JP2581257B2 - Method for manufacturing optical semiconductor device module - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical semiconductor element module incorporating an optical semiconductor element used in a communication device using an optical fiber as a transmission line.

[Prior Art] FIG. 15 is a view showing a conventional method of manufacturing an optical semiconductor device module disclosed in Japanese Patent Application Laid-Open No. Sho 57-118212, in which (1) shows a photodiode chip mounted on a glass window. Semiconductor device in an airtight package with
(2) is a lens, (31) is a receptacle, (32) is a cylindrical metal holder, and (33) is an optical semiconductor element holder that fixes the optical semiconductor element (1) at the center. The lens (2) is fixed to the receptacle (31) with an adhesive or solder. (41) is a ferrule, (42) is an optical fiber, (43) is a connection nut for fixing the ferrule (41) to the receptacle (31), and (101) is a receptacle (3).
Receptacle fixing jig where 1) is fixed, (104) holder fixing jig where the optical semiconductor element holder is fixed,
(121) is a light source (122) is an ammeter. One end of the optical fiber (42) is fixed to the ferrule (41).
The outer diameter of the ferrule (41) into which the ferrule (41) can be inserted is 1 μm to 10 μm in the receptacle (31).
A sleeve with a large inner diameter is formed.

Next, the manufacturing method will be described. Receptacle (3
Insert the ferrule (41) into the sleeve of (1) and fix the ferrule (41) to the receptacle (31) with the connection nut (43). Light is incident on the optical fiber from one of the optical fibers (42) by the light source (121). When all the light emitted from the optical fiber (42) fixed to the ferrule (41) is coupled to the optical semiconductor element (1) via the lens (2), the indicated value of the ammeter (122) becomes the largest. So ammeter (122)
Holder fixing jig (104) so that the indicated value of
Is moved in the X and Y axis directions in the figure (the X axis is perpendicular to the paper surface) by a fine movement stage. At this time, the moving order is as follows. First, at a position on the Z-axis, the holder fixing jig (104) is moved in the X-axis direction to find a position where the indicated value of the ammeter (122) becomes a peak.
Holder fixing jig (1
Move the 04) to find the position where the reading of the ammeter (122) reaches its peak. This is repeated sequentially, and the ammeter (1
Find the position where the indicated value of 22) becomes a peak. Further, while gradually moving the Z axis, the position where the indicated value of the ammeter (122) peaks in the XY plane is sequentially searched, and the indicated value of the ammeter (122) is measured in the X, Y, and Z axis directions. Find the peak position.

That is, by sequentially scanning one of the X and Y axes, the best coupling position in the XY plane between the optical fiber (42) and the semiconductor element (1) is searched for, and the XY direction is repeated many times in the Z axis direction. By searching for the best coupling position in the plane, the best coupling position between the optical fiber (42) and the optical semiconductor device (1) in the three-dimensional space composed of the X, Y, and Z axes in the figure is searched. I have.

Finally, at the position where the optical fiber (42) and the optical semiconductor element (1) are connected best, that is, at the position where the indicated value of the ammeter (122) is maximum, the receptacle (31) and the holder (32)
Are fixed by welding or the like, and then the holder (32) and the optical semiconductor element holder (33) are fixed by welding or the like.

[Problems to be Solved by the Invention] Since the conventional method for manufacturing an optical semiconductor element module is as described above, the XYZ axis direction is repeatedly searched for the best coupling position between an optical fiber and an optical semiconductor element. , Especially X, Y
It was necessary to scan the optical semiconductor element in the axial direction. Also,
In order to detect the peak of the indicated value of the ammeter, it is necessary to confirm that the indicated value decreases, and the optical fiber is moved from the position where the indicated value decreases to the peak position again, which is a wasteful movement. was there. Therefore, there is a problem that it takes time to find the best coupling position.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and it is an object of the present invention to find out the best coupling position between an optical fiber and an optical semiconductor element in a short time and to assemble the optical semiconductor element module in a short time. With the goal.

[Means for Solving the Problems] In a method for manufacturing an optical semiconductor element module according to the present invention, a pipe with a lens in which a lens is incorporated in a cylindrical pipe or a rod-shaped lens is inserted into a sleeve of the optical semiconductor element module. At the same time, the image of the light receiving part, light emitting part of the optical semiconductor element, or the light emitting part light emitting part formed by the lens in the optical semiconductor element module is transferred to the outside of the optical semiconductor element module with the lens or rod-shaped lens with the lens pipe. Observed by enlarging with the installed optical system, the center of the light receiving section of the optical semiconductor element, the center of the light emitting section, or the light receiving section formed by the lens in the optical semiconductor element module, the center of the image of the light emitting section is the optical semiconductor element. Position the sleeve or the optical semiconductor device or the lens in the optical semiconductor device module so that it is located on the central axis of the module sleeve. It is a method of adjusting and then fixing the sleeve and the optical semiconductor element.

Further, another method of manufacturing an optical semiconductor element module according to the present invention provides a pipe with a built-in lens having a mark indicating a central axis and a lens in a cylindrical pipe, or
Insert a rod-shaped lens with a mark indicating the central axis on the lens and the end face into the sleeve, and light-receiving part of the optical semiconductor element, light-emitting part, or light-receiving part made of the lens in the optical semiconductor element module, light-emitting part. The image of the part is magnified and observed with a lens of a pipe with a lens with a built-in lens or a lens of a rod-shaped lens with a mark, and an optical system installed outside the optical semiconductor element module. The center of the part, or the center of the image of the light-receiving part and the light-emitting part made by the lens in the optical semiconductor element module,
Adjust the position of the sleeve or the lens in the optical semiconductor element or the optical semiconductor element module so as to match the mark of the pipe with the built-in lens or the mark of the rod-shaped lens with the mark, and then fix the sleeve and the optical semiconductor element. Is the way.

Further, another method of manufacturing an optical semiconductor device module according to the present invention is a method of manufacturing a semiconductor device, comprising the steps of: forming a mark and a lens having a size substantially equal to an image of an electrode pattern of the optical semiconductor device or an electrode pattern formed by a lens in the optical semiconductor device module; Pipe with a lens with a built-in mark on the pipe in the shape of
Insert a marked rod-shaped lens provided on the end face of the lens with a mark having a size substantially equal to the image of the electrode pattern of the optical semiconductor element or the electrode pattern formed by the lens in the optical semiconductor element module into the sleeve of the optical semiconductor element module. At the same time, the image of the electrode pattern of the optical semiconductor element or the electrode pattern formed by the lens in the optical semiconductor element module is transferred to the lens of the pipe with the built-in mark lens or the rod-shaped lens with the mark and the optics installed outside the optical semiconductor element module. The image of the electrode pattern of the optical semiconductor element or the electrode pattern formed by the lens in the optical semiconductor element module matches the mark of the pipe with a built-in lens or the mark of the rod-shaped lens with a mark. A sleeve or an optical semiconductor device or an optical semiconductor device module Adjust the position of the lens in the Le, then, it is a method for fixing the sleeve and the optical semiconductor element.

[Operation] In the present invention, the light receiving section, the light emitting section,
Alternatively, the images of the light receiving portion and the light emitting portion of the optical semiconductor device formed by the lens in the optical semiconductor device module are magnified and observed by the lens inserted into the sleeve and the optical system installed outside the optical semiconductor device module. As a result, the position of the optical semiconductor element can be detected as a two-dimensional image, so that the position of the sleeve and the optical semiconductor element and, if there is a lens in the optical semiconductor element module, the position of this lens can be adjusted in a short time. can do.

According to another aspect of the present invention, in addition to the effect that the position of the optical semiconductor element can be adjusted in a short time by detecting the position of the optical semiconductor element as the two-dimensional image, a pipe with a built-in lens having a mark indicating the central axis or a pipe with a mark indicating the central axis is provided. By inserting the rod-shaped lens with the mark into the sleeve, the center axis of the sleeve can be easily detected. Therefore, the position of the sleeve and the optical semiconductor element, and the position of this lens if the lens is in the optical semiconductor element module, can be shortened. Can be adjusted in time.

Further, another method for manufacturing an optical semiconductor element module according to the present invention is characterized in that the position can be adjusted in a short time by detecting the position of the optical semiconductor element as the two-dimensional image, and the electrode pattern or the lens in the optical semiconductor element module can be adjusted. The use of a mark having a size substantially equal to the size of the image of the electrode pattern formed by the method described above has an effect that the adjustment can be performed in a short time without detecting the center of the light receiving portion of the optical semiconductor element.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a view for explaining a method of manufacturing an optical semiconductor element module according to the present invention. In FIG. 1, (3) shows a case where the outer diameter of the ferrule for inserting and connecting a ferrule is 1 μm to 10 μm.
a cylindrical sleeve having a larger inner diameter of μm; (4) a metal receptacle in which a screw and a sleeve (3) to which a connection nut for fixing the ferrule is connected are formed, and the other is cylindrical; (11) is a TV camera, (1)
2) is an optical system such as a microscope having an epi-illumination device inside, (13) is a monitor TV, and (14) is a TV camera (1).
(1) a coaxial cable for transmitting the signal of (1) to the monitor television (13), (102) an optical semiconductor element fixing jig to which the optical semiconductor (1) is fixed, (103) a coil for high-frequency heating, ( 110) is a ring-shaped solder. (51) is a light receiving part of a photodiode chip incorporated in the optical semiconductor element (1). The lens (2) is fixed to the receptacle (3). (61) is a refractive index distribution type rod-shaped lens, and (62) is one more than the inner diameter of the sleeve (3).
A small-diameter pipe of μm to 10 μm, (63) is a pipe with a lens in which a lens (61) is incorporated in a pipe (62).

FIG. 2 is a view showing an image of a light receiving portion or a light emitting portion of the optical semiconductor device formed by a lens in the optical semiconductor device. (53) is a line representing the optical path shown to indicate the optical position of the light receiving section (51) and the image (52) of the light receiving section, and (5)
6) is an image of the image (52) of the light receiving unit formed by the lens (61), and (55) is an optical path shown to indicate the optical position of the image (52) and the image (56) of the light receiving unit. Is a line representing. (54) is a ferrule contact surface to which the tip of the ferrule inserted in the sleeve contacts, and C is an optical axis.

Hereinafter, a method for manufacturing the optical semiconductor element module of the present invention will be described. When the pipe with lens (63) is inserted into the sleeve (3), the position of the receptacle fixing jig (101) must be set in advance so that the center axis of the pipe with lens (63) is located at the center of the monitor television (13). Is adjusted. Adjustment of the position of the receptacle fixing jig (101) for aligning the center axis of the pipe with lens (63) with the center of the monitor television (13) is performed only for the first one, by the inner wall of the sleeve (3) or the sleeve (3). The corner formed by the inner wall of (3) and the ferrule contact surface (54) is viewed by a television camera (11) via the optical system (12) or the like. Next, the receptacle (4) is fixed to a receptacle fixing jig (101), a ring-shaped solder (110) is mounted on the optical semiconductor element (1), and then the optical semiconductor element (1) is fixed to the optical semiconductor element fixing jig. Fix to (102). The light-receiving unit (51) of the optical semiconductor element (1) is illuminated by an epi-illumination type illumination device or another illumination device built in the optical system (12), and the light generated by the lens (2) and the lens (61). The image (56) of the light receiving section of the semiconductor element (1) is displayed on the monitor television (13) using the television camera (11) while being enlarged by the optical system (12).

Next, the optical semiconductor element (1) is placed on the XY plane via the optical semiconductor element fixing jig (102) so that the center of the image (56) of the light receiving section is aligned with the center axis of the sleeve (3) on the monitor television. Move within.

After the image of the light receiving section (56) coincides with the center axis of the sleeve (3), the coil (103) is energized to melt the ring-shaped solder (110) by high-frequency heating, and the receptacle (4) and the optical semiconductor element ( 1) is fixed.

The alignment accuracy between the center of the image of the light receiving section (56) and the central axis of the sleeve (3) is improved by enlarging the image of the light receiving section (56) using the optical system (12). The error can be 5 μm or less. In addition, since the image of the light receiving unit (56) is captured as a two-dimensional image, the distance and direction of the positional deviation between the center of the image of the light receiving unit (56) and the central axis of the sleeve (3) can be detected. Becomes shorter.

Next, another embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a view for explaining a method of manufacturing an optical semiconductor element module according to the present invention. FIG. 3 (5) shows a state in which a screw to which a connection nut for fixing a ferrule is connected and a sleeve (3) are formed. And the other is a metal receptacle with a cylindrical shape, (64) is an outer diameter sleeve (3)
Is a rod-shaped lens smaller by 1 μm to 10 μm than the inner diameter of the lens. The receptacle fixing jig is set so that the center axis of the sleeve (3) is located at the center of the monitor screen when viewed by the television camera (11) through the rod-shaped lens (64) and the optical system (12). ing. The rod-shaped lens (64) is inserted into the sleeve (3) until one end touches the ferrule contact surface.

Hereinafter, a method of manufacturing the module will be described.
The receptacle (5) is fixed to the receptacle fixing jig (101), and the ring-shaped solder (110) is attached to the optical semiconductor device (1).
After the optical semiconductor element (1) is mounted on the optical semiconductor element fixing jig (102), the distance between the receptacle (5) and the optical semiconductor element (1) is set to a predetermined value. The light receiving section (51) of the optical semiconductor element (1) is illuminated by an epi-illumination type illumination device or another illumination device built in (12). The light receiving section (51) of the optical semiconductor element (1) is observed with the television camera (11) via the rod-shaped lens (64) and the optical system (12). Optical semiconductor device (1)
The optical semiconductor element (1) is moved in XY via the optical semiconductor element fixing jig (102) so that the center of the light receiving section (51) is located at the center axis of the sleeve (3) on the monitor television (13). Move in a plane.

After the center of the light receiving portion (51) of the optical semiconductor element (1) coincides with the center axis of the sleeve (3) on the monitor television, the coil (103) for high-frequency heating is energized to form a ring-shaped solder (110). Is melted to fix the receptacle (5) and the optical semiconductor element (1).

The alignment accuracy between the center of the light receiving section (51) and the center axis of the sleeve (3) is determined by the optical system (12) and the rod-shaped lens (64).
It is improved by expanding the light receiving section (51) using
The alignment error can be 10 μm or less. In addition, since the light receiving section (51) is captured as a two-dimensional image, the light receiving section (5
Since the distance and direction of the positional deviation between the center of 1) and the central axis of the sleeve (3) can be detected, the adjustment time is shortened.

Next, another embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a view for explaining a method of manufacturing an optical semiconductor element module according to the present invention, wherein (67) is a lens having a convex spherical surface at both ends, (65) is a glass plate having a mark at the center, (66) is a pipe with a lens with a built-in mark in which a lens (67) is incorporated into a pipe (62) and a glass plate (65) is attached to one end. The glass plate (65) is the glass plate (65)
Is attached so as to be the center axis of the pipe (62). Fig. 5 shows a pipe with a lens with a built-in mark (66)
(70) is a mark indicating the central axis of the pipe (62). The glass plate (65) is attached to the pipe (6
The mark (70) is fixed to one end of (2), and the mark (70) is a glass plate (65) with a cross line formed by etching. The pipe with a lens with a built-in mark (66) has a flange for easy insertion into the sleeve (3). When the pipe (66) with the lens with a built-in mark is inserted into the sleeve (3) at the position of the lens (67), the light receiving section (5
The image of 1) is adjusted so that it is in the same plane as the mark (70) on the glass plate (65).

Hereinafter, the manufacturing method will be described. After the receptacle (4) is fixed to the receptacle fixing jig (101) and the ring-shaped solder (110) is mounted on the optical semiconductor element (1), the optical semiconductor element (1) is attached to the optical semiconductor element fixing jig (10).
Fix to 2). Insert the pipe with a lens with a built-in mark (66) into the sleeve (3).
6) The mark (70) is projected on the monitor television (13) by the television camera (11) via the optical system (12). Lens (6
An image of the optical semiconductor element (1) formed by the optical semiconductor element (1) and the light receiving section (51) is displayed on the monitor television (13) through the optical system (12). At this time, the light receiving section (51) is illuminated by an epi-illumination type illumination device or another illumination device built in the optical system (12). The light receiving unit (51) is moved in the Z-axis direction by moving the optical semiconductor element solid jig (102), so that the image of the light receiving unit (51) is clearly displayed on the monitor television (13).

Next, the optical semiconductor element (1) is moved through the optical semiconductor element fixing jig (102) in the XY plane so that the image center of the light receiving section (51) is aligned with the mark (70) on the monitor television (13). Go to After the image of the light receiving section (51) and the mark (70) match on the monitor television (13), the coil (103) is energized to melt the ring-shaped solder (110) by high-frequency heating, and the receptacle (5) The optical semiconductor element (1) is fixed. Lens (6
Image of the light receiving part (51) made by 1) and sleeve (3)
The alignment accuracy with the center axis is almost the same as in the above-described embodiment. Also, the adjustment time is shortened because the image of the light receiving section (51) formed by the lens (67) is captured as a two-dimensional image, as in the above-described embodiment. Further, by replacing the center axis of the sleeve (3) with the mark (70), the center axis of the sleeve (3) is aligned with the mark (70). It is not necessary to obtain the individual sleeves (3), and the working time is shortened.

Next, another embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a view for explaining a method of manufacturing an optical semiconductor element module according to the present invention.
This is a pipe with a built-in lens with a mark (1) incorporated in a pipe (62) and a glass plate (65) attached to one end. The glass plate (65) is marked with a pipe (62).
It is attached so that it may become the central axis of.

FIG. 7 is a view showing a pipe with a built-in mark lens (71), and (70) is a mark showing the central axis of the pipe (62). When an image of the light receiving portion (51) formed by the lens (2) is formed in substantially the same plane as the ferrule contact surface (54), the optical fiber of the ferrule inserted into the sleeve (3) and the optical semiconductor element (1) Is most connected. When the pipe with the lens with a built-in mark (71) is inserted into the sleeve (3), the mark (70) is also located on the same plane as the ferrule contact surface (54).

Hereinafter, the manufacturing method will be described. After the receptacle (4) is fixed to the receptacle fixing jig (101) and the ring-shaped solder (110) is mounted on the optical semiconductor element (1), the optical semiconductor element (1) is attached to the optical semiconductor element fixing jig (10).
Fix to 2). After setting the distance between the receptacle (4) and the optical semiconductor element (1) to a predetermined value, the pipe with the built-in lens (71) is inserted into the sleeve (3), and the mark ( 70) is projected on the monitor television (13) by the television camera (11) via the lens (61) and the optical system (12), and the position of the mark on the monitor television (13) is recorded. The light receiving section (51) is illuminated by an epi-illumination type illumination device or another illumination device built in the optical system (12). The light receiving section (51) is photographed by a television camera via the lens (61) and the optical system (12), and the optical semiconductor element fixing jig (10) is clearly displayed on the monitor television (13).
The optical semiconductor element (1) is moved in the Z-axis direction via 2) for adjustment. The optical semiconductor element (1) is fixed via the optical semiconductor element fixing jig (102) so that the center of the image of the light receiving section (51) displayed on the monitor television (13) is aligned with the position of the recorded mark (70). Moving. After the position of the mark recorded on the monitor television (13) matches the center of the image of the light receiving section (51), the coil (103) is energized to melt the ring-shaped solder (110) by high-frequency heating, and the receptacle ( 4) and the optical semiconductor element (1) are fixed.

As in the previous embodiment, the position of the light receiving unit (51) is captured as a two-dimensional image, so that the adjustment time is shortened, and the center axis of the sleeve (3) is replaced by the mark (70). Only the center of the light receiving section (51) needs to be centered on the mark (70), and the working time is shortened.

In the above embodiment, a pipe (71) with a lens with a built-in mark, in which a glass plate (65) having a mark (70) at the tip of the pipe (62) is used, is shown in FIG. May be used instead of the pipe with the built-in mark (71).

FIG. 8 is a view showing a rod-shaped lens with a mark which has the same function as the pipe with a lens with a built-in mark (71) and can be used in place of the pipe with a built-in lens with a mark (71). (72) is smaller than the inner diameter of the sleeve.
A rod-shaped lens having an outer diameter smaller by μm to 10 μm, (73) is a mark indicating the central axis of the outer diameter of the rod-shaped lens (72), and (72) is a mark (7) at one end of the rod-shaped lens (72).
This is a rod-shaped lens with a mark marked with 3). Mark (7
3) is a cross line formed by etching or the like. By replacing the rod-shaped lens with mark (74) with the pipe with lens with built-in mark (71), an optical semiconductor element module can be manufactured in the same manner as in the embodiment shown in FIG.

Next, another embodiment of the present invention will be described with reference to the drawings. 9 and 10 are views for explaining the method for manufacturing the optical semiconductor element module of the present invention, wherein (81) is a circular mark, and (80) is a mark (81) formed on one surface. The glass plate (82) is a pipe with a lens with a built-in mark to which the glass plate (80) is fixed at one end. Mark (81)
Is coincident with the center axis of the pipe (62). The position of the lens (67) is set so that the image of the light receiving section (51) formed by the lens (67) is substantially flush with the mark (81). Further, the size of the mark (81) is substantially the same as the electrode of the optical semiconductor element (1) made by the lens (67). FIG. 11 is a diagram showing an image of the electrode of the optical semiconductor element (1) formed by the mark (81) and the lens (67), taken by the television camera (11) via the optical system (12).
(91) is an image of the mark (81) on the CRT screen taken by the television camera (11) via the optical system (12), and (92) is a television camera (11) via the optical system (12). It is the image of the electrode of the optical semiconductor element (1) made with the lens (67) on the CRT screen which was image | photographed. The light receiving section (51) is located inside the electrode, and the center of the sleeve (3) is adjusted by adjusting the position of the optical semiconductor element (1) so that the mark image (91) and the electrode image (92) match. The axis and the center of the light receiving section (51) can be matched.

The manufacturing method is the same as that of the embodiment shown in FIG. 4 except that the position of the optical semiconductor element (1) is adjusted so that the mark image (91) and the electrode image (92) match.

Since the electrode of the optical semiconductor element (1) is captured as a two-dimensional image and the distance and direction of the positional shift between the image of the electrode and the mark having substantially the same size can be detected, the adjustment time is shortened. In particular, as in photodiodes and avalanche photodiodes, the diameter of the light-receiving part is from φ80 μm to φ400 μm.
In the case of an optical semiconductor device having a large size, it is not necessary to individually determine the centers of the light receiving portions, and the workability is good.

Next, another embodiment of the present invention will be described with reference to the drawings. 12 and 13 are views showing a method for manufacturing an optical semiconductor element module according to the present invention, wherein (83) is a pipe with a lens having a built-in mark, and (84) is a circular mark. The size of the mark (84) is almost the same as the image of the electrode of the optical semiconductor device (1) made by the lens (2). The image of the mark (84) and the electrode of the optical semiconductor device (1) is converted into a lens (61).
And magnify with the optical system (12) and shoot with the TV camera (11).

As in the embodiment shown in FIG. 9, by adjusting the position of the optical semiconductor element so that the image of the mark (84) and the image of the electrode of the optical semiconductor element coincide, the light of the ferrule inserted into the sleeve is adjusted. The optical semiconductor element module can be manufactured so that the fiber and the optical semiconductor element are optically coupled.

As in the above-described embodiment, the electrodes of the optical semiconductor device are captured as a two-dimensional image and adjusted so as to match the image of the mark (84) having substantially the same size as the image of the electrodes. Become. Also, in the case of an optical semiconductor device having a large light receiving section, the workability is good because it is not necessary to individually determine the center of the light receiving section. FIG. 14 has the same function as the pipe with a lens with a built-in mark (83). It is a figure which shows the rod-shaped lens with a mark which can be used instead of the pipe with a lens with a built-in mark (83), in which (72) is a rod-shaped lens such as a gradient index lens, and (85) is one end. This is a marked rod-shaped lens in which a mark (84) is formed. The outer diameter of the rod-shaped lens is smaller than the inner diameter of the sleeve by 0 μm to 10 μm. The mark (84) is formed on the end surface of the rod-shaped lens by etching or the like. By replacing the rod-shaped lens with mark (85) with a pipe with lens with built-in mark (83), an optical semiconductor element module can be manufactured in the same manner as the embodiment shown in FIG. In the example, the case where a photodiode as a light receiving element is described as an optical semiconductor element, but a light emitting diode as a light emitting element, a semiconductor laser, or the like may be used.
In this case, only the light receiving section in the above embodiment is replaced with the light emitting section, and the same effects as in the above embodiment can be obtained.

[Effects of the Invention] As described above, according to the present invention, the center of the light receiving section and the light emitting section of the optical semiconductor element is transmitted through the optical system installed outside the optical semiconductor element module and the lens inserted into the sleeve. Alternatively, the center of the image of the light-receiving part and the light-emitting part formed by the lens in the optical semiconductor element module is aligned with the sleeve or the mark indicating the central axis of the sleeve, or the light-receiving part, the electrode of the light-emitting part, or Since the image of the electrode of the light receiving section and the light emitting section formed by the lens in the optical semiconductor element module is matched with the mark or the mark image having substantially the same size as this electrode or the image of the electrode, the light receiving section and the light emitting section Since a part or the like can be detected as a two-dimensional image, there is an effect that the adjustment time is shortened.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a method for manufacturing an optical semiconductor device module according to an embodiment of the present invention, and FIG. 2 is a light receiving portion or light emitting portion of the optical semiconductor device formed by a lens in the optical semiconductor device and a lens inserted into a sleeve. Figure showing the image of the part, 3rd
FIG. 4 is a block diagram showing a method for manufacturing an optical semiconductor device module according to another embodiment of the present invention, FIG. 5 is a diagram showing a pipe with a lens with a built-in mark, and FIG. FIG. 7 is a structural view showing a method for manufacturing an optical semiconductor element module according to an embodiment, FIG. 7 is a view showing another pipe with a lens having a built-in mark, FIG.
FIG. 10 is a diagram showing a method of manufacturing an optical semiconductor device module according to another embodiment of the present invention, FIG. 10 is a diagram showing another pipe with a lens having a built-in mark, and FIG. Figure showing the image on the monitor TV screen with the mark, twelfth
FIG. 13 is a structural view showing a method for manufacturing an optical semiconductor device module according to another embodiment of the present invention. FIG. 13 is a view showing another pipe with a built-in lens, and FIG. 14 is a view showing another rod-shaped lens with a mark. FIG. 15 is a configuration diagram showing a method for manufacturing a conventional optical semiconductor element module. In the figure, (1) is an optical semiconductor device, (2) is a lens, and (3)
Is a sleeve, (12) is an optical system, (51) is a light receiving section, (52)
Is the image of the light receiving part (51) made by the lens (2), (61)
(67) is a lens, (63) is a pipe with a lens, (64) (7
2) is a rod-shaped lens, (66), (71), (82), (8)
3) is a pipe with a lens with a built-in mark, (74) and (85) are rod-shaped lenses with a mark, (70), (73), (81), and (84)
Is a mark, (62) is a pipe, (90) is an image of an electrode, (91)
Is an image of the mark. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (3)

(57) [Claims] 1. An optical fiber connector comprising a cylindrical sleeve into which a ferrule of an optical fiber connector can be inserted and connected, and an optical semiconductor element, wherein the optical fiber mounted on the ferrule is optically coupled to the optical semiconductor element. In the method for manufacturing an optical semiconductor element module, a pipe with a lens in which a lens is built in a cylindrical pipe whose outer diameter is equal to or less than the inner diameter of the sleeve, or a rod-shaped lens whose outer diameter is equal to or less than the inner diameter of the sleeve A lens is inserted into the sleeve, and a light-receiving portion or a light-emitting portion of the optical semiconductor element, or, if the optical semiconductor element module has a built-in lens, the lens is made by the built-in lens. The image of the light receiving section or light emitting section of the optical semiconductor element located on the hitting surface is transferred to the lens or pipe of the lens-equipped pipe. The image is taken out by a domed lens, the image is magnified and observed by an optical system installed outside the optical semiconductor element module, and the center of the light receiving unit or the light emitting unit, or the image of the light receiving unit or the light emitting unit is observed. After adjusting the position of the lens incorporated in the sleeve or the optical semiconductor element or the optical semiconductor element module so that the center is located on the central axis of the sleeve, the sleeve and the optical semiconductor element are fixed. A method for manufacturing an optical semiconductor element module. 2. A receptacle-type receptacle having a cylindrical sleeve into which a ferrule of an optical fiber connector can be inserted and connected, and an optical semiconductor element, wherein the optical fiber mounted on the ferrule and the optical semiconductor element are optically coupled to each other. In the method for manufacturing an optical semiconductor element module, a mark having a mark indicating a central axis of the pipe at a tip or inside of the pipe, wherein the lens is built in a cylindrical pipe having an outer diameter equal to or less than the inner diameter of the sleeve. Pipe with built-in lens,
Alternatively, the outer diameter of the lens is equal to or less than the inner diameter of the sleeve, and a rod-shaped lens with a mark having a mark indicating the center axis of the lens on the end surface of the lens is inserted into the sleeve, and the light receiving portion of the optical semiconductor element or An image of the light-receiving portion or light-emitting portion of the optical semiconductor element located on the contact surface with the ferrule of the sleeve, which is formed by the light-emitting portion or the lens incorporated in the optical semiconductor device module when the lens is built-in. Is taken out with the above-mentioned pipe with a lens with a built-in lens or a rod-shaped lens with a mark, an image thereof is enlarged and observed by an optical system installed outside the optical semiconductor element module, and the image of the above-mentioned image of the above-mentioned light-receiving part or light-emitting part The sleeve or sleeve should be aligned so that the center is aligned with the mark on the pipe with the built-in lens or the mark on the rod-shaped lens with the mark. Method for manufacturing an optical semiconductor element module, wherein the optical semiconductor element, or, after adjusting the position of the lens built in the optical semiconductor element module, fixing the sleeve and the optical semiconductor element. 3. A receptacle type having a cylindrical sleeve into which a ferrule of an optical fiber connector can be inserted and connected, and an optical semiconductor element, wherein the optical fiber attached to the ferrule and the optical semiconductor element are optically coupled. In the method of manufacturing an optical semiconductor element module, the outer diameter is built in a cylindrical pipe having a diameter equal to or less than the inner diameter of the sleeve, and a mark is provided at one end or inside of the pipe, and the center axis of the pipe and A pipe with a built-in lens in which the optical axis of the lens built in the pipe substantially coincides, or the outer diameter of the lens is equal to or less than the inner diameter of the sleeve, and the end face of the lens is provided with an optical semiconductor element. A mark having substantially the same size as an electrode or an image of the electrode, and a mark whose optical axis substantially coincides with the central axis of the outer diameter of the lens. An urging rod lens is inserted into the sleeve, the electrodes of the optical semiconductor element, or, when the lens is incorporated in the optical semiconductor device module is made by a lens which is incorporated in an optical semiconductor module,
An image of the electrode of the optical semiconductor element located on the contact surface with the ferrule of the sleeve is taken out by the lens of the pipe with the built-in mark or the rod-shaped lens with the mark, and the image is installed outside the optical semiconductor element module. The electrode or the image of the electrode is marked on the pipe with the built-in mark or the mark of the rod-shaped lens with the mark or the lens of the pipe with the built-in lens and the rod-shaped lens with the mark. The light characterized by fixing the sleeve and the optical semiconductor element after adjusting the position of the sleeve or the optical semiconductor element or the lens incorporated in the optical semiconductor element module so as to match the image of the mark made by A method for manufacturing a semiconductor element module.