JP2017228834A - Distribution synthesizer, distributor, and synthesizer - Google Patents

Abstract

Disclosed is a distributor / combiner having high vibration resistance or shock resistance.
A distribution synthesizer according to an embodiment includes a high-frequency distribution / synthesis line 16 that distributes high-frequency power, a sheet-like dielectric 15 that supports the high-frequency distribution / synthesis line 16, and a planar portion, respectively. Conductor blocks 13 and 14 sandwiching a dielectric. Concave portions are formed along the high-frequency distribution / synthesis line 16 in the planar portion of the conductor block 13 and the planar portion of the conductor block 14, respectively. The conductor block 13 and the conductor block 14 are fixed so that the concave portion of the conductor block 13 and the concave portion of the conductor block 14 face each other with the high-frequency distribution / synthesis line 16 therebetween.
[Selection] Figure 10

Description

  Embodiments described herein relate generally to a distribution synthesizer, a distributor, and a synthesizer.

  The use of high-frequency power (high-frequency signals) has become popular. A high frequency power distribution / combiner is used for the distribution or combination of high frequency power. In the transmission of high-frequency power, the dielectric loss becomes so large that it cannot be ignored. In order to reduce the dielectric loss, an airline type transmission line in which the dielectric part of the stripline (triplate line) is an air layer may be used in the high frequency power distribution and synthesizer.

JP 2006-108741 A

  An airline type transmission line is usually supported by a thick dielectric layer. In the case of a high-frequency power combiner / distributor with an airline-type transmission line, when vibration or impact is applied, stress concentration occurs at the boundary between the floating part of the transmission line and the part supported by a thick dielectric layer. . For this reason, the high-frequency power combiner / distributor having an airline type transmission line is susceptible to vibration or shock in some cases.

  The problem to be solved by the present invention is to provide a distributor / combiner, a distributor, and a combiner that have high vibration resistance or shock resistance.

  The distribution synthesizer according to the embodiment includes a high-frequency distribution / synthesis line that distributes high-frequency power, a sheet-like dielectric material that supports the high-frequency distribution / synthesis line, and a planar portion, and a first sandwiching the dielectric material between the planar portions, A second conductor block. Concave portions are formed in the planar portion of the first conductor block and the planar portion of the second conductor block, respectively, along the high-frequency distribution / synthesis line. The first conductor block and the second conductor block are fixed so that the concave portion of the first conductor block and the concave portion of the second conductor block face each other with the high-frequency distribution combined line therebetween.

FIG. 2 is a perspective view of the distribution synthesizer according to the first embodiment. FIG. 3 is an exploded perspective view of the distribution synthesizer according to the first embodiment. It is a bottom view of the 1st conductor block. It is a top view of the 2nd conductor block. It is a top view of a dielectric sheet in which a high frequency distribution / synthesis line is disposed on the top surface. It is a figure which shows a high frequency distribution synthetic | combination line. It is an enlarged view of the high frequency distribution synthesis circuit with which a high frequency distribution synthesis line is provided. It is an equivalent circuit of a high frequency distribution synthesis circuit. It is a top view of the distribution synthesizer with the first conductor block removed. FIG. 2 is an exploded perspective view of the vicinity of a high-frequency distribution / synthesis circuit of the distribution / combiner according to the first embodiment. 2 is a cross-sectional view of the vicinity of a high-frequency distribution / synthesis circuit of the distribution / combination device of Embodiment 1. FIG. It is a disassembled perspective view of the vicinity of the high-frequency distribution / synthesis circuit of the distribution / combination device of Embodiment 2. It is sectional drawing of the high frequency distribution synthesis circuit vicinity of the distribution synthesizer of Embodiment 2. FIG. It is a figure which shows the modification of arrangement | positioning of a high frequency distribution synthetic | combination line. It is a figure which shows the modification of arrangement | positioning of a high frequency distribution synthetic | combination line.

  Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the drawings, the same or equivalent parts are denoted by the same reference numerals.

(Embodiment 1)
FIG. 1 is a perspective view of a distribution synthesizer 1 according to the first embodiment. The distribution synthesizer 1 is an 8-distribution or 8-synthesis high-frequency power (high-frequency signal) distribution synthesizer. The high frequency power applied to the composite end connector 11 is distributed and output to the distribution end connectors 12a to 12h. In addition, the high frequency power applied to the distribution end connectors 12 a to 12 h is combined and output to the combined end connector 11. The distribution and combination operations of the distribution synthesizer 1 are reversible.

  Here, the high-frequency power is power (signal) including a high-frequency component (a frequency component of about 300 MHz to 300 GHz). In the following description, high-frequency power is referred to as a high-frequency signal or simply high frequency. The high frequency signal may be a signal in a microwave band (approximately 1 GHz to 300 GHz) or a signal in a quasi-millimeter wave band (approximately 20 to 30 GHz). The high frequency signal may be a millimeter wave band signal (approximately 30 GHz to 300 GHz). The distribution synthesizer 1 is installed in a device that is vibrated by operation. For example, the distribution synthesizer 1 is installed in a device that vibrates as the antenna rotates, such as an air radar for air traffic control.

  In the following description, an orthogonal coordinate system including the X axis, the Y axis, and the Z axis is used. In the figure, the direction indicated by the arrow is the plus direction. The X axis plus direction is the right direction, and the X axis minus direction is the left direction. Further, the Y axis plus direction is the back direction, and the Y axis minus direction is the front direction. Further, the positive direction of the Z axis is the upward direction, and the opposite direction is the downward direction.

  FIG. 2 is an exploded perspective view of the distribution synthesizer 1. The distribution synthesizer 1 includes a combination end connector 11, a plurality of distribution end connectors 12 a to 12 h, conductor blocks 13 and 14, a dielectric 15, and a high frequency distribution combination line 16.

  The composite end connector 11 and the distribution end connectors 12a to 12h are connectors for connecting transmission lines such as coaxial cables, strip lines, microstrip lines, feeder lines and the like. The combination end connector 11 is disposed on the back side surface of the distribution combiner 1, and the distribution end connectors 12 a to 12 h are disposed on the front side surface of the distribution combiner 1 of the distribution combiner 1. For example, a signal transmitter or a signal receiver is connected to the composite end connector 11 via a transmission line. For example, an antenna is connected to the distribution end connectors 12a to 12h.

  The conductor blocks 13 and 14 are blocks formed of a conductor such as iron, copper, or aluminum. The conductor block 13 functions as a first conductor block, and the conductor block 14 functions as a second conductor block. The conductor block 14 may be regarded as a first conductor block, and the conductor block 13 may be regarded as a second conductor block. The conductor block 13 has at least one plane portion. The conductor block 13 of this embodiment has a flat bottom surface. The conductor block 14 has at least one plane portion. The conductor block 14 of the present embodiment has a flat surface on the upper surface. The shape of the conductor block 13 and the conductor block 14 is not limited to the shape shown in the figure, and various modifications are possible.

  The conductor block 13 and the conductor block 14 sandwich the sheet-like dielectric 15 between two flat portions. In other words, the dielectric 15 is sandwiched between the bottom surface of the conductor block 13 and the top surface of the conductor block 14. The conductor block 13 and the conductor block 14 are grounded directly or indirectly. The conductor block 13 and the conductor block 14 function as an electromagnetic shield.

  FIG. 3 is a bottom view of the conductor block 13, and FIG. 4 is a top view of the conductor block 14. A concave portion (groove) 13 b is formed along the high-frequency distribution / synthesis line 16 in the flat portion 13 a (bottom surface) of the conductor block 13. Similarly, a concave portion (groove) 14 b is formed along the high-frequency distribution / synthesis line 16 in the flat portion 14 a (upper surface) of the conductor block 14. The conductor block 13 and the conductor block 14 are fixed so that the recess 13b and the recess 14b face each other. The shape of the recess 13b and the recess 14b is a corresponding shape when the bottom surface of the conductor block 13 and the top surface of the conductor block 14 face each other. Therefore, a tubular space is formed in the distribution synthesizer 1 by the recess 13b and the recess 14b.

  FIG. 5 is a top view of the dielectric 15 having the high-frequency distribution / synthesis line 16 disposed on the top surface. The dielectric 15 is a sheet-like dielectric. The “sheet-like dielectric” refers to a thin and soft dielectric, for example, a resin sheet (resin film) having a thickness of 1 μm to 1 mm. The thickness of the sheet constituting the dielectric is not limited to a range of 1 μm to 1 mm, and may be a range of 1 mm to 2 mm, for example. A dielectric is a substance having a dielectric property superior to conductivity, and is not limited to a resin. As an example, the dielectric 15 is a base film of a flexible printed circuit board. The dielectric 15 may be a polyimide film. The thickness of the dielectric 15 is, for example, 50 μm. A film is a sheet having a thickness of less than 250 μm (0.25 mm). When the thickness of the sheet constituting the dielectric 15 is 250 μm, “sheet shape” can be restated as “film shape”. The concept of a sheet includes a film.

  A high frequency distribution / synthesis line 16 is disposed on one surface of the dielectric 15. The high frequency distribution / synthesis line 16 may be formed by a pattern printed on one surface of the dielectric 15. For example, the high frequency distribution / synthesis line 16 may be formed by a pattern printed on a base film of a flexible printed circuit board. As an example, the high-frequency distribution / synthesis line 16 may be formed by mounting an element such as a resistor on a copper pattern formed by etching a copper-clad polyimide film. The high frequency distribution / synthesis line 16 is in a state where the entire surface thereof is supported by the dielectric 15.

  FIG. 6 shows only the high frequency distribution / synthesis line 16 taken out from the dielectric 15. The high frequency distribution / synthesizing line 16 is a high frequency distribution / synthesizing line for distributing or synthesizing an inputted high frequency signal into eight. The high-frequency distribution / synthesis line 16 includes a plurality of high-frequency distribution / synthesis circuits 16a1 to 16a7 and connection lines 16b1 to 16b6 that connect them in a tournament form.

  The high frequency distribution / synthesis circuits 16a1 to 16a7 are distribution / synthesis circuits for distributing or synthesizing high frequency signals. In the present embodiment, the high-frequency distribution / synthesis circuits 16a1 to 16a7 are Wilkinson-type high-frequency distribution / synthesis circuits. The operations of the high-frequency distribution / synthesis circuits 16a1 to 16a7 are reversible. When distributing high-frequency signals, the high-frequency distribution / synthesis circuits 16a1 to 16a7 function as high-frequency distribution circuits, and when synthesizing high-frequency signals, the high-frequency distribution / synthesis circuits 16a1 to 16a7 function as high-frequency synthesis circuits.

  The configuration of the high-frequency distribution / synthesis circuits 16a1 to 16a7 is substantially the same. In the following description, the configuration of the high frequency distribution / synthesis circuit 16a will be described as the configuration of the high frequency distribution / synthesis circuits 16a1 to 16a7. FIG. 7 is an enlarged view of the high-frequency distribution / synthesis circuit 16a. The high frequency distribution / synthesis circuit 16 a includes a synthesis terminal 161 and distribution terminals 162 and 163. The synthesis terminal 161 is connected to a distribution terminal of another high-frequency distribution synthesis circuit 16a through a connection line. Alternatively, the composite terminal 161 is connected to the composite end connector 11. The distribution terminals 162 and 163 are connected to the distribution terminals of the other high-frequency distribution / synthesis circuit 16a through connection lines. Alternatively, the distribution terminals 162 and 163 are connected to any one of the distribution end connectors 12a to 12h.

  FIG. 8 is an equivalent circuit of the high-frequency distribution / synthesis circuit 16a. The high-frequency distribution / synthesis circuit 16a includes branch lines L1 and L2 and two isolation resistors 164 and 165 straddling the two branch lines. Each of the branch lines L1 and L2 is a line having a predetermined characteristic impedance and having an electrical length or an electrical length in consideration of the characteristics of a dielectric of ¼ wavelength with respect to the center frequency. The characteristic impedance of the branch line L1 is Z1 and Z2, and the characteristic impedance of the branch line L2 is Z3 and Z4. The high frequency distribution / synthesis circuit 16a shown in FIGS. 7 and 8 is merely an example. The configuration of the high-frequency distribution / synthesis circuit 16a can be changed in accordance with required characteristics. For example, one isolation resistor may be provided for one high-frequency distribution / synthesis circuit.

  FIG. 9 is a top view of the distribution synthesizer 1 with the conductor block 13 removed. The broken lines in the figure indicate the edge of the recess 13b formed in the conductor block 13 (that is, the boundary between the flat portion 13a and the recess 13b shown in FIG. 3) and the edge of the recess 14b formed in the conductor block 14 (FIG. 4). The boundary between the flat portion 14a and the concave portion 14b shown in FIG. Both the recess 13 b and the recess 14 b are formed along the high-frequency distribution / synthesis line 16. The widths of the recess 13b and the recess 14b are larger than the line width of the high-frequency distribution / synthesis line 16. The concave portion 13b and the concave portion 14b have a wide tournament shape so that the high-frequency distribution / synthesis line 16 is positioned at the approximate center of the width.

  FIG. 10 is an exploded perspective view of the vicinity of the high frequency distribution synthesis circuit 16a of the distribution synthesizer 1. FIG. FIG. 11 is a cross-sectional view of the vicinity of the high frequency distribution / synthesis circuit of the distribution synthesizer. More specifically, FIG. 11 is a diagram obtained by cutting the distribution synthesizer 1 in an undisassembled state along the line AA shown in FIG. The conductor block 13 and the conductor block 14 are fixed so that the recess 13b and the recess 14b face the high-frequency distribution / synthesis line 16 therebetween. Therefore, a tubular space is formed in the distribution synthesizer 1 by the recess 13b and the recess 14b. This tubular space is vertically divided by a sheet-like (or film-like) dielectric 15. The high frequency distribution / synthesis line 16 is supported by the dielectric 15. The high-frequency distribution / synthesis line 16 is located at the center in the width direction of the tubular space (in the example of FIG. 11, the X-axis direction). For this reason, the high-frequency distribution / synthesis line 16 is located substantially at the center of the tubular space.

  Next, the operation of the distribution synthesizer 1 having such a configuration will be described. The operation of the distribution synthesizer 1 is divided into high-frequency signal distribution and high-frequency signal synthesis. First, the distribution of high-frequency signals will be described.

  First, a high frequency signal is applied to the composite end connector 11 from an external device (for example, a transmitter) via a transmission line. The high-frequency signal applied to the combining end connector 11 is input to the combining terminal 161 of the high-frequency distribution combining circuit 16a1 shown in FIG. The high frequency signal is divided into two by the high frequency distribution / synthesis circuit 16a1 and output from the distribution terminals 162 and 163. The distributed high frequency signal is input to the synthesis terminal 161 of the high frequency distribution synthesis circuit 16a2 or 16a3 via the connection line 16b1 or 16b2. The high-frequency signal is further divided into two by the high-frequency distribution / synthesis circuits 16a2 and 16a3, and is output from the respective distribution terminals 162 and 163. The distributed high-frequency signal is input to the synthesis terminal 161 of the high-frequency distribution synthesis circuit 16a4, 16a5, 16a6, or 16a7 via the connection line 16b3, 16b4, 16b5, or 16b6. The high-frequency signal is further divided into two by the high-frequency distribution / synthesis circuits 16a4 to 16a7, and is output from the respective distribution terminals 162 and 163. The output high frequency signal is output from the distribution end connectors 12a to 12h to a device (for example, a receiver) outside the distribution synthesizer 1.

  Next, the synthesis of high frequency signals will be described.

  First, a high frequency signal is applied from an external device (for example, an antenna) to the distribution end connectors 12a to 12h via a transmission line. The high frequency signals applied to the distribution end connectors 12a to 12h are input to the distribution terminals 162 and 163 of the high frequency distribution synthesis circuits 16a4 to 16a7. The high frequency signals are combined into two by the high frequency distribution and synthesis circuits 16a4 to 16a7 and output from the respective synthesis terminals 161. The synthesized high-frequency signal is input to the distribution terminals 162 and 163 of the high-frequency distribution and synthesis circuit 16a2 or 16a3 via the connection lines 16b3, 16b4, 16b5, and 16b6. Two high frequency signals are further synthesized by the high frequency distribution and synthesis circuits 16a2 and 16a3, respectively, and output from the respective synthesis terminals 161. The synthesized high frequency signal is input to the distribution terminals 162 and 163 of the high frequency distribution and synthesis circuit 16a1 via the connection line 16b1 or 16b2. The high-frequency signal is further combined into two by the high-frequency distribution / synthesis circuit 16 a 1 and output from the synthesis terminal 161. The output high frequency signal is output from the combination end connector 11 to a device (for example, a receiver) outside the distribution combiner 1.

  According to the present embodiment, the high-frequency distribution / synthesis line 16 is not partially supported by the thick dielectric layer, but is entirely supported by the sheet-like (or film-like) dielectric 15. Therefore, the high-frequency distribution / synthesis line 16 hardly causes stress concentration in a part of the line due to vibration or impact applied to the distribution / synthesizer 1. Accordingly, the distributor / synthesizer 1 has high vibration resistance and impact resistance.

  The electric field generated by the signal propagates through the thickness direction of the dielectric. Therefore, when a thick dielectric layer is arranged in a direction orthogonal to the electric field, transmission loss is greatly increased due to dielectric loss. However, in this embodiment, what is arranged in the direction perpendicular to the electric field is not a thick dielectric layer but a sheet-like (or film-like) dielectric 15. Since the dielectric 15 that generates the dielectric loss is thin, the distribution synthesizer 1 can transmit a signal with low loss.

(Embodiment 2)
The ground potential of the conductor blocks 13 and 14 affects the characteristics of the high-frequency distribution / synthesis line 16. Therefore, it is desirable that the ground potential of the conductor block 13 and the ground potential of the conductor block 14 are the same. However, in the distribution synthesizer 1 of the first embodiment, the conductor block 13 and the conductor block 14 are electrically separated by the dielectric 15. For this reason, the ground potential must be the same between the conductor block 13 and the conductor block 14, but may differ slightly depending on the case. In the second embodiment, a distribution synthesizer 1 in which the difference between the ground potential of the conductor block 13 and the ground potential of the conductor block 14 is small will be described.

  FIG. 12 is an exploded perspective view of the vicinity of the high frequency distribution synthesis circuit 16a of the distribution synthesizer 1 of the second embodiment. A plurality of through holes 15 a are formed in the dielectric 15. The plurality of through holes 15a are not between the recesses 13b and the recesses 14b (that is, inside the tubular space formed by the recesses 13b and the recesses 14b), but between the planar portion 13a of the conductor block 13 and the planar portion 14a of the conductor block 14. Located between. The plurality of through holes 15a are formed along the edges of the recesses 13b and 14b.

  FIG. 13 is a cross-sectional view of the vicinity of the high frequency distribution synthesis circuit 16a of the distribution synthesizer 1 of the second embodiment. More specifically, FIG. 12 is a diagram obtained by cutting the distribution synthesizer 1 in an undisassembled state along the line AA shown in FIG. A conductor layer is formed between the flat portion 13 a of the conductor block 13 and the flat portion 14 a of the conductor block 14. The conductor layer 17 is formed, for example, by pouring a liquid metal between the flat portion 13a and the flat portion 14a and solidifying it. The conductor of the conductor layer 17 is disposed in the plurality of through holes 15a. The conductor (conductor layer 17) disposed in the through hole 15a electrically connects the conductor block 13 and the conductor block 14.

  When the through hole is not formed in the dielectric 15, in order to electrically connect the conductor block 13 and the conductor block 14, the thin dielectric 15 is sandwiched between the conductor blocks, and the conductor block 13 and the conductor block are 14 need to be contacted. This requires high accuracy in machining the conductor block. However, in the distribution synthesizer 1 of this embodiment, a plurality of through holes 15 a are formed in the dielectric 15. And the conductor block 13 and the conductor block 14 are electrically connected through the conductor arrange | positioned in the through hole 15a. Since the difference in ground potential between the conductor block 13 and the conductor block 14 is small, the characteristics of the high-frequency distribution / synthesis line 16 are stabilized.

  The plurality of through holes 15a are formed along the edges of the recesses 13b and 14b. It is the potential near the surface of the space formed by the recesses 13b and 14b that strongly affects the characteristics of the high-frequency distribution / synthesis line 16. By forming the plurality of through holes 15a along the edges of the recesses 13b and 14b, the difference in potential near the surface of the space is further reduced, so that the characteristics of the high-frequency distribution / synthesis line 16 are further stabilized.

  Each of the embodiments described above shows an example, and various changes and applications are possible.

  For example, in the above-described embodiment, the high frequency distribution / synthesis line 16 is arranged on the upper surface of the dielectric 15, but the high frequency distribution / synthesis line 16 may be arranged on the lower surface of the dielectric 15.

  Further, the high frequency distribution / synthesis line 16 may not necessarily be disposed on the upper surface or the lower surface of the dielectric 15 as long as it is supported in the space by the dielectric 15. For example, as shown in FIG. 14, the high-frequency distribution / synthesis line 16 may be supported by dielectrics 15 at both ends in the line width direction. At this time, a through hole may be formed in the dielectric 15 as described in the second embodiment. A conductor that electrically connects the conductor block 13 and the conductor block 14 may be disposed (filled) in the through hole.

  Further, the high frequency distribution / synthesis line 16 may be sandwiched between two dielectrics 15 as shown in FIG. Also in this case, a through hole may be formed in the dielectric 15, and a conductor that electrically connects the conductor block 13 and the conductor block 14 may be disposed (filled).

In the above embodiment, the dielectric 15 is a film having a thickness of 50 μm. However, the thickness of the dielectric 15 is not limited to 50 μm. The thickness of the dielectric 15 may be in the range of 1 μm or more and less than 250 μm. The dielectric 15 is not limited to a film (for example, a sheet having a thickness of 1 μm or more and less than 250 μm). The dielectric 15 may be a sheet having a thickness of 250 μm or more and 1 mm or less. The dielectric 15 may be a sheet having a thickness greater than 1 mm. For example, the dielectric 15 may be a sheet having a thickness of 1 mm or more and 2 mm or less.

  In the above-described embodiment, the dielectric 15 is a polyimide film, but the dielectric 15 is not limited to a polyimide film. For example, the dielectric 15 is made of polyethylene terephthalate (PET), polycarbonate (PC), polyethylene (PE), polystyrene (PS), polypropylene (PP), polyethylene naphthalate (PEN), polytetrafluoroethylene (PTFE), polyvinyl alcohol ( PVA), triacetate (TAC), aramid (APA), polysulfone (PSF), polyethersulfone (PES), polyetheretherketone (PEEK), polyamideimide (PAI), polyetherimide (PEI), polyphenylene sulfide (PPS) ), Polyvinyl chloride (PVC), polyvinyl alcohol (PVA), or polyarylate (PAR) sheet (film). Of course, the dielectric 15 may be a polyimide (PI) sheet.

  The dielectric 15 is not limited to a resin sheet (resin film). For example, the dielectric 15 may be paper or cloth (woven fabric or non-woven fabric). When the dielectric 15 is a cloth, the cloth constituting the dielectric 15 may be a plastic fiber or a woven cloth of glass fiber. When the dielectric 15 is made of paper or cloth, the high frequency distribution / synthesis line 16 may be attached to the dielectric 15 with an adhesive or the like. Of course, even when the dielectric 15 is a resin sheet (resin film), the high-frequency distribution / synthesis line 16 may be attached to the dielectric 15 with an adhesive or the like.

  In the above-described embodiment, the high-frequency distribution / synthesis circuit 16a (high-frequency distribution / synthesis circuits 16a1 to 16a7) is a Wilkinson-type high-frequency distribution / synthesis circuit. It is not limited to a synthesis circuit. For example, the high frequency distribution / synthesis circuit 16a may be a distributed coupling type, branch line type, or rat race type high frequency distribution / synthesis circuit.

  In the above-described embodiment, the distribution synthesizer 1 is an 8-distribution or 8-synthesis distribution synthesizer in which seven high-frequency distribution synthesizers 16a are connected in a tournament form. However, the number of high-frequency distribution / synthesis circuits 16a and the number of distribution or synthesis are not limited to this. The distribution synthesizer 1 may be a 4-distribution or 4-synthesis distribution synthesizer in which three high-frequency distribution synthesizers 16a are connected in a tournament form. Further, the distribution synthesizer 1 may be a 16 distribution or 16 combination distribution synthesizer in which 15 high frequency distribution synthesizers 16a are connected in a tournament form. Of course, the distribution synthesizer 1 may be a 2-distribution or 2-synthesis distribution synthesizer having one high-frequency distribution synthesizer circuit 16a. Various values can be selected for the number of high-frequency distribution / synthesis circuits 16a and the number of distribution or synthesis depending on the purpose and application.

  In the above-described embodiment, the distribution synthesizer 1 is capable of both distribution and combination. However, the distribution synthesizer 1 may be capable of either distribution or combination. The distribution synthesizer can be rephrased as a distributor or a synthesizer. The high-frequency distribution / synthesis line can also be called a high-frequency distribution line or a high-frequency synthesis line. Similarly, the high-frequency distribution / synthesis circuit can be rephrased as a high-frequency distribution circuit or a high-frequency synthesis circuit.

  Although the embodiment of the present invention has been described, this embodiment is presented as an example and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. This embodiment and its modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

1 ... distribution synthesizer (distributor, synthesizer)
DESCRIPTION OF SYMBOLS 11 ... Composite end connector 12a-12h ... Distribution end connector 13, 14 ... Conductor block 13a, 14a ... Planar part 13b, 14b ... Recessed part 15 ... Dielectric 15a ... Through hole 16 ... High frequency distribution synthetic line (High frequency distribution line, high frequency synthesis) line)
16a to 16a7 ... high frequency distribution and synthesis circuit (high frequency distribution circuit, high frequency synthesis circuit)
16b1 to 16b6 ... connection line 161 ... composite terminal 162, 163 ... distribution terminal 164, 165 ... isolation resistor 17 ... conductor layer L1, L2 ... branch line

Claims (9)

A high-frequency distribution / synthesis line for distributing or synthesizing high-frequency power; and
A sheet-like dielectric material for supporting the high-frequency distribution / synthesis line;
First and second conductor blocks each having a planar portion and sandwiching the dielectric between the planar portions,
The flat portion of the first conductor block and the flat portion of the second conductor block are each formed with a recess along the high-frequency distribution / synthesis line,
The first conductor block and the second conductor block are fixed so that the concave portion of the first conductor block and the concave portion of the second conductor block are opposed to the high-frequency distribution / synthesis line. Yes,
Distribution synthesizer. The high-frequency distribution / synthesis line is composed of a plurality of Wilkinson-type high-frequency distribution / synthesis circuits and a connection line connecting the plurality of high-frequency distribution / synthesis circuits in a tournament form,
The distribution synthesizer according to claim 1. The dielectric is formed with a plurality of through holes,
The plurality of through holes are located between the planar portion of the first conductor block and the planar portion of the second conductor block,
A conductor connecting the first conductor block and the second conductor block is disposed in the plurality of through holes.
The distribution synthesizer according to claim 1 or 2. The plurality of through holes are formed along edges of the recesses of the first and second conductor blocks.
The distribution synthesizer according to claim 3. The dielectric is a base film of a flexible printed circuit board,
The high-frequency distribution / synthesis line is formed by a pattern printed on the base film,
The distribution synthesizer according to any one of claims 1 to 4. A high-frequency distribution line that distributes high-frequency power; and
A sheet-like dielectric material that supports the high-frequency distribution line;
First and second conductor blocks each having a planar portion and sandwiching the dielectric between the planar portions,
The planar portion of the first conductor block and the planar portion of the second conductor block are each formed with a recess along the high-frequency distribution line,
The first conductor block and the second conductor block are fixed so that the concave portion of the first conductor block and the concave portion of the second conductor block are opposed to the high-frequency distribution line. ,
Distributor. The high-frequency distribution line is composed of a plurality of Wilkinson-type high-frequency distribution circuits and a connection line that connects the plurality of high-frequency distribution circuits in a tournament form.
The distributor according to claim 6. A high-frequency synthesis line that synthesizes high-frequency power; and
A sheet-like dielectric material supporting the high-frequency synthetic line;
First and second conductor blocks each having a planar portion and sandwiching the dielectric between the planar portions,
A concave portion is formed along the high-frequency synthetic line in each of the planar portion of the first conductor block and the planar portion of the second conductor block.
The first conductor block and the second conductor block are fixed so that the concave portion of the first conductor block and the concave portion of the second conductor block are opposed to the high-frequency composite line. ,
Synthesizer. The high-frequency synthesis line is composed of a plurality of Wilkinson-type high-frequency synthesis circuits and a connection line that connects the plurality of high-frequency synthesis circuits in a tournament form.
The synthesizer according to claim 8.

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