitive material layer 3a. Thereby, the photosensitive material layer 3a can be cured (post-baked). In this case, since the dimensional change of the plastic substrate 2 is converged by the heat treatment by the preliminary heat treatment part 12, the amount of dimensional change due to the heat treatment of the heat treatment part 17 for curing the photosensitive material layer 3a is suppressed. Can do.

  In this way, the photosensitive material layer 3a is patterned on the plastic substrate 2. Thereafter, the plastic substrate 2 is wound and collected by the winding roll 18 (step S19).

  Thereafter, a photosensitive material layer for a plurality of color pixels patterned to form a plurality of color pixels is formed on the plastic substrate 2. That is, by repeating steps S13 to S18 described above, the photosensitive material for red pixel, the photosensitive material for green pixel, and the photosensitive material for blue pixel are respectively applied to the plastic substrate 2, and the plastic substrate A plurality of red pixels 4, green pixels 5, and blue pixels 6 are formed in each opening 3 c of the black matrix 3 on 2. In this case, in step 13, the photosensitive material for red pixel, the photosensitive material for green pixel, and the photosensitive material for blue pixel containing the pigment of each color are applied on the plastic substrate 2, and in step S <b> 16. The exposure is performed using a photomask corresponding to the arrangement of the pixels 4, 5, 6. Thus, a photosensitive material layer for red pixels patterned so as to constitute a plurality of red pixels 4, a photosensitive material layer for green pixels patterned so as to constitute a plurality of green pixels 5, and a plurality of blue colors The photosensitive material layer for blue pixels patterned so as to constitute the pixel 6 is formed. In this way, the color filter 1 is obtained.

  As described above, according to the present embodiment, since the dimensional change of the plastic substrate 2 is converged by the heat treatment of the preliminary heat treatment step, the dimensions of the plastic substrate 2 by the heat treatment of the heat treatment step of curing the photosensitive material layer 3a. The amount of change can be suppressed. Thus, when the photosensitive material layer 3a is cured by heat treatment, the plastic substrate 2 can be prevented from changing in size, and the patterned photosensitive material layer 3a is formed on the plastic substrate 2. It can be formed with high accuracy.

  Moreover, according to this Embodiment, the prebaked plastic base material 2 is exposed to the normal temperature normal humidity atmosphere, and the temperature and the water absorption rate will equilibrate with the normal temperature normal humidity atmosphere. This makes it possible to expose the photosensitive material layer 3a while lowering the temperature of the plastic substrate 2 to room temperature and keeping the water absorption in equilibrium with an atmosphere of normal humidity. For this reason, exposure can be performed at a temperature and a water absorption rate substantially equal to the temperature and the water absorption rate when the plastic substrate 2 is used (for example, when the color filter 1 is used), and the patterning accuracy at the time of exposure can be increased. The patterning accuracy can be further improved.

  Furthermore, according to the present embodiment, the color filter 1 using the plastic substrate 2 on which the black matrix 3, the red pixel 4, the green pixel 5, and the blue pixel 6 are patterned with high accuracy can be obtained. Thereby, the accuracy of the display image of the color filter 1 can be improved.

  In the present embodiment, an example in which the plastic substrate 2 is exposed to a normal temperature and humidity atmosphere between the step of pre-baking the photosensitive material layer 3a and the step of exposing the photosensitive material layer 3a has been described. . However, the present invention is not limited to this, and after pre-baking the photosensitive material layer 3a, the photosensitive material layer 3a is exposed without equilibrating the temperature and water absorption rate of the plastic substrate 2 with an atmosphere of normal temperature and humidity. You may do it. Also in this case, since the plastic base material 2 is heat-treated, the plastic base material 2 is prevented from changing in size by the heat treatment in the heat treatment step for curing the photosensitive material layer 3a, and is patterned on the plastic base material 2. The formed photosensitive material layer 3a can be formed with high accuracy.

  Further, in this case, the plastic substrate 2 may be exposed to an atmosphere of normal temperature and humidity between the step of heat-treating the plastic substrate 2 by the preliminary heat treatment unit 12 and the step of applying the photosensitive material. As a result, the temperature of the high-temperature plastic substrate 2 heat-treated by the preliminary heat treatment unit 12 is lowered to room temperature, and the water absorption rate is balanced with an atmosphere of normal humidity, and sent to the resist coating unit 13 in the next step. it can.

  In the present embodiment, the example in which the temperature of the heat treatment in the preliminary heat treatment portion 12 is substantially the same as the temperature of the heat treatment in the heat treatment portion 17 for curing the photosensitive material layer 3a has been described. However, the present invention is not limited to this, and the temperature of the heat treatment in the preliminary heat treatment portion 12 may be higher than the temperature of the heat treatment in the heat treatment portion 17 for curing the photosensitive material layer 3a. In this case, the dimensional change of the plastic substrate 2 can be further converged by the heat treatment in the preliminary heat treatment step, and thereby the dimensional change amount of the plastic substrate 2 by the heat treatment in the heat treatment step of curing the photosensitive material layer 3a. Can be further suppressed.

  In the present embodiment, the example in which the black matrix 3 and the pixels 4, 5, 6 of each color are patterned on the plastic substrate 2 to obtain the color filter 1 has been described. However, the present invention is not limited to this, and the photosensitive material for red pixel, the photosensitive material for green pixel, and the photosensitive material for blue pixel are applied without forming the black matrix 3 on the plastic substrate 2. A photosensitive material layer for red pixels patterned so as to constitute a plurality of red pixels, a photosensitive material layer for green pixels patterned so as to constitute a plurality of green pixels, and a plurality of blue pixels. The color filter 1 may be obtained by forming a patterned photosensitive material layer for blue pixels as described above. Even in this case, the red pixel, the green pixel, and the blue pixel can be formed with high accuracy, and the accuracy of the display image of the color filter 1 can be improved.

  Further, in the present embodiment, the example in which the red pixel 4, the green pixel 5, and the blue pixel 6 are formed as the pixels of each color of the color filter 1 has been described. However, the present invention is not limited to this, and yellow (Y) pixels, magenta (M) pixels, and cyan (C) pixels may be formed as pixels of each color of the color filter 1. That is, a yellow pixel photosensitive material, a magenta pixel photosensitive material, and a cyan pixel photosensitive material are coated on the plastic substrate 2 and patterned to form a plurality of yellow pixels. Forming a photosensitive material layer, a magenta pixel photosensitive material layer patterned to constitute a plurality of magenta pixels, and a cyan pixel photosensitive material layer patterned to constitute a plurality of cyan pixels; The color filter 1 may be obtained.

Second Embodiment Next, referring to FIG. 4 and FIG. 5, a pattern forming method and a color filter manufacturing method according to a second embodiment of the present invention will be described.

  In the second embodiment shown in FIG. 4 and FIG. 5, the only difference is that the ink is applied in a predetermined pattern on the plastic substrate by the ink jet method. 3 is substantially the same as the first embodiment shown in FIG. 4 and 5, the same parts as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  A pattern forming apparatus 20 for carrying out the pattern forming method in the present embodiment using the ink jet method will be described with reference to FIG.

  As shown in FIG. 4, the pattern forming apparatus 20 is provided on the downstream side in the traveling direction of the supply roll 11 around which the continuous plastic substrate 2 in the form of a belt is wound, and is fed from the supply roll 11. And a preliminary heat treatment section 12 for performing heat treatment on the plastic substrate 2.

  An ink jet printing unit 21 that applies ink (resin material) onto the plastic substrate 2 by an ink jet method is provided on the downstream side in the traveling direction of the preliminary heat treatment unit 12. The ink jet printing unit 21 is configured to apply ink onto the plastic substrate 2 in a predetermined pattern to form a patterned ink layer (resin layer) 3d. Here, as a material used for the ink, it is preferable to use an ink containing a pigment or a dye and suitable for the ink jet method.

  A heat treatment section 17 is provided on the downstream side of the ink jet printing section 21 for performing a heat treatment for curing the ink layer 3d on the plastic substrate 2 on which the ink layer 3d is patterned.

  A take-up roll 18 that winds up the heat-treated plastic substrate 2 is provided on the downstream side of the heat treatment section 17 that cures the ink layer 3d. Further, a plurality of guide rolls 19 for guiding the plastic substrate 2 are provided at appropriate positions between the supply roll 11 and the take-up roll 18.

  In the pattern forming method and the color filter manufacturing method shown in FIGS. 4 and 5, first, a plastic substrate 2 is prepared (step S21). In this case, as shown in FIG. 4, a supply roll 11 around which a continuous belt-like plastic substrate 2 made of polyethylene naphthalate is wound is prepared.

  Next, heat treatment is performed on the plastic substrate 2 fed from the supply roll 11 by the preliminary heat treatment unit 12 (step S22).

  The heat-treated plastic substrate 2 is exposed to a normal temperature and humidity atmosphere, and the temperature and water absorption rate of the plastic substrate 2 are balanced with the normal temperature and humidity atmosphere (step S23).

  Next, ink is applied onto the plastic substrate 2 by the inkjet printing unit 21 (step S24). In this case, the ink can be applied so as to define a predetermined pattern, that is, a plurality of substantially rectangular openings 3c, to form a patterned ink layer 3d.

  Next, heat treatment is performed on the plastic substrate 2 on which the ink layer 3d is patterned by the heat treatment unit 17 that cures the ink layer 3d (step S25). In this case, the plastic substrate 2 is heat-treated with the ink layer 3d at about 160 ° C. for about 60 minutes. As a result, the ink layer 3d can be cured. In this case, since the dimensional change of the plastic substrate 2 is converged by the preliminary heat treatment part 12, the dimensional change can be suppressed by the heat treatment of the heat treatment part 17 for curing the ink layer 3d.

  In this way, the ink layer 3d is patterned on the plastic substrate 2. Thereafter, the plastic substrate 2 is wound and collected by the winding roll 18 (step S26).

  Thereafter, each of the openings 3c of the ink layer 3d (black matrix 3) on the plastic substrate 2 is filled with red pixel ink, green pixel ink, and blue pixel ink, respectively. , Green pixel 5 and blue pixel 6 are formed. Specifically, the pixels 4, 5, and 6 are formed by repeating the steps S23 to S25 described above. In this case, in step S24, the ink containing the pigment or dye of each color is applied in each opening 3c in each pattern. In this way, the color filter 1 is obtained.

  As described above, according to the present embodiment, since the dimensional change of the plastic substrate 2 is converged by the heat treatment in the preliminary heat treatment step, the dimensional change amount of the plastic substrate 2 by the heat treatment in the heat treatment step for curing the ink layer 3d. Can be suppressed. As a result, when the ink layer 3d is cured by heat treatment, the plastic substrate 2 can be prevented from changing in size, and the patterned ink layer 3d is accurately formed on the plastic substrate 2. be able to.

  Moreover, according to this Embodiment, the plastic base material 2 heat-processed by the preliminary heat processing part 12 is exposed to the normal temperature normal humidity atmosphere, and the temperature and a water absorption rate equilibrate with the normal temperature normal humidity atmosphere. As a result, the temperature of the plastic substrate 2 can be lowered to room temperature, and the ink can be applied with the water absorption rate balanced with an atmosphere of normal humidity. For this reason, the ink can be applied in a pattern at a temperature and a water absorption rate substantially equal to the temperature and the water absorption rate when the plastic substrate 2 is used (for example, when the color filter 1 is used), and patterning accuracy at the time of application is high. Can be maintained even during use, and the patterning accuracy can be further improved.

  Furthermore, according to the present embodiment, the color filter 1 using the plastic substrate 2 on which the black matrix 3, the red pixel 4, the green pixel 5, and the blue pixel 6 are patterned with high accuracy can be obtained. Thereby, the accuracy of the display image of the color filter 1 can be improved.

  In the present embodiment, the example in which the plastic substrate 2 is exposed to an atmosphere of normal temperature and humidity between the step of performing the heat treatment by the preliminary heat treatment unit 12 and the step of applying the ink has been described. However, the present invention is not limited to this. After the heat treatment of the preliminary heat treatment section 12, the ink is applied without causing the temperature and water absorption rate of the plastic substrate 2 to equilibrate with an atmosphere of normal temperature and humidity. Also good. Also in this case, since the plastic substrate 2 is heat-treated, the plastic substrate 2 is patterned on the plastic substrate 2 while suppressing the dimensional change of the plastic substrate 2 by the heat treatment in the heat treatment step for curing the ink layer 3d. The ink layer 3d can be formed with high accuracy.

  Further, in the present embodiment, the example in which the black matrix 3 and the respective color pixels 4, 5, 6 are formed by applying ink onto the plastic substrate 2 by the inkjet method has been described. However, the present invention is not limited to this, and the black matrix 3 may be formed by the inkjet method, and the color pixels 4, 5, 6 may be formed by the photolithography method as in the first embodiment, or The black matrix 3 may be formed by a photolithography method, and the color pixels 4, 5, 6 may be formed by an ink jet method.

  Further, in the present embodiment, the example in which the red pixel 4, the green pixel 5, and the blue pixel 6 are formed as the pixels of each color of the color filter 1 has been described. However, the present invention is not limited to this, and yellow (Y) pixels, magenta (M) pixels, and cyan (C) pixels may be formed as pixels of each color of the color filter 1. That is, a yellow (Y) pixel ink, a magenta (M) pixel ink, and a cyan (C) pixel ink are applied in each opening 3c of the black matrix 3 on the plastic substrate 2, and a plurality of inks are applied. Yellow ink layer patterned to form yellow pixels, magenta pixel ink layer patterned to form multiple magenta pixels, and cyan pixel patterned to form multiple cyan pixels An ink layer may be formed to obtain the color filter 1.

Third Embodiment Next, referring to FIG. 6, a pattern forming method and a color filter manufacturing method according to a third embodiment of the present invention will be described.

  In the pattern forming method and the color filter manufacturing method according to the third embodiment shown in FIG. 6, the only difference is that the resin layer is patterned on a single-sheet plastic substrate. This is substantially the same as the first embodiment shown in FIGS. In FIG. 6, the same parts as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the first embodiment shown in FIG. 1 to FIG. 3, an example is described in which a plastic base material 2 that is continuous in a strip shape is unwound from a supply roll 11, is subjected to a process in each step, and is wound around a winding roll 18. did. In the third embodiment shown in FIG. 6, an example will be described in which the single-wafer plastic substrate 2 performs the process of each step in the first embodiment.

  That is, the pattern forming apparatus 30 shown in FIG. 6 includes a base material supply unit 31 on which single-sheet plastic base materials 2 are stacked. The plastic base material 2 is unloaded from the base material supply unit 31, and the process of each step is performed, and the plastic base material 2 is stacked on the base material recovery unit 32 and recovered. The process in each step is substantially the same as in the first embodiment. In the present embodiment, each plastic substrate 2 is preferably attached on a support substrate (not shown) formed of glass or the like. Thus, the single-wafer plastic substrate 2 can be conveyed in the pattern forming apparatus 30.

  As described above, according to the present embodiment, since the dimensional change of the plastic substrate 2 is converged by the heat treatment of the preliminary heat treatment step, the dimensions of the plastic substrate 2 by the heat treatment of the heat treatment step of curing the photosensitive material layer 3a. The amount of change can be suppressed. Thus, when the photosensitive material layer 3a is cured by heat treatment, the plastic substrate 2 can be prevented from changing in size, and the patterned photosensitive material layer 3a is formed on the plastic substrate 2. It can be formed with high accuracy.

  Furthermore, according to the present embodiment, the color filter 1 using the plastic substrate 2 on which the black matrix 3, the red pixel 4, the green pixel 5, and the blue pixel 6 are patterned with high accuracy can be obtained. Thereby, the accuracy of the display image of the color filter 1 can be improved.

Fourth Embodiment Next, with reference to FIGS. 7 and 8, a pattern forming method according to a fourth embodiment of the present invention will be described.

  The pattern forming method in the fourth embodiment shown in FIGS. 7 and 8 is only different in that a wiring layer is patterned on a plastic substrate, and other configurations are shown in FIGS. This is substantially the same as the first embodiment. 7 and 8, the same parts as those of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 7, the pattern forming apparatus 40 in the present embodiment includes a preliminary heat treatment unit 12 that performs heat treatment on the plastic substrate 2 and a resist coating unit 13 that applies a photosensitive material on the plastic substrate 2. And a wiring layer forming portion 41 for forming a conductive material (for example, indium tin oxide (ITO)) in a film shape on the plastic substrate 2. The wiring layer forming part 41 forms a wiring layer 45 made of a conductive material on the plastic substrate 2 by sputtering or EB vapor deposition.

  In the present embodiment, the resist application unit 13 applies a photosensitive material that can be used as an etching resist to the plastic substrate 2 via the wiring layer 45 by a coating method such as a gravure coater or a die coater. The photosensitive material layer 46 is formed.

  Further, an etching processing portion 42 for etching the wiring layer 45 using the patterned photosensitive material layer 46 as a resist is provided on the downstream side of the heat treatment portion 17 for curing the photosensitive material layer 46. Further, a resist removal portion 43 for removing the photosensitive material layer 46 is provided on the downstream side of the etching processing portion 42.

  In the pattern forming method shown in FIGS. 7 and 8, first, a supply roll 11 around which a continuous belt-shaped plastic substrate 2 is wound is prepared (step S41).

  Next, the preliminary heat treatment unit 12 performs heat treatment on the plastic substrate 2 fed from the supply roll 11 (step S42).

  A wiring layer 45 made of a conductive material is formed by the wiring layer forming unit 41 on the heat-treated plastic substrate 2 (step S43).

  A photosensitive material is applied in a film form on the plastic substrate 2 by the resist application unit 13 via the wiring layer 45 (step S44). As a result, a photosensitive material layer 46 is formed on the wiring layer 45.

  The photosensitive material layer 46 applied on the wiring layer 45 is heated and dried (prebaked) by the prebaking processing unit 14 together with the plastic substrate 2 (step S45). In this case, it is dried at a temperature of about 50 ° C. to 120 ° C. for about 1 to 5 minutes. As a result, the solvent contained in the photosensitive material layer 46 evaporates, and the photosensitive material layer 46 can be brought into close contact with the plastic substrate 2 via the wiring layer 45.

  The pre-baked plastic substrate 2 is exposed to a normal temperature and humidity atmosphere, and the temperature and water absorption rate of the plastic substrate 2 are equilibrated to the normal temperature and humidity atmosphere (step S46).

  Next, in the exposure processing unit 15, the photosensitive material layer 46 is exposed with a predetermined pattern (step S47). In this case, exposure is performed using a photomask 15a for forming a wiring pattern having a predetermined shape.

  The exposed photosensitive material layer 46 is developed in the development processing unit 16 (step S48). Thereby, the photosensitive material layer 46 can be patterned on the wiring layer 45 in the shape of the wiring pattern described above.

  Next, the heat treatment unit 17 that cures the photosensitive material layer 46 heat-treats the plastic base material 2 on which the photosensitive material layer 46 is patterned (step S49). In this case, the plastic substrate 2 is heat-treated together with the wiring layer 45 and the photosensitive material layer 46 at about 160 ° C. for about 60 minutes. Thus, the photosensitive material layer 46 can be cured (post-baked). In this case, since the dimensional change of the plastic base material 2 is converged by the preliminary heat treatment part 12, the dimensional change amount due to the heat treatment of the heat treatment part 17 for curing the photosensitive material layer 46 can be suppressed.

  Thereafter, the wiring layer 45 is etched by the etching processing unit 42 using the photosensitive material layer 46 as a resist (step S50). As a result, the wiring layer 45 can be patterned corresponding to the pattern of the photosensitive material layer 46.

  Next, the photosensitive material layer 46 is removed from the wiring layer 45 by the resist removing unit 43 (step S51). Thereafter, the plastic substrate 2 is wound and collected by the winding roll 18 together with the patterned wiring layer 45 (step S52).

  As described above, according to the present embodiment, since the dimensional change of the plastic substrate 2 is converged by the heat treatment of the preliminary heat treatment step, the dimensions of the plastic substrate 2 by the heat treatment of the heat treatment step for curing the photosensitive material layer 46 are obtained. The amount of change can be suppressed. As a result, when the photosensitive material layer 46 is heat-treated and cured, the plastic substrate 2 can be prevented from changing in size, and is patterned on the plastic substrate 2 via the wiring layer 45. The photosensitive material layer 46 can be formed with high accuracy. Therefore, the wiring layer 45 can be accurately patterned on the plastic substrate 2 by etching the wiring layer 45 using the photosensitive material layer 46 as a resist.

  Moreover, according to this Embodiment, the prebaked plastic base material 2 is exposed to the normal temperature normal humidity atmosphere, and the temperature and the water absorption rate will equilibrate to the normal temperature normal humidity atmosphere. This makes it possible to expose the photosensitive material while lowering the temperature of the plastic substrate 2 to room temperature and keeping the water absorption in equilibrium with an atmosphere of normal humidity. For this reason, exposure can be performed at a temperature and water absorption substantially equal to the temperature and water absorption during etching, the patterning accuracy during exposure can be maintained even during etching, and the patterning accuracy of the wiring layer 45 can be further improved. This can be further improved.

  In the present embodiment, an example in which the plastic substrate 2 is exposed to an atmosphere of normal temperature and humidity between the step of pre-baking the photosensitive material layer 46 and the step of exposing the photosensitive material layer 46 has been described. . However, the present invention is not limited to this, and after the photosensitive material layer 46 is pre-baked, the photosensitive material layer 46 is exposed without equilibrating the temperature and water absorption rate of the plastic substrate 2 with an atmosphere of normal temperature and humidity. You may do it. Also in this case, since the plastic substrate 2 is heat-treated by the preliminary heat treatment unit 12, the plastic substrate 2 is suppressed by suppressing the dimensional change amount of the plastic substrate 2 due to the heat treatment in the heat treatment step for curing the photosensitive material layer 46. The photosensitive material layer 46 patterned via the wiring layer 45 can be formed on the plastic substrate 2 with high accuracy, and the wiring layer 45 can be patterned on the plastic substrate 2 with high accuracy.

  Further, in this case, the plastic substrate 2 may be exposed to an atmosphere of normal temperature and humidity between the step of heat-treating the plastic substrate 2 by the preliminary heat treatment unit 12 and the step of applying the conductive material. As a result, the temperature of the high-temperature plastic substrate 2 heat-treated by the preliminary heat treatment unit 12 is lowered to room temperature, and the water absorption rate is balanced with an atmosphere of normal humidity, and sent to the resist coating unit 13 in the next step. it can.

  Further, in the present embodiment, the example in which the photosensitive material layer 46 is patterned by the photolithography method as described above has been described. However, the present invention is not limited to this, and the photosensitive material layer 46 may be patterned by an ink jet method. Even in this case, the patterned photosensitive material layer 46 can be formed with high accuracy, and the wiring layer 45 can be patterned with high accuracy on the plastic substrate 2.

  As mentioned above, although embodiment by this invention has been described, naturally, within the scope of the gist of this invention, these embodiment can also be combined suitably partially. Further, in the present embodiment, various modifications are possible within the scope of the gist of the present invention. Hereinafter, typical modifications will be described.

  As a method of providing the resin layer in a predetermined pattern on the plastic substrate 2, a transfer method can be adopted. That is, a resin layer (not shown) having a predetermined pattern is transferred onto the plastic substrate 2 that has been subjected to the heat treatment in the preliminary heat treatment step, and the plastic substrate 2 then cures the resin layer. The transferred resin layer may be cured by heat treatment by 17. Even in this case, since the plastic substrate 2 is heat-treated in the preliminary heat treatment step, the amount of dimensional change of the plastic substrate 2 is suppressed by the heat treatment of the heat treatment unit 17 for curing the resin layer, and the plastic substrate 2 is placed on the plastic substrate 2. The patterned resin layer can be formed with high accuracy. Furthermore, the plastic substrate 2 that has been heat-treated in the preliminary heat treatment step is exposed to a normal temperature and normal humidity atmosphere, the temperature is lowered to normal temperature, and the water absorption is equilibrated with the normal humidity atmosphere. You may make it transfer. Thereby, the resin layer can be transferred at a temperature and a water absorption substantially equal to the temperature and the water absorption at the time of use of the plastic substrate 2, and the patterning accuracy at the time of transfer can be maintained even at the time of use, Patterning accuracy can be further improved.

  The dimensional change amount of the plastic substrate 2 by the pattern forming method of the present invention was measured.

  As the plastic substrate 2, a PEN (polyethylene naphthalate) film (manufactured by Teijin DuPont, product name: Q65FA, film thickness: 100 μm) was used. A measurement mark was formed on the PEN film and heat treatment was performed, and the amount of dimensional change per 100 mm was measured. The heat treatment was performed three times, and each heat treatment was performed at 160 ° C. for 1 hour. The dimensional change was measured in two directions, the film flow direction (MD) and the film width direction (TD), and each measurement was performed with the temperature of the plastic substrate 2 at room temperature after heat treatment. .

  The measurement result of the dimensional change is shown in FIG. The dimensional change amount shown here represents the dimensional change amount with respect to the initial value before the heat treatment.

  As shown in FIG. 9 and Table 1, the dimensional change amount of the PEN film by the first heat treatment (preliminary heat treatment) is −58 μm / 100 mm in the film flow direction and −10 μm / 100 m in the film width direction. It was. However, the dimensional change amount of the PEN film by the second and third heat treatments based on the first heat treatment is −2 μm / 100 mm (shrinkage rate: 0.002%) in the film flow direction and the width direction, respectively. ) It became the following.

  Thus, it has been found that when the heat treatment is performed once and then the heat treatment is performed at substantially the same temperature as this heat treatment, the film can be prevented from shrinking. For this reason, since the dimensional change of the film converges by performing the preliminary heat treatment, it was found that the dimensional change amount of the film can be suppressed when the heat treatment is performed at substantially the same temperature thereafter. That is, it was confirmed that the dimensional change amount (shrinkage rate) of the film by the second heat treatment was 0.002% or less after the first heat treatment.

DESCRIPTION OF SYMBOLS 1 Color filter 2 Plastic base material 3 Black matrix 3a Photosensitive material layer 3b Bank (partition wall)
3c Opening 3d Ink layer 4 Red pixel 5 Green pixel 6 Blue pixel 7 Protective layer 8 Transparent electrode film 10 Pattern forming apparatus 11 Supply roll 12 Pre-heat treatment part 13 Resist application part 14 Pre-bake treatment part 15 Exposure process part 15a Photomask 16 Development Processing unit 17 Heat treatment unit 18 Winding roll 19 Guide roll 20 Pattern forming device 21 Inkjet printing unit 30 Pattern forming device 31 Substrate supply unit 32 Base material collecting unit 40 Pattern forming device 41 Wiring layer forming unit 42 Etching processing unit 43 Resist removal Part 45 Wiring layer 46 Photosensitive material layer

Claims (9)

In a pattern forming method for forming a patterned resin layer on a plastic substrate,
Preparing a plastic substrate;
A heat treatment is performed on the plastic substrate, and a preliminary heat treatment step for converging the dimensional change of the plastic substrate,
Providing a resin layer in a predetermined pattern on a heat-treated plastic substrate;
And a heat treatment step of curing the resin layer by subjecting the plastic substrate provided with the resin layer to a heat treatment.   The pattern formation method according to claim 1, wherein the temperature of the heat treatment in the preliminary heat treatment step is equal to or higher than the temperature of the heat treatment in the heat treatment step of curing the resin layer. The step of providing the resin layer in a predetermined pattern is as follows:
A step of applying a photosensitive resin material on a plastic substrate and drying to form a resin layer;
Exposing the resin layer in a predetermined pattern;
The pattern forming method according to claim 1, further comprising: developing and patterning the exposed resin layer.   Between the preliminary heat treatment step and the resin layer forming step, or between the step of forming the resin layer and the step of exposing the resin layer in a predetermined pattern, the plastic substrate is exposed to an atmosphere of normal temperature and humidity, and the plastic The pattern forming method according to claim 3, wherein the temperature and water absorption rate of the substrate are balanced with an atmosphere of normal temperature and humidity.   3. The pattern according to claim 1, wherein in the step of providing the resin layer in a predetermined pattern, the resin layer is formed by applying ink in a predetermined pattern on the plastic substrate by an ink jet method. Forming method.   3. The pattern forming method according to claim 1, wherein in the step of providing the resin layer in a predetermined pattern, the resin layer having the predetermined pattern is transferred onto the plastic substrate by a transfer method.   Between the preliminary heat treatment step and the step of providing the resin layer in a predetermined pattern, the plastic substrate is exposed to a normal temperature and humidity environment, and the temperature and water absorption rate of the plastic substrate are balanced with the normal temperature and humidity environment. The pattern forming method according to claim 5 or 6. In the step of providing the resin layer in a predetermined pattern, a wiring layer made of a conductive material is provided on the plastic substrate, and the resin layer is provided in a predetermined pattern on the wiring layer,
8. The pattern forming method according to claim 1, wherein after the heat treatment step for curing the resin layer, the wiring layer is etched and patterned using the resin layer as a resist. A step of forming a resin layer for a plurality of color pixels patterned so as to constitute a plurality of color pixels on a plastic substrate by the pattern forming method according to claim 1,
A method for producing a color filter, comprising obtaining a color filter.

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