JP2016058463A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device in which damage due to bending can be prevented regardless of the shape of a metal pattern.SOLUTION: In a light-emitting device including a flexible substrate, where a plurality of metallic wires are provided on an insulating substrate while spaced apart via grooves, the groove has a cross region where a first groove and a second groove cross, the metallic wires have a first metallic wire and a second metallic wire sectioned via the first grooves in the cross region, and a third metallic wire sectioned for the first metallic wire and second metallic wire via the second groove, and a reinforcement member is provided on the extension of the first groove, continuously from above the second groove to above the third metallic wire.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a light emitting device using a flexible substrate.

  In recent years, a light-emitting device using a flexible substrate in which a metal pattern is provided on a substrate such as a resin is known (see Patent Documents 1 and 2).

JP 2005-322937 A JP 2014-17356 A

  However, the flexible substrate may be easily bent and damaged depending on the arrangement and shape of the metal pattern.

  This indication makes it a subject to provide the light-emitting device which can reduce the damage by the bending of a metal pattern.

  The present disclosure is a light-emitting device including a flexible substrate in which a plurality of metal wirings separated via a groove portion are provided on an insulating substrate, and the groove portion is an intersection region where the first groove portion and the second groove portion intersect each other. The metal wiring is partitioned through the first groove and the second metal wiring in the intersecting region through the first groove, and is partitioned through the second groove with respect to the first metal wiring and the second metal wiring. And a reinforcing member that is provided on the extension of the first groove and continuously on the third metal wiring from the second groove.

  In the light emitting device according to the present disclosure, it is possible to reduce damage due to bending of the metal pattern.

It is sectional drawing which shows typically the light-emitting device which concerns on this indication. It is a top view shown typically omitting and showing a part of a flexible substrate used for a light emitting device concerning this indication. It is a top view which expands and typically shows the portion of the light emitting element of the light emitting device concerning this indication. It is a top view which expands and typically shows the part of the reinforcement member of the light-emitting device concerning this indication. It is sectional drawing in the XX of FIG. 4A. It is the schematic diagram which showed the other example of the reinforcement part.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the size, positional relationship, and the like of members shown in each drawing may be partially exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

  FIG. 1 shows a cross-sectional view of the light emitting device 10. FIG. 2 is a top view in which a portion of the flexible substrate used in the light emitting device 10 of FIG. 1 is omitted. In FIG. 1, the positions of the light emitting element 9 and the connector 16 are schematically shown so as to be easily understood. FIG. 3 is an enlarged schematic view of the light emitting element portion. 4A is an enlarged schematic view of the reinforcing portion shown in the A portion in FIG. 2, and FIG. 4B is a cross-sectional view taken along line XX in FIG. 4A.

As shown in FIG. 1, the light emitting device 10 mainly includes a flexible substrate 1 and a light emitting element 9 provided on the flexible substrate 1.
The flexible substrate 1 includes a protective layer 7 on the metal wiring 3. The protective layer 7 is preferably, for example, a white resin layer, and can protect the metal wiring 3 and can reflect light from the light emitting element 9. When the protective layer 7 is provided, a mounting opening 8 through which the metal wiring 3 is exposed is formed at a position where the light emitting element 9 is connected. Further, the flexible substrate 1 is provided with a reinforcing member 4.

  As shown in FIGS. 1 and 2, the flexible substrate 1 includes an insulating substrate 2 and a plurality of metal wirings 3 (3P, 3N) provided on the insulating substrate 2 and adjacent to each other through the groove portion 5; As the main configuration. The flexible substrate 1 includes a plurality of mounting portions 6 of light emitting elements 9 to be described later at predetermined positions of the metal wiring 3 and a connector connecting portion 15 that performs electrical connection with the outside. As shown in FIG. 4A, the flexible substrate 1 includes a first groove portion 51 in which a first metal wire 31, a second metal wire 32, and a third metal wire 33 are groove portions 5 as a plurality of metal wires 3. An example in which the second groove 52 is separated from the second groove 52 will be described.

  The insulating substrate 2 is a substrate composed of a glass epoxy substrate having a thickness of 0.4 mm or less in addition to an insulator such as a resin film (sheet) such as polyimide, PET, PEN, or PES. This insulating substrate 2 is excellent in flexibility, and is formed in flexibility, size and thickness that can be formed by a so-called roll-to-roll manufacturing method.

  The thickness of the insulating substrate 2 is formed in the range of 10 to 400 μm, for example. The width, thickness, and size of the insulating substrate 2 vary depending on the product to be incorporated as a target, and are appropriately set. For example, the insulating substrate 2 is formed of a resin film of several meters, and is cut to have a length and width such as 1 to 20 cm in width and 1 to 100 cm in length at the time of product assembly. The insulating substrate 2 is provided with a metal wiring 3 on one surface via an adhesive 11. The adhesive 11 is not limited as long as it is used when the metal wiring 3 is connected to the insulating substrate 2.

  As shown in FIG. 2, the metal wiring 3 having the positive electrode wiring pattern 3P and the negative electrode wiring pattern 3N is made of a metal foil such as a copper foil, a copper alloy foil, an aluminum foil, or an aluminum alloy foil. The metal wiring 3 is formed to be separated from each other by a groove portion 5 as a wiring pattern for conducting to an electronic element such as a light emitting element 9 described later. The thickness of the metal wiring 3 is formed in the range of 9-200 micrometers, for example. And the mounting part 6 for connecting the light emitting element 9 mentioned later is formed in the predetermined position set beforehand. As shown in FIG. 3, the mounting portion 6 includes a portion in which the groove width of the groove portion 5 is partially narrowed, in other words, a portion in which the metal wiring 3 is extended in a direction facing each other. By extending a part of the metal wiring 3 in this way, it is possible to limit a region where an adhesive such as solder spreads, so that the light emitting element 9 can be mounted at a predetermined position with high accuracy by self-alignment. .

  As shown in FIG. 4A, the metal wiring 3 includes the first metal wiring 31, the first groove 51, which is the groove 5, the second groove 52, and the intersecting region 54 where the first groove intersects the second groove. The second metal wiring 32 and the third metal wiring 33 are formed apart from each other. In the intersecting region 54, for example, the groove 5 that is continuous along the longitudinal direction of the insulating substrate 2 is divided into the second groove 52 and the one that intersects the second groove 52 is divided as the first groove 51 for convenience. The configuration for separating the metal wiring 3 is not changed. Further, the groove 5 is formed with a constant groove width except for the mounting portion 6.

  As shown in FIG. 4A, the reinforcing member 4 is formed at a position on the extension line of the first groove portion 51 so as to continue from the second groove portion to the third metal wiring 33. Further, the reinforcing member 4 is formed so as to continue over the linear first metal wiring 31 and the second metal wiring 32. The reinforcing member 4 has a large formation area so that when a force in the bending direction along the groove portion 5 of the flexible substrate 1 is applied from the outside, the metal wiring 3 is bent so as to resist bending. Will function. In particular, the reinforcing member 4 is preferably wider than the width of the first groove 51. Furthermore, it can be made more difficult to bend by using a reinforcing member that continues onto the first metal wiring and / or the second metal wiring.

  The reinforcing member can be convex as shown in FIG. 4B. The thickness is preferably lower than the sealing member sealing the light emitting element. However, it is not limited to this when the distance from the mounting position of the light emitting element is large. Further, as the top view shape, an arbitrary shape such as a quadrangle or a polygon can be selected in addition to a circle as shown in FIG. 4A.

  The reinforcing member 4 is formed under the condition that the area of the third metal wiring 33 on the extension line of the first groove 51 from the second groove 52 intersecting the first groove 51 is relatively small. In addition, the reinforcing member 4 has a total length of the metal wiring 3 in the entire plate width direction of the flexible substrate 1 on the extension line of the first groove portion 51 that is not more than five times the length of the first groove portion 51. It is formed when That is, it is preferable that the reinforcing member 4 is formed when at least one of the two conditions described above is satisfied.

  In the flexible substrate 1 having the above-described configuration, the reinforcing member 4 is formed in the intersecting region 54 of the first groove portion 51 and the second groove portion 52, so that a force is applied to bend along the first groove portion 51 from the outside. The metal wiring 3 is less likely to be damaged.

  FIG. 5 shows an example in which the formation position of the reinforcing member is different from the position shown in FIG. 4A. In FIG. 5, the reinforcing member 4 is provided so as to continue from the second groove portion 52 to the third metal wiring 33. That is, no reinforcing member is provided on the first metal wiring 31 and the second metal wiring 32. Even if it is such a form, when the width | variety of the 3rd metal wiring 33 is small, the effect which suppresses bending will be acquired.

  As a material of the reinforcing member, it is preferable to use a sealing resin described later or the same resin as the underfill. Specific examples include transparent resins having excellent weather resistance such as epoxy resins, silicone resins, acrylic resins, urea resins, and the like.

  When sealing resin and underfill are formed using a dispenser nozzle, you may provide in the same process. Thereby, a reinforcing member can be formed without increasing the number of steps.

As the light emitting element 9, a semiconductor light emitting element such as an LED can be suitably used. In these, a semiconductor such as ZnS, SiC, GaN, GaP, InN, AlN, ZnSe, GaAsP, GaAlAs, InGaN, GaAlN, AlInGaP, and AlInGaN is formed as a light emitting layer on a substrate by a liquid phase growth method, HDVPE method, or MOCVD method. What was made to use is used suitably. The light emitting element 9 can select various emission wavelengths from ultraviolet light to infrared light by selecting the material of the semiconductor layer and the crystallinity thereof. As a material of the light emitting layer, for example, In _X Al _Y Ga _1- XYN (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1) can be used.

  Moreover, such a light emitting element 9 can also be configured by combining various phosphors that are excited by the light emission and emit light having a wavelength different from the emission wavelength of the light emitting element 9. The phosphor is appropriately adjusted depending on the product in which the light emitting device 10 is incorporated. The phosphor is not particularly limited as long as it is used in the light emitting element 9.

  Further, a connector connection portion 15 is formed at a predetermined position of the metal wiring 3, and a connector 16 is provided in the connector connection portion 15. A protective element and necessary electronic elements are installed in the mounting opening hole 8. When the light emitting element 9 is connected to the metal wiring 3 by two bumps 13, 13, an underfill 12 is provided. The underfill 12 is provided here so as to cover the side wall surface of the light emitting element 9. The underfill 12 is provided in a gap between the light emitting element 9 and the insulating substrate 2. By providing the underfill 12, the bonding reliability between the light emitting element 9 and the flexible substrate 1 is improved. If this underfill 12 is used with respect to the light emitting element 9, it will not specifically limit, such as a raw material, a color, and a viscosity.

  The sealing resin 14 is filled in a state in which the light emitting element 9 is mounted on the mounting portion 6, and protects the light emitting element 9 from external force, moisture, and the like, and protects conductive members such as the bumps 13. The sealing resin 14 has translucency in order to extract light from the light emitting element 9. Examples of the resin material that can be used for the sealing resin 14 include transparent resins having excellent weather resistance such as epoxy resins, silicone resins, acrylic resins, and urea resins. In addition, a filler, a scattering material, and the like can be appropriately dispersed in the sealing resin 14, and a wavelength conversion layer in which a wavelength conversion member such as a phosphor is mixed can be provided in the sealing resin 14. . The sealing resin 14 is not limited as long as it seals and protects the light emitting element 9 and is used for the light emitting element 9 and transmits light.

  Since the light emitting device 10 is configured as described above, for example, when it is incorporated into a product, even if a force is applied in a direction in which the flexible substrate 1 is bent from the outside, an intersecting region of the groove portions 5 that separate the metal wiring 3 Since there is a portion where the reinforcing member 4 is formed in 54, the metal wiring 3 is less likely to be damaged compared to a portion where such a reinforcing member 4 is not formed.

  The above description of the form of the light emitting device 10 exemplifies a configuration for embodying the technical idea of the present invention, and is specified by an example in which the flexible substrate 1 and the light emitting device 10 of the present invention are described. It is not a thing. Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified, and are merely explanations. It is just an example.

  The present invention can be used for various light sources such as illumination light sources, various indicator light sources, in-vehicle light sources, display light sources, liquid crystal backlight light sources, traffic lights, in-vehicle components, and signboard channel letters.

DESCRIPTION OF SYMBOLS 1 Flexible board 2 Insulation board 3 Metal wiring 3P Positive electrode wiring pattern 3N Negative electrode wiring pattern 31 1st metal wiring 32 2nd metal wiring 33 3rd metal wiring 4 Reinforcing member 5 Groove part 51 First groove part 52 Second groove part 54 Intersection area 6 Mounting Part 7 Protective layer 8 Mounting opening 9 Light emitting element 10 Light emitting device 11 Adhesive 12 Underfill 13 Bump 14 Sealing resin 15 Connector connecting part 16 Connector

Claims (3)

A light-emitting device including a flexible substrate provided with a plurality of metal wirings spaced apart through a groove on an insulating substrate,
The groove includes an intersecting region where the first groove and the second groove intersect,
The metal wiring includes a first metal wiring and a second metal wiring that are partitioned through the first groove in the intersecting region, and the first metal wiring and the second metal wiring through the second groove. A third metal wiring partitioned by
A light-emitting device having a reinforcing member that is provided on the extension of the first groove and continuously on the third metal wiring from the second groove.   The light emitting device according to claim 1, wherein the reinforcing member is continuously provided on the first metal wiring.   The light emitting device according to claim 1, wherein the reinforcing member is continuously provided on the second metal wiring.

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