JP2015118005A - Device and system for detecting radiation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a preferred embodiment of an ISS-type radiation detection device.SOLUTION: A radiation detection device 1 includes a sensor panel 10 having a photoelectric conversion element array 11 comprising photoelectric conversion elements arranged in an array on a first surface thereof, a scintillator layer 13 located on a side of the first surface of the sensor panel 10, a light source unit 2 located on a side of a second surface opposite to the first surface of the sensor panel 10, a first circuit board 30 for driving the photoelectric conversion element array 11, and a second circuit board 31 including a power supply circuit for supplying power to the light source unit 2, the first circuit board 30 and second circuit board 31 being located on the first surface side of the sensor panel 10 with the scintillator layer 13 located between the circuit boards and the sensor panel 10.

Description

  The present invention relates to a radiation detection apparatus.

  In the field of radiography, converting incident radiation into digital data (Flat Panel Detector, hereinafter referred to as FPD) has been put into practical use. The following two methods are known as FPDs. One system is a system (Penetration Side Sampling, hereinafter referred to as PSS) in which the scintillator and the sensor panel on which the photoelectric conversion elements are disposed are arranged in this order from the X-ray incident side. Another method is a method in which a sensor panel and a scintillator are arranged in this order from the X-ray incident side (Irradiation Side Sampling, hereinafter referred to as ISS).

  The PSS type radiation detector (radiation detection apparatus) described in Patent Document 1 has a plurality of photoelectric conversion elements arranged on the front surface of the sensor panel, and a scintillator layer that converts radiation into light on the photoelectric conversion elements. Is formed. In addition, the PSS type radiation detection apparatus described in Patent Document 1 is disclosed on the back surface of the sensor panel regarding a light source that emits light from a radiation non-incident side and a mounting position of a drive circuit that drives the light source. ing. Patent Document 2 discloses an ISS radiation detector (radiation detector) having a flexible wiring board that connects a photoelectric conversion circuit and a control board.

JP 2007-192809 A JP2012-122841A

  However, neither Patent Document 1 nor Patent Document 2 has been sufficiently studied with respect to a mounting form of an ISS radiation detection apparatus having a light generator. When the radiation detection apparatus proposed in Patent Document 1 is applied to the ISS system, the sensor panel and the light source driving circuit and the wiring are arranged on the radiation incident side, so that they are directly exposed to the radiation. There is a problem. On the other hand, since the radiation detector of Patent Document 2 is a radiation detector that does not have a light generator, there is no specific disclosure regarding the arrangement of the light generator, the control circuit of the light generator, and the like. Therefore, depending on the case, there is a possibility that an unnecessary area of the radiation detection apparatus is increased or an image is affected. Therefore, an object of the present invention is to provide a preferable mounting form for an ISS type radiation detection apparatus.

  In order to solve the above problems, a radiation detection apparatus according to the present invention includes a sensor panel having a photoelectric conversion element array in which photoelectric conversion elements are arranged in an array on the first surface, and disposed on the first surface side of the sensor panel. A scintillator layer that converts radiation into light having a wavelength that can be detected by the photoelectric conversion element, and a light source unit that is disposed on the second surface side facing the first surface of the sensor panel and irradiates the sensor panel with light A radiation detection apparatus comprising: a first circuit board for driving the photoelectric conversion element array; and a second circuit board including a power supply circuit for supplying power to the light source unit. The circuit board and the second circuit board are arranged on the first surface side of the sensor panel with the scintillator layer interposed therebetween.

  By the above means, it is possible to provide a preferable mounting form for the radiation detection apparatus in the ISS system.

It is a top view which shows typically the structure of the radiation detection apparatus of Example 1. FIG. It is sectional drawing which shows typically the structure of the radiation detection apparatus of Example 1. FIG. It is a disassembled perspective view which shows the structure of the radiation detection apparatus of Example 1 typically. It is sectional drawing which shows one Example of a structure of a light source part. It is sectional drawing which shows one Example of a structure of a light source part. It is sectional drawing which shows typically the structure of the radiation detection apparatus of Example 2. FIG. It is a schematic diagram which shows the example of application to a radiation detection system.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

Example 1
First, the structure of the radiation detection apparatus according to the first embodiment will be described in detail with reference to FIG. 1 and FIG. FIG. 1 is a plan view schematically showing the structure of the radiation detection apparatus 1 according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a schematic cross-sectional structure taken along line AA of FIG.

  The radiation detection apparatus 1 in FIGS. 1 and 2 is an (Irradiation Side Sampling, ISS) radiation detection apparatus. That is, radiation enters the light receiving surface (first surface), which is the surface on which the photoelectric conversion element array 11 of the sensor panel 10 is arranged, from the facing surface (second surface) side of the sensor panel 10. In the ISS type radiation detection apparatus 1, since the portion near the photoelectric conversion element in the scintillator layer 13 emits light more strongly, the radiation is scattered more than when radiation is incident from the side opposite to the photoelectric conversion element array 11 side of the scintillator layer 13. Light is reduced and resolution can be increased.

  In the following description, in the sensor panel 10, a surface having the photoelectric conversion element array 11 in which photoelectric conversion elements are arranged in an array is referred to as a light receiving surface (first surface), and a surface facing the first surface is a facing surface ( Called the second side).

  The radiation detection apparatus 1 in FIGS. 1 and 2 includes a sensor panel 10, a scintillator layer 13, a light source unit 2, a first circuit board 30, and a second circuit board 31.

  The sensor panel 10 has a photoelectric conversion element array 11 in which photoelectric conversion elements are arranged in an array on the light receiving surface (first surface). Further, it is desirable that a sensor protective layer 12 covering the photoelectric conversion element array 11 is provided on the first surface of the sensor panel 10. For the sensor panel 10, for example, glass, heat-resistant plastic or the like can be suitably used. When a glass substrate is used, the glass substrate may have an effect of absorbing radiation, but a thin glass substrate can be used. After forming the photoelectric conversion element array 11 on the glass substrate, the photoelectric conversion element array part is protected with a protective film, and the glass substrate is chemically polished by dipping in a hydrofluoric acid solution, thereby reducing the thickness of the substrate. It is possible to minimize the amount of radiation absorption. And since the sensor panel 10 becomes thin, the radiation detector 1 itself can be made thin and light. Here, the thickness of the glass substrate is preferably in the range of 30 to 500 μm, particularly preferably in the range of 100 to 300 μm in consideration of workability and handling properties.

As the photoelectric conversion element, for example, a MIS type sensor or a PIN type sensor is used using a semiconductor such as amorphous silicon (a-Si). It further includes a photoelectric conversion element array 11, a switch element (not shown) for processing a signal from the photoelectric conversion element, a wiring (not shown) for driving the switch element, and the like.
For the sensor protective layer 12, for example, a silicone resin, a polyimide resin, a polyamide resin, an epoxy resin, or a resin containing an organic substance such as paraxylylene or acrylic is used. For example, a thermosetting polyimide resin is representative. Is. Further, a resin having heat resistance is preferable so that it does not deteriorate in a process involving a high temperature condition such as vapor deposition of the scintillator layer 13 or an annealing process.

  The scintillator layer 13 that converts radiation into light having a wavelength that can be detected by the photoelectric conversion element is disposed on the first surface side of the sensor panel 10. Examples of the material of the scintillator layer 13 include particle phosphors such as Gd2O2S: Tb and alkali halide scintillators. Among them, scintillators having alkali halide columnar crystal structures such as CsI: Na and CsI: Tl formed by vapor deposition on the sensor panel are particularly suitable.

  Further, it is desirable to provide a scintillator protective layer 14 for covering the scintillator layer 13 to suppress structural breakage due to intrusion of moisture from the outside air or impact. For the scintillator protective layer 14, for example, polyimide, epoxy, polyolefin, polyester, polyurethane, and polyamide hot melt resins can be used, and those having a low moisture permeability are particularly desirable. The thickness of the scintillator protective layer 14 is preferably about 10 to 200 μm. Further, the scintillator protection layer 14 has a surface facing the scintillator 13 made of a highly reflective metal such as, for example, Al, Ag, Cr, Cu, Ni, Ti, Mg, Rh, Pt, or Au, or an alloy thereof. Luminance characteristics can be improved by providing a reflective layer (not shown).

  The light source unit 2 for irradiating the photoelectric conversion element array 11 with light is disposed on the second surface side facing the first surface of the sensor panel 10. The light source unit 2 will be described in detail later.

  The first circuit board 30 is a circuit board for driving the photoelectric conversion element array 11, and the second circuit board 31 includes a power supply circuit for supplying power to the light source unit 2. The first circuit board 30 and the second circuit board 31 are arranged on the first surface side of the sensor panel 10 with the scintillator layer 13 interposed therebetween.

  As described above, by arranging the scintillator layer 13 on the radiation incident side of the first circuit board 30 and the second circuit board 31, the scintillator layer 13 absorbs radiation and converts it into light. Irradiation of radiation to the circuit board 30 and the second circuit board 31 is suppressed. Thereby, it is possible to suppress the malfunction of the circuit due to radiation irradiation and the influence on the image. Moreover, the remarkable increase in the area of the radiation detection apparatus 1 can be suppressed. The first circuit board 30 is electrically connected to the sensor panel 10 via the first flexible wiring board 32.

  The first flexible wiring board 32 is a wiring for supplying a driving signal for driving the photoelectric conversion element. On the first flexible wiring board 32, a drive circuit which is an integrated circuit for driving the photoelectric conversion elements of the photoelectric conversion element array 11 is arranged.

  The second circuit board 31 is electrically connected to the light source unit 2 via the second flexible wiring board 33. The second flexible wiring board 33 is a wiring for supplying power necessary for lighting the light source 2. The second circuit board 31 includes a power supply circuit for generating power necessary for lighting the light source 21. When the second circuit board 31 supplies power to the light source 21, the light source 21 can be turned on.

  As long as the second circuit board 31 has a function of generating and supplying power to turn on at least the light source 21, a function of supplying power to other circuit boards and electrical components in the radiation detection apparatus 1 Other functions necessary for controlling the system in the radiation detection apparatus 1 and communicating with the outside may be provided.

  The first circuit board 30 and the second circuit board 31 are electric circuit boards that hold ICs and resistors (not shown) and transmit signals, and are made of glass epoxy, paper phenol, paper epoxy, or the like. A circuit (pattern) wiring is configured with a conductor such as copper foil on the substrate, and electrical components are mounted.

  Further, the first circuit board 30 and the second circuit board 31 may be configured by a single circuit board in order to reduce the size and weight of the radiation detection apparatus 1. When glass is used for the sensor panel 10 or when the connection portion between the sensor panel 10 and the first flexible wiring board 32 is protected from external pressure or stress due to vibration, the sensor panel 10 is attached to the outer edge of the light source portion 2. It is good to arrange inside the part. With this configuration, contact between the second flexible wiring board 33 and the sensor panel 10 can be prevented, and the reliability of the radiation detection apparatus 1 can be improved.

  It is desirable that the first circuit board 30 is disposed outside the second circuit board 31 with respect to the center on the first surface side of the sensor panel 10. With this arrangement, the second flexible wiring board 33 and the first flexible wiring board 32 can be wired without crossing each other. In addition, the distance between the second flexible wiring board 33, the first circuit board 30, and the first flexible wiring board 32 can be defined by one distance defining member 34.

  The second flexible wiring board 33 is disposed outside the first flexible wiring board 32 with respect to the sensor panel 10. The second flexible wiring board 33 is disposed so as to cover at least a part of the first flexible wiring board 32, and is connected to the second circuit board 31. By arranging the second flexible wiring board 33 in this way, it is possible to prevent an excessive load from being applied when wiring the second flexible board 33. Furthermore, since wiring is performed avoiding the readout circuit board 40 and the readout flexible wiring board 41, which will be described later, the influence of noise from the second flexible wiring board 33 on the image signal of the radiation detection apparatus 1 is reduced. it can. For the first flexible wiring board 32 and the second flexible wiring board 33, for example, a film such as polyimide or polyester is used. And the flexible wiring board (FPC) which formed the wiring pattern of the thin copper foil on the film base material, and was coat | covered with the insulating film for surface protection is used suitably.

  The distance between the second flexible wiring board 33 and the first flexible wiring board 32 is regulated by the gap defining member 34, and the contact with the first flexible wiring board 32 is suppressed even when subjected to vibration or external stress. It is configured.

  The interval defining member 34 has a certain thickness and is made of a rigid material. In this configuration, the distance between the first flexible wiring board 32 and the second flexible wiring board 33 is defined to be a certain level or more. Thereby, the contact between the second flexible wiring board 33 and the first flexible wiring board 32 can be suppressed. Further, the distance defining member 34 regulates the distance between the second flexible wiring board 33 and the first circuit board 30 to a certain level or less, and suppresses the contact between the second flexible wiring board 33 and the first circuit board 30. can do.

  In the example of FIG. 2, the interval defining member 34 is disposed between the second flexible wiring board 33 and the first flexible wiring board 32. However, the spacing defining member 34 is not necessarily disposed between the second flexible wiring board 33 and the first flexible wiring board 32. For example, the outer edge of the second flexible wiring board 33 is fixed by the interval defining member 34, and the position of the second flexible wiring board 33 is fixed, whereby the first flexible wiring board 32 and the first circuit board 30 are fixed. It is also possible to define the interval.

  Furthermore, the connection portion between the first circuit board 30 and the first flexible wiring board 32 can be prevented from being short-circuited due to position fluctuations due to vibration or the like by performing an insulation process that is sealed with an insulating material such as resin. , Can improve the reliability more. Resins used for insulation treatment are, for example, acrylic, epoxy, or silicone sealing resins, rubber adhesives, acrylic adhesives, styrene / conjugated diene block copolymer adhesives, and silicone adhesives. Etc. can be used.

  For example, a metal material such as iron or aluminum can be used for the interval defining member 34, and it can be processed into a desired form by sheet metal, press, bending, or the like from the shape of the plate. The interval defining member 34 is fixed to and supported by the base. Further, the interval defining member 34 fixes and holds the second flexible wiring board 33, thereby preventing the second flexible wiring board 33 from being displaced due to vibration or the like and improving the reliability.

  The radiation detection apparatus 1 further includes a readout circuit board 40, a readout flexible wiring board 41, an inter-board flexible wiring board 42, and a base 15. The readout circuit board 40 is a circuit board for reading out an image signal based on an analog electrical signal output from each photoelectric conversion element on the sensor panel 10 via the readout flexible wiring board 41.

  The readout flexible wiring board 41 electrically connects the sensor panel 10 and the readout circuit board 40. The readout flexible printed wiring board 41 is provided with a readout circuit (not shown) which is an integrated circuit having an amplifier circuit for amplifying an analog electric signal output from each photoelectric conversion element and an A / D converter for analog-digital conversion. Has been.

  The first circuit board 30, the second circuit board 31, and the readout circuit board 40 are connected to each other by an inter-board flexible printed wiring board 42. The inter-board flexible printed wiring board 42 includes a power line for supplying power from the second circuit board 31 to each circuit board, other signal lines necessary for control, and the like.

  The base 15 is disposed between the scintillator layer 13 and the first circuit board 30 and between the scintillator layer 13 and the second circuit board 31, and the first circuit board 30 and the second circuit board 31 are arranged. The circuit board 31 is mechanically supported.

  The base 15 can be made of a metal material such as molybdenum, tungsten, SUS, or aluminum in order to protect the electric circuit board from the transmitted radiation, and can be selected and laminated from these materials. The base 15 can also fix the space defining member 34 in order to support the space defining member 34. Further, the first circuit board 30 and the second circuit board 31 may be supported directly on the base 15 or may be supported with a material such as SUS or aluminum interposed therebetween.

  In addition, when the part which electrically connects the 1st circuit board 30 and the 1st flexible wiring board 32 contacts the base 15, there exists a possibility of short-circuiting with another circuit board via the base 15. FIG. In order to prevent this, it is desirable that the part that electrically connects the first circuit board 30 and the first flexible wiring board 32 is outside the outer edge part of the base 15.

  Next, the light source unit 2 will be described in detail with reference to FIGS. FIG. 3 is an exploded perspective view schematically showing the structures of the radiation detection apparatus 1 and the light source unit 2 according to the first embodiment. 4 is a cross-sectional view schematically showing a cross-sectional structure of the BB plane in the light source unit 2 of FIG. FIG. 5 is a cross-sectional view schematically showing a cross-sectional structure of the CC plane in the light source unit 2 of FIG.

  As the light source unit 2, for example, an LED unit used as a backlight of a liquid crystal display device, an organic EL (electroluminescence), an inorganic dispersion type EL, or the like can be used. The light source unit 2 shown in FIGS. 3 to 5 includes a light source 21, a light guide plate 22, a reflection plate 23, and a first diffusion plate 24.

  The light source 21 is mounted on the second flexible wiring board 33. The second flexible wiring board 33 extends along the side where the light source 21 is mounted. The second flexible wiring board 33 is drawn out from a part of this side.

  In the light source unit 2, for three sides where the light source 21 is not mounted, the spacer 26 is disposed between the reflecting plate 23 and the second diffusion plate 25, and the contacting portion is fixed by an adhesive material 27. For the side on which the light source 21 and the second flexible wiring board 33 are mounted, the second flexible wiring board 33 is disposed between the spacer 26 and the reflecting plate 23, and each contacting portion is an adhesive material 27. It is fixed at.

  Further, a portion where the reflecting plate 23 and the spacer 26 are in contact with each other and a portion where the upper surface of the reflecting plate 23 is in contact with the second diffusion plate 25 are fixed with an adhesive 27. Neither surface of the light guide plate 22 is fixed by the adhesive material 27.

  The light source 21 is a light emission source of the light source unit 2. For example, a plurality of small-sized light sources are arranged side by side. Specifically, it is desirable to arrange the LED light sources in a line shape by an edge light method. The light source 21 can be appropriately selected from a fluorescent lamp, a light bulb, a laser, and the like according to the embodiment.

  The light guide plate 22 is a plate-like optical member having a function of uniformly guiding light emitted from the light source 21 in the direction of the first diffusion plate 24 while spreading the light in the plane. For the light guide plate 22, a resin material having high light propagation efficiency and high transparency is used. For example, an acrylic resin or the like is desirable.

  The reflection plate 23 is arranged to reflect the light propagating through the light guide plate 22 and transmitted to the reflection plate 23 side again to the light guide plate 22 side, and to increase the amount of light incident on the sensor panel 10 side. The material of the reflecting plate 23 is preferably a plate or sheet-like material or metal in which a filler such as titanium oxide and bubbles are embedded in a PET (polyethylene terephthalate) film. Even if the reflecting plate 23 is used, the amount of radiation reaching the first surface of the sensor panel 10 is not reduced.

  The first diffusing plate 24 and the second diffusing plate 25 irradiate the light emitted from the light source 21 and propagated in the light guide plate 22 toward the sensor panel 10 while diffusing the light in the surface direction of each diffusing plate. It has the function to do. A plurality of convex portions are formed on the surface of the second diffusion plate 25. Then, the light passes through the plurality of convex portions and is irradiated onto the sensor panel 10 so that the light is refracted and diffused in various directions. The convex portion formed on the surface of the second diffusion plate 25 has a function of diffusing light, but does not affect the uniformity of the amount of radiation that reaches the first surface of the sensor panel 10. As a material of the first diffusion plate 24 and the second diffusion plate 25, for example, PET or the like is used.

  The spacer 26 is disposed in the peripheral portion of the light source unit 2. By arranging the spacers 26, a space for arranging the light source 21 and the second flexible wiring board 33 in the peripheral portion of the light source unit 2 can be formed. For example, a silicone resin, an acrylic resin, an epoxy resin, or the like is used. Moreover, it is possible to prevent light emitted from the light source 21 from leaking from the periphery of the light source unit 2 by using a material having a high light reflection coefficient.

  As the adhesive material 27, for example, an adhesive sheet, an adhesive film, an adhesive tape or the like made of an acrylic or silicone material is preferably used. The material of the adhesive material 27 is an example, and is selected according to the material of the spacer 26 and the material to be bonded to the spacer 26.

  The sensor panel 10 and the light source unit 2 can be bonded with a resin having a high light transmittance. For example, the reliability of the radioactive detector can be further improved by bonding with a rubber adhesive, an acrylic adhesive, a styrene / conjugated diene block copolymer adhesive, a silicone adhesive, or the like. As an example, the sensor panel 10 and the light source unit 2 are bonded. However, the light source unit 2 may be disposed on the second surface side of the sensor panel 10 and does not necessarily have to be bonded.

  As described above, according to the present embodiment, a preferable mounting form of the radioactive detection device in the ISS system can be obtained. In addition, the radiation detection apparatus 1 can be included in a housing (not shown), and entry of light and moisture from the outside can be suppressed.

(Example 2)
Next, the structure of the radiation detection apparatus 1 in the second embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view showing the structure of the radiation detection apparatus 1 according to the second embodiment of the present invention. In addition, about a common location with Example 1, a common number is provided and description is abbreviate | omitted.

  As shown in FIG. 6, the radiation detection apparatus 1 of the present embodiment further includes a fixing member 35 that fixes the first flexible wiring board 32 and / or the second flexible wiring board 33. The fixing member 35 is disposed between the first flexible wiring board 32 and the second flexible wiring board 33 and the light source unit 2.

  With such a configuration, each flexible wiring board can be fixed at a predetermined position, the distance between them can be kept constant, and contact can be suppressed. Furthermore, the fixing member 35 can be disposed so as to fix either the first flexible wiring board 32 or the second flexible wiring board 33.

  Further, the fixing member 35 is disposed between the end portion of the sensor panel 10 and the first flexible wiring board 32, so that the first flexible wiring board 32 can be held at a predetermined position. . Further, since the fixing member 35 is not brought into contact with any place other than where the first flexible wiring board 32 and the first circuit board 30 are electrically connected, the reliability of the radiation detection apparatus 1 can be further improved. .

  As the fixing member 35, for example, an acrylic or silicone sealing resin, a rubber adhesive, an acrylic adhesive, a styrene / conjugated diene block copolymer adhesive, a silicone adhesive, or the like can be used.

(Example 3)
FIG. 7 is a schematic diagram showing an application example to the radiation detection system 101 which is an embodiment of the radiation detection apparatus of the present invention. The radiation detection apparatus 1 according to any one of the embodiments of the present invention is applied to the radiation imaging system 101 that is an embodiment of the radiation detection apparatus. The radiation imaging apparatus 6040 can include a cover that mainly accommodates and protects the radiation detection apparatus 1 and the radiation detection apparatus 1.

  The radiation detection system 101 includes an X-ray tube 6050 as a radiation source, a radiation detection apparatus 6040, an image processor 6070 as a signal processing unit, and displays 6080 and 6081 as display units. Further, the radiation detection system 101 includes a film processor 6100 and a laser printer 6120 in addition to these.

  Radiation (X-rays) generated by the X-ray tube 6050 serving as a radiation source passes through the imaging region 6062 of the subject 6061 and enters the radiation imaging apparatus 6040. The radiation incident on the radiation imaging apparatus 6040 includes information inside the imaging region 6062 of the subject 6061.

  When radiation enters the radiation imaging apparatus 6040, the scintillator layer 13 emits light according to the incident radiation, and the photoelectric conversion element array 11 photoelectrically converts light emitted from the scintillator layer 13. Thereby, information on the imaging region 6062 of the electrical subject 6061 is obtained. This information is converted into a digital format and output to an image processor 6070 as signal processing means.

  The image processor 6070 as a signal processing unit is a computer including a CPU, a RAM, and a ROM. Further, the image processor 6070 has a recording medium capable of recording various types of information as recording means. For example, the image processor 6070 has a built-in HDD, SSD, recordable optical disk drive, or the like as recording means. Alternatively, the image processor 6070 may be externally connectable to an HDD or SSD as a recording unit, a recordable optical disk drive, or the like.

  Then, an image processor 6070 as a signal processing unit performs predetermined signal processing on the information and displays the information on a display 6080 as a display unit. Thereby, the subject and the examiner can observe the image. Further, the image processor 6070 can record this information on an HDD, SSD, or recordable optical disk drive as a recording means.

  The image processor 6070 may be configured to have an interface capable of transmitting information to the outside as information transmission means. As such an interface as a transmission means, for example, an interface to which a LAN or a telephone line 6090 can be connected is applicable.

  The image processor 6070 can transmit this information to a remote place through an interface as a transmission means. For example, the image processor 6070 transmits this information to a doctor room at a location away from the X-ray room in which the radiation imaging apparatus 6040 is installed. Thereby, a doctor or the like can diagnose the subject in a remote place. The radiation detection system 101 can also record this information on the film 6210 by a film processor 6100 as recording means.

  Although the present invention has been described in detail based on the embodiments, the present invention is not limited to these specific embodiments, and various forms within the scope of the present invention are within the scope of the present invention. included. Furthermore, each embodiment mentioned above is only what shows one embodiment of this invention, and it is also possible to combine each embodiment suitably.

DESCRIPTION OF SYMBOLS 1 Radiation detection apparatus 2 Light source part 10 Sensor panel 11 Photoelectric conversion element array 12 Sensor protective layer 13 Scintillator layer 14 Scintillator protective layer 15 Base 21 Light source 22 Light guide plate 23 Reflector plate 24 1st diffuser plate 25 2nd diffuser plate 26 Spacer 27 Adhesive 30 First circuit board 31 Second circuit board 32 First flexible wiring board 33 Second flexible wiring board 34 Spacing defining member 35 Fixing member 40 Reading circuit board 41 Reading flexible wiring board 42 Between boards Flexible wiring board 101 Radiation detection system

Claims (15)

A sensor panel having a photoelectric conversion element array in which photoelectric conversion elements are arranged in an array on the first surface;
A scintillator layer disposed on the first surface side of the sensor panel for converting radiation into light having a wavelength detectable by the photoelectric conversion element;
A light source unit disposed on the second surface side facing the first surface of the sensor panel and irradiating light to the photoelectric conversion element array;
A first circuit board for driving the photoelectric conversion element array;
A radiation detection device having a second circuit board including a power supply circuit for supplying power to the light source unit,
The radiation detector according to claim 1, wherein the first circuit board and the second circuit board are disposed on the first surface side with the scintillator layer interposed therebetween. A first flexible wiring board that electrically connects the first circuit board and the sensor panel;
A second flexible wiring board for electrically connecting the second circuit board and the light source unit;
The radiation detection apparatus according to claim 1, wherein   The second flexible wiring board is disposed outside the first flexible wiring board with respect to the sensor panel, and is connected to the second circuit so as to cover at least a part of the first flexible wiring board. The radiation detection apparatus according to claim 2, wherein:   The radiation detection apparatus according to claim 2, further comprising an interval defining member that defines an interval between the first flexible wiring board and the second flexible wiring board.   The radiation detection apparatus according to claim 4, wherein the interval defining member defines an interval between the first circuit board and the second flexible wiring board.   6. The radiation detection apparatus according to claim 4, wherein the interval defining member is disposed between the first flexible wiring board and the second flexible wiring board.   The radiation detection apparatus according to claim 4, wherein the interval defining member is disposed between the first circuit board and the second flexible wiring board.   The radiation detection apparatus according to claim 2, wherein a drive circuit for driving the photoelectric conversion element is disposed on the first flexible wiring board.   The radiation detection apparatus according to claim 2, further comprising a fixing member that fixes at least one of the first flexible wiring board and the second flexible wiring board.   The radiation detection apparatus according to claim 9, wherein the fixing member fixes the first flexible wiring board to the first circuit board. A base for supporting the first circuit board and the second circuit board;
The said base is arrange | positioned between the said scintillator layer and the said 1st circuit board, and between the said scintillator layer and the said 2nd circuit board, The Claim 1 thru | or 10 characterized by the above-mentioned. The radiation detection apparatus of any one of Claims.   The radiation detection apparatus according to claim 11, wherein the interval defining member is fixed to the base.   The radiation detection according to claim 11 or 12, wherein a portion where the first circuit board and the first flexible wiring board are electrically connected is outside an outer edge portion of the base. apparatus.   The radiation detection apparatus according to claim 1, wherein the sensor panel is disposed inside an outer edge portion of the light source unit. The radiation detection apparatus according to any one of claims 1 to 14,
Signal processing means for processing signals from the radiation detection device;
A radiation detection system comprising:

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