JP2584668B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] Regarding an improvement in a method of transporting semiconductor chips, a semiconductor chip formed by a full cut of a semiconductor wafer is not damaged during transportation, and silicon and other dust may adhere thereto. A semiconductor wafer is stuck on the tape of the wafer holding means to which an enclosing frame is stuck on the peripheral portion of the tape, and the semiconductor wafer is fully cut. The wafer holding means, to which the full-cut semiconductor wafer is attached, is stacked on a wafer stacking table via a spacer to form a wafer stack, and the wafer stack is loaded into a dustproof box. And transport it.

[Industrial applications]

The present invention is an improvement in the method of transporting semiconductor chips, and in particular, a semiconductor chip formed by cutting a semiconductor wafer in full, without being damaged during transportation, and so that silicon or the like does not adhere. To improve.

[Conventional technology]

In order to increase the reliability of the semiconductor device, dicing the semiconductor wafer on which the semiconductor device is formed and dividing it into semiconductor chips, instead of the conventional half-cut method,
The full cut method has been used. In this method, a semiconductor wafer is completely cut and separated into chips using a dicer, and the cut and separated semiconductor chips are picked up by a collet, directly mounted on a package, bonded and sealed, or Alternatively, they are once stored in a tray and conveyed, mounted on a package at another place, bonded, and sealed. In the case where the trays are stored and transported, a plurality of trays are generally stacked and transported via aluminum foil or the like.

[Problems to be solved by the invention]

When semiconductor chips that have been fully cut and separated into semiconductor wafers are picked up, directly mounted on a package, and bonded and sealed, there is little possibility that the semiconductor chips will be damaged. When the tray is transported to another location and mounted in a package, the semiconductor chips may be damaged by contact with the tray due to vibration during transport, or silicon or other dust may adhere. As a result, the reliability of the semiconductor device may be reduced.

An object of the present invention is to eliminate this drawback, so that a semiconductor chip formed by a full cut of a semiconductor wafer is not damaged during transportation and silicon and other dust are not attached. The purpose of the present invention is to provide a carrying method for carrying out the method.

[Means for solving the problem]

An object of the present invention is to provide an enclosing frame (1) around the tape (11).
A semiconductor wafer (2) is adhered on the tape (11) of the wafer holding means (1) to which 2) is adhered, and the semiconductor wafer (2) is fully cut. The above-mentioned wafer holding means (1) to which the wafer (2) is adhered is replaced with a spacer (4) having an outer diameter larger than the inner diameter of the enclosing frame (12) and an inner diameter smaller than the inner diameter of the enclosing frame (12). This is achieved by a method of manufacturing a semiconductor device having a step of forming a wafer stack (6) by stacking the wafer stack on a wafer stacking table (3) via the step (1)).

[Action]

In the method for transporting semiconductor chips according to the present invention, when the semiconductor wafer 2 is stuck on the tape 11 of the wafer holding means 1 and full-cut, the tape 11 is about 1 / th of its thickness.
3 is controlled so as to be cut, so that about 2/3 of the vehicle remains uncut, and even if the semiconductor wafer 2 is fully cut, the semiconductor chips remain on the tape 11 of the wafer holding means 1.
It does not separate apart as it is stuck on top. The wafer holding means 1 in this state is stacked on the wafer stacking table 3 via the spacer 4, and a holding plate 5 is placed on the upper portion to form a wafer stacked body 6.
Is loaded into the dustproof box 7 and is pressed and fixed by the spring 71 provided on the side wall and the lid of the dustproof box 7 so as to be transported in the dustproof box 7, so that the fully cut semiconductor chip is It does not come into contact with each other or other members, so that the semiconductor chip is not damaged, silicon and other dust do not adhere to the surface of the semiconductor chip, and , Where it is picked up and mounted on a package.

〔Example〕

Hereinafter, a method of transporting a fully cut semiconductor chip according to an embodiment of the present invention will be described with reference to the drawings.

2 and FIG. 3 FIG. 2 shows a surrounding frame 12 made of stainless steel, aluminum or the like having a thickness of about 1 mm adhered to a peripheral portion of a tape 11 made of polyethylene or the like having a thickness of about 90 to 100 μm. The semiconductor wafer 2 is placed at the center of the tape 11 of the wafer holding means 1.
And FIG. 3 is a plan view showing a state where the semiconductor wafer 2 is fully cut by a dicer (not shown), and FIG. 3 is a sectional view taken along line AA. The semiconductor wafer 2
When the semiconductor wafer 2 is fully cut, the semiconductor chips are not cut apart because the tape 11 is cut only to a thickness of about 30 μm and is not completely cut.ゝ.

FIG. 4 is a plan view of the wafer stacking table 3 made of acrylic or the like. A concave portion is formed in the center of the bottom plate 31, and the wafer holding means 1 is stacked at the four corners. A guide member 32 for positioning is provided. FIG. 5 is BB of FIG.
It is sectional drawing.

FIG. 6 is a sectional view of the wafer stack 6. Approximately ten wafer holding units 1 to which the fully cut semiconductor wafers 2 are attached are stacked on the bottom plate 31 of the wafer stacking table 3 using the guide member 32 as a guide. At this time, a ring-shaped spacer 4 made of Teflon having a thickness of about 2 to 3 mm is interposed between the wafer holding means 1. Teflon is preferred because it has the property of not sticking to the tape. Also,
If the inner diameter of the spacer 4 is formed smaller than the inner diameter of the surrounding frame 12 of the wafer holding means 1, even if the tape 11 vibrates during conveyance, the spacer 4 contacts the tape 11 and suppresses the vibration. effective. Stacked wafer holding means 1
The holding plate 5 is placed on the uppermost part of the wafer to form a wafer stack 6.

See FIG. 1. As shown in FIG. 1, the above-mentioned wafer laminated body 6 is placed in a dustproof box 7 made of acrylic or the like. Since a spring 71 made of a plate made of aluminum or the like is provided on the side surface and the lid of the dustproof box 7, the wafer stack 6 is pressed by the spring and fixed so as not to move in the dustproof box 7. If the semiconductor chip is transported to the next step in this state, the semiconductor chip that is fully cut inside does not come into contact with other semiconductor chips or other members during transportation, so the semiconductor chip may be damaged. And no dust such as silicon adheres to the surface.

〔The invention's effect〕

As described above, in the method of manufacturing a semiconductor device according to the present invention, the semiconductor chip formed by cutting the semiconductor wafer in full is still attached to the tape of the wafer holding means. A plurality of the wafer holding means are stacked on the wafer stacking table via a spacer, and the semiconductor chips are transported while being fixed in the dust-proof box. There is no contact with the member, so that the semiconductor chip is not damaged, and dust such as silicon does not adhere, and is sent to the next step.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a state in which a wafer stack according to one embodiment of the present invention is loaded in a dustproof box. FIG. 2 is a plan view of the wafer holding means. FIG. 3 is a sectional view taken along line AA of FIG. FIG. 4 is a plan view of the wafer stacking table. FIG. 5 is a sectional view taken along line BB of FIG. FIG. 6 is a sectional view of a wafer laminated body. DESCRIPTION OF SYMBOLS 1 ... Wafer holding means, 11 ... Tape, 12 ... Enclosure frame, 2 ... Semiconductor wafer, 3 ... Wafer lamination table, 31
... bottom plate, 32 ... guide member, 4 ... spacer, 5 ... holding plate, 6 ... wafer stack, 7 ... dustproof box, 71 ...
spring.

Claims (1)

(57) [Claims] The tape (1) of a wafer holding means (1) comprising an enclosing frame (12) attached to a peripheral portion of the tape (11).
1) A semiconductor wafer (2) is adhered on the semiconductor wafer (2), the semiconductor wafer (2) is fully cut, and the wafer holding means (1) on which the fully cut semiconductor wafer (2) is adhered is The outer diameter is larger than the inner diameter of the surrounding frame (12) and the inner diameter is smaller than the inner diameter of the surrounding frame (12) via the spacer (4). A method for manufacturing a semiconductor device, comprising a step of forming and transporting.