JP2023173244A - Exposure apparatus, exposure method, and method for manufacturing article - Google Patents

Abstract

The present invention provides an advantageous technique for preventing slit light from irradiating the outside of the shot area of a substrate during scanning exposure of the shot area of the substrate. An exposure device that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to slit light is inserted into and removed from a stage that holds and moves the substrate and an optical path of the slit light. a light-shielding member; and a control unit that controls driving of the stage according to a drive profile and controls insertion and removal of the light-shielding member into the optical path of the slit light, and the drive profile is set at the beginning of the scanning exposure. The control unit is configured to accelerate the stage, and the control unit prevents the slit light from irradiating outside the shot area when extracting the light shielding member from the optical path of the slit light at the beginning of the scanning exposure. The light shielding member is accelerated and driven to follow the acceleration of the stage in the drive profile. [Selection diagram] Figure 1

Description

The present invention relates to an exposure apparatus, an exposure method, and an article manufacturing method.

As a lithography apparatus used in the manufacturing process of semiconductor devices, an exposure apparatus is known that performs so-called scanning exposure, in which a pattern of an original is transferred onto a substrate by scanning the substrate with slit light that has passed through the original. . Generally, such exposure equipment performs scanning exposure of the substrate while moving the substrate at a constant speed, but in order to improve throughput (productivity), scanning exposure of the substrate is performed while accelerating or decelerating the substrate. It is desirable to do so. Patent Document 1 proposes a technique in which the substrate is exposed in a section where the speed and acceleration of the substrate are changing in a sine wave while driving the substrate according to a drive profile (velocity profile, acceleration profile) composed of a sine wave. has been done. Such a technique is sometimes called sinusoidal exposure.

Patent No. 5406861

In an exposure apparatus, during scanning exposure of a shot area of a substrate, it is necessary to prevent slit light from being applied to the outside of the shot area. Even when scanning exposure is performed on a shot area of a substrate while accelerating or decelerating the substrate, it is desirable to prevent irradiation of the slit light to the outside of the shot area.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an advantageous technique for preventing slit light from irradiating the outside of the shot area of a substrate during scanning exposure of the shot area of the substrate.

In order to achieve the above object, an exposure apparatus according to one aspect of the present invention is an exposure apparatus that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to slit light, the exposure apparatus holding the substrate. a light shielding member that is inserted into and removed from the optical path of the slit light; and a light shielding member that controls the drive of the stage according to a drive profile that defines the drive of the stage, and that controls the light shielding member that moves to the optical path of the slit light. a controller configured to accelerate the stage at the beginning of the scanning exposure, and a controller configured to accelerate the stage at the beginning of the scanning exposure. When extracting the light shielding member from the shot area, the light shielding member is accelerated and driven to follow the acceleration of the stage in the drive profile so that irradiation of the slit light to the outside of the shot area is prevented. shall be.

Further objects or other aspects of the invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, it is possible to provide an advantageous technique for preventing slit light from irradiating the outside of the shot area of the substrate, for example, during scanning exposure of the shot area of the substrate.

Schematic diagram showing an example of the configuration of an exposure device Schematic diagram showing an example of the configuration of a masking unit Schematic diagram showing the operation of the light shielding blade with respect to the slit light and the movement of the light irradiation area on the shot area of the substrate over time Schematic diagram showing the operation of the light shielding blade with respect to the slit light and the movement of the light irradiation area on the shot area of the substrate over time A diagram showing an example of drive control of the substrate stage and light shielding blade in the first embodiment (Example 1) A diagram showing an example of drive control of the substrate stage and light shielding blade in the first embodiment (Example 2) A diagram showing acceleration profiles of the substrate stage and the light shielding blade in the first embodiment (Example 2) A diagram showing acceleration profiles of a substrate stage and a light shielding blade in the second embodiment Flowchart showing the exposure operation in the exposure device Diagram showing an example of drive control of the substrate stage and light shielding blade when performing constant speed exposure

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the claimed invention. Although a plurality of features are described in the embodiments, not all of these features are essential to the invention, and the plurality of features may be arbitrarily combined. Furthermore, in the accompanying drawings, the same or similar components are designated by the same reference numerals, and redundant description will be omitted.

In this specification and the accompanying drawings, directions are indicated using an XYZ coordinate system in which the XY plane is a direction parallel to the surface (upper surface) of the substrate. Directions parallel to the X, Y, and Z axes in the XYZ coordinate system are defined as the X direction, Y direction, and Z direction, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are Let θX, θY and θZ be. Control and drive (movement) regarding the X-axis, Y-axis, and Z-axis mean control or drive (movement) in a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis, respectively. Furthermore, the control or drive regarding the θX-axis, θY-axis, and θZ-axis includes control or drive regarding rotation around an axis parallel to the X-axis, rotation around an axis parallel to the Y-axis, and rotation around an axis parallel to the Z-axis, respectively. It means driving.

<First embodiment>
A first embodiment according to the present invention will be described. FIG. 1 is a schematic diagram showing a configuration example of an exposure apparatus 100 of this embodiment. The exposure apparatus 100 transfers the pattern of the mask 102 onto the substrate 104 while relatively scanning the mask 102 (original) and the substrate 104 with respect to slit light (exposure light). The exposure apparatus 100 of this embodiment has a light irradiation area (exposure area) on a substrate 104 in the shape of a rectangular or arcuate slit, and scans the mask 102 and the substrate 104 at relatively high speed to increase a large angle of view. This is a step-and-scan exposure device that performs precise exposure. Such an exposure apparatus 100 is also called a scanning exposure apparatus or a scanner.

As shown in FIG. 1, the exposure apparatus 100 includes an exposure light source 113, an illumination optical system 106, a projection optical system 101, a mask stage 103, a substrate stage 105, a masking unit 112 (light shielding section), and a control section. It has 111. Mask stage 103 and substrate stage 105 may constitute a positioning device for positioning mask 102 and substrate 104 with respect to each other. Here, in this embodiment, the exposure light source 113 is provided as a component of the exposure apparatus 100, but it does not need to be a component of the exposure apparatus 100.

The illumination optical system 106 illuminates the mask 102 using light emitted from an exposure light source 113 that generates pulsed light, such as an excimer laser. The illumination optical system 106 includes, for example, a beam shaping optical system, an optical integrator, a collimator lens, a mirror, and the like, and efficiently transmits or reflects pulsed light in the far ultraviolet region and emits it as slit light (exposure light). The beam shaping optical system (generation unit) has a mechanism (for example, a slit) that shapes the cross-sectional shape (dimensions) of the incident light into a predetermined shape (for example, a rectangular shape or an arc shape), and to generate slit light. The slit light has a cross-sectional shape that defines the illumination area on the mask 102, that is, the light irradiation area on the substrate 104. In the case of this embodiment, the beam shaping optical system is configured to use light from the exposure light source 113 to generate slit light having a rectangular cross-sectional shape. Further, the optical integrator uniformizes the light distribution characteristics of the light and illuminates the mask 102 with uniform illuminance.

The slit light emitted from the illumination optical system 106 enters the masking unit 112. The masking unit 112 is a unit for defining the illumination area on the mask 102, that is, the light irradiation area on the substrate 104. In the case of this embodiment, the masking unit 112 has at least two masking blades (light shielding members) arranged in the scanning direction with respect to the slit light. Then, under the control of the control unit 111, the masking unit 112 inserts and removes the light shielding blade into the optical path of the slit light so as to prevent the slit light from irradiating outside the shot area where scanning exposure is being performed. . A specific example of the configuration of the masking unit 112 will be described later. Here, in this embodiment, the masking unit 112 is arranged on the optical path between the illumination optical system 106 and the mask 102, but it is arranged on a plane conjugate with the object plane and the image plane of the projection optical system 101. It would be fine if it had been done. For example, the masking unit 112 may be arranged between the mask 102 and the projection optical system 101, or between the projection optical system 101 and the substrate 104. Further, the masking unit 112 may be provided within the illumination optical system 106 as a component of the illumination optical system 106.

The projection optical system 101 projects an image of the pattern of the mask 102 illuminated by the illumination optical system 106 onto the substrate 104 . In FIG. 1, the optical axis AX of the projection optical system 101 extends in the Z direction, and the image plane of the projection optical system 101 is a plane perpendicular to the Z direction (ie, the XY plane). The slit light that has passed through the masking unit 112 is irradiated onto the mask 102, and an image of the pattern on the mask 102 is projected onto the projection optical system 101 at a magnification of the projection optical system 101 (for example, 1/4, 1/2, 1/5). is formed on the image plane of

The substrate 104 is, for example, a wafer whose surface is coated with a resist (photosensitive agent). A plurality of shot areas having the same pattern structure formed in the previous exposure process are arranged on the substrate 104. The substrate stage 105 is a stage that holds and moves the substrate 104, and has a chuck that holds (adsorbs or fixes) the substrate 104. The substrate stage 105 may also include an XY stage that can move horizontally in each of the X and Y directions, or a Z stage that can move in the Z direction (height direction of the substrate 104) parallel to the optical axis AX of the projection optical system 101. may include. Furthermore, the substrate stage 105 may also include a leveling stage that can rotate (tilt) in the θX direction around the X axis and the θY direction around the Y axis, and a rotation stage that can rotate in the θZ direction around the Z axis. In this way, the substrate stage 105 can constitute a six-axis drive system for aligning the image of the pattern of the mask 102 with the shot area of the substrate 104. The position of the substrate stage 105 in the X direction, Y direction, and Z direction can always be measured by the bar mirror 108 and the interferometer 110 arranged on the substrate stage 105.

Mask 102 is held by mask stage 103. The mask stage 103 is scanned in the Y direction (direction of arrow 103a) within a plane perpendicular to the optical axis AX of the projection optical system 101. At this time, the mask stage 103 is scanned (correction driven) so that the position of the mask stage 103 in the Y direction always maintains the target position. The position of the mask stage 103 in the X direction and the Y direction is constantly measured by a bar mirror 107 and an interferometer 109 arranged on the mask stage 103.

The control unit 111 is configured by a computer including, for example, a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and controls each unit of the exposure apparatus 100 in an integrated manner. The control unit 111 controls a mask stage 103 that holds the mask 102 and a substrate stage 105 that holds the substrate 104 in order to image the light from the pattern of the mask 102 on a predetermined area (shot area) of the substrate 104. . For example, the control unit 111 controls the position of the mask 102 and the substrate 104 in the XY plane (the position in the XY direction and the rotation in the θZ direction) and the position in the Z direction (the θX direction and the each rotation in the θY direction). Further, the control unit 111 synchronizes the mask stage 103 and the substrate stage 105 with respect to the projection optical system 101 and scans them. In this way, the control unit 111 controls an exposure process (scanning exposure) in which each shot area of the substrate 104 is exposed while the substrate stage 105 scans the substrate 104 with respect to the light irradiation area. For example, when the mask stage 103 is scanned in the direction of the arrow 103a, the substrate stage 105 is scanned in the direction of the arrow 105a at a speed corrected by the magnification (reduction magnification) of the projection optical system 101.

The pattern of the mask 102 can be aligned in the XY plane based on the position of the mask stage 103, the position of the substrate stage 105, and the position of each shot area on the substrate 104 with respect to the substrate stage 105. The position of the mask stage 103 and the position of the substrate stage 105 are measured by the interferometer 109 and the interferometer 110, respectively, as described above. The position of each shot area on the substrate 104 with respect to the substrate stage 105 is determined by detecting the position of the mark provided on the substrate stage 105 and the position of the alignment mark formed on the substrate 104 using an alignment scope (not shown). can get.

[Configuration and control of masking unit]
In the exposure apparatus, during scanning exposure of the shot area of the substrate 104, it is necessary to prevent the slit light from being applied to the outside of the shot area. Therefore, the exposure apparatus 100 of this embodiment is provided with a masking unit 112 having a light shielding blade (light shielding member). In the masking unit 112, under the control of the control unit 111, the light shielding blade is scanned (driven) in synchronization with the mask stage 103 and the substrate stage 105 so as to prevent irradiation of the slit light to the outside of the shot area. Ru.

Here, scanning exposure can be defined as a state in which at least a portion of the slit light is irradiated onto the substrate 104 (shot area) and the substrate 104 is exposed. Further, the scanning direction (driving direction during scanning exposure) of the mask 102, the substrate 104, and the light shielding blades of the masking unit 112 are the same direction. However, in the example of FIG. 1, since the optical path is bent by the mirror MR between the masking unit 112 and the mask 102, the scanning direction of the mask 102 and the substrate 104 is the Y direction, and the scanning direction of the light shielding blade of the masking unit 112 is is in the Z direction.

FIG. 2 is a schematic diagram showing a configuration example of the masking unit 112. The masking unit 112 includes two light shielding blades 205 and 206 for shielding the slit light 204 in the scanning direction (Z direction), and a drive that drives the two light shielding blades 205 and 206 in the scanning direction (Z direction). mechanism 200. The drive mechanism 200 may be configured, for example, by a linear motor having a stator 201 extending in the scanning direction and movers 202 and 203 movable in the scanning direction along the stator 201. Note that the masking unit 112 may further include two light shielding blades for shielding the slit light 204 in a direction (X direction) orthogonal to the scanning direction.

The light-shielding blade 205 (second light-shielding member) is mechanically held by the movable element 202, and the light-shielding blade 206 (first light-shielding member) is mechanically held by the movable element 203. The drive mechanism 200 drives the light-shielding blade 205 in the scanning direction by moving the movable element 202 along the stator 201 in the scanning direction, and blocks the light by moving the movable element 203 in the scanning direction along the stator 201. Blade 206 can be driven in the scanning direction. The drive mechanism 200 may be configured to independently drive the light shielding blade 205 (mover 202) and the light shielding blade 206 (mover 203). Further, the drive mechanism 200 is controlled by the control unit 111 to insert and remove the light shielding blades 205 and 206 into and out of the optical path of the slit light in synchronization with the mask stage 103 and the substrate stage 105. .

Next, an example of controlling the masking unit 112 (driving the light shielding blades 205 and 206) during scanning exposure will be described with reference to FIGS. 3A and 3B. 3A and 3B are schematic diagrams showing the operation of the light shielding blades 205 and 206 with respect to the slit light 204 (the illumination area on the mask 102) and the movement of the light irradiation area 302 on the shot area 301 of the substrate 104 over time. It is. In FIGS. 3A and 3B, the left diagram shows the operation of the light shielding blades 205 and 206 during scanning exposure, and the right diagram shows the movement of the light irradiation area 302 on the shot area 301. Further, in FIGS. 3A and 3B, the scanning direction of the light shielding blades 205, 206 and the shot area 301 is indicated by an arrow. As described above, the light-shielding blades 205 and 206 are arranged in synchronization with the mask stage 103 and the substrate stage 105 to prevent irradiation of the slit light to the outside of the shot area of the substrate 104 during scanning exposure of the shot area of the substrate 104. Driven. Note that in this embodiment, acceleration can be defined as increasing the absolute value of speed, and deceleration can be defined as decreasing the absolute value of speed.

Before the start of scanning exposure (exposure operation), as shown in (Phase 1) in FIG. light) is not irradiated. When scanning exposure is started, as shown in (Phase 2) in FIG. 3A, the light shielding blade 205 and the substrate stage 105 are driven in synchronization with the scanning direction, and the light shielding blade 205 is gradually removed from the optical path of the slit light 204. being extracted. A portion of the slit light 204 then gradually begins to pass through the masking unit 112. That is, irradiation of the slit light onto the shot area 301 starts, and the light irradiation area 302 on the shot area 301 gradually expands. At this time, the drive of the light-shielding blade 205 is controlled to follow the movement of the end (front end) of the shot area 301 on the scanning direction side so that the outside of the shot area 301 in the scanning direction is not irradiated with the slit light.

When the light shielding blade 205 is completely extracted from the slit light 204, as shown in (Phase 3) of FIG. 3A, the entire shot area 301 is irradiated with the slit light, and the light irradiation area 302 becomes maximum. At this time, the light shielding blade 205 starts decelerating and stops, and then the light shielding blade 206 starts accelerating. Then, when reaching the end (rear end) of the shot area 301 in the opposite direction to the scanning direction, the shielding blade 206 starts shielding the slit light 204, as shown in (Phase 4) in FIG. 3B.

When the shielding blade 206 starts shielding the slit light 204, as shown in (Phase 5) in FIG. 3B, the shielding blade 206 is gradually inserted into the optical path of the slit light 204, and the slit light 204 is gradually shielded. begins to be That is, the light irradiation area 302 on the shot area 301 gradually narrows. At this time, the driving of the light shielding blade 206 is controlled to follow the movement of the end (rear end) of the shot area 301 in the opposite direction so that the outside of the shot area 301 in the opposite direction is not irradiated with the slit light. Ru. When the slit light 204 is completely blocked by the light shielding blade 206, the light shielding blade 206 starts decelerating and stops, as shown in (Phase 6) of FIG. 3B. Here, in scanning exposure for the next shot area, since the scanning direction is reversed, it is executed in the order of (Phase 6) to (Phase 1). Such scanning exposure can be performed for each of a plurality of shot areas on the substrate 104.

Next, an example of drive control of the light-shielding blades 205 and 206 when scanning and exposing the substrate 104 while moving the substrate 104 at a constant speed (hereinafter sometimes referred to as constant speed exposure) will be explained with reference to FIG. explain. FIG. 9 is a diagram illustrating an example of drive control of the substrate stage 105 and the light shielding blades 205 and 206 when uniform speed exposure is performed for the Nth shot area and the (N+1)th shot area. The Nth shot area is one of the plurality of shot areas (first shot area) on the substrate 104, and may be referred to as "Nshot" below. Further, the (N+1)th shot area is a shot area (second shot area) in which scanning exposure is performed next to Nshot among the plurality of shot areas on the substrate 104, and is hereinafter referred to as "(N+1) shot". There are things to do.

Here, driving of the substrate stage 105 and the light shielding blades 205 and 206 is controlled by the control unit 111. The control unit 111 controls the drive of the substrate stage 105 according to a drive profile that defines the drive of the substrate stage 105, and in parallel, controls the insertion and removal of the light shielding blades 205 and 206 into and out of the optical path of the slit light by the drive mechanism 200. Control. Although the drive profile of the substrate stage 105 includes at least one of a position profile, a velocity profile, and an acceleration profile, an example in which a velocity profile is used as the drive profile will be described below.

The control unit 111 accelerates the substrate stage 105 to the maximum speed Vws before the Nshot scanning exposure starts, and drives the substrate stage 105 at a constant speed to maintain a constant speed after reaching the maximum speed Vws. The exposure section 901 is a section in which a shot area is irradiated with slit light and scanning exposure of the shot area is performed. In the exposure section 901 in the example of FIG. 9, the substrate stage 105 is driven at a constant speed.

On the other hand, the control unit 111 accelerates and drives the light shielding blade 205 so that it reaches the maximum speed Va by the start of the Nshot scanning exposure, that is, by the start of the exposure section 901. The maximum speed Va of the light shielding blade 205 is a value obtained by multiplying the speed Vws of the substrate stage 105 by a certain optical magnification (for example, the magnification of the projection optical system 101).

As described above with reference to FIGS. 3A and 3B, in scanning exposure of a shot area, it is necessary to prevent the slit light from irradiating the outside of the shot area (for example, the adjacent shot area). Therefore, the control unit 111 is configured to follow (synchronize) the constant speed drive of the substrate stage 105 in the enlarged section 902 which is the beginning of the scanning exposure of the shot area (exposure section 901), that is, to follow the movement of the front end of the Nshot. The light shielding blade 205 is driven at a constant speed so as to follow. The enlargement section 902 is a section in which the light shielding blade (205 or 206) is gradually extracted from the optical path of the slit light to widen (enlarge) the light irradiation area on the shot area. When the light shielding blade 205 comes out of the slit light and the enlarged section 902 ends, the control unit 111 decelerates the light shielding blade 205 and stops it.

Subsequently, the control unit 111 accelerates and drives the light shielding blade 206 so that the slit light (light irradiation area) reaches the maximum speed Vb by the time it reaches the rear end of Nshot. Then, the control unit 111 moves the rear end of the Nshot so as to follow (synchronize) the constant speed drive of the substrate stage 105 in a reduction section 903 that is the final stage of the scanning exposure of the shot area (exposure section 901). The light shielding blade 206 is driven at a constant speed so as to follow. The reduction section 903 is a section in which a light shielding blade (205 or 206) is gradually inserted into the optical path of the slit light to narrow (reduce) the light irradiation area on the shot area. When the light shielding blade 206 completely shields the slit light and the reduction section 903 ends, the control unit 111 decelerates and drives the light shielding blade 206 to stop. In this way, Nshot scanning exposure is performed.

After the scanning exposure of N shots is completed, the scanning exposure of (N+1) shots is started. After finishing the Nshot scanning exposure (exposure period 901), the control unit 111 decelerates the substrate stage 105 and starts accelerating it in the opposite direction. Then, the control unit 111 accelerates the substrate stage 105 to the maximum speed -Vws until the scanning exposure of (N+1) shots is started, and when the maximum speed reaches -Vws, the substrate stage 105 is driven to maintain a constant speed. Drive at constant speed.

On the other hand, the control unit 111 accelerates and drives the light shielding blade 206 so that it reaches the maximum speed -Va by the start of the scanning exposure of (N+1) shots, that is, by the start of the exposure section 901. Then, in the enlarged section 902, the light shielding blade 206 is driven at a constant speed so as to follow (synchronize) with the constant speed driving of the substrate stage 105, that is, to follow the movement of the front end of the (N+1) shot. When the enlarged section 902 ends, the light shielding blade 206 is decelerated and stopped. Subsequently, the control unit 111 accelerates and drives the light shielding blade 205 so that the slit light (light irradiation area) reaches the maximum speed -Vb by the time it reaches the rear end of (N+1) shots. Then, in the reduction section 903, the light shielding blade 205 is driven at a constant speed so as to follow (synchronize) with the constant speed driving of the substrate stage 105, that is, to follow the movement of the rear end of the (N+1) shot. When the reduction section 903 ends, the light shielding blade 205 is decelerated and stopped. In this way, scanning exposure for (N+1) shots is performed. By repeating the driving of the substrate stage 105 and the light-shielding blades 205 and 206 as described above, scanning exposure of a plurality of shot areas on the substrate 104 is performed, respectively.

By the way, in order to improve throughput (productivity) in the exposure apparatus 100, a method has been proposed in which scanning exposure of the substrate 104 is performed while accelerating or decelerating the substrate 104. For example, a scanning exposure method called sine wave exposure is known. In the sine wave exposure, while driving the substrate stage 105 according to a sine wave drive profile (for example, a speed profile), scanning exposure of each shot area is performed in a part of the drive profile that includes acceleration and deceleration of the substrate stage 105. will be held. That is, in the sine wave exposure, in the exposure period in which scanning exposure of each shot area is performed, the substrate stage 105 is accelerated in the enlargement period and decelerated in the reduction period. Even when performing scanning exposure of a shot area by applying sine wave exposure, it is necessary to prevent irradiation of the slit light to the outside of the shot area.

Therefore, in the exposure apparatus 100 of the present embodiment, when extracting the light shielding blade from the optical path of the slit light at the beginning of scanning exposure of the shot area (enlargement section), the light shielding blade is accelerated and driven to follow the acceleration of the substrate stage 105. Further, when inserting the light shielding blade into the optical path of the slit light in the final stage (reduction section) of scanning exposure of the shot area, the light shielding blade is driven to decelerate to follow the deceleration of the substrate stage 105. Hereinafter, an example of drive control of the substrate stage 105 and the light shielding blades 205 and 206 in sine wave exposure will be described.

[Example 1]
FIG. 4 is a diagram showing an example of drive control of the substrate stage 105 and the light-shielding blades 205 and 206 when performing Nshot and (N+1)shot scanning exposures in sine wave exposure. The exposure section 401, enlargement section 402, and reduction section 403 in FIG. 4 correspond to the exposure section 901, enlargement section 902, and reduction section 903 described above using FIG. 9, respectively. Here, the control unit 111 creates a drive profile (for example, a speed profile) for driving the light shielding blades 205 and 206 in accordance with (synchronizing with) the drive of the substrate stage 105 based on the sinusoidal drive profile of the substrate stage 105. Generate in advance. The drive profile is indicated by a broken line in FIG. 4, and may be referred to as a blade drive profile below.

The control unit 111 drives the substrate stage 105 according to a sinusoidal drive profile (velocity profile). Thereby, the time required for scanning exposure of each shot area (exposure time) can be shortened, and throughput can be improved. Note that the exposure section 401 is a section in which scanning exposure of a shot area is performed.

On the other hand, the control unit 111 accelerates and drives the light shielding blade 205 so that the speed of the blade drive profile is reached by the start of the Nshot scanning exposure, that is, by the start of the exposure section 401. At this time, using a drive profile calculated using a formula different from the blade drive profile, the light shielding blade 205 is accelerated and driven at an acceleration greater than the following acceleration (broken line) when making it follow the acceleration of the substrate stage 105. Then, in the enlarged section 402, the blade drive profile is switched to, and the light shielding blade 205 is accelerated and driven according to the blade drive profile so as to follow (synchronize) the acceleration of the substrate stage 105, that is, to follow the movement of the front end of Nshot. do. When the expansion section 402 ends, the blade drive profile is switched to a drive profile calculated using a formula different from the blade drive profile, and the light shielding blade 205 is moved at a deceleration greater than the follow-up deceleration (broken line) when making it follow the deceleration of the substrate stage 105. Decelerate drive and stop. At this time, it is preferable to stop the light shielding blade 205 before the Nshot scanning exposure (exposure section 401) ends.

Subsequently, the control unit 111 accelerates and drives the light shielding blade 206 so that the speed of the blade drive profile is reached by the time the slit light hits the rear end of Nshot. At this time, using a drive profile calculated using a formula different from the blade drive profile, the light shielding blade 206 is accelerated and driven at an acceleration greater than the following acceleration (broken line) when making it follow the acceleration of the substrate stage 105. Then, in the reduction section 403, the blade drive profile is switched to, and the light shielding blade 206 is decelerated according to the blade drive profile so as to follow (synchronize) the deceleration of the substrate stage 105, that is, to follow the movement of the rear end of the Nshot. drive When the reduction section 403 ends, the blade drive profile is switched to a drive profile calculated using a formula different from the blade drive profile, and the light shielding blade 206 is moved at a deceleration greater than the follow-up deceleration (broken line) when making it follow the deceleration of the substrate stage 105. Decelerate drive and stop. At this time, it is preferable to stop the light shielding blade 206 before the scanning exposure of (N+1) shots (exposure section 401) starts. In this way, Nshot scanning exposure is performed.

After the scanning exposure of N shots is completed, the scanning exposure of (N+1) shots is started. The control unit 111 accelerates and drives the light-shielding blade 206 so that the speed of the blade drive profile is reached by the start of scanning exposure of (N+1) shots, that is, by the start of the exposure section 401. At this time, using a drive profile calculated using a formula different from the blade drive profile, the light shielding blade 206 is accelerated and driven at an acceleration greater than the following acceleration (broken line) when making it follow the acceleration of the substrate stage 105. Then, in the enlarged section 402, the blade drive profile is switched to, and the light shielding blade is set according to the blade drive profile so as to follow (synchronize) the acceleration drive of the substrate stage 105, that is, to follow the movement of the front end of the (N+1) shot. 206 is accelerated and driven. When the expansion section 402 ends, the blade drive profile is switched to a drive profile calculated using a formula different from the blade drive profile, and the light shielding blade 206 is moved at a deceleration larger than the follow-up deceleration (broken line) when making it follow the deceleration of the substrate stage 105. Decelerate drive and stop. At this time, it is preferable to stop the light shielding blade 206 before the scanning exposure of (N+1) shots (exposure section 401) is completed.

Subsequently, the control unit 111 accelerates and drives the light shielding blade 205 so that the speed of the blade drive profile is reached by the time the slit light reaches the rear end of (N+1) shots. At this time, using a drive profile calculated using a formula different from the blade drive profile, the light shielding blade 205 is accelerated and driven at an acceleration greater than the following acceleration (broken line) when making it follow the acceleration of the substrate stage 105. Then, in the reduction section 403, the blade drive profile is switched to, and the light is blocked according to the blade drive profile so as to follow (synchronize) the deceleration drive of the substrate stage 105, that is, to follow the movement of the rear end of the (N+1) shot. The blade 205 is driven to decelerate. When the reduction section 403 ends, the blade drive profile is switched to a drive profile calculated using a formula different from the blade drive profile, and the light shielding blade 205 is moved at a deceleration greater than the follow-up deceleration (broken line) when making it follow the deceleration of the substrate stage 105. Decelerate drive and stop. At this time, it is preferable to stop the light shielding blade 205 before the next scanning exposure starts. In this way, scanning exposure for (N+1) shots is performed.

Here, in the example of FIG. 4, focusing on the light shielding blade 206, for example, control is performed so that the stop period ts of the light shielding blade 206 occurs between the scanning exposure of N shots and the scanning exposure of (N+1) shots. Then, the driving of the light shielding blade 206 is controlled so that the stop period ts of the light shield blade 206 is longer than the stop period of the substrate stage 105. In addition, between the scanning exposure of N shots and the scanning exposure of (N+1) shots, the light shielding blade 206 is decelerated and stopped at a deceleration that is larger than the follow-up deceleration (broken line) when making it follow the deceleration of the substrate stage 105. I'm letting you do it. Further, after that, the light shielding blade 206 is accelerated at an acceleration greater than the following acceleration (broken line) when making it follow the acceleration of the substrate stage 105. By controlling the drive of the light shielding blade 206 in this manner, the driving stroke of the light shielding blade 206 can be shortened, which may be advantageous in terms of reducing the cost of the exposure apparatus 100 and avoiding enlargement. Note that the same driving control as that for the light shielding blade 206 can be performed on the light shielding blade 205 as well.

[Example 2]
In the above-described first embodiment, an example has been described in which the light-shielding blades 205 and 206 are stopped between scanning exposures between shot areas (that is, between scanning exposures of N shots and scanning exposures of (N+1) shots). In the second embodiment, an example will be described with reference to FIG. 5 in which one of the light shielding blades 205 and 206 is driven to follow (synchronize) with the driving of the substrate stage 105 during scanning exposure between shot areas. FIG. 5 is a diagram showing an example of drive control of the substrate stage 105 and the light-shielding blades 205 and 206 when performing Nshot and (N+1)shot scanning exposures in sine wave exposure. Note that this second embodiment basically inherits the first embodiment, and can follow the first embodiment except for the matters mentioned below.

In the second embodiment, the light-shielding blade 206 follows (synchronizes) the drive of the substrate stage 105 according to the blade drive profile from the end of Nshot scanning exposure to the start of (N+1)shot scanning exposure. drive. That is, the control unit 111 causes the light shielding blade 206 to follow the drive of the substrate stage 105 according to the blade drive profile from the start of the Nshot reduction section 403 to the end of the (N+1)shot enlargement section 402 (section 502). (synchronized) and driven. Then, when the enlarged section 402 of (N+1) shots ends, the blade drive profile is switched to a drive profile calculated using a different calculation formula. Then, the light shielding blade 206 is decelerated and driven at a deceleration that is larger than the follow-up deceleration (broken line) when making it follow the deceleration of the substrate stage 105, and is brought to a stop.

Similarly, for the light-shielding blade 205, the light-shielding blade 205 is driven by the substrate stage 105 according to the blade drive profile from the end of the scanning exposure of (N+1) shots to the start of the scanning exposure of (N+2) shots. Drive by following. That is, the control unit 111 causes the light shielding blade 205 to follow the drive of the substrate stage 105 according to the blade drive profile from the start of the reduction section 403 at the (N+1) shot to the end of the expansion section 402 at the (N+2) shot. synchronized) and driven. Then, when the expanded section 402 of (N+2) shots ends, the blade drive profile is switched to a drive profile calculated using a formula different from that of the blade drive profile. Then, the light shielding blade 205 is decelerated and driven to a stop at a deceleration that is larger than the follow-up deceleration (broken line) when making it follow the deceleration of the substrate stage 105.

Note that (N+2) shot is a shot area in which scanning exposure is performed next to (N+1) shot. Although drive control for scanning exposure (exposure period 401) for (N+2) shots is not illustrated in FIG. 5, it can be understood as drive control similar to scanning exposure (exposure period 401) for Nshots. In this case, the section from the start of the reduced section 403 at (N+1) shot to the end of the enlarged section 402 at (N+2) shot can be understood as the section that combines section 503 and section 501 in FIG. good.

When switching the drive profile of the light shielding blades 205, 206, the speed and acceleration/deceleration of the light shielding blades 205, 206 change sharply, so vibrations are likely to occur in the light shielding blades 205, 206. According to the second embodiment, focusing on the light shielding blade 206, for example, between the Nshot scanning exposure and the (N+1) shot scanning exposure, the driving of the light shielding blade 206 follows a sinusoidal drive profile on the substrate stage. It is controlled to follow the drive of 105. This makes it possible to reduce vibrations that occur when switching drive profiles.

FIG. 6 is a diagram showing acceleration profiles of the substrate stage 105 and the light shielding blades 205 and 206. In the enlarged section 402, the light shielding blade 205 is driven at an acceleration Aa obtained by multiplying the acceleration Aws of the substrate stage by an optical magnification (for example, the magnification of the projection optical system 101) so as to follow (synchronize) the driving of the substrate stage 105. It can be done. In order to minimize the drive stroke and drive time, after the expansion section 402 ends, it is preferable that the drive mechanism 200 is decelerated at the maximum acceleration Aa_max that can be output from the hardware. On the other hand, in order to cause the light shielding blade 206 to follow (synchronize) with the substrate stage 105 in the reduction section 403, the light shielding blade 206 starts driving after a certain period of time has elapsed after the light shielding blade 205 starts driving. Since the light shielding blade 206 starts driving after a certain period of time has elapsed, the light shielding blade 206 is optically adjusted to the speed of the substrate stage 105 in order to follow (synchronize) the driving of the substrate stage 105 before the slit light reaches the rear end of the shot area. It is necessary to reach the speed that is multiplied by the multiplier. Therefore, the light shielding blade 206 is accelerated to reach the speed of the substrate stage 105 using the maximum acceleration Ab_max that can be outputted by the hardware of the drive mechanism 200. After the speed of the light shielding blade 206 reaches the speed of the substrate stage 105, driving is performed at an acceleration Ab obtained by multiplying the acceleration Aws of the substrate stage 105 by an optical magnification. After the reduction section 403 ends, it continues to follow (synchronize) with the substrate stage 105 and is driven to follow (synchronize) with the substrate stage 105 until it ends the (N+1) Shot enlargement section 402.

As described above, the exposure apparatus 100 of the present embodiment accelerates the light shielding blade to follow the acceleration of the substrate stage 105 when extracting the light shielding blade from the optical path of the slit light at the beginning (enlargement section) of scanning exposure of the shot area. drive Further, when inserting the light shielding blade into the optical path of the slit light at the final stage (reduction section) of scanning exposure of the shot area, the light shielding blade is driven to decelerate to follow the deceleration of the substrate stage. As a result, when performing scanning exposure of a shot area of the substrate 104 while accelerating or decelerating the substrate 104 (for example, sine wave exposure), the light shielding blades 205 and 206 are appropriately driven and the slit light is directed to the outside of the shot area. irradiation can be prevented.

<Second embodiment>
A second embodiment according to the present invention will be described. In the first embodiment, an example has been described in which switching of the drive profile of the light shielding blades 205 and 206 is performed (determined) according to the start and/or end of the enlargement section 402 and the reduction section 403. In the second embodiment, an example will be described in which switching of the drive profile of the light shielding blades 205, 206 is performed (determined) according to the position, speed, or acceleration of the light shielding blades 205, 206. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below.

FIG. 7 is a diagram showing acceleration profiles of the substrate stage 105 and the light shielding blades 205 and 206. In the first embodiment described above, the drive profiles of the light shielding blades 205 and 206 are switched at the start and/or end of the enlargement section 402 and the reduction section 403. On the other hand, in this embodiment, as shown in FIG. 7, the drive profiles of the light shielding blades 205 and 206 are switched at the timing when the acceleration of the light shielding blades 205 and 206 becomes zero.

As described above, when switching the drive profile of the light shielding blades 205, 206, the speed and acceleration of the light shielding blades 205, 206 change sharply, so vibrations are likely to occur in the light shielding blades 205, 206. In particular, if the drive profile is changed while a constant acceleration is applied, the change in the force applied to the light shielding blades 205 and 206 will increase accordingly. Therefore, if the drive profile is switched at a timing when acceleration is large, there is a possibility that large vibrations will occur in the light shielding blades 205 and 206 accordingly. Furthermore, if large vibrations occur in the light shielding blades 205 and 206 in the enlargement section 402 or the reduction section 403, it becomes difficult to accurately shield light at the edges of the shot area, and the outside of the shot area (for example, the adjacent shot area) is exposed. There is a concern that this may lead to defects.

By switching the drive profile at the timing when the acceleration of the light shielding blades 205, 206 becomes zero as in this embodiment, it is possible to minimize the change in the force applied to the light shielding blades 205, 206 when switching the drive profile. . In other words, vibrations of the light shielding blades 205 and 206 can be reduced. However, even after the exposure section 401 (reduction section 403) ends, the light shielding blades 205 and 206 continue to be driven (sine wave drive) following (synchronized with) the substrate stage 105, so compared to the first embodiment, the light shielding blades The drive strokes of 205 and 206 become larger. Therefore, even if the acceleration of the light-shielding blades 205 and 206 is not necessarily zero, the value of the acceleration at which the drive profile is switched may be arbitrarily determined so that vibration is minimized within a desired drive stroke range. Similarly, the timing of switching the drive profile may be determined using an arbitrary position or speed.

<Third embodiment>
A third embodiment according to the present invention will be described. In this embodiment, an exposure operation in the exposure apparatus 100 described in the first embodiment will be described. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below. Further, this embodiment may inherit the second embodiment.

FIG. 8 is a flowchart showing the exposure operation in the exposure apparatus 100. Each step in the flowchart of FIG. 8 can be executed by the control unit 111.

In step S801, the control unit 111 transports the substrate 104 onto the substrate stage 105 using a substrate transport mechanism (not shown). Next, in step S802, the control unit 111 aligns the substrate 104 by detecting the position of the mark on the substrate 104 using an alignment scope (detection unit) not shown. In this step S802, global alignment is executed to detect the positions of marks in some sample shot areas among the plurality of shot areas on the substrate 104, and to statistically process the detection results to obtain arrangement information of the plurality of shot areas. It can be done.

In step S803, the control unit 111 generates (determines and calculates) a drive profile for the substrate stage 105 and a blade drive profile for the light shielding blades 205 and 206. Generation of each drive profile can be performed based on the alignment result (for example, arrangement information) of the substrate 104 in step S802. Next, in step 804, the control unit 111 determines the timing for switching the drive profiles of the light shielding blades 205 and 206. The determination of the switching timing can be performed as described in the first and second embodiments.

In step S805, the control unit 111 performs scanning exposure of the substrate 104. The control unit 111 drives the substrate stage 105 and the light shielding blades 205 and 206 based on the drive profile determined in step S803 and the switching timing determined in step S804. Thereby, scanning exposure can be performed for each of the plurality of shot areas on the substrate 104. Next, in step S806, the control unit 111 collects (carries out) the substrate 104 from the substrate stage 105 using a substrate transport mechanism (not shown).

<Embodiment of article manufacturing method>
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as micro devices such as semiconductor devices and elements having fine structures. The method for manufacturing an article of the present embodiment includes a step of forming a latent image pattern on a photosensitive agent coated on a substrate using the above-mentioned exposure device (a step of exposing the substrate), and a step of forming a latent image pattern on a photosensitive agent coated on a substrate (a step of exposing the substrate). It includes a process of processing (developing) and a process of manufacturing an article from the processed substrate. Additionally, such manufacturing methods include other well-known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

<Other Examples>
The present invention provides a system or device with a program that implements one or more functions of the embodiments described above via a network or a storage medium, and one or more processors in a computer of the system or device reads and executes the program. This can also be achieved by processing. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

<Summary of embodiments>
The disclosure of this specification includes the following exposure apparatus, exposure method, and article manufacturing method.

(Item 1)
An exposure apparatus that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to slit light,
a stage that holds and moves the substrate;
a light shielding member inserted into and removed from the optical path of the slit light;
a control unit that controls the drive of the stage according to a drive profile that defines the drive of the stage, and controls insertion and removal of the light shielding member into the optical path of the slit light;
Equipped with
The drive profile is configured to accelerate the stage at the beginning of the scanning exposure,
The control unit controls the stage in the drive profile so that when the light shielding member is extracted from the optical path of the slit light at the beginning of the scanning exposure, the slit light is prevented from irradiating outside the shot area. An exposure apparatus characterized in that the light shielding member is accelerated and driven to follow the acceleration.

(Item 2)
The drive profile is configured to decelerate the stage at the end of the scanning exposure,
The control unit controls the stage in the drive profile so that when inserting the light shielding member into the optical path of the slit light at the end of the scanning exposure, the slit light is prevented from being irradiated outside the shot area. 2. The exposure apparatus according to item 1, wherein the light shielding member is driven to decelerate in accordance with the deceleration of the light shielding member.

(Item 3)
The substrate includes a first shot area where the scanning exposure is performed, and a second shot area where the scanning exposure is performed next to the first shot area,
The control unit inserts the light shielding member into the optical path of the slit light at the end of the scanning exposure for the first shot area, and inserts the light shielding member into the optical path of the slit light at the beginning of the scanning exposure for the second shot area. The exposure apparatus according to item 2, characterized in that driving of the light shielding member is controlled so as to extract the member.

(Item 4)
The control unit controls the light shielding member so that a stop period of the light shield member is longer than a stop period of the stage between the scanning exposure for the first shot area and the scanning exposure for the second shot area. 3. The exposure apparatus according to item 3, wherein the exposure apparatus controls driving of the exposure apparatus.

(Item 5)
The control unit controls the light shielding member at a deceleration greater than a follow-up deceleration when making it follow the deceleration of the stage between the scan exposure for the first shot area and the scan exposure for the second shot area. The exposure apparatus according to item 3 or 4, characterized in that after the light shielding member is stopped by decelerating the light shielding member, the light shielding member is accelerated with an acceleration greater than a tracking acceleration when making the light shielding member follow the acceleration of the stage.

(Item 6)
The control unit is configured to control the light shielding member so that the driving of the light shielding member follows the driving of the stage in the driving profile between the scanning exposure for the first shot area and the scanning exposure for the second shot area. The exposure apparatus according to item 3, wherein the exposure apparatus controls driving of the light shielding member.

(Item 7)
If the light shielding member is stopped at the start of the scanning exposure for the first shot area, the control unit may drive the light shielding member to decelerate to follow the deceleration of the stage at the end of the scanning exposure. 7. The exposure apparatus according to any one of items 3 to 6, wherein the exposure apparatus controls driving of the light shielding member so that the light shielding member can be driven.

(Item 8)
The control unit is characterized in that when the light shielding member is extracted from the optical path of the slit light at the beginning of the scanning exposure for the second shot area, the control unit stops the light shielding member before the scanning exposure ends. The exposure apparatus according to any one of items 3 to 7.

(Item 9)
further comprising a second light shielding member inserted into and removed from the optical path of the slit light,
The control unit extracts the second light shielding member from the optical path of the slit light at the beginning of the scanning exposure for the first shot area, and extracts the second light shielding member from the optical path of the slit light at the end of the scanning exposure for the second shot area. 9. The exposure apparatus according to any one of items 3 to 8, wherein the exposure apparatus controls driving of the second light shielding member so as to insert the second light shielding member.

(Item 10)
An exposure apparatus that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to slit light,
a stage that holds and moves the substrate;
a light shielding member inserted into and removed from the optical path of the slit light;
a control unit that controls the drive of the stage according to a drive profile that defines the drive of the stage, and controls insertion and removal of the light shielding member into the optical path of the slit light;
Equipped with
The drive profile is configured to decelerate the stage at the end of the scanning exposure,
The control unit controls the stage in the drive profile so that when inserting the light shielding member into the optical path of the slit light at the end of the scanning exposure, the slit light is prevented from being irradiated outside the shot area. An exposure apparatus characterized in that the light shielding member is driven to decelerate in accordance with the deceleration of the light shielding member.

(Item 11)
11. The exposure apparatus according to any one of items 1 to 10, wherein at least a section of the drive profile during the scanning exposure is configured as a sinusoidal profile.

(Item 12)
The exposure apparatus according to any one of items 1 to 11, further comprising a generation unit that generates the slit light using light from a light source.

(Item 13)
An exposure method that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to slit light, the method comprising:
a driving step of driving the stage according to a driving profile that defines driving of the stage that holds the substrate;
In parallel with the driving step, a control step of controlling insertion and removal of a light shielding member into the optical path of the slit light;
including;
The drive profile is configured to accelerate the stage at the beginning of the scanning exposure,
In the control step, the stage is adjusted in the drive profile so that when the light shielding member is extracted from the optical path of the slit light at the beginning of the scanning exposure, the slit light is prevented from irradiating outside the shot area. An exposure method characterized in that the light shielding member is accelerated and driven to follow the acceleration.

(Item 14)
an exposure step of exposing the substrate using the exposure method described in item 13;
a processing step of processing the substrate exposed in the exposure step;
a manufacturing step of manufacturing an article from the substrate processed in the processing step;
A method for manufacturing an article characterized by comprising:

The invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the following claims are hereby appended to disclose the scope of the invention.

100: Exposure device, 101: Projection optical system, 102: Mask (original plate), 103: Mask stage, 104: Substrate, 105: Substrate stage, 106: Illumination optical system, 112: Masking unit, 200: Drive mechanism, 205, 206: Shading blade

Claims (14)

An exposure apparatus that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to slit light,
a stage that holds and moves the substrate;
a light shielding member inserted into and removed from the optical path of the slit light;
a control unit that controls the drive of the stage according to a drive profile that defines the drive of the stage, and controls insertion and removal of the light shielding member into the optical path of the slit light;
Equipped with
The drive profile is configured to accelerate the stage at the beginning of the scanning exposure,
The control unit controls the stage in the drive profile so that when the light shielding member is extracted from the optical path of the slit light at the beginning of the scanning exposure, the slit light is prevented from irradiating outside the shot area. An exposure apparatus characterized in that the light shielding member is accelerated and driven to follow the acceleration. The drive profile is configured to decelerate the stage at the end of the scanning exposure,
The control unit controls the stage in the drive profile so that when inserting the light shielding member into the optical path of the slit light at the end of the scanning exposure, the slit light is prevented from being irradiated outside the shot area. 2. The exposure apparatus according to claim 1, wherein the light shielding member is driven to decelerate in accordance with the deceleration of the light shielding member. The substrate includes a first shot area where the scanning exposure is performed, and a second shot area where the scanning exposure is performed next to the first shot area,
The control unit inserts the light shielding member into the optical path of the slit light at the end of the scanning exposure for the first shot area, and inserts the light shielding member into the optical path of the slit light at the beginning of the scanning exposure for the second shot area. 3. The exposure apparatus according to claim 2, wherein driving of the light shielding member is controlled so as to extract the member. The control unit controls the light shielding member so that a stop period of the light shield member is longer than a stop period of the stage between the scanning exposure for the first shot area and the scanning exposure for the second shot area. 4. The exposure apparatus according to claim 3, further comprising: controlling the driving of the exposure apparatus. The control unit controls the light shielding member at a deceleration greater than a follow-up deceleration when making it follow the deceleration of the stage between the scan exposure for the first shot area and the scan exposure for the second shot area. 4. The exposure apparatus according to claim 3, wherein after the light shielding member is stopped by decelerating the light shielding member, the light shielding member is accelerated at an acceleration greater than a tracking acceleration when making the light shielding member follow the acceleration of the stage. The control unit is configured to control the light shielding member so that the driving of the light shielding member follows the driving of the stage in the driving profile between the scanning exposure for the first shot area and the scanning exposure for the second shot area. 4. The exposure apparatus according to claim 3, wherein the exposure apparatus controls driving of the light shielding member. If the light shielding member is stopped at the start of the scanning exposure for the first shot area, the control unit may drive the light shielding member to decelerate to follow the deceleration of the stage at the end of the scanning exposure. 4. The exposure apparatus according to claim 3, wherein driving of the light shielding member is controlled so that the light shielding member can be driven. The control unit is characterized in that when the light shielding member is extracted from the optical path of the slit light at the beginning of the scanning exposure for the second shot area, the control unit stops the light shielding member before the scanning exposure ends. The exposure apparatus according to claim 3. further comprising a second light shielding member inserted into and removed from the optical path of the slit light,
The control unit extracts the second light shielding member from the optical path of the slit light at the beginning of the scanning exposure for the first shot area, and extracts the second light shielding member from the optical path of the slit light at the end of the scanning exposure for the second shot area. 4. The exposure apparatus according to claim 3, wherein driving of the second light shielding member is controlled so that the second light shielding member is inserted. An exposure apparatus that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to slit light,
a stage that holds and moves the substrate;
a light shielding member inserted into and removed from the optical path of the slit light;
a control unit that controls the drive of the stage according to a drive profile that defines the drive of the stage, and controls insertion and removal of the light shielding member into the optical path of the slit light;
Equipped with
The drive profile is configured to decelerate the stage at the end of the scanning exposure,
The control unit controls the stage in the drive profile so that when inserting the light shielding member into the optical path of the slit light at the end of the scanning exposure, the slit light is prevented from being irradiated outside the shot area. An exposure apparatus characterized in that the light shielding member is driven to decelerate in accordance with the deceleration of the light shielding member. 11. The exposure apparatus according to claim 1, wherein at least a section of the drive profile during the scanning exposure is configured as a sinusoidal profile. The exposure apparatus according to any one of claims 1 to 10, further comprising a generation unit that generates the slit light using light from a light source. An exposure method that performs scanning exposure of a shot area of the substrate while scanning the substrate with respect to slit light, the method comprising:
a driving step of driving the stage according to a driving profile that defines driving of the stage that holds the substrate;
In parallel with the driving step, a control step of controlling insertion and removal of a light shielding member into the optical path of the slit light;
including;
The drive profile is configured to accelerate the stage at the beginning of the scanning exposure,
In the control step, the stage is adjusted in the drive profile so that when the light shielding member is extracted from the optical path of the slit light at the beginning of the scanning exposure, the slit light is prevented from irradiating outside the shot area. An exposure method characterized in that the light shielding member is accelerated and driven to follow the acceleration. an exposure step of exposing the substrate using the exposure method according to claim 13;
a processing step of processing the substrate exposed in the exposure step;
a manufacturing step of manufacturing an article from the substrate processed in the processing step;
A method for manufacturing an article characterized by comprising: