JP2012132049A - Vacuum deposition device and vacuum deposition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum deposition device and a vacuum deposition method capable of more stably depositing a depositional material on a target member while inhibiting degradation of the depositional material due to heating.SOLUTION: The vacuum deposition device 1 includes: a container 4 having an opening and capable of containing the depositional material 3 therein; and a plurality of heat sources 5 fixedly arranged in the container 4 so as to be in contact with the depositional material 3 when the depositional material 3 is contained in the container 4 and capable of being individually heat-controlled from the outside. By bringing the heat sources 5 into direct contact with the depositional material 3, the depositional material 3 can be efficiently heated.

Description

  The present invention relates to a vacuum deposition apparatus and a vacuum deposition method.

  A vacuum deposition method is known as a method for producing an organic layer such as an organic electroluminescence (EL) element. Usually, the vacuum deposition method is performed by placing a substrate and a deposition material to be deposited facing each other in a vacuum environment, heating the deposition material to a vapor pressure temperature, and attaching the obtained evaporated substance to the substrate surface. Is called. As the vapor deposition material, powder is usually used.

  As a method of heating the vapor deposition material, there are a method of heating a container containing the vapor deposition material, and a method of placing a heating body on the vapor deposition material and heating the heating body with an electron beam, induction heating, a heater, etc. (Patent Literature) 1).

Japanese Patent No. 4001296 (Claim 1 and FIG. 1)

  In the method of heating the container, since the entire container is heated and the vapor deposition material is heated from below, the vapor deposition material is vaporized from the surface after the entire vapor deposition material is heated. In such a method, the vapor deposition material may be deteriorated by heat when used for a long time. Therefore, there is a problem that it is desired to reduce the heated portion as much as possible.

  In the method of placing the heating body on the vapor deposition material, only the portion in contact with the vapor deposition material can be heated, so that deterioration of the material can be suppressed. However, in the method described in Patent Document 1, the heating element 55 is merely placed on the vapor deposition material 53 as shown in FIG. For this reason, when evaporation of the vapor deposition material proceeds and the vapor deposition material decreases, the heating body may be inclined depending on how the vapor deposition material is reduced. When the heating body is inclined, the area of the adhesive material in contact with the heating body is reduced, and the heating efficiency is lowered. Further, when the substance to be deposited is a molten material, the material is melted once before evaporating, so that the heating body may sink in the vapor deposition material. When the heating body sinks in the vapor deposition material, the entire vapor deposition material is heated, and the vapor deposition material may be deteriorated.

  The present invention has been made in view of such circumstances, and a vacuum deposition apparatus and a vacuum deposition method capable of more stably depositing a deposition material on a target member while suppressing deterioration of the deposition material due to heating. The purpose is to provide.

  In order to solve the above-described problems, the present invention provides a container having an opening and capable of accommodating a vapor deposition material, and the container in contact with the vapor deposition material when the vapor deposition material is accommodated in the container. And a plurality of heat sources that are fixedly arranged and can be individually controlled by heating from the outside.

  According to the above invention, the vapor deposition material can be efficiently heated by bringing the heat source into direct contact with the vapor deposition material. Therefore, it is possible to suppress the total amount of heat generated by the heat source, and it is possible to suppress deterioration of the vapor deposition material due to heating. Since a plurality of heat sources are divided and arranged in the container, the size of each heat source is smaller than when the entire container is heated. Thereby, the responsiveness of the deposition rate control is improved. Further, since the heat source is fixedly arranged in the container, it does not tilt or sink depending on the amount of the vapor deposition material. Each heat source can be individually controlled from the outside. Accordingly, even when vaporization progresses and the total amount of the vapor deposition material changes, the vapor deposition material can be vaporized while suppressing excessive heating of the vapor deposition material.

  1 aspect of the said invention WHEREIN: You may further provide the cover member which has one or more holes arrange | positioned by the said opening part of the said container.

  According to one aspect of the present invention, by providing the lid member having one or more holes formed in the opening of the container, the vaporized vapor material is discharged out of the container through the holes. . Thereby, the vaporized vapor deposition material can be discharged out of the container from a position other than just above the heating heat source. Therefore, it is possible to stabilize the distribution of the vapor deposition material that is released.

1 aspect of the said invention WHEREIN: It is preferable to provide the heating mechanism which heats the said cover member.
By providing the heating mechanism, it is possible to prevent the vapor deposition material from adhering to the hole and closing the hole when the vaporized vapor deposition material passes through the hole of the lid member.

1 aspect of the said invention WHEREIN: The said container may be provided with the heat-shielding member which divides between a heat source and a heat source.
By doing so, since the temperature rise of the vapor deposition material of the part which is not heated can be suppressed, deterioration of vapor deposition material can be suppressed.

1 aspect of the said invention WHEREIN: The said container may be equipped with the evaporation chamber provided with the gas passage, and the said several heat source may each be fixedly arrange | positioned in the said evaporation chamber.
By doing so, since the exposed part of the heat source can be reduced, it is possible to prevent the vapor deposition material heated and vaporized by another heat source from adhering to the heat source having a low temperature during non-heating.

In one aspect of the above invention, the heat source is heated according to a change in the amount of vaporized vapor deposition material measured by the measurement unit that measures the amount of vaporized vapor deposition material released from the container. It is preferable to further include a control unit for controlling.
With the above structure, the heat source can be controlled by heating according to the vaporization amount of the vapor deposition material, so that the amount of the vapor deposition material released from the opening can be stabilized.

  According to another aspect of the present invention, there is provided a step of filling an evaporation material in contact with the heat source in a container having a plurality of heat sources that are provided with openings and are individually arranged to control heating, and among the plurality of heat sources. A first heating step of heating the vapor deposition material using only a predetermined heat source, and a second heating step of stopping heating by the predetermined heat source and starting heating by another heat source in contact with the vapor deposition material. Provided is a vacuum deposition method.

  According to the above invention, the vapor deposition material can be efficiently heated by bringing the heat source into direct contact with the vapor deposition material. As a result, the total amount of heat generated by the heat source can be suppressed. Since each heat source can be individually controlled from the outside, the heating position in the container can be moved. In the first heating step, the vapor deposition material is heated only with a predetermined heat source. As the vaporization material progresses in vaporization, the contact area between the predetermined heat source and the vapor deposition material decreases. However, the vaporization efficiency can be stabilized by starting heating with another heat source. At that time, since heating by a predetermined heat source is stopped, excessive heating can be suppressed. Further, by partially heating the filled vapor deposition material, it is possible to prevent the vapor deposition material in a portion not in use from being deteriorated.

In one aspect of the above invention, prior to the second heating step, further comprising a measurement step of measuring the amount of vaporized vapor deposition material released from the container, based on the change in the amount of vapor deposition material measured, It is preferable to start heating the other heat source.
Since the heat source can be controlled by heating according to the vaporization amount of the vapor deposition material, the amount of the vapor deposition material released from the opening can be stabilized.

  Further, in the present invention, a container having an opening and capable of accommodating a vapor deposition material, and when the vapor deposition material is accommodated in the container, the vapor deposition material is spaced from the vapor deposition material on the opening side surface. At least one heat source disposed in an open manner, wherein the vapor deposition material vaporized by the heat source is movable over the heat source toward the opening.

  According to the above invention, since the heat source is arranged on the vapor deposition material with a space, even if vaporization progresses and the remaining amount of the vapor deposition material changes, the heat source tilts or sinks in the vapor deposition material. There is nothing. As a result, the vapor deposition material can be vaporized with good reproducibility. Moreover, since it is not necessary to warm the whole vapor deposition material with which it filled, deterioration of the vapor deposition material of the location which is not used can be prevented. In addition, it is possible to vaporize the vapor deposition material with a smaller amount of heat than to warm the entire container.

1 aspect of the said invention WHEREIN: It is preferable to provide further the cover member which is arrange | positioned in the said opening part of the said container and has one or more holes.
By disposing the lid member at the opening of the container, the distribution of the vapor deposition material when the vaporized vapor deposition material is discharged to the outside of the container can be stabilized.

1 aspect of the said invention WHEREIN: It is preferable to provide the heating mechanism which heats the said cover member.
By providing the heating mechanism, it is possible to prevent the vapor deposition material from adhering to the hole and closing the hole when the vaporized vapor deposition material passes through the hole of the lid member.

  According to the present invention, by fixing the heat source in the container, the vapor deposition material can be vapor-deposited on the target member more stably without tilting or sinking. According to the present invention, since the vapor deposition material can be partially heated by bringing a heat source that can be individually controlled to heat into contact with the vapor deposition material, deterioration of the vapor deposition material can be suppressed. According to the present invention, since the vapor deposition material can be heated on the surface by disposing the heat source close to the vapor deposition material, deterioration of the vapor deposition material can be suppressed.

It is a schematic sectional drawing of the vacuum evaporation system which concerns on 1st Embodiment. It is a figure which shows the example of arrangement | positioning of a cover member. It is sectional drawing of the container provided with the heat-shielding member. It is sectional drawing of the container provided with the heat-shielding member. It is a figure explaining the vacuum evaporation method which concerns on 1st Embodiment. It is a schematic sectional drawing of the container provided with the cover member concerning 1st Embodiment. It is a schematic sectional drawing of the container which concerns on 2nd Embodiment. It is a schematic sectional drawing of the container which concerns on 3rd Embodiment. It is a schematic sectional drawing of the container which concerns on 4th Embodiment. It is a schematic top view of the container shown in FIG. It is a schematic sectional drawing of the container provided with the cover member which concerns on 4th Embodiment. It is a partial schematic sectional drawing of the conventional vacuum evaporation system.

Hereinafter, an embodiment of a vacuum deposition apparatus and a vacuum deposition method according to the present invention will be described with reference to the drawings.
[First Embodiment]
In FIG. 1, the schematic sectional drawing of the vacuum evaporation system which concerns on 1st Embodiment is shown. The vacuum deposition apparatus 1 includes a vacuum chamber 2, a container 4 that stores the deposition material 3, and a plurality of heat sources 5 that are fixed in the container 4.
The vacuum chamber 2 is configured so that the substrate 6 can be carried in and out from the outside and can be decompressed. In the vacuum chamber 2, the substrate 6 is held at the top by a substrate holding portion (not shown).

  The container 4 has a box shape having an opening, and is made of a metal such as titanium or stainless steel, for example. The container 4 is disposed in the vacuum chamber 2 so that the opening portion faces the plate surface of the substrate 6 and the bottom surface is horizontal.

  A plurality of heat sources 5 are arranged in the container 4 so as to come into contact with the vapor deposition material 3 when the vapor deposition material 3 is accommodated in the container 4. A plurality of heat sources 5 can be arranged in the container 4 and have a size that allows a predetermined distance from the upper surface (opening) of the container 4. The number and arrangement of the heat sources 5 are appropriately set according to the size of the container 4 and the type of vapor deposition material 3 to be used. For example, the plurality of heat sources 5 are fixed to the bottom surface of the container 4 at intervals. The plurality of heat sources 5 are capable of releasing the amount of heat that can vaporize the vapor deposition material 3. For example, the heat source 5 has the capability of heating the vapor deposition material 3 in the range of room temperature to 400 ° C., at least about 200 ° C. to 400 ° C. The plurality of heat sources 5 can be individually heated and controlled from the outside. Specifically, the heat source 5 is an electric resistance heating using a two-chrome wire or the like. The heat source 5 is preferably covered like a sheath type.

A lid member 7 may be disposed in the opening of the container 4. The lid member 7 is made of metal, for example, the same material as the container, and has one or more holes 8. The number of holes 8, the size of the holes 8, and the arrangement of the holes 8 are appropriately set according to the size of the container 4, the type of the vapor deposition material 3, the number of the heat sources 5, the arrangement of the heat sources 5, and the like. By providing the lid member 7, the distribution of the vaporized vapor deposition material released from the container 4 can be made uniform.
A plurality of lid members 7 may be arranged. FIG. 2 shows an arrangement example of the lid member 7. In FIG. 2, the lid members 7 a and 7 b are arranged above the heat source 5 with two layers in the vertical direction. By setting it as such a structure, it becomes possible to make uniform distribution of the vapor deposition material 3 discharged | emitted from the container 4. FIG.
The lid member 7 is preferably provided with a heating mechanism (not shown) for heating itself (particularly the hole 8). The heating mechanism is, for example, a sheath heater or a carbon heater as with the heat source 5.

  The container 4 may include a heat shield member 9 that separates between the heat sources of the plurality of heat sources 5 that are fixed in the container 4 at intervals. The heat shielding member 9 is a glossy plate made of a metal such as SUS or a plate made of a ceramic material having a low thermal conductivity. The thickness and size of the heat shield member 9 are appropriately set according to the type of the heat source 5, the distance between the heat source and the heat source, and the like. FIG. 3 illustrates a cross-sectional view of the container 4 including the heat shield member 9. In FIG. 3, the heat shield member 9 has a larger cross-sectional area than the heat source 5 and can block at least the heat released from the heat source 5 from moving in the horizontal direction. As shown in FIG. 4, the heat shield member 9 may be arranged in the X direction and the Y direction of the box-shaped container. By providing the heat shield member 9, it is possible to block heat transfer to the vapor deposition material located at a position away from the heat source used for heating. Thereby, the temperature rise of the vapor deposition material around the heat source that is not used for heating can be suppressed, and deterioration can be suppressed.

The vacuum vapor deposition apparatus 1 preferably includes a measurement unit that measures the amount of vaporized vapor deposition material and a control unit that controls heating of the heat source (not shown).
The measuring unit can measure the amount of vaporized vapor deposition material released from the container 4 when the vapor deposition material 3 is heated and vaporized. For example, the measurement unit is a crystal oscillator type film formation rate monitor provided near the opening.
The control unit can control the heating of the heat source 5 according to the change in the vaporized vapor deposition material measured by the measurement unit. For example, if the heat source 5 is a resistance heater that generates electricity when energized, the rate signal is the PV value, the rate target value is the SV value, and the resistance that is the heating source of the heat source 5 is used to keep the film formation rate constant. Heating control is performed by PID control or the like in which the current amount of the heater is MV.

Next, the vacuum deposition method according to this embodiment will be described. FIG. 5 is a diagram illustrating a vacuum deposition method according to this embodiment.
The vacuum vapor deposition method according to the present embodiment includes a step of filling the container 4 with the vapor deposition material 3, and a first heating step and a second heating step for heating the vapor deposition material 3.

(1) The process of filling the container 4 with the vapor deposition material 3 (FIG. 5A)
The vapor deposition material 3 is filled into the container 4 from the opening 10 so that the vapor deposition material 3 comes into contact with the heat source 5. For example, when the heat source 5 is fixed to the bottom surface of the container, the vapor deposition material 3 is filled around the heat source 5 in such an amount that the upper portions of all the heat sources 5 are covered (that is, the heat sources are filled). Further, at the time of filling, the heat source 5 does not need to be completely covered with the vapor deposition material, and it is not always necessary to uniformly fill all the heat sources 5. Therefore, the vapor deposition material may be filled around only a part of the heat sources 5 according to the required evaporation amount. The vapor deposition material 3 to be filled is a kind of organic material (for example, Alq3) that melts and evaporates or sublimates when heated. The organic material is usually provided as a powder.

The substrate 6 is carried into the vacuum chamber 2 and is held by the substrate holding portion (not shown) so that the plate surface of the substrate 6 faces the opening 10 of the container 4. Thereafter, the inside of the vacuum chamber 2 is depressurized. When the inside of the vacuum chamber 2 reaches a predetermined degree of vacuum, for example, 10 ⁻³ Pa to 10 ⁻⁵ Pa, the decompression is stopped.

(2) First heating step (FIG. 5B)
Next, heating by a predetermined heat source 5a is started. The heat source 5a generates heat by controlling the evaporation amount to be constant, or generates heat by controlling the temperature of the material to be heated to be constant. The heat released by the heat source 5a is transferred to the vapor deposition material 3 that is in contact with or near the heat source 5a, and vaporizes the vapor deposition material 3. The vaporized vapor deposition material 9 is discharged from the opening 10 to the outside of the container 4 and adheres to the plate surface of the substrate 6. A predetermined distance is provided from the upper part of the heat source 5 to the upper part of the container 4 (opening 10). Therefore, the vapor deposition material 9 heated and vaporized by the heat source 5a is sufficiently diffused in the direction of the plate surface of the substrate 6 until it reaches the vicinity of the opening 10, and is released to the outside of the container. The amount of vaporized vapor deposition material 9 released to the outside of the container is substantially constant.

  When vaporization of the vapor deposition material 3 by the heat source 5a proceeds, the vapor deposition material 3 in contact with the heat source 5a or in the vicinity of the heat source 5a decreases. When heating is performed so that the amount of heat input to the vapor deposition material 3 is substantially constant, vaporized vapor deposition released to the outside of the container when the amount of the vapor deposition material in contact with the heat source 5a or in the vicinity of the heat source 5a falls below a predetermined amount. The amount of material 9 is reduced. The second heating step is performed before the amount of vaporized vapor deposition material 9 released to the outside of the container fluctuates (decreases) in the first heating step.

  The timing of starting the second heating step is to calculate the time to reach the predetermined amount in advance from the filling amount of the vapor deposition material 3 to be used, the vaporization characteristics of the vapor deposition material 3 to be used, the amount of heat released from the heat source 5a, and the like. May be set. Preferably, in the second heating step, the amount of vaporized vapor deposition material 9 released to the outside of the container in the previous heating step is measured by the measurement unit, and the measured amount of vapor deposition material changes (decreases). Start.

(3) Second heating step (FIG. 5C)
In the second heating step, heating by the heat source 5a is stopped and heating by another heat source 5b is started. Stopping heating means, for example, stopping the supply of electric power to the heat source 5a, and the heat radiation from the heat source 5a does not have to be completely stopped when the heating is stopped. The heat source 5b releases heat so that the amount of heat input to the vapor deposition material 3 becomes substantially constant. The heat released by the heat source 5b is transmitted to the vapor deposition material 3 that is in contact with or near the heat source 5b, and vaporizes the vapor deposition material 3. The vaporized vapor deposition material 11 is discharged from the opening 10 to the outside of the container 4 and adheres to the plate surface of the substrate 6. The amount of vaporized vapor deposition material 11 released to the outside of the container is substantially constant throughout the first heating process and the second heating process.

  The second heating step is repeatedly performed according to the number of heat sources 5 arranged. Specifically, the heating of the heat source 5b is stopped and the heating of the heat source 5c is started before the amount 11 of the vapor deposition material that is vaporized by the heating of the heat source 5b and released to the outside of the container changes. The timing for starting the heating of the heat source 5c may be set based on the measurement result in the measurement unit. Thus, the vapor deposition material 3 is heated in order with the heat source 5 arranged in multiple numbers.

In addition, before decompressing the inside of the vacuum chamber 2, you may provide the process of arrange | positioning the cover member 7 in the opening part 10 of the container 4. The lid member 7 is fixed to the container using an appropriate means. By providing the lid member 7 as shown in FIG. 6, the outlets from the container are dispersed, so that the distribution of the vaporized vapor deposition material 11 can be made uniform.
When the lid member 7 includes a heating mechanism, the lid member 7 is heated through the first heating step and the second heating step. By doing so, since the vaporized vapor deposition material 11 does not cool when passing through the hole 8 of the lid member 7, the vaporized vapor deposition material 11 adheres to the hole 8 and closes the hole 8. Can be prevented.

[Second Embodiment]
The vacuum deposition apparatus according to the present embodiment has the same configuration as that of the first embodiment except that the container for storing the deposition material has a double structure.
In FIG. 7, the schematic sectional drawing of the container which concerns on this embodiment is shown. The container 24 includes a first container 24a that contains a vapor deposition material and to which a plurality of heat sources 25 are fixed, and a second container 24b that covers the outside of the first container 24a.

  The 1st container 24a is made into the box shape which has an opening part, for example, is comprised with metals, such as titanium and stainless steel. A plurality of heat sources 25 are arranged in the first container 24a as in the first embodiment. The second container 24b has the same configuration as that of the first container 24a except that the first container 24a can be completely accommodated and has a size deeper than the first container 24a. The size of the first container 24a and the second container 24b is appropriately set.

  The 1st container 24a is arrange | positioned in the 2nd container 24b so that an opening part may become the same direction. The first container 24a and the second container 24b are arranged in the vacuum chamber so that each opening is directed to the plate surface of the substrate and each bottom surface is horizontal.

  Lid members 27a and 27b are disposed in the openings of the first container 24a and the second container 24b, respectively. The lid members 27a and 27b may be the same as those in the first embodiment. The holes 28a and 28b of the lid members 27a and 27b are preferably arranged so as not to overlap each other when the lid members 27a and 27b are arranged. The number and size of the holes 28a and 28b may be different. By setting it as such a structure, the distribution of the vapor deposition material discharged from the 2nd container 24b can be equalize | homogenized.

[Third Embodiment]
The vacuum vapor deposition apparatus according to the present embodiment has the same configuration as that of the first embodiment except that a container for accommodating a vapor deposition material includes an evaporation chamber.
FIG. 8 is a schematic cross-sectional view of the container 34 according to this embodiment. The container 34 includes a number of evaporation chambers 31 corresponding to the number of heat sources 35. The evaporation chamber 31 is made of a metal such as SUS or a ceramic material such as alumina. In some cases, a structure with low heat transfer to another independent space may be used by using a ceramic material having low thermal conductivity. The evaporation chamber 31 has an independent space inside. The evaporation chamber 31 has a gas communication port 32 opened toward the opening 30 of the container 34.

In the present embodiment, the plurality of heat sources 35 are individually disposed in the evaporation chamber 31. When the vapor deposition material is heated by the heat source 35, the vaporized vapor deposition material is discharged from the opening to the outside of the container via the gas communication port 32.
The heat source used in the first heating step is lowered in an exposed state because the vapor deposition material existing in the surrounding area is reduced. According to the present embodiment, since the heat source 35 is disposed in the evaporation chamber 31, the vapor deposition material vaporized in the second heating process adheres to the heat source that has been cooled as described above or in the vicinity thereof. Can be prevented. Therefore, the vapor deposition material vaporized in the second heating step is efficiently vapor deposited on the substrate.

[Fourth Embodiment]
The vacuum deposition apparatus includes a vacuum chamber, a container for storing a deposition material, and a heat source fixed in the container.
The vacuum chamber is configured so that the substrate can be carried in and out from the outside and the pressure can be reduced. In the vacuum chamber, the substrate is held at the upper portion by the substrate holding portion.

FIG. 9 shows a schematic cross-sectional view of a container 44 to which a heat source 45 according to the fourth embodiment is fixed. FIG. 10 is a schematic top view of the container 44 shown in FIG.
The container 44 has a box shape having the opening 40 and is made of, for example, a metal such as titanium or stainless steel. The container 44 is disposed in the vacuum chamber so that the opening 40 faces the plate surface of the substrate and the bottom surface is horizontal.

  When the vapor deposition material 43 is accommodated in the container 44, the heat source 45 is disposed at a position facing the upper surface (surface on the opening side) of the vapor deposition material 43 with a gap from the upper surface of the vapor deposition material 43. . For example, the heat source 45 is fixed to the side surface of the container 44. The heat source 45 may be fixed to the side surface of the container 44 so as to be movable in the vertical direction or the horizontal direction.

  The heat source 45 is shaped so that the vapor deposition material 49 heated and vaporized by the heat source 45 can move toward the opening 40. It is preferable that the heat source 45 is disposed so that the entire upper surface of the vapor deposition material 43 filled in the container 44 can be heated. For example, as shown in FIG. 10, the elongated heat source 45 may be arranged in a meandering manner. The amount of heat that can vaporize the vapor deposition material 43 can be released. For example, the heat source 45 has the capability of heating the vapor deposition material in the range of room temperature to 400 ° C., at least about 200 ° C. to 400 ° C. The heat source 45 can be controlled by heating from the outside. Specifically, the heat source 45 is an electric resistance heating using a dichrome wire or the like. The heat source 45 is preferably covered like a sheath type. The heat source 45 may be an integrated type, or may be one in which a plurality of heat sources are arranged side by side.

A lid member 47 may be disposed in the opening 40 of the container 44. The lid member 47 is made of metal, for example, the same material as the container, and has one or more holes 48. The number of the holes 48, the size of the holes 48, the arrangement of the holes 48, and the like are appropriately set according to the size of the container 44, the type of the vapor deposition material 43, the number of the heat sources 45, the arrangement of the heat sources 45, and the like. FIG. 11 shows an arrangement example of the lid member 47. By providing the lid member 47, the distribution of the vaporized vapor deposition material 49 released to the outside of the container can be made uniform.
A plurality of lid members 47 may be arranged similarly to the first embodiment.
The lid member 47 is preferably provided with a heating mechanism that heats itself (particularly the hole). The heating mechanism is, for example, a sheath heater or a carbon heater as with the heat source 5.

The vacuum deposition apparatus preferably includes a measurement unit that measures the amount of vaporized deposition material and a control unit that controls heating of the heat source.
When the vapor deposition material is heated and vaporized, the measurement unit can measure the amount of vaporized vapor deposition material released from the container. For example, the measurement unit is a crystal oscillator type film formation rate monitor provided near the opening.
The control unit can control the heating of the heat source 45 according to the change in the vaporized vapor deposition material measured by the measurement unit. For example, when the heat source 45 is a resistance heater that generates electricity by energization, in order to keep the film formation rate constant, the rate signal is the PV value, the target value of the rate is the SV value, and the resistance that is the heating source of the heat source 45 Heating control is performed by PID control or the like in which the current amount of the heater is MV.

Next, the vacuum deposition method according to this embodiment will be described.
First, the vapor deposition material 43 is filled into the container 44 from the opening 40. The amount of the vapor deposition material 43 to be filled is set such that the upper surface of the vapor deposition material 43 after filling does not come into contact with the heat source 45. When the heat source 45 is movable in the vertical direction, the height of the heat source 45 may be adjusted to a height at which the upper surface of the vapor deposition material 43 does not contact the heat source 45. The vapor deposition material 43 to be filled is a type of organic material (for example, Alq3) that melts and evaporates or sublimates when heated. The organic material is usually provided as a powder.

The substrate is carried into the vacuum chamber, and is held by the substrate holder so that the substrate surface faces the opening of the container. Thereafter, the vacuum chamber is depressurized. When the inside of the vacuum chamber reaches a predetermined degree of vacuum, for example, 10 ⁻³ Pa to 10 ⁻⁵ Pa, the decompression is stopped.

  Next, heating by the heat source 45 is started. The heat released by the heat source 45 is radiatively transferred to the upper surface of the vapor deposition material 43 to vaporize the vapor deposition material 43. The vaporized vapor deposition material 49 is discharged from the opening 40 to the outside of the container 44 through the heat source 45 and adheres to the plate surface of the substrate.

  The amount of heat generated by the heat source 45 may be gradually increased. Alternatively, when the heat source 45 is movable in the vertical direction, the heat generation amount of the heat source 45 is kept constant, and the height of the heat source 45 is gradually increased so that the distance between the heat source 45 and the upper surface of the vapor deposition material 43 becomes substantially constant. It may be lowered.

In addition, before decompressing the inside of a vacuum chamber, you may provide the process of arrange | positioning the cover member 47 to the opening part of a container. The lid member 47 is fixed to the container 44 using an appropriate means.
When the lid member 47 is provided with a heating mechanism, the lid member 47 is heated when heated by the heat source 45. By doing so, since the vaporized vapor deposition material 49 is not cooled when passing through the hole 48 of the lid member 47, the vaporized vapor deposition material 49 adheres to the hole 48 and closes the hole 48. Can be prevented.

  According to this embodiment, since the heat source 45 is disposed near the surface of the vapor deposition material 43 and heated, the vapor deposition material 43 can be vaporized with a smaller amount of heat than when the entire vapor deposition material is heated. In addition, since the heat released from the heat source 45 is preferentially used for vaporizing the vapor deposition material 43 near the surface, the temperature rise of the vapor deposition material 43 at a position away from the heat source 45 is suppressed, and deterioration is suppressed. can do.

DESCRIPTION OF SYMBOLS 1 Vacuum evaporation apparatus 2 Vacuum chamber 3,43,53 Vapor deposition material 4,24a, 24b, 34,44 Container 5,5a, 5b, 5c, 25,35,45,55 Heat source 6 Substrate 7,7a, 7b, 27a, 27b, 47 Lid member 8, 28a, 28b, 48 Hole 9 Heat shield member 10, 40 Opening 11, 49 Vaporized vapor deposition material 31 Evaporation chamber 32 Gas communication port

Claims (11)

A container having an opening and capable of containing a vapor deposition material;
When the vapor deposition material is stored in the container, a plurality of heat sources that are fixedly arranged in the container so as to come into contact with the vapor deposition material and can be individually controlled from outside.
A vacuum deposition apparatus comprising:   The vacuum evaporation system according to claim 1, further comprising a lid member having one or more holes disposed in the opening of the container.   The vacuum deposition apparatus according to claim 2, further comprising a heating mechanism that heats the lid member.   The vacuum evaporation apparatus in any one of Claim 1 thru | or 3 with which the said container is equipped with the heat-shielding member which divides between a heat source and a heat source. The container includes an evaporation chamber having a gas communication port,
The vacuum evaporation apparatus according to any one of claims 1 to 3, wherein the plurality of heat sources are respectively fixedly disposed in the evaporation chamber. A measuring unit for measuring the amount of vaporized vapor deposition material released from the container;
In accordance with a change in the amount of vaporized vapor deposition material measured by the measurement unit, a control unit that controls heating of the heat source;
The vacuum evaporation apparatus according to any one of claims 1 to 5, further comprising: Filling a vapor deposition material so as to come into contact with the heat source in a container having a plurality of heat sources, each of which has an opening and in which a plurality of heat sources that can be individually controlled by heating are fixed;
A first heating step of heating the vapor deposition material using only a predetermined heat source among the plurality of heat sources;
A second heating step of stopping heating by the predetermined heat source and starting heating by another heat source in contact with the vapor deposition material;
A vacuum deposition method comprising: Before the second heating step, further comprising a measuring step of measuring the amount of vaporized vapor deposition material released from the container,
The vacuum evaporation method of Claim 7 which starts the heating of said another heat source based on the change of the quantity of the measured said vapor deposition material. A container having an opening and capable of containing a vapor deposition material;
When the vapor deposition material is stored in the container, at least one heat source disposed on the opening side surface of the vapor deposition material at a distance from the vapor deposition material,
With
A vacuum deposition apparatus in which the vapor deposition material vaporized by the heat source can move toward the opening over the heat source.   The vacuum deposition apparatus according to claim 9, further comprising a lid member disposed in the opening of the container and having one or more holes. The vacuum deposition apparatus according to claim 10, further comprising a heating mechanism that heats the lid member.

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