JP2017224798A - Wound film capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To invent a capacitor of high heat resistance capable of instantaneously releasing/storing a large amount of energy, while ensuring a large area per unit volume, and capable of exhibiting the performance without relying upon the temperature of the peripheral environment.SOLUTION: In a wound film capacitor including a wound body of such a form that first and second conductive layers and first and second insulator films are wound in roll state while superposed in the order of the first conductive layer, the first insulator film, the second conductive layer, and the second insulator film, at least the first insulator film is a glass film, and at least the first conductive layer is a metal film having heat resistance of 50°C or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wound film capacitor having high heat resistance.

  For example, in an electric vehicle (EV) or a hybrid electric vehicle (HEV), an inverter is used to drive the AC motor by converting the DC power of the battery into AC power. A DC power supply circuit (converter, battery, etc.) connected to the inverter switching circuit is generally called a DC link, and the DC power supply voltage is called a DC link voltage. A large-capacitance capacitor called a DC link capacitor is connected to the DC link of the inverter in parallel with the DC power supply to compensate for instantaneous load fluctuations caused by the switching circuit (see, for example, Patent Document 1).

Capacitors used for this purpose are required to have the following characteristics.
(1) The ability to instantaneously release / store a large amount of energy to compensate for instantaneous load fluctuations,
(2) In order to prevent the circuit from operating properly due to temperature changes, the temperature dependence of the dielectric constant is small,
(3) It operates normally even in a high temperature environment.

JP-T-2004-52496 Gazette

At present, ceramic capacitors using BaTiO ₃ are mainly used as capacitors for this purpose. However, this ceramic capacitor has a problem that dielectric breakdown occurs when a high voltage is applied. The reason is that when the convex portions of the crystal grains present in the ceramic capacitor are in contact with the electrode and a high voltage is applied to the contact portion, electric field concentration occurs and a short circuit is likely to occur.

Further, it is known that a ceramic capacitor using BaTiO ₃ has a large temperature dependence of dielectric constant, and the dielectric constant is likely to change due to temperature change. Therefore, in order to reduce the temperature dependence of the dielectric constant, it has been considered to be doped with Mg or Mn or the like during BaTiO _3. However, when doped with Mg and Mn, etc., a charge relatively -2 crystal lattice of BaTiO ₃ is induced, whereby there is a case where an oxygen defect is generated in BaTiO _3. This oxygen defect may cause a decrease in dielectric constant under a DC voltage. Therefore, in a ceramic capacitor using BaTiO ₃ , it is difficult to reduce the temperature dependence of the dielectric constant while increasing the dielectric constant.

  In order to store a large amount of energy in the capacitor, it is necessary to secure a large area per unit volume. For example, a large area can be secured by adopting a structure in which plate-shaped ceramic materials are laminated. However, this method increases the number of parts and complicates the process, resulting in an increase in cost.

  Various metals are used for the conductive layer used in the capacitor. As a metal used for the conductive layer, a film or film of a single metal such as copper or zinc is generally used because it is inexpensive. However, since these have low heat resistance, they are easily oxidized and deteriorated in a high temperature environment, and the resistance value becomes high. Therefore, it becomes difficult for the conductive layer to conduct electricity in a high temperature environment, and the performance of the capacitor decreases. To prevent this, a cooling device was installed adjacent to the capacitor to prevent the temperature of the capacitor from rising. However, the required installation space increases by the amount of the cooling device, so the overall size of the device can be reduced. It becomes difficult.

  The present invention has been made in view of the above circumstances, and a technical problem thereof is that a large amount of energy can be instantaneously released / accumulated, a large area per unit volume is ensured, and even in a high temperature environment. The technical challenge is to create a capacitor with high heat resistance that can demonstrate its performance.

  As a result of diligent efforts, the present inventors are able to solve the above technical problem by using a metal film having a heat resistance of 50 ° C. or higher as the conductive layer of the wound film capacitor according to the present invention. It is a headline and is proposed as the present invention. That is, in the wound film capacitor of the present invention, the first and second conductive layers, the first and second insulating films, the first conductive layer, the first insulating film, and the second A conductive film and a wound film capacitor comprising a wound body wound in a roll shape in the state of overlapping the second insulating film in order, wherein the first insulating film is in the thickness direction. The second insulating film has a third surface and a fourth surface directed in opposite directions in the thickness direction. The first surface and the third surface, the second surface and the fourth surface are oriented in the same direction, and at least the first insulating film is a glass film, and At least the first conductive layer is 50 ° C. or higher Characterized in that it is a metal film having a heat resistance.

  Thus, in the present invention, the first and second insulating films and the first and second conductive layers are alternately wound in a roll shape with the first and second conductive layers overlapping each other. In addition, at least the first insulating film was a glass film. Since glass is unlikely to generate oxygen vacancies, the temperature dependence of the dielectric constant can be reduced without reducing the dielectric constant. Therefore, by configuring the capacitor with a wound body in the form of a roll of a film made of glass and a conductive layer, while increasing the capacitance per unit volume of the capacitor, due to temperature changes, The situation where the circuit does not operate properly can be effectively prevented. Therefore, a capacitor capable of storing a large amount of energy and excellent in high temperature environmental characteristics can be manufactured in a relatively small size.

  The wound film capacitor according to the present invention uses a metal film having heat resistance of 50 ° C. or higher as the conductive layer. In this way, the metal film is unlikely to be oxidized or denatured even in a high temperature environment, so that the performance of the capacitor can be exhibited without depending on the temperature of the surrounding environment. Further, it is not necessary to install a cooling device or the like, and the capacitor device as a whole can be downsized. For example, “the metal film has a heat resistance of 50 ° C.” means that the insulating film on which the metal film is formed is heat-treated in the atmosphere at 50 ° C. for 1 hour, and the resistance value of the metal film after the heat treatment is the metal before the heat treatment. It means not to exceed twice the resistance value of the film. Note that a digital multimeter (M-04 manufactured by Custom Corp.) was used for the measurement.

  Secondly, in the wound film capacitor according to the present invention, the second insulating film may be a glass film.

  Thus, by using the glass film as the second insulating film, the capacitor can be a completely inorganic film capacitor that does not contain an organic substance, so that the heat resistance of the capacitor can be improved. Therefore, the function as a capacitor can be appropriately exhibited without being affected by the ambient temperature and other environments.

  Third, in the wound film capacitor according to the present invention, the first and second conductive layers are both metal films having heat resistance of 50 ° C. or more, and the first surface of the first insulating film May be formed on the second surface.

By integrating the conductive layer with the insulating film in this way, the adhesion between the insulating film and each conductive layer is increased, so that the distance between the conductive layers serving as positive and negative electrodes can be reduced, and the capacitance is further improved. Can be achieved. In addition, when the conductive layer is a film, the thickness dimension can be set without considering the handleability of the conductive layer alone, so the metal film thickness can be made smaller and further miniaturization can be achieved. It becomes possible to plan. Furthermore, since the metal film is not easily oxidized or deteriorated even in a high temperature environment, the performance of the capacitor can be exhibited without depending on the temperature of the surrounding environment.

  Fourth, in the wound film capacitor according to the present invention, the first and second conductive layers are both metal films having a heat resistance of 50 ° C. or more, and the first surface of the first insulating film And a film formed on each of the third surfaces of the second insulating film.

  Also by integrating the conductive layer and the insulating film with this configuration, the adhesion between the insulating film and the conductive layer can be increased and the distance between the conductive layers can be reduced, thereby further improving the capacitance. It becomes possible. In addition, since one conductive layer (metal film) may be formed per one insulating film, depending on conditions, the thickness dimension of the insulating film is smaller than when two conductive layers are provided on one insulating film. it can. This can be expected to further improve the capacitance. Furthermore, since the metal film is not easily oxidized or deteriorated even in a high temperature environment, the performance of the capacitor can be exhibited without depending on the temperature of the surrounding environment.

  Fifth, the wound film capacitor according to the present invention includes a first side end face in which the first conductive layer is oriented in one width direction of the wound body, and a second side end face in which the other width direction is oriented. And the second conductive layer has a third side end face that faces one side in the width direction of the wound body, and a fourth side end face that faces the other side in the width direction. The second side end face is offset to one side in the width direction of the wound body from the fourth side end face of the second conductive layer, and the third side end face of the second conductive layer is It may be offset from the first side end face of the conductive layer to the other side in the width direction of the wound body.

  By comprising in this way, when the electrode (a positive electrode, a negative electrode) is provided in the width direction both sides of a wound body, the conductive layer of the side which should be connected can be identified easily. Further, it is possible to reliably avoid contact with the conductive layer on the side that should not be connected, and to easily and safely perform electrical connection between each electrode and the conductive layer on the side that should be connected to each electrode.

  Sixth, the wound film capacitor according to the present invention is provided with a first electrode in contact with the first conductive layer and separated from the second conductive layer on one side in the width direction of the wound body. In addition, a second electrode that is in contact with the second conductive layer and separated from the first conductive layer may be provided on the other side in the width direction of the wound body.

  By arranging the electrodes in this manner, the corresponding conductive layers and the electrodes can be electrically connected with a simple structure. In particular, as described above, each conductive layer is arranged in an offset (shifted) direction different from each other in the width direction of the wound body, so that the gap between the electrode and the conductive layer on the non-connecting side that does not correspond to this electrode. In a state having a predetermined gap in the width direction. Therefore, it is possible to easily form a state in which only the conductive layer on the side to be connected is in contact with, without particularly making the electrode in a complicated shape (such as a partially protruding shape). In addition, since the action as an inductor is suppressed in this way, resistance at high frequencies can be easily suppressed.

  Seventh, in the wound film capacitor according to the present invention, the first and / or second electrodes preferably have a heat resistance of 50 ° C. or higher. For example, “the electrode has a heat resistance of 50 ° C.” means that there is no breakage such as cracking when the electrode is heat-treated in the atmosphere at 50 ° C. for 1 hour and then visually confirmed.

  Eighthly, it is preferable that the first and / or second electrode is made of an inorganic material in which metal powder is dispersed.

  Various materials can be used for the electrode. Among them, from the viewpoint of cost and conductivity, one or two or more selected from the group consisting of Al, Pt, Ni, Cu, Ag, and an Ag alloy are used. Metal can be preferably used. The electrode can be formed, for example, by applying a conductive paste in which the above metal powder is dispersed (a paste-like conductive material having a predetermined viscosity) and then solidifying it. In the present invention, an electrode may be formed from an inorganic material in which metal powder is dispersed by using an inorganic conductive paste or the like among conductive pastes.

  Ninthly, in the wound film capacitor according to the present invention, the thickness of the first insulating film may be 50 μm or less.

  By setting the thickness dimension of the insulating film in this way, the area of the insulating film per unit volume is increased, so that the capacitance of the capacitor can be increased. In addition, since the flexibility of the insulating film is improved, the minimum winding diameter of the wound body (see below for details) can be reduced. Therefore, this also makes it possible to increase the area of the insulating film per unit volume and improve the capacitance. In other words, it is possible to reduce the size of the capacitor while ensuring a predetermined capacitance.

  Tenth, the wound film capacitor according to the present invention may have a minimum winding diameter of 100 mm or less. The minimum winding diameter of the wound body here is substantially equal to the inner diameter dimension of the wound body, and among the first and second insulating films that are wound in a roll shape. It means the radius of curvature of the insulating film located at the innermost radial direction.

  As described above, the capacitor can be effectively downsized by winding the insulating film so that the minimum winding diameter of the wound body is a certain value or less.

  Eleventh, the wound film capacitor according to the present invention may be one in which the dimension in the longitudinal direction of the first insulating film is 0.05 m or more.

  Thus, by defining the lengthwise dimension of the insulating film, the area (surface area) of the conductive layer that is usually set to the same size as the insulating film or slightly smaller (size in the lengthwise direction). Can be secured. Therefore, it is possible to provide the capacitor with a capacitance corresponding to the area of the conductive layer.

  12thly, the value which remove | divided the width direction dimension of the 1st insulating film by the thickness dimension of the 1st insulating film may be 1000 or more.

  For the same reason as described above, the capacitance of the capacitor increases as the area (surface area) of the insulating film increases and the thickness dimension decreases. Therefore, by setting the ratio of the dimension in the width direction to the thickness dimension of the insulating film to be 1000 or more, it is possible to ensure the level of capacitance required for this type of capacitor.

  Thirteenthly, in the wound film capacitor according to the present invention, the glass film as the insulating film may have a relative dielectric constant of 5.0 or more. The relative dielectric constant here refers to a value measured by a method based on ASTM D150 at a temperature of 25 ° C.

  Fourth, the wound film capacitor according to the present invention includes an arithmetic average roughness Ra of a first surface oriented in one thickness direction of the first insulating film or a second surface oriented in the other thickness direction. May be 5 nm or less. In addition, arithmetic mean roughness Ra here refers to the value measured by the method based on JISB0601: 2001.

  By defining the arithmetic average roughness Ra of the surface of the insulating film in this way, the voltage causing dielectric breakdown increases, so that a large amount of energy can be stored accordingly.

Fifteenth, in the wound film capacitor according to the present invention, the glass film as the first insulating film is in mass%, SiO ₂ : 20 to 70%, Al ₂ O ₃ : 0 to 20%, B _The glass composition may contain ₂ O ₃ : 0 to 17%, MgO 0 to 10%, CaO 0 to 15%, SrO 0 to 15%, BaO 0 to 40%.

  By setting the glass composition in this manner, devitrification is less likely to occur at the time of molding, so that the insulating film (glass film) having a large width direction dimension and a long direction dimension can be easily formed. Therefore, as a result, a capacitor capable of storing a large amount of energy can be efficiently manufactured.

  Sixteenth, in the wound film capacitor according to the present invention, the surfaces of the glass films are directly connected to each other at the end in the longitudinal direction on the winding end and / or winding start side of the glass film as the first insulating film. It may be in close contact.

  In this way, the glass film surfaces were brought into close contact with each other without using an adhesive or the like at the end in the longitudinal direction on the winding end side and / or the winding start side of the glass film constituting the wound body. By taking the form, the glass film as the insulating film can be fixed at the end portion on the winding end side. Therefore, the shape of the wound body obtained by winding the two insulating films including the glass film into a roll can be appropriately maintained. Moreover, since it is not necessary to interpose the element for fixing the surfaces of a glass film, a winding body can be comprised simply and can be reduced in size. In addition, as the surfaces of the glass films to be adhered, two surfaces included in one glass film may be used, or one surface of two different glass films may be used.

  17thly, in this invention, the through-hole which penetrates the said wound body in the width direction may be provided in the center of the wound body which comprises a capacitor | condenser.

  With this configuration, a hollow space exists in the center of the capacitor over the entire width direction. By providing a through hole in the center of the wound body, air as an insulator exists inside the wound body, so that an increase in inductance is suppressed and an increase in impedance in the high frequency range is possible. Can be avoided. Of course, if the center of the wound body is a hollow space, the weight of the capacitor can be reduced by that amount, which is suitable for general use of the capacitor.

  As described above, according to the present invention, it is possible to instantaneously release / accumulate a large amount of energy, to secure a large area per unit volume, and to provide a capacitor with high heat resistance. It becomes possible.

It is a conceptual sectional view showing an example of the section structure of the winding type film capacitor of the present invention in the width direction. It is a perspective view which shows an example of the winding type film capacitor of this invention. It is a perspective view which shows the state which expanded a part of other winding body which concerns on this invention virtually. It is a cross-sectional conceptual diagram of the width direction which shows the state by which the silver alloy film was formed with respect to the 1st surface and 2nd surface of the 1st glass film which concerns on [Example 1]. It is a figure showing the impedance characteristic of the winding type film capacitor which concerns on [Example 1].

  Hereinafter, each member constituting the wound capacitor of the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a conceptual cross-sectional view showing an example of a cross-sectional structure in the width direction of the wound film capacitor of the present invention. In the present embodiment, the first and second conductive layers are both metal films. As can be seen from FIG. 1, the wound film capacitor 1 is laminated in the order of a first metal film 10, a first insulating film (glass film) 11, a second metal film 12, and a second insulating film 13. The laminated structure is repeated according to the number of windings. On the first surface 11 a of the first insulating film (glass film) 11, the first metal film 10 is formed, and the first edge portion on which the first metal film 10 is formed 11c and the 1st edge part 11c have the 2nd edge part 11d in which the 1st metal film 10 used as the other side is not formed into a film. As a result, the first metal film 10 is offset to the first edge portion 11 c side of the first insulating film (glass film) 11. In addition, a second metal film 12 is formed on the second surface 11b of the first insulating film (glass film) 11, and a third end where the second metal film 12 is formed. It has the 4th edge part 11f in which the 2nd metal film 12 used as the opposite side to the edge part 11e and the 3rd edge part 11e is not formed into a film. Thereby, the 2nd metal film 12 is offset by the 3rd edge part 11e side. The second insulating film 13 is disposed between the first metal film 10 and the second metal film 12 so that the first metal film 10 and the second metal film 12 do not contact each other. A first electrode 14 that is in contact with the first metal film 10 and not in contact with the second metal film 12 is formed on the first end face 11g of the first insulating film (glass film) 11, and A second electrode 15 that is in contact with the second metal film 12 and is not in contact with the first metal film 10 is formed on the second end surface 11 h of one insulating film (glass film) 11. One side surface of the wound body is covered by the first electrode 14 and the entire end portion of the first metal film 10 is electrically connected, and the other end of the wound body is covered by the second electrode 15. Are covered so that the entire end of the second metal film 12 is electrically connected.

  FIG. 2 is a perspective view showing an example of the wound film capacitor of the present invention. The wound film capacitor 1 according to this embodiment includes a wound body 16 and positive and negative electrodes 14 and 15 that are in contact with the wound body 16 in the width direction. A lead wire (not shown) is attached to each of the electrodes 14 and 15 so that a predetermined voltage can be applied between the electrodes 14 and 15. In this form, the wound body 16 is wound around the core 17 in a roll shape.

  In the wound film capacitor of the present invention, the thickness of the first glass film is 50 μm or less, 40 μm or less, 30 μm or less, 20 μm or less, 10 μm or less, 8 μm or less, 6 μm or less, 5 μm or less, 3 μm or less, particularly 1 μm. The following is preferred. The smaller the thickness of the first glass film, the larger the area per unit volume, so that a large amount of energy can be easily stored. Moreover, since the flexibility of a 1st glass film improves, the minimum curvature radius of a 1st glass film can be made small. As a result, it is easy to reduce the size of the capacitor. Furthermore, it becomes easy to reduce the weight of the device.

  In the wound film capacitor of the present invention, resin, paper or the like is used as the second film, but it is preferable to use a glass film. By using a glass film as the second film, it becomes possible to produce an all-inorganic film capacitor that does not contain organic substances with respect to the essential members, and the heat resistance of the capacitor can be increased. As a result, the function as a capacitor can be appropriately exhibited regardless of the ambient temperature and environment. The thickness of the second glass film is 50 μm or less, preferably 40 μm or less, 30 μm or less, 20 μm or less, 10 μm or less, 8 μm or less, 6 μm or less, 5 μm or less, 3 μm or less, particularly 1 μm or less. Moreover, it is preferable that the width dimension of a 2nd film is smaller than the width dimension of a 1st glass film. If it does in this way, it will become easy to form an electrode on both sides of a winding object.

  In the wound film capacitor of the present invention, the first metal film is formed on the first surface of the first glass film, and the second metal film is formed on the second surface of the first glass film. A film is preferably formed. These metal films act as electrodes. If it does in this way, the adhesiveness of a metal film and a 1st glass film becomes high, and it can avoid the situation where an air layer is made between a metal film and a 1st glass film, and an electrostatic capacitance falls.

  In the wound film capacitor of the present invention, a metal film having a heat resistance of 50 ° C. or higher is used as the conductive layer. In this way, the metal film is unlikely to be oxidized or altered even when the ambient temperature is high, and the performance of the capacitor can be exhibited even in a high temperature environment. Further, it is not necessary to install a cooling device or the like, and the capacitor device as a whole can be downsized. If the metal film is oxidized or the metal film is altered, that is, the surface of the metal film is deformed in a high temperature environment, or the surface roughness is increased, the performance of the capacitor may be reduced, or the cause of dielectric breakdown may be There is a risk of becoming. Therefore, the higher the heat resistance of the metal film, the more advantageous, and more preferably 80 ° C or higher, 100 ° C or higher, 150 ° C or higher, 200 ° C or higher, 300 ° C or higher, 400 ° C or higher, 500 ° C or higher.

  Examples of the metal film having high heat resistance include a silver alloy, an aluminum-neodymium alloy, an aluminum-tantalum alloy, and a molybdenum-niobium alloy. These are not easily oxidized or denatured even in a high temperature environment, and show a low resistance value even in a high temperature environment.

  In the wound film capacitor of the present invention, the first glass film has a first end face and a second end face facing in the width direction, and the first metal film is formed offset to the first end face side. It is preferable that the second metal film is formed offset to the second end face side. And the area | region in which the metal film is not formed in the 1st surface of the 1st glass film and the 2nd surface is the area | region from 1 mm to an end surface, 3 mm from an end surface, 5 mm from an end surface, and 7 mm from an end surface A region is more preferred. If it does in this way, when an electrode is formed in the both sides | surfaces of a wound body, the situation where a 1st metal film and a 2nd metal film are electrically connected can be avoided effectively. In addition, you may form the insulating film of the film thickness equivalent to a conductive layer in the area | region in which the conductive layer is not formed in the 1st surface and 2nd surface of a 1st glass film.

  In the wound film capacitor of the present invention, the end portions of the adjacent first metal films in the wound body are electrically connected, and the end portions of the adjacent second metal films are also electrically connected. A first electrode that is in contact with the first metal film and is not in contact with the second metal film is formed on one side of the wound body, and is in contact with the second metal film on the other side of the wound body. It is preferable that a second electrode not in contact with the first metal film is formed. In this way, since the action as an inductor is suppressed, resistance at high frequencies can be easily suppressed. The electrode can be formed, for example, by applying a conductive paste in which metal powder is dispersed to the end surface of the first glass film.

  The electrode preferably has a heat resistance of 50 ° C. or higher. If the heat resistance is high, the performance of the capacitor can be exhibited even in a high temperature environment. Further, it is not necessary to install a cooling device or the like, and the capacitor device as a whole can be downsized. The heat resistance of the electrode is more preferably 100 ° C or higher, 120 ° C or higher, 130 ° C or higher, 140 ° C or higher, 150 ° C or higher, 160 ° C or higher, 170 ° C or higher, 180 ° C or higher, 190 ° C or higher, 200 ° C or higher, 220 ° C. Above, it is 240 degreeC or more, 250 degreeC or more, 270 degreeC or more, 300 degreeC or more, 500 degreeC or more. Some commonly used organic conductive pastes form an electrode by curing a resin, for example, by mixing two liquids. In that case, the formed electrode contains an organic component. Will be. In a high temperature environment, organic components are volatilized from the electrode and volume shrinkage occurs, so that a large crack that can be visually confirmed is generated on the electrode, which may result in damage to the capacitor.

  Of the electrode forming materials, a thermosetting resin or a thermoplastic resin may be used as long as it does not interfere with the assumed ambient temperature as an organic material. For example, melamine resin, epoxy resin, silicone resin, polypropylene resin, acrylic resin, urethane resin, vinyl resin, styrene resin, various elastomers, engineering plastics, super engineering plastics, and the like can also be used. From the viewpoint of heat resistance, engineering plastics and super engineering plastics are preferred, and polyacetal resin, polycarbonate resin, polyamide resin, polyphenylene ether resin, polybutylene terephthalate resin, polyethylene terephthalate resin, polyethylene resin, syndiotactic polystyrene resin, amorphous polyarylate resin Polysulfone resin, fluororesin, liquid crystal polymer resin, polyimide resin, polyamideimide resin, polyetherimide resin, polyphenylene sulfide resin, polyethersulfone resin, polyetheretherketone resin, and the like can be used. In the present invention, these resins can be appropriately selected according to the heat resistance required for the electrodes, and the electrodes can be formed by any method according to the characteristics of the resin. For example, in the case of using a thermoplastic resin, the electrode can be formed by cooling and fixing the softened resin to the contacted surface and forming it as necessary. Of course, the above-mentioned various resins can be used as an electrode forming material after being made into a paste.

  In particular, in order to obtain an electrode having high heat resistance, for example, the electrode may be formed of an inorganic material in which metal powder is dispersed using an inorganic conductive paste or the like. Examples of the inorganic conductive paste include water glass in which metal powder is dispersed. Since the water glass paste does not contain an organic substance, volume shrinkage or deformation does not occur in the formed electrode even in a high temperature environment, and as a result, damage to the capacitor can be suppressed.

  Further, by appropriately adding water to the water glass paste, it is possible to reduce the viscosity to a preferred viscosity and easily form an electrode. Furthermore, a dense electrode can be formed by evaporating water after electrode formation and promoting dehydration condensation in water glass.

  In the wound film capacitor of the present invention, the first glass film is preferably wound with a minimum curvature radius of 100 mm or less, and the minimum curvature radius is further 80 mm or less, 75 mm or less, 50 mm or less, 30 mm or less. , 20 mm or less, 10 mm or less, 5 mm or less, particularly 3 mm or less is preferable. If the first glass film is wound in a state where the minimum curvature radius is small, a large area can be secured per unit volume, so that a large amount of energy can be stored.

  The length dimension of the first glass film is preferably 0.05 m or more, 0.5 m or more, 1 m or more, 3 m or more, 5 m or more, 10 m or more, 30 m or more, 50 m or more, 70 m or more, particularly 100 m or more. When the length dimension of the first glass film is too small, the electrostatic capacity becomes small, so that it is difficult to accumulate a large amount of energy.

  The (width dimension / thickness) ratio of the first glass film is preferably 1000 or more, 1200 or more, 1400 or more, 1600 or more, 1800 or more, 2000 or more, particularly 2400 or more. When the (width dimension / thickness) ratio of the first glass film is too small, the electrostatic capacity becomes small, so that it is difficult to accumulate a large amount of energy.

  The dielectric constant of the first glass film is preferably 5 or more, 5.5 or more, 6 or more, 7 or more, 8 or more, 9 or more, 10 or more, particularly 11 or more. If the dielectric constant of the first glass film is too low, it is difficult to store a large amount of energy.

  The average surface roughness Ra of the first glass film is preferably 5 nm or less, 3 nm or less, 1 nm or less, 0.8 nm or less, 0.4 nm or less, 0.3 nm or less, particularly 0.2 nm or less. If the average surface roughness Ra of the first glass film is too large, the voltage that causes dielectric breakdown when a high voltage is applied tends to decrease.

  The surface roughness Rmax of the first glass film is preferably 10 nm or less, 5 nm or less, particularly 3 nm or less. If the surface roughness Rmax of the first glass film is too large, the voltage that causes dielectric breakdown when a high voltage is applied tends to decrease. Here, “average surface roughness Rmax” refers to a value measured by a method based on JIS B0601: 2001.

First glass film, as a glass composition, in _{mass%, SiO 2 20~70%, Al} 2 O 3 0~20%, B 2 O 3 0~17%, 0~10% MgO, CaO 0~15 %, SrO 0 to 15%, BaO 0 to 40%.

  The reason for limiting the content of each component as described above will be described below. In addition, in description of content of each component,% display means the mass%.

When the content of SiO ₂ is increased, the meltability and moldability tend to be lowered. Therefore, the content of SiO ₂ is preferably 70% or less, 65% or less, 60% or less, 58% or less, 55% or less, 50% or less, particularly 45% or less. On the other hand, when the content of SiO2 is reduced, it becomes difficult to form a glass network structure, and vitrification becomes difficult. Therefore, the content of SiO2 is preferably 20% or more, 25% or more, particularly 30% or more.

The content of Al ₂ O ₃ is 0 to 20%. When the content of Al ₂ O ₃ is increased, devitrified crystals are likely to be precipitated on the glass, and the liquid phase viscosity is likely to be lowered. Therefore, the content of Al ₂ O ₃ is preferably 20% or less, 18% or less, 15% or less, 12% or less, particularly 10% or less. On the other hand, when the content of Al ₂ O ₃ decreases, the component balance of the glass composition is impaired, and the glass is easily devitrified. Therefore, the content of Al ₂ O ₃ is preferably 0% or more, 1% or more, 3% or more, particularly 5% or more.

When the content of B ₂ O ₃ increases, the dielectric constant tends to decrease, and the heat resistance decreases, and the reliability of the capacitor at high temperatures tends to decrease. Therefore, the content of B ₂ O ₃ is preferably 15% or less, 13% or less, 11% or less, 7% or less, particularly 5% or less.

  MgO is a component that increases the strain point and also decreases the high-temperature viscosity. However, when there is too much content of MgO, liquidus temperature, a density, and a thermal expansion coefficient will become high too much. Therefore, the content of MgO is preferably 10% or less, 5% or less, 3% or less, 2% or less, 1.5% or less, 1% or less, particularly 0.5% or less.

  When the content of CaO is increased, the density and the thermal expansion coefficient are increased, the component balance of the glass composition is impaired, and the devitrification resistance is easily lowered. Therefore, the content of CaO is preferably 15% or less, 12% or less, 10% or less, 9% or less, particularly 8.5% or less. On the other hand, when the content of CaO is reduced, the dielectric constant and meltability are likely to be lowered. Therefore, the content of CaO is preferably 0% or more, 0.5% or more, 1% or more, 2% or more, 3% or more, particularly 5% or more.

  When the content of SrO increases, the density and the thermal expansion coefficient tend to increase. Therefore, the SrO content is preferably 15% or less, particularly 12% or less. On the other hand, when the content of SrO decreases, the dielectric constant and meltability tend to decrease. Therefore, the content of SrO is preferably 0% or more, 0.5% or more, 1% or more, 3% or more, particularly 5% or more.

  When the content of BaO increases, the density and the thermal expansion coefficient tend to increase. Therefore, the BaO content is preferably 40% or less, particularly 35% or less. On the other hand, when the content of BaO decreases, the dielectric constant tends to decrease, and it becomes difficult to suppress devitrification. Therefore, the content of BaO is preferably 0% or more, 0.5% or more, 1% or more, 2% or more, 5% or more, 10% or more, 15% or more, 20% or more, particularly 25% or more. .

  Each component of MgO, CaO, SrO, and BaO is a component that improves the dielectric constant, devitrification resistance, meltability, and moldability. However, if the content of MgO + CaO + SrO + BaO (the total amount of MgO, CaO, SrO and BaO) decreases, in addition to the difficulty of increasing the dielectric constant, the function as a flux cannot be fully exhibited, and the meltability decreases. It becomes easy. Therefore, the content of MgO + CaO + SrO + BaO is preferably 5% or more, 10% or more, 15% or more, 20% or more, 25% or more, particularly 30% or more. On the other hand, when the content of MgO + CaO + SrO + BaO increases, the density tends to increase, and the balance of the components of the glass composition is lost, and the devitrification resistance tends to decrease. Therefore, the content of MgO + CaO + SrO + BaO is preferably 60% or less, 55% or less, and particularly 50% or less.

Each component of Li ₂ O, Na ₂ O, and K ₂ O is a component that adjusts the thermal expansion coefficient by reducing the viscosity. In addition, the temperature characteristics of dielectric constant tend to decrease. Therefore, the total amount of these components is preferably 15% or less, 10% or less, 5% or less, 2% or less, 1% or less, 0.5% or less, particularly 0.1% or less.

  ZnO is a component that increases the dielectric constant and also increases the meltability. However, if it is contained in a large amount, the glass tends to devitrify and the density tends to increase. Therefore, the content of ZnO is preferably 0 to 30%, 0 to 20%, 0.5 to 15%, particularly 1 to 10%.

ZrO ₂ is a component that increases the dielectric constant, but if it is contained in a large amount, the liquidus temperature rises rapidly, and devitrified foreign substances of zircon are likely to precipitate. Therefore, the upper limit range of ZrO ₂ is preferably 20% or less, 15% or less, and particularly preferably 10% or less. Further, the lower limit range of ZrO ₂ is preferably 0% or more, 0.1% or more, 0.5% or more, 1% or more, 2% or more, and particularly preferably 3% or more.

Y ₂ O ₃ , Nb ₂ O ₃ , and La ₂ O ₃ can each be added up to 20%. These components have a function of increasing the dielectric constant and the like, but if they are contained in a large amount, the density tends to increase.

As a fining agent, 0 to 3% of one or two or more selected from the group of As ₂ O ₃ , Sb ₂ O ₃ , CeO ₂ , SnO ₂ , F, Cl, and SO ₃ can be added. However, it is preferable to refrain from using As ₂ O ₃ , Sb ₂ O ₃ and F as much as possible from an environmental viewpoint, and the content of each is preferably less than 0.1%. From the environmental point of view, SnO ₂ , Cl and SO ₃ are preferable as the fining agent. The content of SnO ₂ + Cl + SO ₃ (total amount of SnO _2, Cl and SO ₃ ) is preferably 0.001 to 1%, 0.01 to 0.5%, and particularly preferably 0.01 to 0.3%. The SnO ₂ content is preferably 0 to 1%, 0.01 to 0.5%, particularly preferably 0.05 to 0.4%.

  In addition to the above components, for example, other components can be added to the glass composition up to 20%, in particular up to 10%.

The liquidus temperature of the first glass film is preferably 1200 ° C. or lower, 1150 ° C. or lower, 1090 ° C. or lower, 1050 ° C. or lower, 1030 ° C. or lower, particularly 1000 ° C. or lower. If the liquidus temperature of the first glass film is too high, the glass tends to devitrify during molding, and it is difficult to increase the surface accuracy of the first glass film. Further, the liquid phase viscosity of the first glass film is preferably 10 ^3.5 dPa · s or more, 10 ^4.0 dPa · s or more, 10 ^4.5 dPa · s or more, 10 ^4.8 dPa · s or more. In particular, it is 10 ^5.0 dPa · s or more. If the liquidus viscosity of the first glass film is too low, the glass tends to devitrify during molding, and it becomes difficult to increase the surface accuracy of the first glass film. The “liquid phase viscosity” refers to a value obtained by measuring the viscosity of glass at the liquid phase temperature by a platinum ball pulling method. “Liquid phase temperature” refers to the temperature at which crystals pass through a standard sieve 30 mesh (500 μm) and the glass powder remaining on 50 mesh (300 μm) is placed in a platinum boat and kept in a temperature gradient furnace for 24 hours. Refers to the measured value.

The density of the first glass film is 4.5 g / cm ³ or less, 4.0 g / cm ³ or less, 3.6 g / cm ³ or less, 3.3 g / cm ³ or less, 3.0 g / cm ³ or less. It is preferably 8 g / cm ³ or less, particularly 2.5 g / cm ³ or less. The smaller the density, the easier it is to reduce the weight of the device. Here, “density” refers to a value measured by the well-known Archimedes method.

The thermal expansion coefficient of the first glass film is preferably 25 × 10 ^{−7 to} 120 × 10 ⁻⁷ / ° C., 30 × 10 ^{−7 to} 120 × 10 ⁻⁷ / ° C., and 40 × 10 ^{−7 to} 110 × 10. ⁻⁷ / ° C., 60 × 10 ^{−7 to} 100 × 10 ⁻⁷ / ° C., particularly 70 × 10 ^{−7 to} 95 × 10 ⁻⁷ / ° C. If the thermal expansion coefficient of the first glass film is out of the above range, the thermal expansion coefficients of the first glass film and the metal film are difficult to match, making it difficult to prevent the metal film from warping. Here, the “thermal expansion coefficient” refers to an average value measured with a dilatometer in a temperature range of 30 to 380 ° C.

The temperature at 10 ^2.5 dPa · s of the first glass film is preferably 1550 ° C. or lower, 1450 ° C. or lower, 1350 ° C. or lower, 1250 ° C. or lower, 1200 ° C. or lower, 1170 ° C. or lower, particularly 1150 ° C. or lower. The lower the temperature at 10 ^2.5 dPa · s of the first glass film, the easier it is to melt the glass at a low temperature, and the manufacturing cost of the first glass film is likely to be reduced. Here, “temperature at 10 ^2.5 dPa · s” refers to a value measured by a platinum ball pulling method.

  The first glass film preferably has an unpolished surface, and it is particularly preferred that all of the first surface and the second surface of the first glass film are unpolished. Although the theoretical strength of glass is very high, it often leads to fracture even at a stress much lower than the theoretical strength. This is because a small defect called Griffith flow is generated on the surface of the glass in a post-molding process such as a polishing process. Therefore, if the surface of the first glass film is unpolished, the original mechanical strength is difficult to be damaged, and the first glass film is difficult to break. In addition, if it is a redraw method or an overflow downdraw method, the 1st glass film with high surface precision which is not grind | polished can be shape | molded.

  The first glass film is preferably formed by a redraw method. If it does in this way, it will become easy to reduce the thickness of the 1st glass film. Moreover, the surface quality of the first glass film can be improved. Furthermore, it becomes possible to make the both end surfaces of a 1st glass film into a fire-making surface. And if a both-ends surface is a fire-making surface, it will become difficult to damage a 1st glass film from an end surface. The “redraw method” is a method for forming a glass film by heating a molded glass again to a temperature near the softening point, followed by stretching.

  Various methods other than the redraw method can be employed as the first glass film forming method. For example, an overflow down draw method, a slot down draw method, a redraw method, or the like can be employed. The “overflow down draw method” is also called a fusion method, and the molten glass overflows from both sides of the heat-resistant cage-like structure, and the overflowing molten glass is joined at the lower end of the cage-like structure. In this method, the first glass film is formed by drawing downward. If the first glass film is formed by the overflow down draw method, the surface quality of the first glass film can be improved.

  When the second insulating film is a glass film, it is possible to make at least one of the glass composition, physical properties, shape, surface properties, dimensions, molding conditions, etc. of the one insulating film 7 described above the same. Of course, glass films with different glass compositions, physical properties, shapes, surface properties, dimensions, molding conditions, and the like may be used for the second insulating film as long as there is no particular problem in terms of cost and productivity.

  As the material of the first and second glass films, those that are difficult to break and highly flexible are more preferable, but not limited to the glass composition described above as long as they can be wound, various materials can be used, For example, non-alkali glass, soda glass, alkali-containing glass and the like can be mentioned.

  When a glass film is used as the second film, the thickness of the second glass film is preferably (the thickness of the second glass film / the thickness of the first glass film), preferably 0.3 or more and 0.0. 4 or more, 0.5 or more, 0.6 or more, 0.7 or more, 0.8 or more, particularly 0.9 or more, more preferably 3.0 or less, 2.5 or less, 2.0 or less, 1.8 or less, 1.5 or less, 1.3 or less, 1.2 or less, 1.1 or less, particularly 1.05 or less.

  Moreover, when winding up the first glass film and the second glass film, by appropriately managing the manufacturing conditions such as the winding speed and winding angle of each glass film and the winding direction, Rubbing and unreasonable stress concentration can be suppressed, and the probability of breaking the glass film can be reduced.

  In addition, naturally the various form is employable as long as the winding type film capacitor of this invention is a range which does not change the main point of this invention. That is, the first metal film is formed on the first surface of the first insulating film, and the second metal film is formed on the third surface of the second insulating film It may be. In this way, one conductive layer (metal film) may be formed per one insulating film, so that depending on conditions, the insulating film may be more than the case where two conductive layers are provided on one insulating film. In addition, the first insulating film with the first metal film and the second insulating film with the second metal film have the same configuration, which is advantageous in terms of cost and production control. It is.

  Furthermore, it may have a core that penetrates the winding body in the width direction at the center of the winding body that constitutes the capacitor, or may have a through hole without having a core. Also good. With this configuration, an increase in inductance can be suppressed and an increase in impedance in a high frequency range can be avoided as much as possible, and a capacitor can be reduced in weight. In addition, as a method of producing the winding type film capacitor which provided the through-hole in the center of a wound body, for example, after winding a glass film around a core, it is obtained by removing a core.

  FIG. 3 is a perspective view showing an example of a wound body according to the present invention. FIG. 3 shows a state where the first and second conductive layers 10 and 12 and the first and second insulating films 11 and 13 are virtually developed by a two-dot chain line. In the wound body 16 according to this embodiment, the first and second conductive layers 10 and 12 are both metal films, and the first metal film (first conductive layer 10) is the first insulating film 11. The second metal film (second conductive layer 12) is formed on the first surface (here, the outer surface) 11a, and the third surface (here, the outer surface) of the second insulating film 13 is formed. ) 13a. Then, from the outside in the radial direction of the wound body 2, two insulating layers are arranged so that the first conductive layer 5, the first insulating film 7, the second conductive layer 6, and the second insulating film 8 are arranged in this order. The film 7 and 8 are rolled up, and a through hole 18 is provided at the center. As a similar embodiment of the wound body 16, the first insulating film 11, the first conductive layer 10, the second insulating film 13, and the second conductive layer 12 are formed from the outside in the radial direction of the wound body 16. You may arrange in order.

  Since the wound film capacitor of the present invention has high heat resistance, it can exhibit performance even in a high temperature environment. That is, since characteristics such as capacitance, dielectric loss, and equivalent series resistance do not deteriorate even in a high temperature environment, there is little performance variation due to ambient temperature fluctuations, and reliability is very high.

  The wound film capacitor of the present invention has a measured value (26 to 150 ° C.) / Measured value (room temperature 26 ° C.) within ± 10%, preferably ± 5%, ± Within 4%, within ± 3%, within ± 2%, within ± 1.5%.

  The wound film capacitor of the present invention has a measured value (26 to 150 ° C.) / Measured value (room temperature 26 ° C.) within ± 10%, preferably within ± 8%, ± 6 regarding dielectric loss. %, ± 5%, ± 4%, and ± 3%.

  The wound film capacitor of the present invention has a measured value (26 to 150 ° C.) / Measured value (room temperature 26 ° C.) within ± 10%, preferably within ± 5%, ± Within 4%, within ± 3%, within ± 2%, within ± 1.5%.

Hereinafter, based on an Example, this invention is demonstrated in detail. However, the present invention is not limited to the following examples. The following examples are merely illustrative.
[Example 1]
<Production of glass substrate>
First, after preparing a glass raw material so that it might become a glass composition of Table 1, the obtained glass batch was supplied to the glass melting furnace, and it fuse | melted at 1500-1600 degreeC. Next, after the obtained molten glass was poured on a carbon plate and formed into a flat plate shape, a slow cooling treatment was performed from the strain point to room temperature over 10 hours. Finally, the obtained glass plate was processed as necessary to evaluate various properties. The results are shown in Table 1.

  The density is a value measured by a well-known Archimedes method.

  The strain point and the annealing point are values measured based on the method of ASTM C336-71.

  The softening point is a value measured based on the method of ASTM C338-93.

The temperatures at high temperature viscosities of 10 ^4.0 dPa · s, 10 ^3.0 dPa · s and 10 ^2.5 dPa · s are values measured by the platinum ball pulling method.

  The thermal expansion coefficient is an average value measured with a dilatometer in a temperature range of 30 to 380 ° C.

  The liquid phase temperature passed through a standard sieve 30 mesh (500 μm), the glass powder remaining in 50 mesh (300 μm) was placed in a platinum boat and held in a temperature gradient furnace for 24 hours, and the temperature at which crystals precipitated was measured. Value.

  The liquid phase viscosity is a value obtained by measuring the viscosity of glass at the liquid phase temperature by a platinum ball pulling method.

The dielectric constant is a value measured by a method based on ASTM D150.
<Production of capacitor>
Sample No. above. The glass plate according to 1 to 9 is heated to the vicinity of the softening point, and then stretch-molded by a redraw method to obtain a first glass film having a length dimension of 19.3 m, a width dimension of 25 mm, and a thickness of 10 μm, and a length dimension of 19.3 m. A second glass film having a width of 22 mm and a thickness of 9 μm and made of the same material as the first glass film was obtained. Each glass film had an average surface roughness Ra of 0.2 nm.

  Next, a 65 nm thick silver alloy film (corresponding to the first metal film and the second metal film) is formed on the first surface and the second surface of the obtained first glass film. did. At this time, the silver alloy film was formed by sputtering using “APC-TR” manufactured by Furuya Metal Co., Ltd. During film formation, a region of 6.5 mm from one end face of the first surface was masked so that no silver alloy film was formed on that portion. Furthermore, a 6.5 mm region from one end face of the second surface was masked so that no silver alloy film was formed on that portion. Here, the portions where the silver alloy film was not formed were not opposed to each other when viewed from the thickness direction of the first glass film. And after forming a silver alloy film, masking was removed. FIG. 4 is a conceptual cross-sectional view in the width direction showing a state in which a silver alloy film (10, 12) is formed on the first surface 11a and the second surface 11b of the first glass film 11. is there.

  Subsequently, the first glass film and the second glass film were overlapped and wound around a core of φ50 mm. Thereafter, the core was removed.

  After removing the core, the entire end of the metal film (corresponding to the first metal film) on the first surface is electrically applied by applying a conductive paste to one end surface of the first glass film. And an electrode (corresponding to the first electrode) on the side surface of the wound body so that the entire end of the metal film (corresponding to the second metal film) on the second surface is not electrically connected Formed). By applying a conductive paste to the other end face of the first glass film by a similar procedure, the entire end of the metal film (corresponding to the second metal film) on the second surface is electrically Connect the other end of the metal film on the first surface (corresponding to the first metal film) so as not to be electrically connected. Corresponding). Here, Pyroduct 597-A manufactured by Alemco was used as the conductive paste. At this time, a small amount of water was added to the conductive paste to adjust the viscosity so that it could be easily applied as an electrode, and after applying to the end face, it was cured by holding at 95 ° C. for 2 hours. In this way, sample no. The wound type film capacitor concerning 1-9 was produced.

Sample No. 1 was measured using an impedance analyzer (Solartron 1260 type, measurement conditions: frequency 1 Hz to 32 MHz, applied voltage 100 mV), the result shown in FIG. Obtained. When the capacitance was calculated from the impedance at 1 Hz, it was 2.3 μF. Further, when the resistance of the electrode film was measured with a digital multimeter (M-04 manufactured by Custom Corp.) with a tester after heat treatment at 150 ° C. for 1 hour in the atmosphere, no change was observed. Moreover, when the electrostatic capacitance was measured by the same procedure as described above, it was 2.3 μF, and there was no change before and after the heat treatment. In appearance, the metal film and the electrode were not damaged.
[Example 2]
Except that the width of the first glass film was changed to 50 mm and the thickness to 20 μm, the width of the second glass film was changed to 45 mm, and the thickness was changed to 18 μm, sample No. 1 was used under the same conditions as in [Example 1]. 1 was produced.
[Example 3]
At the time of film formation, an area of 4.7 mm from one end surface of the first surface is masked, the width dimension of the first glass film is 25.4 mm, the length dimension is 12.1 m, and CW2400 manufactured by ITW Chemtronics is used as an electrode. Sample No. 5 was used under the same conditions as in [Example 1], except that 1 was produced.

  The capacitance of the obtained wound film capacitor was measured using an impedance analyzer (Solartron 1260 type, measurement conditions: frequency 1 Hz to 32 MHz, applied voltage 100 mV). The capacitance was calculated from the impedance at 1 Hz to be 1.91 μF. Thereafter, the capacitance, dielectric loss, and equivalent series resistance were measured by changing the ambient temperature in the order of room temperature (26 ° C.), 50 ° C., 75 ° C., 100 ° C., 125 ° C., and 150 ° C. Results were obtained. In addition, the appearance of the metal film and the electrode were not damaged.

[Comparative Example 1]
A wound film capacitor was fabricated with the same configuration as in Example 1 except that CW2400 manufactured by ITW Chemtronics was used as the copper film and the electrode as the metal film. After the heat treatment at 150 ° C. for 1 hour in the atmosphere, the resistance of the electrode film was measured with a digital multimeter (M-04 manufactured by Custom Corp.) with a tester, but the metal film was not energized. Furthermore, when the temperature was increased to 300 ° C., the electrode was cracked.

1 wound film capacitor 10 first metal film (first conductive layer)
11 First insulation film (glass film)
11a First surface 11b Second surface 12 Second metal film (second conductive layer)
13 Second insulating film 13a Third surface 14 First electrode 15 Second electrode 16 Winding body 17 Core 18 Through hole

Claims (17)

The first and second conductive layers and the first and second insulating films are in the order of the first conductive layer, the first insulating film, the second conductive layer, and the second insulating film. A wound film capacitor including a wound body that is wound into a roll shape in an overlapping state,
The first insulating film has a first surface and a second surface oriented in opposite directions in the thickness direction,
The second insulating film has a third surface and a fourth surface directed in opposite directions in the thickness direction, and
The first surface and the third surface, the second surface and the fourth surface are each directed in the same direction,
A wound film capacitor in which at least the first insulating film is a glass film, and at least the first conductive layer is a metal film having heat resistance of 50 ° C. or higher.   The wound film capacitor according to claim 1, wherein the second insulating film is a glass film.   The first and second conductive layers are both metal films having a heat resistance of 50 ° C. or higher, and are formed on the first surface and the second surface of the first insulating film, respectively. Item 3. A wound film capacitor according to Item 1 or 2.   The first and second conductive layers are both metal films having a heat resistance of 50 ° C. or more, and are formed on the first surface of the first insulating film and the third surface of the second insulating film. The wound film capacitor according to claim 1 or 2, wherein each film is formed. The first conductive layer has a first side end face that faces one side in the width direction and a second side end face that faces the other side in the width direction,
The second conductive layer has a third side end face that faces one side in the width direction, and a fourth side end face that faces the other side in the width direction,
The second side end surface of the first conductive layer is offset to one side in the width direction from the fourth side end surface of the second conductive layer, and the second conductive layer 5. The wound film capacitor according to claim 1, wherein the third side end face is offset to the other side in the width direction from the first side end face of the first conductive layer. . A first electrode in contact with the first conductive layer and separated from the second conductive layer is provided on one side in the width direction of the wound body,
The second electrode in contact with the second conductive layer and separated from the first conductive layer is provided on the other side in the width direction of the wound body. Winding film capacitor.   The wound film capacitor according to claim 6, wherein the first and / or second electrode has a heat resistance of 50 ° C. or higher.   The wound film capacitor according to claim 6 or 7, wherein the first and / or second electrode is made of an inorganic material in which metal powder is dispersed.   The wound film capacitor according to any one of claims 1 to 8, wherein the first insulating film has a thickness of 50 µm or less.   The wound film capacitor according to any one of claims 1 to 9, wherein a minimum winding diameter of the wound body is 100 mm or less.   The wound film capacitor according to any one of claims 1 to 10, wherein a dimension in a longitudinal direction of the first insulating film is 0.05 m or more.   The wound film capacitor according to any one of claims 1 to 11, wherein a value obtained by dividing a width direction dimension of the first insulating film by a thickness dimension of the first insulating film is 1000 or more.   The winding film capacitor according to any one of claims 1 to 12, wherein the glass film as the first insulating film has a relative dielectric constant of 5.0 or more.   The arithmetic average roughness Ra of the first surface oriented in one thickness direction of the first insulating film or the second surface oriented in the other thickness direction is 5 nm or less. Winding film capacitor. Glass film as the first insulating film, in _{mass%, SiO 2: 20~70%,} Al 2 O 3: 0~20%, B 2 O 3: 0~17%, MgO: 0~10% The wound film capacitor according to any one of claims 1 to 14, which has a glass composition containing CaO: 0 to 15%, SrO: 0 to 15%, BaO: 0 to 40%.   The surface of the said glass film is closely_contact | adhering directly in the elongate direction edge part of the winding end of the glass film as said 1st insulating film, and / or the winding start side. Winding film capacitor.   The wound film capacitor according to any one of claims 1 to 16, wherein a through-hole penetrating the wound body in the width direction is provided at a center of the wound body.