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JP2020093285A - Method of joining dissimilar metals - Google Patents

Method of joining dissimilar metals Download PDF

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JP2020093285A
JP2020093285A JP2018233277A JP2018233277A JP2020093285A JP 2020093285 A JP2020093285 A JP 2020093285A JP 2018233277 A JP2018233277 A JP 2018233277A JP 2018233277 A JP2018233277 A JP 2018233277A JP 2020093285 A JP2020093285 A JP 2020093285A
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metal material
upper metal
laser light
lower metal
laser
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雅志 古川
Masashi Furukawa
雅志 古川
裕臣 小林
Hiroomi Kobayashi
裕臣 小林
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Toyota Motor Corp
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Toyota Motor Corp
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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Abstract

【課題】金属間化合物の生成を抑制しつつ異種金属の接合すること。
【解決手段】下側金属材21と、下側金属材21に比べてレーザー光の吸収率が高く、かつ、下側金属材21より融点が高い上側金属材22と、を重ね、上側金属材22の上方からレーザー光を上側金属材22に照射し、上側金属材22を溶融させることで両金属材を溶接する異種金属の接合方法であって、上側金属材22のレーザー光が当たる領域には、凹凸形状を有する凹凸領域22aが形成されており、凹凸領域22aに、上側金属材22が溶融するエネルギーを有するレーザー光を照射する。
【選択図】図1
PROBLEM TO BE SOLVED: To bond dissimilar metals while suppressing generation of intermetallic compounds.
A lower metal material (21) and an upper metal material (22) having a higher absorption rate of laser light than the lower metal material (21) and a melting point higher than that of the lower metal material (21) are overlapped with each other to form an upper metal material. 22 is a method of joining dissimilar metals in which upper metal material 22 is irradiated with laser light from above 22 and the upper metal material 22 is melted to weld both metal materials. Has an uneven area 22a having an uneven shape, and the uneven area 22a is irradiated with a laser beam having energy for melting the upper metal material 22.
[Selection diagram] Figure 1

Description

本発明は、レーザーを用いた異種金属の接合方法に関する。 The present invention relates to a method for joining dissimilar metals using a laser.

二次電池の製造において、アルミニウム材と銅材を溶接することにより接続端子を形成している。従来、このような分野の技術として、特開2012−61474号公報がある。この公報に記載された異種金属の接合方法では、隣り合う異種金属が密接している状態で、各金属の反射率を変えることで一方のみを溶融させ、接合させることが記載されている。 In manufacturing a secondary battery, a connection terminal is formed by welding an aluminum material and a copper material. Conventionally, as a technique in such a field, there is JP 2012-61474 A. In the method of joining dissimilar metals described in this publication, it is described that only one of the dissimilar metals adjacent to each other is melted and joined by changing the reflectance of each metal in a state of being in close contact with each other.

特開2012−61474号公報JP 2012-61474 A

しかしながら、前述した従来の接合方法では、レーザーの照射面積が小さく、異種金属の加工部に隙間があると正常な接合ができない。そのため、異種金属同士を密着させておく必要があるが、そのため異種金属の端面精度が重要となり、特別な加工をする必要性が生じるため、高コストとなる。 However, according to the above-described conventional joining method, if the laser irradiation area is small and there is a gap in the processed portion of the dissimilar metal, normal joining cannot be performed. Therefore, the dissimilar metals must be in close contact with each other, but the precision of the end faces of the dissimilar metals is important, and special processing is required, resulting in high cost.

さらに、異種金属同士が密着しているため熱伝導が大きく、制御しきれない熱伝導が発生しやすくなる。ここで、2種類の金属の融点が近い場合には、この熱伝導により、溶融させる対象ではない金属部材に想定以上の溶融が発生し、多量の金属間化合物が生成されてしまう場合がある。例えば、この金属間化合物がアルミと銅の金属間化合物であるとした場合、この金属間化合物は硬くて脆いという性質を有するため、多量の金属間化合物が生成されることによって機械的強度が弱くなる。
本発明は、金属間化合物の生成を抑制した異種金属の接合方法を提供するものである。
Further, since the dissimilar metals are in close contact with each other, heat conduction is large, and heat conduction that cannot be controlled is likely to occur. Here, when the melting points of the two kinds of metals are close to each other, due to this heat conduction, the metal member which is not the object of melting may melt more than expected and a large amount of intermetallic compound may be generated. For example, when the intermetallic compound is an intermetallic compound of aluminum and copper, the intermetallic compound has a property of being hard and brittle, so that a large amount of intermetallic compound is generated and mechanical strength is weakened. Become.
The present invention provides a method for joining dissimilar metals, which suppresses the formation of intermetallic compounds.

本発明にかかる異種金属の接合方法は、下側金属材と、前記下側金属材に比べてレーザー光の吸収率が高く、かつ、前記下側金属材より融点が高い上側金属材と、を重ね、前記上側金属材の上方からレーザー光を前記上側金属材に照射し、上側金属材を溶融させることで両金属材を溶接する異種金属の接合方法であって、前記上側金属材のレーザー光が当たる領域には、凹凸形状を有する凹凸領域が形成されており、前記凹凸領域に、前記上側金属材が溶融するエネルギーを有するレーザー光を照射する。
これにより、下側金属材の溶融を抑制し、上側金属材を溶融させることで接合することができる。
The method for joining dissimilar metals according to the present invention comprises a lower metal material, and an upper metal material having a higher absorption rate of laser light than the lower metal material and having a higher melting point than the lower metal material. A method of joining dissimilar metals in which the upper metal material is overlapped and the upper metal material is irradiated with laser light from above the upper metal material to melt the upper metal material and the two metal materials are welded together. An uneven region having an uneven shape is formed in a region hit by the contact point, and the uneven region is irradiated with laser light having energy for melting the upper metal material.
Thereby, it is possible to suppress the melting of the lower metal material and to bond the upper metal material by melting.

これにより、金属間化合物の生成を抑制した異種金属の接合方法を提供することができる。 This makes it possible to provide a method for joining dissimilar metals in which the formation of intermetallic compounds is suppressed.

接合装置の概略を示す図である。It is a figure which shows the outline of a joining apparatus. 上側金属材の表面の一例を示す図である。It is a figure which shows an example of the surface of an upper side metal material. 下側金属材の表面の一例の図である。It is a figure of an example of the surface of a lower metal material. 接合装置による溶接の流れを示した図である。It is the figure which showed the flow of the welding by the joining apparatus. 上側金属材と下側金属材が適切に溶接された状態を示す図である。It is a figure showing the state where the upper metallic material and the lower metallic material were welded appropriately.

以下、図面を参照して本発明の実施の形態について説明する。図1に示すように、接合装置1は、レーザー照射部11と、レーザー照射されるワーク2を載置するための載置部12と、を備える。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, the bonding apparatus 1 includes a laser irradiation unit 11 and a mounting unit 12 for mounting the work 2 to be laser-irradiated.

ワーク2には、2種類の異種金属が用いられる。ワーク2として、アルミ材であって載置部12上に配置される下側金属材21と、銅材であって、載置部12上に載置された下側金属材21の上側に配置される上側金属材22と、が配置される。 Two different kinds of metals are used for the work 2. As the work 2, a lower metal material 21 made of aluminum and placed on the placing portion 12 and a copper material placed on the upper side of the lower metal material 21 placed on the placing portion 12 And the upper metal member 22 to be disposed.

レーザー照射部11は、ワーク2に対してレーザーの照射を行う。具体的には、レーザー照射部11は、レーザー発振器や、レーザーヘッドや、レーザー光のエネルギー強度やワーク2にレーザー光が当たる位置を制御する制御部などを備える。例えば、レーザー照射部11のレーザーヘッドは、ワーク2の上方に配置されており、レーザーヘッドから照射されたレーザー光を上側金属材22の上面に照射する。 The laser irradiation unit 11 irradiates the work 2 with a laser. Specifically, the laser irradiation unit 11 includes a laser oscillator, a laser head, a control unit that controls the energy intensity of the laser light, the position at which the laser light strikes the work 2, and the like. For example, the laser head of the laser irradiation unit 11 is arranged above the work 2, and irradiates the upper surface of the upper metal material 22 with the laser light emitted from the laser head.

下側金属材21は、アルミ材の板である。下側金属材21は、レーザー照射部11からのレーザー光が照射された場合にレーザー吸収率を下げるために、表面の面粗度が良く形成されている。 The lower metal material 21 is a plate of aluminum material. The lower metal material 21 has a good surface roughness in order to reduce the laser absorption rate when the laser light from the laser irradiation unit 11 is irradiated.

図2は、下側金属材21の表面のレーザー吸収率を下げるために、表面粗さを良くした状態を示した図である。 FIG. 2 is a diagram showing a state where the surface roughness is improved in order to reduce the laser absorptance of the surface of the lower metal material 21.

上側金属材22は、銅材の板である。上側金属材22は、下側金属材21の上に配置され、ここで、上側金属材22は下側金属材21に密着していても良く、密着していなくても良い。すなわち、上側金属材22は、レーザー照射部11からレーザー光が照射された際に、溶融された状態を維持したまま下側金属材21に接触できればよい。上側金属材22と下側金属材21は、重ね合わせ、または隅肉溶接される。 The upper metal member 22 is a copper plate. The upper metal material 22 is arranged on the lower metal material 21, and the upper metal material 22 may or may not be in close contact with the lower metal material 21. That is, it is sufficient that the upper metal material 22 can contact the lower metal material 21 while maintaining the molten state when the laser light is irradiated from the laser irradiation unit 11. The upper metal material 22 and the lower metal material 21 are overlapped or fillet welded.

なお、上側金属材22は、下側金属材21に比べて融点が低く、下側金属材21より溶融しやすい。 The upper metal material 22 has a lower melting point than the lower metal material 21, and is more easily melted than the lower metal material 21.

さらに、上側金属材22は、レーザー照射部11からレーザー光が照射された場合にレーザー吸収率をあげるために、表面の面粗度が悪く形成されている。例えば、上側金属材の上面には凹凸形状を有する凹凸領域22aが形成されており、凹凸領域22aにレーザー光が照射される。なお、凹凸領域22aではレーザー吸収率が高くなる。 Further, the upper metal material 22 is formed to have a poor surface roughness in order to increase the laser absorption rate when the laser beam is irradiated from the laser irradiation section 11. For example, an uneven region 22a having an uneven shape is formed on the upper surface of the upper metal material, and the uneven region 22a is irradiated with laser light. The unevenness area 22a has a high laser absorption rate.

図3は、上側金属材22の表面において吸収率を上げるために、レーザーマーカによって表面を荒らすことで、凹凸領域22aを形成した状態を示した図である。 FIG. 3 is a view showing a state in which the surface of the upper metal material 22 is roughened by a laser marker to increase the absorptance, thereby forming the concavo-convex region 22a.

ここで、図4を用い、レーザー光を照射することで下側金属材21と上側金属材22を溶接する動作について説明する。 Here, the operation of welding the lower metal material 21 and the upper metal material 22 by irradiating the laser light will be described with reference to FIG.

図4(a)に示すように、最初に、載置部12に、下側金属材21と、上側金属材22が載置される。レーザー照射部11は、上側金属材22の上面であり、特に凹凸領域22aが形成されている箇所(図1、図2参照)にレーザー光を照射する。 As shown in FIG. 4A, first, the lower metal material 21 and the upper metal material 22 are mounted on the mounting portion 12. The laser irradiation unit 11 is a top surface of the upper metal material 22, and particularly irradiates a portion (see FIGS. 1 and 2) where the uneven region 22a is formed with laser light.

図4(b)に示すように、上側金属材22は、レーザー照射部11から照射されたレーザー光を吸収することにより、溶融を始める。 As shown in FIG. 4B, the upper metal material 22 starts melting by absorbing the laser light emitted from the laser irradiation unit 11.

ここで、下側金属材21に対して、レーザー照射部11から照射されたレーザー光が照射される状態となった場合であっても、下側金属材21はレーザーの吸収率が低く、上側金属材22に比べて融点が高い材料であるため、溶融が抑制される。 Here, even when the lower metal material 21 is in a state of being irradiated with the laser light emitted from the laser irradiation unit 11, the lower metal material 21 has a low laser absorption rate, Since the material has a higher melting point than the metal material 22, melting is suppressed.

図4(c)に示すように、溶融した上側金属材22が下側金属材21に接触する。このとき、上側金属材22は十分に熱せられた状態であるため、熱伝導によって下側金属材21が僅かに溶融して接合される。このとき、金属間化合物はほとんど生成されない状態となる。 As shown in FIG. 4C, the molten upper metal material 22 contacts the lower metal material 21. At this time, since the upper metal material 22 is in a sufficiently heated state, the lower metal material 21 is slightly melted and joined by heat conduction. At this time, the intermetallic compound is hardly produced.

その後、レーザー照射部11では、上側金属材22と下側金属材21が十分に溶接される状態となったら、レーザー光の照射を停止する。 After that, in the laser irradiation unit 11, when the upper metal material 22 and the lower metal material 21 are sufficiently welded, the irradiation of the laser light is stopped.

このようにして溶接を行うことで、図5に示すように、接合界面に僅かな金属間化合物が存在する状態で溶接され、強度を安定させることができる。 By performing welding in this manner, as shown in FIG. 5, welding is performed in the state where a slight amount of intermetallic compound exists at the joint interface, and the strength can be stabilized.

したがって、上側金属材22に対してレーザー光が照射される部分には凹凸形状を形成しておき、レーザー光の吸収率を高めておくことで溶融しやすくできる。さらに、上側金属材は溶融しやすく、下側金属材は溶融しにくい材料を用いておき、溶融した上側金属材の熱伝導によって下側金属材を僅かに溶融しながら、両金属材を接合することで、溶融された両金属が混ざる量を抑制することができ、金属間化合物の生成を抑制できる。 Therefore, it is possible to easily melt the upper metal material 22 by forming a concavo-convex shape in the portion irradiated with the laser light and increasing the absorption rate of the laser light. Further, the upper metal material is easily melted, and the lower metal material is hard to be melted. The two metal materials are joined while the lower metal material is slightly melted by heat conduction of the melted upper metal material. As a result, it is possible to suppress the mixing amount of the two melted metals, and it is possible to suppress the formation of intermetallic compounds.

なお、本発明は上記実施の形態に限られたものではなく、趣旨を逸脱しない範囲で適宜変更することが可能である。例えば、下側金属材21はアルミ材であり、上側金属材22は銅材であるものとして説明したが、これらに限られない。すなわち、下側金属材21として融点が高い他の金属材料を用いることや、上側金属材22として融点の低い他の金属材料を用いることができる。 The present invention is not limited to the above-mentioned embodiments, but can be modified as appropriate without departing from the spirit of the present invention. For example, although the lower metal material 21 is an aluminum material and the upper metal material 22 is a copper material, the material is not limited to these. That is, another metal material having a high melting point can be used as the lower metal material 21, and another metal material having a low melting point can be used as the upper metal material 22.

1 接合装置
2 ワーク
11 レーザー照射部
12 載置部
21 下側金属材
22 上側金属材
22a 凹凸領域
DESCRIPTION OF SYMBOLS 1 Joining apparatus 2 Work 11 Laser irradiation part 12 Mounting part 21 Lower metal material 22 Upper metal material 22a Uneven area

Claims (1)

下側金属材と、前記下側金属材に比べてレーザー光の吸収率が高く、かつ、前記下側金属材より融点が高い上側金属材と、を重ね、前記上側金属材の上方からレーザー光を前記上側金属材に照射し、上側金属材を溶融させることで両金属材を溶接する異種金属の接合方法であって、
前記上側金属材のレーザー光が当たる領域には、凹凸形状を有する凹凸領域が形成されており、
前記凹凸領域に、前記上側金属材が溶融するエネルギーを有するレーザー光を照射する
異種金属の接合方法。
A lower metal material and an upper metal material having a higher absorptance of laser light than the lower metal material and having a higher melting point than the lower metal material are stacked, and laser light is applied from above the upper metal material. Is a method for joining dissimilar metals, in which both metal materials are welded by irradiating the upper metal material and melting the upper metal material,
An uneven region having an uneven shape is formed in a region of the upper metal material exposed to the laser beam,
A method for joining dissimilar metals, wherein the uneven region is irradiated with laser light having energy for melting the upper metal material.
JP2018233277A 2018-12-13 2018-12-13 Method of joining dissimilar metals Pending JP2020093285A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021054483A1 (en) 2019-09-17 2021-03-25 キヤノン株式会社 Toner cartridge and image formation device
US20220294089A1 (en) * 2021-03-11 2022-09-15 Prime Planet Energy & Solutions, Inc. Terminal component and electricity storage device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021054483A1 (en) 2019-09-17 2021-03-25 キヤノン株式会社 Toner cartridge and image formation device
EP3982202A1 (en) 2019-09-17 2022-04-13 Canon Kabushiki Kaisha Toner cartridge and image forming apparatus
EP3982200A1 (en) 2019-09-17 2022-04-13 Canon Kabushiki Kaisha Toner cartridge and image forming apparatus
EP3982201A1 (en) 2019-09-17 2022-04-13 Canon Kabushiki Kaisha Toner cartridge and image forming apparatus
EP4425265A2 (en) 2019-09-17 2024-09-04 Canon Kabushiki Kaisha Toner cartridge and image forming apparatus
US20220294089A1 (en) * 2021-03-11 2022-09-15 Prime Planet Energy & Solutions, Inc. Terminal component and electricity storage device

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