JP2018022793A - Electronic component and electronic device using the same - Google Patents

Abstract

To provide a highly reliable electronic component by preventing breakage of a terminal due to vibration. A body having a coil element therein, an end of the coil element pulled out from the side of the body and bent from the side to the bottom, and an end of the coil element made of a metal plate A holding member 24 for holding the first side surface portion 29, a second side member 29, and a second side member 23, which are spaced from each other on both sides of the end portion 23 of the coil element in a portion facing the side surface of the body 22. The first and second side surfaces 29 and 30 are connected to each other at a portion opposed to the bottom surface of the body 22 and a bottom portion to which the end 23 of the coil element is fixed. The width of the side portions 29, 30 is made larger than the width of the end portion 23 of the coil element, and the end portion 23 of the coil element has a bent portion 42 protruding outward beyond the first and second side portions 29, 30. To Those digits. [Selection diagram] Fig. 1

Description

  The present invention relates to an electronic component used in various electronic devices and an electronic device using the same.

  In recent years, electronic control of automobile drive systems and control systems has been increasingly advanced, and a large number of electronic control devices have been installed in a single automobile, and further downsizing and higher reliability of electronic control devices are desired. It is rare.

  In addition, electronic components used in these electronic control devices are also required to have high reliability that can be surface-mounted for miniaturization and are required for in-vehicle components.

  Next, an example in which a coil element is used as a circuit element for such a conventional electronic component will be described with reference to the drawings.

  12 is a plan view of a conventional electronic component, FIG. 13 is a cross-sectional view taken along line AA of FIG. 12, and FIG. 13 shows a state where the electronic component is mounted on a mounting board.

  As shown in FIGS. 12 and 13, a conventional electronic component is formed by winding a copper wire with an insulating film to form a coil element 1, and the coil element 1 is formed of a binder composed of a metal magnetic powder and a thermosetting resin. The body 2 is formed by embedding in the mixed powder and pressure forming, and the lead wires 3 at both ends of the coil element 1 protruding from the side surface of the body 2 are crushed into a flat plate shape and from the side surface of the body 2 The surface mounting type terminals 4 were formed by bending toward the bottom surface, and thus the electronic component was configured.

  And this electronic component was mounted with the solder 7 on the land 6 of the mounting board | substrate 5 using the reflow solder tank.

  As prior art document information related to the invention of this application, for example, Patent Document 1 is known.

JP 2009-123927 A

  In recent years, the mounting positions of electronic control devices for automobiles are increasing from outside the engine room to the inside of the engine room, and it is desired to further improve the vibration resistance.

  Among them, there is an increasing demand for downsizing of electronic parts, and in the height dimension of electronic parts, there is a demand for downsizing to 3 mm and further to 2 mm equivalent to the conventional electronic parts of 4 to 5 mm. Is getting stronger.

However, in the above-described conventional electronic component, when the height dimension of the electronic component is reduced to 3 mm or less, the height dimension of the terminal 4 bent from the side surface of the body 2 toward the bottom surface is 1.
The fillet of the solder 7 formed when the electronic component is mounted on the mounting board is formed up to the vicinity of the bent portion 8 of the terminal 4.

  When the fillet of the solder 7 is formed up to the vicinity of the bent portion 8 of the terminal 4, the terminal 4 is hardened with the solder and the terminal 4 itself is not bent, and the vibration stress of the automobile transmitted through the mounting substrate 5 is weakened. However, there is a problem that the bent portion 8 of the terminal 4 is concentrated and transmitted, and finally the bent portion 8 of the terminal 4 is broken due to metal fatigue, and the electronic component may be disconnected.

  An object of the present invention is to provide a highly reliable electronic component as a vehicle-mounted component by preventing breakage of a terminal due to vibration even if it is downsized.

  In order to solve the above-mentioned problems, the present invention comprises a body having a circuit element therein, an end of the circuit element drawn out from the side surface of the body and bent from the side surface toward the bottom surface, and a metal plate. A holding member for holding the end portion of the circuit element, and the holding member includes a first side surface portion, a second side surface portion, and a second side surface portion, which are disposed on both sides of the end portion of the circuit element at a portion facing the side surface of the body, respectively. The first and second side surfaces are connected to each other at the portion facing the bottom surface of the body, and the end portions of the circuit elements are fixed to each other. The width dimension of the end portion is larger than the first and second side surface portions at the end portion of the circuit element, and a bent portion that is bent outwardly from the body is provided. Dimension of the distance from the end of the , Body side and the first, is made larger than the maximum dimension of the spacing between the second side portion.

  With the above configuration, since the holding member has the first side surface portion and the second side surface portion arranged on both sides of the end portion of the circuit element at the portion facing the side surface of the body, the solder of the mounting board is melted. Thus, when forming the fillet, the first side surface portion, the second side surface portion, and the end portion of the circuit element can be easily separated.

  Further, since the width dimension of the first and second side surface portions is made larger than the width dimension of the end portion of the circuit element, the molten solder is attracted more to the first and second side surface portions than the end portion of the circuit element. Therefore, the amount of solder around the end of the circuit element is reduced, and the height of the solder fillet formed at the end of the circuit element can be reduced.

  In addition, a bent portion is provided at the end of the circuit element so as to protrude outwardly of the body from the first and second side surfaces, and the maximum dimension of the distance between the side surface of the body and the end of the circuit element is set. Since the maximum distance between the side of the body and the first and second side surfaces is larger, the end of the circuit element bent from the side of the body toward the bottom surface bends more than the first and second side surfaces. It can be made easier.

  From these results, it is possible to increase the portion where the solder fillet is not formed at the end portion of the circuit element, so that the end portion of the circuit element where the fillet is not formed bends the vibration stress of the automobile transmitted through the mounting substrate. The stress can be weakened, and it is possible to prevent the vibration stress from concentrating on the bent portion of the end of the circuit element on the side surface of the body and breaking.

  And an electronic component can be accurately attached to a mounting board by the big solder fillet formed in the 1st, 2nd side part.

As described above, according to the present invention, it is possible to obtain the effect of preventing the breakage of the terminal due to vibration and improving the reliability of the electronic component.

The exploded side perspective view of the electronic component in one embodiment of this invention The perspective view of the electronic component in one embodiment of this invention The figure explaining the example of mounting of the electronic component in one embodiment of this invention Sectional drawing of the BB line and CC line in FIG. The perspective view which shows another example of the electronic component in one embodiment of this invention The figure explaining the manufacturing process of the electronic component in one embodiment of this invention The figure explaining the manufacturing process of the electronic component in one embodiment of this invention The figure explaining the manufacturing process of the electronic component in one embodiment of this invention The figure explaining the manufacturing process of the electronic component in one embodiment of this invention The figure explaining another example of mounting of the electronic component in one embodiment of this invention The figure explaining another example of mounting of the electronic component in one embodiment of this invention Plan view of conventional electronic components Sectional view of the AA line in FIG.

  Hereinafter, an example in which a coil element is used as a circuit element of an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an exploded perspective view of an electronic component according to an embodiment of the present invention, and FIG. 2 is a perspective view of the electronic component.

  FIG. 1 shows the shapes of green compacts 26a and 26b, which will be described later. FIGS. 2 (a) and 2 (b) show the shape of the body 22 formed by re-pressing the green compact 26. FIG. Is shown. 2A is a transparent perspective view through the body 22, FIG. 2B is a perspective view, and in FIG. 2A, the outline of the body is indicated by a broken line.

  As shown in FIGS. 1 and 2, the electronic component of the present embodiment is drawn out by projecting to the outside from a side surface of the body 22 and a body 22 of a substantially rectangular column having a coil element 21 inside as a circuit element. The end 23 of the coil element and one end made of a metal plate are fixed to the side surface of the body 22, and the end 23 of the coil element is overlapped and fixed to the other end to fix the position and shape of the end 23 of the coil element. The terminal portion 25 is constituted by the end portion 23 of the coil element and the holding member 24, and the terminal portion 25 is bent from the side surface of the body 22 toward the bottom surface to be a surface mount type electronic component. I have to.

  Among them, the coil element 21 is formed by spirally winding an insulating coated copper wire with a fusion layer to form an air-core coil. In the present embodiment, the coil wire 21 is a round wire having a thickness of 0.30 mm. A copper wire was used, wound for 11 turns with an axial center diameter of 2.2 mm, and after the end portions 23 of the coil elements were drawn in opposite directions, the fused layer was subjected to a curing reaction to maintain the shape.

  The body 22 has a coil element 21 therein and is formed in a substantially quadrangular prism shape.

The body 22 also serves as the magnetic core of the coil element 21, and the binder containing the thermosetting resin and the metal magnetic substance powder are mixed in a state where the thermosetting resin is not completely cured, and is about 1 ton / cm ² . A plurality of pressure-molded green compacts 26 are re-press-molded so as to sandwich the coil element 21, and the coil element 21 is covered with the green compact 26 and heat-treated so that the thermosetting resin is completely cured. Is formed.

At this time, the re-press molding is performed at a pressure of about 5 ton / cm ² , which is larger than the pressure molding, and the thickness of the green compact 26 is smaller after the re-press molding than before the re-press molding. Therefore, the molding density is increased.

  As shown in FIG. 1, in this embodiment, the body 22 is formed using two green compacts 26a and 26b. One green compact 26 a has a quadrangular prism shape in which a storage portion 34 for storing the coil element 21 is formed. The other green compact 26b has a lid-like shape that covers one green compact 26a. The coil element end 23 and the holding member 24 protrude from the interface between the two green compacts 26 a and 26 b and protrude in the opposite direction from the opposing side surfaces of the body 22.

  The holding member 24 is formed by punching a metal plate having a thickness of about 0.15 mm. The holding member 24 may be made of any material that can maintain its shape in a self-supporting manner. However, in order to hold the position and shape of the end 23 of the coil element, the holding member 24 is made of a material that is stronger than the end 23 of the coil element. Is desirable, and phosphor bronze is preferable.

  The holding member 24 is provided with protruding portions 27 on both sides of one end in the extending direction, and is fixed by embedding the protruding portions 27 in the body 22 so that the end portion 23 of the coil element is positioned approximately at the center in the extending direction. Yes. In addition, it is preferable to provide a through hole 28 in the protruding portion 27, which is preferable because the fixing strength of the holding member 24 can be increased.

  An end 23 of the coil element is electrically connected by resistance welding and mechanically fixed to the other end side of the holding member 24 in the extending direction from the side surface of the body 22 together with the end 23 of the coil element. A surface-mounting type terminal portion 25 is configured in which the end portion 23 of the coil element is arranged on the mounting surface by bending toward the bottom surface of the body 22.

  The shape of the holding member 24 will be described in more detail. The holding member 24 is disposed at both sides of the end portion 23 of the coil element at intervals S1 and S2 in a portion facing the side surface of the body 22. The one side surface portion 29, the second side surface portion 30, and the bottom surface portion 31 that connects the first and second side surface portions 29, 30 and fixes the end portion 23 of the coil element at the portion facing the bottom surface of the body protrude. It is formed integrally with the portion 27.

  And the 1st side surface part 29 and the 2nd side surface part 30 are arrange | positioned along the side surface of the body 22 along with the edge part 23 of a coil element, and the extending | stretching direction of the 1st side surface part 29 and the 2nd side surface part 30 The width dimensions WH1 and WH2 in the direction orthogonal to the direction (from the portion fixed to the side surface of the body 22 toward the bottom surface of the body 22) are larger than the width dimension WC in the direction orthogonal to the extending direction of the end portion 23 of the coil element. Formed.

  Further, the end portion 23 of the coil element disposed between the first side surface portion 29 and the second side surface portion 30 protrudes outward of the body from the first side surface portion 29 and the second side surface portion 30. A gently bent portion 42 is provided.

  The bending portion 42 has a curved or arcuate shape having a constant or a plurality of radii of curvature, and the end portion 23 of the coil element projects from the side surface of the body 22 and the bottom surface of the body 22 has a bent side surface 39. Between the bottom bent portion 41 bent toward the bottom, there is a portion where the distance SBT between the side surface of the body 22 and the end portion 23 of the coil element is gradually increased.

  The maximum dimension of the distance SBT between the body 22 and the end 23 of the coil element is larger than the maximum dimension of the distance SBH between the body 22 and the first side surface part 29 and the second side surface part 30.

  In addition, in the region where the end 23 of the coil element on the bottom surface portion 31 is overlapped and fixed, it is preferable to provide a stepped portion 32 that is recessed from other regions. In this embodiment, the depth of 0.18 mm is provided. A step portion 32 is formed. A storage recess 33 for storing the stepped portion 32 may be formed on the bottom surface of the body 22. By doing in this way, it can suppress that the height dimension of an electronic component becomes large.

  When the diameter of the wire 23 at the end portion 23 of the coil element is large and protrudes from the stepped portion 32, the end portion 23 of the coil element may be flattened beforehand as shown in FIG. Is pressed into 0.18 mm and crushed.

  In this way, in the present embodiment, the external dimensions of the electronic component are 6.5 × 6.0 × 2.6 mm, and the height dimension from the protruding portion of the side surface of the body 22 of the end portion 23 of the coil element to the mounting surface is set. A small electronic component of 1.8 mm is configured.

  The electronic component of the present embodiment configured as described above can be used for various electronic devices by reflow soldering to a mounting board, and the state mounted on the mounting board by reflow soldering is shown in FIGS. 4 will be described.

  FIG. 3 is a diagram for explaining an example of mounting electronic components according to an embodiment of the present invention. FIG. 3A shows a state before reflow soldering with the electronic components mounted on the mounting board 35. FIG. 3B shows a state after reflow soldering. In FIG. 3, only the front half of the electronic component is shown. 4A is a sectional view taken along line BB in FIG. 3B, and FIG. 4B is a sectional view taken along line CC in FIG. 3B.

  The terminal part 25 of the electronic component is placed on the mounting substrate 35 in which the solder 37 is applied to the land pattern 36 as shown in FIG. 38 is formed. At this time, in the electronic component of the present embodiment, in the portion facing the side surface of the body 22, the first side surface portion 29 of the holding member 24 and the second side surface of the holding member 24 are spaced apart on both sides of the end portion 23 of the coil element. Since the two side surface portions 30 are arranged, the melted solder 37 can be easily separated from the first side surface portion 29, the end portion 23 of the coil element, and the second side surface portion 30 by the intervals S1 and S2, respectively. Since the solder fillet 38 is formed on each of the element end portion 23 and the second side surface portion 30, there is a gap between the first side surface portion 29, the coil element end portion 23, and the second side surface portion 30. The height of each solder fillet 38 can be made lower than that of a single integral terminal.

  In this case, it is desirable that the dimensions of the intervals S1 and S2 be 2 to 10 times the thickness dimension TH of the holding member 24. When the distances S1 and S2 are smaller than twice the thickness dimension TH of the holding member 24, the solder that wraps around in the thickness direction of the holding member 24 forms a bridge with the end 23 of the coil element, and each solder fillet. 38 is not preferable because it becomes easy to be integrated, and if it is larger than 10 times, the influence of a reduction in the dimensions of the first side surface portion 29 and the second side surface portion 30 is increased. More preferably, it is preferably 3-6 times, and in this embodiment, it is formed 4 times.

  In addition, since the width dimensions WH1 and WH2 of the first side face portion 29 and the second side face portion 30 are made larger than the width dimension WC of the end portion 23 of the coil element, the molten solder 37 is larger than the end portion 23 of the coil element. Since the first side surface portion 29 and the second side surface portion 30 are attracted much, the amount of solder 37 around the end portion 23 of the coil element is reduced, and the solder fillet 38 formed on the first side surface portion 29 and the second side surface portion 30. The height of the solder fillet 38 formed at the end portion 23 of the coil element can be made lower than the height dimension.

  In this case, it is desirable that the width dimensions WH1 and WH2 of the first side face portion 29 and the second side face portion 30 be twice to 10 times the width dimension WC of the end portion 23 of the coil element. If it is smaller than 2 times, the solder 37 around the end 23 of the coil element is difficult to decrease, which is not preferable, and if it exceeds 10 times, the external dimension of the electronic component becomes large. More preferably, it should be 3 to 6 times, and in this embodiment, it is made 3.5 times.

  Further, the coil element end 23 disposed between the first side surface portion 29 and the second side surface portion 30 is protruded outward of the body from the first side surface portion 29 and the second side surface portion 30. A bent portion 42 that is gently bent is provided, and the maximum dimension of the distance SBT between the body 22 and the end 23 of the coil element is the maximum dimension of the distance SBH between the body 22, the first side face portion 29, and the second side face portion 30. Since the end portion 23 of the coil element can be bent in advance, the solder fillet is formed on the bottom surface bent portion 41 that is bent toward the bottom surface of the body 22 of the end portion 23 of the coil element. Even if formed, the end 23 of the coil element can be easily bent.

  In this case, the maximum dimension of the distance SBT between the side surface of the body 22 and the end portion 23 of the coil element is set to the maximum dimension of the distance SBH between the side surface of the body 22 and the first side surface portion 29 and the second side surface portion 30. Desirably, the dimension is 0.5 to 3.0 times the thickness dimension TT of the end portion 23.

  If it is smaller than 0.5 times, the effect of facilitating bending of the end portion 23 of the coil element is reduced, which is not preferable. If it is larger than 3.0 times, the end portion 23 of the coil element on the bottom bent portion 41 side becomes the first side surface portion 29. The amount of protrusion outward from the second side surface portion 30 increases, and the mounting solder adheres and the solder fillet tends to be high, which is not preferable. More preferably, it is 1.0 to 2.0 times, and in this embodiment, it is 1.0 times.

  Here, if the end portion 23 of the coil element is provided with the first side surface portion 29 and the bending portion 42 that protrudes outward from the second side surface portion 30 of the body 22, the external dimensions of the electronic component increase, but the electronic component is mounted. When mounted on the substrate 35, the solder fillets of the first side surface portion 29 and the second side surface portion 30 are formed large, so that the mounting result does not increase the mounting area.

  Further, since the bending portion 42 is provided, the radius of curvature of the side surface bent portion 39 is larger than the radius of curvature of the bent portions of the first side surface portion 29 and the second side surface portion 30, and therefore when the side surface bent portion 39 is bent. The processing strain can be further reduced, and the reliability against breakage can be improved.

  From these results, it is possible to increase the portion where the solder fillet 38 is not formed on the end portion 23 of the coil element. Therefore, the end of the coil element where the solder fillet 38 is not formed due to the vibration stress of the automobile transmitted through the mounting board. The portion 23 can be bent and the stress can be weakened. Further, since the bent portion 42 is provided at the end portion 23 of the coil element, the stress can be further reduced. It is possible to prevent the stress of vibration from being concentrated and broken at the side bent portion 39 that is pulled out from the side of the body 22 and bent in the side direction.

  In addition, since the electronic component is accurately attached to the mounting board by the large solder fillets formed on the first and second side surface portions 29 and 30, even if the electronic component is downsized, the end 23 of the coil element is broken by vibration. Therefore, the reliability of the electronic component can be improved.

In the electronic component shown in FIGS. 1 and 2, the height dimension LH obtained by pulling the end 23 of the coil element from the side surface of the body 22 to the outside is higher than the center of the height dimension BH of the body 22. The example in which the body 22 is pulled out has been described. However, as shown in FIG. 5, the body 22 may be pulled out from the center of the height dimension BH to the outside of the body 22.

  FIG. 5 shows a transparent perspective view through the body 22 as in FIG. 2A. The electronic component shown in FIG. 1 is connected to the end 23 of the coil element from the upper end side of the coil element 21. 5 is pulled out from the side of the body 22, in the electronic component shown in FIG. 5, the end 23 of the coil element is pulled out from the lower end side of the coil element 21, so that the end 23 of the coil element is raised to the height of the body 22. It is drawn out of the body 22 on the bottom side from the center of the dimension BH.

  Further, in the electronic component shown in FIG. 5, the electronic component shown in FIG. 1 is fixed to the inside of the holding member 24, whereas the end 23 of the coil element is fixed to the outside of the holding member 24. It is.

  By doing in this way, the dimension from the drawer part of the 1st and 2nd side parts 29 and 30 and the edge part 23 of a coil element to a bottom face becomes short, and the 1st and 2nd side parts 29 and 30 are near a drawer part. The end 23 of the coil element is shortened in size so that the amount of movement of the bending due to the vibration of the automobile can be reduced, and the stress applied to the side bent portion 39 can be further reduced.

  In this case, the height dimension LH for projecting the end 23 of the coil element to the outside from the side surface of the body 22 is preferably lower than the center of the height dimension BH of the body 22, and more preferably lower 1 / It is preferable that the height be 3 or less. By doing so, the resonance frequency between the electronic component and the mounting substrate 35 can be further increased, and the vibration resistance of the electronic component can be improved.

  Further, the dimension of the interval S1, the dimension of the interval S2, and the width dimension WH1 of the first side surface part 29 and the width dimension WH2 of the second side surface part 30 are not limited to the same dimension, but are equivalent dimensions. In this way, the solder fillet 38 can be formed in a well-balanced manner.

  Next, the manufacturing method of the electronic component in this Embodiment is demonstrated with reference to FIGS.

  First, as shown in FIG. 6, an air-core coil element 21 is formed by spirally winding an insulating coated copper wire with a fusion layer.

  An insulating coated copper wire with a fusion layer is wound around a predetermined winding axis, and the ends 23 of the coil elements at both ends are pulled out in opposite directions, and then melted by blowing hot air or dropping a solvent onto the winding portion. The coating layer is allowed to undergo a curing reaction, and is removed from the winding shaft while maintaining the shape of the winding portion, and the air-core coil element 21 is formed.

  The end portion 23 of the coil element is peeled off from the insulating member at the portion to be resistance-welded with the holding member 24, and is pressed into a flat shape as necessary.

  In addition, the first side surface portion 29 and the second side surface are disposed on the portion disposed between the first side surface portion 29 and the second side surface portion 30 of the end portion 23 of the coil element, that is, the portion disposed on the side surface of the body 22. A bending portion 42 that is gently bent so as to protrude outward of the body from the portion 30 is pressed.

The bending portion 42 may be processed simultaneously when the end portion 23 of the coil element is pressed into a flat shape.

  Next, as shown in FIG. 7, the end 23 of the coil element is resistance-welded to the holding member 24 to be electrically connected and mechanically fixed.

  The holding member 24 is formed by pressing a phosphor bronze plate like a U-shape of katakana in which the first side surface portion 29 and the second side surface portion 30 are connected by the bottom surface portion 31.

  The distance between the first side surface portion 29 and the second side surface portion 30 is set in advance by setting the distance S1 and the distance S2 and the width dimension WC of the end portion 23 of the coil element to be combined. A protruding portion 27 having a through hole 28 is formed at the tip of the second side surface portion 30 on the body 22 side.

  Further, a stepped portion 32 that is recessed in the direction of the bottom surface of the body 22 is formed in a region where the end portions 23 of the coil elements of the bottom surface portion 31 are overlapped and fixed.

  Then, the end portion 23 of the coil element is positioned between the first side surface portion 29 and the second side surface portion 30 so as to be aligned with the spacing S1 and the spacing S2, and overlapped with the stepped portion 32 formed on the bottom surface portion 31. Fix them together by resistance welding.

  The holding member 24 may be formed as a single piece as shown in FIG. 7, but may be formed in a continuous hoop shape (not shown), and the positioning of the end 23 of the coil element can be easily performed. In addition, it is preferable because continuous production is possible and productivity can be improved.

Next, the binder containing the thermosetting resin and the metal magnetic powder are mixed in a state where the thermosetting resin is not completely cured, dried and pulverized to obtain a magnetic material of 1 ton / cm. a plurality of green compact 26a as pressure molding to 1 with ² mm, after obtaining 26b, a coil element 21, approximately five tons / cm ² so as to sandwich the protruding portion 27 of the holding member 24 Re-press molding with. The coil element 21 is covered with the green compacts 26a and 26b to form the body 22 shown in FIG. At this time, a storage portion 34 for storing the stepped portion 32 formed on the bottom surface portion 31 of the holding member 24 is formed using a mold for re-press molding.

  Then, the body 22 is completely cured by heat-treating it at about 180 ° C. or higher. In FIG. 8, the outline of the body 22 is indicated by a broken line.

  Next, as shown in FIG. 9, the end 23 of the coil element and the holding member 24 are cut at predetermined positions. Thereafter, the holding member 24 and the end 23 of the coil element may be solder-plated by dipping in molten solder.

  Finally, the terminal portion 25 including the end portion 23 of the coil element and the holding member 24 is bent from the side surface of the body 22 toward the bottom surface.

  By doing so, the electronic component shown in FIG. 2 can be obtained.

In the present embodiment, in the land pattern 36 of the mounting substrate 35, the contour shapes of the portions corresponding to the first side surface portion 29, the end portion 23 of the coil element, and the second side surface portion 30 are as shown in FIG. As described above with the linear configuration, another mounting example may be shown in a diagram illustrating another mounting example of the electronic component in the embodiment of the present invention in FIG. 10. 10A is a perspective view of the state after reflow soldering, and FIG. 10B is a cross-sectional view taken along the line DD of FIG. 10A. In another mounting example, in the contour shape of the land pattern 36 of the mounting substrate 35, a land pattern recess 40 that is recessed toward the body 22 is formed in a portion corresponding to the space between the first side surface portion 29 and the second side surface portion 30. It is provided. By doing so, the amount of solder 37 around the end portion 23 of the coil element can be reduced, and the height of the solder fillet 38 formed around the end portion 23 of the coil element is made lower. It is something that can be done.

  Furthermore, as another mounting example, a diagram illustrating another mounting example of the electronic component in the embodiment of the present invention shown in FIG. 11 may be shown. 11A is a perspective view of the state after reflow soldering, and FIG. 11B is a cross-sectional view taken along line EE of FIG. 11A. In still another mounting example, as compared with the mounting example shown in FIG. 10, the land pattern recess 40 is extended to the electronic component side, and the bottom surface is bent from the side surface of the body 22 of the end portion 23 of the coil element toward the bottom surface. The land pattern recess 40 is extended to a region including the bent portion 41. By doing so, the two bent portions of the side surface bent portion 39 and the bottom surface bent portion 41 of the end portion 23 of the coil element can no longer be hardened by the solder fillet 38, so that the vibration stress is further reduced and the vibration resistance is improved. It can be made to.

  The electronic component according to the present invention is industrially useful because it can prevent the breakage of the terminal due to vibration and can increase the reliability of the electronic component.

21 Coil element (Circuit element)
22 Body 23 End of coil element (End of circuit element)
24 Holding member 25 Terminal portion 26 Compact 27 Protruding portion 28 Through hole 29 First side surface portion 30 Second side surface portion 31 Bottom surface portion 32 Stepped portion 33 Storage recess portion 34 Storage portion 35 Mounting substrate 36 Land pattern 37 Solder 38 Solder fillet 39 Side bent portion 40 Land pattern recessed portion 41 Bottom bent portion 42 Deflection portion

Claims (7)

A body having a circuit element therein; an end of the circuit element drawn out from the side surface of the body and bent from the side surface toward the bottom surface; and a holding member that is made of a metal plate and holds the end of the circuit element. The holding member has a first side surface portion, a second side surface portion, and a bottom surface of the body, which are disposed on both sides of an end portion of the circuit element at a portion facing the side surface of the body. In the opposing portion, the first and second side surface portions are connected to each other and a bottom surface portion to which the end portion of the circuit element is fixed, and the width dimension of the first and second side surface portions is set to the end of the circuit element. A bending portion that is bent so as to protrude outward of the body from the first and second side surface portions, and is provided at a side surface of the body. And the circuit element Wherein the maximum dimension of the gap between the end portion of the side surface of the body first, electronic components, characterized in that is larger than the maximum dimension of the spacing between the second side portion. 2. The electronic component according to claim 1, wherein a width dimension of the first side surface part and the second side surface part is set to be twice to 10 times a width dimension of an end portion of the coil element. 2. The electronic component according to claim 1, wherein a distance between the first side surface portion, the second side surface portion, and an end portion of the circuit element is 2 to 10 times a thickness dimension of the holding member. The maximum dimension of the gap between the side surface of the body and the end of the circuit element is set to 0 of the thickness dimension of the edge of the circuit element to the maximum dimension of the gap between the side surface of the body and the first and second side faces. 2. The electronic component according to claim 1, wherein a dimension obtained by adding dimensions of 5 to 3.0 times is added. 2. The electronic component according to claim 1, wherein an end portion of the circuit element is drawn to the outside of the body from the center of the height dimension of the body on the bottom surface side. An electronic device comprising the electronic component according to claim 1 mounted on a surface of a mounting substrate. The land pattern concave portion recessed on the body side is provided in a corresponding portion between the first side surface portion and the second side surface portion in a contour pattern of the land pattern of the mounting substrate. 6. The electronic device according to 6.

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