JP2013063486A - Rotary cutting tool and method of manufacturing the same - Google Patents

Abstract

There is provided a high-performance rotary cutting tool used for heavy cutting of an aluminum alloy casting or a feeder.
A circular saw includes a substrate 110 on which a substrate coating 111 is formed by electro nickel plating, and a chip 100 including an ultra-hard material layer 101 fixed to the surface of the substrate coating 111 by brazing.
[Selection] Figure 4

Description

  The present invention relates to a rotary cutting tool and a manufacturing method thereof.

As a conventional tool of this type, for example, a circular saw for mowing is known.
A recess having a required angle and pitch is formed in the circumferential direction of the titanium substrate, and the chip is fixed to the recess by brazing. As this chip, there is known a circular saw for mowing that is fixed to a substrate by soldering through a nickel plating applied to a recess.
(Registered Utility Model No. 3043399: Patent Document 1)
Another conventional tool of this type is known as a circular saw coated with electroless nickel plating.

There is known a circular saw in which a surface of a substrate is coated with a film by electroless nickel plating, the phosphorus content of the film is 5% by mass or more and 10% by mass or less, and the hardness of the substrate is HRC 40 or more and 44 or less.
(JP 2000-202796 A: Patent Document 2)
As another conventional tool of this type, a circular saw in which TiN, AL ₂ O ₃ and SiC are coated by a PVD method as a hard coating on a substrate is known.
(Japanese Patent Laid-Open No. 5-38621: Patent Document 3)

Registered Utility Model No. 3043399 JP 2000-202796 A Japanese Patent Laid-Open No. 5-38621

  However, the conventional circular saw described in Patent Document 1 is difficult to apply to heavy cutting. For example, there has been a problem that it cannot be used for heavy cutting of an aluminum alloy casting gate or feeder.

  Furthermore, the conventional circular saw described in Patent Document 2 requires high cost for management of the electroless nickel plating solution. In addition, since the temperature of the plating solution is high, there is a problem in that the substrate is affected by heat and generates distortion.

  Further, the conventional circular saw described in Patent Document 3 has a problem in that the substrate is affected by heat and distortion occurs because the processing temperature of the PVD method is high.

  Accordingly, the present invention has been made to solve the above-described problems, and an object thereof is to provide a high-performance rotary cutting tool.

  The rotary cutting tool according to the present invention includes a substrate and a chip including a super-hard material fixed to the surface of the substrate by brazing, and the chip includes a chip coating by nickel plating that contacts the brazing material.

  In the rotary cutting tool configured as described above, since the chip includes a chip coating by nickel plating that contacts the brazing material, the chip adheres to the substrate. As a result, a high-performance rotary cutting tool can be provided.

Preferably, the thickness of the chip coating is not less than 0.5 μm and not more than 20 μm.
Preferably, the hardness of the chip coating is Hv300 or more and Hv600 or less.

  Preferably, the superhard material includes at least one selected from the group consisting of ceramics, cermets, cemented carbides, sintered diamonds, and single crystal diamonds.

Preferably, it is used for cutting of a sprue or feeder of an aluminum alloy casting.
Preferably, it further includes a substrate coating by electro nickel plating that covers the entire surface of the substrate.

Preferably, the chip is fixed to the radial surface of the substrate.
The method of manufacturing a rotary cutting tool according to the present invention includes a step of forming a chip coating by nickel plating, and a step of fixing a chip to the surface of the substrate by interposing a brazing material between the chip coating and the substrate by brazing. With.

It is a top view of the circular saw as a rotary cutting tool according to an embodiment of the present invention. It is sectional drawing along the II-II line | wire in FIG. It is sectional drawing which expands and shows the part enclosed by III in FIG. It is sectional drawing which expands and shows the part enclosed by IV in FIG. It is sectional drawing corresponding to FIG. 4, Comprising: It is sectional drawing which shows another embodiment. It is sectional drawing corresponding to FIG. 4, Comprising: It is sectional drawing which shows another embodiment.

  FIG. 1 is a plan view of a circular saw as a rotary cutting tool according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is an enlarged cross-sectional view of a portion surrounded by III in FIG. 4 is an enlarged cross-sectional view of a portion surrounded by IV in FIG.

  Referring to FIG. 1, the circular saw 1 has a disk-shaped substrate 110, and a chip 100 is provided on the outer periphery of the substrate 110. A through hole 2 is formed in the center of the substrate 110.

  The plurality of chips 100 are arranged at equal intervals, and the work can be cut when each chip 100 comes into contact with the work. The circular saw 1 rotates around the through hole 2.

  Referring to FIG. 2, substrate 110 has a certain thickness, and chip 100 having a thickness larger than that of substrate 110 is fixed to the outer periphery thereof.

  Referring to FIG. 3, the shape of chip 100 is such that the width (thickness) increases as it approaches the distal end side (outer peripheral side), and the distal end portion (outer peripheral portion) is formed in a rectangular shape. The shape of the tip 100 is not limited to that shown in this embodiment, and can be variously set according to the type of workpiece, the rotational speed of the circular saw, and the cutting conditions.

  Referring to FIG. 4, a substrate coating 111 is formed on substrate 110 by electro nickel plating. The substrate coating 111 is formed on the entire surface of the substrate 110 and has a function of facilitating the bonding of the chip 100 to the substrate 110.

  The chip has a three-layer structure of a super hard material layer 101, a super hard layer 102, and a chip coating 103, and the brazing material layer 104 is in close contact with the substrate coating 111 and the chip coating 103, whereby the chip 100 is mounted on the substrate. 110 can be fixed.

  A chip 100 made of an ultra-hard material in which a chip coating 103 formed by nickel plating is coated on at least the surface of the fixing surface is fixed to the surface of the substrate 110. In particular, when the chip 100 is fixed using the brazing material layer 104, the wettability between the brazing material layer 104 and the substrate 110 is extremely high because at least the surface of the fixing surface of the chip 100 is covered with the chip coating 103 formed by nickel plating. Good and reliable brazing is possible, and high brazing strength is stably obtained.

  The thickness of the chip coating 103 formed by nickel plating and the substrate coating 111 on the chip 100 is preferably 0.5 μm or more and 20 μm or less.

  If the thickness of the chip coating 103 and the substrate coating 111 formed by nickel plating is 0.5 μm or more, the brazing strength is stable and the circular saw 1 can sufficiently exhibit performance. The thicknesses of the chip coating 103 and the substrate coating 111 are more preferably 1 μm or more and 20 μm or less, and most preferably 1 μm or more and 15 μm or less.

  The hardness of the chip coating 103 and the substrate coating 111 formed by nickel plating on the chip is preferably Hv300 or more and Hv600 or less.

  Both nickel electroplating and electroless nickel plating can be used for nickel plating constituting the chip coating 103. The hardness of the coating is preferably from Hv300 to Hv600, more preferably from Hv300 to Hv600, and most preferably from Hv300 to Hv500.

  The material of the superhard material constituting the superhard material layer 101 is preferably composed of any one of ceramics, cermet, cemented carbide, sintered diamond, and single crystal diamond, or a combination of two or more.

  As the material of the super hard material used for the chip, an optimum super hard material is selected according to the material of the work, the hardness of the work, the cutting conditions, the required surface roughness, and the like.

  Furthermore, since the substrate coating 111 by electro nickel plating is coated on the entire substrate 110, rust is not generated on the substrate 110. Furthermore, since the substrate coating 111 by electro nickel plating is coated, it is possible to prevent the substrate from being damaged even if the substrate rubs against chips or a workpiece.

  Accordingly, not only can the substrate 110 be protected from rust for a long period of time, but also the damage to the substrate 110 can be prevented, so that the circular saw 1 can be maintained in a good state for a long time, and the performance of a new article can be improved over a long period of time. Can be used without lowering.

  Furthermore, in electro nickel plating, it is easy to manage the plating solution, and it is possible to perform plating at a lower cost than electroless nickel plating. In addition, since the entire surface of the substrate is coated with a coating by plating, the number of masking steps can be omitted, so that effects such as shortening of the process and cost reduction can be expected.

  The circular saw 1 is used for cutting a pouring gate or a feeder of an aluminum alloy casting. When the circular saw 1 is used for cutting an aluminum alloy casting sprue or feeder, a remarkable effect of the present invention can be obtained. Of course, it can be used for cutting various other materials.

  The circular saw 1 includes a substrate 110 and a chip 100 including an ultrahard material layer 101 fixed to the surface of the substrate coating 111 by brazing. The chip 100 includes a chip coating 103 formed by nickel plating that contacts the brazing material. Preferably, the thickness of the chip coating 103 is not less than 0.5 μm and not more than 20 μm. Preferably, the hardness of the chip coating 103 is Hv300 or more and Hv600 or less. Preferably, the superhard material includes at least one selected from the group consisting of ceramics, cermets, cemented carbides, sintered diamonds, and single crystal diamonds. Used to cut aluminum alloy casting gates or feeders. Preferably, a substrate coating 111 is formed by electro nickel plating that covers the entire surface of the substrate 110. Preferably, the chip 100 is fixed to the radial surface of the substrate 110.

  The method of manufacturing the circular saw 1 according to the present invention includes a step of forming a substrate coating 111 on the substrate 110 by electro nickel plating, and a step of fixing the chip 100 to the surface of the substrate coating 111 by brazing.

  FIG. 5 is a cross-sectional view corresponding to FIG. 4 and showing another embodiment. Referring to FIG. 5, in this example, the chip 100 is not provided with a chip coating, and the brazing material layer 104 is in direct contact with the cemented carbide layer 102. By adopting such a configuration, since it is not necessary to form a chip coating on the chip 100, the number of manufacturing steps can be reduced.

  FIG. 6 is a cross-sectional view corresponding to FIG. 4 and showing another embodiment. With reference to FIG. 6, in this example, the substrate film is not formed, and the brazing material layer 104 is in direct contact with the substrate 110. By adopting such a configuration, it is not necessary to form a substrate coating on the substrate 110, so that the number of manufacturing steps can be reduced.

  In the circular saw 1 as described above, when the chip 100 is fixed using the brazing material layer 104, since at least the fixing surface of the chip 100 is coated with a nickel plating film, the brazing material layer 104 and the substrate The wettability with 110 is very good, reliable brazing is possible, and high brazing strength is stably obtained.

The best mode for carrying out the invention will be described in detail in Examples.
(Example 1)
The following circular saw of the present invention was manufactured and the effect of the present invention was confirmed by experiments.

  A chip 100 made of cemented carbide was prepared, and the chip 100 was plated with nickel and covered with a plating film having a thickness of 1 μm. The hardness of the plating film was Hv350. Next, this chip was brazed to an alloy tool steel (SKS-5) substrate (no plating), and the chip was ground by a tool grinder to complete a circular saw (FIG. 6). The size of the circular saw was 355 mm in outer diameter, 3.5 mm in blade thickness, and 80 teeth.

  When this wood saw was used to perform a wood cutting test, the substrate was not rusted, and the substrate could be prevented from being damaged, and showed good performance over a long period of time.

(Example 2)
The following circular saw of the present invention was manufactured and the effect of the present invention was confirmed by experiments.

  A sintered diamond chip was prepared, nickel-plated on the chip, and coated with a plating film having a thickness of 1 μm. The hardness of the plating film was Hv350. Next, this chip was brazed to a substrate (no plating) of alloy tool steel (SKS-5), and the chip was ground with a tool grinder to complete a circular saw (FIG. 6). As for the size of the circular saw, the outer diameter was 400 mm, the blade thickness was 5.5 mm, and the number of teeth was 60.

  Using this circular saw, a cutting test of the gate of the aluminum alloy casting was carried out. As a result, there was no rust generation on the substrate, and even if the substrate rubbed with chips or workpieces, the substrate was not damaged and showed good performance over a long period of time.

(Example 3)
The following circular saw of the present invention was manufactured and the effect of the present invention was confirmed by experiments.

  A sintered diamond chip was prepared, nickel-plated on the chip, and coated with a plating film having a thickness of 1 μm. The hardness of the plating film was Hv350. Next, an alloy tool steel (SKS-5) substrate was prepared from this chip, and the entire surface of the substrate was subjected to electro nickel plating. A chip was soldered to this substrate, and the chip was ground by a tool grinder to complete a circular saw (FIG. 5). As for the size of the circular saw, the outer diameter was 400 mm, the blade thickness was 5.5 mm, and the number of teeth was 60.

  Using this circular saw, a cutting test of the gate of the aluminum alloy casting was carried out. As a result, there was no rust generation on the substrate, and even if the substrate rubbed with chips or workpieces, the substrate was not damaged and showed good performance over a long period of time.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be applied to a circular saw or the like used for cutting various materials. Particularly, it is suitable for a circular saw used for cutting a pouring gate or a feeder of an aluminum alloy casting.

  1 circular saw, 2 through-hole, 100 chip, 101 super hard material layer, 102 super hard layer, 103 chip coating, 104 brazing material layer, 110 substrate, 111 substrate coating.

Claims (8)

A substrate,
A chip including a super-hard material fixed to the surface of the substrate by brazing,
A rotary cutting tool, wherein the tip includes a tip coating by nickel plating that contacts the brazing material.   2. The rotary cutting tool according to claim 1, wherein the chip coating has a thickness of 0.5 μm or more and 20 μm or less.   The rotary cutting tool according to claim 1 or 2, wherein the chip coating has a hardness of Hv300 or more and Hv600 or less.   The rotary cutting tool according to any one of claims 1 to 3, wherein the super hard material includes at least one selected from the group consisting of ceramics, cermets, cemented carbide, sintered diamond, and single crystal diamond. .   The rotary cutting tool according to any one of claims 1 to 4, which is used for cutting a pouring gate or a feeder of an aluminum alloy casting.   The rotary cutting tool according to any one of claims 1 to 5, further comprising a substrate coating by electro nickel plating that covers the entire surface of the substrate.   The rotary cutting tool according to claim 1, wherein the chip is fixed to a radial surface of the substrate. A method of manufacturing a rotary cutting tool according to any one of claims 1 to 7,
Forming the chip coating by nickel plating;
A method of manufacturing a rotary cutting tool, comprising: a step of fixing a chip on a surface of the substrate by interposing a brazing material between the chip coating and the substrate by brazing.

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