JP2012058946A - Ic module with external terminal and ic card with external terminal using the same - Google Patents

Abstract

An IC module with external terminals in which a white sealing resin layer is formed on a sealing resin layer of a conventional IC module with external terminals, and an IC card with external terminals using the same.
An IC module with an external terminal mounted so as to expose an external terminal in a recess formed on one side of a card base, wherein the external terminal is formed on one side of the module substrate, An IC chip is mounted on the other surface, the pad electrode of the IC chip and the external terminal are connected by a conductive wire, and a black first sealing is applied so as to cover the IC chip and the conductive wire Provided are an IC module with external terminals in which a resin layer is formed and a white second sealing resin layer is formed on the exposed surface of the first sealing resin layer, and an IC card using the same.
[Selection] Figure 1

Description

  The present invention relates to an IC module with external terminals in which a white sealing resin layer is formed on a sealing resin layer of a conventional IC module with external terminals, and an IC card with external terminals using the same.

For the card base of the plastic card, a plastic material in which a white pigment is kneaded is used so that any color may be used for the design applied to the card. The printed surface is protected by a transparent cover sheet so that the ink design printed on the surface of the card is not scratched or stained.
In recent years, credit cards and cash cards are equipped with IC modules in order to improve safety. A plurality of independent metal contacts are formed on one surface of the module substrate of the IC module, and an IC chip connected to the contacts by wires or the like is mounted on the other surface. Further, the connection portion such as the IC chip and the wire is reinforced with a robust sealing resin.

  Since the black resin is often used for the aforementioned sealing resin of the IC module, when the IC module mounting portion is viewed from the back side of the card, the sealing resin portion can be seen through black. There is a method of reducing the sealing resin thickness and increasing the remaining thickness of the base material on the back side of the card so that it cannot be seen through black, but this causes a problem that the physical strength of the chip itself is lowered.

  Therefore, in an IC card IC module in which the IC chip is covered with a sealing resin, the color of the resin itself forming the sealing resin portion is opposite to the side where the contact portion of the IC module is located. It has been proposed to color the card in the same color as or similar to the color of the card seen from the card (for example, see Patent Document 1).

JP-A-9-290587

In the IC module of the invention of Patent Document 1, the appearance is improved, but the IC chip can be seen through the sealing resin surface, and when the strong light is irradiated from the back surface of the card, the IC chip malfunctions. there is a possibility.
Accordingly, the present invention provides an IC module with an external terminal in which a white sealing resin layer is formed on the sealing resin layer of a conventional IC module with an external terminal, and an IC card with an external terminal using the same. It is intended.

  In order to achieve the object, the first aspect of the IC module with external terminals of the present invention has an external terminal mounted so as to expose the external terminal in a recess formed on one surface of the card base. In the IC module, an external terminal is formed on one surface of the module substrate, an IC chip is mounted on the other surface, and the pad electrode of the IC chip and the external terminal are connected by a conductive wire, A black first sealing resin layer was formed so as to cover the IC chip and the conductive wire, and a white second sealing resin layer was formed on the exposed surface of the first sealing resin layer It is characterized by this.

  The second aspect is characterized in that, in the first aspect, the second sealing resin layer is formed by transfer molding.

  The third aspect is characterized in that, in the first aspect, the second sealing resin layer is formed by transfer.

  The fourth aspect is characterized in that, in the first aspect, the second sealing resin layer is formed by printing.

  The fifth aspect is an IC card with external terminals using the IC module with external terminals of any one of the first to fourth aspects, wherein the recess forming portion of the IC card with external terminals is connected to the external terminal of the card base. When measured from the opposite side of the formation surface, the reflection density measured with a Macbeth RD918 reflection densitometer is 0.01 to 0.15.

1) A first sealing resin layer is formed as in the IC module with external terminals of the present invention, and a white second sealing resin layer is formed on the exposed surface of the first sealing resin layer by transfer molding means and transfer means. Alternatively, by being formed by the printing means, the back side of the IC module of the IC card with external terminals does not look dark, and can be provided as an IC card with external terminals having a good appearance.
In addition, the possibility of malfunction of the IC chip is reduced even when strong light is irradiated from the back side of the card.
2) An IC card with an external terminal using an IC module with an external terminal, and when the recess forming portion of the IC card with an external terminal is measured from the opposite side of the external terminal forming surface of the card base, the Macbeth RD918 reflection densitometer When the reflection density measured in (1) is 0.01 to 0.15, the back surface of the IC module is also equivalent to the surrounding color. Further, by setting the reflection density value as described above, it becomes easier to manage the reflection density value on the back side of the module after being carded.

It is a figure for demonstrating an example of the IC card with an external terminal of this embodiment. It is a figure for demonstrating the XX sectional view of FIG. It is a figure for demonstrating an example of the 1st recessed part of a card | curd base | substrate, and a 2nd recessed part. It is a figure for demonstrating an example of the IC module with an external terminal of this embodiment. It is a figure for demonstrating another example of the IC module with an external terminal of this embodiment.

  Hereinafter, an IC module with external terminals and an IC card with external terminals using the same according to the present embodiment will be described with reference to the drawings.

FIG. 1 is a diagram showing an example of an IC card 100 with external terminals (hereinafter also simply referred to as an IC card) according to the present embodiment.
An IC module 2 is mounted on the IC card base 1, and external terminals for reading information recorded in the recording part of the IC chip are connected to an external reading device. Further, the “IC card” which is the name of the card is printed and displayed on the printing unit 4 of the core sheet (not shown) of the card by a printing means or the like.
Although not shown, a magnetic stripe may be formed. Further, the back surface of the card substrate 1 may be printed with a back surface and a magnetic stripe may be provided.

2 is a cross-sectional view taken along line XX of FIG.
FIG. 2A is a diagram illustrating an example in which the IC module 2 is bonded to the card base 1 with an adhesive sheet 3 having a size covering the entire sealing resin of the IC module. FIG. 2b shows an IC card in which the IC module 2 is bonded to the card base 1 by using the adhesive sheet 3 only at the peripheral edge of the first recess 11 formed in the card base 1. FIG.
As can be seen from FIGS. 2A and 2B, the card base 1 is formed with a shallow first recess 11 and a second recess 12 which is a deeper recess inside the first recess. In the following description of the present embodiment, the IC module will be described as an example of a COT (Chip On Tape) type IC module.

In FIG. a, an adhesive sheet having substantially the same shape as the IC module is fixed to the inside of the first and second recesses, and the IC module 2 is fitted from above, and the adhesive sheet is melted by the heat transmitted from the surface of the module substrate. Then, the IC module 2 is fixed to the card base 1.
In FIG. b, the adhesive sheet 3 is die-cut in substantially the same shape as the edge of the first concave portion 11 and fixed to the first concave portion, and the IC module 2 is fitted from above to attach the adhesive sheet 3 from the surface of the module substrate. The IC module 2 is fixed to the card base 1 by being melted by the transmitted heat.

With reference to FIG. 3, the first recess and the second recess described in FIG. 2 will be described in more detail.
The card substrate 1 includes a core sheet 15 in which a white pigment is kneaded and transparent cover sheets 13 (for front) and 14 (for back) laminated on the front and back.
When the card body 1 is formed with a recess, the exposed surface of the core sheet 15 is printed, protected (laminated) with the cover sheets 13 (for front) and 14 (for back), and the surface of the front cover sheet 13 is cut. The first recess 11 is formed. The depth of the first recess 11 is a thickness (depth) obtained by combining the thickness of the module substrate of the IC module and the thickness of the adhesive sheet.
A second recess is formed inside the first recess 11 by cutting in accordance with the thickness of the back surface of the IC module. As a result, a second recessed portion remaining thickness “t” portion formed by the back cover sheet 14 and the core sheet 15 is formed in the recessed portion of the card base 1.

4 and 5 are cross-sectional views of the IC module 2.
The example of the IC module 2 shown in FIG. 4 is an example in which the second sealing resin layer 23 is formed only at the exposed portion in the thickness direction of the first sealing resin layer 22 by transfer molding, for example. Inside the first sealing resin layer 22, the IC chip 5 fixed to the module substrate 21, the external terminal (not shown) formed on the opposite surface of the IC chip 5 of the module substrate, and the IC are not shown. Conductive wires (not shown) connecting the chip pad electrodes (not shown) are encapsulated.
The example of the IC module 2 shown in FIG. 5 is an example in which the second sealing resin layer 23 is formed over the entire exposed surface of the first sealing resin layer 22 by, for example, transfer molding.

The IC module of the present embodiment is mounted and used so that external terminals are exposed in the first recess 11 and the second recess 12 formed on one surface of the card base 1 described with reference to FIGS. IC module 2 with an external terminal.
As described above, an external terminal (not shown) is formed on one surface of the module substrate 21, and the IC chip 5 is mounted on the other surface, and the pad electrode (not shown) of the IC chip 5 is mounted. The external terminal (not shown) is connected with a conductive wire (not shown), and a black first sealing resin layer 22 is formed so as to cover the IC chip and the conductive wire, By forming the white-type second sealing resin layer 23 on the exposed surface of the first sealing resin layer 22 by transfer molding means, transfer means, or printing means, the back side of the module is changed into a card. The IC card 100 with an external terminal that does not look dark and looks good can be obtained.

With reference to FIG. 3, the card base material used in the present embodiment will be described.
The core sheet 15 and the cover sheets 13 and 14 include polyethylene terephthalate, polyethylene terephthalate glycol (PET-G), polypropylene, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, biodegradable aliphatic polyester, biodegradable polycarbonate. , Selected from acrylic resins such as biodegradable polylactic acid, polymethyl methacrylate, ethyl polymethacrylate, polycarbonate, etc., and white pigments are used in combination.

  When the core sheet 15 (the core sheet may be composed of a plurality of sheets) and the cover sheets 13 and 14 are laminated with an adhesive, a vinyl chloride / vinyl acetate copolymer, an ethylene / vinyl acetate copolymer, and vinyl chloride are used. / After adding a plasticizer, stabilizer, curing agent, etc. to a binder such as propionic acid copolymer, rubber resin, cellulosic resin, polyolefin copolymer, etc., it is sufficient to use a solvent or diluent. It is applied using a kneaded adhesive layer coating. The adhesive is applied by a coating method such as a gravure method, a roll method, or a knife edge method.

  Printing on the card is performed using ultraviolet curable offset ink or screen ink depending on the design.

The material used for the IC module will be described with reference to FIG.
For the module substrate 21, a heat resistant resin film such as glass epoxy, polyimide, polyethylene terephthalate is used.
Although not shown, a hole for connecting a conductive wire for connecting an external terminal (not shown) and an IC chip is opened on the module substrate 21, and a metal thin plate is bonded to one surface of the module substrate 21, An independent external terminal is formed by means such as etching, and the IC chip 5 is fixed to the other surface and sealed with the first sealing resin 22.

The sealing method using resin includes a transfer mold method, a potting mold method, and a dam formation potting mold method. In either case, an uncured resin is formed and cured with heat, ultraviolet rays, a curing agent, or the like, and the IC chip 5 or a bonding wire (not shown) is covered.
In the present embodiment, a curing agent such as a fatty acid anhydride or an aromatic acid anhydride is added to the first sealing resin 22 to an epoxy resin such as a bisphenol F type, a novolac type, an alicyclic type, or a polycrule type. use. As a solid content, an inorganic filler such as silica, alumina, quartz, aluminum hydroxide, calcium carbonate, titanium oxide, and talc and a black pigment are mixed to form a resin layer that does not transmit light.

  The thickness of each layer of the IC module 2 is approximately 110 μm for the module substrate 21 (total thickness including the metal thin plate of the external terminal, nickel plating, gold plating, and adhesive), 150 to 200 μm for the IC chip 5, and the first sealing resin. Layer 22 is 470-510 μm.

Table 1 shows the reflection density measurement data of the back side “B2” portion of the second recess in FIG. 3 for the card base manufactured with the material configuration and thickness setting as described above.
The reflection density of the “B1” portion is the reflection density value of the portion where the back side printing of the card base is not performed (the non-printing portion of the card base).
Note that the reflection density values (hereinafter referred to as reflection density A, reflection density B1, and reflection density B2) at positions “A”, “B1”, and “B2” described below are the materials that make up the card substrate 1. , Measured values of a card substrate in which a core sheet (620 μm) kneaded with a white pigment and a transparent front and back cover sheet (each 100 μm) are fused.
The reflection density is measured using a “Macbeth RD918 reflection densitometer” with an aperture size of 5 mmφ and a measurement area of 4 mmφ.

The reflection density values shown in Table 1 are the values at the positions of B1 and B2 in FIG. 3 for three types of “second recess remaining thickness” (see “t” in FIG. 3) that are assumed to be generated depending on the material configuration of the card base. This is a value obtained by measuring the reflection density.
The reflection density B1 is 0.12 in common for all cards.
The card a having a second recess remaining thickness of 0.195 mm has a reflection density B2 of 0.14, the card b having a second recess remaining thickness of 0.165 mm has a reflection density B2 of 0.16, and the card having a second recess remaining thickness of 0.155 mm. The reflection density B2 of c is 0.17.

Next, with reference to Table 2, the reflection density C of the second sealing resin layer 23 made of various materials formed on the first sealing resin layer 22 of FIG. 4 and the card after mounting the IC module of FIG. The reflection density A measured from the surface will be described. Note that the first sealing resin layer 22 in FIG. 4 is a sealing resin layer made of a black resin formed by a transfer molding method.
Six types of materials were prototyped as the second sealing resin layer 23, and the reflection density A and the reflection density C were measured for the second recess remaining thicknesses a, b, and c. Hereinafter, “Example 1” to “Example 6” in Table 2 will be described.

Example 1
When the second sealing resin layer 23 is the “adhesive sheet” 3 shown in FIG. 2, the reflection density C is 1.13, and the reflection density A of the second recess remaining thicknesses a, b, c is 0.15. , 0.20, 0.21. The adhesive sheet is a white turbid adhesive sheet having a thickness of 50 μm mainly composed of a resin obtained by copolymerizing ethylene vinyl alcohol (EVA) and vinyl acetate.

(Example 2)
When the second sealing resin layer 23 is “transfer mold (white) resin”, the reflection density C is 0.06, and the reflection density A of the second concave remaining thicknesses a, b, c is 0.14. 0.14 and 0.16. The transfer mold (white) resin is a sealing resin in which biphenyl resin is filled with about 80% by mass of titanium oxide. The thickness of the second sealing resin layer is about 20 μm.

Example 3
When the second sealing resin layer 23 is “white ink by screen printing”, the reflection density C is 0.05, and the reflection densities A of the second concave remaining thicknesses a, b, c are 0.14, 0, respectively. .14, 0.15. White ink by screen printing is a resin in which 30% by mass of titanium oxide is filled in an acrylic vehicle. The thickness of the white ink film after drying is about 20 μm.

Example 4
When the second sealing resin layer 23 is “white ink by screen printing according to Example 3 + adhesive sheet”, the reflection density C is 0.03, and the reflection density A of the second concave remaining thicknesses a, b, c is They were 0.13, 0.13, and 0.13, respectively.

(Example 5)
When the second sealing resin layer 23 is a “white transfer foil”, the reflection density C is 0.03, and the reflection densities A of the second recess remaining thicknesses a, b, and c are 0.13 and 0.13, respectively. 0.13. For the “white transfer foil”, a commercially available wide correction tape was used. The thickness of the foil excluding the “white transfer foil” base film is about 25 μm.

(Example 6)
When the second sealing resin layer 23 is “white transfer foil + adhesive sheet of Example 5”, the reflection density C is 0.04, and the reflection density A of the second recess remaining thicknesses a, b, c is respectively It was 0.14, 0.14, 0.15.

  As described above, if the reflection density of the recess forming portion of the IC card with external terminals is 0.01 to 0.15, the reflection density on the back surface of the module is close to the reflection density of the non-printing portion of the card base, It has been found that it is possible to use the card in an unobtrusive state.

  It can be used for all IC cards with external terminals.

1 Card base 2 IC module (COT)
3 Adhesive sheet (adhesive)
4 Printing Section 5 IC Chip 11 First Recess 12 Second Recess 13 Front Cover Sheet 14 Back Cover Sheet 15 Core Sheet 21 Module Substrate 22 First Sealing Resin Layer (First Sealing Resin)
23 Second sealing resin layer (second sealing resin)
100 IC card

Claims (5)

An IC module with an external terminal mounted so as to expose the external terminal in a recess formed on one surface of the card base,
An external terminal is formed on one surface of the module substrate, and an IC chip is mounted on the other surface. The pad electrode of the IC chip and the external terminal are connected by a conductive wire, and the IC chip and the conductive material are connected. A black first sealing resin layer is formed so as to cover the conductive wire, and a white second sealing resin layer is formed on the exposed surface of the first sealing resin layer. IC module with terminals. In the IC module with external terminals according to claim 1,
An IC module with external terminals, wherein the second sealing resin layer is formed by transfer molding. In the IC module with external terminals according to claim 1,
The IC module with an external terminal, wherein the second sealing resin layer is formed by transfer. In the IC module with external terminals according to claim 1,
An IC module with external terminals, wherein the second sealing resin layer is formed by printing. An IC card with external terminals using the IC module with external terminals according to any one of claims 1 to 4,
The reflection density measured by Macbeth RD918 reflection densitometer is 0.01 to 0.15 when the concave portion forming part of the IC card with external terminals is measured from the reverse side of the external terminal forming surface of the card base. IC card with external terminal.

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