JP2019008106A - Array substrate and display panel including array substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the connection strength between a display panel and an electronic component such as an FPC or IC without greatly changing from a conventional display panel manufacturing method even in a display device having a narrow space between terminals. Objective.
SOLUTION: A plurality of contact holes 3 are formed in a terminal portion of a scanning wiring 2 of an array substrate 10 constituting a liquid crystal display panel 30 so that a resin 6 enters the plurality of contact holes 3 when an FPC 70 is mounted. Thus, the adhesion area between the resin 6 and the contact hole 3 can be increased.
[Selection] Figure 4

Description

  The present invention relates to an array substrate and a display panel including the array substrate. Specifically, the present invention relates to a structure of a connection portion with an electronic component connected to an array substrate.

  Generally, a display panel configured to display an image composed of a liquid crystal display panel, an organic light emitting diode (OLED), and the like, and a flexible display that is arranged to input an external signal or a power source. Connection to a wiring substrate (Flexible Printed Circuit: hereinafter referred to as FPC) and an integrated circuit (hereinafter referred to as IC) is performed through an anisotropic conductive film containing conductive particles.

  The display panel is formed with a plurality of transparent electrodes for external connection (for example, configured as ITO films) at predetermined positions in order to input external signals and voltages. Similarly, a connection terminal corresponding to the external connection transparent electrode is exposed on the adhesive surface of the FPC or IC. Then, an anisotropic conductive film containing conductive particles having a diameter of several microns is disposed on the electrode of the display panel paired with the FPC or IC.

  Heat and pressurize in the above arrangement. The conductive particles constituting the anisotropic conductive film are fixed on the external connection transparent electrode existing on the display panel and the connection terminal paired therewith. As a result, the display panel and the FPC or IC can be electrically connected. Further, the resin constituting the anisotropic conductive film has a role of fixing the FPC or IC to each other by physical connection.

  Conventionally, the physical connection between the display panel and the FPC or IC is the connection between the resin constituting the anisotropic conductive film and the protective film on the display panel and the Si (silicon) part constituting the film or IC constituting the FPC. It was established by connection with an anisotropic conductive film.

  However, in recent years, the pitch of the connection terminals configured in the FPC has been reduced, and the proportion of the external connection terminal portion of the display panel has increased. Along with this, the proportion of the protective film formed between the terminal portions is decreasing, and there is a concern that the connection strength between the display panel and the electronic component is lowered.

  Patent Document 1 discloses a structure in which contact holes are provided in an organic film or an insulating film between terminals so that a large amount of conductive particles in an anisotropic conductive film does not remain on the organic film. As a result, the conductive particles of ACF can be dropped into the contact hole or the dummy contact hole.

  In the thin film EL panel of Patent Document 2, an insulating layer is formed between the electrode pads, and a gap is provided between the electrode pad and the insulating layer. Also disclosed is a technique for forming a groove in the electrode layer to increase the connection strength with the flexible lead.

  In the liquid crystal device of Patent Document 3, a groove is provided in the transparent resin film between the input and output terminals.

JP 2000-221540 A Japanese Utility Model Publication No. 61-13891 JP 2001-222021 A

  In Patent Document 1, since the contact hole must be formed so that the conductive particles remain sufficiently on the organic film, it is necessary to form the contact hole about 3 to 20 times as large as the conductive particles. In this case, the anisotropic conductive film and the insulating film have a small adhesion area, and the FPC may be peeled off.

  In Patent Documents 2 and 3, grooves are formed in the electrode layer / resin film or the like disposed between the terminals. However, when the distance between the terminals is narrow, there is a problem that the area for forming the groove is also narrowed.

  The present invention has been made to solve the above-described problems. Even in a display device having a narrow space between terminals, the display panel and the FPC or IC are not greatly changed from the conventional display panel manufacturing method. The purpose is to increase the connection strength with electronic components.

  The array substrate according to the present invention is an array substrate including a plurality of wirings arranged in a matrix on the substrate, thin film transistors formed at intersections of the wirings, and pixel electrodes controlled by signals input to the thin film transistors. And an electronic component for inputting signals arranged at the terminal portions of the plurality of wirings formed at the end portion of the array substrate, and the array substrate is disposed between the terminal portions of the adjacent wirings in the region including the electronic components. A plurality of contact holes are formed in the formed protective film, and an electronic component is connected by disposing a resin in the plurality of contact holes.

  According to the present invention, even in a display device in which the distance between terminals is narrow, the adhesion area between the terminals is increased without greatly changing from the conventional panel manufacturing method, and the connection strength due to the anchor effect is increased. The connection strength between the terminal electrode and the FPC or IC can be increased.

It is a top view which shows typically the display panel which comprises the display apparatus of this invention. It is a top view of the terminal part of the array substrate concerning an embodiment of the invention. It is AA sectional drawing of FIG. It is a top view of the terminal part of the array substrate concerning an embodiment of the invention. It is BB sectional drawing of FIG. It is sectional drawing which concerns on the modification of embodiment of this invention.

Embodiment 1.
FIG. 1 is a plan view schematically showing a display panel constituting the display device of the present invention.

  As shown in FIG. 1, the display device of the present invention is a liquid crystal display device and includes a liquid crystal display panel 30 for displaying an image. The liquid crystal display panel 30 has scanning wirings and signal wirings arranged in a matrix on an insulating substrate such as glass or plastic, and a thin film transistor (Thin Film Transistor, hereinafter referred to as TFT) formed at the intersection of the scanning wirings and the signal wirings. The array substrate 10 on which the pixels 31 composed of pixel electrodes and the like are formed and the counter substrate 20 on which a color filter and a black matrix are formed are bonded together and arranged to face each other via liquid crystal. A polarizing plate and a phase plate are affixed to both opposing surfaces of the liquid crystal display panel 30 to control light from a backlight (not shown). Further, an external circuit (described later) for inputting an external signal to the liquid crystal display panel 30 is attached to constitute a display device. In addition, although the structure of the display apparatus which mounts the liquid crystal display panel 30 was demonstrated as a display panel, you may use an organic EL (Electro-Luminescence, EL) panel.

  As described above, the liquid crystal display panel 30 includes the display area 50 in which the pixels 31 are configured to display an image, and the frame area 55 on the outer periphery of the display area 50. In the frame area 55, in order to send a signal to the pixels 31 formed in the display area 50, scanning lines and signal lines constituting the pixels 31 are formed to extend (not shown). Further, in the frame region 55, that is, the region where the scanning wiring and the signal wiring extend, as an example, the scanning wiring driving circuit 60 and the signal wiring driving circuit 65 are directly formed on the array substrate 10 as an IC as an integrated circuit. It is mounted by a chip on glass (Chip On Glass, hereinafter, COG) mounting technique. Although not shown in FIG. 1 for simplification of the drawing, a control signal, a clock, image data, and the like are supplied to the scanning wiring driving circuit 60 and the signal wiring driving circuit 65 at the end of the array substrate 10. Wirings for connecting to a plurality of terminals for FPCs 70 and 75, which are flexible wiring boards connected to an external circuit (not shown), are provided.

  When the liquid crystal display panel is a small panel, the total number of scanning wirings and signal wirings is relatively small. Therefore, the scanning wiring driving circuit 60 and the signal wiring driving circuit 65 are integrated into a driving circuit. May be. Further, the FPCs 70 and 75 may be integrated.

  2 is a plan view of a terminal portion (on the side where the scanning wiring driving circuit 60 is mounted) in the frame region 55 of the array substrate 10 constituting the liquid crystal display panel according to Embodiment 1, and FIG. It is A sectional drawing.

  As shown in FIGS. 2 and 3, on the insulating substrate 1, a scanning wiring made of a metal such as Al, Cr, Mo, Ti, Ta, W, Ni, Cu, Au, Ag, or an alloy or a laminated film thereof. 2 is formed by patterning.

  Next, a protective film 4 composed of a gate insulating film made of an oxide film, a nitride film, etc., and a protective film is formed on the entire upper surface of the scanning wiring 2. A semiconductor film and an ohmic contact film into which impurities are implanted are laminated and formed on a part of the protective film 4 on the scanning wiring 2 (not shown).

  In the display region 50, the source electrode and the drain electrode that are formed in the same layer as the signal wiring formed so as to intersect the scanning wiring 2 are formed so as to overlap the ohmic contact film, and are exposed from the source electrode and the drain electrode. The ohmic contact film is removed. The ohmic contact film between the source electrode and the drain electrode is removed to form a TFT channel portion. The scanning wiring 2 under the channel portion also functions as a gate electrode, and a TFT as a switching element is configured. The scanning wiring 2 is connected to a transparent electrode through a contact hole (not shown).

  As shown in FIGS. 2 and 3, in the frame region 55, a plurality of contact holes 3 are formed in the protective film 4 between the connection terminals in the connection terminal portion of the scanning wiring 2 with the FPC 70. Further, the width of the opening in the plan view of the contact hole 3 is 3 μm or less.

  4 is a plan view showing a state in which the FPC 70 is connected to the terminal portion (the side on which the scanning wiring driving circuit 60 is mounted) in the frame region 55 of the array substrate 10 constituting the liquid crystal display panel, and FIG. It is -B sectional drawing.

  As shown in FIGS. 4 and 5, an FPC 70, which is an electronic component, is disposed at the terminal portion of the frame region 55 of the array substrate 10. In the FPC 70, the connection member 5 is formed at a position facing the contact hole 41 (connection portion) formed in the scanning wiring 2 of the array substrate 10. Bumps 7 are formed on the connection member 5 and are in contact with and connected to the contact holes 41. A resin 6 such as an anisotropic conductive film containing conductive particles (not shown) is disposed between the FPC 70 and the array substrate 10, and both are conductively connected through the conductive particles.

  In the present invention, a plurality of contact holes 3 are formed in the terminal portion of the scanning wiring 2 of the array substrate 10 constituting the liquid crystal display panel 30, so that the resin 6 enters the plurality of contact holes 3 when the FPC 70 is mounted. By doing so, the adhesion area between the resin 6 and the contact hole 3 can be increased. The resin 6 also enters a fine hole formed in the side wall 42 of the protective film 4 forming the contact hole 3. When the resin 6 enters the hole in the side wall 42 of the protective film 4 forming the contact hole 3 and the resin 6 and the protective film 4 are engaged with each other, the connection strength between the FPC 70 and the protective film 4 can be increased. it can. With such a structure, the connection strength between the connection member 5 formed in the FPC 70 and the contact hole 41 formed in the terminal portion of the array substrate 10 can be increased. The aforementioned holes are formed during etching in the process of forming the contact hole 3 in the protective film 4.

  As described above, according to the configuration of the present invention, even in the display device in which the ratio of the protective film formed between the terminal portions is narrowed by narrowing the pitch of the FPC 70 terminals, in the region where the FPC 70 is disposed. By providing a plurality of contact holes 3 in the protective film 4 formed between the terminal portions, the adhesive area with the resin 6 such as an anisotropic conductive film is not significantly changed from the conventional method of manufacturing a liquid crystal display panel. Can be increased. That is, the bonding area is increased by allowing the resin 6 to penetrate into the plurality of contact holes 3 formed in the protective film 4, and the connection strength between the protective film 4 and the resin 6 due to the anchor effect is increased. Thereby, the connection strength of the connection part 5 of the terminal part of the scanning wiring 2 in the frame area | region 55 of the array board | substrate 10 and FPC70 which is an electronic component can be increased.

  When forming a liquid crystal display panel, when forming an insulating substrate with a glass material or a material containing glass, the protective film 4 is completely removed from the substrate 1 when the contact hole 3 is formed, and the substrate 1 is removed. Expose. Compared with the connection strength between the resin 6 and the protective film 4, the connection strength between the resin 6 and the glass material (glass substrate) is larger. The resin 6 can further increase the connection strength by entering the contact hole 4 and contacting the substrate 1 made of a glass material.

  Further, the contact hole 3 can be formed on the array substrate 10 during the TFT manufacturing process, and it is not necessary to make a significant change from the conventional panel process.

  The contact hole 3 needs to have a diameter that can exhibit the anchor effect and a width of 3 μm or less. By setting the contact hole 3 to 3 μm or less, when the FPC 70 is mounted, the resin 6 can be penetrated, and the adhesive force can be increased by the anchor effect.

  Further, the shape of the contact hole 3 is not particularly limited. However, by forming the contact hole 3 in a columnar shape, it is possible to further expand the adhesion area as compared with the rectangular shape.

  FIG. 6 is a cross-sectional view showing a modification of the present embodiment. When the substrate 11 constituting the array substrate 10 is made of PET (Polyethylene terephthalate), plastic, or the like, the connection strength with the resin 6 becomes low. Therefore, an insulating film 43 is formed between the terminal portions of the scanning wiring 2 on the substrate 11, and then the contact hole 3 is formed by the protective film 4. When the substrate 11 is made of plastic, PET, or the like and the connection strength with the resin 6 is low, the connection strength with the resin 6 is increased by providing the insulating film 43 on the substrate 11 as in this modification. can do.

  As described above, in the embodiment of the present invention, the connection structure between the array substrate 10 and the FPC 70 which is an electronic component has been described as an example. However, when the electronic component is connected on the substrate using the resin 6 By adopting this structure, the same effect can be obtained.

1 Insulating substrate, 2 scan wiring, 3 contact hole,
4 protective film, 41 contact hole, 42 side wall of protective film, 43 insulating film,
5 connecting member, 6 resin, 7 transparent electrode, 10 array substrate, 20 counter substrate,
30 liquid crystal display panel, 31 pixels, 50 display area, 55 frame area,
60 Scanning wiring drive circuit, 65 Signal wiring driving circuit, 70, 75 Flexible substrate.

Claims (5)

A plurality of wires arranged in a matrix on the substrate;
A thin film transistor formed at an intersection of the wires,
An array substrate including a pixel electrode controlled by a signal input to the thin film transistor,
An electronic component for inputting signals arranged at terminal portions of a plurality of wirings formed at the end of the array substrate,
The array substrate is formed with a plurality of contact holes in a protective film disposed between terminal portions of the adjacent wirings in a region including the electronic component,
An array substrate in which resin is disposed in the plurality of contact holes to connect the electronic components. The array substrate according to claim 1, wherein the electronic component is a flexible substrate connected to an integrated circuit for controlling a signal input to the array substrate or a terminal portion of a wiring. 3. The array substrate according to claim 1, wherein the protective film forming the contact hole has a side wall, and the resin is disposed in a hole formed in the side wall. The substrate is formed of glass or a material containing glass;
The array substrate according to claim 1, wherein the plurality of contact holes are formed by removing the protective film and exposing the substrate. The display panel which has arrange | positioned the opposing board | substrate facing the array board | substrate of any one of the said Claims 1-4.