JP2025006868A - Component Mounting System - Google Patents

Abstract

To suppress deterioration of soldering quality.SOLUTION: A component mounting system includes a mounting head that mounts components on a board to which solder has been applied, a heat ray head that applies a heat ray to the solder after the components have been mounted, a camera that images the solder while applying the heat ray, a learning unit that generates a learning model in which the image of the solder is input and the quality of the soldering is output, a determination unit that inputs the image of the solder taken by the camera into the learning model and determines whether the soldering is of good quality, and a control unit that stops the application of the heat ray when it is determined that the soldering is of good quality.SELECTED DRAWING: Figure 11

Description

The technology disclosed in this specification relates to a component mounting system.

In the technical field related to component mounting systems, a production system such as that disclosed in Patent Document 1 is known.

JP 2023-026021 A

The board on which the components are mounted may be a board with low heat resistance, such as a resin board. When soldering components to a board with low heat resistance, a local heating method is used. In such cases, soldering using heat rays such as laser light is usually used. The cream solder applied to the board in advance melts and a fillet is formed on the electrode part of the component, and the component is soldered to the board. If the high temperature is maintained for a long time to ensure soldering, it will damage the board. The temperature rise during heat ray irradiation varies depending on the size of the pad part of the board and the size of the lead part of the component, so it is difficult to control. For this reason, it is managed using a point detection temperature sensor, but it is not possible to manage the melting state of the entire solder. If the melting state of the solder cannot be properly managed, the quality of the soldering may deteriorate.

The technology disclosed in this specification aims to prevent deterioration of soldering quality.

According to the technology disclosed in this specification, a component mounting system is provided that includes a mounting head that mounts components on a board to which solder has been applied, a heat ray head that irradiates the solder with a heat ray after the components have been mounted, a camera that images the solder in parallel with the irradiation of the heat ray, a learning unit that generates a learning model in which the image of the solder is input and the quality of the soldering is output, a determination unit that inputs the image of the solder captured by the camera into the learning model and determines whether the soldering is of good quality, and a control unit that stops the irradiation of the heat ray when it is determined that the soldering is of good quality.

The technology disclosed in this specification prevents deterioration of soldering quality.

FIG. 1 is a perspective view showing a substrate and a component according to an embodiment. FIG. 2 is a perspective view showing a pallet for holding substrates according to the embodiment. FIG. 3 is an exploded perspective view showing a substrate and a pallet according to the embodiment. FIG. 4 is a diagram illustrating a component mounting system according to an embodiment. FIG. 5 is a plan view illustrating a schematic diagram of the mounting apparatus according to the embodiment. FIG. 6 is a perspective view showing a pallet and a stage according to the embodiment. FIG. 7 is an exploded perspective view showing a pallet and a stage according to the embodiment. FIG. 8 is a diagram illustrating a mounting head according to the embodiment. FIG. 9 is a diagram illustrating a laser irradiation device according to an embodiment. FIG. 10 is a diagram illustrating a schematic view of a part of a substrate on which components according to the embodiment are mounted. FIG. 11 is a block diagram showing a laser irradiation device according to an embodiment. FIG. 12 is a hardware configuration diagram of a controller according to the embodiment. FIG. 13 is an example of machine learning and use of the learning results according to the embodiment. FIG. 14 shows example images for learning and determination according to the embodiment.

The following describes the embodiment with reference to the drawings. In the embodiment, an XYZ Cartesian coordinate system is defined, and the positional relationship of each part is described with reference to this XYZ Cartesian coordinate system. The direction parallel to the X axis of the specified plane is the X axis direction. The direction parallel to the Y axis of the specified plane perpendicular to the X axis is the Y axis direction. The direction parallel to the Z axis perpendicular to the specified plane is the Z axis direction. The direction of rotation or tilt around the X axis direction is the θX direction. The direction of rotation or tilt around the Y axis direction is the θY direction. The direction of rotation or tilt around the Z axis direction is the θZ direction. In the embodiment, the specified plane and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. The specified plane may be inclined with respect to the horizontal plane. In the embodiment, the specified plane including the X axis and the Y axis is appropriately referred to as the XY plane.

[substrate]
1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. A protrusion may be provided on the surface of the substrate 1.

An electrical circuit is provided on the surface of the substrate 1. In an embodiment, the substrate 1 is formed by in-mold molding technology. The substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electrical circuit. The surface of the substrate 1 includes the surface of the film 1B.

Component 2 includes an electronic component. Component 2 may be a lead-type electronic component having leads protruding from a body. Component 2 may be a chip-type electronic component having no leads. An electronic device is manufactured by mounting component 2 on the surface of substrate 1.

[palette]
Fig. 2 is a perspective view showing a pallet 3 that holds a substrate 1 according to an embodiment. Fig. 3 is an exploded perspective view showing a substrate 1 and a pallet 3 according to an embodiment. The pallet 3 holds the substrate 1. In the embodiment, the substrate 1 is handled while being held by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1, and a clamp mechanism 5 that fixes the substrate 1.

The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B that are provided on both the +Y side and the -Y side of the base portion 4A, and a number of pin portions 4C that support the substrate 1 from both the +Y side and the -Y side.

The base portion 4A is plate-shaped with multiple openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are spaced apart from each other in the Y-axis direction. One guard portion 4B protrudes to the +Z side from the end on the +Y side of the top surface of the base portion 4A. The other guard portion 4B protrudes to the +Z side from the end on the -Y side of the top surface of the base portion 4A.

Each of the multiple pin portions 4C protrudes from the top surface of the base portion 4A to the +Z side. Some of the pin portions 4C are positioned on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are positioned on the -Y side of the center of the base portion 4A. The multiple pin portions 4C positioned on the +Y side of the center of the base portion 4A support the end of the substrate 1 on the +Y side. The multiple pin portions 4C positioned on the -Y side of the center of the base portion 4A support the end of the substrate 1 on the -Y side.

The clamp mechanism 5 is provided on the support member 4. The clamp mechanism 5 fixes the substrate 1 to the support member 4. The clamp mechanism 5 includes a pair of support parts 5A that support the end of the substrate 1 on the -X side, and a movable part 5B that supports the end of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, whereby the substrate 1 is sandwiched between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[Component mounting system]
Fig. 4 is a diagram illustrating a component mounting system 10 according to an embodiment. As illustrated in Fig. 4, the component mounting system 10 includes a mounting device 12, a preheating device 13, and a laser irradiation device 14. The mounting device 12, the preheating device 13, and the laser irradiation device 14 form a production line for electronic devices.

The mounting device 12 mounts the component 2 on the board 1. At least one mounting device 12 is provided in the production line. Note that multiple mounting devices 12 may be provided.

Figure 5 is a plan view showing a schematic diagram of a mounting device 12 according to an embodiment. The mounting device 12 includes a base member 18, a transport device 19, a stage 20, a stage movement device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a board camera 25, a height sensor 26, a head movement device 27, and a chamber 29.

The base member 18 supports each of the transport device 19, the stage 20, the stage movement device 21, the component supply device 22, the mounting head 24, and the head movement device 27.

The transport device 19 transports the pallet 3 holding the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 to a processing position of the mounting device 12. The processing position is defined by the transport path of the transport device 19.

The conveying device 19 has a conveying belt 19A that conveys the pallet 3 in the X-axis direction, and a guide member 19B that guides the pallet 3.

The guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are spaced apart from each other in the Y-axis direction. One guide member 19B is positioned on the +Y side of the pallet 3. The other guide member 19B is positioned on the -Y side of the pallet 3.

The conveyor belt 19A is circular. A pair of conveyor belts 19A are provided. The conveyor belts 19A are supported by a guide member 19B via a drive pulley and a driven pulley. The conveyor belts 19A are hung on the drive pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

Of the pair of conveyor belts 19A, the conveyor belt 19A located on the +Y side supports the +Y side end of the underside of the pallet 3. The conveyor belt 19A located on the -Y side supports the -Y side end of the underside of the pallet 3. The pallet 3 is conveyed in the X-axis direction by the drive pulley rotating due to a drive motor (not shown).

One guide member 19B can be moved in the Y-axis direction relative to the other guide member 19B by an actuator (not shown). When one guide member 19B and the other guide member 19B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 19A is released.

Figure 6 is a perspective view showing the pallet 3 and stage 20 according to the embodiment. Figure 7 is an exploded perspective view showing the pallet 3 and stage 20 according to the embodiment.

The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 from the -Z side when it is transported to the processing position. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into the holes 4D of the pallet 3. The stage 20 and the pallet 3 are positioned by inserting the positioning members 20A into the holes 4D from the -Z side of the pallet 3. A hook is provided on the upper end of the positioning member 20A. The hook is hooked onto the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hooked onto the pallet 3 to fix the stage 20 and the pallet 3.

The stage movement device 21 moves the stage 20. In the embodiment, the stage movement device 21 moves the stage 20 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage movement device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

After the pallet 3 is transported to the processing position by the transport device 19, the +Y side guide member 19B moves in the +Y direction away from the other guide member 19B, and the stage moving device 21 moves the stage 20 in the +Z direction. The +Y side guide member 19B moves in the Y axis direction away from the other guide member 19B, releasing the support of the pallet 3 by the transport belt 19A. The pallet 3 is transferred from the transport device 19 to the stage 20 by releasing the support of the pallet 3 by the transport belt 19A and moving the stage 20 in the +Z direction. With the pallet 3 supported by the stage 20, the stage moving device 21 moves the stage 20 in the +Y direction so that it is in the center of the two guide members 19B, making it possible to move the stage 20 in each of the Z axis direction, the θX direction, and the θY direction.

When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 is on the transport belt 19A, and the guide member 19B on the +Y side moves to the -Y side until the other side of the pallet 3 is on the transport belt 19A. After the hook provided at the upper end of the positioning member 20A is released, the stage 20 moves in the -Z direction by the stage movement device 21. This releases the support of the pallet 3 by the stage 20, and the pallet 3 is supported by the transport belt 19A.

The component supply device 22 supplies the components 2. The component supply device 22 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supply device 22 supplies at least one component 2 of the plurality of components 2 to a supply position. The component supply device 22 is disposed on the -Y side of the conveying device 19. Note that the component supply device 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

The mounting head 24 mounts the components 2 on the board 1. The mounting head 24 supports a number of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them on the board 1. The mounting head 24 is movable between a supply position where the components 2 are supplied from the component supply device 22 and a processing position where the board 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts them on the surface of the board 1 placed at the processing position.

The head moving device 27 moves the mounting head 24. In the embodiment, the head moving device 27 moves the mounting head 24 in each of the X-axis direction and the Y-axis direction. The head moving device 27 has an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction, and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. The mounting head 24 moves in the X-axis direction by operating the X-axis moving device 27X. The Y-axis moving device 27Y moves the mounting head 24 in the Y-axis direction by operating the X-axis moving device 27X.

FIG. 8 is a schematic diagram of a mounting head 24 according to an embodiment. As shown in FIG. 8, the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction and hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 and the component 2 in contact, a suction operation is performed from the opening provided at the lower end of the nozzle 23, thereby suctioning and holding the component 2 at the lower end of the nozzle 23. The suction operation from the opening is released, thereby releasing the component 2 from the nozzle 23. The nozzle 23 may be a gripper nozzle that clamps and holds the component 2.

The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in both the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of the shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to each of the plurality of shafts 23A. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to each of the plurality of shafts 23A. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shaft 23A in the Z-axis direction and the θZ direction to move the nozzle 23.

The nozzle 23 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by the head moving device 27 and the nozzle moving device 28. By moving the nozzle 23, the part 2 held by the nozzle 23 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

The board camera 25 images the board 1. In an embodiment, the board camera 25 images the surface of the board 1 from the +Z side of the board 1. The board camera 25 is provided on the mounting head 24. The board camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The board camera 25 can image the alignment marks provided on the surface of the board 1.

The height sensor 26 detects a height indicating the position of the surface of the substrate 1 in the Z-axis direction. The height sensor 26 is provided on the mounting head 24. The height sensor 26 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. In the embodiment, the height sensor 26 is a laser positioning sensor. The height sensor 26 can detect the distance from the mounting head 24 to the substrate 1 by irradiating the surface of the substrate 1 with laser light from the +Z side of the substrate 1 and receiving the laser light reflected by the surface of the substrate 1. By detecting the distance from the mounting head 24 to the substrate 1, the height of the surface of the substrate 1 is detected.

The chamber 29 has an internal space that accommodates the base member 18, the transport device 19, the stage 20, the stage movement device 21, the component supply device 22, the mounting head 24, the head movement device 27, and the nozzle movement device 28.

In the embodiment, the mounting device 12 has a dispenser 34 that applies cream solder to the board 1. The dispenser 34 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the transport device 19. The dispenser 34 and the mounting head 24 can move separately. After the cream solder is applied to the surface of the board 1 by the dispenser 34, the mounting head 24 mounts the components 2 on the board 1. The mounting head 24 mounts the components 2 on the board 1 to which the cream solder has been applied. The board 1 on which the components 2 have been mounted by the mounting device 12 is transported to the preheating device 13 while being fixed to the pallet 3.

The preheating device 13 reduces the liquid components of the cream solder applied to the substrate 1. The cream solder contains flux and metallic solder balls dispersed in the flux. The preheating device 13 reduces the liquid components of the cream solder by activating the flux and vaporizing at least a portion of the liquid components.

The preheating device 13 includes a base member 35, a transport device 36 for transporting the pallet 3, a heater 37 for heating the substrate 1, and a chamber 38.

The base member 35 supports the conveying device 36. The conveying device 36 conveys the pallet 3 holding the substrate 1 in the X-axis direction. The conveying device 36 has a conveying belt 36A that conveys the pallet 3 and a guide member 36B that guides the pallet 3.

The heater 37 heats the substrate 1 so that at least a portion of the liquid component of the solder paste flux is vaporized.

The chamber 38 has an internal space in which the base member 35, the conveying device 36, and the heater 37 are housed.

The preheating device 13 heats the substrate 1 held on the pallet 3 so that the liquid component of the cream solder is reduced. The preheating device 13 heats the substrate 1 to a temperature lower than the melting point of the cream solder. The preheating device 13 heats the substrate 1, for example, for 10 minutes at a temperature between 80°C and 100°C. The substrate 1 preheated by the preheating device 13 is transported to the laser irradiation device 14 while being fixed to the pallet 3.

The laser irradiation device 14 irradiates the cream solder with laser light so that the cream solder melts. The laser irradiation device 14 includes a base member 39, a transport device 40 that transports the pallet 3, a stage 41 that supports the pallet 3, a stage movement device 42 that moves the stage 41, a laser head 43 that emits laser light, a fillet camera 45 that images the board 1, and a chamber 44.

The base member 39 supports the transport device 40, the stage 41, the stage moving device 42, and the laser head 43.

The conveying device 40 conveys the pallet 3 holding the substrate 1 in the X-axis direction. The conveying device 40 has a conveying belt 40A that conveys the pallet 3, and a guide member 40B that guides the pallet 3. The structure and function of the conveying device 40 are substantially the same as the structure and function of the conveying device 19.

The stage 41 supports the pallet 3 from the -Z side. The stage movement device 42 moves the stage 41 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The structure and function of the stage 41 are substantially the same as the structure and function of the stage 20.

After the mounting head 24 mounts the component 2 on the board 1 via the cream solder, the laser head 43 irradiates the cream solder with laser light. The laser head 43 irradiates the cream solder with laser light to melt the cream solder. The laser head 43 moves in the X-axis direction, Y-axis direction, and Z-axis direction on the +Z side of the conveying device 40. The laser head 43 is an example of a heat ray head. The laser light emitted from the laser head 43 is an example of a heat ray.

The fillet camera 45 images the substrate 1. The fillet camera 45 images at least the cream solder. In an embodiment, the fillet camera 45 images the surface of the substrate 1 from the +Z side of the substrate 1. The fillet camera 45 is provided on the laser head 43. The fillet camera 45 moves in the X-axis direction, the Y-axis direction, and the Z-axis direction together with the laser head 43.

The chamber 44 has an internal space in which the base member 39, the transport device 40, the stage 41, the stage movement device 42, and the laser head 43 are housed.

[Laser irradiation device]
Fig. 9 is a diagram that illustrates a laser irradiation device 14 according to the embodiment. Fig. 10 is a diagram that illustrates a part of a board 1 on which a component 2 according to the embodiment is mounted.

The stage 41 of the laser irradiation device 14 supports the pallet 3 holding the substrate 1. The substrate 1 is supported by the stage 41 via the pallet 3. The stage 41 is rotatable about the rotation axis Rm.

The component 2 is mounted on the substrate 1 via cream solder 90. As shown in FIG. 10, the component 2 has a main body portion 2A and an electrode portion 2B. The substrate 1 has a pad 1C. The electrode portion 2B and the pad 1C are soldered together with the cream solder 90.

In the laser irradiation device 14, the cream solder 90 is irradiated with the laser light emitted from the laser head 43. The cream solder 90 is heated by the laser light, and the cream solder 90 melts. The melted cream solder 90 is cooled, and a fillet is formed between the electrode portion 2B and the pad 1C, thereby soldering the component 2 to the board 1. The fillet refers to the portion where solder is piled up on the surface of the board 1.

In the embodiment, the cream solder 90 is irradiated with laser light after the liquid component of the cream solder 90 is reduced in the preheating device 13. Since the cream solder 90 is irradiated with laser light in a state in which the liquid component of the cream solder 90 is reduced, solder balls caused by bumping of the cream solder 90 are suppressed.

The fillet camera 45 is fixed to the laser head 43. The fillet camera 45 images the cream solder 90 provided on the surface of the substrate 1. The fillet camera 45 images the cream solder 90 in parallel with the irradiation of the cream solder 90 with the laser light. That is, the fillet camera 45 images the cream solder 90 at least during the period when the laser light is being emitted from the laser head 43. The fillet camera 45 images the cream solder while the cream solder 90 is being irradiated with the laser light.

If the cream solder 90 is irradiated with laser light for a long period of time in order to ensure reliable soldering, the board 1 may be damaged. If the cream solder 90 is not irradiated with laser light insufficiently, the quality of the soldering may be reduced. In other words, if the cream solder 90 is not irradiated with laser light insufficiently, the board 1 and the component 2 may not be soldered sufficiently. Conventionally, the melted state of the cream solder 90 was managed by a point detection temperature sensor, but the method using a temperature sensor can only manage the melted state of a localized portion of the cream solder 90.

In the embodiment, the melted state of the cream solder 90 is managed based on an image of the cream solder 90. Specifically, the irradiation time of the laser light is managed based on the image of the cream solder 90. According to the embodiment, the melted state of the entire solder is managed, so that it is possible to suppress damage to the substrate 1 while suppressing deterioration in the quality of the soldering.

Figure 11 is a block diagram showing the laser irradiation device 14 according to the embodiment. The laser irradiation device 14 has a laser head 43, a fillet camera 45, and a controller 16. The controller 16 controls the laser irradiation device 14.

FIG. 12 is a hardware configuration diagram of the controller 16 according to the embodiment. The controller 16 includes a computer system. The controller 16 has a processor 47 such as a CPU (Central Processing Unit), a main memory 48 including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 49, and an interface 50 including an input/output circuit. The functions of the controller 16 are stored in the storage 49 as a computer program. The processor 47 reads the computer program from the storage 49 and expands it in the main memory 48, and executes a predetermined process according to the computer program. The computer program may be distributed to the controller 16 via a network.

As shown in FIG. 11, an inspection device 15 is connected to the laser irradiation device 14. The controller 16 can communicate with the inspection device 15. The inspection device 15 includes a board appearance inspection device (AOI: Automated Optical Inspection) that inspects the state of the board 1 after the component 2 is soldered. The inspection device 15 can inspect the quality of the soldering.

In an embodiment, the quality of the soldering includes the fillet shape of the cream solder 90. The inspection device 15 inspects the fillet shape. As described above, the cream solder 90 is melted by irradiating the cream solder 90 with laser light from the laser head 43. The melted cream solder 90 is cooled to form a fillet of the cream solder 90. The quality of the soldering can be evaluated by the fillet shape. If the fillet shape is good (if it is the target shape), the soldering is evaluated as good. If the fillet shape is poor (if it differs from the target shape), the soldering is evaluated as poor. The inspection results of the inspection device 15 are transmitted to the controller 16.

The controller 16 has a control unit 51, a fillet formation determination unit 52, and a machine learning unit 53.

The control unit 51 controls the laser head 43. The control unit 51 controls the laser oscillation. The control unit 51 can control the irradiation time of the laser light.

The fillet formation determination unit 52 determines whether the soldering is of good quality based on the image of the cream solder 90 captured by the fillet camera 45. That is, the fillet formation determination unit 52 determines whether the fillet shape of the cream solder 90 is of good quality based on the image of the cream solder 90 captured by the fillet camera 45.

The machine learning unit 53 takes an image of the cream solder 90 as input and generates a learning model that outputs the quality of soldering. The machine learning unit 53 uses, for example, an image of the cream solder 90 in a molten state and the inspection results of the inspection device 15 as training data, takes an image of the cream solder 90 in a molten state as input, and generates a learning model that outputs the fillet shape of the cream solder 90.

The fillet formation determination unit 52 inputs an image of the cream solder 90 in a molten state (a state in which laser light is being irradiated) captured by the fillet camera 45 into the learning model and determines whether the soldering is of good quality. That is, the fillet formation determination unit 52 predicts the fillet shape of the cream solder 90 after it has cooled based on the image of the cream solder 90 in a molten state (a state in which laser light is being irradiated) and the learning model, and determines whether the predicted fillet shape is of good quality.

The control unit 51 stops the irradiation of the laser light when the fillet formation determination unit 52 determines that the soldering is of good quality. This prevents excessive irradiation of the laser light, i.e., prevents damage to the board 1, and prevents deterioration of the soldering quality.

[Operation of laser irradiation device]
An example of the operation of the laser irradiation device 14 will be described below. Fig. 13 is a flowchart showing the operation of the laser irradiation device 14 according to the embodiment. Fig. 14 is a diagram showing a schematic diagram of a fillet state according to the embodiment. Fig. 14 shows an example of a learning image and a judgment image according to the embodiment.

The fillet camera 45 can capture video. The machine learning unit 53 extracts images from the video of fillet formation when the cream solder 90 is irradiated with laser light, as shown in FIG. 14, and labels the extracted images with the state of the fillet (step S1). The labels attached to the images include a label indicating that the fillet is "before formation" and a label indicating that the fillet is "after formation". For example, the machine learning unit 53 may label an image taken just before the end of soldering under normal time management as "after formation" and label an image taken before the end as "before formation".

The machine learning unit 53 performs supervised machine learning on the labeled images to generate a learning model (step S2).

The fillet formation determination unit 52 inputs an image of the cream solder 90 captured by the fillet camera 45, as shown in FIG. 14, into the learning model, and determines the state of the fillet from the image during soldering at any time. That is, the fillet formation determination unit 52 uses the learning model to determine whether the fillet is "before formation" or "after formation" from the image during soldering at any time (step S3).

The control unit 51 stops laser oscillation when the determination result of the fillet formation determination unit 52 changes from "before formation" to "after formation" of the fillet (step S4).

By controlling the laser oscillation time during soldering in the operations of steps S3 and S4, soldering is performed with minimal heating. The image used for the judgment is saved, and if the soldering is judged to be poor by the inspection device 15 in the subsequent process, the image can be labeled as "before fillet formation" and re-learned to improve the judgment accuracy.

If the laser irradiation device 14 is provided with a temperature sensor capable of detecting the temperature of the cream solder 90 (fillet temperature) and the temperature of the substrate 1 (substrate temperature), the reliability of the soldering can be improved by stopping the laser oscillation in step S4 described above after the determination result of the fillet formation determination unit 52 changes from "before fillet formation" to "after fillet formation", after the fillet temperature exceeds the designated temperature, and before the substrate temperature exceeds the designated temperature.

1...Substrate, 1A...Base material, 1B...Film, 1C...Pad, 2...Component, 2A...Main body, 2B...Electrode, 3...Pallet, 4...Support member, 4A...Base, 4B...Guard, 4C...Pin, 4D...Hole, 5...Clamp mechanism, 5A...Support, 5B...Moveable, 10...Component mounting system, 12...Mounting device, 13...Preheating device, 14...Laser irradiation device, 15...Inspection device, 16...Controller, 18...Base member, 19...Transport device, 19A...Transport belt, 19B...Guide member, 20...Stage, 20A...Positioning member, 21...Stage movement device, 22...Component supply device, 23...Nozzle, 23A...Shaft, 24...Mounting head, 25...Substrate camera, 26...Height sensor, 27...He head moving device, 27X...X-axis moving device, 27Y...Y-axis moving device, 28...nozzle moving device, 29...chamber, 34...dispenser, 35...base member, 36...transport device, 36A...transport belt, 36B...guide member, 37...heater, 38...chamber, 39...base member, 40...transport device, 40A...transport belt, 40B...guide member, 41...stage, 42...stage moving device, 43...laser head, 44...chamber, 45...fillet camera, 47...processor, 48...main memory, 49...storage, 50...interface, 51...control unit, 52...fillet formation determination unit (determination unit), 53...machine learning unit (learning unit), 90...cream solder (solder).

Claims (3)

a mounting head that mounts components on a board to which solder has been applied;
a hot wire head for irradiating the solder with a hot wire after the component is mounted;
a camera that captures an image of the solder in parallel with the irradiation of the heat rays;
A learning unit that generates a learning model using the image of the solder as an input and the quality of the soldering as an output;
a judgment unit that inputs an image of the solder captured by the camera into the learning model and judges whether the soldering is of good quality;
and a control unit that stops the irradiation of the heat rays when the soldering is determined to be of good quality.
Component mounting system. The soldering quality includes a fillet shape of the solder;
The determination unit determines whether or not the fillet shape is of good quality.
The component mounting system according to claim 1 . An inspection device for inspecting the quality of the soldering,
The learning unit generates the learning model using the image of the solder and the inspection result of the inspection device as training data.
The component mounting system according to claim 2 .

Images