JP2020013948A

JP2020013948A - Light emitting device

Info

Publication number: JP2020013948A
Application number: JP2018136788A
Authority: JP
Inventors: 公博宮本; Kimihiro Miyamoto
Original assignee: Nichia Chemical Industries Ltd
Current assignee: Nichia Chemical Industries Ltd
Priority date: 2018-07-20
Filing date: 2018-07-20
Publication date: 2020-01-23
Anticipated expiration: 2038-07-20
Also published as: JP7177336B2

Abstract

【課題】発光部と非発光部の輝度の差が急峻で、見切り性の良い、良好な輝度分布を有する発光装置を提供することを目的とする。【解決手段】配列された複数の発光素子１１と、複数の発光素子１１それぞれの上面を被覆する複数の透光性部材１２と、透光性部材１２の側面を被覆する被覆部材１３と、隣接する透光性部材１２間に配置された被覆部材１３中に配置されたワイヤ１４とを備える発光装置。【選択図】図１ＢPROBLEM TO BE SOLVED: To provide a light emitting device having a steep difference in brightness between a light emitting unit and a non-light emitting unit, having good visibility and having a good brightness distribution. SOLUTION: A plurality of arranged light emitting elements 11, a plurality of translucent members 12 covering the upper surface of each of the plurality of light emitting elements 11, and a covering member 13 covering the side surface of the translucent member 12 are adjacent to each other. A light emitting device including a wire 14 arranged in a covering member 13 arranged between the translucent members 12 and the light emitting device. [Selection diagram] FIG. 1B

Description

本発明は、複数の発光素子を備えた発光装置に関する。 The present invention relates to a light emitting device including a plurality of light emitting elements.

近年、半導体発光素子は、蛍光灯に代わる照明用の光源のみならず、車両のヘッドライトなどの投光器、投光照明等の良好な指向性及び高い輝度を有する光源として利用されている。
このような用途に用いられる発光装置は、複数の発光素子の側面が反射性部材で被覆され、互いに近接して一列に配列されている。このように複数の発光素子を備えた発光装置においては、発光状態の素子と非発光状態の素子との輝度の差が明確で、見切り性の良い発光装置が求められている。そのために、発光素子を覆う光反射部材にさらに遮光部材を配置した発光装置が提案されている（特許文献１）。 2. Description of the Related Art In recent years, semiconductor light emitting devices have been used as light sources having good directivity and high luminance, such as floodlights such as vehicle headlights and floodlights, as well as light sources for lighting instead of fluorescent lamps.
In a light emitting device used for such an application, the side surfaces of a plurality of light emitting elements are covered with a reflective member, and are arranged in a row in close proximity to each other. As described above, in a light-emitting device including a plurality of light-emitting elements, a light-emitting device with a clear difference in luminance between an element in a light-emitting state and an element in a non-light-emitting state and with good visibility is demanded. For this purpose, a light-emitting device has been proposed in which a light-shielding member is further disposed on a light-reflecting member that covers a light-emitting element (Patent Document 1).

特開２０１４−２３６１７５号公報JP 2014-236175 A

近年の発光装置における素子間距離の縮小により、発光素子を覆う光反射部材にさらに遮光部材を配置することは困難となりつつある。
本発明は上記課題に鑑みなされたものであり、発光部と非発光部の輝度の差が明確で、見切り性の良い、良好な輝度分布を有する発光装置を提供することを目的とする。 Due to a reduction in the distance between elements in a light emitting device in recent years, it is becoming difficult to further arrange a light shielding member on a light reflecting member covering the light emitting element.
The present invention has been made in view of the above problems, and has as its object to provide a light-emitting device having a clear luminance difference between a light-emitting portion and a non-light-emitting portion, good visibility, and good luminance distribution.

本発明の発光装置は、
配列された複数の発光素子と、
前記複数の発光素子それぞれの上面を被覆する複数の透光性部材と、
前記透光性部材の側面を被覆する被覆部材と、
隣接する前記透光性部材間に配置された前記被覆部材中に配置されたワイヤとを備える。 The light emitting device of the present invention
A plurality of light emitting elements arranged,
A plurality of translucent members covering the upper surface of each of the plurality of light emitting elements,
A covering member for covering a side surface of the translucent member,
And a wire disposed in the covering member disposed between the adjacent light transmitting members.

本発明の発光装置は、発光部と非発光部の輝度の差が明確で、見切り性の良い、良好な輝度分布を有する発光装置を提供することができる。 The light-emitting device of the present invention can provide a light-emitting device in which the difference in luminance between a light-emitting portion and a non-light-emitting portion is clear, has good visibility, and has a favorable luminance distribution.

本発明の一実施形態の発光装置を示す概略平面図である。1 is a schematic plan view illustrating a light emitting device according to an embodiment of the present invention. 図１ＡのＩ−Ｉ'線断面図である。FIG. 1B is a sectional view taken along line II ′ of FIG. 1A. 本発明の他の実施形態の発光装置を示す概略断面図である。FIG. 9 is a schematic sectional view showing a light emitting device according to another embodiment of the present invention. 本発明のさらに他の実施形態の発光装置を示す概略断面図である。FIG. 11 is a schematic sectional view showing a light emitting device according to still another embodiment of the present invention. 本発明のさらに他の実施形態の発光装置を示す概略断面図である。FIG. 11 is a schematic sectional view showing a light emitting device according to still another embodiment of the present invention. 透光性部材を説明するための概略断面図である。It is a schematic sectional drawing for demonstrating a translucent member. 本発明の別の実施形態の発光装置を示す概略平面図である。FIG. 9 is a schematic plan view illustrating a light emitting device according to another embodiment of the present invention. 図３ＡのＩＩ−ＩＩ'線断面図である。FIG. 3B is a sectional view taken along line II-II ′ of FIG. 3A. 本発明のさらに別の実施形態の発光装置の製造方法を示す概略工程平面図である。It is a schematic process top view showing the manufacturing method of the light emitting device of yet another embodiment of the present invention. 本発明のさらに別の実施形態の発光装置の製造方法を示す概略工程平面図である。It is a schematic process top view showing the manufacturing method of the light emitting device of yet another embodiment of the present invention. 図１Ａの発光装置の製造方法を示す概略工程断面図である。FIG. 1B is a schematic process sectional view illustrating the method of manufacturing the light emitting device of FIG. 1A. 図１Ａの発光装置の製造方法を示す概略工程断面図である。FIG. 1B is a schematic process sectional view illustrating the method of manufacturing the light emitting device of FIG. 1A. 図１Ａの発光装置の製造方法を示す概略工程断面図である。FIG. 1B is a schematic process sectional view illustrating the method of manufacturing the light emitting device of FIG. 1A. 本発明の製造装置の別の製造方法を示す概略工程断面図である。It is a schematic process sectional drawing which shows another manufacturing method of the manufacturing apparatus of this invention. 本発明の製造装置の別の製造方法を示す概略工程断面図である。It is a schematic process sectional drawing which shows another manufacturing method of the manufacturing apparatus of this invention. 本発明の製造装置のさらに別の製造方法を示す概略工程断面図である。It is a schematic process sectional drawing which shows another manufacturing method of the manufacturing apparatus of this invention. 本発明の製造装置のさらに別の製造方法を示す概略工程断面図である。It is a schematic process sectional drawing which shows another manufacturing method of the manufacturing apparatus of this invention. 本発明の製造装置のさらに別の製造方法を示す概略工程断面図である。It is a schematic process sectional drawing which shows another manufacturing method of the manufacturing apparatus of this invention.

本願においては、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。以下の説明において、同一の名称、符号については同一又は同質の部材を示しており、詳細説明を適宜省略する。一実施例及び一実施形態において説明された内容は、他の実施例及び他の実施形態等に利用可能である。
本件明細書において、「上」、「下」という用語は、発光装置の発光を取り出す側とその逆側を指す用語としても用いる。例えば「上面」とは発光装置の発光を取り出す側にある面を指し、「下面」とはその逆側の面を指す。 In the present application, the size, positional relationship, and the like of the members illustrated in each drawing may be exaggerated for clarity of description. In the following description, the same names and reference numerals indicate the same or similar members, and a detailed description thereof will be omitted as appropriate. The contents described in one example and one embodiment can be used in other examples and other embodiments.
In this specification, the terms “upper” and “lower” are also used as terms indicating a side from which light is emitted from a light emitting device and an opposite side thereof. For example, “upper surface” refers to a surface on the light extraction side of the light emitting device, and “lower surface” refers to a surface on the opposite side.

〔発光装置１０〕
図１Ａ及び図１Ｂに示すように、本実施形態の発光装置１０は、複数の発光素子１１と、発光素子１１の上面を被覆する複数の透光性部材１２と、透光性部材１２の側面を被覆する被覆部材１３と、隣接する透光性部材１２間に配置され、被覆部材１３中に配置されたワイヤ１４とを備える。
（発光素子１１）
発光素子１１は、通常、発光ダイオードが用いられる。発光素子１１は、その組成、発光色又は波長、大きさ、個数等、目的に応じて適宜選択することができる。例えば、青色、緑色の発光素子としては、ＺｎＳｅ、窒化物系半導体（Ｉｎ_XＡｌ_YＧａ_1-X-YＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）、ＧａＰなどの半導体層を用いたもの、赤色の発光素子としては、ＧａＡｌＡｓ、ＡｌＩｎＧａＰなどの半導体層を用いたものが挙げられる。
発光素子１１は、通常、成長用基板（例えば、サファイア基板）上に、第１導電型半導体層、発光層及び第２導電型半導体層等の複数の半導体層を積層させて形成される。成長用基板は半導体層との接合面に凹凸を有していてもよい。これにより半導体層から出射された光が基板に当たるときの臨界角を意図的に変えることができ、基板の外部に光を容易に取り出すことができる。成長用基板は、半導体層の積層後に除去されていてもよい。除去は、例えば、研磨、ＬＬＯ（Laser Lift Off）等で行うことができる。また、成長用基板を除去する場合は、半導体層に実装用の支持基材を備えることもできる。 [Light emitting device 10]
As shown in FIGS. 1A and 1B, a light emitting device 10 of the present embodiment includes a plurality of light emitting elements 11, a plurality of light transmitting members 12 covering an upper surface of the light emitting elements 11, and side surfaces of the light transmitting members 12. And a wire 14 disposed between the adjacent translucent members 12 and disposed in the covering member 13.
(Light emitting element 11)
As the light emitting element 11, a light emitting diode is usually used. The composition, emission color or wavelength, size, number, and the like of the light-emitting elements 11 can be appropriately selected depending on the purpose. For example, as a blue or green light-emitting element, an element using a semiconductor layer such as ZnSe, a nitride semiconductor (In _x Al _Y Ga _{1 -XYN} , 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), or GaP is used. Examples of the red light emitting element include an element using a semiconductor layer such as GaAlAs or AlInGaP.
The light emitting element 11 is generally formed by stacking a plurality of semiconductor layers such as a first conductive semiconductor layer, a light emitting layer, and a second conductive semiconductor layer on a growth substrate (for example, a sapphire substrate). The growth substrate may have irregularities on the bonding surface with the semiconductor layer. Thereby, the critical angle when the light emitted from the semiconductor layer hits the substrate can be intentionally changed, and the light can be easily taken out of the substrate. The growth substrate may be removed after the lamination of the semiconductor layers. The removal can be performed by, for example, polishing, LLO (Laser Lift Off), or the like. When the growth substrate is removed, the semiconductor layer may be provided with a supporting base material for mounting.

発光素子１１は、同一面側に正負一対の電極を有するものが好ましい。これにより、発光素子を実装基材にフリップチップ実装することができる。この場合、一対の電極が形成された面と対向する面が光取り出し面となる。フリップチップ実装は、半田等の導電性を有するペースト状の接合部材、薄膜状の接合部材又はバンプ状の接合部材を用いて、発光素子と基材上の配線パターンとが電気的に接続されている。あるいは、フェイスアップ実装する場合には、一対の電極が形成された面を光取り出し面としてもよい。また、発光素子は、異なる側に正負一対の電極を有するものであってもよい。正負一対の電極が反対の面に各々設けられている対向電極構造の発光素子の場合、下面電極が導電性部材で基材に固定され、上面電極が導電性ワイヤ等で基材と接続される。
発光素子１１は、１つの発光装置において複数が整列して配置されている。発光素子１１は、例えば、図１Ａに示すように、一列に整列されてもよいが、図４Ｂに示すようにマトリクス状に整列されていてもよい。発光素子１１の数は、得ようとする発光装置の特性、サイズ等に応じて適宜設定することができる。配列する複数の発光素子１１は、互いに近接していることが好ましく、車両用途、さらに輝度分布等を考慮すると、発光素子間距離は、発光素子自体のサイズ（例えば一辺の長さ）よりも短いものが好ましく、例えば、発光素子自体のサイズの３０％程度以下がより好ましく、２０％以下がさらに好ましい。別の観点から、発光素子間距離は、例えば、１０数μｍ〜２００μｍ程度が好ましく、２０μｍ〜１００μｍ程度がより好ましい。このような距離に設定することにより、後述する被覆部材１３、さらにはワイヤ１４によって、光漏れを最小限に止め、効率的な光反射を実現しながら、隣接する発光素子間の距離を近接させて、良好な輝度分布を確保することができ、発光ムラの少ない発光品位の高い面光源の発光装置を得ることができる。
発光素子１１は、例えば、表面に配線パターン１５を有する基材１６の上に、配列されていることが好ましい。 The light emitting element 11 preferably has a pair of positive and negative electrodes on the same surface side. Thereby, the light emitting element can be flip-chip mounted on the mounting base material. In this case, a surface facing the surface on which the pair of electrodes are formed is a light extraction surface. In flip-chip mounting, a light-emitting element and a wiring pattern on a substrate are electrically connected using a paste-like joining member, a thin-film joining member, or a bump-like joining member having conductivity such as solder. I have. Alternatively, in the case of face-up mounting, the surface on which the pair of electrodes are formed may be the light extraction surface. Further, the light emitting element may have a pair of positive and negative electrodes on different sides. In the case of a light-emitting element having a counter electrode structure in which a pair of positive and negative electrodes are provided on opposite surfaces, a lower electrode is fixed to a substrate with a conductive member, and an upper electrode is connected to the substrate with a conductive wire or the like. .
A plurality of light emitting elements 11 are arranged in one light emitting device. The light emitting elements 11 may be arranged in a line as shown in FIG. 1A, for example, or may be arranged in a matrix as shown in FIG. 4B. The number of the light emitting elements 11 can be appropriately set according to the characteristics, size, and the like of the light emitting device to be obtained. The plurality of light emitting elements 11 to be arranged are preferably close to each other, and in consideration of a vehicle application, luminance distribution, and the like, the distance between the light emitting elements is shorter than the size of the light emitting elements themselves (for example, the length of one side). Preferably, the size is, for example, about 30% or less of the size of the light emitting element itself, more preferably 20% or less. From another viewpoint, the distance between the light-emitting elements is, for example, preferably about 10 μm to 200 μm, and more preferably about 20 μm to 100 μm. By setting such a distance, the covering member 13 and the wire 14, which will be described later, minimize light leakage and reduce the distance between adjacent light emitting elements while realizing efficient light reflection. As a result, a good luminance distribution can be ensured, and a light emitting device of a surface light source with high light emission quality with less light emission unevenness can be obtained.
The light emitting elements 11 are preferably arranged, for example, on a base material 16 having a wiring pattern 15 on the surface.

（透光性部材１２）
発光素子１１のそれぞれの上面（つまり光取り出し面）には、それら上面を被覆する透光性部材１２が配置されている。透光性部材１２は、発光素子１１から出射される光を透過させ、その光を外部に放出することが可能な部材である。透光性部材１２は、発光素子１１から出射された光の全てを取り出すために、発光素子１１の上面の全部を透光性部材１２で被覆することが好ましい。ただし、透光性部材が発光素子よりも大きくなるほど、そこから取り出される光は、輝度が低下することがある。従って、発光素子を被覆する透光性部材は、平面視において、できる限り発光素子と同じ大きさであることが好ましい。これにより、発光装置のより一層の小型化が可能となることに加え、より一層高い輝度が得られる。
発光素子１１と同等又は若干大きい透光性部材１２で複数の発光素子１１をそれぞれに被覆する場合、透光性部材間距離は、透光性部材自体のサイズ（例えば最長長さ又は一辺の長さ）よりも短いものが好ましく、例えば、透光性部材自体のサイズの２０％以下、１５％以下又は１０％以下であることがより好ましい。このように透光性部材同士を近接して配置させることにより、発光ムラの少ない発光品位の高い面光源の発光装置とすることができる。
透光性部材１２の厚みは、例えば、５０μｍ〜３００μｍ程度とすることができる。
透光性部材１２は、板状又は層状の部材であることが好ましい。ただし、上面が凹凸形状、曲面、レンズ状の種々の形状であってもよく、下面は、発光素子１１の光取り出し面に平行な面とすることが好ましい。また、例えば、図２に示すように、透光性部材２２は、下面側の板状部２２ａ、上面側に１つの凸部２２ｂを有する形状とすることができる。この場合、板状部２２ａの平面視における外縁が、発光素子１１の外縁と一致するか、それよりも外側に配置されることが好ましい。あるいは、凸部２２ｂの平面視における外縁が、発光素子１１の外縁と一致するか、それよりも内側に配置されることが好ましい。凸部２２ｂの大きさ、配置によって、配光性を調整することができる。
なお、透光性部材１２の平面形状にかかわらず、その端面は、上下面又は発光素子の光取出し面に垂直であることが好ましいが、傾斜していてもよい。
透光性部材１２は、例えば、樹脂成形体や、セラミックス、ガラス等の無機物によって形成することができる。ここで、透光性とは、透光性部材を構成する母材の透過率において発光素子から出射される光の６０％以上を透過すればよく、７０％以上を透過するものが好ましく、８０％以上を透過するものがより好ましい。
透光性部材１２は、蛍光体を含有していることが好ましい。蛍光体を含有する透光性部材１２としては、例えば蛍光体の焼結体や、樹脂、セラミックス、ガラス等に蛍光体を含有させたものが挙げられる。透光性部材１２の透明度が高いほど、被覆部材との界面において光を反射させやすいため、発光装置としての輝度を向上させることが可能となる。
蛍光体としては、イットリウム・アルミニウム・ガーネット系蛍光体（ＹＡＧ系蛍光体）、窒化物系蛍光体、酸窒化物蛍光体、Ｋ₂ＳｉＦ₆：Ｍｎ系蛍光体（ＫＳＦ蛍光体）、硫化物系蛍光体等の当該分野で公知のものを適宜使用することができる。これらの蛍光体を、所望の色調に適した組み合わせ及び／又は配合比で用いて、演色性及び色再現性等を調整することができる。透光性部材１２が蛍光体を含有することにより、透光性部材１２上面から外部に出射される光は、蛍光体により波長変換された光を含む。そのため、例えば、発光素子１１から出射された青色光と、その青色光の一部が蛍光体により波長変換された黄色光とを混色させることにより、白色系の光を発する発光装置１０を得ることができる。 (Translucent member 12)
On each of the upper surfaces of the light emitting elements 11 (that is, light extraction surfaces), a translucent member 12 that covers the upper surfaces is disposed. The translucent member 12 is a member capable of transmitting light emitted from the light emitting element 11 and emitting the light to the outside. The light transmitting member 12 preferably covers the entire upper surface of the light emitting element 11 with the light transmitting member 12 in order to extract all of the light emitted from the light emitting element 11. However, as the size of the light-transmitting member is larger than that of the light-emitting element, light extracted from the light-emitting element may have lower luminance. Therefore, it is preferable that the translucent member covering the light emitting element has the same size as the light emitting element as much as possible in plan view. This allows the light emitting device to be further miniaturized, and further obtains higher luminance.
When each of the plurality of light emitting elements 11 is covered with the light transmitting element 12 that is equal to or slightly larger than the light emitting element 11, the distance between the light transmitting members is determined by the size of the light transmitting member itself (for example, the longest length or the length of one side). Is smaller than 20%, for example, more preferably 20% or less, 15% or less, or 10% or less of the size of the translucent member itself. By arranging the translucent members close to each other as described above, it is possible to provide a light-emitting device of a surface light source with low light emission unevenness and high light emission quality.
The thickness of the translucent member 12 can be, for example, about 50 μm to 300 μm.
The translucent member 12 is preferably a plate-shaped or layer-shaped member. However, the upper surface may have various shapes such as an uneven shape, a curved surface, and a lens shape, and the lower surface is preferably a surface parallel to the light extraction surface of the light emitting element 11. Further, for example, as shown in FIG. 2, the translucent member 22 can have a shape having a plate-like portion 22 a on the lower surface side and one convex portion 22 b on the upper surface side. In this case, it is preferable that the outer edge of the plate-shaped portion 22a in plan view coincides with the outer edge of the light emitting element 11 or is disposed outside the outer edge. Alternatively, it is preferable that the outer edge of the projection 22b in a plan view coincides with the outer edge of the light emitting element 11 or is located inside the outer edge. The light distribution can be adjusted by the size and arrangement of the protrusions 22b.
In addition, regardless of the planar shape of the translucent member 12, the end surface is preferably perpendicular to the upper and lower surfaces or the light extraction surface of the light emitting element, but may be inclined.
The translucent member 12 can be formed of, for example, a resin molded body or an inorganic substance such as ceramics and glass. Here, the term “light-transmitting” means that the light transmitting element transmits at least 60% of the light emitted from the light emitting element, and preferably transmits 70% or more of the light emitted from the light emitting element. % Is more preferable.
It is preferable that the translucent member 12 contains a phosphor. As the translucent member 12 containing a phosphor, for example, a sintered body of the phosphor, or a material in which the phosphor is contained in resin, ceramics, glass, or the like can be given. As the transparency of the translucent member 12 increases, light is more likely to be reflected at the interface with the covering member, so that the luminance of the light emitting device can be improved.
Phosphors include yttrium / aluminum / garnet phosphor (YAG phosphor), nitride phosphor, oxynitride phosphor, K ₂ SiF ₆ : Mn phosphor (KSF phosphor), sulfide phosphor A known substance such as a phosphor can be used as appropriate. By using these phosphors in a combination and / or a compounding ratio suitable for a desired color tone, the color rendering properties and the color reproducibility can be adjusted. Since the translucent member 12 contains a phosphor, the light emitted from the upper surface of the translucent member 12 to the outside includes light whose wavelength has been converted by the phosphor. Therefore, for example, it is possible to obtain the light emitting device 10 that emits white light by mixing the blue light emitted from the light emitting element 11 with the yellow light in which a part of the blue light is wavelength-converted by the phosphor. Can be.

透光性部材１２は、１種類の部材によって単層で形成してもよく、２種類以上の部材を混合して単層で形成してもよく、単層を２層以上積層して形成してもよい。
また、透光性部材１２は、光拡散材を含有してもよい。光拡散材としては、例えば、酸化チタン、チタン酸バリウム、酸化アルミニウム、酸化ケイ素等が挙げられる。
透光性部材１２は、発光素子１１の上面（光取り出し面）を被覆するように接合されている。接合は、例えば、圧着、焼結、エポキシ又はシリコーンのような周知の透光性の接着剤による接着、高屈折率の有機接着剤による接着、低融点ガラスによる接着などで行うことができる。接着剤には、さらに、蛍光体、光拡散材などが含有されていてもよい。
なお、透光性部材１２を発光素子の上面に接合する場合において、図１Ｃに示すように、接着剤１８等を用いた場合には、接着剤１８に起因する透光性の部材の一部１８ａが、発光素子１１の側面の一部又は全部を被覆することがある。特に、発光素子１１より大きい透光性部材１２を接合する場合、発光素子１１からの光が透光性部材１２に伝播されやすいよう、接着剤１８を発光素子１１側面にまで配置することがある。接着剤１８が発光素子１１の側面を被覆する場合、接着剤１８は、透光性部材１２の直下からはみ出さないように配置されることが好ましい。
透光性部材１２は、例えば、複数の発光素子１１を配列した後、複数の透光性部材１２を、それぞれ、複数の発光素子１１の上面に配置してもよいし、複数の発光素子１１を配列した後、１つの透光性部材を複数の発光素子１１の上面に配置し、その後、ブレード、レーザ照射等にて発光素子１１間において透光性部材を切断して、１つの発光素子に１つの透光性部材を配置してもよい。 The translucent member 12 may be formed as a single layer by one kind of member, or may be formed as a single layer by mixing two or more kinds of members, or may be formed by laminating two or more single layers. You may.
Further, the light transmitting member 12 may contain a light diffusing material. Examples of the light diffusing material include titanium oxide, barium titanate, aluminum oxide, and silicon oxide.
The translucent member 12 is joined so as to cover the upper surface (light extraction surface) of the light emitting element 11. The bonding can be performed by, for example, pressure bonding, sintering, bonding with a well-known translucent adhesive such as epoxy or silicone, bonding with an organic adhesive having a high refractive index, bonding with low-melting glass, or the like. The adhesive may further contain a phosphor, a light diffusing material, and the like.
In the case where the translucent member 12 is bonded to the upper surface of the light emitting element, as shown in FIG. 1C, when the adhesive 18 or the like is used, a part of the translucent member caused by the adhesive 18 is used. 18 a may cover a part or all of the side surface of the light emitting element 11. In particular, when a light-transmitting member 12 larger than the light-emitting element 11 is joined, the adhesive 18 may be disposed on the side surface of the light-emitting element 11 so that light from the light-emitting element 11 is easily transmitted to the light-transmitting member 12. . When the adhesive 18 covers the side surface of the light emitting element 11, the adhesive 18 is preferably arranged so as not to protrude from directly below the translucent member 12.
For example, after arranging the plurality of light emitting elements 11, the plurality of light transmitting members 12 may be arranged on the upper surface of the plurality of light emitting elements 11, respectively. Are arranged, one translucent member is arranged on the upper surface of the plurality of light emitting elements 11, and then the translucent member is cut between the light emitting elements 11 by a blade, laser irradiation, or the like, thereby forming one light emitting element. One light-transmitting member may be arranged in the first position.

（被覆部材１３）
図１Ａ及び図１Ｂに示すように、被覆部材１３は、透光性部材１２の側面を被覆している。ここでの透光性部材１２の側面とは、透光性部材１２の厚み方向の一部、厚み方向の全部、透光性部材１２の側面の外周に沿った一部、側面の外周に沿った全部のいずれかでもよいが、透光性部材１２の側面の全周に亘って、厚み方向の全部であることが好ましい。また、ここでの被覆とは、透光性部材１２との間に別の層が介在していてもよいが、透光性部材１２と接触していることが好ましい。なかでも、複数含まれる透光性部材１２の側面の外周の全周に亘って、厚み方向の全てが被覆部材で被覆されていることがより好ましく、側面の外周が全周に亘って厚み方の全てが被覆部材と接触していることがさらに好ましい。これにより、透光性部材１２と被覆部材１３との界面で、発光素子から出射される光が透光性部材内に反射されやすくなるため、隣接する発光素子への光吸収が抑制され、発光素子の上面から透光性部材の上面及び外部へと効率的に光を出射させることができる。透光性部材間に配置される被覆部材は、透光性部材の上面（光取り出し面）と面一又は略面一とすることができる。これにより、透光性部材の側面から出射される光同士の干渉をより抑制しやすくできる。あるいは、隣接する消灯した発光素子に対する光の干渉をより抑制しやすくできる。ここで略面一とは、透光性部材の厚みの±１０％程度、好ましくは±５％程度の高低差が許容されることを意味する（本明細書において同じ意味）。
被覆部材は、発光素子１１の側面をも被覆していることが好ましい。ここでの発光素子１１の側面とは、少なくとも半導体層の側面の厚み方向の一部、半導体層の厚み方向の全部、半導体層の側面の外周の一部、半導体層の外周の全周のいずれでもよく、半導体層の側面の外周が全周に亘って厚み方向の全てであることが好ましい。これにより、発光素子と被覆部材との界面で、発光素子から出射される光が発光素子内に反射されるため、隣接する発光素子に光が吸収されることなく、発光素子の上面から透光性部材の上面又は外部へと出射される。また、被覆部材１３は、発光素子１１の下面をも被覆していることが好ましい。発光素子から出射される光を効率的に光取出し面に導くためである。なお、発光素子と被覆部材との間に別の層が介在する場合、別の層は、発光装置の発光面側に露出しないように配置されることが好ましい。別の層が発光面側に露出すると、発光素子と被覆部材との間で光が反射／伝播し色むらが生じるおそれがある。
ここでの別の層とは、例えば、図１Ｂ及び１Ｃに示すような接着剤１８及びその一部１８ａ又は図１Ｄに示し、後述するような埋設部材１７が挙げられる。 (Coating member 13)
As shown in FIGS. 1A and 1B, the covering member 13 covers the side surface of the translucent member 12. Here, the side surface of the translucent member 12 refers to a part in the thickness direction of the translucent member 12, the entirety in the thickness direction, a part along the outer periphery of the side surface of the translucent member 12, along the outer periphery of the side surface. However, it is preferable that it is the whole in the thickness direction over the entire periphery of the side surface of the translucent member 12. Further, the coating here may have another layer interposed between the light-transmissive member 12 and the light-transmissive member 12, but is preferably in contact with the light-transmissive member 12. Above all, it is more preferable that the entire outer periphery of the side surface of the plurality of translucent members 12 is covered with the covering member in the entire thickness direction, and the outer periphery of the side surface is formed in the thickness direction over the entire periphery. Is more preferably in contact with the covering member. Accordingly, at the interface between the light-transmitting member 12 and the covering member 13, light emitted from the light-emitting element is easily reflected in the light-transmitting member, so that light absorption to an adjacent light-emitting element is suppressed and light emission is suppressed. Light can be efficiently emitted from the upper surface of the element to the upper surface of the translucent member and to the outside. The covering member disposed between the translucent members may be flush or substantially flush with the upper surface (light extraction surface) of the translucent member. Thereby, it is possible to more easily suppress interference between lights emitted from the side surfaces of the translucent member. Alternatively, it is possible to more easily suppress the interference of light with the adjacent light-emitting element that has been turned off. Here, “substantially flush” means that a height difference of about ± 10%, preferably about ± 5% of the thickness of the translucent member is allowed (the same meaning in the present specification).
It is preferable that the covering member also covers the side surface of the light emitting element 11. Here, the side surface of the light-emitting element 11 means at least a part of the side surface of the semiconductor layer in the thickness direction, the whole of the semiconductor layer in the thickness direction, a part of the outer periphery of the side surface of the semiconductor layer, or the entire periphery of the outer periphery of the semiconductor layer. Alternatively, it is preferable that the outer periphery of the side surface of the semiconductor layer is all over the entire periphery in the thickness direction. Accordingly, at the interface between the light emitting element and the covering member, light emitted from the light emitting element is reflected into the light emitting element, so that light is transmitted from the upper surface of the light emitting element without being absorbed by the adjacent light emitting element. The light is emitted to the upper surface of the conductive member or to the outside. Further, it is preferable that the covering member 13 also covers the lower surface of the light emitting element 11. This is for efficiently guiding the light emitted from the light emitting element to the light extraction surface. When another layer is interposed between the light emitting element and the covering member, it is preferable that the other layer is arranged so as not to be exposed on the light emitting surface side of the light emitting device. If another layer is exposed on the light emitting surface side, light may be reflected / propagated between the light emitting element and the covering member, resulting in color unevenness.
The other layer here includes, for example, an adhesive 18 and a part 18a thereof as shown in FIGS. 1B and 1C or an embedded member 17 as shown in FIG. 1D and described later.

被覆部材は、発光素子から出射される光を反射することができる材料から形成されることが好ましい。これによって、発光素子及び／又は透光性部材と被覆部材との界面で、発光素子から出射される光を発光素子及び／又は透光性部材内に反射させる。その結果、光が、発光素子内で伝播し、最終的に発光素子の上面から透光性部材の上面、外部へと出射される。
被覆部材は、絶縁材料を用いることが好ましく、例えば樹脂材料を用いることができる。樹脂材料としては、シリコーン樹脂、変性シリコーン樹脂、エポキシ樹脂、変性エポキシ樹脂、アクリル樹脂、フェノール樹脂、フッ素樹脂の１種以上を含む樹脂又はハイブリッド樹脂等が挙げられる。被覆部材は、これらの樹脂材料に、光反射性物質を含有させることによって形成することができる。光反射性物質としては、酸化チタン、酸化ケイ素、酸化ジルコニウム、チタン酸カリウム、アルミナ、窒化アルミニウム、窒化ホウ素、ムライトなどが挙げられる。
光反射性物質等の含有量は、被覆部材の光の反射量及び透過量等を変動させることができるため、得ようとする発光装置の特性等によって適宜調整することができる。例えば、被覆部材の全重量に対して反射性物質の含有量を３０重量％以上とすることが好ましい。
被覆部材は、例えば、ポッティング成形、射出成形、樹脂印刷法、トランスファーモールド法、圧縮成形などで成形することができる。 The covering member is preferably formed from a material that can reflect light emitted from the light emitting element. Thereby, at the interface between the light emitting element and / or the translucent member and the covering member, light emitted from the light emitting element is reflected into the light emitting element and / or the translucent member. As a result, the light propagates in the light emitting element and is finally emitted from the upper surface of the light emitting element to the upper surface of the light transmitting member and to the outside.
It is preferable to use an insulating material for the covering member, and for example, a resin material can be used. Examples of the resin material include a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, a phenol resin, a resin containing at least one kind of fluororesin, and a hybrid resin. The covering member can be formed by adding a light reflecting substance to these resin materials. Examples of the light reflective substance include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, and the like.
The content of the light-reflective substance or the like can be adjusted as appropriate depending on the characteristics of the light-emitting device to be obtained, because the amount of light reflected and transmitted by the coating member can be varied. For example, the content of the reflective substance is preferably set to 30% by weight or more based on the total weight of the covering member.
The covering member can be formed by, for example, potting molding, injection molding, resin printing, transfer molding, compression molding, or the like.

（ワイヤ１４)
ワイヤ１４は、図１Ａ及び図１Ｂに示すように、隣接する透光性部材１２間に配置された被覆部材１３中に配置されている。ここで、被覆部材１３中とは、ワイヤ１４の全部が被覆部材に埋め込まれている、つまり、ワイヤ１４の全表面が被覆部材で覆われていることが好ましいが、被覆部材１３の上面の位置によっては、ワイヤの光取出し面側の表面の一部が露出していてもよい。なかでも、ワイヤ１４の上端（つまり、最上点）が、透光性部材１２の上面及び／又は被覆部材の上面と一致していることが好ましい。透光性部材１２間とは、透光性部材１２の間であって、互いに隣接する透光性部材１２の対向する側面間に配置される被覆部材１３を分断するように配置されることを意味する。従って、上面側から見て、少なくとも隣接する透光性部材１２間にのみ配置されていればよい。言い換えると、ワイヤは、上面視において、隣接する透光性部材１２の対向する辺に沿って、少なくとも辺と同じ長さのワイヤが被覆部材１３に埋設されていればよいが、隣接する透光性部材１２間から延長して配置されていることが好ましい。また、透光性部材１２の厚み方向の側面の全部の被覆部材１３を分断していることが好ましい。このようなワイヤの配置によって、一方の発光素子から出射され、さらに透光性部材１２に入射した光が被覆部材を通過して隣接する発光素子、隣接する透光性部材及び／又はそこから出射された光等に干渉することをより抑制することができる。ただし、後述するワイヤ１４の直径によっては、透光性部材１２間において、その厚み方向の一部の間には、ワイヤが配置されないことがある。
ワイヤ１４は、複数の発光素子の配列状態によるが、透光性部材１２間において、上面側から見て、例えば、図１Ａに示すように、直線状に配置されていることが好ましく、透光性部材１２間の略中央に直線状に配置されていることがより好ましい。このような配置によって、透光性部材１２間を被覆する被覆部材の厚みの均一性を確保することができ、見切り性の良い、良好な輝度分布を有する発光装置とすることができる。ただし、ワイヤ１４は、発光素子１１間、透光性部材１２間のみならず、２つの発光素子１１又は２つの透光性部材１２に挟まれない、端部に位置する発光素子１１又は透光性部材１２の外側にも配置されることが好ましい。これにより、端部の発光素子による配光性を制御することができ、見切り性のより良好な発光装置を得ることができる。
ワイヤ１４は、例えば、金、アルミニウム、銅、これらの合金又はこれら２種以上の組み合わせ等によって形成されている。ワイヤ１４は、通常、直径十数μｍ〜数百μｍのものを用いることができる。なかでも、１５μｍ〜４５μｍのものが好ましい。ワイヤ１４は、図１Ｂに示すように、透光性部材１２間に配置された被覆部材１３中に１本のみ配置されていてもよいし、図１Ｅに示すように、透光性部材１２の厚み方向に沿って、２本以上、つまり、透光性部材１２の厚み方向に２本以上、さらに、隣接する発光素子１１間にも配置されていることが好ましい。また、用いるワイヤ１４の直径、隣接する透光性部材１２間の距離等によっては、透光性部材１２間の同じ高さにおいて１本のワイヤのみならず、２本以上のワイヤが並列して配置されていてもよい。
このように、少なくとも隣接する透光性部材１２間に、さらには発光素子１１間にワイヤを配置することにより、隣接する透光性部材間、発光素子間での光漏れを確実に防止し、見切り性の良い、良好な輝度分布を確保することができる。特に、隣接する発光素子間で、点灯／消灯の状態となる場合において、消灯された発光素子への、点灯された発光素子からの光の干渉を最小限に止めることができ、消灯された発光素子の微小発光レベルを激減させることができる。
図１Ｅに示すように、ワイヤ１４が２本以上、透光性部材１２の厚み方向に配置される場合、そのワイヤ１４間の間隔は小さいほうがよい。ワイヤ１４同士は接触していてもよいし、若干離間していてもよい。ここでの若干の離間とは、ワイヤの直径の３０％以内の長さを指す（以下、本願明細書において同じ）。ワイヤ間の間隔は、一定であることが好ましいが、部分的に異なっていてもよい。また、３本以上のワイヤが配置されている場合においても、ワイヤ間の間隔は、ワイヤ間ごとに同じでも、一部又は全部が異なっていてもよい。
発光素子１１が、基材上に接合されている場合には、ワイヤ１４は、基材表面に接触することが好ましいが、基材表面と離間していてもよい。この場合、ワイヤの下端は、発光素子の下面より下方に配置されていることが好ましい。これにより、隣接する発光素子間での光の干渉を最小限に止めることができる。
さらに、図１Ｄに示すように、発光素子１１が基材１６上に接合され、上述したように基材１６と発光素子１１との間に埋設部材１７が埋設され、かつ埋設部材１７が発光素子１１間にまで及ぶ場合には、ワイヤの下端は、埋設部材１７の表面、埋設部材１７中のいずれに配置されていてもよい。 (Wire 14)
As shown in FIGS. 1A and 1B, the wire 14 is disposed in the covering member 13 disposed between the adjacent light transmitting members 12. Here, "in the covering member 13" means that the entire wire 14 is embedded in the covering member, that is, the entire surface of the wire 14 is preferably covered with the covering member. In some cases, a part of the surface on the light extraction surface side of the wire may be exposed. In particular, it is preferable that the upper end (that is, the uppermost point) of the wire 14 coincides with the upper surface of the translucent member 12 and / or the upper surface of the covering member. Between the translucent members 12 means between the translucent members 12 and is arranged to divide the covering member 13 disposed between the opposing side surfaces of the adjacent translucent members 12. means. Therefore, when it is viewed from the upper surface side, it is only necessary to be arranged at least between the adjacent translucent members 12. In other words, in the top view, the wire may have at least the same length as the side buried in the covering member 13 along the opposing side of the adjacent translucent member 12. It is preferable to be arranged so as to extend from between the sexual members 12. Further, it is preferable that all the covering members 13 on the side surface in the thickness direction of the light transmitting member 12 are divided. With such an arrangement of the wires, light emitted from one light emitting element and further incident on the light transmissive member 12 passes through the covering member, and is emitted from the adjacent light emitting element, the adjacent light transmissive member, and / or the light transmissive member. It is possible to further suppress interference with the emitted light or the like. However, depending on the diameter of the wire 14 described later, the wire may not be arranged between the translucent members 12 and partly in the thickness direction.
Although it depends on the arrangement state of the plurality of light emitting elements, the wires 14 are preferably arranged linearly between the translucent members 12 as shown in FIG. More preferably, they are linearly arranged substantially at the center between the sex members 12. With such an arrangement, the uniformity of the thickness of the covering member that covers between the translucent members 12 can be ensured, and a light-emitting device having good parting properties and a favorable luminance distribution can be obtained. However, the wire 14 is not only between the light emitting elements 11 and between the light transmissive members 12 but also between the two light emitting elements 11 or the two light transmissive members 12 and located at an end portion of the light emitting element 11 or the light transmissive member. It is preferable to be arranged also outside the sex member 12. Thereby, the light distribution by the light emitting element at the end can be controlled, and a light emitting device with better parting performance can be obtained.
The wire 14 is formed of, for example, gold, aluminum, copper, an alloy thereof, or a combination of two or more thereof. As the wire 14, a wire having a diameter of ten to several μm to several hundred μm can be used. Among them, those having a size of 15 μm to 45 μm are preferable. As shown in FIG. 1B, only one wire 14 may be arranged in the covering member 13 arranged between the translucent members 12, or as shown in FIG. It is preferable that two or more light-emitting elements 11 are arranged along the thickness direction, that is, two or more light-transmissive members 12 in the thickness direction of the translucent member 12. Further, depending on the diameter of the wire 14 used, the distance between the adjacent light-transmitting members 12, and the like, not only one wire but also two or more wires are arranged in parallel at the same height between the light-transmitting members 12. It may be arranged.
In this way, by arranging wires between at least the adjacent light-transmitting members 12 and further between the light-emitting elements 11, light leakage between the adjacent light-transmitting members and between the light-emitting elements is reliably prevented, A good luminance distribution with good parting performance can be secured. In particular, in the case where the light emitting element is turned on / off between adjacent light emitting elements, interference of light from the turned on light emitting element to the turned off light emitting element can be minimized, and the turned off light emitting The minute light emission level of the device can be drastically reduced.
As shown in FIG. 1E, when two or more wires 14 are arranged in the thickness direction of the translucent member 12, it is preferable that the interval between the wires 14 is small. The wires 14 may be in contact with each other or may be slightly separated from each other. Here, the slight separation refers to a length within 30% of the diameter of the wire (hereinafter the same in the present specification). The spacing between the wires is preferably constant, but may be partially different. Further, even when three or more wires are arranged, the intervals between the wires may be the same for each wire, or some or all may be different.
When the light emitting element 11 is bonded on a substrate, the wire 14 preferably contacts the substrate surface, but may be separated from the substrate surface. In this case, it is preferable that the lower end of the wire is disposed below the lower surface of the light emitting element. Thus, light interference between adjacent light emitting elements can be minimized.
Further, as shown in FIG. 1D, the light emitting element 11 is bonded on the base material 16, the embedded member 17 is embedded between the base material 16 and the light emitting element 11 as described above, and the embedded member 17 is In the case where the distance extends to between 11 and 11, the lower end of the wire may be disposed on the surface of the embedded member 17 or in the embedded member 17.

平面視において、複数の透光性部材１２が一列に整列している場合、ワイヤ１４は、隣接する任意の透光性部材１２間の一部のみ配置されていてもよいが、図１Ａに示すように、全部の透光性部材１２間に配置されていることが好ましい。また、透光性部材１２が二列に整列して搭載されている場合、図３Ａに示すように、列と列の間に配置されていてもよいし、透光性部材１２が行列状に配置される場合、図４Ａに示すように、全ての透光性部材１２間に格子状に配置されていてもよい。ワイヤ１４は、目的、用途に応じて適宜その配置を変更させることができる。例えば、透光性部材１２がマトリクス状に配列されている場合は、ワイヤ１４は、被覆部材中の同じ高さで交差することはできないため、その部分及び周辺において又はワイヤごとに、被覆部材中の高さが異なる位置に配置させることが適している。例えば、図３Ｂに示すように、列状に配列された透光性部材間と、行状に配列された透光性部材間とにおいて、交互にワイヤ１４が積層されていることが好ましい。平面視において行列状にワイヤを配置する場合、行と列の交差する点では、ワイヤは互いに接触してもよい。 When the plurality of translucent members 12 are arranged in a line in a plan view, the wires 14 may be arranged only partially between any adjacent translucent members 12, as shown in FIG. 1A. Thus, it is preferable to be arranged between all the translucent members 12. When the translucent members 12 are mounted in two rows, the translucent members 12 may be arranged between rows as shown in FIG. 3A, or the translucent members 12 may be arranged in a matrix. When they are arranged, as shown in FIG. 4A, they may be arranged in a lattice pattern between all the translucent members 12. The arrangement of the wire 14 can be appropriately changed depending on the purpose and application. For example, when the translucent members 12 are arranged in a matrix, the wires 14 cannot intersect at the same height in the covering member. It is suitable to arrange them at different heights. For example, as shown in FIG. 3B, it is preferable that the wires 14 are alternately stacked between the light-transmitting members arranged in a row and between the light-transmitting members arranged in a row. When arranging the wires in a matrix in plan view, the wires may contact each other at the points where the rows and columns intersect.

（基材１６）
発光装置は、図１Ａ及び図１Ｂに示したように、発光素子１１が、基材１６上に配列されていることが好ましい。基材は、通常、その表面に発光素子１１と接続される配線パターン１５を有している。
基材は、当該分野で公知であり、発光素子等が実装されるために使用される基板のいずれをも用いることができる。例えば、ガラスエポキシ、樹脂、セラミックスなどの絶縁性部材、表面に絶縁部材を形成した金属部材等によって形成された基板が挙げられる。なかでも、耐熱性及び耐候性の高いセラミックスを利用したものが好ましい。セラミックス材料としては、アルミナ、窒化アルミニウム、ムライトなどが挙げられ、これらのセラミックス材料に、例えば、ＢＴレジン、ガラスエポキシ、エポキシ系樹脂等の絶縁性材料を組み合わせてもよい。
なお、発光装置は、基材の配線パターン、その電力供給制御等によって、複数の発光素子は独立して駆動されるように構成されている。このような独立した点滅制御は、当該分野で公知であり、通常使用される方法のいずれをも利用することができる。 (Substrate 16)
In the light emitting device, as shown in FIGS. 1A and 1B, it is preferable that the light emitting elements 11 are arranged on the base material 16. The base material usually has a wiring pattern 15 connected to the light emitting element 11 on its surface.
As the substrate, any substrate known in the art and used for mounting a light emitting element or the like can be used. For example, a substrate formed of an insulating member such as glass epoxy, resin, or ceramic, a metal member having an insulating member formed on the surface, or the like can be given. Among them, those using ceramics having high heat resistance and high weather resistance are preferable. Examples of the ceramic material include alumina, aluminum nitride, and mullite. These ceramic materials may be combined with an insulating material such as BT resin, glass epoxy, and epoxy resin.
The light emitting device is configured such that a plurality of light emitting elements are independently driven by a wiring pattern of a base material, power supply control thereof, and the like. Such independent flicker control is well known in the art and can employ any of the commonly used methods.

（埋設部材１７）
上述したように、発光素子１１が基材１６上に接合される場合、図１Ｄに示すように、基材１６と発光素子１１との間に埋設部材１７が配置されていてもよい。基材１６と発光素子１１との間に埋設部材１７を配置することにより、発光素子と基材の熱膨張率の差による応力を吸収したり、放熱性を高めたりすることができる。
埋設部材１７は、発光素子の直下にのみ配置されていてもよいし、図１Ｄに示すように、発光素子の直下から、発光素子間に及んでいてもよく、発光素子の側面の一部に接触していてもよい。ただし、その材料によっては、少なくとも発光素子の発光層よりも上面側を露出するか、発光層及びそれよりも上面側を露出するように介在していることが好ましい。埋設部材は、例えば、最も肉厚の部位において、数μｍ〜数百μｍ程度の膜厚とすることができる。
埋設部材１７は、いわゆるアンダーフィルと呼称されるものであり、通常、樹脂を含んで構成される。含有される樹脂は、光反射性樹脂であることが好ましい。光反射性樹脂を用いることで、発光素子の下方向へ出射される光を反射することができ、光束を高めることができる。埋設部材１７は、被覆部材よりも低弾性、低線膨張の材料を用いる場合、発光素子と基材との接合部における樹脂膨張収縮応力の緩和が可能となり、電気的な接合信頼性が向上するため好ましい。また、被覆部材に機械強度の高い材料を使用し、埋設部材が外部に露出しないよう、被覆部材で埋設部材を完全に覆う構成とすることが好ましい。これにより、発光素子および埋設部材部分の外的応力に対する耐久性を確保できる。埋設部材と被覆部材とを異なる材料とする場合は、被覆部材を充填する前に埋設部材を硬化させておくことが好ましい。これにより、互いの樹脂が混合することを防止でき、互いの樹脂の性能を損なうことがない。
埋設部材１７は、例えば、上述した被覆部材１３と同様の材料を用いることができる。 (Buried member 17)
As described above, when the light emitting element 11 is bonded on the base 16, the embedded member 17 may be disposed between the base 16 and the light emitting element 11 as shown in FIG. 1D. By arranging the embedded member 17 between the base material 16 and the light emitting element 11, it is possible to absorb the stress due to the difference in the coefficient of thermal expansion between the light emitting element and the base material, and to enhance the heat dissipation.
The buried member 17 may be arranged only directly below the light emitting element, or may extend from immediately below the light emitting element to between the light emitting elements as shown in FIG. It may be in contact. However, depending on the material, it is preferable that at least the upper surface side of the light emitting layer of the light emitting element is exposed or the light emitting layer and the upper surface side of the light emitting element are interposed so as to be exposed. The buried member can have a film thickness of about several μm to several hundred μm at the thickest part, for example.
The burying member 17 is what is called an underfill, and is usually configured to include a resin. The contained resin is preferably a light-reflective resin. By using the light-reflective resin, light emitted downward from the light-emitting element can be reflected, and the luminous flux can be increased. When the embedded member 17 is made of a material having lower elasticity and lower linear expansion than the covering member, the resin expansion / shrinkage stress at the joint between the light emitting element and the base material can be reduced, and the electrical joining reliability is improved. Therefore, it is preferable. It is also preferable to use a material having high mechanical strength for the covering member, and to completely cover the embedded member with the covering member so that the embedded member is not exposed to the outside. Thereby, the durability of the light emitting element and the buried member against external stress can be secured. When the embedding member and the covering member are made of different materials, it is preferable that the embedding member is cured before filling the covering member. This can prevent the resins from being mixed with each other and do not impair the performance of the resins.
The embedding member 17 can be made of, for example, the same material as the covering member 13 described above.

本実施形態の発光装置は、さらにツェナーダイオード等の保護素子が搭載されていてもよい。例えば、保護素子を、被覆部材に埋設することにより、発光素子からの光が保護素子に吸収されたり、保護素子に遮光されたりすることによる光取り出しの低下を防止することができる。 The light emitting device of the present embodiment may further include a protection element such as a Zener diode. For example, by embedding the protection element in the covering member, it is possible to prevent light from being emitted from the light emitting element from being absorbed by the protection element or from being reduced by the protection element from reducing light extraction.

〔発光装置の製造方法〕
上述した発光装置（図１Ａ及び１Ｂ）は、概して、図５Ａ〜５Ｃに示すように、
複数の発光素子１１が配列された基材１６を準備し、
複数の発光素子１１それぞれの上面に複数の透光性部材１２を被覆し、
透光性部材１２の側面に被覆部材１３を被覆し、
隣接する透光性部材間に配置された被覆部材中にワイヤを配置することにより製造することができる。
被覆部材中へのワイヤの配置は、複数の発光素子の側面に被覆部材を被覆し、隣接する発光素子間に配置された被覆部材中にワイヤを配置してもよいし、隣接する発光素子間にワイヤを配置した後、隣接する発光素子の側面に被覆部材を被覆し、被覆部材でワイヤを埋設してもよい。
あるいは、図１Ｅに示す発光装置のように、透光性部材の厚み方向に２本以上積層されるワイヤを有する場合は、図６Ａに示すように、隣接する透光性部材間にワイヤを配置した後、図６Ｂに示すように、隣接する透光性部材の側面に被覆部材を被覆し、被覆部材でワイヤを埋設することが好ましい。 (Method of manufacturing light emitting device)
The light emitting devices described above (FIGS. 1A and 1B) generally include, as shown in FIGS.
Prepare a substrate 16 on which a plurality of light emitting elements 11 are arranged,
A plurality of light-transmitting members 12 are coated on the upper surfaces of the plurality of light-emitting elements 11,
A covering member 13 is covered on a side surface of the translucent member 12,
It can be manufactured by arranging a wire in a covering member arranged between adjacent translucent members.
The arrangement of the wires in the covering member may be such that the side surfaces of the plurality of light emitting elements are covered with the covering member, and the wires are arranged in the covering member arranged between the adjacent light emitting elements, or between the adjacent light emitting elements. After arranging the wires, the covering member may be covered on the side surface of the adjacent light emitting element, and the wire may be embedded with the covering member.
Alternatively, when two or more wires are stacked in the thickness direction of the translucent member as in the light emitting device illustrated in FIG. 1E, the wires are arranged between the adjacent translucent members as illustrated in FIG. 6A. After that, as shown in FIG. 6B, it is preferable to cover the side surface of the adjacent translucent member with the covering member and bury the wire with the covering member.

（基材１６の準備）
まず、図５Ａに示すように、表面に配線パターン１５を有する基材１６を準備し、基材１６の配線パターン１５上に、複数の発光素子１１を配列する。
ここでの複数の発光素子の配列は、図１Ａに示すように、一列に配列してもよいし、図３Ａに示すように、列及び行においてそれぞれ複数の発光素子を配列してもよいし、図４Ｂに示すように、マトリクス状に複数の発光素子を配列してもよい。
発光素子は、例えば、当該分野で公知の接合部材によって配線パターン１５上に電気的に接続するように配列させることができる。 (Preparation of base material 16)
First, as shown in FIG. 5A, a base material 16 having a wiring pattern 15 on its surface is prepared, and a plurality of light emitting elements 11 are arranged on the wiring pattern 15 of the base material 16.
Here, the arrangement of the plurality of light emitting elements may be arranged in a row as shown in FIG. 1A, or the plurality of light emitting elements may be arranged in columns and rows as shown in FIG. 3A. As shown in FIG. 4B, a plurality of light emitting elements may be arranged in a matrix.
The light emitting elements can be arranged so as to be electrically connected to the wiring pattern 15 by a bonding member known in the art, for example.

（透光性部材１２の被覆）
図５Ｂに示すように、発光素子１１のそれぞれの上面に透光性部材１２を接合する。
透光性部材１２は、接着剤１８を用いて接合することができる。 (Coating of translucent member 12)
As shown in FIG. 5B, a light-transmissive member 12 is bonded to each upper surface of the light-emitting element 11.
The translucent member 12 can be joined using an adhesive 18.

（被覆部材１３の被覆）
図５Ｃに示すように、隣接する透光性部材１２間に被覆部材１３を被覆する。この際、隣接する発光素子１１の各側面をも被覆部材１３で被覆することが好ましい。被覆部材１３は、透光性部材１２の光取り出し面と略面一となるような量で充填することが好ましいが、次工程で用いるワイヤの容積を考慮して、若干透光性部材１２の上面よりも低い位置となるように充填することが好ましい。 (Coating of coating member 13)
As shown in FIG. 5C, a covering member 13 is covered between the adjacent translucent members 12. At this time, it is preferable that each side surface of the adjacent light emitting element 11 is also covered with the covering member 13. It is preferable that the covering member 13 is filled in an amount so as to be substantially flush with the light extraction surface of the translucent member 12, but in consideration of the volume of the wire used in the next step, the covering member 13 is slightly filled. It is preferable that the filling is performed at a position lower than the upper surface.

（ワイヤ１４の配置）
その後、被覆部材１３が硬化する前に、平面方向における一端から他端にワイヤ１４を渡し、図１Ａ及び１Ｂに示すように、透光性部材１２間の被覆部材１３内にワイヤ１４を埋設する。
なお、図１Ｅに示すように、ワイヤ１４を透光性部材１２の厚み方向に２本以上積層する場合には、以下のように発光装置を製造してもよい。
まず、図６Ａに示すように、発光素子１１間であって、基材の一端側から他端側にワイヤ１４を渡す。次いで、ワイヤ１４上に、一端側から他端側にワイヤ１４を渡し、ワイヤを積層する。これを数回繰り返す。その後、図６Ｂに示すように、被覆部材１３を配置し、ワイヤ１４を、発光素子間の被覆部材１３内に埋設する。
なお、図７Ａに示すように、発光素子１１間であって、発光素子１１の側面の一部を被覆するように埋設部材１７を配置し、埋設部材１７上において、基材の一端側から他端側にワイヤ１４を渡す。次いで、図７Ｂに示すように、発光素子１１間において、ワイヤ１４上に、一端側から他端側にワイヤ１４を渡し、ワイヤを積層する。その後、図７Ｃに示すように、被覆部材１３を配置し、ワイヤ１４ｂを、発光素子間の被覆部材１３内に埋設することがより好ましい。
さらに、発光素子１１が行列状に基材の上に配置されている場合、まず、図４Ａに示すように、行方向に隣接する複数の透光性部材１２間の全部にそれぞれワイヤ１４ｘを配置し、続いて、図４Ｂに示すように、列方向に隣接する複数の透光性部材１２間の全部にそれぞれワイヤ１４ｙを配置してもよい。また、ワイヤ１４ｘ、１４ｙを行列交互に配置してもよい。この場合、発光素子１１間、透光性部材１２間のみならず、２つの発光素子１１又は２つの透光性部材１２に挟まれない、端部に位置する発光素子１１又は透光性部材１２の外側にもワイヤ１４ｘ、１４ｙを配置する。
ワイヤ１４のボンディング開始点及びボンディング終了点は、基板上に配置されていてもよい。この場合、接合強度の観点から、ワイヤのボンディング開始点及びボンディング終了点は、基板上に配置される配線パターン又は金属層１９上に配置されることが好ましい。また、ワイヤが少なくとも隣接する透光性部材１２間にのみ配置されていれば、ワイヤのボンディング開始点及びボンディング終了点は、除去されていてもよい。 (Arrangement of wire 14)
After that, before the covering member 13 is cured, the wire 14 is passed from one end to the other end in the planar direction, and the wire 14 is embedded in the covering member 13 between the translucent members 12 as shown in FIGS. 1A and 1B. .
When two or more wires 14 are stacked in the thickness direction of the light transmitting member 12 as shown in FIG. 1E, the light emitting device may be manufactured as follows.
First, as shown in FIG. 6A, a wire 14 is passed from one end of the base material to the other end between the light emitting elements 11. Next, the wire 14 is passed over the wire 14 from one end to the other end, and the wires are stacked. This is repeated several times. Thereafter, as shown in FIG. 6B, the covering member 13 is disposed, and the wire 14 is embedded in the covering member 13 between the light emitting elements.
As shown in FIG. 7A, the embedded member 17 is disposed between the light emitting elements 11 so as to cover a part of the side surface of the light emitting element 11. Pass the wire 14 to the end side. Next, as shown in FIG. 7B, between the light emitting elements 11, the wire 14 is passed from one end to the other end on the wire 14, and the wires are stacked. Thereafter, as shown in FIG. 7C, it is more preferable to arrange the covering member 13 and bury the wire 14b in the covering member 13 between the light emitting elements.
Further, when the light emitting elements 11 are arranged on the base material in a matrix, first, as shown in FIG. 4A, the wires 14x are respectively arranged all over the plurality of translucent members 12 adjacent in the row direction. Then, as shown in FIG. 4B, the wires 14y may be arranged respectively between the plurality of translucent members 12 adjacent in the column direction. Further, the wires 14x and 14y may be arranged alternately in rows and columns. In this case, not only between the light emitting elements 11 and between the light transmissive members 12, but also between the two light emitting elements 11 or the two light transmissive members 12, the light emitting element 11 or the light transmissive member 12 located at the end portion. The wires 14x and 14y are also arranged outside the.
The bonding start point and the bonding end point of the wire 14 may be arranged on the substrate. In this case, from the viewpoint of the bonding strength, the bonding start point and the bonding end point of the wire are preferably arranged on the wiring pattern or the metal layer 19 arranged on the substrate. If the wire is arranged at least only between the adjacent light-transmitting members 12, the bonding start point and the bonding end point of the wire may be removed.

本発明の発光装置は、照明用光源、各種インジケーター用光源、車載用光源、ディスプレイ用光源、液晶のバックライト用光源、信号機、車載部品、看板用チャンネルレターなど、種々の光源に使用することができる。 The light emitting device of the present invention can be used for various light sources such as a light source for lighting, a light source for various indicators, a light source for a vehicle, a light source for a display, a light source for a backlight of a liquid crystal, a traffic light, a vehicle component, and a channel letter for a sign. it can.

１０発光装置
１１発光素子
１２、２２透光性部材
２２ａ板状部
２２ｂ凸部
１３被覆部材
１４、１４ａ、１４ｂ、１４ｄ、１４ｘ、１４ｙワイヤ
１５配線パターン
１６、２６、３６基材
１７埋設部材
１８接着剤
１８ａ一部
１９金属層 Reference Signs List 10 light emitting device 11 light emitting element 12, 22 translucent member 22a plate portion 22b convex portion 13 covering member 14, 14a, 14b, 14d, 14x, 14y wire 15 wiring pattern 16, 26, 36 base material 17 embedded member 18 adhesion Agent 18a Part 19 Metal layer

Claims

A plurality of light emitting elements arranged,
A plurality of translucent members covering the upper surface of each of the plurality of light emitting elements,
A covering member for covering a side surface of the translucent member,
A wire disposed in the covering member disposed between the adjacent translucent members.

The light emitting device according to claim 1, wherein the wire is disposed along at least a length of the side along an opposing side of the adjacent light transmitting member.

The light emitting device according to claim 1, wherein two or more wires are stacked in a thickness direction of the light transmitting member.

The translucent members are arranged in a matrix in a plan view, and are arranged between the wires arranged between the translucent members arranged in columns and the translucent members arranged in rows. The light emitting device according to claim 1, wherein the wires are alternately stacked.

The light emitting device according to claim 1, wherein the covering member is formed of a light-reflective resin.

The light emitting device according to any one of claims 1 to 5, wherein the translucent member, the covering member, and the wire are substantially flush on an upper surface side of the light emitting device.

The light emitting device according to claim 1, wherein a distance between the light transmitting members is shorter than a length of one side of the light transmitting member.

The light emitting device according to claim 1, wherein the plurality of light emitting elements are independently driven.