JP2025059390A - Sensor Module - Google Patents

Abstract

To provide a sensor module capable of improving the temporal reliability of characteristics of a sensor device mounted on a substrate.SOLUTION: A sensor module 100 includes: an upper surface 15a of a substrate 15; the substrate 15 having a through-hole 41; a sensor device 17z provided on the upper surface 15a of the substrate 15 and detecting a physical quantity of a first axis; a sensor device 17x provided on the through-hole 41 and detecting a physical quantity of a second axis perpendicular to the first axis; a fixing portion 61a for fixing the sensor device 17x to an inner side surface 41a on a X axial direction plus side in the through-hole 41; and a fixing portion 62a for fixing the sensor device 17x to an inner side surface 41b on a X axial direction minus side in the through-hole 41.SELECTED DRAWING: Figure 4

Description

The present invention relates to a sensor module.

2. Description of the Related Art Japanese Patent Laid-Open No. 2006-133663 discloses a sensor module incorporating a sensor device having an angular velocity sensor that detects inertia based on a predetermined detection axis.
Patent Document 1 describes a sensor module that includes a sensor device mounted on a front surface of a substrate and a sensor device mounted on a side surface of the substrate.

JP 2017-20829 A

In such sensor modules, further improvement is desired in terms of the reliability over time of the characteristics of the sensor devices mounted on the substrate.

A sensor module according to one aspect of the present application includes a substrate having a first surface and a first through hole, a first sensor device provided on the first surface and configured to detect a physical quantity of a first axis, a second sensor device provided in the first through hole and configured to detect a physical quantity of a second axis perpendicular to the first axis, a first fixing part that fixes the second sensor device to a first side surface within the first through hole, and a second fixing part that fixes the second sensor device to a second side surface within the first through hole.

A sensor module according to one aspect of the present application includes a substrate having a first surface, a first through hole, and a second through hole, a first sensor device provided on the first surface and configured to detect a physical quantity of a first axis, a second sensor device provided in the first through hole and configured to detect a physical quantity of a second axis perpendicular to the first axis, a third sensor device provided in the second through hole and configured to detect a physical quantity of a third axis perpendicular to the first axis and the second axis, a first fixing part that fixes the second sensor device to a first side surface within the first through hole, a second fixing part that fixes the second sensor device to a second side surface within the first through hole, a third fixing part that fixes the third sensor device to a first side surface within the second through hole, and a fourth fixing part that fixes the third sensor device to a second side surface within the second through hole.

FIG. 2 is a perspective view showing a state in which the sensor module according to the first embodiment is fixed to a mounting surface. FIG. 2 is a perspective view showing the sensor module of FIG. 1 as viewed from the mounting surface side. FIG. FIG. FIG. 4 is an enlarged plan view showing a mounting state of the sensor device. 5B is a cross-sectional view taken along line BB in FIG. 5A. FIG. 3 is a cross-sectional perspective view taken along line AA in FIG. 2 . FIG. 13 is a perspective view of a substrate according to a first modified example. FIG. 11 is a perspective view of a substrate according to a second modified example. FIG. 11 is an enlarged plan view showing a mounting state of a sensor device according to a third modified example. FIG. 13 is an enlarged plan view showing a mounting state of a sensor device according to a fourth modified example. FIG. 11 is a cross-sectional perspective view of a sensor module according to a second embodiment. FIG. 11 is an enlarged plan view showing a mounting state of a sensor device according to a second embodiment. 12B is a cross-sectional view taken along line CC of FIG. 12A. FIG. 11 is a perspective view showing an electronic device according to a third embodiment. FIG. 11 is a perspective view showing an electronic device according to a third embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the drawings, the dimensions of the components may be shown on different scales in order to make the components easier to see.
For ease of explanation, the three mutually orthogonal axes are referred to as the X-axis, Y-axis, and Z-axis, and the direction parallel to the X-axis is also referred to as the "X-axis direction," the direction parallel to the Y-axis is also referred to as the "Y-axis direction," and the direction parallel to the Z-axis is also referred to as the "Z-axis direction." The tip side of the arrow direction of each axis is also referred to as the "plus side," and the opposite side is also referred to as the "minus side." In addition, hereinafter, viewing in the Z-axis direction is also referred to as the "planar view," and viewing from the X-axis or Y-axis direction with respect to a cross section including the Z-axis is also referred to as the "cross-sectional view."

Furthermore, in the following description, the term "top surface" refers to the surface of the configuration on the positive side in the Z-axis direction, for example, "top surface of the board" refers to the surface of the board on the positive side in the Z-axis direction. Furthermore, the term "bottom surface" refers to the surface of the configuration on the negative side in the Z-axis direction, for example, "bottom surface of the board" refers to the surface of the board on the negative side in the Z-axis direction. Furthermore, the term "left side surface" refers to the surface of the configuration on the negative side in the X-axis direction, the term "right side surface" refers to the surface of the configuration on the positive side in the X-axis direction, the term "front surface" refers to the surface of the configuration on the negative side in the Y-axis direction, and the term "back surface" refers to the surface of the configuration on the positive side in the Y-axis direction.

1. Embodiment 1
A sensor module 100 according to a first embodiment will be described with reference to FIGS.
FIG. 1 is a perspective view showing a state in which a sensor module 100 is fixed to a mounting surface 71 of an automobile or the like. FIG. 2 is a perspective view showing a state in which the sensor module 100 of FIG. 1 is viewed from the mounting surface 71 side. FIG. 3 is an exploded perspective view of the sensor module 100. FIG. 4 is a perspective view of a substrate 15. FIG. 5A is an enlarged plan view showing a mounting state of a sensor device. FIG. 5B is a cross-sectional view taken along line B-B of FIG. 5A. FIG. 6 is a cross-sectional perspective view taken along line A-A of FIG. 2. FIG. 7 is a perspective view of a substrate 15 according to a first modified example. FIG. 8 is a perspective view of a substrate 15 according to a second modified example. FIG. 9 is an enlarged plan view showing a mounting state of a sensor device according to a third modified example. FIG. 10 is an enlarged plan view showing a mounting state of a sensor device according to a fourth modified example.

In this embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the attitude and behavior of a worn device such as an automobile or a robot. Here, the worn device can be rephrased as a moving body, and the behavior can be rephrased as inertial momentum.

As shown in FIG. 1, the sensor module 100 has an outer case 1 that is substantially square in plan and rectangular in three-dimensional shape. The size of the sensor module 100 is, for example, a square with a side length of about 3 cm and a thickness of about 1 cm.

The outer case 1 includes a substrate 15 on which multiple sensor devices are mounted. In this embodiment, the multiple sensor devices include an X-axis angular velocity sensor, a Y-axis angular velocity sensor, a Z-axis angular velocity sensor, and a three-axis acceleration sensor. In other words, the sensor module 100 is a six-axis motion sensor.

Two screw holes 2 are formed in the bottom surface 8 of the outer case 1. By passing screws 70 through these two screw holes 2, the sensor module 100 is fixed to the mounting surface 71 of a mounting device such as an automobile and used.

As shown in FIG. 2, an opening 21 is formed on the surface of the sensor module 100 as viewed from the side on which the sensor module is to be mounted. A plug-type connector 16 is disposed inside the opening 21. The connector 16 has multiple pins. A socket-type connector (not shown) is connected to the connector 16 from the device to which the sensor module is to be mounted. The sensor module 100 receives power from the device to which the sensor module is to be mounted via the connector 16, and transmits electrical signals such as detection data to the device to which the sensor module is to be mounted.

1.1 Configuration of the Sensor Module FIG. 3 is an exploded perspective view of the sensor module 100, seen from the same direction as FIG.
3, the sensor module 100 is composed of an outer case 1, a joint member 12, a sensor unit 10, etc. Specifically, the sensor unit 10 is inserted into the inside 3 of the outer case 1 with the joint member 12 interposed therebetween.

The outer case 1 is a base machined from aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc or stainless steel, resin, or a composite material of metal and resin may also be used.

The outer case 1 is in the shape of a lidless box, and its inside 3 defines an internal space surrounded by a bottom surface 5 , a joint surface 6 , and a side wall 4 .
The sensor unit 10 is housed in the internal space of the outer case 1 via a joint member 12. The joint member 12 is a ring-shaped gasket that fits along the joint surface 6 of the outer case 1 and the joint surface 22 of the sensor unit 10 and has a thickness of about 1 mm.

The sensor unit 10 is composed of an inner case 20 and a substrate 15 .
The inner case 20 is a member that supports the substrate 15, and is shaped to fit inside the inner side 3 of the outer case 1. In more detail, in plan view, it is a hexagon with two vertices of a square chamfered, and has an opening 21 that is a rectangular through-hole and a recess 31 provided on the surface that supports the substrate 15.

As shown in FIG. 2 , the top surface 27 of the inner case 20 is lower than the top surface 7 of the outer case 1 .
Although not shown, guide pins and a support surface for positioning the substrate 15 are formed on the bottom surface of the inner case 20 .
The substrate 15 is positioned by the guide pins and the support surface and is adhered to the rear surface of the inner case 20 .

1.2 Mounting Structure of Sensor Devices As shown in FIG. 4, a plurality of sensor devices 17x, 17y, 17z, and 18 are mounted on the substrate 15.
The substrate 15 is a multi-layer substrate having a plurality of through holes, specifically a glass epoxy substrate. However, the substrate 15 is not limited to a glass epoxy substrate, and may be a composite substrate, a ceramic substrate, or other rigid substrate.

As shown in FIG. 4, in this embodiment, a plurality of sensor devices 17x, 17y, 17z, and 18, a connector 16, and a control IC 19 are mounted on the substrate 15. In addition, a plurality of other electronic components are also mounted on the substrate 15.

The sensor device 17x is an angular velocity sensor including a sensor element that detects a one-axis angular velocity in the X-axis direction, and preferably has a detection circuit and an output circuit packaged together in the same package.
The sensor device 17y is an angular velocity sensor including a sensor element that detects a one-axis angular velocity in the Y-axis direction, and preferably has a detection circuit and an output circuit packaged together in the same package.
The sensor device 17z is an angular velocity sensor including a sensor element that detects a one-axis angular velocity in the Z-axis direction, and preferably has a detection circuit and an output circuit packaged together in the same package.

In this embodiment, the sensor elements of the sensor devices 17x, 17y, and 17z are vibration gyro sensors that use quartz as an oscillator and detect angular velocity from the Coriolis force acting on a vibrating object. Note that the sensor elements may also be sensors that use ceramic or silicon as an oscillator.

In this embodiment, sensor device 17z is an example of a first sensor device that detects a physical quantity of a first axis. Sensor device 17x is an example of a second sensor device that detects a physical quantity of a second axis. Sensor device 17y is an example of a third sensor device that detects a physical quantity of a third axis. The physical quantity of the first axis, the physical quantity of the second axis, and the physical quantity of the third axis are angular velocity around the Z axis, angular velocity around the X axis, and angular velocity around the Y axis. The physical quantity of the first axis, the physical quantity of the second axis, and the physical quantity of the third axis may be acceleration in the Z axis direction, acceleration in the X axis direction, and acceleration in the Y axis direction.

The sensor device 18 is a three-axis acceleration sensor for the X-axis, Y-axis, and Z-axis, and is an acceleration sensor that can detect X-axis acceleration, Y-axis acceleration, and Z-axis acceleration with a single device. In this embodiment, the sensor device 18 is a capacitance-type acceleration sensor in which a silicon substrate is processed using MEMS technology.

The connector 16 is a plug-type connector and has two rows of connection terminals arranged at equal pitch in the X-axis direction. In this embodiment, the connector 16 has a total of 20 connection terminals, with 10 pins per row, but the number of terminals may be changed as appropriate depending on the design specifications.

The control IC 19 is a microcontroller unit (MCU), which has a built-in storage unit including a non-volatile memory, an A/D converter, and the like, and controls each part of the sensor module 100 .
The memory unit stores a program that defines the sequence and content for detecting acceleration and angular velocity, a program that digitizes the detected data and incorporates it into packet data, and associated data.

The sensor device 17z is mounted on the upper surface 15a of the substrate 15. In other words, the upper surface 15a of the substrate 15 is a mounting surface on which the sensor device 17z is mounted.
The substrate 15 has two through holes 41 and 42. The through holes 41 and 42 each penetrate the substrate 15 in the Z-axis direction. In this embodiment, the through hole 41 is an example of a first through hole. The through hole 42 is an example of a second through hole.

As shown in FIG. 5A, the planar shape of through hole 41 is a rectangle with its long sides in the Y-axis direction. Therefore, the three-dimensional shape of through hole 41 is a rectangular parallelepiped. Through hole 41 has four inner sides 41a, 41b, 41c, and 41d inside. Through hole 42 is a rectangle with its long sides in the X-axis direction. Like through hole 41, through hole 42 has four inner sides inside.

The sensor device 17x is mounted in the through hole 41. The sensor device 17x is inserted into the through hole 41 of the substrate 15 and fixed to the inner surfaces 41a and 41b of the through hole 41.
In this embodiment, the sensor device 17x is mounted on inner surfaces 41a, 41b on two opposing long side sides of the through hole 41. The two inner surfaces 41a, 41b of the through hole 41 are mounting surfaces on which the sensor device 17x is mounted.

The sensor device 17x is fixed such that the right side surface 17xa and the left side surface 17xb of the sensor device 17x are aligned with the inner surfaces 41a, 41b of the two opposing long sides of the through hole 41. In this embodiment, one of the inner surfaces 41a, 41b of the two opposing long sides that is closer to the center of the substrate 15, in other words, the inner surface 41a on the positive side of the X-axis direction of the through hole 41, is an example of a first side surface, and the other of the inner surfaces on the outside of the substrate 15, in other words, the inner surface 41b on the negative side of the X-axis direction of the through hole 41, is an example of a second side surface. The right side surface 17xa and the left side surface 17xb of the sensor device 17x are also examples of two opposing surfaces of the sensor device 17x.

As shown in FIG. 5B, the sensor device 17x is mounted with a portion thereof protruding from the opening on the upper surface side of the through-hole 41 to the positive side in the Z axis direction, and from the opening on the lower surface side of the through-hole 41 to the negative side in the Z axis direction. In other words, the sensor device 17x has a first portion 17x1 protruding from the upper surface 15a of the substrate 15 to the positive side in the Z axis direction, and a second portion 17x2 protruding from the lower surface 15b of the substrate 15 to the negative side in the Z axis direction. In this embodiment, the upper surface 15a of the substrate 15 is an example of a first surface, and the lower surface 15b of the substrate 15 is an example of a second surface.

As shown in FIG. 4, the first portion 17y1 of the sensor device 17y protrudes from the opening on the upper surface of the through-hole 42 to the positive side in the Z axis direction. Also, although not shown, a part of the sensor device 17y protrudes from the opening on the lower surface of the through-hole 42 to the negative side in the Z axis direction. In other words, the sensor device 17y has a first portion 17y1 that protrudes from the upper surface 15a of the substrate 15 to the positive side in the Z axis direction, and a second portion that protrudes from the lower surface 15b of the substrate 15 to the negative side in the Z axis direction.

As shown in FIG. 5B, the substrate 15 has a plurality of electrodes 33a and 33b. The electrode 33a is provided on the upper surface 15a of the substrate 15 in correspondence with the electrode 35a of the sensor device 17x. The electrode 33b is provided on the lower surface 15b of the substrate 15 in correspondence with the electrode 35b of the sensor device 17x.

Electrodes 33a and 35a are electrically connected by solder 37a. Electrodes 33b and 35b are electrically connected by solder 37b. In this embodiment, solders 37a and 37b are examples of conductive parts.

The substrate 15 and the sensor device 17x are joined by the fixing parts 61a, 61b, 62a, and 62b. In other words, the sensor device 17x is fixed to the substrate 15 at four points by the fixing parts 61a, 61b, 62a, and 62b. Therefore, the fixed state of the sensor device 17x is prevented from changing due to changes over time, etc., and the characteristics of the sensor device 17x can be prevented from changing.

The fixing portion 61a is provided to cover the electrodes 33a, 35a, and the solder 37a, while the fixing portion 61b is provided to cover the electrodes 33b, 35b, and the solder 37b.
In the present embodiment, the fixing portion 61a is an example of a first fixing portion. The fixing portion 62a is an example of a second fixing portion. For example, the fixing portion 61a fixes the sensor device 17x to the inner surface 41a of the through hole 41, and the fixing portion 62a fixes the sensor device 17x to the inner surface 41b of the through hole 41.

The role of the fixing part 61a is to fix the sensor device 17x and the inner surface 41a of the through hole 41 so that the positional relationship between them is constant, and as shown in FIG. 5B, the sensor device 17x may be fixed so that it is in contact with the inner surface 41a of the through hole 41, or so that there is a predetermined space between the sensor device 17x and the inner surface 41a of the through hole 41. The same is true for the fixing part 62a, and as shown in FIG. 5B, the sensor device 17x may be fixed so that it is in contact with the inner surface 41b of the through hole 41, or so that there is a predetermined space between the sensor device 17x and the inner surface 41b of the through hole 41.

The fixing parts 61a, 61b, 62a, and 62b are made of a resin whose glass transition temperature (TG) is equal to or higher than the operating temperature range, and the same material is used for all of them. By using the same material for the fixing parts 61a, 61b, 62a, and 62b, the effects of thermal stress are uniform. Therefore, it is possible to suppress changes in the characteristics of the sensor device 17x over time, and to improve the reliability of the characteristics of the sensor device 17x over time.

The fixing parts 61a and 61b have a symmetrical structure on the upper surface 15a and the lower surface 15b of the substrate 15. The fixing parts 62a and 62b have a symmetrical structure on the upper surface 15a and the lower surface 15b of the substrate 15. In this way, by making the fixing parts 61a and 61b, and the fixing parts 62a and 62b, respectively, symmetrical, it is possible to suppress the influence of the linear expansion coefficient and stress of the resin used in the fixing parts 61a, 61b, 62a, and 62b. Therefore, it is possible to suppress the change over time in the characteristics of the sensor device 17x, and to improve the reliability over time of the characteristics of the sensor device 17x.

As shown in FIG. 4, a sensor device 17y is mounted in the through hole 42. The sensor device 17y is inserted into the through hole 42 of the substrate 15 and fixed to the inner surfaces 42a and 42b of the through hole 42.

In this embodiment, the sensor device 17y is mounted on the inner surfaces 42a and 42b of the two opposing long sides of the through hole 42. The two inner surfaces 42a and 42b of the through hole 42 are the mounting surfaces on which the sensor device 17y is mounted.

The sensor device 17y is fixed such that the front surface 17ya and the back surface 17yb of the sensor device 17y are aligned with the inner surfaces 42a, 42b of the two long sides of the through hole 42. In this embodiment, of the inner surfaces 42a, 42b of the two opposing long sides, the one on the center side of the substrate 15, in other words, the inner surface 42a on the negative side of the Y axis direction of the through hole 42, is an example of a first side, and the other on the outside of the substrate 15, in other words, the inner surface 42b on the positive side of the Y axis direction of the through hole 42, is an example of a second side. The front and back surfaces of the sensor device 17y are also examples of two opposing surfaces of the sensor device 17y.

The substrate 15 and the sensor device 17y are joined by the fixing parts 63a and 64a. Although not shown, the lower surface 15b of the substrate 15 is provided with a fixing part having a structure symmetrical to the fixing part 63a, similar to the fixing part 61a, and a fixing part having a structure symmetrical to the fixing part 64a, similar to the fixing part 62a.
The fixing portion 63a is provided to cover the electrode 33a, the electrode 35a, and the solder 37a. In this embodiment, the fixing portion 63a is an example of a third fixing portion. The fixing portion 64a is an example of a fourth fixing portion.

As shown in FIG. 6, the substrate 15 is disposed in the space between the outer case 1 and the inner case 20. In addition, the sensor device 17z, the sensor device 17y, and the sensor devices 17x and 18 (not shown) are disposed in an area overlapping the recess 31 of the inner case 20.

The inner case 20 defines on the upper surface 15a of the substrate 15 an area in which the connector 16 is disposed and an area in which the sensor device 17z and the like are disposed. The connector 16 is exposed from an opening 21 of the inner case 20. The upper surface 15a of the substrate 15 around the connector 16 is bonded to the inner case 20 with an adhesive to prevent the intrusion of water and air.

1.3 Modifications The above-described embodiment may be modified in various ways. Specific modifications are exemplified below.

1.3.1. Variation 1
As shown in FIG. 7, in the first modification, the substrate 15 has a slit 43 and a slit 44 .
The slit 43 is open on the positive side in the Y axis direction. In other words, the slit 43 is the one of the four inner surfaces of the through hole 41 that does not have an inner surface on the positive side in the Y axis direction. The slit 43 is an example of a first through hole.

The slit 44 is open on the positive side in the X-axis direction. In other words, the slit 44 is the one of the four inner surfaces of the through hole 42 that does not have an inner surface on the positive side in the X-axis direction. The slit 44 is an example of a second through hole.

The sensor device 17x is mounted in the slit 43. The sensor device 17x is inserted into the slit 43 of the substrate 15 and fixed to inner surfaces 43a and 43b of the slit 43.
In the first modification, the sensor device 17x is mounted on inner surfaces 43a and 43b on two opposing long side surfaces of the slit 43. The two inner surfaces of the slit 43 are mounting surfaces on which the sensor device 17x is mounted.

The sensor device 17x is fixed so that the left side surface 17xb and the right side surface 17xa of the sensor device 17x are aligned with the two inner surfaces 43a, 43b of the slit 43. In the first modification, of the inner surfaces 43a, 43b of the two opposing long sides, one of the inner surfaces 43a, 43b on the center side of the substrate 15, in other words, the inner surface 43a on the positive side of the X-axis direction of the slit 43, is an example of a first side, and the other of the inner surfaces on the outside of the substrate 15, in other words, the inner surface 43b on the negative side of the X-axis direction of the slit 43, is an example of a second side.

In the first modification, when inserting the sensor device 17x into the slit 43, the opening on the positive side of the Y axis direction of the slit 43 can be used. Specifically, the sensor device 17x can be arranged at the desired mounting position by inserting the sensor device 17x from the opening on the positive side of the Y axis direction of the slit 43 and sliding it to the negative side of the Y axis direction. Therefore, the sensor device 17x can be more easily arranged at the desired mounting position than by inserting the sensor device 17x from the Z axis direction of the through hole 41.

The sensor device 17y is mounted in the slit 44. The sensor device 17y is inserted into the slit 44 of the substrate 15 and fixed to the inner surfaces 44a and 44b of the slit 44.
In the first modification, the sensor device 17y is mounted on inner surfaces 44a, 44b on two opposing long side sides of the slit 44. The two inner surfaces 44a, 44b of the slit 44 are mounting surfaces on which the sensor device 17y is mounted.

The sensor device 17y is fixed so that the front surface 17ya and the back surface 17yb of the sensor device 17y are aligned with the two inner surfaces 44a, 44b of the slit 44. In the first modification, of the inner surfaces 44a, 44b on the two opposing long side sides, one of the inner surfaces 44a, 44b on the center side of the substrate 15, in other words, the inner surface 44a on the negative side of the Y axis direction of the slit 44, is an example of a first side, and the other of the inner surfaces on the outside of the substrate 15, in other words, the inner surface 44b on the positive side of the Y axis direction of the slit 44, is an example of a second side.

In the first modification, when inserting the sensor device 17y into the slit 44, the opening on the positive side of the X-axis direction of the slit 44 can be used. Specifically, the sensor device 17y can be placed in the desired mounting position by inserting the sensor device 17y from the opening on the positive side of the X-axis direction of the slit 44 and sliding it to the negative side of the X-axis direction. Therefore, the sensor device 17y can be more easily placed in the desired mounting position than by inserting the sensor device 17y from the Z-axis direction of the through-hole 42.

1.3.2. Variation 2
As shown in FIG. 8, in the second modification, the substrate 15 has a notch 45 and a notch 46 .
The cutout 45 is open on the negative side in the X-axis direction. In other words, the cutout 45 is the one of the four inner surfaces of the through hole 41 that does not have an inner surface on the negative side in the X-axis direction. The cutout 45 is an example of a first through hole.

The notch 46 is open on the positive side in the Y axis direction. In other words, the one of the four inner surfaces of the through hole 42 that does not have an inner surface on the positive side in the Y axis direction is the notch 46. In this modified example, the notch 46 is an example of a second through hole.

The sensor device 17x is mounted in the cutout 45. The sensor device 17x is inserted into the cutout 45 of the substrate 15 and fixed to inner surfaces 45a and 45c of the cutout 45.
In the second modification, the sensor device 17x is mounted on an inner surface 45a on the long side and an inner surface 45b on the short side of the cutout 45. The inner surface 45a on the long side and the inner surface 45c on the short side of the cutout 45 are mounting surfaces on which the sensor device 17x is mounted. The sensor device 17x may be mounted on the inner surface 45a on the long side and the inner surface 45d on the short side of the cutout 45.

The sensor device 17x is fixed so that the right side surface 17xa and the front surface 17xc of the sensor device 17x are aligned along the two continuous inner surfaces 45a, 45c of the cutout 45. In the second modification, the inner surface 45a on the long side, in other words, the inner surface 45a on the positive side of the X-axis direction of the cutout 45, is an example of a first side surface, and one of the two inner surfaces 45c, 45d on the short side, in other words, the inner surface 45c on the negative side of the Y-axis direction of the cutout 45, is an example of a second side surface. In addition, the right side surface 17xa and the front surface 17xc of the sensor device 17x are an example of two continuous surfaces.

The substrate 15 and the sensor device 17x are joined by the fixing parts 61a and 65a. Although not shown, the lower surface 15b of the substrate 15 is provided with a fixing part having a structure symmetrical to the fixing part 61a and a fixing part having a structure symmetrical to the fixing part 65a. In the second modification, the fixing part 61a is an example of a first fixing part. The fixing part 65a is an example of a second fixing part.

In the second modification, when inserting the sensor device 17x into the notch 45, the opening on the negative side in the X-axis direction of the notch 45 can be used.
Therefore, the sensor device 17x can be more easily disposed at a predetermined mounting position than by inserting the sensor device 17x into the through hole 41 from the Z-axis direction.

The sensor device 17y is mounted in the notch 46. The sensor device 17y is inserted into the notch 46 in the substrate 15 and fixed to the inner surfaces 46a and 46c of the notch 46.

In the second modification, the sensor device 17y is mounted on the inner surface 46a on the long side and the inner surface 46d on the short side of the cutout 46. The inner surface 46a on the long side and the inner surface 46d on the short side of the cutout 46 are the mounting surfaces on which the sensor device 17y is mounted. The sensor device 17y may also be mounted on the inner surface 46a on the long side and the inner surface 46c on the short side of the cutout 46.

The sensor device 17y is fixed so that the right side surface 17yd and the front surface 17ya of the sensor device 17y are aligned along the two continuous inner surfaces 46a, 46d of the cutout 46. In the second modification, the inner surface 46a on the long side, in other words, the inner surface 46a on the negative side of the Y-axis direction of the cutout 46, is an example of a first side surface, and one of the two inner surfaces 46c, 46d on the short side, in other words, the inner surface 46d on the positive side of the X-axis direction of the cutout 46, is an example of a second side surface. In addition, the right side surface 17yd and the front surface 17ya of the sensor device 17y are an example of two continuous surfaces.

The substrate 15 and the sensor device 17y are joined by the fixing parts 63a and 66a. Although not shown, the lower surface 15b of the substrate 15 is provided with a fixing part having a structure symmetrical to the fixing part 63a and a fixing part having a structure symmetrical to the fixing part 66a. In the second modification, the fixing part 63a is an example of a third fixing part. The fixing part 66a is an example of a fourth fixing part.

In the second modification, when inserting the sensor device 17y into the notch 46, the opening on the positive side in the Y axis direction of the notch 46 can be used.
Therefore, the sensor device 17y can be more easily disposed at a predetermined mounting position than by inserting the sensor device 17y from the Z-axis direction of the through-hole 42.

Variation 3
As shown in FIG. 9 , in the third modification, the sensor device 17 x is inserted into a through-hole 41 and fixed to the inner surfaces 41 a and 41 c of the through-hole 41 .
In the third modification, the sensor device 17x is mounted on the inner surface 41a on the long side and the inner surface 41c on the short side that is continuous with the inner surface 41a on the long side in the through hole 41. The sensor device 17x is fixed so that the right side 17xa and the front surface 17xc of the sensor device 17x are aligned with the two inner surfaces 41a and 41c of the through hole 41. In the third modification, the inner surface 41a on the long side, in other words, the inner surface 41a on the positive side in the X-axis direction of the through hole 41, is an example of a first side, and the inner surface 41c on the short side, in other words, the inner surface 41c on the negative side in the Y-axis direction of the through hole 41, is an example of a second side. The right side 17xa and the front surface 17xc of the sensor device 17x are an example of two continuous surfaces of the sensor device 17x.

The fixing portion 65a is provided along the short side of the through hole 41 on the negative side in the Y-axis direction. Although not shown, a fixing portion having a structure symmetrical to the fixing portion 65a is provided on the lower surface 15b of the substrate 15.

The substrate 15 and the sensor device 17x are joined by fixing parts 61a, 61b, 65a, and a fixing part having a structure symmetrical to fixing part 65a. In other words, the sensor device 17x is fixed to the substrate 15 at four points by each fixing part. Therefore, the fixed state of the sensor device 17x is prevented from changing due to changes over time, etc., and the characteristics of the sensor device 17x can be prevented from changing.

Variation 4
As shown in FIG. 10 , in the fourth modification, a sensor device 17 x is inserted into a through hole 41 and fixed to the inner surface of the through hole 41 .
In the fourth modification, the sensor device 17x is mounted on two inner surfaces 41a, 41c, and 41d on the opposing short sides of the through hole 41. The sensor device 17x is fixed such that the front surface 17xc and the back surface 17xd of the sensor device 17x are aligned with the two opposing inner surfaces 41c and 41d of the through hole 41. In the fourth modification, one of the two opposing inner surfaces 41c and 41d on the short side, in other words, the inner surface 41c on the negative side of the Y-axis direction of the through hole 41, is an example of a first side surface, and the other of the two opposing inner surfaces 41c and 41d on the short side, in other words, the inner surface 41d on the positive side of the Y-axis direction of the through hole 41, is an example of a second side surface. The front surface 17xc and the back surface 17xd of the sensor device 17x are an example of two opposing surfaces.

The fixing portion 65a is provided along the short side on the negative Y-axis direction side in the through hole 41. Although not shown, a fixing portion having a symmetrical structure to the fixing portion 65a is provided on the lower surface 15b of the substrate 15.
The fixing portion 67a is provided along the short side on the positive side in the Y axis direction in the through hole 41. Although not shown, a fixing portion having a symmetrical structure to the fixing portion 67a is provided on the lower surface 15b of the substrate 15.

The substrate 15 and the sensor device 17x are joined by a fixing portion 65a, a fixing portion 67a having a structure symmetrical to the fixing portion 65a, and a fixing portion having a structure symmetrical to the fixing portion 67a. In other words, the sensor device 17x is fixed to the substrate 15 at six points by each fixing portion. Therefore, the fixed state of the sensor device 17x is prevented from changing due to changes over time, etc., and the characteristics of the sensor device 17x are prevented from changing. Note that the fixing portions 61a and 61b may be omitted, or the fixing portions 62a and 62b described in the first embodiment may be added.

In the above-described embodiment, the sensor module 100 is described as a six-axis motion sensor, but the sensor module 100 is not limited to a six-axis motion sensor. For example, the sensor module 100 may be a three-axis angular velocity sensor having an X-axis angular velocity sensor, a Y-axis angular velocity sensor, and a Z-axis angular velocity sensor, or a three-axis acceleration sensor having an X-axis acceleration sensor, a Y-axis acceleration sensor, and a Z-axis acceleration sensor.
Furthermore, the sensor module 100 may be configured without one or both of the outer case 1 and the inner case 20. In other words, the board 15 or a circuit configuration equivalent to the board 15 may be referred to as the sensor module 100. For example, the board 15 or a circuit configuration equivalent to the board 15 may be incorporated into a circuit board of a mounted device.

In the above-described embodiment, as a preferred example, the sensor device 17x is fixed to the substrate 15 at four points by the respective fixing parts. However, depending on the required performance, one of the four fixing parts may be omitted, and the sensor device 17x may be fixed to the substrate 15 at three points.

In the above-described embodiment, the positions at which the through holes 41 and 42 are provided are not limited to the positions shown in FIG. 4. For example, the through hole 41 may be provided between the sensor device 17z and the sensor device 18. Furthermore, the through hole 42 may be provided between the sensor device 18 and the connector 16.

As described above, according to the sensor module 100 of the present embodiment, the following effects can be obtained.
The sensor module 100 of the present embodiment includes a substrate 15 having an upper surface 15a of the substrate 15 as a first surface and a through hole 41 as a first through hole, a sensor device 17z as a first sensor device provided on the upper surface 15a of the substrate 15 and detecting a physical quantity of a first axis, a sensor device 17x as a second sensor device provided in the through hole 41 and detecting a physical quantity of a second axis perpendicular to the first axis, a fixing portion 61a as a first fixing portion fixing the sensor device 17x to an inner surface 41a on the positive side in the X-axis direction of the through hole 41 as a first side surface within the through hole 41, and a fixing portion 62a as a second fixing portion fixing the sensor device 17x to an inner surface 41b on the negative side in the X-axis direction of the through hole 41 as a second side surface within the through hole 41.

In this manner, the sensor module 100 of this embodiment includes a fixing portion 61a that fixes the sensor device 17x to the inner surface 41a on the positive side in the X-axis direction within the through hole 41 in the substrate 15, and a fixing portion 62a that fixes the sensor device 17x to the inner surface 41b on the negative side in the X-axis direction within the through hole 41 in the substrate 15.
Therefore, it is possible to suppress changes in the characteristics of the sensor device 17x over time, and to improve the reliability of the characteristics of the sensor device 17x over time.

In the sensor module 100 of this embodiment, the fixing part 61a as the first fixing part is arranged on the right side 17xa of one of the two opposing faces of the sensor device 17x as the second sensor device, and the fixing part 62a as the second fixing part is arranged on the left side 17xb of the other of the two opposing faces of the sensor device 17x.

Therefore, the sensor device 17x is fixed to the two inner surfaces 41a, 41b of the through hole 41 of the substrate 15 by the fixing parts 61a and 62a arranged on the two opposing surfaces of the sensor device 17x. Therefore, compared to the sensor device described in Patent Document 1 in which only one surface of the sensor device is fixed to the substrate, the sensor device of this embodiment can better suppress changes over time in the characteristics of the sensor device 17x.

In the sensor module 100 of this embodiment, the fixing part 61a as the first fixing part is arranged on the right side 17xa side of one of the two consecutive faces of the sensor device 17x as the second sensor device, and the fixing part 65a as the second fixing part is arranged on the front side 17xc side of the other of the two consecutive faces of the sensor device 17x.

Therefore, the sensor device 17x is fixed to the two inner surfaces 41a, 41c of the through hole 41 of the substrate 15 by the fixing parts 61a and 65a arranged on two consecutive surfaces of the sensor device 17x. Therefore, compared to the sensor device described in Patent Document 1 in which only one surface of the sensor device is fixed to the substrate, the sensor device of this embodiment can better suppress changes over time in the characteristics of the sensor device 17x.

The sensor module 100 of this embodiment has a lower surface 15b of the substrate 15 as a second surface that faces an upper surface 15a of the substrate 15 as a first surface, and the sensor device 17x as a second sensor device has a first portion 17x1 protruding from the upper surface 15a of the substrate 15 and a second portion 17x2 protruding from the lower surface 15b of the substrate 15.
Therefore, the change over time in the characteristics of the sensor device 17x inserted into the through hole 41 can be suppressed.

The sensor module 100 of this embodiment has solder 37a as a conductive portion that electrically connects the substrate 15 and a sensor device 17x as a second sensor device, and a fixing portion 61a as a first fixing portion is provided so as to cover the solder 37a.
In this manner, the fixing portion 61a is provided so as to cover the solder 37a, thereby improving the reliability of the electrical connection between the substrate 15 and the sensor device 17x and suppressing changes over time in the characteristics of the sensor device 17x.

In the sensor module 100 of this embodiment, the material of the fixing portion 61a serving as the first fixing portion and the material of the fixing portion 62a serving as the second fixing portion are the same.
Therefore, the effect of thermal stress is uniform, and changes in the characteristics of the sensor device 17x over time can be suppressed.

The sensor module 100 of this embodiment includes a substrate 15 having an upper surface 15a of the substrate 15 as a first surface, a through hole 41 as a first through hole, and a through hole 42 as a second through hole, a sensor device 17z provided on the upper surface 15a of the substrate 15 as a first sensor device that detects a physical quantity of a first axis, a sensor device 17x provided in the through hole 41 as a second sensor device that detects a physical quantity of a second axis perpendicular to the first axis, a sensor device 17y provided in the through hole 42 as a third sensor device that detects a physical quantity of a third axis perpendicular to the first axis and a sensor device 17y provided through the sensor device 17x. The fixing portion 61a is a first fixing portion that fixes the sensor device 17x to the inner surface 41a on the positive side in the X-axis direction of the through hole 41 as the first side surface in the through hole 41, the fixing portion 62a is a second fixing portion that fixes the sensor device 17x to the inner surface 41b on the negative side in the X-axis direction of the through hole 41 as the second side surface in the through hole 41, the fixing portion 63a is a third fixing portion that fixes the sensor device 17y to the inner surface 42a on the negative side in the Y-axis direction of the through hole 42 as the first side surface in the through hole 42, and the fixing portion 64a is a fourth fixing portion that fixes the sensor device 17y to the inner surface 42b on the positive side in the Y-axis direction of the through hole 42 as the second side surface in the through hole 42.

In this manner, the sensor module 100 of the present embodiment comprises a fixing portion 61a for fixing the sensor device 17x to the inner surface 41a on the positive side in the X-axis direction of the through hole 41 in the substrate 15, a fixing portion 62a for fixing the sensor device 17x to the inner surface 41b on the negative side in the X-axis direction of the through hole 41 in the substrate 15, a fixing portion 63a for fixing the sensor device 17y to the inner surface 42a on the negative side in the Y-axis direction of the through hole 42 in the substrate 15, and a fixing portion 64a for fixing the sensor device 17y to the inner surface 42b on the positive side in the Y-axis direction of the through hole 42 in the substrate 15.
Therefore, it is possible to suppress changes over time in the characteristics of the sensor devices 17x and 17y, and to improve the reliability over time of the characteristics of the sensor devices 17x and 17y.

In the sensor module 100 of this embodiment, the inner surface 41a on the positive side in the X-axis direction of the through hole 41 as the first side surface in the through hole 41 as the first through hole and the inner surface 41b on the negative side in the X-axis direction of the through hole 41 as the second side surface face each other, and the inner surface 42a on the negative side in the Y-axis direction of the through hole 42 as the first side surface in the through hole 42 as the second through hole and the inner surface 42b on the positive side in the Y-axis direction of the through hole 42 as the second side surface face each other.

Therefore, the sensor device 17x is fixed to each of the two opposing inner surfaces 41a, 41b of the through hole 41, and the sensor device 17y is fixed to each of the two opposing inner surfaces 42a, 42b of the through hole 42. Therefore, compared to the sensor device described in Patent Document 1 in which only one side of the sensor device is fixed to the substrate, it is possible to further suppress changes over time in the characteristics of the sensor device 17x and the sensor device 17y.

2. Embodiment 2
The sensor module 100 according to the second embodiment will be described with reference to FIGS. 11 to 12B.
Fig. 11 is a cross-sectional perspective view of the sensor module 100 according to the second embodiment, and is an explanatory diagram showing a cross-sectional structure cut at a position along line A-A in Fig. 2. Fig. 12A is an enlarged plan view showing a mounted state of the sensor device 17x. Fig. 12B is a cross-sectional view along line C-C in Fig. 12A. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 11, the space between the upper surface 15a of the substrate 15 and the recess 31 of the inner case 20 is filled with a filling member 50. The filling member 50 may be, for example, a molding material used in semiconductor packaging, but it is preferable to use a material whose glass transition temperature (TG) is lower than the glass transition temperature of the material used for the fixing parts 61a, 62a, 63a, 64a, etc. described above.

As shown in Figures 12A and 12B, the filling member 50 is provided on the upper surface 15a of the substrate 15, covering the sensor device 17x, the fixing portion 61a, the fixing portion 62a, and the through-hole 41. More specifically, the filling member 50 is provided so as to fill the gaps between the substrate 15 and the right side surface 17a, the left side surface 17xb, the front surface 17xc, and the back surface 17xd of the sensor device 17x.

In other words, the right side surface 17a of the sensor device 17x is fixed to the inner surface 41a on the positive side in the X-axis direction of the through hole 41 by the fixing part 61a and the filling member 50 on the upper surface 15a side of the substrate 15, and the fixing part 61b on the lower surface 15b side of the substrate 15 (not shown). The left side surface 17xb of the sensor device 17x is fixed to the inner surface 41b on the negative side in the X-axis direction of the through hole 41 by the fixing part 62a and the filling member 50 on the upper surface 15a side of the substrate 15, and the fixing part 62b on the lower surface 15b side of the substrate 15 (not shown). The front surface 17xc of the sensor device 17x is fixed to the inner surface 41c on the negative side in the Y-axis direction of the through hole 41 by the filling member 50. The back surface 17xd of the sensor device 17x is fixed to the inner surface 41d on the positive side in the Y-axis direction of the through hole 41 by the filling member 50.

In this way, the sensor device 17x is further fixed by the filling member 50 in addition to the fixing parts 61a, 61b, 62a, and 62b. This makes it possible to further suppress changes in the characteristics of the sensor device 17x over time.

In addition, the sensor device 17x is fixed by the fixing parts 61a and 61b, and the fixing parts 62a and 62b, which are arranged in a symmetrical structure on the upper surface 15a and the lower surface 15b of the substrate 15. Therefore, even if the filling member 50 is provided only on the upper surface 15a side of the substrate 15, it is possible to suppress the influence of stress caused by the filling member 50 and suppress changes in the characteristics of the sensor device 17x over time. The filling member 50 may also be provided between the lower surface 15b and the bottom surface 5 of the substrate 15. The filling member 50 may be omitted.

In this embodiment, the inner surface 41c on the negative side of the through hole 41 in the Y axis direction is an example of a third side surface, and the filling member 50 is an example of a third fixing part. Also, the inner surface 41d on the positive side of the through hole 41 in the Y axis direction is an example of a fourth side surface, and the filling member 50 is an example of a fourth fixing part.

As described above, the sensor module 100 of embodiment 2 can provide the following advantages in addition to the advantages of embodiment 1.

In the sensor module 100 of the second embodiment, the through hole 41 as the first through hole has an inner surface 41c on the negative side of the Y axis direction of the through hole 41 as a third side surface that is continuous with the inner surface 41a on the positive side of the X axis direction of the through hole 41 as the first side surface, and an inner surface 41d on the positive side of the Y axis direction of the through hole 41 as a fourth side surface that is continuous with the inner surface 41b on the negative side of the X axis direction of the through hole 41 as the second side surface, and is provided with a filling member 50 as a third fixing part that fixes the sensor device 17x as the second sensor device to the inner surface 41c on the negative side of the Y axis direction of the through hole 41, and a filling member 50 as a fourth fixing part that fixes the sensor device 17x to the inner surface 41d on the positive side of the Y axis direction.

Therefore, the sensor device 17x is further fixed by the filling member 50. This further suppresses changes in the characteristics of the sensor device 17x over time.

3. Embodiment 3
In the third embodiment, an electronic device including the sensor module 100 will be described.
In the following, examples of electronic devices will be described, including a moving object such as an automobile and a portable device such as a smartphone.

13 is a perspective view of a portable device as an electronic device according to the third embodiment, and shows the configuration of a smartphone 110 as an example of the portable device.

The smartphone 110 is equipped with the sensor module 100 .
The detection signal detected by the sensor module 100 is output to the control unit 111, and the control unit 111 recognizes the posture and behavior of the smartphone 110 from the received detection signal and can change the display image being displayed on the display unit, sound an alarm or sound effect, or drive a vibration motor to vibrate the main body.

The sensor module 100 may also be mounted on portable devices other than the smartphone 110. For example, the sensor module 100 may be mounted on portable devices such as smartwatches, portable activity meters, HMDs (Head Mounted Displays), mobile PCs (Personal Computers), tablet PCs, cameras, and PDAs (Personal Digital Assistants). This allows the portable device to recognize its posture and behavior based on the detection signal from the sensor module 100, and to change the displayed image, sound an alarm or sound effect, or drive a vibration motor to vibrate the main body.

In this manner, in this embodiment, a mobile device such as a smartphone 110 is equipped with a sensor module 100. Therefore, according to this embodiment, the reliability of a mobile device equipped with the sensor module 100 can be improved.

3.2. Overview of Mobile Object FIG. 14 is a perspective view of a mobile object serving as an electronic device according to the third embodiment, showing the configuration of an automobile 130 as an example of the mobile object.

The automobile 130 is equipped with the sensor module 100 .
The sensor module 100 detects the attitude of the vehicle body 131 and outputs a detection signal. The detection signal includes an angular velocity signal and an acceleration signal. The detection signal of the sensor module 100 is supplied to a vehicle body attitude control device 132 that controls the attitude of the vehicle body 131.
The vehicle body attitude control device 132 detects the attitude of the vehicle body 131 based on the signal, and controls the hardness of the suspension and the brakes on each wheel 133 according to the detection result.

The detection signal of the sensor module 100 may also be used in other devices, such as keyless entry, immobilizers, car navigation systems, car air conditioners, antilock braking systems (ABS), airbags, TPMS (Tire Pressure Monitoring Systems), engine controls, inertial navigation control devices for autonomous driving, and ECUs (Electronic Control Units) for battery monitors in hybrid and electric vehicles.

The sensor module 100 may also be mounted on a moving body other than the automobile 130. Examples of the moving body include a bipedal robot, a train, a radio-controlled airplane, a radio-controlled helicopter, a drone, agricultural machinery, and construction machinery. A moving body equipped with the sensor module 100 can utilize the detection signal of the sensor module 100 for posture control and position measurement of the moving body.

In this manner, in this embodiment, a moving body such as an automobile 130 is equipped with a sensor module 100. Therefore, according to this embodiment, the reliability of a moving body equipped with a sensor module 100 can be improved.

Although the above describes a preferred embodiment, the present invention is not limited to the above embodiment. Furthermore, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above embodiment, and any configuration can be added.

1...outer case, 2...screw hole, 3...inside, 4...side wall, 5...bottom, 6...joint surface, 7...top, 8...bottom, 10...sensor unit, 12...joint member, 15...substrate, 15a...top, 15b...bottom, 16...connector, 17x, 17y, 17z, 18...sensor device, 17xa...right side, 17xb...left side, 17xc...front, 17xd...rear, 17x1...first part, 17x2...second part, 17ya...front, 17yb...rear, 17yd...right side, 19...control IC, 20...inner case, 21...opening, 22...joint surface, 27...top, 31 ...recess, 33a, 33b, 35a, 35b...electrodes, 37a, 37b...solder, 41, 42...through holes, 41a, 41b, 41c, 41d, 42a, 42b, 43a, 43b, 44a, 44b...inner surfaces, 43, 44...slits, 45, 46...notches, 50...filling member, 61a, 61b, 62a, 62b, 63a, 64a, 65a, 66a, 67a...fixing parts, 70...screws, 71...mounting surface, 100...sensor module, 110...smartphone, 111...control unit, 130...automobile, 131...vehicle body, 132...vehicle body attitude control device, 133...wheels.

Claims (9)

A substrate having a first surface and a first through hole;
A first sensor device provided on the first surface and configured to detect a physical quantity of a first axis;
a second sensor device provided in the first through hole and configured to detect a physical quantity of a second axis perpendicular to the first axis;
a first fixing portion that fixes the second sensor device to a first side surface within the first through hole;
a second fixing portion that fixes the second sensor device to a second side surface within the first through hole,
Sensor module. the first fixed portion is disposed on one of two opposing surfaces of the second sensor device;
the second fixing portion is disposed on the other of the two opposing surfaces of the second sensor device;
The sensor module according to claim 1 . the first fixing portion is disposed on one of two continuous surfaces of the second sensor device;
the second fixing portion is disposed on the other of two consecutive surfaces of the second sensor device;
The sensor module according to claim 1 . the substrate has a second surface opposite to the first surface,
the second sensor device has a first portion protruding from the first surface and a second portion protruding from the second surface.
The sensor module according to claim 1 . a conductive portion electrically connecting the substrate and the second sensor device;
The first fixed portion is provided to cover the conductive portion.
The sensor module according to claim 1 . The material of the first fixed portion and the material of the second fixed portion are the same.
The sensor module according to claim 1 . the first through hole has a third side surface continuous with the first side surface and a fourth side surface continuous with the second side surface,
a third fixing portion that fixes the second sensor device to the third side surface;
a fourth fixing portion that fixes the second sensor device to the fourth side surface,
The sensor module according to claim 1 . A substrate having a first surface and a first through hole and a second through hole;
A first sensor device provided on the first surface and configured to detect a physical quantity of a first axis;
a second sensor device provided in the first through hole and configured to detect a physical quantity of a second axis perpendicular to the first axis;
a third sensor device provided in the second through hole and configured to detect a physical quantity of a third axis perpendicular to the first axis and the second axis;
a first fixing portion that fixes the second sensor device to a first side surface within the first through hole;
a second fixing portion that fixes the second sensor device to a second side surface within the first through hole;
a third fixing portion that fixes the third sensor device to a first side surface within the second through hole;
a fourth fixing portion that fixes the third sensor device to a second side surface in the second through hole,
Sensor module. The first side surface and the second side surface of the first through hole face each other,
The first side surface and the second side surface of the second through hole face each other.
The sensor module according to claim 8.

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