JP2012054160A - Light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source device excellent in heat radiation.SOLUTION: The light source device 1 is provided with a plate-shaped mounting board 2 having a first metal layer 23 formed on its upper face and made of a metal material and at least one light emitting unit 4 mounted so as to contact the metal layer on an upper face side of the mounting board 2 and having a light emitting diode 42. The first metal layer 23 has a patterning in a prescribed shape and is composed of a circuit pattern 231 electrically connected to the light emitting unit 4 and a heat radiating pattern 232 having a function to radiate heat generated in the light emitting unit 4. Further, there is provided at least one first heat transfer part 25a which is mounted on an upper face side of the mounting board 2 so as to contact the metal layer and penetrates in the thickness direction, and has a function to transfer the heat generated by the light emitting unit 4 to a lower face side of the mounting board 2 at a part where the heat radiating pattern 232 is superimposed in a plan view on the light emitting unit 4 having the light emitting diode 42.

Description

  The present invention relates to a light source device.

  So-called “LED bulbs” having light emitting diodes (LEDs) are known. The LED bulb includes a plurality of light-emitting diodes, a substrate on which these light-emitting diodes are arranged in a matrix, a cylindrical housing for storing the substrate together with the light-emitting diodes, and a base installed at the base end of the housing And a cover as a lid installed at the tip of the housing (see, for example, Patent Document 1).

  In the LED bulb described in Patent Document 1, the substrate is disposed orthogonal to the central axis of the housing. And the board | substrate arrange | positioned in this way is supported by the ring-shaped support member fitted to the inner peripheral part of a housing.

  By the way, since the light emitting diode generates heat as it emits light, the LED bulb needs to release the heat. However, in the light bulb described in Patent Document 1, the substrate is a mere metal plate (aluminum substrate), and the substrate on which the current LED is directly mounted conducts heat from each light emitting diode to the outside sufficiently and reliably. As a result, there is a problem that heat radiation becomes insufficient.

JP 2006-156187 A

  The objective of this invention is providing the light source device excellent in heat dissipation.

Such an object is achieved by the present inventions (1) to (13) below.
(1) A substrate having a plate shape and having a metal layer formed on one surface side and made of a metal material;
Including at least one light emitting device mounted on one surface side of the substrate in contact with the metal layer and having a light emitting element;
The metal layer is patterned into a predetermined shape and functions as an electric circuit electrically connected to the light emitting device, and a heat dissipation function unit having a function for radiating heat generated in the light emitting device Consists of
The substrate has a function of penetrating in a thickness direction through a portion overlapping the light emitting device of the heat radiation function unit in a plan view, and transferring heat generated in the light emitting device to the other surface side of the substrate. A light source device comprising at least one heat transfer section.

(2) The light source device according to (1), wherein the heat transfer unit includes a through hole.
(3) The light source device according to (2), wherein an inner metal layer made of a metal material is formed on an inner peripheral surface of the through hole.

(4) The light source device according to (3), wherein the internal metal layer is in contact with or connected to the metal layer.

(5) The light source device according to any one of (2) to (4), wherein a conductor post made of a metal material is disposed in the through hole.

(6) The light source device according to (1), wherein the heat transfer section is formed of a conductor post made of a metal material.

(7) The substrate (1) to (6), wherein the substrate is a laminated plate having a substrate layer formed by impregnating a fiber substrate with a resin material, and the metal layer is laminated on the substrate layer. The light source device according to any one of the above.

(8) The light source device according to (7), wherein the fiber base material is a glass fiber base material.
(9) The light source device according to (7) or (8), wherein the substrate is formed on the other surface side and includes a back side metal layer made of a metal material.

(10) The light source device according to any one of (1) to (9), wherein the heat transfer unit has an occupation ratio with respect to an area of the light emitting device in plan view of 0.01% or more.

(11) The light source device according to any one of (1) to (10), wherein the metal layer has an occupation ratio with respect to the entire one surface of the substrate of 50% or more.

(12) Any one of (1) to (11), further including a heat dissipating member that is installed on the other surface side of the substrate and dissipates heat from the light emitting device transmitted through the heat transfer unit. Light source device.

(13) The light source device according to any one of (1) to (12), which is used as a backlight of a liquid crystal display device.

  According to the present invention, by providing the heat transfer section, it is promoted that the heat from the light emitting device is transmitted to the other surface side of the substrate, particularly immediately below the light emitting device. And the heat transmitted to the other surface side of the substrate is radiated outward. Therefore, the light source device of the present invention is excellent in heat dissipation.

It is a top view which shows 1st Embodiment of the light source device of this invention. FIG. 2 is an enlarged detail view of a light emitting device of the light source device shown in FIG. 1 and its surroundings. It is the sectional view on the AA line in FIG. It is the BB sectional view taken on the line in FIG. It is sectional drawing which shows 2nd Embodiment of the light source device of this invention. It is sectional drawing which shows 3rd Embodiment of the light source device of this invention. It is a top view which shows 4th Embodiment of the light source device of this invention. It is a top view which shows 5th Embodiment of the light source device of this invention. It is a perspective view of the liquid crystal television which incorporated the light source device shown in FIG. FIG. 10 is a schematic partial cross-sectional view of the liquid crystal television shown in FIG. 9.

DESCRIPTION OF EMBODIMENTS Hereinafter, a light source device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
<First Embodiment>
FIG. 1 is a plan view showing a first embodiment of a light source device of the present invention, FIG. 2 is an enlarged detailed view of a light emitting device and its periphery of the light source device shown in FIG. 1, and FIG. 4 is a sectional view taken along line BB in FIG. 2, FIG. 9 is a perspective view of a liquid crystal television incorporating the light source device shown in FIG. 1, and FIG. 10 is a perspective view of the liquid crystal television shown in FIG. It is a general | schematic fragmentary sectional view. In the following, for convenience of explanation, the upper side in FIGS. 3 and 4 (the same applies to FIGS. 5 and 6) is “upper”, “upper” or “table”, and the lower side is “lower”, “lower” Or “back”, the left side of FIG. 10 is called “front”, and the right side is called “back”.

  As shown in FIG. 9, the light source device 1 is built in a liquid crystal television 100 which is a liquid crystal display device, and can be used as a backlight thereof.

  The liquid crystal television 100 includes a light source device 1, a display unit (liquid crystal cell) 101 disposed on the front side of the light source device 1, a housing 102 that houses the light source device 1 and the display unit 101, and legs that support the housing 102. Part (stand) 103.

  As shown in FIG. 10, the display unit 101 includes a polarizing plate 104, a glass substrate 105, a color filter 106, a protective film 107, a liquid crystal unit 108, a glass substrate 109, and a polarizing plate 110 in order from the front side. . Furthermore, between the polarizing plate 110 and the light source device 1, various optical films (not shown) such as a diffusion plate, a diffusion sheet, a prism sheet, a brightness enhancement film, and a reflection type deflection plate may be provided. The liquid crystal unit 108 includes a thin film transistor (TFT) as a switching element and a liquid crystal layer made of a quasi-isotropic liquid crystal material or the like. The display unit 101 generates an electric field in the thin film transistor and changes the alignment state of the liquid crystal material in the liquid crystal layer by the electric field, thereby changing the color tone to be visually recognized. And the light from the light source device 1 which is a backlight permeate | transmits the display part 101, and the image displayed on the said display part 101 can be visually recognized.

  As shown in FIGS. 1 and 2, the light source device 1 includes a plurality of light emitting devices 4 and a mounting substrate (substrate) 2 on which these light emitting devices 4 are mounted together. Hereinafter, the configuration of each unit will be described.

  Since each light-emitting device 4 has the same configuration, one light-emitting device 4 will be representatively described below.

  The light emitting device 4 generates light emission by electroluminescence (EL) effect and light emission by fluorescence.

  As shown in FIG. 3, the light emitting device 4 includes a package 41 having a recess 411, a light emitting diode (light emitting element) 42 provided on the bottom surface of the recess 411 of the package 41, and a recess 411 so as to cover the light emitting diode 42. It has a translucent resin portion 43 enclosed therein and a pair of external terminals 44 provided at the bottom of the package 41.

  The package 41 is a small piece made of an insulating material such as a resin material or a ceramic material. The package 41 is provided with wiring (not shown) that electrically connects the light emitting diode 42 and the pair of external terminals 44.

  The light emitting diode 42 is formed by forming a semiconductor such as GaAlN, ZnS, ZnSe, SiCGaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN in the package 41 as a light emitting layer. In the present embodiment, a light emitting diode that emits light having a wavelength that can excite a phosphor material contained in a light-transmitting resin portion 43 described later is used. More specifically, a light emitting diode that emits blue light is used.

  The translucent resin portion 43 is composed mainly of a resin material such as an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, a urethane resin, or a polyimide resin having transparency.

  In the present embodiment, the translucent resin portion 43 includes a phosphor material that emits yellow light when excited by the light from the light emitting diode 42 described above.

  The translucent resin portion 43 has a function of protecting the light emitting diode 42 from external force, dust, moisture, and the like.

  The pair of external terminals 44 is composed of a conductive material as a main material. One external terminal 44 is an anode electrode (anode), and the other external terminal 44 is a cathode electrode (cathode). . Each external terminal 44 is composed mainly of a metal material such as Al, Ti, Fe, Cu, Ni, Ag, Au, and Pt. Each external terminal 44 is electrically connected (contacted) to a circuit pattern (circuit function unit) 231 (first metal layer 23) provided on the mounting substrate 2 by solder (not shown). is doing. Furthermore, the circuit pattern 231 is electrically connected to a power source (not shown).

  In such a light emitting device 4, when a voltage is applied to the light emitting diode 42 via the pair of external terminals 44, the light emitting diode 42 emits light based on the electroluminescence effect. By this light emission, the light is transmitted through the translucent resin portion 43 and emitted to the outside. At this time, a part of the light is reflected on the inner wall surface of the recess 411 of the package 41, then passes through the translucent resin portion 43 and is emitted to the outside.

  In addition, the light emitting device 4 emits blue light by the EL effect of the light emitting diode 42, and the translucent resin portion 43 is excited by a part of the blue light and emits yellow light by fluorescence. White light is emitted by mixing blue light and yellow light.

  Note that the light emitting diode 42 is not limited to the above-described one, and may be a single color light emitting diode such as red, blue, or green. In this case, the phosphor material may be omitted from the translucent resin portion 43. The light emitting device 4 may have a plurality of light emitting diodes. In this case, the light emission colors may be the same or different from each other.

  Such a light emitting device 4 is mounted on the mounting substrate 2. As shown in FIG. 1, the mounting substrate 2 has a long plate shape. The light emitting devices 4 are arranged at equal intervals along the longitudinal direction of the mounting substrate 2.

  As shown in FIGS. 3 and 4, the mounting substrate 2 includes a first base material layer (base material layer) 21 and second base material layers (bases) formed on both surfaces of the first base material layer, respectively. Material layers) 22a and 22b, a first metal layer (metal layer (front side metal layer)) 23 formed on the upper surface (one surface) of the second base material layer 22a, and a second base material layer 22b It is the laminated board which has the 2nd metal layer (back side metal layer) 24 formed in the lower surface (other side) of this. This mounting substrate 2 is an example using a so-called glass composite substrate “CEM-3”.

The thickness (total thickness) t _total of the entire mounting substrate 2 is not particularly limited, and is preferably 0.1 to 2.0 mm, for example, and more preferably 0.4 to 1.2 mm. The thickness _{t 1} of the first substrate layer 21, the thickness _{t 2} of the second base material layer 22a and 22b, the thickness _{t 3} of the first metal layer 23, the second metal layer 24 magnitude relationship between the thickness _{t 4,} from the viewpoint of thermal conductivity, it is preferred that _{t 1 ≧ t 2> t 3} . Moreover, it is preferable that t ₃ = t ₄ from the viewpoint of suppressing the warpage of the mounting substrate 2.

  The first base material layer 21, the second base material layer 22a, and the second base material layer 22b are layers formed by impregnating a fiber base material with a resin material, respectively.

  The fiber substrate is not particularly limited, and examples thereof include glass fiber substrates such as glass woven fabrics, glass nonwoven fabrics, and glass papers, and woven fabrics and nonwoven fabrics composed of organic fibers such as paper (pulp), aramid, polyester, and fluororesin. Woven fabrics, nonwoven fabrics, mats and the like made of metal fibers, carbon fibers, mineral fibers and the like. These substrates may be used alone or in combination. In particular, it is preferable to use a glass nonwoven fabric for the first base material layer 21 and a glass woven fabric for the second base material layers 22a and 22b.

  The resin material to be impregnated into the fiber base material is preferably a thermosetting resin, such as an epoxy resin, a phenol resin, a urea resin, a melamine resin, a polyester (unsaturated polyester) resin, a polyimide resin, a silicone resin, and a polyurethane resin. Among them, one or two or more of these can be mixed and used, and among these, an epoxy resin is more preferable.

  Further, when the fiber base material constituting the first base material layer 21 is impregnated with a resin material, the resin material includes, for example, a metal oxide such as alumina, a metal hydroxide such as aluminum hydroxide, and nitriding. It is also possible to fill an electrically insulating and highly heat conductive filler (inorganic filler) typified by a nitride such as boron.

  In the mounting substrate 2, the heat generated as each light emitting device 4 emits light is transmitted from the first metal layer 23 to the second base material layer 22 a, the first base material layer 21, and the second base material layer. It is reliably transmitted in the order of 22 b, that is, in the direction away from the light emitting device 4 (the surface direction and the thickness direction of the mounting substrate 2), and is radiated by the second metal layer 24. Thus, the mounting substrate 2 (light source device 1) is excellent in heat dissipation.

  Further, as described above, it is preferable to use a glass nonwoven fabric for the first base material layer 21 and a glass woven fabric for the second base material layers 22a and 22b. Since the glass nonwoven fabric can carry a larger amount of a resin material having a higher thermal conductivity than the glass woven fabric, the first nonwoven fabric layer 21 located on the innermost side of the mounting substrate 2 is used to emit light in particular in the surface direction. The heat from the device 4 is diffused. Thereby, heat dissipation efficiency improves.

The thickness _{t 1,} not particularly limited, for example, is preferably from 0.1 to 1.2 mm, and more preferably 0.2 to 0.8 mm.

The thickness _{t 2,} not particularly limited, for example, is preferably from 0.04～0.4Mm, and more preferably 0.1 to 0.2 mm.

  A first metal layer 23 is laminated on the second base material layer 22a, and a second metal layer 24 is laminated on the second base material layer 22b. Each of the first metal layer 23 and the second metal layer 24 is a layer made of a metal material.

  The metal material constituting the first metal layer 23 is not particularly limited, and for example, one type selected from the group consisting of copper, iron, aluminum, indium, tin, lead, silver, zinc, bismuth, and antimony or Examples thereof include conductive materials obtained by combining two or more kinds, and among these, copper is particularly preferable. Copper is also excellent in thermal conductivity, and can reliably transfer the heat from each light emitting device 4 to the second base material layer 22 a under the first metal layer 23.

  The metal material constituting the second metal layer 24 is not particularly limited. For example, in addition to the metal material constituting the first metal layer 23, aluminum can also be used. Aluminum and copper are excellent in thermal conductivity, and can reliably dissipate heat transmitted through the second base material layer 22b.

  The first metal layer 23 and the second metal layer 24 may be made of the same metal material or may be made of different metal materials. In the case where the first metal layer 23 and the second metal layer 24 are made of the same metal material, for example, each of the first metal layer 23 and the second metal layer 24 can be made of copper. One metal layer 23 can be made of copper, and the second metal layer 24 can be made of aluminum.

  Further, the method for forming the first metal layer 23 and the second metal layer 24 is not particularly limited, and examples thereof include metal foil bonding (adhesion), metal plating, vapor deposition, sputtering, and printing. .

  As shown in FIG. 2, the first metal layer 23 is patterned into a predetermined shape. Thereby, the 1st metal layer 23 can be divided into the circuit pattern 231 which functions as an electric circuit, and the pattern for heat radiation (heat radiation function part) 232 which has a heat radiation function. The circuit pattern 231 is electrically connected to the external terminal 44 of each light emitting device 4 via, for example, solder. Thereby, power is supplied via the circuit pattern 231. The heat radiation pattern 232 is in contact with (in contact with) the back surface of the package 41 of each light emitting device 4. Thereby, the heat generated in each light emitting device 4 can be reliably transmitted to the first heat transfer section 25a and the second heat transfer section 25b described later via the heat radiation pattern 232.

  In addition, it does not specifically limit as a patterning method to the 1st metal layer 23, For example, methods, such as an etching, printing, masking, can be used. By such a patterning method, the circuit pattern 231 and the heat radiation pattern 232 can be formed in a lump.

  In addition, the first metal layer 23 preferably has, for example, an occupation ratio with respect to the entire top surface of the mounting substrate 2 of 50% or more, more preferably 80 to 99%. Thereby, the area of the heat radiation pattern 232 can be ensured to such an extent that the heat generated in each light emitting device 4 can be reliably transmitted to the first heat transfer unit 25a and the second heat transfer unit 25b. Further, when etching is used as a patterning method for the first metal layer 23, the portion of the first metal layer 23 to be removed by the etching is relatively small. Can do.

The thickness _{t 3,} not particularly limited, for example, is preferably from 0.008～0.21Mm, and more preferably 0.012～0.105Mm.

The thickness _{t 4,} is not particularly limited, for example, is preferably from 0.008～2Mm, and more preferably 0.012～1.5Mm.

  As shown in FIGS. 1 and 2, the mounting substrate 2 is provided with a large number of first heat transfer units 25a and second heat transfer units 25b arranged in a matrix. Each first heat transfer portion 25a is disposed in a portion overlapping the light emitting device 4 of the heat radiation pattern 232 in plan view. Each of the second heat transfer portions 25b is disposed in a portion of the heat radiation pattern 232 that does not overlap the light emitting device 4 in plan view. Each of the first heat transfer units 25 a and each of the second heat transfer units 25 b transfers the heat generated in the light emitting device 4 to the lower surface side of the mounting substrate 2, that is, to the second metal layer 24. It is a thermal via having a function of heating.

  As shown in FIG. 3, each 1st heat-transfer part 25a each mounts the mounting substrate 2 in the thickness direction, ie, from the 1st metal layer 23 (radiation pattern 232) to the 2nd metal layer. The through hole 251 penetrates and the inner metal layer 252 formed on the inner peripheral surface of the through hole 251 is configured. The inner metal layer 252 is connected to (in contact with) the first metal layer 23 and the second metal layer 24.

  As shown in FIG. 4, each second heat transfer section 25b is also composed of a through hole 251 and an internal metal layer 252 as in the first heat transfer section 25a, and the internal metal layer 252 is the first heat transfer section 25a. The metal layer 23 and the second metal layer 24 are connected.

  The shape of each through hole 251 in plan view is a circle in the present embodiment, but is not limited to this, and may be, for example, a polygon such as an ellipse or a rectangle.

  A method for forming the through hole 251 is not particularly limited, and examples thereof include drilling, router processing, punching processing, and laser processing.

  The internal metal layer 252 is made of a metal material, and for example, the same material as that of the first metal layer 23 and the second metal layer 24 can be used. A method for forming the internal metal layer 252 is not particularly limited, and examples thereof include metal plating, vapor deposition, and sputtering.

  By providing the first heat transfer section 25a and the second heat transfer section 25b configured as described above, the heat from each light-emitting device 4 is particularly generated in each first heat transfer section 25a. It is reliably transmitted to the second metal layer 24 through the air in the through-hole 251 and the inner metal layer 252 around the air, that is, the second heat transfer unit 25a performs the second transmission from the light emitting device 4. The heat transfer to the metal layer 24 is promoted. Moreover, in each 2nd heat-transfer part 25b, the heat from each light-emitting device 4 can be transmitted to the 2nd metal layer 24 supplementarily. And the heat transfer effect | action in such a 1st heat-transfer part 25a and the 2nd heat-transfer part 25b, and the 2nd in the 1st base material layer 21 mentioned above, and the 2nd base material layers 22a and 22b. Due to the synergistic effect with the heat transfer action to the metal layer 24, the heat is reliably transmitted by the second metal layer 24 and is radiated by the second metal layer 24. Thus, the light source device 1 is extremely excellent in heat dissipation.

  As shown in FIG. 2, the number of the first heat transfer sections 25a is three. These first heat transfer parts 25a preferably have an occupation ratio with respect to the area of the light emitting device 4 in plan view of 0.01% or more, and more preferably 0.02 to 50%. Thereby, the heat from the light emitting device 4 can be reliably and directly guided to the first heat transfer unit 25a, and thus the thermal conductivity in the first heat transfer unit 25a is improved. In addition, although the number of the 1st heat-transfer parts 25a is three in the structure shown in FIG. 2, it is not limited to this, For example, one, two, or four or more may be sufficient.

  In addition, the second heat transfer section 25b preferably has an occupation ratio of 0.01% or more, more preferably 0.02 to 10%, with respect to the entire top surface of the mounting substrate 2. As a result, heat generated from each light emitting device 4 (light emitting diode 42) can be reliably conducted outward, and thus the light emission efficiency of each light emitting device 4 can be improved and the drive voltage can be lowered. Thereby, the light source device 1 with high heat dissipation, high luminance, and long life can be provided. In the light source device 1, the second heat transfer unit 25 b can be omitted.

Second Embodiment
FIG. 5 is a cross-sectional view showing a second embodiment of the light source device of the present invention.

  Hereinafter, the second embodiment of the light source device of the present invention will be described with reference to this drawing, but the description will focus on the differences from the above-described embodiment, and the description of the same matters will be omitted.

  This embodiment is the same as the first embodiment except that the configuration of the first heat transfer section is different.

  As shown in FIG. 5, in the light source device 1A, rod-shaped conductor posts (thermal conductive conductor posts) 253 are respectively arranged (inserted) in the through holes 251 of the first heat transfer portions 25a. In the present embodiment, each first heat transfer section 25a is composed of a conductor post 253 and an internal metal layer 252.

  The conductor post 253 is made of a metal material, and for example, the same material as the constituent material of the first metal layer 23 and the second metal layer 24 can be used.

  Examples of the method of arranging the conductor post 253 in the through hole 251 include a method of filling the through hole 251 with a metal material, a method of inserting a rod-shaped member made of a metal material into the through hole 251, specifically a copper paste , A method of embedding a metal paste such as silver paste in the through hole 251, a method of using eyelets and rivets, a method of forming the first heat transfer portion 25 a while forming the through hole 251 with bolts, screws, and the like. It is done.

  Since the metal material is generally higher in heat conductivity than air, the conductor posts 253 made of the metal material are arranged, so that the heat of each light emitting device 4 is transferred to the second metal layer 24. Is further promoted.

  In addition, the conductor post 253 is not limited to one made of a metal material, and may be made of a resin material having a relatively high thermal conductivity, for example.

  Each of the second heat transfer portions 25b may have the same configuration as the first heat transfer portion 25a, that is, a configuration in which the conductor post 253 is inserted into the through hole 251. The configuration may be such that the insertion of 253 is omitted.

<Third Embodiment>
FIG. 6 is a cross-sectional view showing a third embodiment of the light source device of the present invention.

  Hereinafter, the third embodiment of the light source device of the present invention will be described with reference to this figure, but the description will focus on the differences from the above-described embodiment, and the description of the same matters will be omitted.

  This embodiment is the same as the first embodiment except that the light source device further includes a heat dissipation member.

  As shown in FIG. 6, in the light source device 1 </ b> B, a heat sink (heat radiating member) 3 is fixed to the back surface of the mounting substrate 2. The method for fixing the heat sink 3 is not particularly limited. For example, a method using adhesion (adhesion with an adhesive or a solvent), a method using fusion (thermal fusion, high frequency fusion, ultrasonic fusion, etc.), screws, and the like. Examples include a method by stopping.

The heat sink 3 includes a flat main body 31 and a plurality of heat radiation fins 32 protruding from the back surface of the main body 31. The upper surface of the main body 31 is in contact with the back surface (second metal layer 24) of the mounting substrate 2. Each of the radiation fins 32 is composed of a small piece, and is arranged at equal intervals along the longitudinal direction of the mounting substrate 2. Thereby, the surface area of the heat sink 3 can be sufficiently secured to the extent that heat can be reliably radiated. Therefore, the heat from the light emitting device 4 transmitted to the second metal layer 24 through each first heat transfer section 25a and each second heat transfer section 25b can be efficiently radiated by the heat sink 3.
The heat sink 3 may be one in which the heat radiating fins 32 are omitted.

<Fourth embodiment>
FIG. 7 is a plan view showing a fourth embodiment of the light source device of the present invention.

  Hereinafter, the fourth embodiment of the light source device of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and the description of the same matters will be omitted.

  This embodiment is the same as the first embodiment except that the size of the first heat transfer section in plan view is different.

  As shown in FIG. 7, in the light source device 1 </ b> C, the first heat transfer unit 25 a has a larger size in plan view than the size of the second heat transfer unit 25 b in plan view. . Thereby, the heat transfer effect | action in each 1st heat-transfer part 25a is accelerated | stimulated, and the heat dissipation from the 2nd metal layer 24 improves.

<Fifth Embodiment>
FIG. 8 is a plan view showing a fifth embodiment of the light source device of the present invention.

Hereinafter, the fifth embodiment of the light source device of the present invention will be described with reference to this drawing. However, the difference from the above-described embodiment will be mainly described, and description of similar matters will be omitted.
This embodiment is the same as the first embodiment except that the arrangement of the light emitting devices is different.

  As shown in FIG. 8, in the light source device 1 </ b> D, a plurality of sets of four light emitting devices 4 are arranged on the mounting substrate 2, for example, in a “rice” shape. The two light emitting devices 4 on the diagonal side emit green monochromatic light. Of the remaining two light emitting devices 4, one light emitting device 4 emits red monochromatic light, and the other light emitting device 4 emits blue monochromatic light. When these light emitting devices 4 emit light, the light source device 1C can emit white light as a whole and adjust the color temperature. Further, the color filter 106 can be omitted from the liquid crystal display device.

  Similarly to the light source device 1, the light source device 1 </ b> D promotes the transfer of heat to the second metal layer 24 via the first heat transfer portions 25 a and the second heat transfer portions 25 b, and the second The metal layer 24 surely radiates heat.

  The light source device of the present invention has been described above with respect to the illustrated embodiment. However, the present invention is not limited to this, and each part constituting the light source device has an arbitrary configuration that can exhibit the same function. Can be substituted. Moreover, arbitrary components may be added.

  Further, the light source device of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In addition to the liquid crystal television, examples of the liquid crystal display device in which the light source device of the present invention can be built include a desktop or notebook personal computer monitor, a mobile phone, a digital camera, and a portable information terminal. Furthermore, the light source device of the present invention can be applied to a light bulb in addition to such a liquid crystal display device. In that case, for example, a light source such as a streetlight (electric light), a traffic light, lighting of a signboard, an electric bulletin board, etc. Can be applied to.

In addition to the substrate using “CEM-3” which is a so-called glass composite substrate, for example, so-called “FR-4” having a layer formed by impregnating a glass woven fabric with an epoxy resin is used. It may be a thing.
The mounting board may be one in which the second metal layer is omitted.

1, 1A, 1B, 1C, 1D Light source device 2 Mounting substrate (substrate)
21 1st base material layer (base material layer)
22a, 22b Second base material layer (base material layer)
23 1st metal layer (metal layer (front side metal layer))
231 Circuit pattern (circuit function part)
232 Heat dissipation pattern (heat dissipation function part)
24 Second metal layer (back side metal layer)
25a 1st heat-transfer part 25b 2nd heat-transfer part 251 Through-hole 252 Internal metal layer 253 Conductor post (heat conduction conductor post)
3 Heat sink (heat dissipation member)
31 Body 32 Radiating fin 4 Light emitting device 41 Package 411 Recess 42 Light emitting diode (light emitting element)
43 Translucent resin part 44 External terminal 100 Liquid crystal television 101 Display part (liquid crystal cell)
102 Housing 103 Leg (stand)
104 polarizing plate 105 glass substrate 106 color filter 107 protective film 108 liquid crystal part 109 glass substrate 110 polarizing plate t _total , t ₁ , t ₂ , t ₃ , t ₄ thickness

Claims (13)

A substrate having a metal layer made of a metal material formed on one side of the plate,
Including at least one light emitting device mounted on one surface side of the substrate in contact with the metal layer and having a light emitting element;
The metal layer is patterned into a predetermined shape and functions as an electric circuit electrically connected to the light emitting device, and a heat dissipation function unit having a function for radiating heat generated in the light emitting device Consists of
The substrate has a function of penetrating in a thickness direction through a portion overlapping the light emitting device of the heat radiation function unit in a plan view, and transferring heat generated in the light emitting device to the other surface side of the substrate. A light source device comprising at least one heat transfer section.   The light source device according to claim 1, wherein the heat transfer unit is configured by a through hole.   The light source device according to claim 2, wherein an inner metal layer made of a metal material is formed on the inner peripheral surface of the through hole.   The light source device according to claim 3, wherein the internal metal layer is in contact with or connected to the metal layer. The light source device according to claim 2, wherein a conductor post made of a metal material is disposed in the through hole.   The light source device according to claim 1, wherein the heat transfer unit is formed of a conductor post made of a metal material.   The said board | substrate is a laminated board which has a base material layer formed by impregnating a resin material in a fiber base material, and the said metal layer was laminated | stacked on this base material layer. Light source device.   The light source device according to claim 7, wherein the fiber base material is a glass fiber base material.   The light source device according to claim 7, wherein the substrate has a back side metal layer formed on the other surface side and made of a metal material.   10. The light source device according to claim 1, wherein the heat transfer unit has an occupation ratio with respect to an area of the light emitting device in a plan view of 0.01% or more.   The light source device according to any one of claims 1 to 10, wherein the metal layer has an occupation ratio of 50% or more with respect to the entire one surface of the substrate.   The light source device according to claim 1, further comprising a heat dissipating member that is installed on the other surface side of the substrate and dissipates heat from the light emitting device transmitted through the heat transfer unit.   The light source device according to claim 1, wherein the light source device is used as a backlight of a liquid crystal display device.

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