JP2012146904A - Photoelectric conversion device and photoelectric conversion module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photoelectric conversion device and a photoelectric conversion module capable of contributing to an increase in size.
SOLUTION: A photoelectric conversion device 2 includes a substrate 6, a photoelectric conversion element 5 provided above the substrate 6, a rectifying element 4 provided below the substrate 6, and a substrate 6. A via conductor 7 is provided in which the rectifying element 4 is electrically connected in parallel to the photoelectric conversion element 5 so that the rectifying direction is opposite to the output voltage.
[Selection] Figure 2

Description

  The present invention relates to a photoelectric conversion device and a photoelectric conversion module using the photoelectric conversion device.

  In recent years, development of a photoelectric conversion device having a photoelectric conversion element has been advanced. As an exemplary photoelectric conversion device, there is a solar cell device that converts solar energy into electric power. In particular, for the purpose of improving the power generation efficiency, a concentrating solar cell device is being developed. The photoelectric conversion device includes a photoelectric conversion element that converts light energy into electric power energy. When the photoelectric conversion device is, for example, a solar cell device, the photoelectric conversion element is a solar cell element that converts solar energy into electric power energy (see, for example, Patent Document 1).

  Note that in the photoelectric conversion device, a condensing member that condenses light on the photoelectric conversion element is provided on the photoelectric conversion element.

JP-A-9-64396

  Since the photoelectric conversion device collects light and converts it into electricity, when it is installed and used outdoors, it is easily affected by sunlight. Therefore, when it is going to enlarge a photoelectric conversion apparatus, while increasing the area of the photoelectric conversion element which receives light, it is necessary to improve the heat dissipation of a photoelectric conversion element.

  This invention is made | formed in view of the above, Comprising: It aims at providing the photoelectric conversion apparatus and photoelectric conversion module which can contribute to enlargement.

  A photoelectric conversion device according to an embodiment of the present invention includes a substrate, a photoelectric conversion element provided above the substrate, a rectifier element provided below the substrate, and a rectifier provided in the substrate. A via conductor is electrically connected in parallel to the photoelectric conversion element so that the rectification direction is opposite to the output voltage.

  The photoelectric conversion module which concerns on one Embodiment of this invention is the condensing which collects the light which received the light from the outside provided in the said photoelectric conversion apparatus and the said photoelectric conversion apparatus, and was received by the said photoelectric conversion element And a member.

  ADVANTAGE OF THE INVENTION According to this invention, the photoelectric conversion apparatus and photoelectric conversion module which can contribute to enlargement can be provided.

It is a disassembled perspective view which shows the external appearance of the photoelectric conversion module which concerns on this embodiment. It is a partial sectional view of a photoelectric conversion module concerning this embodiment. It is a top view of the photoelectric conversion apparatus which concerns on this embodiment. The electrical connection relationship between the photoelectric conversion element and the rectifying element is shown. It is a permeation | transmission top view of the photoelectric conversion apparatus which concerns on this embodiment. It is sectional drawing of the photoelectric conversion apparatus which concerns on one modification. It is sectional drawing of the photoelectric conversion apparatus which concerns on one modification. It is sectional drawing of the photoelectric conversion apparatus which concerns on one modification. It is sectional drawing of the photoelectric conversion apparatus which concerns on one modification. It is sectional drawing of the photoelectric conversion apparatus which concerns on one modification. It is sectional drawing of the photoelectric conversion apparatus which concerns on one modification.

  Exemplary embodiments of a photoelectric conversion device and a photoelectric conversion module according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited to the example of the following embodiment.

<Schematic configuration of photoelectric conversion module>
FIG. 1 is an overview perspective view of a photoelectric conversion module 1 according to the present embodiment, and an exploded perspective view in which a part thereof is enlarged. FIG. 2 is a cross-sectional view of the photoelectric conversion device 2 and the light collecting member 3 which are part of the photoelectric conversion module 1 shown in FIG. FIG. 3 is a plan view of the photoelectric conversion device 2 and shows a connection relationship between the photoelectric conversion devices 2. FIG. 4 shows an electrical connection relationship between the photoelectric conversion element 2 and the rectifying element 4. FIG. 5 is a transmission plan view of the photoelectric conversion device 2 and shows an arrangement relationship between the photoelectric conversion device 2 and the rectifying element 4. 2 is a cross-sectional view of the photoelectric conversion device 2 taken along the line AA ′ in FIG.

  The photoelectric conversion module 1 according to the present embodiment is a photovoltaic power generation module that converts sunlight into electric power. Moreover, the photoelectric conversion apparatus 2 according to the present embodiment includes a photoelectric conversion element 5 that converts light into electricity. The photoelectric conversion element 5 has a function of receiving sunlight and generating electric power, for example. As shown in FIG. 1, the photoelectric conversion module 1 includes a plurality of photoelectric conversion devices 2. A plurality of photoelectric conversion devices 2 are electrically connected in parallel or in series.

  The photoelectric conversion module 1 includes a photoelectric conversion device 2 and a light collecting member 3 that receives light. The condensing member 3 is provided above the photoelectric conversion device 2. The condensing member 3 is, for example, a dome-shaped Fresnel lens. The condensing member 3 has a function of collecting light received from the outside and collecting the received light on the photoelectric conversion element 5 of the photoelectric conversion device 2. The light collecting member 3 is made of, for example, glass, plastic, resin, or the like. The condensing member 3 includes a lens member 3a and a frame member 3b, and is fixed by the frame member 3b so as to surround the outer periphery of the lens member 3a.

  The photoelectric conversion device 2 includes a substrate 6, a plurality of photoelectric conversion elements 5 provided above the substrate 6, a plurality of rectifier elements 4 provided below the substrate 6, and a substrate 6. A via conductor 7 that electrically connects the element 5 and the rectifying element 4 is provided.

The substrate 6 has a function of radiating heat transmitted to the photoelectric conversion element 5 to the outside. The photoelectric conversion device 2 generates heat by converting a part of the energy of the light transmitted through the light collecting member 3 into heat. Therefore, the substrate 6 is made of a material that easily transfers heat from the photoelectric conversion element 5. The substrate 6 is made of, for example, a ceramic material such as alumina, mullite, or aluminum nitride, a glass ceramic material, or a composite material obtained by mixing a plurality of these materials. The substrate 6 is made of a metal material with excellent heat dissipation such as copper, aluminum, iron, nickel, cobalt, chromium, or an alloy thereof. The thermal conductivity of the substrate 6 is set to 180 W / (m · K) or more, for example. The coefficient of thermal expansion of the substrate 6 is, for example, 3 × 10 ⁻⁶ / ° C. or higher and 18 ×
It is set to 10 ⁻⁶ / ° C. or lower.

  The size of the substrate 6 is set such that a plurality of ceramic substrates 8 can be provided. The size of the substrate 6 is set such that, for example, the length of one side in a plan view is 20 mm or more and 200 mm or less, and the thickness in the vertical direction is 0.5 mm or more and 10 mm or less.

The ceramic substrate 8 is made of, for example, a ceramic material such as alumina, mullite, or aluminum nitride, a glass ceramic material, or a composite material obtained by mixing a plurality of these materials. The thermal conductivity of the ceramic substrate 8 is set to, for example, 14 W / m · K or more and 200 W / m · K or less. Moreover, the thermal expansion coefficient of the ceramic substrate 8 is set to, for example, 3 × 10 ⁻⁶ / ° C. or more and 10 × 10 ⁻⁶ / ° C. or less.

  The size of each ceramic substrate 8 is set such that one photoelectric conversion element 5 can be mounted on the upper surface of one ceramic substrate 8. The size of each ceramic substrate 8 is set such that, for example, the length of one side in a plan view is 3 mm or more and 30 mm or less, and the thickness in the vertical direction is 0.1 mm or more and 5 mm or less.

  An electrode pattern as the first electrode layer 9 is provided on each ceramic substrate 8. The 1st electrode layer 9 is electrically connected with the photoelectric conversion element 5, and is for taking out the electric power generated by the photoelectric conversion element 5 outside. The first electrode layer 9 is made of, for example, a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, or an alloy thereof.

  The photoelectric conversion element 5 is disposed on the ceramic substrate 8. The photoelectric conversion element 5 is electrically connected to the first electrode layer 9 through, for example, a bonding wire. Moreover, the photoelectric conversion element 5 may be mounted on an electrode pattern metallized on the ceramic substrate 8.

The photoelectric conversion element 5 has a function of converting light into electric power. The photoelectric conversion element 5 is, for example, a solar cell element that includes a III-V group compound semiconductor. The photoelectric conversion element 5 can immediately convert received light into electric power and output an output voltage by the photovoltaic effect. The solar cell element has, for example, an InGaP / GaAs / Ge3 junction type cell structure. The indium gallium phosphide (InGaP) top cell converts energy contained in a wavelength region of 660 nm or less. The gallium arsenide (GaAs) middle cell converts energy contained in a wavelength region of 660 nm or more and 890 nm or less. The germanium (Ge) bottom cell converts energy contained in a wavelength region of 890 nm or more and 2000 nm or less. The three cells are connected in series via a tunnel junction. The open circuit voltage is the sum of the electromotive voltages of the three cells.

  The size of the photoelectric conversion element 5 is set such that, for example, the length of one side in a plan view is 3 mm or more and 15 mm or less, and the thickness in the vertical direction is 0.3 mm or more and 5 mm or less. In a state where one photoelectric conversion element 5 is superposed on one ceramic substrate 8, the gap between the end of the ceramic substrate 8 and the end of the photoelectric conversion element 5 when viewed in plan is, for example, 10 mm or less. Is set to

  The electric power generated by the photoelectric conversion element 5 is taken out from the lead frame 10 to the outside. The lead frame 10 functions as a terminal. The lead frame 10 is provided at the ends of a plurality of photoelectric conversion elements 5 that are electrically connected in series.

The lead frame 10 provided on the ceramic substrate 8 is for taking out the electric power generated by the photoelectric conversion element 5 to the outside. The lead frame 10 is made of, for example, a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, or an alloy thereof.

  A frame 11 is provided on the substrate 6 so as to surround the plurality of photoelectric conversion elements 5. The frame 11 is connected to the substrate 6 via, for example, solder or bonding resin.

  A part of the frame 11 is provided with a gap in which a part of the frame 11 is interrupted, and the lead frame 10 is provided in the gap. When the frame 11 is made of a metal material, the lead frame 10 has an insulating material interposed between the frame 11 and the lead frame 10 so as to be insulated from the frame 11.

The frame 11 is made of, for example, a metal material such as copper, aluminum, iron, nickel, cobalt, chromium, or an alloy thereof, a ceramic material such as alumina, mullite, or aluminum nitride, a glass ceramic material, or these materials. It consists of a composite material in which a plurality of materials are mixed. The thermal conductivity of the frame 11 is set to, for example, 14 W / m · K or more and 200 W / m · K or less. Moreover, the thermal expansion coefficient of the frame 11 is set to, for example, 3 × 10 ⁻⁶ / ° C. or more and 10 × 10 ⁻⁶ / ° C. or less.

  When the frame body 11 is made of the same material as the ceramic substrate 8, the thermal expansion coefficient of the ceramic substrate 8 and the thermal expansion coefficient of the frame body 11 can be matched. By combining the thermal expansion coefficients of the ceramic substrate 8 and the frame body 11, the thermal stress applied to the lead frame 10 is prevented from being concentrated at a specific location due to the difference in thermal expansion coefficient between the two due to the heat of sunlight or the like. be able to. As a result, the lead frame 10 can be prevented from being deformed and peeled off from the frame body 11, and the hermeticity of the photoelectric conversion device 2 can be improved.

  A light transmissive substrate 12 is provided on the frame 11 so as to cover the plurality of photoelectric conversion elements 5. The light transmissive substrate 12 is connected to the frame 11 via, for example, solder or bonding resin. The photoelectric conversion element 5 is hermetically sealed by being surrounded by the substrate 6, the frame 11, and the light transmissive substrate 12. Note that the space to be hermetically sealed is filled with an inert gas. Alternatively, the hermetically sealed space is maintained in a low pressure state having a lower pressure than the atmosphere.

  The light transmissive substrate 12 is provided to face the substrate 6. The light transmissive substrate 12 transmits sunlight and can irradiate the plurality of photoelectric conversion elements 5. The light transmissive substrate 12 is made of a light transmissive material such as glass, plastic, or resin. The size of the light-transmitting substrate 12 is a size that overlaps the substrate 6. For example, the length of one side in a plan view is 20 mm or more and 200 mm or less, and the thickness in the vertical direction is 0.2 mm or more and 5 mm. It is set as follows.

  The light transmissive substrate 12 is provided to be spaced from the photoelectric conversion element 5. By providing the photoelectric conversion element 5 and the light-transmitting substrate 12 through a hermetically sealed space, a part of the light-transmitting substrate 12 comes into contact with the photoelectric conversion element 5 and the light-transmitting substrate 12 or photoelectric It can suppress that the conversion element 5 is damaged. If the photoelectric conversion element 5 is damaged, the photoelectric conversion efficiency of the photoelectric conversion element 5 may be reduced. However, according to this embodiment, the photoelectric conversion efficiency of the photoelectric conversion element 5 is reduced because they do not contact each other. Can be suppressed. In addition, if the light-transmitting substrate 12 is damaged, there is a risk that light traveling from the light collecting member 3 toward the photoelectric conversion element 5 may be diffusely reflected at the damaged portion. However, according to the present embodiment, the two are not in contact with each other. It is possible to suppress the amount of light condensed on the photoelectric conversion element 5 from being reduced.

A rectifying element 4 is provided on the lower surface of the substrate 6. As shown in FIG. 4, the rectifying element 4 is electrically connected to the photoelectric conversion element 5 in parallel so that the rectification direction is opposite to the output voltage of the photoelectric conversion element 5. Here, the photoelectric conversion element 5 and the rectification element 4 electrically connected in parallel to the photoelectric conversion element 5 so that the rectification direction is opposite to the output voltage are referred to as an electric unit U. FIG. 4 shows an electric circuit in which a plurality of electric units U are electrically connected in series. The rectifying element 4 minimizes a decrease in the generated power, such as avoiding variations such as a decrease in the amount of generated power due to the shadow of the photoelectric conversion element 5 or a decrease in generated power due to an increase in resistance. Is for. For example, the rectifying element 4 can bypass a flowing current by using a bypass diode, an IC element having a voltage / current adjusting function, and the like, and can suppress a decrease in generated power to a minimum. If the rectifying element 4 is provided on the upper surface of the substrate 6 in parallel with the photoelectric conversion element 5, the area of the photoelectric conversion element 5 in the upper surface of the substrate 6 is reduced. When the area occupied on the upper surface of the substrate 6 of the photoelectric conversion element 5 is reduced, the amount of light received by the photoelectric conversion element 5 is reduced, and the electromotive force as the photoelectric conversion device 2 is reduced. Therefore, by providing the rectifying element 4 on the lower surface of the substrate 6 without providing it in parallel with the photoelectric conversion element 5, the area of the photoelectric conversion element 5 occupying the upper surface of the substrate 6 can be increased. The electromotive force of 2 can be improved.

  As shown in FIG. 5, the rectifying element 4 is disposed in a region overlapping the photoelectric conversion element 5 as seen in a plan view. When the rectifying element 4 is arranged so as to overlap the photoelectric conversion element 5, the area of the photoelectric conversion element 5 occupying the upper surface of the substrate 6 can be maximized, and the electromotive force of the photoelectric conversion device 2 is effectively improved. Can be made.

  In the rectifying element 4, an electrode pattern as the second electrode layer 13 is provided on the lower surface of the substrate 6. The second electrode layer 13 is electrically connected to the rectifying element 4. The second electrode layer 13 is made of, for example, a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, or an alloy thereof.

  The rectifying element 4 is electrically connected to the second electrode layer 13 through, for example, a bonding wire. The rectifying element 4 may be mounted on an electrode pattern metallized on the lower surface of the substrate 6.

  The via conductor 7 is provided between the first electrode layer 9 and the second electrode layer 13. The via conductor 7 has a structure that penetrates the ceramic substrate 8 and the substrate 6. The via conductor 7 can electrically connect the rectifying element 4 to the photoelectric conversion element 5 in parallel. The via conductor 7 is made of a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, or an alloy thereof. The via conductor 7 can be produced by embedding a conductive paste in a via hole laser-processed on the ceramic substrate 8 and the substrate 6. The diameter of the via conductor 7 is set to, for example, 0.2 mm or more and 5 mm or less.

  By using the via conductor 7, the rectifying element 4 can be provided on the lower surface of the substrate 6, the area of the photoelectric conversion element 5 occupying the upper surface of the substrate 6 can be increased, and the photoelectric conversion efficiency of the photoelectric conversion element 5 is improved. Can be made.

  The photoelectric conversion module 1 and the photoelectric conversion device 2 collect light and convert it into electricity. Since it is often used outdoors, it is easily affected by the heat of sunlight. Further, the photoelectric conversion module 1 and the photoelectric conversion device 2 are greatly influenced by the temperature difference of the outside air between day and night. Furthermore, the photoelectric conversion module 1 and the photoelectric conversion device 2 are also affected by the weather. Therefore, the photoelectric conversion module 1 and the photoelectric conversion device 2 are placed in an environment in which thermal expansion is likely to occur due to a difference in temperature.

Therefore, in the photoelectric conversion module 1 and the photoelectric conversion device 2, when the photoelectric conversion element 5 and the rectifying element 4 are mounted on the upper surface which is one side of the substrate 6, the warpage of the substrate 6 is caused by the heat generated from the photoelectric conversion element 5 and the rectifying element 4. The photoelectric conversion element 5 or the rectifying element 4 may be peeled off from the substrate 6. In particular, if the photoelectric conversion module 1 and the photoelectric conversion device 2 are increased in size, the possibility that the substrate 6 is destroyed increases.

  The photoelectric conversion module 1 and the photoelectric conversion device 2 according to the present embodiment have a structure in which a plurality of ceramic substrates 8 are mounted on a large substrate 6 and the photoelectric conversion elements 5 are mounted on each ceramic substrate 8. As a result, the influence of thermal expansion due to the difference in thermal expansion coefficient between the substrate 6 and the ceramic substrate 8 is reduced by dividing the substrate on which the plurality of photoelectric conversion elements 5 are mounted into a plurality of substrates and mounting them on the substrate 6. It is possible to prevent the ceramic substrate 8 from peeling from the substrate 6. Furthermore, by mounting the photoelectric conversion element 5 on one main surface of the substrate 6 and mounting the rectifying element 4 on the other main surface of the substrate 6, it is possible to effectively suppress the destruction of the substrate 6, and the photoelectric conversion module 1 and the photoelectric conversion apparatus 2 can be enlarged.

  As described above, according to the present embodiment, it is possible to provide the photoelectric conversion device 2 and the photoelectric conversion module 1 that can contribute to an increase in size.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

<Modification>
Hereinafter, modifications of the embodiment of the present invention will be described. Note that, in the photoelectric conversion module 1 and the photoelectric conversion device 2 according to the modification of the embodiment of the present invention, portions similar to those of the photoelectric conversion module 1 and the photoelectric conversion device 2 according to the embodiment of the present invention are denoted by the same reference numerals. The description will be omitted as appropriate. 6 to 11 are diagrams showing a photoelectric conversion device 2 according to a modification, and FIGS. 6 to 11 correspond to FIG. 2.

  The photoelectric conversion device 2 according to the above-described embodiment uses the ceramic substrate 8, but is not limited thereto. For example, as shown in FIG. 6, a structure in which the photoelectric conversion element 5 is directly mounted on the upper surface of the substrate 6 without providing the ceramic substrate 8 may be used.

  By mounting the photoelectric conversion element 5 directly on the upper surface of the substrate 6, the thickness of the photoelectric conversion device 2 can be reduced, a light receiving area for receiving sunlight can be secured, and the photoelectric conversion device 2 can be downsized. can do. Further, the heat generated in the photoelectric conversion element 5 can be directly transmitted to the substrate 6 and radiated from the substrate 6 toward the outside. As a result, heat generated in the photoelectric conversion element 5 can be prevented from being trapped inside the package, and the package sealing can be prevented from being broken.

  Moreover, although the 1st electrode layer 9 and the 2nd electrode layer 13 were used for the photoelectric conversion apparatus 2 which concerns on embodiment mentioned above, it is not restricted to this. For example, as shown in FIG. 7, the photoelectric conversion element 5 and the rectifying element 4 are directly connected via the via conductor 7 without providing the first electrode layer 9 and the second electrode layer 13. Also good.

  By electrically connecting the photoelectric conversion element 5 and the rectifying element 4 directly via the via conductor 7, heat generated in the first electrode layer 9 and the second electrode layer 13 can be eliminated. Then, the power consumed in the first electrode layer 9 and the second electrode layer 13 of the electric power generated by the photoelectric conversion element 5 can be eliminated, the electric power taken out from the photoelectric conversion device 2 can be increased, and a large amount of electric power can be generated. The conversion module 1 and the photoelectric conversion device 2 can be realized.

Moreover, although the photoelectric conversion apparatus 2 which concerns on embodiment mentioned above secured the sealing property of the photoelectric conversion element 5 using the frame 11, it is not restricted to this. For example, as shown in FIG. 8, a structure in which a light-transmitting resin 14 is filled between the substrate 6 and the light-transmitting substrate 12 may be used.

  The translucent resin 14 transmits light and joins the substrate 6 and the light transmissive substrate 12 together. The translucent resin 14 is, for example, a thermosetting resin such as polyimide resin, acrylic resin, epoxy resin, urethane resin, cyanate resin, silicone resin or bismaleimide triazine resin, or polyether ketone resin, polyethylene terephthalate resin or polyphenylene ether. It consists of material excellent in sealing properties, such as thermoplastic resins, such as resin.

  The photoelectric conversion device 2 according to this modification can improve the adhesion between the substrate 6 and the light transmissive substrate 12 by covering the plurality of photoelectric conversion elements 5 with the light transmissive resin 14. The light transmissive substrate 12 can be made difficult to peel off, and the airtightness of the plurality of photoelectric conversion elements 5 sandwiched between the substrate 6 and the light transmissive substrate 12 can be favorably maintained.

  In the photoelectric conversion device 2 according to the above-described embodiment, the rectifying element 4 is outside the package, but is not limited thereto. For example, as shown in FIG. 9 or FIG. 10, a structure in which the rectifying element 4 is provided in a package may be used.

  As shown in FIG. 9, a structure in which a support 15 is provided along the outer periphery of the lower surface of the substrate 6 and a sealing substrate 16 is provided on the support 15 via, for example, solder or bonding resin may be employed. The support 15 is made of, for example, a metal material such as copper, aluminum, iron, nickel, cobalt, chromium, or an alloy thereof, a ceramic material such as alumina, mullite, or aluminum nitride, a glass ceramic material, or a material thereof. Of these, a composite material in which a plurality of materials are mixed is used.

  The sealing substrate 16 seals the rectifying element 4 and covers the plurality of rectifying elements 4. The sealing substrate 16 is made of a material such as copper, aluminum, or an alloy thereof.

  Moreover, as shown in FIG. 10, the structure which provides the photoelectric conversion element 5 and the rectifier 4 in the frame 11 may be sufficient. The ceramic substrate 8 is used as a substrate on which the photoelectric conversion element 5 and the rectifying element 4 are mounted. By providing the convex portion 17 on the outer periphery of the lower surface of the ceramic substrate 8, a gap can be provided between the ceramic substrate 8 and the substrate 6, and the rectifying element 4 can be provided in the gap.

  The convex portion 17 may be a part of the ceramic substrate 8 or may be provided with a separate member unlike the ceramic substrate 8. The convex part 17 consists of materials, such as ceramic materials, such as an alumina, a mullite, or aluminum nitride, or a glass ceramic material, for example.

  By providing the rectifying element 4 in the package, the rectifying element 4 can be hermetically sealed, and the rectifying element 4 can be prevented from receiving an external impact or being oxidized. Can be prevented from deteriorating. And the electromotive force which generate | occur | produces in the photoelectric conversion module 1 and the photoelectric conversion apparatus 2 can be maintained favorable.

  Moreover, although the photoelectric conversion apparatus 2 which concerns on embodiment mentioned above used the insulating material for the board | substrate 6, it is not restricted to this. For example, as shown in FIG. 11, the substrate 6a may be made of a metal material.

As shown in FIG. 11, when the substrate 6a is made of a metal material, a first insulating layer 18 is provided between the photoelectric conversion element 5 and the substrate 6a, and the first rectifying element 4 and the substrate 6a Two insulating layers 19 are provided to insulate the photoelectric conversion element 5 and the rectifying element 4 from the substrate 6a. Furthermore, a through hole is formed in the substrate 6a. Then, an insulator 20 is provided on the inner wall surface of the through hole to insulate the via conductor 7 from the substrate 6a, and the photoelectric conversion element 5 and the rectifying element 4 are electrically connected via the via conductor 7.

  By using the substrate 6a as a metal material, the heat generated by the photoelectric conversion element 5 can be easily dissipated to the outside through the substrate 6a, and by making the heat difficult to stay in the photoelectric conversion device, photoelectric conversion It can suppress that the electrical property of the element 5 changes.

<Method for producing photoelectric conversion module>
Here, the manufacturing method of the photoelectric conversion module 1 and the photoelectric conversion apparatus 2 is demonstrated.

  First, the substrate 6 and the ceramic substrate 8 are prepared. If the substrate 6 and the ceramic substrate 8 are made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, or calcium oxide. To obtain a mixture. Then, the molds of the substrate 6 and the ceramic substrate 8 are filled with the mixture and dried, and then the unsintered substrate 6 and the ceramic substrate 8 are taken out.

  Then, via holes are formed at predetermined positions of the substrate 6 and the ceramic substrate 8 with respect to the substrate 6 and the ceramic substrate 8 before sintering using, for example, a laser.

  Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. And for the via hole of the board | substrate 6 and the ceramic board | substrate 8 before the taking out which were taken out, for example using a screen printing method, a metal paste is apply | coated and the photoelectric conversion element 5 and the rectifier element 4 are electrically connected A via hole 7 is formed.

  In addition, the first electrode layer 9 and the second electrode layer 13 are formed by printing a metal paste on predetermined positions of the substrate 6 and the ceramic substrate 8.

  Then, the board | substrate 6 and the ceramic substrate 8 are each baked at the temperature of about 1600 degreeC, and the board | substrate 6 and the ceramic substrate 8 can each be produced.

  The ceramic substrate 8 on which the photoelectric conversion element 5 is mounted on the substrate 6 is connected through, for example, solder or bonding resin.

  Next, the frame 11 and the light transmissive substrate 12 are prepared. Then, the frame body 11 is joined to the substrate 6 via, for example, solder so as to surround the plurality of photoelectric conversion elements 5 along the outer periphery of the substrate 6. Furthermore, the lead frame 10 is connected to a predetermined portion of the frame 11 via, for example, solder. Then, the light transmissive substrate 12 is positioned so as to face the substrate 6, and the substrate 6 and the light transmissive substrate 12 are bonded through the bonding resin 12 in an inert gas atmosphere. In this way, the photoelectric conversion device 2 can be manufactured. Furthermore, the photoelectric conversion module 1 can be produced by positioning and providing the light collecting member 3 above the photoelectric conversion device 2.

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion module 2 Photoelectric conversion apparatus 3 Condensing member 3a Lens member 3b Frame member 4 Rectification element 5 Photoelectric conversion element 6 Substrate 7 Via conductor 8 Ceramic substrate 9 1st electrode layer 10 Lead frame 11 Frame body 12 Light transmission substrate 13 Second electrode layer 14 Translucent resin 15 Support 16 Sealing substrate 17 Convex part

Claims (8)

A substrate,
A photoelectric conversion element provided above the substrate;
A rectifying element provided below the substrate;
And a via conductor provided in the substrate and electrically connected in parallel to the photoelectric conversion element so that the rectification direction is opposite to the output voltage. The photoelectric conversion device according to claim 1,
A plurality of electric units composed of the photoelectric conversion element and the rectifying element are provided,
A photoelectric conversion device in which the plurality of electrical units are electrically connected in series. The photoelectric conversion device according to claim 1 or 2, wherein
The rectifying element is a photoelectric conversion device arranged in a region overlapping the photoelectric conversion element in plan view. A photoelectric conversion device according to any one of claims 1 to 3,
The via conductor is a photoelectric conversion device arranged in a region overlapping the photoelectric conversion element in plan view. A photoelectric conversion device according to any one of claims 1 to 4,
A photoelectric conversion device in which the via conductor is provided between the photoelectric conversion element and the rectifying element. A photoelectric conversion device according to any one of claims 1 to 5,
The photoelectric conversion device in which the plurality of photoelectric conversion elements are covered with a translucent resin. The photoelectric conversion device according to any one of claims 1 to 6,
The photoelectric conversion device and the rectifying device are a photoelectric conversion device provided in a package. A photoelectric conversion device according to any one of claims 1 to 7,
And a light collecting member that is provided above the photoelectric conversion device and receives light from the outside and collects the light received by the photoelectric conversion element.

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