JP2016207999A - Image pickup device storage package and image pickup apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup device housing package which is advantageous in improving the accuracy of alignment between an image pickup device and a member of an optical system.SOLUTION: An image pickup device housing package 1 has a base 2 having a mounting portion of the image pickup device 6 on the upper surface thereof, a frame 3 arranged on the upper surface side of the base 2 so as to surround the mounting portion, a bonding layer 4 for bonding the upper surface of the base 2 and the lower surface of the frame 3 facing the upper surface, and a plurality of lead terminals 5 penetrating the bonding layer 4 from the inside of the frame 3 toward the outside of the base 2. The base 2 has an extending portion 2a extending outwardly of the frame 3 and a hole 11a penetrating in the thickness direction or a recess recessed from the upper surface is formed in the extending portion 2a.SELECTED DRAWING: Figure 1

Description

  The present invention is for housing an image sensor having a lead terminal for housing an image sensor such as a CCD (Charge Coupled Device) and a C-MOS (Complementary Metal Oxide Semiconductor). The present invention relates to a package and an imaging apparatus using the package.

  An image pickup device storage package for storing an image pickup device used in the image pickup apparatus includes a base body having an image pickup element mounting portion on an upper surface, a frame body disposed on the upper surface side of the base body so as to surround the mount portion, A bonding layer for bonding the upper surface of the base and the lower surface of the frame opposite to the upper surface, and a plurality of lead terminals extending through the bonding layer from the inside of the frame to the outside of the base.

  For example, in the image pickup device storage package disclosed in Patent Document 1, a positioning hole is formed in a lead frame for forming a lead terminal, and the lead frame is put between a base and a frame to overlap each other. In some cases, the base and the frame are provided with notches so that the positioning holes are exposed to the outside.

JP 2006-13281 A

  In an imaging device, it is important to align the position of an optical system member such as a lens and an imaging element with high accuracy. In the case of a structure that aligns the image pickup element mounted on the mounting portion and the member of the optical system with reference to the hole formed in the lead frame, as in the image pickup element storage package disclosed in Patent Document 1. As for the surface direction along the image sensor surface, the image sensor and the optical system member can be aligned with high accuracy. However, regarding the optical axis direction perpendicular to the image sensor surface, variations in the thickness of the bonding layer and bonding Because the accuracy of the position of the lead frame with respect to the surface of the image sensor is unlikely to be sufficient due to variations in the position of the lead frame in the optical axis direction in the layer, the image sensor and the optical system member should be aligned with high accuracy. There was a problem that was difficult.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an image pickup device storage package that is advantageous in improving the alignment accuracy between the image pickup device and an optical system member, and the same. An imaging device is provided.

  An image sensor housing package according to an aspect of the present invention includes a base body having an image sensor mounting portion on an upper surface thereof, a frame body disposed on the upper surface side of the base body so as to surround the mounting portion, and an upper surface of the base body. And a plurality of lead terminals extending through the bonding layer from the inner side of the frame toward the outer side of the base body. The base has an extending part extending outward from the frame, and a hole penetrating in the thickness direction or a recess recessed from the upper surface is formed in the extending part. ing.

An image pickup apparatus according to an aspect of the present invention includes the above-described image pickup device storage package, the image pickup device mounted on the mounting portion of the image pickup device storage package, and the image pickup device joined to the upper surface of the frame body. And a lid for sealing the element.

  According to the image pickup device storage package according to one aspect of the present invention, the image pickup device and the optical system member can be aligned via the base on which the image pickup device is mounted. For this reason, not only can the image pickup device and the optical system member be aligned with high accuracy in the surface direction along the image pickup device surface, but also high-precision alignment in the optical axis direction perpendicular to the image pickup device surface. be able to.

  According to the imaging apparatus according to one aspect of the present invention, since the imaging element housing package is provided, an imaging apparatus in which the imaging element and the optical system member are aligned with high accuracy can be realized.

It is a top view which shows an imaging device provided with the image pick-up element accommodation package in the 1st Embodiment of this invention. It is sectional drawing of the imaging device in the AA line shown in FIG. It is sectional drawing of the imaging device with which the member of the optical system was attached. It is a top view which shows an imaging device provided with the image pick-up element accommodation package in the 2nd Embodiment of this invention. It is a top view which shows an imaging device provided with the image pick-up element accommodation package in the 3rd Embodiment of this invention. It is a top view which shows an imaging device provided with the image pick-up element accommodation package in the 4th Embodiment of this invention.

(First embodiment)
With reference to FIG. 1, an image sensor housing package 1 and an imaging device 10 according to a first embodiment of the present invention will be described. FIG. 1 is a top view illustrating an imaging apparatus 10 including an imaging element storage package 1 according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view of the imaging device 10 taken along line AA shown in FIG. In FIG. 1, the imaging device 10 is illustrated by omitting a lid 8 and an adhesive 9 which will be described later.

  The image pickup device storage package 1 includes a base 2 having a mounting portion for a rectangular image pickup device 6 in a plan view at the center of the upper surface, and a frame disposed on the upper surface side of the base 2 so as to surround the mounting portion. 3, a bonding layer 4 that bonds the upper surface of the base 2 and the lower surface of the frame 3 that faces the upper surface, and a plurality of layers that extend through the bonding layer 4 from the inside of the frame 3 toward the outside of the base 2. And lead terminals 5. The base body 2 has an extending portion 2a extending outward from the frame 3, and a positioning hole 11a penetrating the base body 2 in the thickness direction is formed in the extending portion 2a. ing.

  In the example shown in FIGS. 1 and 2, the imaging device 10 includes an imaging element storage package 1, an imaging element 6 mounted on a mounting portion of the imaging element storage package 1, an imaging element 6, and a lead terminal 5. A bonding wire 7 that electrically connects the image sensor 6, a lid body 8 that is bonded to the upper surface of the frame body 3 and seals the imaging element 6 mounted on the mounting portion, and the upper surface of the frame body 3 and the lid body 8. The adhesive 9 which joins a lower surface is included.

The base 2 is made of a material that can accurately form the positioning holes 11a. Further, the base body 2 is made of a material having a small coefficient of thermal expansion because the positional accuracy between the image sensor 6 and the optical system member deteriorates when the base body 2 is deformed by heat generated from the image sensor 6 mounted on the mounting portion. preferable. Furthermore, it is preferable that the base 2 is made of a material having a high thermal conductivity in that the heat generated from the image sensor 6 can be dissipated well.

  The base 2 may be provided with positioning marks (not shown) at the mounting position of the image sensor 6. With such a mark, the image sensor 6 can be positioned more accurately with respect to the positioning hole 11a. When the substrate 2 is formed by metal punching, the positioning mark can be formed by stamping or the like at the same time as the positioning hole 11a is punched. In this way, the possibility that the relative position between the positioning mark and the positioning hole 11a is shifted is reduced.

  For example, when the base 2 is made of a metal material, examples of the material are 42 alloy or stainless steel. For example, when the substrate 2 is made of a ceramic material, examples of the material include aluminum oxide ceramics, mullite ceramics, silicon carbide ceramics, aluminum nitride ceramics, and silicon nitride ceramics. Among these ceramic materials, silicon carbide ceramics, aluminum nitride ceramics or silicon nitride ceramics are preferable in terms of thermal conductivity.

  The base 2 is a plate-like member having a rectangular shape in plan view. The size of the base 2 when viewed in plan is, for example, a short side of about 10 to 40 mm and a long side of about 18 to 75 mm. Moreover, the thickness of the base | substrate 2 is about 0.5-3 mm, for example.

  If the base 2 is made of a metal material, for example, the base 2 is made by subjecting a plate material made of a metal material rolled to a predetermined thickness to a predetermined shape by performing an appropriate punching process or the like. In this case, the positioning hole 11a is formed at a predetermined position in the region to be the extended portion 2a of the base 2 by, for example, drilling.

  If the substrate 2 is made of, for example, silicon nitride ceramics, it is conventionally applied to a slurry obtained by adding and mixing an appropriate organic binder, a plasticizer and a solvent to raw powders such as silicon nitride, aluminum oxide, magnesium oxide and yttrium oxide. A ceramic green sheet (ceramic green sheet) is formed by employing a known doctor blade method or calendar roll method. Next, the ceramic green sheet is subjected to a suitable punching process or the like to obtain a predetermined shape, and a plurality of sheets are laminated as necessary to form a molded body. After that, the substrate 2 is produced by firing this at a temperature of 1600 to 2000 ° C. in a non-oxidizing atmosphere such as a nitrogen atmosphere. In this case, the positioning hole 11a is formed at a predetermined position in a region to be the extended portion 2a of the base 2 by, for example, laser processing.

  The frame 3 is preferably made of a material having the same thermal expansion coefficient as the material constituting the base 2, for example, made of the same material as the base 2. Thereby, generation | occurrence | production of the thermal stress resulting from the difference of the thermal expansion coefficient of the base | substrate 2 and the frame 3 can be suppressed, and it can make it difficult to deform | transform as the image pick-up element storage package 1 whole. Furthermore, it is possible to effectively prevent peeling at the bonding interface between the base body 2 and the frame body 3 and the bonding layer 4, and the imaging element housing package 1 with high airtight reliability can be obtained.

  The frame body 3 is formed with a through-hole having a rectangular opening in plan view having a size larger than that of the mounting portion of the base body 2 in the center in the surface direction of the plate member having a rectangular outer shape in plan view. Consists of. In the example shown in FIGS. 1 and 2, the size of the outer shape when the frame 3 is viewed in plan is the same as the length of the short side of the base 2 and the length of the long side is the base 2. It is shorter than the length of the long side and is about 15 to 55 mm. Moreover, the thickness of the frame 3 is about 0.5-3 mm, for example.

If the frame 3 is made of, for example, a metal material or silicon nitride ceramics, it can be produced by the same method as described above.

  The frame 3 is arranged on the upper side of the base 2 so that the direction in which the long side extends in the outer shape coincides with the direction in which the long side of the base 2 extends and the mounting portion of the base 2 is located in the opening. Then, it is bonded to the substrate 2 by the bonding layer 4.

  Here, since the length of the long side in the outer shape of the frame body 3 is shorter than the length of the long side of the base body 2, the base body 2 and the frame body 3 are joined as described above to be viewed from above. When this occurs, a part of the base 2 extends outward from the frame 3. Thus, a portion of the base 2 that extends outward from the frame 3 corresponds to the extending portion 2a.

  In the example shown in FIG. 1, the extending portions 2 a are present on both sides of the frame 3 with respect to the direction in which the long side of the base 2 extends. Each extension portion 2a is formed with one positioning hole 11a. In addition to the positioning hole 11a, each extending part 2a is formed with a fixing hole 11b used for fixing the member of the optical system to the extending part 2a. In the example shown in FIG. 1, one extending portion 2a is formed with one fixing hole 11b, and the other extending portion 2a is formed with two fixing holes 11b.

  The lead terminal 5 is made of metal such as copper, copper alloy, iron-nickel-cobalt alloy or 42 alloy. The lead terminal 5 has a plurality of lead terminals so that a plate material made of these metals has a frame at the outer peripheral portion by punching using a conventionally known stamping mold and extends inward from the inner periphery of the frame. 5 is formed by cutting a lead frame using a punching die or the like.

  In the example shown in FIG. 1, each of the plurality of lead terminals 5 is a group of lead terminals extending in parallel to the short side of the base body 2 from the inner side of the frame body 3 toward the outer side of the side surface of one long side of the base body 2. 5 and a group of lead terminals 5 extending in parallel to the short side of the base body 2 from the inner side of the frame 3 toward the outer side of the other long side surface of the base body 2.

  The bonding material constituting the bonding layer 4 is, for example, a thermosetting epoxy resin. The bonding material includes, for example, a main agent made of bisphenol A type liquid epoxy resin, bisphenol F type liquid epoxy resin, phenol novolac type liquid resin, etc., a filler made of spherical silicon oxide, or an acid such as tetrahydromethylphthalic anhydride. A paste obtained by adding carbon powder or the like as a curing agent mainly containing an anhydride or the like, and mixing and kneading using a centrifugal stirrer or the like is used.

  The bonding material made of the paste-like thermosetting resin has a predetermined thickness over the entire periphery of the mounting portion on the upper surface of the base 2 and the entire lower surface of the frame 3 by a conventionally known screen printing method, dispensing method, or the like. Applied. These are dried in a tunnel-type atmosphere furnace or oven or the like, so that the bonding material is attached to the base 2 and the frame 3.

  A tunnel-type atmosphere furnace, oven, or the like with a lead frame having a plurality of lead terminals 5 sandwiched between the bonding materials of the base 2 and the frame 3 to which the bonding materials are respectively attached in this manner. And the base material 2, the frame body 3, and the plurality of lead terminals 5 are firmly and airtightly joined by the joining layer 4 by completely curing the joining material by heating at about 150 ° C. for about 90 minutes. Is done. Thereafter, the frame of the lead frame is cut using a punching die or the like, thereby completing the image sensor housing package 1.

In addition, as the bonding material, for example, bisphenol A type epoxy resin, bisphenol A modified epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, special novolac type epoxy resin, phenol derivative An epoxy resin such as an epoxy resin or a bisphenol skeleton type epoxy resin to which a curing agent such as imidazole, amine, phosphorus, hydrazine, imidazole adduct, amine adduct, cationic polymerization or dicyandiamide is added Can be used.

  For example, the bonding layer 4 is formed of a bonding material having a Young's modulus of 0.5 to 2 GPa and a glass transition temperature of 110 ° C. or lower. The Young's modulus and the Young's modulus in the following description are values at room temperature (about 5 to 35 ° C.).

  If the Young's modulus of the bonding layer 4 is 0.5 GPa or more, when the bonding wire 7 is connected to the lead terminal 5 by the ultrasonic bonding method, the bonding layer 4 hardly absorbs ultrasonic waves during wire bonding. Therefore, it becomes easy to improve the wire bonding property with respect to the lead terminal 5. If the Young's modulus is 2 GPa or less, warping of the base 2 due to stress generated due to the difference in thermal expansion coefficients of the base 2 and the frame 3 and the bonding layer 4 is effectively suppressed. The Therefore, for example, the possibility that the accuracy in the height direction of the imaging element 6 is lowered due to the warp of the base 2 is effectively reduced.

  Further, if the glass transition temperature is 110 ° C. or lower (although the substrate 2 is likely to warp due to the stress generated by the difference in thermal expansion coefficient), for example, the bonding layer 4 is made of a thermosetting material (the above heat Even if the bonding layer 4 is cured at a high temperature in order to shorten the time required for curing the bonding layer 4, the stress that reduces the accuracy in the height direction of the imaging element 6 is not enough. It can only be applied below the glass transition temperature of (110 ° C.). Therefore, it is preferable because it is easy to improve and secure the height accuracy of the image sensor 6.

In addition, as a joining material of the joining layer 4 which has such a Young's modulus and glass transition temperature, bifunctional epoxy resin is mentioned, for example among thermosetting epoxy resins. In this case, a main agent made of a bisphenol A type epoxy resin or a bisphenol F type epoxy resin, which is easy to obtain a cured product having high toughness even though the glass transition temperature is low, is used. Also, silicone rubber, silicone resin, LDPE (Low Density Polyethylene), HDPE (High Density Polyethylene), PMMA (Polymethyl Methacrylate), which has a lower Young's modulus than the cured resin ), A filler made of soft fine particles such as cross-linked PMMA, polystyrene, cross-linked polystyrene, ethylene-acrylic copolymer, polyethyl methacrylate, butyl acrylate, or urethane. In these mixtures, an imidazole or amine complex that is a catalyst-type curing agent that is easy to form a cured product having a high toughness even though the glass transition temperature is low, or an amine adduct or polyamide that is not a catalyst-type curing agent but can be cured at a low temperature Etc. are further contained as main curing agents. A paste obtained by kneading using the joining material containing the above materials is used as a joining material (uncured) for the joining layer 4.

  The bonding material forming the bonding layer 4 is, for example, a thermosetting material having a curing temperature of 50 to 100 ° C. If the curing temperature of the bonding material is 50 ° C. or higher, the possibility that the bonding material starts to be cured other than when it is necessary depending on the climate and the indoor environment is reduced. If a bonding material that has been cured when unnecessary is used, the wraparound property of the uncured material (resin) that becomes the bonding material may be likely to be reduced. In addition, when the curing temperature of the bonding material is 100 ° C. or lower, the bonding layer 4 is basically not heated above the curing temperature (100 ° C.) or higher. That is, since the possibility of increasing to the glass transition temperature of the bonding layer 4 is reduced, the stress that lowers the accuracy in the height direction of the imaging element 6 is applied only in the low temperature region, so that the thermal stress is reduced. Therefore, it is preferable because a decrease in height accuracy of the image sensor 6 due to warpage of the base 2 due to thermal stress is effectively suppressed.

  In addition, as a joining material of such a joining layer 4, since it hardens | cures at the low temperature which a solvent does not volatilize easily, so that printability can be ensured even if a solvent is not included, it is a viscosity among thermosetting epoxy resins. A main agent made of a bisphenol F type liquid epoxy resin such as jER806 (trademark, manufactured by Mitsubishi Chemical Corporation) having a low viscosity is used. This includes a filler that lowers the coefficient of thermal expansion, and a bonding material (an uncured mixture) containing an amine adduct such as Amicure PN23 (manufactured by Ajinomoto Co., Inc.) that cures at a temperature of 100 ° C. or less as a main curing agent. Is used. A paste obtained by kneading the bonding material is used as the bonding material for the bonding layer 4.

  The uncured material as described above is heated to be cured to form the bonding layer 4, and the base 2 and the frame 3 are bonded to each other by the bonding layer 4. In addition, a lead frame including lead terminals 5 is disposed in the bonding layer 4 so as to penetrate the bonding layer 4.

  In addition to the resin, low melting point glass can be used as the bonding material. In this case, for example, a zirconium oxide silica-based filler as a filler in a glass component containing 56 to 66% by mass of lead oxide, 4 to 14% by mass of boron oxide, 1 to 6% by mass of silicon oxide, and 1 to 11% by mass of zinc oxide. A glass paste obtained by adding and mixing an appropriate organic solvent and a solvent to a glass composition powder obtained by adding 4 to 15% by mass of a compound can be used.

  The bonding material made of this glass paste is laminated and applied to a predetermined thickness over the entire periphery of the mounting portion on the upper surface of the substrate 2 and the entire lower surface of the frame 3 by a conventionally known screen printing method. By baking this at a temperature of about 430 ° C., the bonding material is attached to the base 2 and the frame 3.

  A tunnel-type atmosphere furnace, oven, or the like with a lead frame having a plurality of lead terminals 5 sandwiched between the bonding materials of the base 2 and the frame 3 to which the bonding materials are respectively attached in this manner. The base material 2, the frame body 3 and the plurality of lead terminals 5 are firmly and airtightly joined to each other by the joining layer 4 by melting and fixing the joining material by heating to about 470 ° C. Thereafter, the frame of the lead frame is cut using a punching die or the like, thereby completing the image sensor housing package 1.

  Further, for example, as in the example shown in FIG. 1, the bonding layer 4 is preferably wider on the base 2 side than on the frame 3 side. In this case, it is possible to provide the image sensor housing package 1 that is effective in improving the positional accuracy of the image sensor 6 in the height direction. This is due to the following reason. When the bonding layer 4 having a thermal expansion coefficient different from that of the base body 2 and the frame body 3 is formed on the upper surface of the base body 2 and the lower surface of the frame body 3, it is at a position on the frame body 3 side away from the base body 2. The thermal stress due to the difference in thermal expansion coefficient increases as the bonding layer 4 increases. Due to the distribution (inclination) of this thermal stress, a moment force acts to warp the base 2. At this time, since the width of the bonding layer 4 on the base 2 side is wider on the base 2 side than on the frame 3 side, the frame 3 can be bonded to the base 2 with sufficient strength. At the same time, since the width of the bonding layer 4 on the frame body 3 side is narrow, the occurrence of warpage of the base 2 can be suppressed to a low level. Therefore, even if the moment force as described above is applied, the warp of the base 2 is suppressed, which is preferable because the accuracy in the height direction of the image sensor 6 is improved.

  Note that the width of the bonding layer 4 on the frame body 3 side is reduced by forming the bonding material to be deposited on the lower surface of the frame 3 smaller than the width of the bonding material deposited on the upper surface of the base 2. As compared with the above, the width on the substrate 2 side can be formed wider.

In the example of this embodiment, the base body 2 is rectangular in plan view, and the bonding layer 4 on each side of the base body 2 has a lead frame in which the lead terminals 5 are formed in the width direction of the bonding layer 4 (each figure). In the xy direction). The lead frame that penetrates the bonding layer 4 in the width direction is a frame portion of the lead frame or the lead terminal 5. These frames and lead terminals 5 penetrate so as to come out from the inner side of the frame 3 to the outer side in plan view.

  This is also preferable because the accuracy in the height direction of the image sensor 6 is improved. That is, the thermal expansion coefficient of the lead terminal 5, which is a metal material, is closer to that of the base body 2 and the frame body 3 than the bonding layer 4, which is an organic resin (adhesive). Therefore, the lead terminal 5 penetrates in the width direction of the bonding layer 4, so that the apparent thermal expansion coefficient of the bonding layer 4 (the bonding layer 4 and a part of the lead frame located inside the bonding layer 4) (FIG. 1). (Not shown) comes closer to the base 2 and the occurrence of warpage of the base 2 can be suppressed to a small level. Therefore, a decrease in position accuracy in the height direction of the image sensor 6 due to the warp of the base 2 is effectively suppressed.

  After cutting the lead frame, a nickel plating layer having a thickness of about 2 μm and a gold plating layer having a thickness of about 0.05 μm are sequentially deposited on the surface of each lead terminal 5. Is preferred. As a result, it is easy to electrically connect the image pickup element 6 and the lead terminal 5 by the bonding wire 7 such as a gold wire or an aluminum wire, and the portion of the lead terminal 5 that is disposed outside the base body 2 is easily connected. When soldered to a wiring conductor of an external electronic circuit board (not shown), the joining becomes easy.

  Further, as the metal constituting the lead terminal 5, it is preferable to use copper having a small electric resistance. However, in this case, it is difficult to ensure airtightness unless a resin is used as a bonding material. Therefore, when low melting glass is used as the bonding material, it is necessary to match the thermal expansion coefficients of the bonding material and the lead terminal 5 by using 42 alloy or the like as the metal constituting the lead terminal 5.

  In recent imaging apparatuses, since a differential line is used for signal transmission, it is easy to match the characteristic impedance to 100Ω by using a bonding material made of resin as a bonding material constituting the bonding layer 4. From such a viewpoint, it is preferable in terms of electrical characteristics to use a bonding material made of resin.

  Further, the bonding material applied to the upper surface of the base 2 and the bonding material applied to the lower surface of the frame 3 may be the same or different. By making the bonding material applied to the upper surface of the base 2 different from the bonding material applied to the lower surface of the frame 3, fine adjustment of the characteristic impedance is facilitated. For example, even if the characteristics of the bonding material adjusted in advance slightly deviate from the target value, the bonding material adjusted in advance is applied to one side of the base 2 and the frame 3 instead of remaking the bonding material. By making and attaching a bonding material having a dielectric constant different from that of the previously adjusted bonding material on the other side, the man-hour for the change can be reduced and the characteristic impedance can be finely adjusted in detail. It becomes like this.

  The image sensor 6 is an image sensor such as a CCD or C-MOS. The imaging element 6 is aligned with respect to the positioning hole 11a formed in the extending portion 2a of the base 2 and adhered to the mounting portion on the upper surface of the base 2 through an adhesive such as silver epoxy resin. Is done. Thereafter, the terminals of the image sensor 6 and the plurality of lead terminals 5 are electrically connected using bonding wires 7 such as gold wires or aluminum wires.

  The lid 8 is made of a light-transmitting material, and examples of the material include glass or quartz. As the lid 8, it is preferable to use one having a thermal expansion coefficient close to that of the base body 2 and the frame body 3, thereby suppressing deformation due to a thermal history during assembly and a temperature change during use.

  As the adhesive 9, for example, an ultraviolet curable epoxy resin is used. Adhesive 9 is applied to the upper surface of the frame body 3 over the entire circumference using a dispensing method, and after placing the lid body 8 on the upper surface of the frame body 3 so as to close the opening of the frame body 3, ultraviolet rays are applied. It is cured by irradiation. Thereby, the imaging device 10 in which the imaging device 6 is hermetically sealed by the imaging device storage package 1 is completed.

  FIG. 3 shows a cross-sectional view of the apparatus with an optical member attached to the imaging apparatus 10 shown in FIGS. 1 and 2. The imaging device 10 illustrated in FIG. 3 further includes a housing 12, a lens 13 that is a member of an optical system, and a fixing screw 14. In FIG. 3, reference numeral 15 denotes a part of the lead frame.

  The housing 12 is a cylindrical member made of a resin material such as an epoxy resin or a metal material such as an iron-nickel alloy, and has a function of supporting the lens 13 as will be described later. A lens barrel is configured by joining an outer peripheral surface of a lens 13 such as a circular convex lens to the inner peripheral surface of the housing 12. The lens barrel is a member for guiding external light to the image pickup device 6 mounted on the mounting portion to form an image.

  The casing 12 has a cylindrical main body portion 12a and an outward flange portion 12b provided perpendicularly to the optical axis of the lens 13 at the lower end of the main body portion 12a. Two protrusions (not shown) that can be fitted into positioning holes 11a formed in the extending portion 2a are provided so as to protrude downward from the lower surface thereof. The two convex portions are provided so as to have a positional relationship corresponding to the positional relationship between the two positioning holes 11 a formed in the extending portion 2 a of the base 2.

  These two convex portions are portions serving as a reference for alignment with the lens 13. By fitting these two convex portions into two positioning holes 11a formed in the extending portion 2a of the base 2, the positioning is performed with reference to the positioning holes 11a and mounted on the mounting portion. The image pickup device 6 and the lens 13 having a fixed positional relationship with respect to the two convex portions can be aligned with respect to the surface direction of the image pickup surface of the image pickup device 6.

  Furthermore, the lower surface of the flange portion 12b and the upper surface of the base body 2 are brought into surface contact with each other by fitting these two convex portions into the two positioning holes 11a formed in the extending portion 2a of the base body 2, respectively. Thereby, it can align with respect to the axial direction of the main-body part 12a. That is, the lens 13 having a fixed positional relationship with the lower surface of the flange portion 12b and the image pickup device 6 mounted on the upper surface of the base 2 are aligned with respect to the optical axis direction perpendicular to the image pickup surface of the image pickup device 6. Can do.

  In addition to the two convex portions, three screw holes 12c are formed in the flange portion 12b, and each screw hole 12c has two convex portions formed on the extending portion 2a of the base body 2. When fitted in the positioning holes 11a, they are arranged so as to be connected to the fixing holes 11b formed in the extending portions 2a. The housing 12 is fixed to the screw hole 12c by fixing a fixing screw 14 inserted from below to a fixing hole 11b formed in the extending portion 2a of the base body 2, thereby extending the base body 2. It is fixed to the protruding portion 2a. As a result, the lens 13 is held in a state of being highly accurately aligned with respect to the imaging device 6 with respect to the surface direction of the imaging surface of the imaging device 6 and the optical axis direction perpendicular to the imaging surface.

According to the image pickup device storage package 1 of the present embodiment, the image pickup device 6 and the optical system member can be aligned via the base 2 on which the image pickup device 6 is mounted. For this reason, not only can the image pickup element 6 and the optical system member be aligned with high accuracy with respect to the surface direction along the image pickup surface of the image pickup element 6, but also with high accuracy with respect to the optical axis direction perpendicular to the image pickup surface. Can be aligned.

  Further, according to the imaging apparatus 10 of the present embodiment, it is possible to realize the imaging apparatus 10 in which the imaging element 6 and the optical system member are aligned with high accuracy.

  In the present embodiment, a through-hole penetrating the base 2 is formed as the positioning hole 11a in the extending portion 2a of the base 2; however, in other embodiments, for example, the base 2 is used as the positioning hole 11a. A notch that opens on the short side may be formed. In still another embodiment, a recess that is recessed from the upper surface of the base 2 may be formed in the extended portion 2a of the base 2 in place of the positioning hole 11a.

  When both the base 2 and the frame 3 are made of a ceramic material, it is preferable to use black ceramics. Moreover, when both the base body 2 and the frame 3 are made of a metal material, it is preferable to reduce the glossiness by roughening the surface by sandblasting or by processing such as blackening. Thereby, in the imaging device 10, it is possible to prevent unnecessary stray light from entering the imaging element 6.

  Further, when the Young's modulus at normal temperature (20 ° C.) exceeds 3 GPa, the bonding material and the adhesive 9 constituting the bonding layer 4 are imaged due to differences in thermal expansion coefficients of the base body 2, the frame body 3, and the lid body 8. The element storage package 1 is likely to be warped, and stress is applied to the image sensor 6 or it is likely to be partially out of focus. Therefore, it is preferable that the bonding material and the adhesive 9 constituting the bonding layer 4 have a Young's modulus at room temperature of 3 GPa or less so that stress due to the difference in thermal expansion coefficient can be relieved.

  Furthermore, if the Young's modulus at 150 ° C. of the bonding material constituting the bonding layer 4 exceeds 100 MPa, cracks are likely to occur in the bonding layer 4 due to heat when the imaging element 6 is mounted on the mounting portion of the base 2. . Therefore, the bonding material constituting the bonding layer 4 preferably has a Young's modulus at 150 ° C. of 100 MPa or less.

(Second Embodiment)
With reference to FIG. 4, an image sensor housing package 1A and an image pickup apparatus 10A according to a second embodiment of the present invention will be described. FIG. 4 is a top view showing an image pickup apparatus 10A including the image pickup element storage package 1A according to the second embodiment of the present invention. In FIG. 4, the imaging device 10 </ b> A is illustrated without the illustration of the lid 8 and the adhesive 9.

  The imaging element storage package 1A according to the present embodiment is different from the imaging element storage package 1 according to the first embodiment described above in that an extension portion 2a has a positioning hole 11a and a frame 3. An opening 16 that penetrates the base body 2 in the thickness direction is formed therebetween.

  This image pickup apparatus 10A includes an image pickup element storage package 1A, an image pickup element 6 mounted on a mounting portion of the image pickup element storage package 1A, and a bonding wire 7 that electrically connects the image pickup element 6 and the lead terminal 5. A lid body 8 that seals the imaging element 6 mounted on the mounting portion and is bonded to the upper surface of the frame body 3, and an adhesive 9 that bonds the upper surface of the frame body 3 and the lower surface of the lid body 8. It is out.

The opening 16 extends from the side surface on the short side of the frame 3 to a position closer to the frame 3 than the positioning hole 11a and the fixing hole 11b in the direction in which the long side of the base 2 extends. It is formed so as to extend parallel to the short side of 2. Thereby, in the extension part 2a, the part extending in parallel with the short side of the base 2 over the long side of the base 2 which is the part in which the positioning hole 11a and the fixing hole 11b are formed is the longitudinal direction. Are connected to a portion of the base 2 that is disposed below the frame body 3.

  In recent years, in an imaging apparatus, the amount of heat generated from the imaging element 6 has increased with an increase in the amount of data transmission. However, according to the imaging element storage package 1A of the present embodiment, the extension 2a Since the opening 16 as described above is formed, heat transmitted to the portion where the positioning hole 11a and the fixing hole 11b are formed can be reduced by the opening 16. Thereby, the deformation of the portion where the positioning hole 11a and the fixing hole 11b are formed due to the heat generated in the imaging element 6 can be suppressed. In the imaging apparatus 10A, the imaging element 6 and the optical system The state where the member is aligned with high accuracy can be maintained.

(Third embodiment)
With reference to FIG. 5, an image sensor housing package 1B and an imaging device 10B according to a third embodiment of the present invention will be described. FIG. 5 is a top view showing an image pickup apparatus 10B including the image pickup element storage package 1B according to the third embodiment of the present invention. In FIG. 5, the imaging device 10 </ b> B is illustrated without the illustration of the lid 8 and the adhesive 9.

  The image pickup device storage package 1B according to the present embodiment differs from the image pickup device storage package 1A according to the second embodiment described above in that some of the plurality of lead terminals 5 are framed from the inside of the frame 3. This is a point that extends through the bonding layer 4 toward the outside of the body 3 and that one end located on the outside of the frame 3 faces the opening 16. In other words, the plurality of lead terminals 5 include one (5a) in which a part in the length direction is located in the opening 16.

  The image pickup apparatus 10B includes an image pickup element storage package 1B, an image pickup element 6 mounted on a mounting portion of the image pickup element storage package 1B, and a bonding wire 7 that electrically connects the image pickup element 6 and the lead terminal 5. A lid body 8 that seals the imaging element 6 mounted on the mounting portion and is bonded to the upper surface of the frame body 3, and an adhesive 9 that bonds the upper surface of the frame body 3 and the lower surface of the lid body 8. It is out.

  The plurality of lead terminals 5 (5a) provided so that one end faces the opening 16 are formed on the base body 2 from the inner side of the frame body 3 toward the outer side of the side surface on one short side of the frame body 3, respectively. A group of lead terminals 5 (5a) provided so as to extend parallel to the long side and have one end facing the opening 16 formed in one extension portion 2a, and the other of the frame body 3 from the inside of the frame body 3 respectively. A group of lead terminals 5 (5a) provided so as to extend in parallel with the long side of the base body 2 toward the outside from the side surface on the short side, and to have one end facing the opening 16 formed in the other extending portion 2a. ).

  According to the image pickup device storage package 1B of the present embodiment, the opening 16 formed in the extending portion 2a is used as an opening for leading out the lead terminal 5 (5a), whereby a rectangular mounting portion is used. A plurality of lead terminals 5 and 5a can be provided corresponding to each of the sides, and the imaging element 6 having a large number of pins can also be handled.

  In addition, since the positioning hole 11a exists outside the lead terminal 5 (5a) in the direction in which the long side of the base body 2 extends, in other words, the positioning hole 11a and the mounting portion Therefore, the positional accuracy when the image pickup device 6 is mounted on the mounting portion can be improved. Furthermore, for example, it is preferable in terms of electrical characteristics as compared with the second embodiment. That is, for the lead terminal 5 (5a) whose part in the length direction is located in the opening portion 16, the extension portion 2a having the opening portion 16 serves as a ground (ground conductor). Since adjustment of the impedance of (5a) becomes easy, it is preferable in terms of electrical characteristics.

(Fourth embodiment)
With reference to FIG. 6, an image sensor housing package 1 </ b> C and an image pickup apparatus 10 </ b> C according to the fourth embodiment of the present invention will be described. FIG. 6 is a top view showing an image pickup apparatus 10C including the image pickup element storage package 1C according to the fourth embodiment of the present invention. In FIG. 6, the illustration of the lid 8 and the adhesive 9 is omitted, and the imaging device 10C is illustrated.

  Also in the image sensor housing package 1 </ b> C according to the present embodiment, the shape of the base 2 is rectangular in plan view. In addition, the image pickup device storage package 1C according to the present embodiment is different from the image pickup device storage package 1B according to the third embodiment described above in that the base 2 is located on each side of the base 2 that is rectangular in plan view. Is the point which has the extension part 2a. Further, all of the plurality of lead terminals 5 are the lead terminals 5 (5 a) whose one end faces the opening 16 on each of the four sides of the base 2.

  That is, the base body 2 is rectangular in plan view and has an extended portion 2a on each side, and the lead terminal 5 has a part in the length direction on each side of the base body 2 in the opening 16. It is provided in the position. In the example shown in FIG. 6, all the lead terminals 5 are the lead terminals 5 (5a) of the said form. Even in such a case, it is possible to provide a plurality of lead terminals 5 (5a) corresponding to each side of the rectangular base body 2, and it is also possible to deal with a multi-pin imaging device 6. . Further, since the extended portion 2a having the opening 16 with respect to the lead terminal 5 (5a) serves as a ground (ground conductor), the impedance of the plurality of lead terminals 5 (5a) (that is, a larger number of lead terminals 5). This is preferable in terms of electrical characteristics.

  Further, in the example shown in FIG. 6, all the lead terminals 5 (5 a) are also protected by the extending portion of the base 2, and therefore, for example, handling such as transport or sealing of the image sensor 6. The possibility that the lead terminal 5 (5a) is bent or damaged by mistake is effectively reduced. Therefore, it is possible to provide an image sensor housing package 1C and an image pickup apparatus 10C that are advantageous in improving reliability and workability when the lead terminals 5 are externally connected.

  When the base body 2 has the extended portions 2a on each side of the base body 2 that is rectangular in plan view, the extended portions 2a on each side are adjacent to each other as in the example shown in FIG. They may be connected to each other. In other words, the extending part 2a may extend over the entire circumference of the base 2 in plan view.

  In the case where the extending portions of each side of the rectangular base body 2 (the individual extending portions of each side are not labeled) are adjacent to each other to form one extending portion 2a. The rigidity as the extension part 2a is increased. Therefore, the deformation of the extending part 2a is effectively suppressed. Thereby, for example, the positional accuracy of the positioning hole 11a in the extending portion 2a is improved, and the positional accuracy of the imaging element 6 mounted on the mounting portion of the base 2 with respect to the housing 12 is improved.

  When the imaging device 10 is mounted on an external electronic circuit board (not shown), the lead terminals 5 (5a) may be electrically connected to the terminals of the electronic circuit board by soldering or the like. At this time, the height of the tip of the lead terminal 5 (5a) may be made substantially the same as the lower surface of the base 2. In this case, it is easy to improve the heat dissipating property of the imaging apparatus 10 by connecting the lower surface of the base 2 to an external electronic circuit board.

  Further, the periphery of the lead terminal 5 (5a) facing the opening 16 and the gap between the base 2 and the external electric circuit board may be filled with a resin material (not shown) whose dielectric constant is adjusted. When such filling is performed, the base 2 around the opening 16 serves as a dam and can be filled with resin at a constant height, so that the impedance of the lead terminal 5 (5a) can be easily adjusted to an appropriate value. You can also Moreover, heat dissipation is also improved.

  The dielectric constant of the resin material can be appropriately adjusted depending on, for example, the type of resin used, the addition of filler particles having a relative dielectric constant different from that of the resin, the porosity of the resin material, and the like. Examples of the resin material include an epoxy resin, a urethane resin, and a silicone resin.

  In order to make the height of the tip of the lead terminal 5 (5a) substantially the same as the lower surface of the base 2, for example, as shown in FIG. 1B, the outer end portion of the lead terminal 5 (5a) May be bent (broken) in a downward direction. The outer end portion of the lead terminal 5 (5a) can be bent into a predetermined shape, for example, by mechanical bending.

  In addition, this invention is not limited to the above embodiment, A various change is possible if it is in the range of the summary of this invention. For example, a reinforcing rib (not shown) may be further added to the extending portion 2a of the base 2 or an additional process such as embossing (not shown) may be performed. In this case, it is possible to increase the rigidity of the base body 2 in the extending portion 2a, and to make a form advantageous for improving the positional accuracy of the positioning hole 11a. If such additional processing is performed on a portion having a relatively large area, such as a corner portion of the extending portion 2 in the form shown in FIG. 6, the effect of improving the rigidity and the workability of the processing are obtained. This is advantageous.

DESCRIPTION OF SYMBOLS 1, 1A, 1B, 1C Image pick-up element storage package 2 Base | substrate 2a Extension part 3 Frame body 4 Bonding layer 5, 5a Lead terminal 6 Image pick-up element 7 Bonding wire 8 Cover body 9 Adhesive 10, 10A, 10B, 10C Image pick-up device 11a Positioning hole 11b Fixing hole 12 Housing 12a Body portion 12b Flange portion 12c Screw hole 13 Lens 14 Fixing screw 15 Part of lead frame 16 Opening portion

Claims (10)

A base body having an image sensor mounting portion on the upper surface;
A frame disposed on the upper surface side of the base so as to surround the mounting portion;
A bonding layer for bonding the upper surface of the base body and the lower surface of the frame opposite to the upper surface;
An image sensor housing package including a plurality of lead terminals extending through the bonding layer from the inside of the frame toward the outside of the base body,
The base has an extending part extending outward from the frame, and a hole penetrating in the thickness direction or a recess recessed from the upper surface is formed in the extending part. A package for storing an image sensor.   The opening portion penetrating in the thickness direction is formed in the extension portion between the hole or the recess formed in the extension portion and the frame body. The package for image pick-up element accommodation as described in 2.   At least some of the plurality of lead terminals extend from the inside of the frame body to the outside of the frame body through the bonding layer, and are provided so that one end located on the outside of the frame body faces the opening. The image pickup device storage package according to claim 2, wherein the image pickup device storage package is provided.   The image sensor housing package according to claim 1, wherein the bonding layer has a width on the base side larger than a width on the frame side.   The substrate is rectangular in plan view, and the bonding layer corresponding to each side of the substrate has a lead frame having a plurality of the lead terminals penetrating in the width direction of the bonding layer at the lead terminal portion. The image pickup device storage package according to claim 1, wherein the image pickup device storage package is provided. The base body is rectangular in a plan view, and the base body has the extension part and the opening part on each side;
4. The image sensor housing package according to claim 3, wherein the lead terminal is provided so that the one end faces the opening on each side of the base.   The imaging according to claim 1, wherein the bonding layer is formed of a bonding material having a Young's modulus of 0.5 to 2 GPa and a glass transition temperature of 110 ° C. or less. Package for element storage.   The image sensor housing package according to claim 1, wherein the bonding layer is formed of a bonding material that is a thermosetting material having a curing temperature of 50 to 100 ° C. 7. The image sensor housing package according to any one of claims 1 to 8,
An image sensor mounted on the mounting portion of the image sensor storage package;
An image pickup apparatus comprising: a lid member that is bonded to an upper surface of the frame body and seals the image pickup element. A lens disposed above the lid;
The imaging apparatus according to claim 9, further comprising a housing that is fixed to the extension portion and supports the lens.

Images