JP2024111618A - Electronics - Google Patents

Abstract

To realize an electronic apparatus capable of accommodating an arrangement of one imaging device using one board.SOLUTION: An electronic apparatus comprises: a second housing including a first housing plane and a second housing plane that are disposed and spaced apart in a first direction; and a board configured such that an imaging device can be mounted. The board is located midway in a first direction Z inside the second housing and extends along an imaginary plane intersecting the first direction Z. The second housing includes a first arrangement part and a second arrangement part. The first arrangement part is configured such that the board can be disposed in a first state in which the mounted imaging device can be exposed from the first housing plane. The second arrangement part is configured such that the board can be disposed in a second state in which the mounted imaging device can be exposed from the second housing plane.SELECTED DRAWING: Figure 8

Description

This disclosure relates to electronic devices.

Patent document 1 discloses an electronic device in which a front camera and a rear camera are housed inside the upper housing.

WO2017-022554

The electronic device in Patent Document 1 has room for improvement in terms of changing the camera placement to meet the user's needs.

The present disclosure aims to provide an electronic device that can accommodate the arrangement of two imaging devices on a single board.

An electronic device according to an embodiment of the present disclosure includes:
a housing including a first housing surface and a second housing surface spaced apart in a first direction;
a substrate configured to be able to mount an imaging device, positioned at a middle point in the first direction inside the housing, and extending along a virtual plane intersecting the first direction;
The housing,
a first arrangement section capable of arranging the board in a first state in which the mounted imaging device can be exposed from the first housing surface;
The imaging device includes a second arrangement portion capable of arranging the board in a second state in which the mounted imaging device can be exposed from the second housing surface.

This disclosure makes it possible to realize an electronic device that can accommodate the arrangement of two imaging devices on a single board.

FIG. 1 is a perspective view showing an electronic device according to an embodiment of the present disclosure including a substrate in a first state. FIG. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 2 is a cross-sectional view taken along line III-III in FIG. FIG. 1 is a perspective view showing an electronic device according to an embodiment of the present disclosure having a substrate in a second state. FIG. 5 is a cross-sectional view taken along line V-V in FIG. 4 . FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. FIG. 2 is a perspective view showing a substrate of the electronic device of FIG. 1 . FIG. 8 is a schematic cross-sectional view taken along line VIII-VIII in FIG.

For example, when changing the position of the cameras from being exposed from the front of the housing to being exposed from the back of the housing, it may not be possible to accommodate the placement of two cameras on one board due to placement constraints imposed by the thickness of the housing, the placement of other components inside the housing, etc. In this case, there is a possibility that disadvantages will arise, such as having to start up different boards depending on the camera placement.

The inventors discovered an electronic device configuration that can accommodate the placement of two imaging devices on a single board, leading to the following invention.

The electronic device according to the first aspect of the present disclosure includes:
a housing including a first housing surface and a second housing surface spaced apart in a first direction;
a substrate configured to be able to mount an imaging device, positioned at a middle point in the first direction inside the housing, and extending along a virtual plane intersecting the first direction;
The housing,
a first arrangement section capable of arranging the board in a first state in which the mounted imaging device can be exposed from the first housing surface;
The imaging device includes a second arrangement portion capable of arranging the board in a second state in which the mounted imaging device can be exposed from the second housing surface.

An electronic device according to a second aspect of the present disclosure is the electronic device according to the first aspect,
The imaging device mounted on the board in the first state and the imaging device mounted on the board in the second state are positioned symmetrically with respect to the imaginary plane.

An electronic device according to a third aspect of the present disclosure is the electronic device according to the first or second aspect,
The housing,
a first mounting portion, a second mounting portion, and a third mounting portion that are spaced apart from one another along a second direction that intersects the first direction;
the second mounting portion and the third mounting portion are positioned symmetrically with respect to the first mounting portion,
the first arrangement portion includes the first mounting portion and the second mounting portion,
The second arrangement portion includes the first mounting portion and the third mounting portion.

An electronic device according to a fourth aspect of the present disclosure is the electronic device according to the third aspect,
a first fastening member and a second fastening member for fastening the board to the housing;
The first attachment portion is
a first positioning pin capable of positioning the board relative to the housing;
a first fastening hole that is disposed on a first virtual line that extends along the second direction and passes through the first positioning pin, the first fastening hole being spaced apart from the first positioning pin in the second direction and capable of coupling with the first fastening member;
Each of the second mounting portion and the third mounting portion is
a second positioning pin located on the first virtual line and capable of positioning the board relative to the housing together with the first positioning pin;
a second fastening hole that is disposed on a second virtual line that extends along a third direction intersecting the first direction and the second direction and passes through the second positioning pin, the second fastening hole being spaced apart from the second positioning pin in the third direction and capable of coupling with the second fastening member;
The substrate is
a first through hole and a second through hole capable of accommodating the first positioning pin,
a third through hole capable of accommodating the first fastening member;
a fourth through hole capable of accommodating the second positioning pin;
a fifth through hole capable of accommodating the second fastening member;
In the first state, the first positioning pin is received in the first through hole, and the second positioning pin of the second mounting portion is received in the fourth through hole,
In the second state, the first positioning pin is received in the second through hole, and the second positioning pin of the third mounting portion is received in the fourth through hole.

An electronic device according to a fifth aspect of the present disclosure is the electronic device according to any one of the first to fourth aspects,
The straight-line distance from a first substrate surface of the substrate closest to the first housing surface in the first direction to an inner surface of the housing opposite the first substrate surface, and the straight-line distance from a second substrate surface of the substrate to an inner surface of the housing opposite the second substrate surface in the first direction are each 1.2 mm or more and 1.7 mm or less.

The following describes an embodiment of the present disclosure with reference to the drawings. The following description does not limit the present disclosure, but is essentially merely illustrative, and can be modified as appropriate without departing from the spirit of the present disclosure. The drawings are schematic, and the ratios of the dimensions do not necessarily correspond to reality.

As shown in FIG. 1, an electronic device 1 according to an embodiment of the present disclosure is, as an example, a notebook personal computer (in other words, a laptop PC). The electronic device 1 includes a first housing 10, a second housing 20, and a hinge unit 30 that connects the first housing 10 and the second housing 20.

The electronic device 1 includes a central processing unit (CPU), a volatile storage device (RAM), a non-volatile storage device (ROM, SSD, etc.), a battery, etc. The non-volatile storage device (ROM, SSD, etc.) stores an operating system (OS), various application programs, various data, etc. The central processing unit (CPU) is configured to be able to realize various functions by reading the OS, application programs, and various data and executing calculations.

As shown in FIG. 1, the first housing 10 has a display unit 11. The display unit 11 includes, for example, a touch panel liquid crystal display capable of receiving touch operations from the user.

As shown in Figs. 1 and 2, the second housing 20 includes a first housing surface 201 and a second housing surface 202 spaced apart in a first direction (e.g., Z direction). The first housing surface 201 is provided with an input unit 21. The input unit 21 includes, for example, a keyboard, and is configured to allow the user to perform input processing.

As shown in FIG. 2, the electronic device 1 includes a substrate 40 located inside the second housing 20. The substrate 40 is configured to be able to mount an imaging device 22. The imaging device 22 is configured, for example, as a camera module including a lens 221, an imaging element, a lens drive unit, etc.

The electronic device 1 is configured to be able to change the arrangement of the imaging device 22 by changing the arrangement of the board 40 to either a first state A1 shown in Figs. 1 to 3 or a second state A2 shown in Figs. 4 to 6 in accordance with user requests, etc. The first state A1 is an arrangement state of the board 40 in which the mounted imaging device 22 (e.g., lens 221) is arranged so that it can be exposed from the first housing surface 201, and the second state A21 is an arrangement state of the board 40 in which the mounted imaging device 22 (e.g., lens 221) is arranged so that it can be exposed from the second housing surface 202.

In more detail, the electronic device 1 includes a first fastening member 71 and a second fastening member 72 for fixing the substrate 40 to the second housing 20, and the second housing 20 includes a first arrangement portion 51 and a second arrangement portion 52. The first fastening member 71 and the second fastening member 72 are, for example, configured with screws. The first arrangement portion 51 is configured to be able to arrange the substrate 40 in a first state A1 as shown in FIG. 3. The second arrangement portion 52 is configured to be able to arrange the substrate 40 in a second state A2 as shown in FIG. 6.

In this embodiment, the first arrangement portion 51 includes a first mounting portion 61 and a second mounting portion 62 as shown in FIG. 3, and the second arrangement portion 52 includes a first mounting portion 61 and a third mounting portion 63 as shown in FIG. 6. The first mounting portion 61, the second mounting portion 62, and the third mounting portion 63 are provided on the second housing 20 and are positioned at intervals from each other along a second direction (e.g., the Y direction) that intersects the first direction Z. The second mounting portion 62 and the third mounting portion 63 are positioned symmetrically with respect to the first mounting portion 61 in the second direction Y.

The first mounting portion 61 has a first positioning pin 611 and a first fastening hole 612. The first positioning pin 611 is configured to be able to position the substrate 40 with respect to the second housing 20. As an example, as shown in FIG. 2 and FIG. 3, the first positioning pin 611 has a substantially cylindrical shape and protrudes from the first wall portion 23 constituting the first housing surface 201 in the second housing 20 toward the second wall portion 24 constituting the second housing surface 202. The first fastening hole 612 is configured to be able to couple the first fastening member 71. The first fastening hole 612 is located on a first virtual straight line L1 that extends along the second direction Y and passes through the first positioning pin 611, with a gap between them in the second direction Y. As an example, the first fastening hole 612 is composed of a first hole 251 provided in a boss portion 25 extending from the first wall portion 23 toward the second wall portion 24, and a second hole 261 provided in a boss portion 26 extending from the second wall portion 24 toward the first wall portion 23. A gap is formed between the two boss portions 25, 26 in the first direction Z, and the substrate 40 is located in this gap. The first hole 251, the second hole 261, and the third through hole 43 are arranged coaxially.

Each of the second mounting portion 62 and the third mounting portion 63 has a second positioning pin 621 and a second fastening hole 622. The second positioning pin 621 is located on the first virtual straight line L1 and is configured to be able to position the substrate 40 with respect to the second housing 20 together with the first positioning pin 611. As an example, the second positioning pin 621 has the same configuration as the first positioning pin 611. The second fastening hole 622 is configured to be able to connect the second fastening member 72. The second fastening hole 622 is arranged at a distance from the second positioning pin 621 in the third direction X on a second virtual straight line L2 that extends along a third direction (for example, the X direction) that intersects the first direction Z and the second direction Y and passes through the second positioning pin 621. As an example, the second fastening hole 622 is provided in the boss portion 27 that extends from the first wall portion 23 toward the second wall portion 24. In Figures 3 and 6, the second imaginary straight line L2 on the second mounting portion 62 side is indicated by "L2(1)," and the second imaginary straight line L2 on the third mounting portion 63 side is indicated by "L2(2)."

The substrate 40 is configured to be able to mount the imaging device 22, is located at the middle of the first direction Z inside the second housing 20, and extends along a virtual plane P intersecting the first direction Z as shown in Figs. 2 and 5. In this embodiment, the virtual plane P is configured as an XY plane located approximately at the center of the first wall portion 23 and the second wall portion 24 of the second housing 20. As an example, as shown in Fig. 7, the substrate 40 has a substantially rectangular plate shape extending along the second direction Y when attached to the second housing 20. A first through hole 41, a second through hole 42, and a third through hole 43 are provided at one end of the substrate 40 in the second direction Y, and a fourth through hole 44 and a fifth through hole 45 are provided at the other end of the substrate 40 in the second direction Y.

Each of the first through hole 41, the second through hole 42, the third through hole 43, the fourth through hole 44, and the fifth through hole 45 penetrates the substrate 40 in the first direction Z. When viewed along the first direction Z, the first through hole 41, the second through hole 42, the third through hole 43, and the fourth through hole 44 are located on a first virtual straight line L1, and the fourth through hole 44 and the fifth through hole 45 are located on a second virtual straight line L2 extending along a third direction (e.g., the X direction) intersecting the first direction Z and the second direction Y. When the substrate 40 is arranged in the first state A1, the fourth through hole 44 and the fifth through hole 45 are located on the second virtual straight line L2 (1) on the second mounting portion 62 side, as shown in FIG. When the substrate 40 is disposed in the second state A2, the fourth through hole 44 and the fifth through hole 45 are located on the second virtual straight line L2 (2) on the third mounting portion 63 side, as shown in FIG. 3. The third through hole 43 is located between the first through hole 41 and the second through hole 42, and the first through hole 41 is located between the third through hole 43 and the fourth through hole 44. The first through hole 41 and the second through hole 42 are located symmetrically with respect to the third through hole 43. A mounting portion 46 capable of mounting the imaging device 22 is provided between the first through hole 41 and the fourth through hole 44 and the fifth through hole 45 of the substrate 40.

The first through hole 41 and the second through hole 42 are each configured to accommodate a first positioning pin 611. The third through hole 43 is configured to accommodate a first fastening member 71. The fourth through hole 44 is configured to accommodate a second positioning pin 621. The fifth through hole 45 is configured to accommodate a second fastening member 72.

When the substrate 40 is placed in the first state A1, in the first direction Z, the first through hole 41 faces the first positioning pin 611, and the fourth through hole 44 faces the second positioning pin 621 of the second mounting portion 62. The first positioning pin 611 is accommodated in the first through hole 41, and the second positioning pin 621 of the second mounting portion 62 is accommodated in the fourth through hole 44. The third through hole 43 is positioned approximately coaxially with the first fastening hole 612, and the fifth through hole 45 is positioned approximately coaxially with the second fastening hole 622 of the second mounting portion 62.

When the substrate 40 is placed in the second state A2, in the first direction Z, the second through hole 42 faces the first positioning pin 611, and the fourth through hole 44 faces the second positioning pin 621 of the third mounting portion 63. The first positioning pin 611 is accommodated in the second through hole 42, and the second positioning pin 621 of the third mounting portion 63 is accommodated in the fourth through hole 44. The third through hole 43 is positioned approximately coaxially with the first fastening hole 612, and the fifth through hole 45 is positioned approximately coaxially with the second fastening hole 622 of the third mounting portion 63.

As shown in FIG. 8, the imaging device 22 mounted on the board 40 in the first state A1 and the imaging device 22 mounted on the board 40 in the second state A2 are positioned symmetrically with respect to the virtual plane P. The imaging device 22 mounted on the board 40 in the second state A2 is positioned closer to the center in the second direction Y than the imaging device 22 mounted on the board 40 in the first state A1. This prevents the user's hand from covering the imaging device 22 and appearing in the captured image when the user holds the electronic device 1 with the board 40 arranged in the second state A1.

A gap is formed between the substrate 40 and the second housing 20 in the first direction Z. The width of the gap 205 on the first housing surface 201 side is the "first linear distance D1", and the width of the gap 206 on the second housing surface 202 side is the "second linear distance D2". The gaps 205, 206 are configured such that the first linear distance D1 and the second linear distance D2 are 1.2 mm or more and 1.7 mm or less. The first linear distance D1 is, in other words, the linear distance between the first substrate surface 401 close to the first housing surface 201 of the substrate 40 in the first direction Z and the inner surface 203 facing the first substrate surface 401 of the second housing 20. The second linear distance D2 is, in other words, the linear distance between the second substrate surface 402 of the substrate 40 in the first direction Z and the inner surface 204 facing the second substrate surface 402 of the second housing 20.

The hinge unit 30 connects the first housing 10 and the second housing 20 to each other so that they can rotate. The hinge unit 30 is configured to be able to hold the first housing 10 at any angle relative to the second housing 20, or the second housing 20 at any angle relative to the first housing 10.

Electronic device 1 can achieve the following effects:

The electronic device 1 includes a second housing 20 including a first housing surface 201 and a second housing surface 202 spaced apart in the first direction Z, and a board 40 configured to be able to mount an imaging device 22. The board 40 is located at the middle of the first direction Z inside the second housing 20 and extends along a virtual plane P intersecting the first direction Z. The second housing 20 includes a first arrangement section 51 and a second arrangement section 52. The first arrangement section 51 is configured to be able to arrange the board 40 in a first state A1 in which the mounted imaging device 22 can be exposed from the first housing surface 201. The second arrangement section 52 is configured to be able to arrange the board 40 in a second state A2 in which the mounted imaging device 22 can be exposed from the second housing surface 202. With this configuration, an electronic device 1 capable of accommodating the arrangement of multiple imaging devices 22 on one board 40 can be realized.

In the electronic device 1, the imaging device 22 mounted on the board 40 in the first state A1 and the imaging device 22 mounted on the board 40 in the second state A2 are positioned symmetrically with respect to the virtual plane P. This configuration makes it possible to more reliably realize an electronic device 1 that can accommodate the arrangement of multiple imaging devices 22 on a single board 40.

The electronic device 1 includes a second housing 20 including a first mounting portion 61, a second mounting portion 62, and a third mounting portion 63 that are spaced apart from one another along the second direction Y. The second mounting portion 62 and the third mounting portion 63 are positioned symmetrically with respect to the first mounting portion 61. The first arrangement portion 51 includes the first mounting portion 61 and the second mounting portion 62, and the second arrangement portion 52 includes the first mounting portion 61 and the third mounting portion 63. This configuration makes it possible to more reliably realize an electronic device 1 that can accommodate the arrangement of multiple imaging devices 22 on a single board 40.

The electronic device 1 includes a first fastening member 71 and a second fastening member 72 that fix the substrate 40 to the second housing 20. The first mounting portion 61 has a first positioning pin 611 that can position the substrate 40 relative to the second housing 20, and a first fastening hole 612 that can connect the first fastening member 71. The first fastening hole 612 is disposed on a first imaginary straight line L1 that extends along the second direction Y and passes through the first positioning pin 611, with a gap between the first positioning pin 611 in the second direction Y. Each of the second mounting portion 62 and the third mounting portion 63 has a second positioning pin 621 that is located on the first imaginary straight line L1 and that can position the substrate 40 relative to the second housing 20 together with the first positioning pin 611, and a second fastening hole 622 that can connect the second fastening member 72. The second fastening hole 622 is disposed on a second virtual straight line L2 extending along the third direction X and passing through the second positioning pin 621, with a gap therebetween in the third direction X with respect to the second positioning pin 621. The substrate 40 has a first through hole 41 and a second through hole 42 capable of accommodating the first positioning pin 611, a third through hole 43 capable of accommodating the first fastening member 71, a fourth through hole 44 capable of accommodating the second positioning pin 621, and a fifth through hole 45 capable of accommodating the second fastening member 72. In the first state A1, the first positioning pin 611 is accommodated in the first through hole 41, and the second positioning pin 621 of the second mounting portion 62 is accommodated in the fourth through hole 44. In the second state A2, the first positioning pin 611 is accommodated in the second through hole 42, and the second positioning pin 621 of the third mounting portion 63 is accommodated in the fourth through hole 44. This configuration makes it possible to more reliably realize an electronic device 1 that can accommodate the arrangement of multiple imaging devices 22 on a single board 40.

The linear distance in the first direction Z between the first substrate surface 401 closest to the first housing surface 201 of the substrate 40 and the inner surface 203 facing the first substrate surface 401 of the second housing 20 is defined as the first linear distance D1. The linear distance in the first direction Z between the second substrate surface 402 of the substrate 40 and the inner surface 204 facing the second substrate surface 402 of the second housing 20 is defined as the second linear distance D2. The first linear distance D1 and the second linear distance D2 are 1.2 mm or more and 1.7 mm or less. This configuration makes it possible to more reliably realize an electronic device 1 that can accommodate the arrangement of multiple imaging devices 22 on a single substrate 40.

The electronic device 1 can also be configured as follows:

The imaging device 22 mounted on the substrate 40 in the first state A1 and the imaging device 22 mounted on the substrate 40 in the second state A2 may be positioned asymmetrically with respect to the virtual plane P, not necessarily symmetrically with respect to the virtual plane P.

The first arrangement section 51 is not limited to including the first mounting section 61 and the second mounting section 62, and the second arrangement section 52 is not limited to including the first mounting section 61 and the third mounting section 63. The first arrangement section 51 and the second arrangement section 52 can adopt any configuration that can realize the arrangement of the substrate 40 in both the first state A1 and the second state A2.

The first mounting portion 61 is not limited to having the first positioning pin 611 and the first fastening hole 612. For example, the first positioning pin 611 may be omitted. Furthermore, if a configuration is adopted in which the first fastening member 71 is not used to attach the substrate 40 to the second housing 20, the first fastening hole 612 may be changed to another configuration or may be omitted if possible. The same applies to the second mounting portion 62 and the third mounting portion 63.

The first linear distance D1 and the second linear distance D2 are not limited to being 1.2 mm or more and 1.7 mm or less, and can be changed as desired depending on the design of the electronic device 1, etc.

The components constituting the electronic device 1 are not limited to the illustrated embodiment, and any shape and configuration may be adopted as long as they do not deviate from the scope of this disclosure.

By appropriately combining any of the various embodiments or modifications described above, it is possible to achieve the effects of each. Combinations of embodiments, combinations of examples, or combinations of embodiments and examples are possible, and combinations of features of different embodiments or examples are also possible.

Although the present disclosure has been described in connection with preferred embodiments with reference to the accompanying drawings, various variations or modifications will be apparent to those skilled in the art. Such variations and modifications are to be understood as being included within the scope of the present disclosure as defined by the appended claims, unless they depart therefrom.

This disclosure is broadly applicable to electronic devices, including notebook computers.

1 Electronic device 10 First housing 11 Display unit 20 Second housing 21 Input unit 22 Imaging device 221 Lens 23 First wall unit 24 Second wall unit 25, 26, 27 Boss unit 251 First hole 261 Second hole 30 Hinge unit 40 Substrate 41 First through hole 42 Second through hole 43 Third through hole 44 Fourth through hole 45 Fifth through hole 46 Mounting unit 51 First arrangement unit 52 Second arrangement unit 61 First mounting unit 62 Second mounting unit 63 Third mounting unit 71 First fastening member 72 Second fastening member 201 First housing surface 202 Second housing surface 202 Second substrate surface 203, 204 Inner surface 205, 206 Gap 401 First substrate surface 402 Second substrate surface 611 First positioning pin 612 First fastening hole 621 Second positioning pin 622 Second fastening hole

Claims (5)

a housing including a first housing surface and a second housing surface spaced apart in a first direction;
a substrate configured to be able to mount an imaging device, positioned at a middle point in the first direction inside the housing, and extending along a virtual plane intersecting the first direction;
The housing,
a first arrangement section capable of arranging the board in a first state in which the mounted imaging device can be exposed from the first housing surface;
a second arrangement portion capable of arranging the board in a second state in which the mounted imaging device can be exposed from the second housing surface. The electronic device according to claim 1, wherein the imaging device mounted on the substrate in the first state and the imaging device mounted on the substrate in the second state are positioned symmetrically with respect to the virtual plane. The housing,
a first mounting portion, a second mounting portion, and a third mounting portion that are spaced apart from one another along a second direction that intersects the first direction;
the second mounting portion and the third mounting portion are positioned symmetrically with respect to the first mounting portion,
the first arrangement portion includes the first mounting portion and the second mounting portion,
The electronic device according to claim 1 , wherein the second arrangement portion includes the first attachment portion and the third attachment portion. a first fastening member and a second fastening member for fastening the board to the housing;
The first attachment portion is
a first positioning pin capable of positioning the board relative to the housing;
a first fastening hole that is disposed on a first virtual line that extends along the second direction and passes through the first positioning pin, the first fastening hole being spaced apart from the first positioning pin in the second direction and capable of coupling with the first fastening member;
Each of the second mounting portion and the third mounting portion is
a second positioning pin located on the first virtual line and capable of positioning the board relative to the housing together with the first positioning pin;
a second fastening hole that is disposed on a second imaginary line that extends along a third direction intersecting the first direction and the second direction and passes through the second positioning pin, the second fastening hole being spaced apart from the second positioning pin in the third direction and capable of coupling with the second fastening member;
The substrate is
a first through hole and a second through hole capable of accommodating the first positioning pin,
A third through hole capable of accommodating the first fastening member;
a fourth through hole capable of accommodating the second positioning pin;
a fifth through hole capable of accommodating the second fastening member;
In the first state, the first positioning pin is received in the first through hole, and the second positioning pin of the second mounting portion is received in the fourth through hole,
The electronic device according to claim 3 , wherein in the second state, the first positioning pin is received in the second through hole, and the second positioning pin of the third attachment portion is received in the fourth through hole. The electronic device according to claim 1 or 2, wherein the first linear distance is a linear distance between a first substrate surface of the substrate that is closer to the first substrate surface of the substrate in the first direction and an inner surface of the substrate that faces the first substrate surface, and the second linear distance is a linear distance between a second substrate surface of the substrate in the first direction and an inner surface of the substrate that faces the second substrate surface of the substrate, the first linear distance and the second linear distance being 1.2 mm or more and 1.7 mm or less.

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