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JP2011204926A5 - - Google Patents

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Publication number
JP2011204926A5
JP2011204926A5 JP2010071081A JP2010071081A JP2011204926A5 JP 2011204926 A5 JP2011204926 A5 JP 2011204926A5 JP 2010071081 A JP2010071081 A JP 2010071081A JP 2010071081 A JP2010071081 A JP 2010071081A JP 2011204926 A5 JP2011204926 A5 JP 2011204926A5
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JP
Japan
Prior art keywords
collimator
chamber
transport
sample
support
Prior art date
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Granted
Application number
JP2010071081A
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Japanese (ja)
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JP5450198B2 (en
JP2011204926A (en
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Publication date
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Priority to JP2010071081A priority Critical patent/JP5450198B2/en
Priority claimed from JP2010071081A external-priority patent/JP5450198B2/en
Publication of JP2011204926A publication Critical patent/JP2011204926A/en
Publication of JP2011204926A5 publication Critical patent/JP2011204926A5/ja
Application granted granted Critical
Publication of JP5450198B2 publication Critical patent/JP5450198B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (5)

試料投入チャンバーと、前記試料投入チャンバーとの間に第1の搬入搬出口を有して隣接する搬送チャンバーと、前記搬送チャンバーとの間に第2の搬入搬出口を有して隣接するコリメーションスパッタリング可能なスパッタチャンバーとからなるスパッタリング装置であって、
前記スパッタチャンバーは試料を載置するための試料ホルダーと、前記試料ホルダーと対向するターゲットと、前記試料ホルダーと前記ターゲットの間に配置された着脱可能なコリメーターと、前記コリメーターの外周部を支持する第1のコリメーター支持具とを有し、
前記搬送チャンバーは機器と、前記コリメーターを収納する第2のコリメーター支持具を有し、
前記コリメーターは、前記第1のコリメーター支持具と前記第2のコリメーター支持具の間を前記搬送機器によって移動できることを特徴とするスパッタリング装置。
Collimation sputtering with a first loading / unloading port between the sample loading chamber and the sample loading chamber and an adjacent conveying chamber and a second loading / unloading port between the sample loading chamber and the adjacent loading chamber A sputtering apparatus comprising a possible sputtering chamber,
The sputtering chamber has a sample holder for mounting a sample, a target facing the sample holder, and the sample holder and placed removable collimator between the target, the outer peripheral portion of the collimator A first collimator support for supporting
The transport chamber has a conveyance device, a second collimator support housing the collimator,
The sputtering apparatus, wherein the collimator can be moved between the first collimator support and the second collimator support by the transport device.
前記搬送チャンバー、さらに、シャッター板および前記シャッター板を収納するためのシャッター支持具を備えていることを特徴とする請求項1記載のスパッタリング装置。 The conveying chamber is further sputtering apparatus according to claim 1, characterized in that it comprises a shutter support for accommodating the shutter plate and the shutter plate. 前記第1のコリメーター支持具と接触する前記コリメーターの外周部は開孔のないシャドー部であることを特徴とする請求項1記載のスパッタリング装置。 Claim 1 Symbol placement of a sputtering apparatus, wherein the outer peripheral portion of the collimator in contact with the first collimator support is no opening shadows. 前記搬送機器は、上下方向に伸縮動作可能な搬送シャフトと、360度回転可能な搬送回転機構と、水平方向に伸縮動作可能な搬送支持アームと、前記搬送支持アームの先端に固定され、前記試料または前記コリメーターまたは前記シャッター板を載せるための搬送ホルダー機構を有することを特徴とする請求項2記載のスパッタリング装置。 The transport device is fixed to the tip of the transport support arm, a transport shaft that can be expanded and contracted in the vertical direction, a transport rotation mechanism that can rotate 360 degrees, a transport support arm that can be expanded and contracted in the horizontal direction, and the sample or claim 2 Symbol placement of a sputtering apparatus and having a conveying holder mechanism for placing the collimator or the shutter plate. 前記搬送機器は、前記コリメーターまたは前記シャッター板を前記第1の搬入搬出口を介して移動することが可能であることを特徴とする請求項4記載のスパッタリング装置。   The sputtering apparatus according to claim 4, wherein the transfer device is capable of moving the collimator or the shutter plate via the first loading / unloading port.
JP2010071081A 2010-03-25 2010-03-25 Sputtering equipment Expired - Fee Related JP5450198B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010071081A JP5450198B2 (en) 2010-03-25 2010-03-25 Sputtering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010071081A JP5450198B2 (en) 2010-03-25 2010-03-25 Sputtering equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013265762A Division JP5753249B2 (en) 2013-12-24 2013-12-24 Manufacturing method of semiconductor device

Publications (3)

Publication Number Publication Date
JP2011204926A JP2011204926A (en) 2011-10-13
JP2011204926A5 true JP2011204926A5 (en) 2013-02-28
JP5450198B2 JP5450198B2 (en) 2014-03-26

Family

ID=44881266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010071081A Expired - Fee Related JP5450198B2 (en) 2010-03-25 2010-03-25 Sputtering equipment

Country Status (1)

Country Link
JP (1) JP5450198B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6490523B2 (en) * 2015-07-15 2019-03-27 株式会社アルバック Sputtering apparatus and driving method of sputtering apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210177A (en) * 1985-03-15 1986-09-18 Hitachi Ltd In-line thin film forming equipment
JPH04280624A (en) * 1991-03-08 1992-10-06 Fujitsu Ltd semiconductor manufacturing equipment
JPH06280007A (en) * 1993-03-25 1994-10-04 Nippon Steel Corp Sputtering equipment
JPH0711442A (en) * 1993-06-28 1995-01-13 Fuji Electric Co Ltd Sputtering equipment for semiconductor device manufacturing
JPH07335552A (en) * 1994-06-08 1995-12-22 Tel Varian Ltd Treatment device
JPH08316147A (en) * 1995-05-18 1996-11-29 Sony Corp Collimation sputtering apparatus
JP2007273490A (en) * 2004-03-30 2007-10-18 Renesas Technology Corp Manufacturing method of semiconductor integrated circuit device

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