JP2011204926A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2011204926A5 JP2011204926A5 JP2010071081A JP2010071081A JP2011204926A5 JP 2011204926 A5 JP2011204926 A5 JP 2011204926A5 JP 2010071081 A JP2010071081 A JP 2010071081A JP 2010071081 A JP2010071081 A JP 2010071081A JP 2011204926 A5 JP2011204926 A5 JP 2011204926A5
- Authority
- JP
- Japan
- Prior art keywords
- collimator
- chamber
- transport
- sample
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 claims 9
- 230000002093 peripheral effect Effects 0.000 claims 2
Claims (5)
前記スパッタチャンバーは、試料を載置するための試料ホルダーと、前記試料ホルダーと対向するターゲットと、前記試料ホルダーと前記ターゲットの間に配置された着脱可能なコリメーターと、前記コリメーターの外周部を支持する第1のコリメーター支持具とを有し、
前記搬送チャンバーは、搬送機器と、前記コリメーターを収納する第2のコリメーター支持具を有し、
前記コリメーターは、前記第1のコリメーター支持具と前記第2のコリメーター支持具の間を前記搬送機器によって移動できることを特徴とするスパッタリング装置。 Collimation sputtering with a first loading / unloading port between the sample loading chamber and the sample loading chamber and an adjacent conveying chamber and a second loading / unloading port between the sample loading chamber and the adjacent loading chamber A sputtering apparatus comprising a possible sputtering chamber,
The sputtering chamber has a sample holder for mounting a sample, a target facing the sample holder, and the sample holder and placed removable collimator between the target, the outer peripheral portion of the collimator A first collimator support for supporting
The transport chamber has a conveyance device, a second collimator support housing the collimator,
The sputtering apparatus, wherein the collimator can be moved between the first collimator support and the second collimator support by the transport device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010071081A JP5450198B2 (en) | 2010-03-25 | 2010-03-25 | Sputtering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010071081A JP5450198B2 (en) | 2010-03-25 | 2010-03-25 | Sputtering equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013265762A Division JP5753249B2 (en) | 2013-12-24 | 2013-12-24 | Manufacturing method of semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011204926A JP2011204926A (en) | 2011-10-13 |
| JP2011204926A5 true JP2011204926A5 (en) | 2013-02-28 |
| JP5450198B2 JP5450198B2 (en) | 2014-03-26 |
Family
ID=44881266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010071081A Expired - Fee Related JP5450198B2 (en) | 2010-03-25 | 2010-03-25 | Sputtering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5450198B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6490523B2 (en) * | 2015-07-15 | 2019-03-27 | 株式会社アルバック | Sputtering apparatus and driving method of sputtering apparatus |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61210177A (en) * | 1985-03-15 | 1986-09-18 | Hitachi Ltd | In-line thin film forming equipment |
| JPH04280624A (en) * | 1991-03-08 | 1992-10-06 | Fujitsu Ltd | semiconductor manufacturing equipment |
| JPH06280007A (en) * | 1993-03-25 | 1994-10-04 | Nippon Steel Corp | Sputtering equipment |
| JPH0711442A (en) * | 1993-06-28 | 1995-01-13 | Fuji Electric Co Ltd | Sputtering equipment for semiconductor device manufacturing |
| JPH07335552A (en) * | 1994-06-08 | 1995-12-22 | Tel Varian Ltd | Treatment device |
| JPH08316147A (en) * | 1995-05-18 | 1996-11-29 | Sony Corp | Collimation sputtering apparatus |
| JP2007273490A (en) * | 2004-03-30 | 2007-10-18 | Renesas Technology Corp | Manufacturing method of semiconductor integrated circuit device |
-
2010
- 2010-03-25 JP JP2010071081A patent/JP5450198B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018133464A5 (en) | ||
| JP2015067856A5 (en) | ||
| JP2004180675A5 (en) | ||
| JP2010135381A5 (en) | ||
| JP5384220B2 (en) | Alignment apparatus and alignment method | |
| JP2011522230A5 (en) | ||
| JP2006329985A5 (en) | ||
| JP2011190105A5 (en) | ||
| JP2010171139A5 (en) | ||
| DE602007000584D1 (en) | Liquid processing apparatus and method | |
| JP2013039797A5 (en) | ||
| EP2226604A3 (en) | Target apparatus | |
| JP2008016676A5 (en) | ||
| EP3208051A3 (en) | Electrodynamic apparatus | |
| JP2012222156A5 (en) | ||
| JP2007289823A5 (en) | ||
| JP2013021026A5 (en) | ||
| JP2009137686A5 (en) | ||
| JP2009131945A5 (en) | ||
| JP2009079276A5 (en) | ||
| JP2011204926A5 (en) | ||
| JP2009286562A5 (en) | ||
| JP2011029241A5 (en) | Reversing device and substrate bonding device | |
| JP2016122777A5 (en) | ||
| TW200712229A (en) | Film forming device, manufacturing device of thin film, and film forming method |