JP2018092847A - Light source unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source unit capable of suppressing a reduction in the amount of light emitted to the outside. A light source unit includes a package body 21 in which a semiconductor light emitting element 25 is accommodated, and a light source package 20 having an electrode 22 connected to the semiconductor light emitting element 25 and extending outward from a side wall 26 of the package body 21. And a first plate 41 of a heat dissipating member having an arrangement surface 41A on which the light source package 20 is arranged. The package main body 21 is fixed to the arrangement surface 41 </ b> A side so that heat generated in the semiconductor light emitting element 25 can be conducted to the heat radiating member 40, and the electrode 22 is separated from the heat radiating member 40. [Selection] Figure 3

Description

  The present invention relates to a light source unit used for an automotive front lamp or the like.

  The following Patent Literature 1 is disclosed as a light source unit used for a vehicle headlamp. In the light source unit of Patent Document 1 below, a semiconductor light source composed of a white light emitting diode having a planar light emitting portion on the upper surface, a frame formed with an opening through which light emitted from the semiconductor light source can pass, A pair of terminals extending from the edge is provided. These terminals are in contact with a pair of electrodes provided on the upper surface of the semiconductor light source from above.

Japanese Patent Laying-Open No. 2015-037056

  In the light source unit of Patent Document 1, since the light emitting part and the electrode are arranged on the upper surface of the semiconductor light source, the light emitted from the light emitting part tends to be blocked by the terminal connected to the electrode. When the light from the light emitting unit is blocked by the terminal, the amount of light emitted from the light source unit to the outside is reduced.

  By the way, there is a demand to arrange an electrode connected to the terminal other than the upper surface of the semiconductor light source so that the light of the light emitting unit is not blocked by the terminal. However, since the semiconductor light source of Patent Document 1 is fixed to a metal heat sink, there is a concern that the semiconductor light source may be short-circuited if the electrodes of the semiconductor light source are arranged on a surface other than the upper surface.

  Therefore, the present invention is intended to provide a light source unit that can suppress a reduction in the amount of light emitted to the outside.

  In order to solve the above problems, a light source package having a package main body in which the semiconductor light emitting element of the present invention is accommodated, an electrode connected to the semiconductor light emitting element and extending outward from a side wall of the package main body, and the light source package A heat dissipating member having a disposition surface on which the heat dissipating member is disposed, and the package body is fixed to the disposition surface side in a state in which heat generated in the semiconductor light emitting element can be conducted to the heat dissipating member, It is separated from the heat radiating member.

  In this light source unit, the electrode and the heat radiating member are separated from each other, so that the electrode is insulated from the heat radiating member even if the electrode is disposed outside the side wall of the package body. For this reason, it becomes possible to supply electric power from an external power supply via the electrode of the light source package. In addition, since the electrode is disposed outside the side wall of the package body, light is emitted from the semiconductor light emitting element as compared with the case where the electrode is disposed on the light emitting surface side of the semiconductor light emitting element accommodated in the package body. It is reduced that light is blocked by the power supply terminal connected to the electrode. Thus, the light source unit of the present invention can suppress a reduction in the amount of light emitted to the outside.

  By the way, the electrode has a plate shape including a first surface facing the arrangement surface side and a second surface opposite to the first surface, and the second surface side is a power supply terminal. It is possible to include a power feeding unit capable of supplying power from the power source.

  The heat dissipating member has a through-hole penetrating from the arrangement surface to the side opposite to the arrangement surface, and the electrode penetrates when the arrangement surface is viewed from the direction orthogonal to the arrangement surface. By being located inside the hole, the electrode and the heat dissipating member can be separated. The heat dissipating member has a concave portion that is recessed from the arrangement surface toward the opposite side of the arrangement surface, and the electrode is formed when the arrangement surface is viewed from the direction orthogonal to the arrangement surface. By being located inside the recess, the electrode and the heat dissipation member can be separated.

  Moreover, it is preferable to further provide an insulating member disposed between the electrode and the arrangement surface. Moreover, it is preferable to further provide an insulating member disposed in the recess. In this case, since the electrode can be supported by the insulating member, even when the power supply terminal is pressed against the electrode, the electrode is prevented from being deformed to the arrangement surface side according to the pressing. Therefore, the contact point of the power supply terminal with respect to the electrode can be strengthened, and the contact point of the power supply terminal with respect to the electrode can be stably secured even if vibration or the like occurs.

  Moreover, it is preferable that the electrode is provided with a stress absorbing portion that absorbs stress applied to the package body when a power feeding terminal is pressed against the electrode. In this case, the pressing force of the power supply terminal against the electrode can be increased by the amount that can absorb the stress applied to the package body. Therefore, the contact point of the power supply terminal with respect to the electrode can be strengthened, and the contact point of the power supply terminal with respect to the electrode can be stably secured even if vibration or the like occurs.

  As described above, according to the present invention, a light source unit that can suppress a reduction in the amount of light emitted to the outside is provided.

It is sectional drawing which shows the outline of the lamp in 1st Embodiment. FIG. 2 is an exploded view showing components of the lamp unit in FIG. 1 in an exploded manner. It is sectional drawing which shows a part of light source unit of FIG. It is a figure which shows the mode of a through-hole and an electrode at the time of seeing a placement surface from the direction orthogonal to the placement surface of a 1st plate. It is sectional drawing which shows the lamp unit of FIG. It is sectional drawing which shows the light source unit in 2nd Embodiment from the same viewpoint as FIG. It is a figure which shows the mode of a recessed part and an electrode when the arrangement | positioning surface is seen from the direction orthogonal to the arrangement | positioning surface of a 1st plate. It is sectional drawing which shows the light source unit in 3rd Embodiment from the same viewpoint as FIG. It is sectional drawing which shows the light source unit in 4th Embodiment from the same viewpoint as FIG. It is a figure which shows a mode that the insulating member is attached in the cross section of the direction orthogonal to the cross section of FIG. It is a perspective view which shows the light source package in 5th Embodiment. It is sectional drawing which shows the light source unit in 5th Embodiment from the same viewpoint as FIG. It is a figure which shows the heat radiating member of the light source unit in 6th Embodiment. It is sectional drawing which shows the light source unit in 6th Embodiment from the same viewpoint as FIG. It is a figure which shows the modification of a heat radiating member.

  EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing the vehicle headlamp which concerns on this invention is illustrated with an accompanying drawing. The embodiments exemplified below are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The present invention can be modified and improved from the following embodiments without departing from the spirit of the present invention.

(1) 1st Embodiment FIG. 1: is sectional drawing which shows the outline of the lamp in 1st Embodiment. As shown in FIG. 1, the lamp 1 of the present embodiment is a lamp used in a vehicle and is a vehicle headlamp disposed in front of the vehicle. The lamp 1 includes a housing 10 and a lamp unit LPU accommodated in the housing.

  The housing 10 includes a translucent cover 11 and a housing 12 as main components. The translucent cover 11 and the housing 12 are a set of members that form the lamp chamber LR. The translucent cover 11 and the housing 12 are combined so as to close the opening of the translucent cover 11 and the opening of the housing 12. A lamp chamber LR is formed.

  A lamp unit LPU is accommodated in the lamp chamber LR, and the lamp unit LPU is fixed to, for example, the housing 12 by a predetermined fixture. The lamp unit LPU includes a light source unit LSU and a reflector unit RFU. The light source unit LSU includes a light source package 20, a power supply attachment 30, and a heat dissipation member 40, and the reflector unit RFU includes a reflector 50 and a reflector support portion 60.

  2 is an exploded view showing each component of the lamp unit in FIG. 1, and FIG. 3 is a cross-sectional view showing a part of the light source unit in FIG. As shown in FIG. 2, the light source package 20 includes a package body 21, a pair of electrodes 22, and a pair of screwing plates 23.

  As shown in FIG. 3, the package body 21 has a semiconductor light emitting element 25 mounted on a metal substrate 24, and a cylindrical side wall 26 is disposed over the entire circumference of the semiconductor light emitting element 25. Examples of the semiconductor light emitting element 25 include an LED (Light Emitting Diode), an LD (Laser Diode), and an organic EL (Electro Luminescence). A space surrounded by the side wall 26 and the metal substrate 24 is filled with a light-transmitting sealing resin 27. As described above, the package body 21 of the present embodiment accommodates the semiconductor light emitting element 25 in the space surrounded by the metal substrate 24 and the side wall 26, and covers the semiconductor light emitting element 25 with the sealing resin 27. In FIG. 1, the cross section of the package body 21 is omitted for convenience. Instead of the light-transmitting sealing resin 27, a white resin obtained by kneading light scattering powder into a transparent resin may be employed. Examples of the light scattering powder include alumina, tungsten oxide, and silicon dioxide (silica). When a white resin is employed, a white resin is formed in the space surrounded by the side wall 26 and the metal substrate 24 so that the light emitting portion of the semiconductor light emitting element 25 is exposed and the portions other than the light emitting portion are sealed. Is placed.

  Each of the pair of electrodes 22 has a plate shape including a first surface F1 facing the arrangement surface 41A side of the heat dissipation member 40 and a second surface F2 opposite to the first surface F1. In the present embodiment, the pair of electrodes 22 includes an outer portion extending outward from the side wall 26 of the package body 21, an inner wall portion extending inside the side wall 26, and a bottom surface inside the side wall 26. And an inner portion extending to the side. The cathode of the semiconductor light emitting element 25 is connected to one inner part of the pair of electrodes 22 by a wire 28, and the anode of the semiconductor light emitting element 25 is connected to the other inner part of the pair of electrodes 22 by a wire 28. A space between the inner portion of the electrode 22 and the metal substrate 24 of the package body 21 is filled with a non-light transmissive resin 29.

  As shown in FIG. 2, the pair of screwing plates 23 are portions fixed by screws to the heat radiating member 40, and sandwich the package body 21 in a direction substantially orthogonal to the extending direction of the electrodes 22. Projecting from the side wall 26 of the package body 21. One of the pair of screwing plates 23 is provided with a screw hole 23O corresponding to a predetermined screw along the thickness direction of the screwing plate 23, and the other of the pair of screwing plates 23 is provided with a screwing plate 23. A notch 23 </ b> C is provided through which a shaft portion of a predetermined screw can be inserted along the thickness direction.

  In the light source package 20 of the present embodiment, the surface of the metal substrate 24 opposite to the surface on which the semiconductor light emitting element 25 is mounted is the bottom surface of the package body 21, and the bottom surface of the package body 21 and the first of the electrodes 22. The plane F1 is substantially the same plane and is in the same plane. However, the 1st surface F1 does not need to be arrange | positioned on the same plane as one surface of the metal substrate 24 like this embodiment. For example, the first surface F1 may be separated from the arrangement surface 41A of the heat dissipation member 40 by providing a step with respect to the metal substrate 24. The surface of the semiconductor light emitting element 25 opposite to the surface mounted on the metal substrate 24 is the light emitting surface of the semiconductor light emitting element 25. The light source package 20 is arranged such that the light emitting surface is located below the lamp 1.

  The power supply attachment 30 is a power supply component that supplies power from an external power supply that is a power supply provided outside, and includes a pair of power supply lines 31 and a covering member 32 as shown in FIG. The power supply line 31 is a plate-like conductive member that transmits a current supplied from an external power source, and has elasticity.

  The covering member 32 includes a covering sheet portion 33, a connector portion 34, and a pair of screwing plates 35. The covering sheet portion 33 is a sheet-like insulating member that covers an intermediate portion of the power supply line 31 and is a substantially rectangular parallelepiped in the present embodiment. An intermediate portion of the power supply line 31 is a portion sandwiched between a power supply terminal 31 </ b> A that is one end of the power supply line 31 and a connector terminal 31 </ b> B that is the other end of the power supply line 31. Examples of the material of the covering member 32 include polycarbonate and polyethylene terephthalate. The covering sheet portion 33 is provided with an opening 33 </ b> O that penetrates the covering sheet portion 33 along the thickness direction of the covering sheet portion 33, and the power supply terminal 31 </ b> A of the power supply line 31 is exposed from the covering sheet portion 33 in the opening 33 </ b> O. doing. In the present embodiment, the thickness direction of the covering sheet portion 33 corresponds to the vertical direction of the lamp 1.

  The connector portion 34 is provided so as to protrude from, for example, a corner region on one surface of the covering sheet portion 33 in a direction substantially orthogonal to the surface, and has an opening 34O into which an external connector is fitted. In the opening 34 </ b> O of the connector portion 34, the connector terminal 31 </ b> B of the power supply line 31 is exposed from the covering sheet portion 33. In the present embodiment, one surface of the covering sheet portion 33 provided with the connector portion 34 is disposed on the lamp 1 as a lower surface.

  The pair of screwing plates 35 are parts fixed to the heat radiating member 40 with screws, and protrude from the substantially central portion of the end portion in the short direction of the covering sheet portion 33 so as to sandwich the covering sheet portion 33. Yes. Each of the pair of screwing plates 35 is provided with a screw hole 35O corresponding to a predetermined screw along the thickness direction of the screwing plate 35.

  The heat radiating member 40 is a member that radiates heat generated by light emission from the semiconductor light emitting element 25 of the package body 21, and is a metal plate in the present embodiment. The heat radiating member 40 is bent at a predetermined portion and is formed in an L shape, and includes a first plate 41 and a second plate 42 that is substantially orthogonal to the first plate 41. The longitudinal direction of the first plate 41 is the front of the lamp 1, and the surface of the first plate 41 on the lower side of the lamp 1 is the arrangement surface 41A. The placement surface 41A is a surface on the side where the light source package 20, the power supply attachment 30, and the reflector support portion 60 are placed. In addition, the radiation fin may be provided in the surface opposite to the arrangement surface 41 </ b> A in the first plate 41.

  The first plate 41 is provided with a through-hole 43 that penetrates from the placement surface 41A to the surface opposite to the placement surface 41A. The first plate 41 has a screw hole 44O corresponding to a screw for fixing the light source package 20, a screw hole 45O corresponding to a screw for fixing the power supply attachment 30, and a screw corresponding to a screw for fixing the reflector support portion 60. A hole 46O and a pin hole 46P corresponding to a pin for positioning the reflector support portion 60 are provided.

  The reflector 50 is an optical member having a surface facing the front of the lamp 1 as the reflecting surface 51. At the reflecting surface 51, at least a part of light emitted from the semiconductor light emitting element 25 (FIG. 3) of the light source package 20 is reflected forward of the lamp 1.

  The reflecting surface 51 is curved so that the front side of the lamp 1 is inward, and has a concave shape formed of a free curved surface based on a parabola, for example. More specifically, the shape of the reflecting surface 51 in the vertical section is a shape below the apex of the parabola, and the shape of the reflecting surface 51 in the horizontal section is a shape including the apex of the parabola. . However, the parabola in the vertical cross section of the reflecting surface 51 and the parabola in the horizontal cross section may be different from each other. Moreover, the shape of the cross section in the horizontal direction may not be a parabola, and may be a part of an ellipse, for example.

  The reflector support portion 60 is a member that supports the reflector 50. The reflector support portion 60 may be formed integrally with the reflector 50, or the reflector and 50 may be separate. The reflector support portion 60 of the present embodiment has a base portion 61 and a plurality of support columns 62 to 64. The base portion 61 has, for example, a plate shape, and the base portion 61 is provided with a notch 61A from one end portion in the short direction toward the other end portion. In this embodiment, the notch 61 </ b> A extends substantially between the reflector 50 and the other end of the base part 61, beyond the substantially central region of the reflector 50 where the base part 61 is disposed.

  Each of the plurality of support columns 62 to 64 is fixed to a surface of the base portion 61 opposite to the surface to which the reflector 50 is fixed. In the present embodiment, the support column 62 is located between one end portion in the longitudinal direction of the base portion 61 and the notch 61A, and between the other end portion in the longitudinal direction of the base portion 61 and the notch 61A. The column part 63 is located on the side. Moreover, the support | pillar part 64 is located between the one end part of the transversal direction of the base part 61, and the notch 61A. The pillars 62 and 63 are provided with pins 62A and 63A inserted through the pin holes 46P of the first plate 41, and the pillar 64 is a screw corresponding to a predetermined screw along the height direction of the pillar 64. A hole 64O is provided. The height of the column portions 62 to 64 is set to be equal to or higher than the height of the connector portion 34 from one surface of the covering sheet portion 33 in the power supply attachment 30.

  The light source package 20, the power supply attachment 30, and the reflector support portion 60 are fixed to the first plate 41 of the heat radiating member 40. That is, a predetermined screw is screwed into the screw hole 23O of the light source package 20 and the screw hole 44O of the first plate 41 in order, and a shaft of the predetermined screw is inserted into the notch 23C of the light source package 20, and the screw is the first screw. 1 plate 41 is screwed into the screw hole 44O. Thereby, the package body 21 in the light source package 20 is fixed to the arrangement surface 41 </ b> A side of the first plate 41.

  When the package main body 21 is fixed to the first plate 41, as shown in FIG. 3, the metal substrate 24 in the package main body 21 contacts the arrangement surface 41A of the first plate 41, and the heat generated in the semiconductor light emitting element 25 is dissipated. The member 40 can be conducted to the member 40. In this case, the through hole 43 of the first plate 41 is located on the first surface F1 side of the electrode 22 in the light source package 20, and the first surface F1 faces the opening on the arrangement surface 41A side of the through hole 43. doing. That is, the electrode 22 and the through hole 43 overlap in a direction orthogonal to the arrangement surface 41A of the first plate 41, and when the arrangement surface 41A is viewed from the direction orthogonal to the arrangement surface 41A, as shown in FIG. The electrode 22 is located inside the outer edge 43 </ b> A of the through hole 43.

  Further, as shown in FIG. 5, a predetermined screw is sequentially screwed into the screw hole 35 </ b> O of the power supply attachment 30 and the screw hole 45 </ b> O of the first plate 41, so that the covering sheet portion 33 in the power supply attachment 30 is first. The plate 41 is fixed to the arrangement surface 41A side.

  When the covering sheet portion 33 is fixed to the first plate 41, the light source package 20 fixed on the arrangement surface 41A of the heat radiating member 40 is disposed in the opening 33O of the covering sheet portion 33. In this case, the second surface F2 side of the electrode 22 of the light source package 20 is pressed by the power supply terminal 31A exposed to the opening 33O of the covering sheet portion 33. That is, the second surface F2 side of the electrode 22 includes a power feeding unit that can supply power from the power feeding terminal 31A.

  Further, in the state where the pins 62A and 63A of the support columns 62 and 63 in the reflector support unit 60 are inserted into the pin holes 46P of the first plate 41, the support columns 62 and 63 and the first plate 41 are bonded by, for example, an adhesive. The In addition, predetermined screws are sequentially screwed into the screw holes 64O of the support column 64 and the screw holes 46O of the first plate 41. Thereby, the reflector support part 60 is fixed to the arrangement surface 41 </ b> A side of the first plate 41.

  When the reflector support portion 60 is fixed to the first plate 41, the light source package 20 and the power supply attachment 30 fixed on the arrangement surface 41A of the heat radiating member 40 in the notch 61A of the base portion 61 in the reflector support portion 60. Is placed. Further, in this case, the upper end of the reflector 50 is located at the rear position of the light source package 20 on the lower surface of the base portion 61, and the reflector 50 hangs forward from that position. Furthermore, in this case, since the height of the support column portions 62 to 64 is equal to or higher than the height of the connector portion 34 from one surface of the covering sheet portion 33, the connector portion 34 protrudes from the notch 61 </ b> A of the base portion 61 toward the reflector 50. Is prevented. Therefore, the light emitted from the semiconductor light emitting element 25 of the light source package 20 is prevented from being blocked by the connector portion 34.

  As described above, in the light source unit LSU of the present embodiment, the package main body 21 in which the semiconductor light emitting element 25 is accommodated, and the electrode 22 connected to the semiconductor light emitting element 25 and extending outward from the side wall 26 of the package main body 21. A light source package 20 is provided. Further, the light source unit LSU of the present embodiment is provided with a heat radiating member 40 having an arrangement surface 41A on which the light source package 20 is arranged. The package body 21 in the light source package 20 is fixed to the arrangement surface 41 </ b> A side in a state where heat generated in the semiconductor light emitting element 25 can be conducted to the heat radiating member 40, and the electrode 22 in the light source package 20 is separated from the heat radiating member 40.

  In the case of this embodiment, the heat radiating member 40 has a through hole 43 that penetrates from the arrangement surface 41A to the opposite side of the arrangement surface 41A, and the first hole 22 of the electrode 22 is formed in the opening of the through hole 43 on the arrangement surface 41A side. The surface F1 is opposed. As described above, in this embodiment, the lower side of the electrode 22 is the space of the through hole 43, so that the electrode 22 and the heat dissipation member 40 are separated from each other. For this reason, even if the electrode 22 is arrange | positioned at the side of the light source package 20, it is insulated from the heat radiating member 40. In addition, since the electrode 22 is disposed outside the side wall 26 of the package body 21, light emission from the semiconductor light emitting element 25 is achieved as compared with the case where the electrode 22 is disposed in a direction along the side wall 26 of the package body 21. The light to be blocked by the electrode 22 is reduced. Thus, a light source unit LSU that can suppress a reduction in the amount of light emitted to the outside is provided.

  The electrode 22 has a plate shape including a first surface F1 facing the arrangement surface 41A side of the heat radiating member 40 and a second surface F2 opposite to the first surface F1. The surface F2 side includes a power feeding unit that can supply power from the power feeding terminal 31A.

  Further, in the package body 21 of the present embodiment, the metal substrate 24 on which the semiconductor light emitting element 25 is disposed is in direct contact with the heat radiating member 40 without an insulating member interposed. For this reason, compared with the case where the metal substrate 24 is arrange | positioned through the insulating member with respect to the heat radiating member 40, the heat dissipation in the heat radiating member 40 with respect to the heat | fever which generate | occur | produces in the semiconductor light-emitting element 25 can be raised, and only by that much The drive current for driving the semiconductor light emitting element 25 can be increased.

(2) Second Embodiment Next, a light source unit LSU in the second embodiment will be described. In addition, about the component in the light source unit LSU of this embodiment, the same or equivalent component as 1st Embodiment attaches | subjects the same referential mark as 1st Embodiment, and the description which overlaps with the said 1st Embodiment is given. Omitted as appropriate.

  FIG. 6 is a cross-sectional view showing the light source unit in the second embodiment from the same viewpoint as FIG. In the light source unit LSU of this embodiment, the structure of the 1st plate 41 in the heat radiating member 40 differs from 1st Embodiment. That is, in the first embodiment, the through hole 43 is provided in the first plate 41, whereas in the present embodiment, the concave portion 71 is provided in the first plate 41.

  The recess 71 is a portion that is recessed from the placement surface 41 </ b> A toward the surface opposite to the placement surface 41 </ b> A, and an insulating member 72 is placed in a space surrounded by the inner wall of the recess 71. The insulating member 72 has a substantially rectangular parallelepiped shape, and has a protruding portion 72A that protrudes outward from the opening of the recess 71. The opening of the recess 71 is a portion surrounded by the tip on the inner peripheral surface side of the recess 71, and the opening surface of the recess 71 is located on the same surface as the arrangement surface 41 </ b> A of the first plate 41 in this embodiment. To do. Examples of the material of the insulating member 72 include a cured resin typified by a thermosetting resin or a photo-curing resin, or a resin such as a thermoplastic resin.

  In the first embodiment, the metal substrate 24 in the package body 21 is in contact with the arrangement surface 41A of the first plate 41. In the present embodiment, the thermal conductivity is provided between the metal substrate 24 and the arrangement surface 41A. The adhesive 73 is disposed.

  The height of the adhesive 73 is approximately the same as the protrusion 72A of the insulating member 72. In addition, the height of the protrusion 72A of the insulating member 72 is approximately the same as the height from the arrangement surface 41A of the first plate 41 as described above. As described above, the adhesive 73 not only fixes the metal substrate 24 and the first plate 41 and transmits heat generated in the semiconductor light emitting element 25, but also the light source package 20 has the arrangement surface 41A of the first plate 41. It is a member which adjusts the height with the insulating member 72 so that it may be supported substantially in parallel. In the present embodiment, the pair of screwing plates 23 in the light source package 20 and the screw holes 44O in the heat dissipation member 40 may be omitted.

  In such a light source unit LSU, when the package body 21 of the light source package 20 is fixed to the first plate 41, the concave portion 71 of the first plate 41 is disposed on the first surface F 1 side of the electrode 22 in the light source package 20. Is located, and the first surface F1 faces the opening side of the recess 71. That is, when the electrode 22 and the recess 71 overlap in a direction orthogonal to the arrangement surface 41A of the first plate 41 and the arrangement surface 41A is viewed from the direction orthogonal to the arrangement surface 41A, as shown in FIG. The electrode 22 is located inside the edge 71 </ b> A of the opening of the recess 71.

  The electrode 22 is supported by an insulating member 72 disposed in the recess 71 of the first plate 41. For this reason, even if the electrode 22 is pressed against the first plate 41 by the power supply terminal 31A of the power supply attachment 30, the electrode 22 is prevented from being deformed toward the first plate 41 according to the pressing. Therefore, the contact point of the power supply terminal 31A with respect to the electrode 22 can be strengthened, and the contact point of the power supply terminal 31A with respect to the electrode 22 can be stably secured even if vibration or the like occurs.

  In the case of the present embodiment, an adhesive 73 that bonds the first plate 41 and the package body 21 of the light source package 20 supports the light source package 20 together with the insulating member 72 substantially parallel to the arrangement surface 41A. Therefore, the adhesive 73 not only simply bonds the metal substrate 24 and the first plate 41, but also the insulating member 72 so that the light source package 20 is supported substantially parallel to the arrangement surface 41A of the first plate 41. It can also serve as a member that adjusts the height of the head, and the number of parts can be reduced accordingly.

  In the present embodiment, the insulating member 72 and the adhesive 73 may be omitted. However, as described above, in order to strengthen the contact point of the power supply terminal 31A with the electrode 22 and reduce the number of parts, it is preferable that the insulating member 72 and the adhesive 73 are provided.

(3) Third Embodiment Next, a light source unit LSU in a third embodiment will be described. In addition, about the component in the light source unit LSU of this embodiment, the same or equivalent component as 1st Embodiment attaches | subjects the same referential mark as 1st Embodiment, and the description which overlaps with the said 1st Embodiment is given. Omitted as appropriate.

  FIG. 8 is a sectional view showing the light source unit in the third embodiment from the same viewpoint as FIG. In the light source unit LSU of the present embodiment, the through hole 43 of the first plate 41 is filled with an insulating member 74. Examples of the material of the insulating member 74 include a cured resin typified by a thermosetting resin or a photo-curing resin, or a resin such as a thermoplastic resin.

  In such a light source unit LSU, when the package body 21 of the light source package 20 is fixed to the first plate 41, the electrode 22 in the light source package 20 is the same as the arrangement surface 41A of the first plate 41 by the insulating member 74. Supported at a height. For this reason, even if the electrode 22 is pressed against the first plate 41 by the power supply terminal 31A of the power supply attachment 30, the electrode 22 is prevented from being deformed toward the first plate 41 according to the pressing. Therefore, the contact point of the power supply terminal 31A with respect to the electrode 22 can be strengthened, and the contact point of the power supply terminal 31A with respect to the electrode 22 can be stably secured even if vibration or the like occurs.

(4) 4th Embodiment Next, the light source unit LSU in 4th Embodiment is demonstrated. In addition, about the component in the light source unit LSU of this embodiment, the same or equivalent component as 1st Embodiment attaches | subjects the same referential mark as 1st Embodiment, and the description which overlaps with the said 1st Embodiment is given. Omitted as appropriate.

  FIG. 9 is a cross-sectional view showing the light source unit in the fourth embodiment from the same viewpoint as FIG. 3, and FIG. 10 is a view showing a state in which an insulating member is attached in a cross section perpendicular to the cross section of FIG. is there. As shown in FIGS. 9 and 10, in the light source unit LSU of this embodiment, an insulating member 80 is newly provided, and the insulating member 80 is attached to the first plate 41. In addition, the through hole 43 has a substantially rectangular parallelepiped shape in the present embodiment, and a cross-section in the direction along the short side of the through hole 43 is shown in FIG. 9, and the direction in the direction along the long side of the through hole 43 is shown. A cross section is shown in FIG.

  The insulating member 80 is an insulating member having a tube portion 81, a first hook portion 82, a second hook portion 83, and a closing portion 84. The tube portion 81 is a tubular member that can be inserted into the through hole 43 of the first plate 41, and the outer peripheral surface of the tube portion 81 is in contact with the inner peripheral surface of the through hole 43 without a gap. The first hook portion 82 is a member that is provided on one end side of the tube portion 81 and is hooked on the opening edge of the first plate 41 on the arrangement surface 41 </ b> A side. The second hook portion 83 is a member that is provided on the other end portion side of the tube portion 81 and is hooked on the opening edge on the surface side opposite to the arrangement surface 41 </ b> A of the first plate 41. The closing portion 84 is a member that closes the inner space of the tube portion 81, and is, for example, a plate-like member that extends along a direction substantially orthogonal to the longitudinal direction of the tube portion 81.

  The blocking portion 84 of the present embodiment has an electrode support portion 85 on the surface side on the first hook portion 82 side. The surface of the electrode support portion 85 on the first hook portion 82 side is an electrode arrangement surface 85A on which the electrode 22 of the light source package 20 is disposed, and is higher than the surface 84A of the closing portion 84 on the first hook portion 82 side. Yes.

  In the present embodiment, a thermally conductive adhesive 86 is disposed between the metal substrate 24 and the placement surface 41A. The height of the adhesive 86 is approximately the same as the height of the electrode support portion 85. The height of the electrode support portion 85 is the distance between the surface 84A of the closing portion 84 and the electrode arrangement surface 85A of the electrode support portion 85. As described above, the adhesive 86 not only fixes the metal substrate 24 and the first plate 41 and transmits heat generated in the semiconductor light emitting element 25, but also the light source package 20 has the arrangement surface 41A of the first plate 41. It is a member that adjusts the height of the electrode support portion 85 so that it is supported substantially in parallel. In the present embodiment, the pair of screwing plates 23 in the light source package 20 and the screw holes 44O in the heat dissipation member 40 may be omitted.

  In such a light source unit LSU, the insulating member 80 is fixed to the through hole 43 of the first plate 41. That is, the pipe portion 81 is inserted into the through hole 43 of the first plate 41, and the first hook portion 82 on one end side and the second hook portion 83 on the other end side of the pipe portion 81 sandwich the first plate 41. It is hung on the opening edges at both ends of the through hole 43.

  In a state where the insulating member 80 is fixed to the through hole 43 of the first plate 41, a part of the electrode 22 of the light source package 20 is arranged on the electrode arrangement surface 85 </ b> A of the electrode support portion 85, and the package body 21 is bonded to the adhesive 86. To be fixed to the first plate 41. In this state, since the electrode 22 is supported by the electrode support portion 85 of the insulating member 80, even if the electrode 22 is arranged on the side of the light source package 20 as in the first embodiment, Can be insulated. Further, even when the electrode 22 is pressed against the first plate 41 side by the power supply terminal 31A of the power supply attachment 30, the deformation of the electrode 22 toward the first plate 41 according to the pressing is reduced. Therefore, the contact point of the power supply terminal 31A with respect to the electrode 22 can be strengthened.

  In the case of the present embodiment, an adhesive 86 that bonds the first plate 41 and the package body 21 of the light source package 20 supports the light source package 20 together with the electrode support portion 85 substantially parallel to the arrangement surface 41A. Therefore, the adhesive 86 not only simply bonds the metal substrate 24 and the first plate 41 but also the electrode support portion 85 so that the light source package 20 is supported substantially parallel to the arrangement surface 41A of the first plate 41. The number of parts can be reduced by that amount.

  The electrode support portion 85 of the insulating member 80 is omitted, and the first surface F1 of the electrode 22 of the light source package 20 fixed on the arrangement surface 41A of the first plate 41 and the surface 84A of the closing portion 84 are separated from each other. In this way, a closing portion 84 may be provided.

  In this case, the electrode 22 and the blocking portion 84 are insulated with the space between the electrode 22 and the blocking portion 84 being separated. Further, an insulating member different from the insulating member 80 may be disposed in the space between the electrode 22 and the closing portion 84.

(5) Fifth Embodiment Next, a light source unit LSU in a fifth embodiment will be described. In addition, about the component in the light source unit LSU of this embodiment, the same or equivalent component as 1st Embodiment attaches | subjects the same referential mark as 1st Embodiment, and the description which overlaps with the said 1st Embodiment is given. Omitted as appropriate.

  FIG. 11 is a perspective view showing a light source package in the fifth embodiment, and FIG. 12 is a sectional view showing the light source unit in the fifth embodiment from the same viewpoint as FIG. As shown in FIG. 11, the electrode 22 of the light source package 20 in the present embodiment is provided with a stress absorbing portion 90 that absorbs stress applied to the package body 21 in response to the pressing of the power supply terminal 31A.

  In this embodiment, the stress absorbing portion 90 is formed as a cutout portion 91 cut out along a direction substantially orthogonal to the extending direction in which the electrode 22 extends outward from the side wall 26 of the package body 21. . In the notch 91, the amount of deformation deformed in response to the pressing by the power supply terminal 31 </ b> A is larger than that of other electrode parts other than the notch 91. For this reason, the force transmitted from the electrode 22 to the package body 21 is reduced by the amount of deformation of the notch 91. Thus, the stress applied to the package body 21 by the power supply terminal 31 </ b> A being pressed against the electrode 22 is absorbed by the notch 91. For this reason, the pressing force of the power supply terminal 31 </ b> A against the electrode 22 can be increased by the amount that can absorb the stress applied to the package body 21. Therefore, the contact point of the power supply terminal 31A with respect to the electrode 22 can be strengthened, and the contact point of the power supply terminal 31A with respect to the electrode 22 can be stably secured even if vibration or the like occurs.

  In the present embodiment, as shown in FIG. 12, the stress absorbing portion 90 is provided between the contact point where the power supply terminal 31 </ b> A is in contact with the electrode 22 and the side wall 26 of the package body 21. The electrode portion on the contact side of the stress absorbing portion 90 is supported by the first plate 41 of the heat radiating member 40 via a film-like insulating sheet 92, and the concave portion 93 is provided from the stress absorbing portion 90 to the first plate 41 side. A space is formed. For this reason, the notch 91 of the electrode 22 can be deformed so as to bend into the space of the recess 93 in accordance with the pressing by the power supply terminal 31 </ b> A. Therefore, the force transmitted from the electrode 22 to the package body 21 can be further reduced by the amount of deformation of the notch 91 as compared with the case where the space of the recess 93 is not formed.

  Instead of the recesses 93 of the present embodiment, the first plate 41 may be provided with a through hole penetrating from the placement surface 41A to the surface opposite to the placement surface 41A. Moreover, the recessed part 93 of this embodiment may be abbreviate | omitted. Even in the case where the concave portion 93 is omitted, in the present embodiment, as long as the stress absorbing portion 90 is provided in the electrode 22, the stress applied to the package body 21 can be absorbed.

(6) Sixth Embodiment Next, a light source unit LSU in a sixth embodiment will be described. In addition, about the component in the light source unit LSU of this embodiment, the same or equivalent component as 2nd Embodiment is attached | subjected with the same referential mark as 1st Embodiment, and the description which overlaps with the said 1st Embodiment is given. Omitted as appropriate.

  FIG. 13 is a view showing a heat radiating member of the light source unit in the sixth embodiment, and FIG. 14 is a sectional view showing the light source unit in the sixth embodiment from the same viewpoint as FIG. As shown in FIGS. 13 and 14, in the light source unit LSU of the present embodiment, excess adhesive 73 is taken into the first plate 41 of the heat dissipation member 40 between the heat conductive adhesive 73 and the electrode 22. This is different from the second embodiment in that a capturing unit 100 is newly provided.

  In the present embodiment, the take-in portion 100 is formed as a groove portion 101 that is recessed from one end portion in the longitudinal direction of the first plate 41 to the other end portion along the short direction of the first plate 41. In this groove part 101, it is dented toward the surface on the opposite side to 41 A of arrangement | positioning surfaces from 41 A of arrangement | positioning surfaces. For this reason, when the heat conductive adhesive 73 flows toward the electrode 22 between the metal substrate 24 and the arrangement surface 41 </ b> A, the flowed adhesive 73 is stored in the groove portion 101. Thus, excess adhesive 73 is taken up by the groove 101. Therefore, it is reduced that the excessive adhesive 73 reaches the electrode 22 and is short-circuited.

  In addition, the groove part 101 may be formed along the direction which intersects the transversal direction of the 1st plate 41. FIG. Further, the groove portion 101 may be formed only in a part between the one end portion in the longitudinal direction of the first plate 41 and the other end portion. Furthermore, instead of the groove portion 101, one or a plurality of through holes penetrating from the placement surface 41 </ b> A to the surface opposite to the placement surface 41 </ b> A is a first plate of the heat radiation member 40 between the adhesive 73 and the electrode 22. 41 may be provided. In short, it suffices that at least a part of the region of the heat dissipation member 40 between the heat conductive adhesive 73 and the electrode 22 is provided with a taking-in portion made of a recess or a through hole.

(7) Modifications Although the present invention has been described above by taking the above embodiment as an example, the present invention is not limited thereto.

  For example, in the above embodiment, the heat radiation member 40 is configured by the first plate 41 and the second plate 42. However, the second plate 42 may be omitted. When the second plate 42 is omitted, for example, the surface of the first plate 41 opposite to the arrangement surface 41A is fixed to the housing 10 with a predetermined fixing tool. Further, the heat radiating member 40 is configured by the first heat radiating member constituted by the first plate 41 and the second plate 42 and the second heat radiating member arranged on the arrangement surface 41A of the first plate 41. Also good.

  An example shown in FIG. 15 is given as the second heat radiating member. The second heat dissipating member shown in FIG. 15 is, for example, plate-shaped, and the first disposing portion 111 where the package body 21 of the light source package 20 is disposed and the second disposing portion where the electrode 22 of the light source package 20 is disposed. And an arrangement portion 112. The first placement portion 111 is provided with a screw hole 111O corresponding to the screw hole 23O of the light source package 20, and a notch 111C corresponding to the notch 23C of the light source package 20. Note that the screwing plate 23 is omitted in the light source package 20 shown in FIG.

  A first insulating member 113 and a second insulating member 114 are attached to the second arrangement portion 112, and the electrode 22 is supported by the first insulating member 113 and the second insulating member 114. The support surface that supports the electrode 22 in the first insulating member 113 and the second insulating member 114 and the arrangement surface on which the package body 21 is arranged in the first arrangement portion 111 are located on the same level. Yes.

  The electrode 22 of the light source package 20 shown in FIG. 14 is provided with a stress absorbing portion 90, and the stress absorbing portion 90 is not supported by the first insulating member 113 and the second insulating member 114. It is. In this part, the amount of deformation deformed in response to pressing by the power supply terminal 31A is larger than that of the electrode portion supported by the first insulating member 113 and the second insulating member 114, and the electrode 22 is correspondingly increased. Therefore, the force transmitted to the package main body 21 is reduced. As shown in FIG. 14, the stress absorbing part 90 can be obtained with a configuration different from the notch part 91 of the fifth embodiment.

  Moreover, in the said embodiment, the bottom face of the package main body 21 in the light source package 20 and the 1st surface F1 of the electrode 22 were located on the same surface. However, the first surface F1 of the electrode 22 may be located above or below the bottom surface of the package body 21.

  Further, in the above embodiment, the electrode 22 extends to the outer side extending from the side wall 26 of the package body 21, the inner wall portion extending inside the side wall 26, and the bottom surface inside the side wall 26. And an inner part present. However, the inner part may be omitted.

  ADVANTAGE OF THE INVENTION According to this invention, the light source unit which can suppress that the light quantity of the light radiate | emitted to a part reduces is provided, and can be utilized in the field | area using a lamp, such as the field | area of a motor vehicle.

DESCRIPTION OF SYMBOLS 1 ... Lamp 10 ... Case 20 ... Light source package 21 ... Package main body 22 ... Electrode F1 ... 1st surface F2 ... 2nd surface 30 ... Power feeding attachment 31 ... Feed line 31A ... Feed terminal 32 ... Cover member 40 ... Heat radiation member 41 ... First plate 41A ... Arrangement surface 42 ... Second plate 43 ... Through hole 50 ... Reflector 51 ... Reflecting surface 60 ... Reflector support part 61 ... Base part 62-64 ... Post part 71 ... Recess 72, 74 ... Insulating member 73 ... Adhesion Agent 80 ... Insulating member 81 ... Tube part 82 ... First hook part 83 ... Second hook part 84 ... Closure part 85 ... Electrode support part 90 ... Stress absorption part 91 ... Notch 92 ... Insulating sheet 93 ... Recess 100 ... Taking-in part 1 1 ... groove 111 ... first placement unit 112 ... second arrangement section 113 ... first insulating member 114 ... second insulating member

Claims (7)

A package body in which a semiconductor light emitting element is accommodated, and a light source package having an electrode connected to the semiconductor light emitting element and extending outward from a side wall of the package body;
A heat dissipating member having an arrangement surface on which the light source package is arranged;
With
The package body is fixed to the arrangement surface side in a state where heat generated in the semiconductor light emitting element can be conducted to the heat radiating member,
The light source unit, wherein the electrode is separated from the heat dissipation member. The electrode has a plate shape including a first surface facing the arrangement surface side and a second surface opposite to the first surface;
The light source unit according to claim 1, wherein the second surface side includes a power feeding unit capable of supplying power from a power feeding terminal. The heat dissipating member has a through hole penetrating from the arrangement surface to the opposite side of the arrangement surface,
The light source unit according to claim 2, wherein the electrode is located inside the through hole when the arrangement surface is viewed from the direction orthogonal to the arrangement surface. The heat dissipation member has a recess that is recessed from the placement surface toward the opposite side of the placement surface,
3. The light source unit according to claim 2, wherein the electrode is positioned inside the recess when the arrangement surface is viewed from the direction orthogonal to the arrangement surface. 4. The light source unit according to claim 1, further comprising an insulating member arranged between the electrode and the arrangement surface. The light source unit according to claim 4, further comprising an insulating member disposed in the recess. 2. The light source unit according to claim 1, wherein the electrode is provided with a stress absorbing portion that absorbs stress applied to the package body when a power supply terminal is pressed against the electrode. 3.

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