JP2019119091A - Physical quantity sensor and method for manufacturing same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the bondability between a metal terminal and a case while suppressing an increase in the number of parts. SOLUTION: In a physical quantity sensor in which a sensor unit 10 is electrically connected to a metal terminal 50 and the sensor unit 10 and the metal terminal 50 are covered by a case 40, the portion of the metal terminal 50 covered by the case 40. Therefore, it is composed of unevenness between the end portion on the side connected to the sensor unit 10 and the one end portion, and goes around the surface of the metal terminal 50 around the axial direction with the extension direction of the metal terminal 50 as the axial direction. The joint portion 53 is formed. Then, the case 10 is made of a resin material, and the resin material enters the unevenness so as to be joined to the joint portion 53. [Selection diagram] Fig. 1

Description

  The present invention relates to a physical quantity sensor and a method of manufacturing the same.

  Conventionally, a resin molded body in which a sensor chip and a metal terminal are covered with a case formed of a thermoplastic resin has been proposed (see, for example, Patent Document 1). Specifically, in this resin molded body, the sensor chip and the metal terminal are electrically connected through the bonding wire, and the side of the metal terminal opposite to the side connected to the sensor chip is exposed from the case ing. And such a resin molding is used by electrically connecting the metal terminal exposed from the case with the external connector.

  The said resin molding is manufactured as follows. That is, first, the sensor chip and the metal terminal are connected to form a structure. And this structure is arrange | positioned in a metal mold | die. Thereafter, it is manufactured by pouring molten resin into a mold to form a case.

JP, 2017-128902, A

  However, in the resin molded product, the metal terminal and the case are joined with different materials, and the case is difficult to adhere to the metal terminal, so the adhesion between the metal terminal and the case is lowered. For this reason, under the condition where the metal terminal exposed from the case is exposed to the external environment, there is a possibility that foreign matter such as water or oil may intrude from the gap between the metal terminal and the case.

  Therefore, it is conceivable to newly place another resin member by potting or the like around the metal terminal exposed from the case so that foreign matter does not enter from the gap between the metal terminal and the case. However, in this configuration, another resin member must be disposed, which leads to an increase in the number of parts.

  An object of this invention is to provide the physical quantity sensor which can improve the bondability of a metal terminal and a case, and its manufacturing method in view of the said point, suppressing that a number of parts increases.

  In claim 1 for achieving the above object, the sensor unit (10) for outputting a sensor signal according to the physical quantity is electrically connected to the metal terminal (50), and the metal terminal is covered by the case (40). In a physical quantity sensor, a sensor unit that outputs a sensor signal, a metal terminal electrically connected to the sensor unit and having a portion extended in one direction, and at least a side of the metal terminals connected to the sensor unit And a case for covering the metal terminal in a state in which one end opposite to the end is exposed, the metal terminal being a portion covered by the case, the end on the side to be connected to the sensor unit A joint (53) is formed between the end and one end, and is formed of asperities, and circling the surface of the metal terminal around the axial direction with the extension direction as the axial direction, and the case is made of a resin material Is, is joined to the joining portion by resin material intrudes into irregularities.

  According to this, since the bonding portion is formed on the metal terminal and the bonding portion is bonded to the case, the bonding property between the metal terminal and the case can be improved. Further, since the case and the metal terminal are joined by forming the joint portion on the metal terminal, the number of parts is not increased.

  Further, in the method of manufacturing a physical quantity sensor in which the sensor unit (10) for outputting a sensor signal according to the physical quantity is electrically connected to the metal terminal (50) and the metal terminal is covered by the case (40) Preparing, preparing a metal terminal having a portion extending in one direction, electrically connecting the sensor unit and the metal terminal to form a structure (81), and Providing a mold (300) in which a cavity (330) to be placed is configured and into which molten resin (40a) is poured from the injection gate (340), placing a structure in the cavity, and By pouring the molten resin from the injection gate and solidifying it, at least one end of the metal terminals on the side opposite to the end connected to the sensor unit While exposing the performed forming a casing for covering the metal terminal. Then, before forming the case, a junction (53) is formed on the metal terminal, which is configured with irregularities and extends in the axial direction of the metal terminal around the axial direction, Forming the case joins the joint and the case.

  According to this, since a junction part is formed in a metal terminal and a junction part is joined to a case, a physical quantity sensor which improved junction nature of a metal terminal and a case can be manufactured. Further, since the case and the metal terminal are joined by forming the joint portion on the metal terminal, the number of parts is not increased.

  Note that the reference numerals in parentheses in the above and the claims indicate the correspondence between the terms described in the claims and the concrete items and the like that exemplify the terms described in the embodiments described later. .

It is sectional drawing which shows the structure of the rotation angle sensor in 1st Embodiment. It is a sectional view different from Drawing 1, and is a fragmentary sectional view showing a connector case etc. in a section. It is a perspective view of the part except the connector case of the rotation angle sensor shown in FIG. It is an enlarged view of the junction formed in the terminal. It is a schematic diagram which shows the actual state of 2nd unevenness | corrugation in area | region IVB enclosed with the dashed-two dotted line in FIG. 4A. It is a schematic diagram which shows the structure of a manufacturing system. It is a perspective view which shows the metal plate by which a base material is comprised by being cut | disconnected. It is a schematic diagram which shows the structure of a laser irradiation apparatus. It is a schematic diagram which shows the irradiation spot system of a laser beam, and the space | interval of an irradiation spot. It is sectional drawing which shows a joining part formation process. It is sectional drawing which shows a joining part formation process. It is a fragmentary sectional view which has arranged the 2nd composition in a metallic mold. It is sectional drawing which has arrange | positioned the 2nd structure to a metal mold | die. It is a fragmentary sectional view showing composition of a rotation angle sensor in a 2nd embodiment. It is a fragmentary sectional view which has arranged the 2nd composition in a metallic mold. It is a cross-sectional schematic diagram which shows the state which poured molten resin between the junction part formed in the insert thing, and a metal mold | die. It is a cross-sectional schematic diagram which shows the state in which the hardening part was formed between the junction part formed in the insert thing, and a metal mold | die. It is a cross-sectional schematic diagram which shows the state which a vacuum void generate | occur | produces between the junction part formed in the insert thing, and a metal mold | die. It is a cross-sectional schematic diagram which shows the state which a vacuum void generate | occur | produces between the part in which the junction part of the insert is not formed, and a metal mold | die. It is sectional drawing which shows the state at the time of joining an insert thing and a resin member. It is sectional drawing of the rotation angle sensor in 3rd Embodiment. It is sectional drawing of the rotation angle sensor in 4th Embodiment. It is sectional drawing of the rotation angle sensor in the modification of 4th Embodiment. It is a fragmentary sectional view which has arranged the 2nd composition in a metallic mold. It is a figure which shows the relationship between filling time, a flow cross section, and a pressure. It is sectional drawing of the rotation angle sensor in 5th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal shown in FIG. It is a perspective view which shows the metal plate by which a base material is comprised by being cut | disconnected. It is a fragmentary sectional view which has arranged the 2nd composition in a metallic mold. It is sectional drawing of the rotation angle sensor in 6th Embodiment. It is a fragmentary sectional view which has arranged the 2nd composition in a metallic mold. It is sectional drawing of the rotation angle sensor in 7th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal shown in FIG. It is a perspective view which shows the junction part vicinity of the terminal in the modification of 7th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal in the modification of 7th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal in the modification of 7th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal in the modification of 7th Embodiment. It is a perspective view which shows the flow direction of the molten resin with respect to the terminal shown in FIG. It is a schematic diagram which shows the state in which the bubble which looked the terminal shown in FIG. 29 from the other surface side is formed. It is sectional drawing of the terminal in 8th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal in 9th Embodiment. It is a schematic diagram which shows the metal plate which comprises a terminal. It is sectional drawing at the time of arrange | positioning a terminal in the mounting surface of an accommodating member. It is a perspective view which shows the junction part vicinity of the terminal in the modification of 9th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal in 10th Embodiment. It is a side view of the terminal shown in FIG. It is a perspective view which shows the junction part vicinity of the terminal in the modification of 10th Embodiment. It is a side view of the terminal shown in FIG. It is a perspective view which shows the junction part vicinity of the terminal in the modification of 10th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal in the modification of 10th Embodiment. It is a perspective view which shows the process surface at the time of forming a base material from the metal plate in 11th Embodiment. FIG. 42B is a cross-sectional view along XLIIB-XLIIB in FIG. 42A. It is a perspective view which shows the process surface at the time of performing a shaving process, after forming a base material from the metal plate in 11th Embodiment. FIG. 43C is a cross-sectional view along XLIIIB-XLIIIB in FIG. 43A. It is a perspective view which shows the junction part vicinity of each terminal in 12th Embodiment. It is a schematic diagram at the time of irradiating a laser beam from one side of each terminal. It is a schematic diagram at the time of irradiating a laser beam from the side surface side of each terminal. It is a schematic diagram at the time of irradiating a laser beam from the other surface side of each terminal. It is a schematic diagram at the time of irradiating a laser beam from the side surface side of each terminal. It is a cross-sectional schematic diagram which shows the junction-part formation process in 13th Embodiment. It is sectional drawing of the rotation angle sensor in 14th Embodiment. It is a perspective view which shows the junction part vicinity of the terminal shown in FIG. It is a schematic diagram which shows the manufacturing system in 14th Embodiment. It is sectional drawing which shows a terminal bending process. It is sectional drawing which shows the terminal bending process following FIG. 50A. It is a side view which shows the terminal bending process and junction-part formation process in 15th Embodiment. It is a perspective view which shows the storage member in 16th Embodiment. It is a perspective view at the time of mounting a 1st structure in the accommodation member shown in FIG. It is a schematic diagram which shows the manufacturing system in 17th Embodiment. It is a plane schematic diagram showing a holding jig. It is a plane schematic diagram which shows the holding jig in the modification of 17th Embodiment. It is sectional drawing for demonstrating the subject of the resin-made accommodating member in 18th Embodiment. It is sectional drawing of the accommodating member in 18th Embodiment. It is sectional drawing for demonstrating the subject of the paper-made accommodating member in the modification of 18th Embodiment. It is sectional drawing of the accommodating member in the modification of 18th Embodiment. It is a side view of the accommodating member in the modification of 18th Embodiment. It is sectional drawing which shows the connection process in 19th Embodiment. It is sectional drawing which shows the connection process in the modification of 19th Embodiment. It is sectional drawing which shows the terminal bending process in 20th Embodiment. It is sectional drawing which shows the terminal bending process following FIG. 64A. It is sectional drawing which shows the junction-part formation process in 20th Embodiment. It is sectional drawing of the physical quantity sensor in other embodiment. It is sectional drawing of the physical quantity sensor in other embodiment. It is sectional drawing of the physical quantity sensor in other embodiment.

  Hereinafter, an embodiment of the present invention will be described based on the drawings. In the following embodiments, parts that are the same as or equivalent to each other will be described with the same reference numerals.

First Embodiment
A first embodiment will be described with reference to the drawings. In the present embodiment, an example in which a physical quantity sensor is applied to a rotation angle sensor will be described. In addition, this rotation angle sensor is suitably mounted, for example in vehicles, such as a motor vehicle, and when used for detecting the rotational speed of a wheel. First, the configuration of the rotation angle sensor will be described.

  The rotation angle sensor of this embodiment is configured to have a mold IC 10, a magnet 20, a cap 30, a connector case 40, a terminal 50, and the like, as shown in FIGS. 2, the below-mentioned mold resin 14 in the mold IC 10, the magnet 20, the cap 30, and the connector case 40 are shown as a cross section. And the below-mentioned terminal part 11a and terminal 50 in mold IC10 are shown as a top view. In the following, in the same partial cross-sectional view as FIG. 2, the terminal portion 11a and the terminal 50 are shown as a plan view, and the others are shown as cross-sectional views.

  The mold IC 10 has a sensor chip 12 and a circuit chip 13 mounted on a lead frame 11 via a bonding member (not shown), and these are integrated by a mold resin 14. In the present embodiment, the mold IC 10 corresponds to a sensor unit.

  In the present embodiment, the lead frame 11 is formed, for example, by press-forming or etching a metal conductor plate such as a copper alloy, and has three terminal portions 11 a. The sensor chip 12 is configured by forming a magnetoresistive element (that is, MRE), and outputs a sensor signal according to the applied magnetism. The circuit chip 13 includes a signal processing circuit and the like, and performs predetermined processing and the like on the sensor signal.

  The sensor chip 12 and the circuit chip 13 are electrically connected via bonding wires or the like (not shown). Further, the circuit chip 13 is electrically connected to each terminal portion 11 a of the lead frame 11.

  The mold resin 14 is made of a thermosetting resin or the like, and seals the lead frame 11, the sensor chip 12 and the circuit chip 13 so that the terminal portions 11a of the lead frame 11 are exposed. In the sensor chip 12 and the circuit chip 13, the sensor chip 12 is disposed on the side opposite to the terminal portion 11 a side of the lead frame 11, and the circuit chip 13 is disposed between the sensor chip 12 and the terminal portion 11 a.

  The magnet 20 provides a bias magnetic field to the magnetoresistive element of the sensor chip 12. In the present embodiment, the magnet 20 is in a cylindrical shape having a hollow portion, and the inner wall surface forming the hollow portion has a shape corresponding to the outer shape of the mold IC 10. The mold IC 10 is disposed in the magnet 20 so that the terminal portion 11 a protrudes from the hollow portion of the magnet 20. The magnet 20 is recessed in the inner wall surface so that a part of the connector case 40 is inserted between the mold IC 10 and the magnet 20 on the end side where the terminal portion 11 a is located. Is formed.

  The cap 30 is made of a thermoplastic resin or the like and has a bottomed cylindrical shape having a hollow portion. And in the cap 30, the magnet 20 by which mold IC10 is arrange | positioned is arrange | positioned so that the terminal part 11a may protrude from the said cap 30. As shown in FIG. Moreover, the convex part 31 which goes around the outer wall surface along the circumferential direction is formed in the part coat | covered with the connector case 40 among the outer wall surfaces. The convex portion 31 is a portion functioning as a welding portion welded to the connector case 40 when the connector case 40 is formed. FIG. 3 shows the state before the connector case 40 is formed, and after the connector case is formed, the shape of the convex portion 31 changes as shown in FIGS. 1 and 2.

  The connector case 40 is formed, for example, by molding a thermoplastic resin of polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polyamide, liquid crystal polymer (LCP), urethane, nylon, polycarbonate (PC), and silicone. Ru. The connector case 40 may be formed, for example, by molding a thermosetting resin such as an epoxy resin or a phenol resin. In the present embodiment, the connector case 40 corresponds to a resin member.

  The connector case 40 has a substantially cylindrical shape, one end of which is a connector connected to an external connector, and the other end of which is a covering that covers the molded IC 10, the cap 30, and the like. The connector case 40 has an opening 41 at one end. The connector case 40 is provided at the other end side so that the bottom of the cap 30 is exposed. The connector case 40 is joined to the cap 30 by welding.

  As shown in FIG. 4A, the terminal 50 is configured by forming a metal thin film 62 on the surface of a base 61 made of a conductive metal material. In the present embodiment, the substrate 61 is made of an alloy or a pure metal containing at least one of copper (Cu), iron (Fe), and aluminum (Al) as a main component. The metal thin film 62 is composed of a plating film, and contains at least one of gold (Au), tin (Sn), nickel (Ni), palladium (Pd), silver (Ag), and copper (Cu) as a main component. It is configured. In the present embodiment, the terminal 50 corresponds to a metal terminal or a metal member.

  Further, as shown in FIG. 3, in the present embodiment, the terminal 50 has one surface 50a, the other surface 50b opposite to the one surface 50a, and side surfaces 50c and 50d connecting the one surface 50a and the other surface 50b. , It is in the form of a square rod extending in one direction. Here, the side surfaces 50 c and 50 d are side surfaces extending along the extending direction of the terminal 50. Further, in the present embodiment, when the terminal 50 has a length in the direction intersecting with the extending direction of the terminal 50 in each of the surfaces 50a to 50d, the widths of the one surface 50a and the other surface 50b are the side surfaces 50c and 50d. It has a rectangular cross section which is longer than the width.

  In the present embodiment, three terminals 50 are provided, and the terminals 50 are arranged such that one surface 50a and the other surface 50b of each other are on the same surface. And each terminal 50 is arrange | positioned in the connector case 40, respectively. Specifically, each terminal 50 is disposed in the connector case 40 in a state in which one end side is exposed from the opening 41 and the other end side is connected to the terminal portion 11 a.

  In the terminal 50, a through hole 51 into which the terminal portion 11a can be inserted is formed on the other end side. The terminal 50 is electrically and mechanically connected to the terminal portion 11 a by the other end being crimped after the lead frame 11 is inserted into the through hole 51.

  Further, the terminal 50 has a positioning hole 52 formed on the side to be joined to the terminal portion 11a. The positioning holes 52 are appropriately used when adjusting the position of the terminal 50 in each process described later.

  Here, in the terminal 50 of the present embodiment, a joint portion 53 joined to the connector case 40 is formed in a portion covered by the connector case 40. In the present embodiment, the joint portion 53 is formed at a portion on one end side of the terminal 50, and assuming that the extension direction of the terminal 50 is an axial direction (hereinafter simply referred to as an axial direction), the surface is an axis It is formed to go around along the direction intersecting with the direction. Although FIG. 3 is not a cross-sectional view, hatching is applied to the joint portion 53 for easy understanding. In addition, in order to facilitate understanding in the following description, although not a cross-sectional view, it may be described with reference to a figure in which a portion forming the bonding portion 53 is hatched.

  As shown in FIG. 4A, the bonding portion 53 is configured by forming a second unevenness 72 having a smaller height difference than the first unevenness 71 on the surface and the periphery of the first unevenness 71. Specifically, the bonding portion 53 is configured by forming a nano-order second unevenness 72 on the surface and the periphery of the micro-order first unevenness 71. The bonding portion 53 is formed only on the metal thin film 62 and is not formed on the base 61. Further, in FIG. 4A, the second unevenness 72 is shown in a simplified manner for easy understanding, but in fact, as shown in FIG. 4B, the second unevenness 72 is formed in an irregular state. ing.

  The first unevenness 71 has a crater-like substantially circular shape, and has an outer diameter of approximately 5 to 300 μm. In the present embodiment, such first irregularities 71 are formed by irradiating the terminal 50 with a pulsed laser beam, as described later. That is, it can be said that the first unevenness 71 in the present embodiment is a laser irradiation mark. And one substantially circular shape which comprises the 1st unevenness | corrugation 71 is formed of the laser beam irradiation of one pulse oscillation.

  Moreover, the convex part 71a in the 1st unevenness | corrugation 71 is comprised by the convex part (it is hereafter mentioned the 1st convex part 71a in the crater-like unevenness | corrugation), and has a 0.5-50 micrometers height. That is, the first unevenness 71 is a micro-order unevenness. In FIG. 4A, the height of the first convex portion 71a is indicated by the arrow H1.

  The second unevenness 72 is formed on and around the surface of the first unevenness 71, and has a height of 0.5 to 500 nm and a width of 1 to 300 nm. In FIG. 4A, the height of the convex portion (hereinafter referred to as a second convex portion) 72a of the second unevenness 72 is indicated by the arrow H2.

  In the present embodiment, the height of the first convex portion 71 a smoothes the second convex portion 72 a and is perpendicular to the in-plane direction when the imaginary cross section curve L 1 of the first unevenness 71 is formed. , And the distance between the highest position and the lowest position of the first convex portion 71a. Further, the height of the second convex portion 72a is the highest position and the lowest position of the second convex portion 72a in the direction orthogonal to the horizontal line L2 when the above-mentioned virtual cross section curve in the first convex portion 71a is horizontally extended. It is the distance between the position. That is, in FIG. 4A, the distance between the highest position and the lowest position in the vertical direction in the drawing is the height of each of the convex portions 71a and 72a. The width of the second convex portion 72a is a distance between two adjacent lowest positions of the second convex portion 72a in the direction orthogonal to the direction defining the height of the second convex portion 72a.

  In the present embodiment, such a bonding portion 53 is formed by irradiating a laser beam as described later. In addition, as long as such a bonding portion 53 is configured, the bonding portion 53 may be formed by plasma irradiation, ultraviolet irradiation, blasting, chemical treatment, chemical coating, roughening plating, or the like. . However, if it is a laser beam, one 1st unevenness | corrugation 71 and several 2nd unevenness | corrugation 72 which comprise the junction part 53 are formed by irradiating a laser beam once, without performing another back-and-front process. For this reason, forming the bonding portion 53 with a laser beam can suppress the process of forming the bonding portion 53 from becoming complicated.

  Then, in the terminal 50, the joint portion 53 is joined to the connector case 40. Specifically, the joint portion 53 is joined to the connector case 40 by the anchor effect by the thermoplastic resin forming the connector case 40 entering the above-mentioned asperities.

  According to the study of the present inventors, it is confirmed that the bonding between the connector case 40 and the bonding portion 53 can be improved by forming the bonding portion 53 having the first unevenness 71 and the second unevenness 72 as described above. It is done.

  The above is the configuration of the rotation angle sensor in the present embodiment.

  Next, a manufacturing system for manufacturing the rotation angle sensor will be described. The manufacturing system of this embodiment is, as shown in FIG. 5, a molded IC manufacturing apparatus 100, a terminal forming apparatus 110, a connection apparatus 120, a tie bar cutting apparatus 130, a joint forming apparatus 140, an inspection apparatus 150, and an assembling apparatus 160. , Connector case molding apparatus 170. The manufacturing system also includes transport devices 181 to 187 and the like that transport the object to be processed among the devices 100 to 170. In addition, each conveyance apparatus 181-187 is comprised by a conveyor etc., for example.

  The mold IC manufacturing apparatus 100 is an apparatus for manufacturing the mold IC 10, and performs a process of manufacturing the mold IC 10. Specifically, the mold IC manufacturing apparatus 100 performs press molding or the like from a metal plate to form the lead frame 11 and mounts the sensor chip 12 and the circuit chip 13 on the lead frame 11. Next, the molded IC manufacturing apparatus 100 electrically connects the sensor chip 12 and the circuit chip 13 through the bonding wire, and electrically connects the circuit chip 13 and the lead frame 11 through the bonding wire. . Thereafter, the mold IC manufacturing apparatus 100 integrates the sensor chip 12, the circuit chip 13 and the lead frame 11 with the mold resin 14 so as to expose the terminal portions 11a of the lead frame 11, thereby manufacturing a mold IC 10. Then, the mold IC manufacturing apparatus 100 sends out the manufactured mold IC 10 to the transport apparatus 181.

  The terminal forming device 110 is a device that forms the terminal 50 and performs the process of forming the terminal 50. Specifically, the terminal forming device 110 first performs press molding or the like from a metal plate to form the base 61 that constitutes the terminal 50. In the present embodiment, a tie bar forms one in which three base materials 61 are integrated. Then, the terminal forming device 110 performs plating processing such as electroless plating, forms the metal thin film 62 on the substrate 61 to form the terminal 50, and sends the terminal 50 to the transport device 182. In addition, as a metal plate, the hoop-shaped thing as shown in FIG. 6 is used, for example. Further, in the present embodiment, the terminal forming device 110 corresponds to a metal member forming device.

  The connecting device 120 is a device for electrically and mechanically connecting the molded IC 10 and the terminal 50, and performs the step of electrically and mechanically connecting the molded IC 10 and the terminal 50. Specifically, when the molding IC 10 is carried in by the carrier device 181 and the terminal 50 is carried in by the carrier device 182, the connection device 120 connects the mold IC 10 and the terminal 50 and connects the first structure 81. Form. In the present embodiment, the connection device 120 inserts the terminal portion 11a of the molded IC 10 into the through hole 51 formed on the other end side of the terminal 50, and crimps the other end of the terminal 50 to form a first configuration. Construct a body 81. Then, the connection device 120 sends the first structure 81 to the transfer device 183.

  The tie bar cutting apparatus 130 is an apparatus for cutting tie bars, and performs a tie bar cutting process. Specifically, since the tie bar cutting apparatus is in a state in which the terminals 50 of the first structure 81 are integrated by the tie bar, the tie bar is cut to separate the terminals 50. Then, the first structure 81 is sent out to the transfer device 184.

  The bonding portion forming device 140 is a device for forming the bonding portion 53 in the terminal 50, and performs the step of forming the bonding portion 53 in the terminal 50. In the present embodiment, the joint forming apparatus 140 has a laser irradiation apparatus 200 as shown in FIG. Here, the structure of the laser irradiation apparatus 200 of this embodiment is demonstrated.

  The laser irradiation apparatus 200 is a conveying apparatus provided with a receiving jig 210 and a delivery jig 220 which drop off after picking up and moving the first structure 81, and a pallet 231 on which the first structure 81 is mounted. It has 230. The laser irradiation apparatus 200 further includes a laser beam irradiation unit 250 for irradiating the terminal 50 with a laser beam in the partitioned room 240, and a dust collector 262 for collecting dust in the room 240 through the exhaust port 260 and the exhaust duct 261. There is. Furthermore, the laser irradiation apparatus 200 is connected to the transport apparatus 230, the laser beam irradiation unit 250, and the like, and includes a controller 270 that controls these. The laser irradiation apparatus 200 also has a position adjustment jig (not shown) or the like in the room 240 for adjusting the position, the inclination, and the like of the first structure 81, although not particularly shown. In FIG. 7, the arrow extending from the laser beam irradiation unit 250 indicates a laser beam.

  The laser irradiation apparatus 200 is configured to be able to change the position of the terminal 50 to which the laser beam is irradiated when the laser beam is irradiated from the laser beam irradiation unit 250 to the terminal 50. In the present embodiment, the laser beam irradiation unit 250 and the pallet 231 are configured to be relatively movable. However, when using a galvano scanner capable of scanning the laser beam by the rotation operation of the mirror, the laser beam irradiation unit 250 is configured to be able to move the laser beam irradiation unit 250 and the pallet 231 relative to each other. It does not have to be.

In the present embodiment, the laser beam irradiation unit 250 uses, for example, Nd: YAG (neodymium: yttrium aluminum garnet) or the like as a laser light source. When Nd: YAG is used as a laser light source, the laser beam has a fundamental wavelength of 1064 nm, or its harmonics of 533 nm or 355 nm. When Nd: YAG is used as a laser light source, the laser beam has an irradiation spot diameter of 5 to 300 μm, an energy density of 5 to 100 J / cm ² , and a pulse width (ie, irradiation time per one spot) of 10 It becomes 〜10001000 ns.

  Then, the laser irradiation device 200 irradiates the terminal 50 with a laser beam under the above conditions, thereby melting or vaporizing the metal thin film 62 and causing solidification or deposition of metal accompanying this. As a result, as shown in FIG. 4A, the bonding portion 53 having the first unevenness 71 and the second unevenness 72 is formed. Specifically, the first unevenness 71 is formed by irradiating a laser beam, and the second unevenness 72 is formed by depositing a metal generated by irradiating the laser beam, an oxide of the metal, or the like. It is formed.

  Here, as the wavelength of the laser beam, it is necessary to select a wavelength having a large absorptivity in the metal material to be processed. For example, as compared with the case of irradiating a laser beam having a wavelength of 1064 nm having a low absorptivity to copper or gold, the unevenness is more easily formed by irradiating a laser beam having a wavelength of 532 nm having a high absorptivity. Further, even if the laser beam is not pulsed and continuous oscillation is performed, and the other conditions are the same as the above conditions, the unevenness is not formed.

  It is presumed that this is because the evaporation of the metal is less likely to occur, and the re-deposition amount of the evaporation particles forming the unevenness is reduced.

Therefore, in this embodiment, the laser beam has a wavelength of 0.2 to 11 μm, an energy density of 100 J / cm ² or less, and a pulse width of 1 μs or less. Moreover, in the present embodiment, as described above, the metal thin film 62 is mainly composed of at least one of gold, tin, nickel, palladium, and silver. Therefore, as shown in FIG. 4A, the bonding portion 53 having the first unevenness 71 and the second unevenness 72 is formed.

  Further, since the laser beam is pulsed, it is irradiated for each irradiation spot. In the study of the present inventors, if the distance between adjacent irradiation spots is too wide, the re-deposition amount of evaporation particles forming the unevenness decreases, so the second unevenness 72 is not sufficiently formed, and the joint portion 53 and the connector It was confirmed that there is a possibility that the bonding with the case 40 may be reduced.

  Therefore, in the present embodiment, as shown in FIG. 8, assuming that the diameter of the irradiation spot S of the laser beam is x and the distance between the centers of the adjacent irradiation spots S is y1 and y2, y1 and y2 ≦ 20x. Then, the terminal 50 is irradiated with a laser beam. Thereby, as shown in FIG. 4A, the bonding portion 53 having the first unevenness 71 and the second unevenness 72 is appropriately formed. As shown in FIG. 8, assuming that one direction is a first direction and the direction orthogonal to the first direction is a second direction, the laser beam is scanned along the first direction and shifted in the second direction. It is again scanned along the first direction. Therefore, in the interval between the centers of adjacent irradiation spots S, the interval y1 in the first direction and the interval y2 in the second direction may have different values.

  Further, in the present embodiment, the laser irradiation device 200 is in a state in which the terminal 50 is inclined with respect to the irradiation direction. Then, in the laser irradiation apparatus 200, when a laser beam is scanned, one of the one surface 50a and the other surface 50b and one of the two bonding surface formation regions 53a of the two side surfaces 50c and 50d are irradiated. Do. For example, as shown in FIG. 9A, the laser irradiation apparatus 200 causes the one surface 50a and the side surface 50d to be irradiated with the laser beam when the laser beam is scanned. Thereafter, as shown in FIG. 9B, the laser irradiation apparatus 200 places the first structure 81 on the pallet 231 again with the adjustment jig disposed in the room 240 and scans the laser beam. The laser beam is applied to the other surface 50b and the side surface 50c. As a result, in the terminal 50, a joint portion 53 is formed which goes around the surface in the direction intersecting the axial direction.

  In this case, according to the study of the present inventors, it was confirmed that the side surfaces 50c and 50d of the terminal 50 may not be appropriately irradiated with the laser beam if the distance between the adjacent terminals 50 is too short. Specifically, according to the study of the present inventors, assuming that the thickness is T and the distance between the adjacent terminals 50 is L, the laser beam is directed to the side surfaces 50c and 50d when T / L> 10. It was confirmed that it could not be irradiated. Therefore, in the present embodiment, in the terminal formation step, the terminal 50 is formed so as to satisfy T / L ≦ 10. In addition, the thickness of the terminal 50 is, in other words, the length between the one surface 50a and the other surface 50b, and also the width of the side surfaces 50c and 50d.

  The above is the configuration of the laser irradiation apparatus 200 in the present embodiment. Then, when the first structure 81 is carried in by the transfer device 184, the bonding portion forming device 140 holds the first structure 81 by the receiving jig 210 and places the first structure 81 on the pallet 231. Then, the bonding portion forming device 140 forms the bonding portion 53 by the laser beam irradiation unit 250, and sends out the first structure 81 to the transfer device 185 by the sending jig 220.

  Here, the transport device 185 includes a housing member 190 as shown in FIGS. 5 and 7. In the present embodiment, the housing member 190 is formed of a box-shaped housing tray made of resin or the like, and is configured to be able to house a plurality of first structure bodies 81. Then, when the predetermined number of first structures 81 are accommodated in the accommodating member 190, the conveying device 185 conveys the accommodating member 190 to the inspection device 150.

  The inspection apparatus 150 is an apparatus for inspecting the shape of the bonding portion 53, and performs a process of inspecting the shape of the bonding portion 53. For example, the inspection apparatus 150 is configured using an image inspection camera capable of grasping the shape of the bonding portion 53, a control unit that performs abnormality determination, and the like. Then, when the first structure 81 is carried in from the transfer device 185, the inspection device 150 recognizes the shape of the bonding portion 53, and performs abnormality determination as to whether or not the bonding portion 53 has appropriate irregularities. , And sends out the first structure 81 determined to be normal to the transport apparatus 186. The inspection device 150 may be any device that can grasp the shape of the bonding portion 53. For example, the inspection device 150 may be configured to have a laser or the like.

  The assembling apparatus 160 is an apparatus for assembling the first structure 81 and the magnet 20 to the cap 30, and performs the process of assembling the first structure 81 and the magnet 20 to the cap 30 to form the second structure 82. Then, the assembly apparatus 160 sends the second structure 82 to the transport apparatus 187. In addition, the magnet 20 and the cap 30 are prepared separately from each process performed by said each apparatus, and are carried in to the assembly apparatus 160 suitably. However, the magnet 20 and the cap 30 may be stored in advance in the assembling apparatus 160 or may be formed in the manufacturing system.

  The connector case molding apparatus 170 is an apparatus for forming the connector case 40, and performs a process of forming the connector case 40. As shown in FIGS. 10A and 10B, a connector case molding apparatus 170 is provided with an upper mold 310, a lower mold 320 and a slide mold 370, and a gold in which a cavity 330 is formed between the upper mold 310 and the lower mold 320. It has a mold 300. Further, in the mold 300, an injection gate 340 for injecting the molten resin 40a into the cavity 330 and a runner 350 communicating with the injection gate 340 are formed, and a sprue 360 communicating with the runner 350 is formed.

  10A corresponds to a cross section taken along the line XA-XA in FIG. 10B. Further, in the present embodiment, when the second structure 82 is disposed in the cavity 330, the injection gate 340 is formed to be positioned closer to the portion facing the molded IC 10 than the portion facing the bonding portion 53. There is. More specifically, the injection gate 340 is formed in a portion facing the vicinity of the junction between the terminal portion 11 a and the terminal 50 when the second structure 82 is disposed in the cavity 330. Further, in the present embodiment, the connector case molding apparatus 170 corresponds to a resin member molding apparatus.

  Then, when the second structure 82 is disposed in the mold 300, the connector case molding apparatus 170 injects the molten resin 40 a from the injection gate 340 into the cavity 330 through the sprue 360 and the runner 350. Then, the molten resin 40 a is cooled and solidified to manufacture the connector case 40 that covers the second construct 82.

  As described above, the terminal 50 is in the form of a square pole having a rectangular cross section, and the width of the one surface 50a and the other surface 50b is longer than the width of the side surfaces 50c and 50d. That is, the terminal 50 is configured to be more easily bent when an external force is applied to the one surface 50a and the other surface 50b than when the external force is applied to the side surfaces 50c and 50d. For this reason, in the present embodiment, the second structure 82 is disposed so that the arrangement direction of the terminals 50 is substantially parallel to the direction in which the molten resin 40a is poured from the injection gate 340 in the mold 300. . As a result, the molten resin 40a poured from the injection gate 340 can easily reach the side surfaces 50c and 50d of the terminals 50 first, and the bending of the terminals 50 can be suppressed.

  The above is the configuration of the manufacturing system in the present embodiment. And in this embodiment, the above-mentioned rotation angle sensor is manufactured using the above-mentioned manufacturing system.

  Briefly explaining, the molded IC 10 is manufactured by the molded IC manufacturing apparatus 100. The terminal forming device 110 forms a terminal 50. Then, the terminal 11 a and the terminal 50 are connected by the connection device 120 to form the first structure 81.

  Next, the tie bar cutting device 130 cuts tie bars connecting the respective terminals 50. Then, the terminal 50 is irradiated with a laser beam by the bonding portion forming apparatus 140 to form the bonding portion 53. Thereafter, the inspection device 150 determines that the joint 53 is abnormal. Subsequently, the magnet 20 and the first structure 81 are assembled to the cap 30 by the assembling device 160 to form a second structure 82. After that, the second structure 82 composed of the first structure 81 is placed in the mold 300 of the connector case molding apparatus 170. Then, the molten resin 40 a is poured into the mold 300 and solidified to form the connector case 40 so that one end of the terminal 50 is exposed. As described above, the rotation angle sensor is manufactured.

  As described above, in the present embodiment, the joint portion 53 is formed in the terminal 50. The connector case 40 and the joint portion 53 are joined. For this reason, the bondability between the connector case 40 and the terminal 50 can be improved, and intrusion of foreign matter such as water or oil from the opening 41 side of the connector case 40 can be suppressed. Therefore, it can suppress that the reliability of a rotation angle sensor falls.

  Further, by forming the bonding portion 53 in the terminal 50 and bonding with the connector case 40, the entry of foreign matter is suppressed. Therefore, an increase in the number of parts can be suppressed.

  The first unevenness 71 has a height of 0.5 to 50 μm, and the second unevenness 72 has a height of 0.5 to 500 nm. For this reason, sealability (that is, bonding property) can be exhibited by the first unevenness 71, and stress to the first unevenness can be relieved by the second unevenness 72. Therefore, the bondability between the connector case 40 and the joint portion 53 can be improved.

  Furthermore, in the present embodiment, the terminal 50 is configured by forming the metal thin film 62 on the surface of the base 61. The metal thin film 62 is mainly composed of at least one of gold, tin, nickel, palladium, and silver. For this reason, when irradiating the laser beam to form the bonding portion 53, the bonding portion 53 having the appropriate first unevenness 71 and the second unevenness 72 is formed.

Further, in the present embodiment, the wavelength is 0.2 to 11 μm, the energy density is 100 J / cm ² or less, and the pulse width is 1 μs or less. For this reason, when irradiating the laser beam to form the bonding portion 53, the bonding portion 53 having the appropriate first unevenness 71 and the second unevenness 72 is formed.

  Furthermore, in the present embodiment, assuming that the diameter of the irradiation spot S of the laser beam is x and the distance between the centers of the adjacent irradiation spots S is y1 and y2, the laser beam is such that 0.01x ≦ y1 and y2 ≦ 20x. To the terminal 50. Therefore, when forming the bonding portion 53 by irradiating the laser beam, while suppressing the disappearance of the second unevenness 72 formed by the previous laser beam by the later laser beam, the second unevenness is formed at an appropriate interval. 72 can be formed. Therefore, it can suppress that the bondability of the connector case 40 and the junction part 53 falls.

  Further, assuming that the thickness of the terminal 50 is T, and the distance between the adjacent terminals 50 of the portion where the bonding portion 53 is formed is L, T / L ≦ 10. For this reason, when forming the junction part 53 by irradiating a laser beam, it can suppress that the junction part 53 is not formed in side 50c of the terminal 50, and 50d. Therefore, it can suppress that the bondability of the connector case 40 and the junction part 53 falls.

Second Embodiment
The second embodiment will be described. In the present embodiment, the thickness of the portion covering the joint portion 53 in the connector case 40 is reduced compared to the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 11, in the connector case 40, the thickness of the portion covering the joint portion 53 of the terminal 50 is thinner than the thickness of the portion different from the portion covering the joint portion 53. There is. Specifically, in the connector case 40, the joint portion 53 is formed by covering the joint surface 53 with the joint portion 53 along the portion corresponding to the joint portion 53. The thickness of the part covering the is reduced.

  The thickness of the portion covering the terminal 50 in the connector case 40 refers to the length between the surfaces 50a to 50d of the terminal 50 and the outer wall surfaces facing the surfaces 50a to 50d. That is, the thickness of the portion covering the bonding portion 53 in the connector case 40 is the portion of each of the surfaces 50 a to 50 d of the terminals 50 where the bonding portion 53 is formed and the outer wall surface of the connector case 40 facing the portion. And the length between. Further, the thickness of a portion different from the portion covering the joint portion in the connector case 40 is a portion where the joint portion 53 is not formed in each of the surfaces 50 a to 50 d of the terminal 50 and the connector case 40 facing the portion Is the length between the outer wall of the

  Such a rotation angle sensor is manufactured by changing the mold 300 in the process of forming the connector case 40 of the first embodiment. That is, in the present embodiment, as shown in FIG. 12, as the mold 300, a convex portion for forming a recess is formed in the upper mold 310 to protrude toward the cavity 330, and the lower mold 320 protrudes toward the cavity 330. The thing in which the convex part 321 for recessed part formation was formed is prepared. In addition, the convex part for recessed part formation formed in the upper mold | type 310 is formed in a cross section different from FIG. Then, by pouring the molten resin 40 a into the cavity 330, the connector case 40 in which the recess 42 is formed by the recess forming protrusion formed on the upper die 310 and the recess forming protrusion 321 formed on the lower die 320. Is manufactured.

  Here, the following problems may occur when the present inventors examined a resin molded product in which the insert formed of the metal material and having the above-described bonding portion 53 is covered with the resin member. confirmed.

  That is, in order to manufacture such a resin molded body, as shown in FIG. 13A, first, the insert 400 in which the joint portion 53 is formed is disposed in the mold 300, and the molten resin covers the insert 400. Pour 410 into the mold 300. The insert 400 shown in FIG. 13A has a bonding portion 53 of the above shape formed on the surface. In addition, the insert 400 has the same configuration as the terminal 50 described above.

  Then, as shown in FIG. 13B, when the temperature of the molten resin 410 is lowered, the curing is started from the surface of the molten resin 410, that is, the surface in contact with the insert 400 and the mold 300. Then, after the cured portion 411a is formed on the insert 400 side and the cured portion 411b is formed on the mold 300 side of the molten resin 410, cooling solidification and shrinkage of the uncured portion 412 which is not cured proceeds . At this time, the cured portion 411 a is cured in a state of being bonded to the bonding portion 53 in the bonding portion 53.

  Thereafter, as shown in FIG. 13C, in the portion on the insert 400 side of the uncured portion 412, since the cured portion 411a is joined to the insert 400, the cured portion 411a is between the insert 400 and With no gap formed, internal cooling and solidification progress. On the other hand, in the portion on the mold 300 side of the uncured portion 412, since the cured portion 411b is not joined to the mold 300, a gap is formed between the cured portion 411b and the mold 300, Solidification and contraction of internal cooling progress.

  For this reason, in the portion on the insert 400 side of the uncured portion 412, a negative pressure is more likely to be relatively generated than the other uncured portion 412. Therefore, in the uncured portion 412, the vacuum void 420 tends to be concentrated in the vicinity of the cured portion 411a on the insert 400 side, and the vacuum void 420 is connected in the vicinity of the cured portion 411a (below, the vacuum void It may be called connection). In this case, the bonding strength between the insert 400 and the resin member 430 is reduced due to the vacuum void connection, which causes the reduction in the bonding property between these members.

  A portion of the insert 400 in which the joint portion 53 is not formed is as shown in FIG. That is, in this portion, when the temperature of the molten resin 410 is lowered, the cured portion 411a is formed on the insert 400 side and the cured portion 411b is formed on the mold 300 side because the bonding portion 53 is formed. It is the same as the However, since the hardened portion 411 a is not joined to the insert 400, cooling solidification and contraction of the unhardened portion 412 proceed in a state where a gap is formed between the hardened portion 411 a and the insert 400. Therefore, the vacuum void 420 is easily formed so as to be scattered between the hardened portion 411a and the hardened portion 411b in the molten resin 410, and the vacuum void connection is hard to occur.

  Then, when the present inventors conducted further studies on vacuum void connection, the result shown in FIG. 15 was obtained. FIG. 15 is a view showing a resin molded body composed of an insert 400 and a resin member 430 made of a thermoplastic resin covering a part of the insert 400. As shown in FIG. Further, in FIG. 15, in the insert 400, the joint portion 53 is formed on a part of the surface, and the remaining part of the surface is an untreated portion 401 in which the joint portion 53 is not formed. Further, in FIG. 15, a portion of the resin member 430 covering the joint portion 53 is a thick portion 430 a having a large thickness, and the remaining portion is a thin portion 430 b having a large thickness. The portion of the resin member 430 which covers the non-processed portion 401 is all configured to be thick.

  As shown in FIG. 15, it is confirmed that the vacuum void 420 and the vacuum void connection portion are generated in the thick portion 430 a in the portion covering the bonding portion 53 in the resin member 430. However, in the thin portion 430b of the resin member 430, it is confirmed that the vacuum void 420 and the vacuum void connection hardly occur. This is because, when the thickness of the resin member 430 is large, it takes time for the uncured portion 412 to cure. Therefore, as shown in FIG. 13C, the shrinkage stress in the vicinity of the cured portion 411a of the uncured portion 412 It is because vacuum void connection is likely to occur when the state of concentrated

  In the portion covering the unprocessed portion 401 of the resin member 430, it is confirmed that the vacuum voids 420 are scattered inside. Further, a region R1 shown in FIG. 15 is a region corresponding to FIGS. 13A to 13C, and a region R2 is a region corresponding to FIG.

  As described above, by reducing the thickness of the portion covering the bonding portion 53 of the connector case 40, the occurrence of vacuum void connection can be suppressed, and the bonding property between the bonding portion 53 and the connector case 40 is reduced. Can be suppressed. According to the study of the present inventors, when the thickness of the portion covering the joint portion 53 is, for example, 2 mm or less, the reduction effect of the vacuum void 420 is remarkably obtained, and when it is 1 mm or less, the effect is more effective. It was confirmed that it could be obtained. Therefore, in the present embodiment, the connector case has a thickness in the vicinity of the joint of 2 mm or less.

  As described above, in the present embodiment, the connector case 40 has the recess 42, and the thickness of the portion covering the joint portion 53 of the terminal 50 is different from that of the joint portion 53 of the terminal 50. It is thinner than the part covering the part. For this reason, it can suppress that a vacuum void connection is comprised by the part at the side of the junction part 53 in connector case 40. FIG. Therefore, it can suppress that the joint strength of the junction part 53 and the connector case 40 falls.

(Modification of the second embodiment)
A modification of the second embodiment will be described. In the second embodiment, the recess 42 may not have a shape that goes around the outer wall surface of the connector case 40. For example, the recess 42 may be formed in a portion facing only the joint portion 53 formed on one surface 50 a and the other surface 50 b of the outer wall surface of the connector case 40. Even with such a configuration, since the vacuum void connection is unlikely to occur in the vicinity of the bonding portion 53 formed on the one surface 50a and the other surface 50b, the same effect as that of the second embodiment can be obtained.

Third Embodiment
A third embodiment will be described. In the present embodiment, a through hole is formed instead of the recess 42 in the connector case 40 in the second embodiment. The other aspects are the same as in the second embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 16, a through hole 43 is formed at a position corresponding to the joint portion 53 in the connector case 40. In the present embodiment, the through holes 43 are formed at positions corresponding to the bonding portions 53 formed on the one surface 50 a and the other surface 50 b of the terminal 50. For this reason, in this rotation angle sensor, the occurrence of the vacuum void connection in the vicinity of the bonding portion 53 formed on the one surface 50 a and the other surface 50 b is suppressed.

  In the present embodiment, the distance between the joint portion 53 and the through hole 43 is the thickness of the portion covering the joint portion 53 in the connector case 40. Therefore, when forming the through holes 43 in the connector case 40, it is preferable that the distance between the joint portion 53 and the through holes 43 be 2 mm or less. Further, in the present embodiment, the recess 42 is not formed on the outer wall surface of the connector case 40. For this reason, the connector case 40 has substantially the same outer peripheral length that goes around the outer wall surface in the circumferential direction along the axial direction.

  Such a rotation angle sensor is manufactured by changing the mold 300 in the process of forming the connector case 40 of the first embodiment. That is, although not shown in the drawings, as the mold 300, it is necessary to have a through hole forming convex portion corresponding to the formation of the through hole 43. Then, by pouring the molten resin 40 a into the cavity 330, the connector case 40 in which the through hole 43 is formed by the through hole forming convex portion is manufactured.

  As described above, even if the thickness of the portion covering the joint portion 53 is reduced by forming the through hole 43 in the connector case 40, the same effect as that of the second embodiment can be obtained. .

  Further, in the present embodiment, by forming the through holes 43 in the connector case 40, the thickness of the portion covering the joint portion 53 of the connector case 40 is reduced. There is no need to form 42. For this reason, for example, it is possible to cope with the case where the recess 42 can not be formed on the outer wall surface due to the restriction on the mounted device side such as a vehicle.

(Modification of the third embodiment)
A modification of the third embodiment will be described. In the third embodiment, an example in which the through hole 43 is formed in the connector case 40 at a position corresponding to the joint portion 53 formed on the one surface 50a and the other surface 50b of the terminal 50 has been described. However, through holes 43 may be formed in the connector case 40 at positions corresponding to the joint portions 53 formed on the side surfaces 50 c and 50 d of the terminal 50. In this case, generation of vacuum void connection in the vicinity of the bonding portion 53 formed on the side surfaces 50c and 50d is suppressed.

Fourth Embodiment
A fourth embodiment will be described. In the present embodiment, a groove portion is formed in the connector case 40 in contrast to the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 17A, in the connector case 40, the thickness of the portion covering one end side of the portion covering the joint portion 53 of the terminal 50 is the portion covering the joint portion 53. It is thinner. Specifically, in the connector case 40, a groove 44 is formed on the outer wall surface of the portion covering one end portion side of the portion covering the joint portion 53 in the circumferential direction with respect to the axial direction.

  Such a rotation angle sensor is manufactured by changing the mold 300 in the process of forming the connector case 40 of the first embodiment. That is, in the present embodiment, as shown in FIG. 18, as the mold 300, a groove-forming convex portion that protrudes toward the cavity 330 is formed in the upper mold 310 and protrudes toward the cavity 330 in the lower mold 320. A groove-forming protrusion 322 is prepared. The groove-forming convex portion formed in the upper mold 310 is formed in a cross section different from that in FIG. 18.

  Then, by pouring the molten resin 40 a into the cavity 330, the connector case 40 in which the groove 44 is formed by the groove forming convex formed on the upper mold 310 and the groove forming convex 322 formed on the lower mold 320. Is manufactured. The configuration of the mold 300 according to this embodiment is the same as that of the first embodiment except for the above, and the injection gate 340 is molded more than the bonding portion 53 when the second component 82 is disposed in the cavity 330. It is formed to be located on the IC 10 side. That is, the rotation angle sensor forms the connector case 40 in which the portion covering the downstream side in the flow direction of the molten resin 40 a than the bonding portion 53 is thinner than the portion covering the bonding portion 53. Manufactured by

  At this time, the groove-forming convex of the upper mold 310 and the groove-forming convex 322 of the lower mold 320 are located downstream of the joint 53 in the flow direction of the molten resin 40 a injected from the injection gate 340. It will be. Therefore, as shown in FIG. 19, after the molten resin 40 a is injected into the cavity 330, the groove forming convex of the upper mold 310 and the groove forming convex 322 of the lower mold 320 and the terminal 50 The flow cross section decreases as it passes between. Therefore, when the molten resin 40 a reaches the groove forming convex part of the upper mold 310 and the groove forming convex part 322 of the lower mold 320, the resin pressure becomes high, and easily flows into the unevenness formed in the joint part 53. That is, the upper groove-forming convex portion and the lower groove-forming convex exhibit the function as a diaphragm. Therefore, the bondability between the connector case 40 and the terminal 50 can be improved.

  In addition, the flow cross-sectional area here is the area of the flow front of the molten resin 40a.

  As described above, in the present embodiment, the groove portion 44 is formed in the connector case 40 at a portion closer to the one end portion than the portion facing the joint portion 53 in the outer wall surface. Then, when forming the connector case 40, the molten resin 40 a injected from the injection gate 340 reaches the joint portion 53 and reaches the portion where the groove 44 is to be formed. That is, when the connector case 40 is formed, the molten resin 40 a injected from the injection gate 340 has a smaller flow cross-sectional area after reaching the joint portion 53. Therefore, when forming the connector case 40, the resin pressure of the molten resin 40a in the vicinity of the joint portion 53 can be increased, and the jointability between the connector case 40 and the joint portion 53 can be improved.

(Modification of the fourth embodiment)
A modification of the fourth embodiment will be described. In the fourth embodiment, an example has been described in which the injection gate 340 is formed to be closer to the mold IC 10 than the bonding portion 53 when the second structure 82 is disposed in the cavity 330. However, when the second structure 82 is disposed in the cavity 330, the injection gate 340 may be located on the side opposite to the mold IC 10 with respect to the bonding portion 53. That is, the injection gate 340 may be disposed closer to one end of the terminal 50 than the junction 53. In this case, the groove-forming convex portion of the upper mold 310 and the groove-forming convex portion 322 of the lower mold 320 are positioned closer to the mold IC 10 than the bonding portion 53 when the second construct 82 is disposed in the cavity 330. It should just be formed to do. That is, in the present embodiment, if the flow cross-sectional area is smaller on the downstream side than the bonding portion 53 in the flow direction of the molten resin 40a injected from the injection gate 340, the groove 44 formed in the connector case 40 The position can be changed as appropriate.

  In the fourth embodiment, the groove 44 may not have a shape that goes around the outer wall surface of the connector case 40. For example, the groove portion 44 may be formed in a portion facing only the joint portion 53 formed on one surface 50 a and the other surface 50 b of the outer wall surface of the connector case 40. Even with such a configuration, since the molten resin 40a can easily flow into the joint portion 53 formed on the first surface 50a and the second surface 50b, the same effect as that of the fourth embodiment can be obtained.

  Furthermore, in the fourth embodiment, as shown in FIG. 17B, the bonding portion 53 may be formed closer to the opening 41. Even with such a configuration, since the flow cross-sectional area is reduced at the portion constituting the opening 41, the same effect as that of the fourth embodiment can be obtained.

  The fourth embodiment can also be combined with the second embodiment. In this case, the depth of the groove 44 may be made deeper than the depth of the recess 42.

Fifth Embodiment
A fifth embodiment will be described. In the present embodiment, a thick portion is formed in the terminal 50 in contrast to the fourth embodiment. The other aspects are similar to those of the fourth embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIGS. 20 and 21, the terminal 50 is formed with a thick portion 54 on one end side of the portion where the bonding portion 53 is formed. The thick portion 54 is configured to be larger than the portion where the joint portion 53 is formed in the size of the cross section in which the axial direction is the normal direction. In the present embodiment, the thick portion 54 is generally larger on the surfaces 50 a to 50 d than the portion where the bonding portion 53 is formed in the size of the cross section in which the axial direction is the normal direction. Also, the terminals 50 located at both ends in the arrangement direction of the terminals 50 are formed to be thicker on the side opposite to the terminal 50 located at the center. FIG. 21 is a perspective view of the vicinity of the bonding portion 53 of the terminal 50 located at the lowermost side in the drawing of FIG.

  Such a rotation angle sensor is manufactured, for example, by changing the base material 61 which comprises the terminal 50 in the process of forming the terminal 50 of the said 1st Embodiment. That is, in the step of forming the terminal 50, for example, as shown in FIG. 22, the metal plate 90 on which the convex portion 91 is formed by rolling, cutting or the like is prepared. In addition, in FIG. 22, the metal plate 90 made into hoop shape after the convex part 91 was formed is shown.

  Then, in the step of forming the terminal 50, when the metal plate 90 is press-formed to form the base 61, the metal plate 90 is also press-formed so that a convex portion connected to the convex portion 91 is also formed on the cut-out surface. Then, the metal thin film 62 is formed on the base material 61 to form the terminal 50, whereby the terminal 50 in which the thick portion 54 is formed is prepared.

  Thereafter, as shown in FIG. 23, the second structure 82 having the terminal 50 in which the thick portion 54 is formed is disposed in the mold 300 to form the connector case 40. Thereby, the rotation angle sensor shown in FIG. 22 is manufactured.

  At this time, the thick portion 54 narrows the distance between the thick portion 54 and the mold 300. That is, as in the fourth embodiment, after the molten resin 40 a is injected into the cavity 330, the flow cross-sectional area becomes smaller when passing between the thick portion 54 and the mold 300. Therefore, the bondability between the connector case 40 and the terminal 50 can be improved.

  As described above, by forming the thick-walled portion 54 in the terminal 50, even if the flow cross-sectional area of the molten resin 40a decreases after reaching the bonding portion 53, the fourth embodiment is described. The same effect can be obtained. Further, in the present embodiment, since the distance between the thick portion 54 and the mold 300 can be adjusted by changing the shape of the thick portion 54 of the terminal 50, for example, the convex portion or the like is changed to the mold 300. The design can be easily changed as compared with the case where

(Modification of the fifth embodiment)
A modification of the fifth embodiment will be described. As in the modification of the fourth embodiment, the injection gate 340 may be located on the opposite side of the molding IC 10 side than the bonding portion 53 when the second structure 82 is disposed in the cavity 330. In this case, the thick portion 54 of the terminal 50 may be formed closer to one end than the joint 53.

  Moreover, in the said 5th Embodiment, the thick part 54 may be made into the shape protruded only to the one surface 50a and the other surface 50b side, for example.

Sixth Embodiment
A sixth embodiment will be described. In the present embodiment, a thick-walled portion is formed in the terminal 50 in contrast to the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 24, in the terminal 50, a thick portion 55 is formed at a portion closer to the terminal portion 11a than the portion where the bonding portion 53 is formed. The shape of the thick portion 55 is the same as that of the thick portion 54 of the fifth embodiment. That is, in the present embodiment, in the connector case 40, the thickness of the portion covering the other end side of the portion covering the joint portion 53 in the terminal 50 is thinner than the portion covering the joint portion 53. .

  Such a rotation angle sensor is manufactured as follows. First, in the step of forming the terminal 50 of the fifth embodiment, the base plate 61 is formed by preparing the metal plate 90 in which the location where the convex portion 91 is formed is changed. Then, as shown in FIG. 25, the second structure 82 having the terminal 50 in which the thick portion 55 is formed is disposed in the mold 300, and the connector case 40 is formed. The mold 300 of this embodiment is the same as the first embodiment, and the injection gate 340 is positioned closer to the mold IC 10 than the bonding portion 53 when the second structure 82 is disposed in the cavity 330. It is formed to be. That is, in the rotation angle sensor, the connector case 40 is formed in which the portion covering the upstream side in the flow direction of the molten resin 40 a than the bonding portion 53 has a thinner thickness than the portion covering the bonding portion 53. Manufactured by

  At this time, although the molten resin 40a injected from the injection gate 340 spreads along the axial direction from the injection gate 340, the spreading is suppressed by the thick portion 55, and the circumferential direction of the axial direction is easily spread. . That is, the junction of the molten resin 40 a injected from the injection gate 340 formed in the upper mold 310 and the molten resin 40 a injected from the injection gate 340 formed in the lower mold 320 is injected from the thick portion 55. It is likely to occur on the gate 340 side. That is, the junction of the molten resin 40 a injected from the injection gate 340 formed in the upper mold 310 and the molten resin 40 a injected from the injection gate 340 formed in the lower mold 320 is in the vicinity of the joint 53. It becomes difficult. Therefore, formation of a weld surface on the connector case 40 in the vicinity of the joint portion 53 can be suppressed.

  As described above, in the present embodiment, the thick portion 55 is formed in the terminal 50 at a portion closer to the terminal portion 11 a than the portion where the bonding portion 53 is formed. Then, when forming the connector case 40, the molten resin 40 a injected from the injection gate 340 flows to the joint portion 53 after reaching the thick portion 55. Therefore, when the connector case 40 is formed, formation of a weld surface in the vicinity of the bonding portion 53 can be suppressed, and deterioration in the bonding property between the connector case 40 and the bonding portion 53 can be suppressed.

(Modification of the sixth embodiment)
A modification of the sixth embodiment will be described. In the sixth embodiment, an example in which the thick portion 55 is formed on the terminal 50 has been described. However, a protrusion corresponding to the thick portion may be formed on the mold 300. However, in the case where the thick portion 55 is formed in the terminal 50, the design change is easier.

  In the sixth embodiment, as in the modification of the fourth embodiment, the injection gate 340 is on the side opposite to the mold IC 10 with respect to the bonding portion 53 when the second structure 82 is disposed in the cavity 330. It may be located at In this case, the thick portion 55 of the terminal 50 may be formed closer to one end than the joint portion 53. That is, in the sixth embodiment, if the flow cross-sectional area is smaller on the upstream side than the bonding portion 53 in the flow direction of the molten resin 40a injected from the injection gate 340, the formation location of the thick portion 55 is appropriate. It can be changed.

  Further, in the sixth embodiment, for example, when the injection gate 340 is positioned further on the left side of the drawing in FIG. 25, a convex portion or the like corresponding to the thick portion 55 is formed on the cap 30 or the mold IC 10 Good. That is, the joining portion between the molten resin 40 a injected from the injection gate 340 formed in the upper mold 310 and the molten resin 40 a injected from the injection gate 340 formed in the lower mold 320 is unlikely to be near the joint 53 In this case, the thick portion 55 may not be formed on the terminal 50.

  Furthermore, in the sixth embodiment, the thick portion 54 may be, for example, shaped so as to protrude only to the one surface 50a and the other surface 50b.

Seventh Embodiment
A seventh embodiment will be described. In the present embodiment, air bubbles are formed in the connector case 40 as compared with the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 26 and FIG. 27, in the terminal 50, a plurality of through holes 56a are formed in portions different from the joint portion 53. Specifically, the through hole 56a is formed between the positioning hole 52 and the joint 53 and between the joint 53 and one end so as to penetrate between the one surface 50a and the other surface 50b. ing. Then, in the connector case 40, air bubbles 45 are formed around the portion where the through holes 56a are formed. In the present embodiment, the through hole 56a corresponds to the bubble forming portion.

  Such a rotation angle sensor is manufactured as follows. First, in the step of forming the terminal 50 of the first embodiment, the through hole 56a is formed by performing press forming, laser processing, or the like after the terminal 50 is formed. Then, the connector case 40 is formed using the terminal 50.

  Under the present circumstances, since the through-hole 56a is formed in the terminal 50, when the molten resin 40a reaches the through-hole 56a, it will be in the state which bites in air. For this reason, when the molten resin 40 a is cooled and solidified to form the connector case 40, the trapped air expands to form a bubble 45. That is, in the present embodiment, the air bubble 45 is actively formed in a portion different from the portion covering the joint portion 53 in the connector case 40.

  As described above, in the present embodiment, the air bubble 45 is formed in the connector case 40 at a portion different from the portion covering the joint portion 53. And such a connector case 40 is formed when it comprises the connector case 40 from molten resin 40a. For this reason, when the molten resin 40 a cools and solidifies, a portion in the vicinity of the bonding portion 53 does not easily become negative pressure due to air bubbles, and contraction stress generated in the bonding portion 53 can be reduced. Therefore, it becomes difficult to generate a vacuum void connection in the vicinity of the bonding portion 53 of the connector case 40, and it is possible to suppress a decrease in the bonding property between the bonding portion 53 and the connector case 40.

(Modification of the seventh embodiment)
Although the seventh embodiment has described an example in which the through holes 56a as the bubble forming portion are formed in the terminal 50, the bubble forming portion is not limited to this. For example, as shown in FIG. 28A, the bubble forming portion may be further configured with a plurality of through holes 56a. In addition, although not particularly illustrated, the bubble forming portion may be a through hole penetrating through the side surfaces 50 c and 50 d of the terminal 50 or may be a hole not penetrating the terminal 50. Furthermore, as shown in FIG. 28B, the bubble forming portion may be a groove 56 b formed on one surface 50 a of the terminal 50. In this case, as shown in FIG. 28C, the groove 56b may be formed in a lattice. Although not particularly illustrated, in FIGS. 28B and 28C, the groove 56b may be appropriately formed on the other surface 50b and the side surfaces 50c and 50d of the terminal 50.

  Furthermore, as shown in FIG. 29, the bubble forming portion may be configured by a bent portion 56c in which the terminal 50 is bent. In addition, in FIG. 29, the other surface 50b is showing the bending part 56c bent in the one surface 50b side.

  When the connector case 40 is formed using such a terminal 50, as shown in FIGS. 30A and 30B, the molten resin 40a joins on the downstream side in the flow direction of the molten resin 40a in the bending portion 56c. At this time, air is likely to be caught in the joining portion. Therefore, the air bubble 45 is formed around the bent portion 56c.

Eighth Embodiment
An eighth embodiment will be described. In the present embodiment, the thickness of the metal thin film 62 at the terminal 50 is changed with respect to the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 31, in the metal thin film 62 in the terminal 50, the portion where the bonding portion 53 is formed is thicker than the portion where the bonding portion 53 is formed. In the present embodiment, the metal thin film 62 is thicker in the portion where the bonding portion 53 is formed than the portion where the opening portion 41 is exposed.

  Such a terminal 50 is formed by performing, for example, the process of forming the metal thin film 62 twice in the process of forming the terminal 50 of the first embodiment. For example, the bonding portion 53 is formed by forming the metal thin film 62 for the first time on the portion including the bonding portion 53 with respect to the base material 61 and then forming the metal thin film 62 for the second time on the whole. A portion of the metal thin film 62 can be thicker than the other portions of the metal thin film 62.

  As described above, in the present embodiment, in the metal thin film 62 in the terminal 50, the portion where the bonding portion 53 is formed is thicker than the portion where the bonding portion 53 is formed. Therefore, for example, when forming the bonding portion 53 by irradiating the laser beam, the base material 61 penetrates the metal thin film 62 as compared with the case where the thickness of the thin part of the metal thin film 62 is constant. Is suppressed from being exposed. That is, it can be suppressed that the bonding portion 53 is not appropriately formed on the terminal 50. Furthermore, for example, as compared with the case where the thickness of the thick portion of the metal thin film 62 is constant, it is possible to reduce the material constituting the metal thin film 62.

The ninth embodiment
A ninth embodiment will be described. In the present embodiment, a recessed portion is formed in the terminal 50 and a bonding portion 53 is formed in the recessed portion, as compared with the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 32, in the terminal 50, the recess portion 57 is formed in the one surface 50a and the other surface 50b. The bonding portion 53 is formed on the bottom surface of the recessed portion 57. That is, the bonding portion 53 is formed at a position recessed from the periphery of the one surface 50 a and the other surface 50 b.

  Such a terminal 50 is formed by changing the step of forming the terminal 50 of the first embodiment and the step of forming the joint portion 53.

  That is, in the step of forming the terminal 50, for example, the metal plate 90 forming the base 61 is changed. For example, in the step of forming the terminal 50, as shown in FIG. 33, the metal plate 90 in which the recess 92 is formed by rolling, cutting or the like is prepared. And the base material 61 which comprises the terminal 50 from this metal plate 90 is formed by press molding etc. Thereafter, the metal thin film 62 is formed on the base 61 to form the terminal 50 in which the recess 57 is formed.

  Then, in the step of forming the bonding portion 53, the laser beam is irradiated so that the bonding portion 53 is formed including the bottom surface of the recessed portion 57. Thus, the terminal 50 shown in FIG. 32 is formed.

  As described above, in the present embodiment, the bonding portion 53 is formed in the recessed portion 57 of the terminal 50. Therefore, as shown in FIGS. 7 and 34, when the first construct 81 is mounted on the housing member 190 after the step of forming the joint portion 53, the one surface 50a side or the other surface 50b side is By being directed to the side of the mounting surface 190 a of the housing member 190, the joint portion 53 hardly contacts the housing member 190. Therefore, it can suppress that the unevenness | corrugation which comprises the junction part 53 is destroyed, and can suppress that the bondability of the junction part 53 and the connector case 40 falls. In the present embodiment, since the housing member 190 is constituted by a box-shaped housing tray, the mounting surface 190a is constituted by the bottom surface of the housing tray.

(Modification of the ninth embodiment)
A modification of the ninth embodiment will be described. In the ninth embodiment, as shown in FIG. 35, the terminal 50 may have a recess 57 formed on the side surfaces 50c and 50d. And the junction part 53 may be made to be formed in the bottom of hollow part 57 formed in each field 50a-50d. According to this, the bonding portion 53 can be further protected, and the decrease in the bonding property between the bonding portion 53 and the connector case 40 can be suppressed.

  In addition, such a terminal 50 is formed, for example, when forming the base material 61 which comprises the terminal 50 from the metal plate 90, using the press apparatus which can form the hollow part 57 also in side 50c, 50d. .

  In the ninth embodiment, for example, when it is determined that the other surface 50b side is directed to the mounting surface 190a side of the accommodation member 190 when it is placed on the accommodation member 190, a recess is provided. The portion 57 may be formed only on the other surface 50b side.

Tenth Embodiment
A tenth embodiment will be described. In the present embodiment, a convex portion is formed around the joint portion 53 of the terminal 50 in the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 36, in the terminal 50, a first convex portion 58a and a second convex portion 58b configured by bending the terminal 50 are formed around the joint portion 53. There is. Specifically, two first convex portions 58 a are formed on the terminal 50 so as to protrude to the one surface 50 a side of the bonding portion 53 and to sandwich the bonding portion 53. Further, two second convex portions 58 b are formed on the terminal 50 so as to project to the other surface 50 b side with respect to the joint portion 53 and to sandwich the joint portion 53. That is, the joint portion 53 is located between the first convex portion 58a and the second convex portion 58b, and is formed at a position recessed from the periphery of the one surface 50a and the other surface 50b.

  In addition, since the first convex portion 58a and the second convex portion 58b are configured by being bent, the first convex portion 58a and the second convex portion 58b are formed on the whole between the facing side surfaces 50c and 50d.

  Such a terminal 50 is formed by changing the step of forming the terminal 50 of the first embodiment and the step of forming the joint portion 53. That is, in the step of forming the terminal 50, the terminal 50 is bent by a jig or the like so that the first convex portion 58a and the second convex portion 58b are formed. Then, in the step of forming the bonding portion 53, the bonding portion 53 is formed between the two first convex portions 58a. Thus, the terminal 50 of the present embodiment is formed.

  As described above, in the present embodiment, in the terminal 50, the first convex portion 58a and the second convex portion 58b are formed around the bonding portion 53. Therefore, as in the ninth embodiment, when the first construct 81 is placed on the housing member 190, the one surface 50a side or the other surface 50b side is directed to the mounting surface 190a side of the housing member 190. By doing this, it is possible to suppress that the unevenness that constitutes the bonding portion 53 is broken. Therefore, it can suppress that the bondability of the junction part 53 and the connector case 40 falls.

(Modification of the tenth embodiment)
A modification of the tenth embodiment will be described. In the tenth embodiment, the first convex portion 58a is formed on the entire surface 50a between the opposing side surfaces 50c and 50d, and the second convex portion 58b is between the opposing side surfaces 50c and 50d on the other surface 50b. Although the example formed in the whole of is demonstrated, it is not limited to this. For example, as shown in FIGS. 38 and 39, the first convex portion 58a may be formed substantially at the center between the facing side surfaces 50c and 50d of the one surface 50a. In addition, the second convex portion 58b may be formed at a substantially central portion between the facing side surfaces 50c and 50d of the other surface 50b. The first convex portion 58a and the second convex portion 58b are formed by pressing with a punch or the like.

  Furthermore, as shown in FIG. 40, the first convex portion 58a is formed on the side surface 50c, 50d side in the one surface 50a, and the second convex portion 58b is formed on the side surface 50c, 50d side in the other surface 50b. It is also good.

  Further, as shown in FIG. 41, when forming the base material 61 constituting the terminal 50, a claw portion is formed on the side surface 50c, 50d, and the first convex portion 58a and the convex portion are bent by bending the claw portion. You may make it form the 2nd convex part 58b.

Eleventh Embodiment
An eleventh embodiment will be described. In the present embodiment, a shaving process is performed on the base material 61 constituting the terminal 50 in the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  Here, as described above, the terminal 50 is configured using the base material 61 formed by press-forming the metal plate 90 in the step of forming the terminal 50. Under the present circumstances, as the base material 61 is shown by FIG. 42A and FIG. 42B, the processing surface 61a formed by press molding turns into a surface in which the sag 61b, the shear surface 61c, and the torn surface 61d were mixed.

  In this case, when the terminal 50 is configured by using the base 61, the laser beam is irradiated on the surface (for example, the side surfaces 50c and 50d) configured by the processing surface 61a to form the bonding portion 53. The beam may be scattered. For this reason, even if it irradiates with a laser beam, the junction part 53 which has appropriate unevenness may not be formed.

  For this reason, in the present embodiment, as shown in FIGS. 43A and 43B, in the step of forming the terminal 50, the base 61 is formed by press forming the metal plate 90, and then formed by press forming. A shaving process is performed on the processing surface 61a. As a result, the machined surface 61a can be made into a sheared surface 61c having substantially high smoothness. Accordingly, when forming the bonding portion 53 by irradiating the surface of the terminal 50 formed by the processing surface 61 a with the laser beam, unevenness is not appropriately formed, and the bonding portion 53 is not formed. it can.

  As described above, in the present embodiment, after forming the base material 61 from the metal plate 90, the shaving process is performed on the processing surface 61a. For this reason, when forming the terminal 50 using the base material 61, it can suppress that an unevenness | corrugation is not formed appropriately. Therefore, it can suppress that the bondability of the connector case 40 and the junction part 53 falls.

(Modification of the eleventh embodiment)
A modification of the eleventh embodiment will be described. As described above, the shaving process is performed to remove the sagging 61 b and the fracture surface 61 d and to set the machined surface 61 a as the sheared surface 61 c. For this reason, the base material 61 may be formed from the metal plate 90 by a processing method in which the sag 61 b or the fracture surface 61 d is not easily generated, and the shaving processing may not be performed. For example, the base 61 may be formed from the metal plate 90 by fine blanking. Further, for example, the base 61 may be formed by etching from the metal plate 90. According to this, the number of processes can be reduced.

(Twelfth embodiment)
A twelfth embodiment will be described. The present embodiment is a modification of the first embodiment in which the height of the portion where the bonding portion 53 of each terminal 50 is formed is changed. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 44, each terminal 50 has a portion with a relatively different height on a line along the arrangement direction. And the junction part 53 is each formed in the part from which the height differs relatively among each terminal.

  Specifically, one of the terminals 50 (that is, the terminal 50 on the front side of the drawing in FIG. 44) is formed with a first convex portion 59a which is convex on the other surface 50b side. The first convex portion 59a is configured such that one surface 50a of the first convex portion 59a is located lower than the other surface 50a that does not constitute the first convex portion 59a. One of the terminals 50 (i.e., the terminal 50 at the center of the drawing in FIG. 44) is formed with a second convex portion 59b which is convex toward the one surface 50a. The second convex portion 59b is configured such that the other surface 50b of the second convex portion 59b is located above the one surface 50a that does not constitute the second convex portion 59b. In one of the terminals 50 (that is, the terminal 50 on the back side in FIG. 44), the first convex portion 59a and the second convex portion 59b are not formed.

  In each of the terminals 50, a bonding portion 53 is formed on the same line along the arrangement direction of the terminals 50 and at a position including the first convex portion 59a and the second convex portion 59b.

  Such a terminal 50 is formed by the process of forming the terminal 50 of the first embodiment and the process of forming the joint portion 53 as follows.

  That is, in the step of forming the terminal 50, press molding or the like is performed so that the heights of the portions where the bonding portions 53 are formed are different. Specifically, in the step of forming the terminal 50, the first convex portion 59a is formed on one of the terminals 50, and the second convex portion 59b is formed on one of the terminals 50.

  Then, in the step of forming the bonding portion 53, the laser beam is irradiated from the normal direction of each of the surfaces 50a to 50d of the terminal 50. For example, as shown in FIGS. 45A to 45D, the bonding portion 53 is formed by irradiating a laser beam in order of the one surface 50a, the side surface 50c, the other surface 50b, and the side surface 50d of the terminal 50. In the step of forming the bonding portion 53 of the present embodiment, the first structure 81 is held by another holding jig from the pallet 231, and the laser beam is irradiated in a state of being held by the other holding jig. Do.

  At this time, the terminals 50 are arranged along the surface direction of the one surface 50a and the other surface 50b. Further, in each terminal 50, the heights of the joint formation regions 53a of the side surfaces 50c and 50d are relatively different. For this reason, as shown in FIGS. 45A and 45C, when irradiating the laser beam to the one surface 50a and the other surface 50b of the terminal 50, the laser beam is not blocked by the terminals 50 of each other. Further, as shown in FIG. 45B and FIG. 45D, even when the laser beam is irradiated from the side surfaces 50c and 50d of the terminals 50, the heights of the bonding portion forming regions 53a are different. The laser beam is not blocked. Therefore, the junctions 53 can be easily formed on the respective terminals 50.

  As described above, in the present embodiment, the heights of the joint formation regions 53a where the joint 53 is formed are relatively different. Therefore, even when the laser beam is irradiated from the direction normal to each of the surfaces 50a to 50d of the terminals 50 when forming the bonding portion 53, the laser beam is not blocked by the respective terminals 50, and the bonding portion 53 It can suppress that it is not formed. Therefore, it can suppress that the bondability of the connector case 40 and the junction part 53 falls.

  In addition, since the laser beam may be irradiated from the normal direction to each of the surfaces 50a to 50d of the terminal 50 when forming the bonding portion 53, the positional relationship between the irradiation direction of the laser beam and the terminal 50 can be easily adjusted. Can. Therefore, the manufacturing process can be simplified.

(Modification of the twelfth embodiment)
A modification of the twelfth embodiment will be described. In the twelfth embodiment, the terminal 50 on which the first convex portion 59a and the second convex portion 59b are formed can be changed as appropriate. In addition, since the respective terminals 50 need only have different heights of the joint formation regions 53a, for example, the first terminals 59a that are convex toward the other surface 50b are formed on the two terminals 50, respectively. The heights of the first protrusions 59a may be different from each other.

(13th Embodiment)
A thirteenth embodiment will be described. In the present embodiment, in the step of forming the bonding portion 53, the laser beam is irradiated in a state in which the bonding portion forming region 53a of the terminal 50 is twisted, as compared with the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 46, in the step of forming the bonding portion 53, the bonding portion forming area 53a of the terminal 50 is twisted, and the laser beam is irradiated in this state. In the present embodiment, each terminal 50 is twisted so that one surface 50 a and the other surface 50 b are 45 ° with respect to the laser irradiation direction. That is, each terminal 50 is twisted so that the junction part 53 which goes around the surface by irradiation of the laser beam from 2 directions is formed. In the step of forming the joint portion 53 of the present embodiment, the first structure 81 is held by another holding jig from the pallet 231, and the other holding jig or another jig is used. The terminal 50 is twisted.

  As described above, in the present embodiment, the terminal 50 is twisted, and the bonding portion 53 is formed by irradiating the laser beam in this state. For this reason, compared with the case (for example, FIG. 9A and FIG. 9B) which inclines each terminal 50 and irradiates a laser beam, the difference of the irradiation distance of the laser beam irradiated to each terminal 50 can be made small. Therefore, it can suppress that the shape of the junction part 53 disperses.

  In the case where the terminals 50 are twisted, it is preferable that the deviation in the surface direction of each of the terminals 50 be small. For example, it is preferable that the deviation in the surface direction of the surface 50a of each terminal 50 be small. As described above, by reducing the deviation in the surface direction of each of the terminals 50, the difference in the irradiation angle can be reduced, so that the variation in the shape of the bonding portion 53 can be further suppressed.

  Then, by irradiating the laser beam with the terminals 50 in a twisted state, the distance between the terminals 50 (that is, L shown in FIGS. 9A and 9B) can be shortened. Therefore, the rotation angle sensor can be miniaturized.

  Furthermore, in order to irradiate the laser beam with the terminal 50 in a twisted state, it is not necessary to change the equipment on the laser beam irradiation unit 250 side, and the manufacturing apparatus is not complicated.

Fourteenth Embodiment
A fourteenth embodiment will be described. This embodiment is obtained by bending one end side of the terminal 50 in the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the rotation angle sensor of this embodiment, as shown in FIG. 47, one end side of the connector case 40 and one end side of the terminal 50 are bent. In the present embodiment, the terminal 50 is bent so that one end side thereof is substantially perpendicular to the axial direction.

  Further, in the terminal 50, the depressions 57 are formed in the one surface 50a and the other surface 50b, as in the ninth embodiment. However, in the present embodiment, the recess 57 is formed in a bent portion of the terminal 50 and covered by the connector case 40. Further, as shown in FIG. 48, the recess 57 of the present embodiment is V-shaped in a plan view. That is, the recess portion 57 is configured to have a portion inclined with respect to a virtual straight line connecting the portions positioned on the side surfaces 50c and 50d. And the junction part 53 is formed in the bottom of the hollow part 57 formed in the surface 50a and the other surface 50b, and the side surfaces 50c and 50d. In addition, when setting it as such a structure, the part in which the junction part 53 is formed is corresponded to the part extended along one direction. That is, in the present embodiment, the terminal 50 corresponds to a portion in which the bent portion extends along one direction.

  Such a rotation angle sensor is manufactured by changing the process of forming the terminal 50 of the first embodiment and the process of forming the joint portion 53 and further performing a bending process of bending the terminal 50.

  Here, the manufacturing system of the present embodiment will be described. The manufacturing system of this embodiment is basically the same as the first embodiment, as shown in FIG. 49, but has a bending apparatus 180.

  The bending apparatus 180 is an apparatus for bending the terminal 50 and performs a process of bending the terminal 50. Specifically, when the first structure 81 is carried in by the transfer device 184, the bending device 180 bends the terminal using a jig. In the present embodiment, the bending device 180 has a holding jig 501, a receiving jig 502, and a bending jig 503, as shown in FIG. 50A. Then, the bending device 180 holds the terminal 50 between the pressing jig 501 and the bending jig 503, and brings the bending jig 503 into contact with the bending portion of the terminal 50. Thereafter, as shown in FIG. 50B, the terminal 50 is bent by moving the bending jig 503. Then, the first structure 81 obtained by bending the terminal 50 is sent out to the transfer device 188.

  The above is the structure of the bending apparatus 180 of this embodiment. Then, when forming the terminal 50 as described above, first, in the step of forming the terminal 50, the recess portion 57 having a V-shape in plan view is formed on the one surface 50a and the other surface 50b. Then, in the step of bending the terminal 50, as shown in FIG. 50B, the terminal 50 is bent by moving the bending jig 503.

  Under the present circumstances, since the hollow part 57 is made into planar shape V-shape, when moving the bending jig 503, it is suppressed that the said bending jig 503 falls in the hollow part 57. As shown in FIG. For this reason, it can suppress that the bottom face of the hollow part 57 is roughened when bending the terminal 50. That is, the joint formation region 53a can be suppressed from being roughened. Therefore, in the step of forming the joint portion 53 performed after the bending step, it is possible to suppress the formation of the joint portion 53 having appropriate unevenness.

  And the rotation angle sensor shown in the said FIG. 47 is manufactured by performing the process of forming the connector case 40 with respect to the 2nd structure 82 by which the terminal 50 was bend | folded.

  As described above, in the present embodiment, the recessed portion 57 having a V-shape in plan view is formed in the terminal 50, and the bonding portion 53 is formed so as to include the bottom surface of the recessed portion 57. For this reason, bending the terminal 50 with the bending jig 503 from the surface on which the depressed portion 57 is formed can suppress the bending jig 503 from falling into the depressed portion 57. Therefore, when forming the junction part 53 in the terminal 50, it can suppress that the junction part 53 which has an appropriate unevenness | corrugation is not formed.

(Modification of the fourteenth embodiment)
A modification of the fourteenth embodiment will be described. In the fourteenth embodiment, the portion where the recessed portion 57 is formed is held by the holding jig 501 and the receiving jig 502, and the bending jig 503 is brought into contact with the portion where the recessed portion 57 is not formed. You may make it bend. Even in such a case, since the holding jig 501 and the receiving jig 502 are unlikely to fall on the bottom surface of the recessed portion 57, it is possible to suppress the joint portion formation region 53a from being roughened.

  In the fourteenth embodiment, in the manufacturing system, the bending device 180 may bend the terminal 50 before the first structure 81 is formed by the connection device 120, or after forming the bonding portion 53. The terminal 50 may be bent. In addition, when bending the terminal 50 after forming the junction part 53, it can suppress that the unevenness | corrugation of the junction part 53 is destroyed.

  Furthermore, in the fourteenth embodiment, the recess 57 may be U-shaped in a plan view.

(Fifteenth embodiment)
A fifteenth embodiment will be described. The present embodiment is a modification of the fourteenth embodiment except that the step of forming the terminal 50 and the step of forming the joint portion 53 are modified. The other aspects are similar to those of the fourteenth embodiment, and thus the description thereof is omitted here.

  In this embodiment, in the step of bending the terminals 50, as shown in FIG. 51, the bending angles of the respective terminals 50 are made different. Specifically, when each terminal 50 is viewed from the side surface 50 c side, a part of the side surface 50 c of each terminal 50 does not overlap. In other words, when each terminal 50 is viewed from the side surface 50 c side, a part of the side surface 50 c of each terminal 50 can be visually recognized. That is, the relative heights of the joint formation regions 53a in the respective terminals 50 are made different. Although the recess portion 57 is not formed in the terminal 50 in FIG. 51, the recess portion 57 may be formed in the terminal 50.

  Then, in the step of forming the bonding portion 53, as in the twelfth embodiment, the laser beam is irradiated from the normal direction of each of the surfaces 50a to 50d of the terminal 50. Under the present circumstances, when irradiating a laser beam from side 50c of the terminal 50, 50d, it can suppress that a laser beam is interrupted | blocked by mutual terminal 50 by irradiating a laser beam to the area | region A in FIG. . For this reason, it can suppress that the junction part 53 which has an appropriate unevenness | corrugation is not formed.

  Then, after the step of forming the joint portion 53, a bending step or the like may be appropriately performed so that the terminals 50 have the same angle, and the step of forming the connector case 40 may be performed.

  As described above, in the present embodiment, when viewed from the side surfaces 50c and 50d, parts of the side surfaces 50c and 50d do not overlap. Then, in this state, a laser beam is irradiated to form the bonding portion 53. Therefore, even when the laser beam is irradiated from the direction normal to each of the surfaces 50a to 50d of the terminals 50 when forming the bonding portions 53, the laser beams are not blocked by the respective terminals 50, and the bonding portions 53 are formed. It can suppress that it is not formed. Therefore, it can suppress that the bondability of the connector case 40 and the junction part 53 falls.

(Modification of the fifteenth embodiment)
A modification of the fifteenth embodiment will be described. Although the said 15th Embodiment demonstrated the rotation angle sensor by which each terminal 50 was bend | folded, it can also be applied to the rotation angle sensor by which each terminal 50 is not bend | folded. In this case, for example, after the bonding portion 53 is formed, a step of extending the terminal 50 may be performed.

Sixteenth Embodiment
A sixteenth embodiment will be described. In the present embodiment, the shape of the mounting surface 190 a of the housing member 190 is changed with respect to the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 52, in the housing member 190, a housing recess 191 corresponding to the outer shape of the first structure 81 is formed in the mounting surface 190a. Then, in the accommodation recess 191, a recess 191a is formed at each position corresponding to the joint 53 formed on the terminal 50 when the first structure 81 is placed. That is, the accommodation member 190 is configured not to abut on the joint portion 53 when the first structure 81 is placed.

  Then, in the step of forming the bonding portion 53, after forming the bonding portion 53, as shown in FIG. 53, the first structure 81 is accommodated so that the bonding portion is positioned at a position corresponding to the recessed portion 191a. It is placed on the member 190. Thereby, it can suppress that the junction part 53 contacts the accommodation member 190, and an unevenness | corrugation is destroyed.

  As described above, in the present embodiment, the housing member 190 is formed with the recessed portion 191a so as not to abut on the joint portion 53 when the first structure 81 is placed. For this reason, when the 1st structure 81 is mounted in the accommodation member 190, it can suppress that the unevenness | corrugation which comprises the junction part 53 is destroyed. Therefore, it can suppress that the bondability of the connector case 40 and the terminal 50 falls.

(Modification of the sixteenth embodiment)
A modification of the sixteenth embodiment will be described. In the sixteenth embodiment, after the formation of the bonding portion 53 has been described, the housing member 190 as described above is applied to the terminal 50 before the formation of the bonding portion 53 or the first structure 81. It can also be done. According to this, the bonding portion forming area 53a of the terminal 50 is prevented from being attached with foreign matter or deformed. Therefore, it can suppress that the junction part 53 which has an appropriate unevenness | corrugation is not formed.

(Seventeenth embodiment)
A seventeenth embodiment will be described. In the present embodiment, the transfer device 185 and the like are modified from the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  First, in each of the above embodiments, after the mold IC 10 and the terminal 50 are connected by the connection device 120 to form the first structure 81, the manufacturing system in which the bonding portion 53 is formed by the bonding portion forming apparatus 140 has been described. . However, as shown in FIG. 54, the manufacturing system may connect the mold IC 10 and the terminal 50 by the connecting device 120 after forming the bonding portion 53 on the terminal 50 by the bonding portion forming device 140. .

  In this case, when the terminal 50 in which the bonding portion 53 is formed is transported by the transport device 185 configured by a conveyor or the like as it is, the unevenness of the bonding portion 53 may be broken.

  Therefore, in the present embodiment, as shown in FIG. 55, the transfer device 185 includes two holding jigs 511 each having a pair of holding portions 511a for holding and holding the terminal 50. Then, the two holding jigs 511 respectively hold and hold the portions of the terminal 50 which are different from the bonding portion 53 and are positioned on the opposite side of the bonding portion 53. Therefore, the terminal 50 can be transported without contacting the bonding portion 53 with the transport device 185.

  As described above, the bonding portion 53 may be formed on the terminal 50 before the first structure 81 is formed. In this case, destruction of the unevenness of the bonding portion 53 can be suppressed by using the holding jig 511 which holds and holds a portion different from the bonding portion 53 after forming the bonding portion 53. Therefore, it can suppress that the bondability of the connector case 40 and the junction part 53 falls.

(Modification of the seventeenth embodiment)
A modification of the seventeenth embodiment will be described. In the seventeenth embodiment, as shown in FIG. 56, the terminal 50 may be sandwiched by one holding jig 511 having a pair of holding portions 511a. In this case, a recess 511b may be formed in the holding jig 511, and the bonding portion 53 may be disposed in the recess 511b. Even in this case, destruction of the bonding portion 53 can be suppressed.

  Further, in the seventeenth embodiment, after the formation of the bonding portion 53 is described, the terminal 50 before the formation of the bonding portion 53 is in contact with the bonding portion formation region 53a in which the bonding portion 53 is formed. In order not to do so, the holding jig 511 may hold it. According to this, the bonding portion forming area 53a of the terminal 50 is prevented from being attached with foreign matter or deformed. Therefore, it can suppress that the junction part 53 which has an appropriate unevenness | corrugation is not formed.

Eighteenth Embodiment
An eighteenth embodiment will be described. This embodiment is a modification of the first embodiment in the configuration of the housing member 190 for housing the first structure 81 in which the joint portion 53 is formed. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  First, in the first embodiment, the example in which the first structure 81 is placed on the housing member 190 after the first structure 81 is formed by the connection device 120 has been described. In this case, as shown in FIG. 57, when the containing member 190 is made of a material containing a plasticizer 192a and a release agent 192b, the plasticizer 192a and the release agent 192b are closely packed on the mounting surface 190a. , And may adhere to the joint 53. Then, if the plasticizer 192a, the mold release agent 192b, and the like adhere to the joint portion 53, there is a possibility that the bondability between the connector case 40 and the joint portion 53 may be reduced.

  Therefore, in the present embodiment, as shown in FIG. 58, the containing member 190 is made of a resin that does not contain the plasticizer 192a and the release agent 192b. That is, in the present embodiment, the housing member 190 is made of a non-staining material that does not have the bleeding property. Therefore, when the first construct 81 is placed on the housing member 190, adhesion of the plasticizer 192a and the release agent 192b to the joint portion 53 can be suppressed.

  As described above, in the present embodiment, the containing member 190 is made of resin that does not contain the plasticizer 192 a and the release agent 192 b. For this reason, adhesion of the plasticizer 192a, the mold release agent 192b and the like to the joint portion 53 can be suppressed, and deterioration in the jointability between the connector case 40 and the joint portion 53 can be suppressed.

(Modification of the eighteenth embodiment)
A modification of the eighteenth embodiment will be described. In the eighteenth embodiment, the housing member 190 may be made of paper instead of being made of resin. However, when it is made of paper, as shown in FIG. 59, there is a possibility that the paper dust 192c adheres to the mounting surface 190a. In this case, when the paper dust 192c adheres to the joint portion 53, the bondability between the connector case 40 and the joint portion 53 is reduced. For this reason, when the mounting surface 190a of the housing member 190 is made of paper, it is preferable that the paper dust removing process be performed as shown in FIG. The paper dust removing process is performed, for example, by blowing or brushing.

  Furthermore, in the eighteenth embodiment, the accommodation member 190 after the formation of the bonding portion 53 has been described, but the embodiment can be applied before the formation of the bonding portion 53. That is, the terminal 50 or the first structure 81 can be accommodated by the accommodating member 190 before the joint portion 53 is formed. In this case, by making the housing member 190 the same as the above, adhesion of foreign matter to the joint portion forming area 53a of the terminal 50 can be suppressed, and the joint portion 53 having appropriate unevenness is not formed. Can be suppressed.

  Further, in the case where the joint portion 53 is formed on the terminal 50 before forming the first construct 81, as shown in FIG. 61, a housing member 193 may be used to sandwich and protect the terminal 50. Specifically, the housing member 193 has a reel-shaped protective member 193a and a protective sheet 193b, and holds the terminal 50 with the terminal 50 interposed between the protective member 193a and the protective sheet 193b. While protecting. In this case, for example, the protection member 193a and the protection sheet 193b may be made of paper, and the foreign matter may be prevented from adhering to the joint portion 53 by performing the paper dust removing process on each surface.

  Nineteenth Embodiment

  A nineteenth embodiment will be described. In the present embodiment, a protective jig is used in the step of connecting the mold IC 10 and the terminal 50 to the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In the present embodiment, as shown in FIG. 62, in the step of bonding the mold IC 10 and the terminal 50 to form the first structure 81, the protection jig 520 provided in the connection device 120 is used. . The protective jig 520 includes a first jig 521 having one surface 521 a, and a second jig 522 having a recess 522 b formed on the side of the one surface 522 a facing the first jig 521.

  Then, in the step of forming the first structure 81, first, the mold IC 10 and the terminal 50 are disposed such that the terminal 11a and the other end side of the terminal 50 are positioned in the recess 522b of the protective jig 520. At this time, the joint formation region 53a in the terminal 50 is located outside the recess 522b. That is, the joint forming area 53 a and the portion to be crimped are partitioned by the protective jig 520. Then, in the step of forming the first structure 81, the terminal portion 11a and the terminal 50 are electrically and mechanically connected by caulking the other end of the terminal 50 in the recess 522b.

  Under the present circumstances, although the metal particle 523 may scatter by crimping, the metal particle 523 has become difficult to reach the junction part formation area 53a by the protection jig 520. As shown in FIG. For this reason, adhesion of the metal particles 523 to the joint formation region 53a is suppressed.

  As described above, in the present embodiment, the step of forming the first construct 81 is performed in the protective jig 520 partitioned from the joint formation region 53a. For this reason, when the other end of the terminal 50 is crimped, adhesion of the metal particles 523 which may be generated to the bonding portion forming region 53a can be suppressed. Therefore, when forming junction part 53 by irradiating a laser beam to junction part formation field 53a, it can control that junction part 53 which has suitable unevenness is not formed, and junction nature of connector case 40 and junction part 53 is It is possible to suppress the decrease.

  The first jig 521 and the second jig 522 may be used as electrodes. That is, the first structure 81 may be configured by heat staking in which the staking process is performed while a current is supplied by the first jig 521 and the second jig 522.

(Modification of the nineteenth embodiment)
A modification of the nineteenth embodiment will be described. In the nineteenth embodiment, an example in which the terminal portion 11a and the terminal 50 are crimped and connected has been described. However, the terminal portion 11a and the terminal 50 may be joined by resistance welding or the like. In this case, for example, as shown in FIG. 63, the first jig 521 may be provided with the first electrode 524 and the second jig 522 may be provided with the second electrode 525. As described above, since the metal particles 523 are also scattered when the terminal portion 11a and the terminal 50 are connected by resistance welding, the metal particles 523 adhere to the bonding portion formation region 53a by performing in the protective jig 520. Can be suppressed.

(Twentieth embodiment)
A twentieth embodiment will be described. The present embodiment is a modification of the fourteenth embodiment in the step of forming the joint portion 53 and the like. The other aspects are similar to those of the fourteenth embodiment, and thus the description thereof is omitted here.

  The rotation angle sensor of this embodiment is a rotation angle sensor similar to that of FIG. 47 described in the fourteenth embodiment. That is, the terminal 50 is in a bent state at one end side.

  Next, the process of bending the terminal 50 of the present embodiment, the process of forming the bonding portion 53, and the inspection process will be described. In the present embodiment, in the step of bending the terminal 50, as shown in FIGS. 64A and 64B, the bending and holding jig 530 provided in the bending device 180 is used.

  The bending holding jig 530 has a pair of first jigs 531 and second jigs 532. The first jig 531 has a first supporting point surface 531a that is a flat surface, and a first action point surface 531b that is a flat surface that is inclined with respect to the first supporting point surface 531a. A first opening 531c is formed between the first action point surface 531b and the first action point surface 531b. The second jig 532 has a second supporting point surface 532a that is a flat surface, and a second action point surface 532b that is a flat surface that is inclined with respect to the second supporting point surface 532a. And a second opening 532c penetrating the second jig 532 between the second action point surface 532b.

  The first jig 531 and the second jig 532 are disposed such that the fulcrum surfaces 531a and 532a and the action point surfaces 531b and 532b face each other. More specifically, the first jig 531 and the second jig 532 are configured and arranged such that the fulcrum surfaces 531a and 532a are parallel to one another and the action point surfaces 531b and 532b are parallel to one another. .

  In FIG. 64A, the portion having the first supporting point surface 531a and the portion having the first action point surface 531b are separated from each other, but in the cross section different from FIG. 64A, each portion is connected. Similarly, in FIG. 64A, a portion having the second supporting point surface 532a and a portion having the second action point surface 532b are shown separately, but in a cross section different from FIG. 64A, the second supporting point surface 532a and the second The two action point surfaces 532 b are connected.

  Then, when the terminal 50 is bent, the first jig 531 and the second jig 532 are disposed with the terminal 50 interposed therebetween. Then, as shown in FIG. 64B, for example, the second jig 532 is displaced to the first jig 531 side, and the terminal 50 is pressed to the second action point by pressing the terminal 50 with the second action point surface 532b. Bend at an angle along plane 532b. Then, the terminal 50 is held by the first jig 531 and the second jig 532.

  Next, in the step of forming the joint portion 53, the laser beam is irradiated while the terminal 50 is held by the bending holding jig 530. Specifically, as shown in FIG. 65, the laser beam is irradiated through the first opening 531 c formed in the first jig 531 and the second opening 532 c formed in the second jig 532. The junction 53 is formed. That is, in the present embodiment, although the bending and holding jig 530 is initially provided in the bending device 180, the bending and holding jig 530 is carried into the joint forming device 140 by the conveying device 188 as it is.

  Subsequently, although not particularly illustrated, in the step of inspecting the bonding portion 53, the bonding portion 53 is inspected while the terminal 50 is held by the bending and holding jig 530. Specifically, the joint 53 is inspected through the first opening 531 c formed in the first jig 531 and the second opening 532 c formed in the second jig 532.

  As described above, in the present embodiment, the step of forming the joint portion 53 and the step of inspecting the joint portion 53 while the terminal 50 is held by the bending and holding jig 530 used in the step of bending the terminal 50 To be executed. For this reason, for example, compared with the case where the terminal 50 is held using another jig in each process, the process of changing the jig is not necessary, and simplification can be achieved.

(Twenty-first embodiment)
A twenty-first embodiment will be described. In the present embodiment, the terminal 50 is heated before the connector case 40 is formed, as compared with the first embodiment. The other aspects are the same as in the first embodiment, and thus the description thereof is omitted here.

  In this embodiment, in the step of forming the connector case 40, as shown in FIGS. 10A and 10B, after disposing the second component 82 in the mold 300, before pouring the molten resin 40a into the cavity 330. A process of heating the terminal 50 is performed. This heating step is performed, for example, at 200 ° C. for 5 minutes. Thereafter, the molten resin 40 a is poured into the cavity 330 to form the connector case 40.

  As described above, in the present embodiment, the terminal 50 is heated before pouring the molten resin 40 a into the cavity 330. Therefore, when the molten resin 40a is poured into the cavity 330 and the molten resin 40a comes into contact with the terminal 50, the temperature of the molten resin 40a does not easily fall, and the inflow of the molten resin 40a to the joint portion 53 is inhibited. It can be suppressed. Therefore, it can suppress that the bondability of the connector case 40 and the junction part 53 falls.

(Other embodiments)
The present invention is not limited to the above-described embodiment, and appropriate modifications can be made within the scope of the claims.

  For example, in the above embodiments, the rotation angle sensor has been described as an example, but the embodiments may be applied to a pressure sensor.

  In each of the above embodiments, the terminal 50 may also expose the other end side connected to the sensor unit 10 from the case 40, as shown in FIGS. 66A to 66C, for example. In this case, as shown in FIGS. 66A and 66B, the sensor unit 10 may not be covered with the mold resin 14 as long as the sensor chip 12 is configured, and the lead frame 11 is provided. It does not have to be. That is, the sensor unit 10 may be configured to have at least the sensor chip 12.

  In each of the above embodiments, the metal thin film 62 may not be a metal thin film formed by plating. For example, the metal thin film 62 may be formed by vapor deposition or the like.

  Furthermore, in the above-described embodiments, although the terminal 50 has been described as having a square rod shape, the terminal 50 may be, for example, a cylindrical rod shape, or may be a square rod shape other than a square pole.

  In each of the above-described embodiments, the manufacturing system has described the example including the various devices 100 to 180. However, it is not necessary to include all the devices, and at least the joint portion forming device 140 and the connector case forming device 170 are provided. It should be done. For example, in the above-described manufacturing system, the mold IC 10 manufactured in another process may be carried in without being provided with the mold IC manufacturing apparatus 100. Moreover, in the manufacturing system of each said embodiment, when not providing all apparatuses, the apparatus which is not provided can be suitably changed by each embodiment.

  And in the above-mentioned each embodiment, when replacing with terminal 50 or adding to terminal 50 and providing another metal member, the above junctions 53 can be formed to the metal member concerned. In addition, as another metal member, components, such as a housing made from metal, are mentioned, for example. Moreover, when covering a metal member with the resin case instead of the connector case 40 or another resin member, the structure similar to the connector case 40 can be suitably employ | adopted with respect to the said other resin member.

  Further, it goes without saying that the above embodiments can be combined as appropriate. For example, in each of the embodiments, one end side of the terminal 50 may be bent as in the fourteenth embodiment. In this case, as shown in FIG. 47, the joint portion 53 may be formed in a bent portion of the terminal 50 and covered by the connector case 40. In addition, even when the one end side of the terminal 50 is bent, the joint portion 53 may be formed in the unbent portion of the terminal 50.

10 Molded IC (Sensor unit)
40 connector case 50 terminal (metal terminal)
53 joints

Claims (14)

In a physical quantity sensor in which a sensor unit (10) for outputting a sensor signal according to a physical quantity is electrically connected to a metal terminal (50), and the metal terminal is covered by a case (40),
The sensor unit that outputs the sensor signal;
The metal terminal electrically connected to the sensor unit and having a portion extending in one direction;
The case which covers the metal terminal in a state where at least one end of the metal terminal on the side connected to the sensor unit is exposed and the other end is exposed,
The metal terminal is a portion covered with the case, and is configured with unevenness between the end portion connected to the sensor unit and the one end portion, and the extending direction is an axial direction A joint (53) is formed around the axial direction around the surface of the metal terminal,
The physical quantity sensor, wherein the case is made of a resin material, and the resin material is intruded in the unevenness to be joined to the joint portion.   The case is formed such that a thickness of a portion of the metal terminal covering the joint is thinner than a thickness of at least a portion of the metal terminal covering an area different from the joint. The physical quantity sensor according to item 1.   The physical quantity sensor according to claim 2, wherein the case has a recess (42) formed in a portion of the outer wall surface of the case facing the joint portion.   The physical quantity sensor according to claim 2, wherein in the case, a through hole (43) penetrating the case is formed in a portion between the outer wall surface of the case and the joint portion.   In the case, the thickness of the portion covering the region closer to the one end portion than the bonding portion of the metal terminal is thinner than the thickness of the portion covering the bonding portion of the metal terminal The physical quantity sensor according to any one of claims 1 to 4.   In the case, the thickness of the portion covering the area on the side connected to the sensor unit from the junction of the metal terminals is greater than the thickness of the portion covering the junction of the metal terminals The physical quantity sensor according to any one of claims 1 to 5, which is thinned. The metal terminal is formed with bubble forming portions (56a to 56c),
The physical quantity sensor according to any one of claims 1 to 6, wherein the case is a portion different from a portion covering the bonding portion, and a bubble (45) is formed around the bubble forming portion. A cap (30) for housing the sensor unit;
The physical quantity sensor according to any one of claims 1 to 7, wherein the case covers the cap and is also joined to the cap. In a method of manufacturing a physical quantity sensor in which a sensor unit (10) for outputting a sensor signal according to a physical quantity is electrically connected to a metal terminal (50), and the metal terminal is covered by a case (40)
Providing the sensor unit;
Providing the metal terminal having a portion extending in one direction;
Electrically connecting the sensor unit and the metal terminal to form a structure (81);
Providing a mold (300) in which a cavity (330) in which the structure is to be disposed is configured, and into which a molten resin (40a) is poured from an injection gate (340);
Placing the arrangement in the cavity;
By pouring the molten resin from the injection gate into the cavity and solidifying, the metal is exposed while exposing one end of the metal terminal on the side opposite to the end connected to the sensor unit Forming the case covering the terminals;
Prior to forming the case, a junction (53) is formed on the metal terminal, the unevenness being formed, and the extension direction is taken as an axial direction to form a joint (53) around the surface of the metal terminal. Do,
A manufacturing method of a physical quantity sensor which joins the junction part and the case by forming the case.   In forming the case, the thickness of the portion of the metal terminal covering the joint portion is thinner than the thickness of at least a portion of the metal terminal covering a region different from the joint portion. The method of manufacturing a physical quantity sensor according to claim 9, wherein the case is formed. In preparing the mold, in arranging the structure, the injection gate is formed in a portion different from the portion facing the junction,
In the case where the case is formed, in the portion covering the metal terminal, the portion covering the region downstream of the joint in the flow direction of the molten resin is thicker than the portion covering the joint The method of manufacturing a physical quantity sensor according to claim 9 or 10, wherein the case is formed to be thin. In preparing the mold, in arranging the structure, the injection gate is formed in a portion different from the portion facing the junction,
In the case where the case is formed, in the portion covering the metal terminal, the portion covering the region on the upstream side in the flow direction of the molten resin with respect to the bonding portion is thicker than the portion covering the bonding portion The method of manufacturing a physical quantity sensor according to any one of claims 9 to 11, wherein the case is formed to be thin. Before arranging the structure, prepare the metal terminal in which the bubble forming portion (56a to 56c) is formed as the structure,
In forming the case, when the molten resin is poured from the injection gate, air bubbles (45) are formed around the bubble forming portion by causing air to bite in the bubble forming portion. The method of manufacturing a physical quantity sensor according to any one of claims 9 to 12, wherein the case is formed.   The manufacturing of the physical quantity sensor according to any one of claims 9 to 13, wherein the metal terminal in the structure is heated after disposing the structure and before forming the case. Method.