JP2510024B2 - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To avoid the damage on an IC chip surface and the breakage of chip angles during pick-up process by a method wherein a soft cushion member having a through hole in large diameter capable of passing Si pieces bonded onto IC chip surface is mounted on a suction port sucking IC chips by negative pressure. CONSTITUTION:The title semiconductor manufacturing device with a suction port 5b sucking IC chips cut out of a wafer by negative pressure (a) is provided with a soft cushion member 6 having a through hole capable of passing Si pieces bonded onto the IC chip surfaces on the said suction port 5b so as to suck the IC chips through the intermediary of the cushion member 6. For example, a holder 5c is formed on the peripheral part of the said suction port 5b provided on one end of the communication path 5a of a collet 4 with a cylinder 5 forming the communication path 5a for negative pressure so as to fix the cushion member 6 to the holder 5c. Finally, as for the cushion member 6, sponge or soft urethane foam, etc., are applicable.

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] Regarding a semiconductor manufacturing apparatus, an IC chip cut out from a wafer is sucked by a negative pressure for the purpose of avoiding damage to the IC chip surface and chipping of the chip corner at the time of pickup. In a semiconductor manufacturing apparatus provided with a suction port, the suction port is provided with a through hole having a size through which the Si piece attached to the IC chip surface and a cushion member having flexibility are provided, and the cushion member is interposed therebetween. Characterized in that it is configured to suck the IC chip, or at least a part of the surface of the cushion member is a non-cut processing surface, and the non-cut processing surface is used as an IC chip suction surface, or The through hole of the cushion member has an open cell structure.

[Industrial applications]

The present invention relates to a semiconductor manufacturing apparatus used when assembling an IC.

In general, the process for assembling IC chips, that is, assembly, is roughly divided into one IC for each wafer.
It consists of four steps: a pelletizing (or dicing) step of dividing into chips, a bonding step of mounting an IC chip on a package, a package sealing step, and a finishing process step.

FIG. 10 is a diagram showing details of the pelletizing process.

In the pelletizing process, the wafer is held by an adhesive tape (Fig. 10 (a)), the wafer is cut by using a cutter blade (Fig. 10 (b)), and washed and dried by spin spray (Fig. 10 (c)). )) Is performed, the IC chip pushed up by the push-up pin is picked up and conveyed to the bonding step (FIG. 10 (d)). The pickup uses a collet for negative pressure suction. .

[Conventional technology]

As conventional collets of this kind, two types of plane collets and pyramid collets are known.

Flat collet In FIG. 11, collet 1 has a communicating passage 1a for negative pressure.
And a horizontal end face 1c having a suction port 1b for opening the communication passage 1a to the outside. By applying a negative pressure to the suction port 1b, the IC chip surface is adsorbed and picked up by the suction port 1b.

Pyramidal collet In FIG. 12, collet 2 has a communication passage 2a for negative pressure.
And a pyramidal suction port 2b that opens this communication path 2a to the outside. By applying a negative pressure to the suction port 2b, the corner of the IC chip is held and picked up by the suction port 2b.

[Problems to be Solved by the Invention]

However, the conventional flat collet and pyramid collet have the following problems, respectively.

If dust (hard foreign matter such as Si pieces generated during dicing) remains on the surface of the flat collet IC chip, this dust
As a result of being strongly pressed against the IC chip surface, the protective film (eg PSG film) on the IC chip surface may be damaged.

It should be noted that if the collet 1 is made of an elastic material, the dust pressing force is weakened, so that it is possible to suppress damage to the chip surface. However, in practice, dust easily attaches to the horizontal end surface 1c of the collet 1, so when the pickup is repeated, the horizontal end surface 1c
The amount of residual dust in 1c increases, and damage to the IC chip surface is inevitable.

Pyramidal collet On the other hand, in this type of collet,
Since the IC chips do not come into surface contact with each other, a defect such as the above flat collet, that is, damage to the surface of the IC chip due to dust does not occur, but there is a possibility that the corner of the IC chip may be broken in order to hold the corner.

The present invention has been made in view of these problems, and an object thereof is to avoid damage to the chip surface and chipping of chip corners due to dust during pickup.

[Means for solving the problem]

In order to achieve the above object, the present invention is a semiconductor manufacturing apparatus having a suction port for sucking an IC chip cut out from a wafer by negative pressure, as shown in FIG. A through hole having a size through which the Si pieces attached to the surface of the IC chip can pass and a cushion member having flexibility are provided, and the IC chip is sucked through the cushion member.

Further, preferably, at least a part of the surface of the cushion member is a non-cut processed surface, and the non-cut processed surface is used as an IC chip suction surface.

Furthermore, more preferably, the cushion member has an open cell structure.

[Action]

In the present invention, a cushion member having permeability and flexibility for fine particles (for example, Si pieces on the surface of the IC chip) is interposed between the IC chip and the suction port.

Therefore, when the negative pressure is sucked, the IC chip is elastically held on the surface and dust (for example, a Si piece, which is a foreign substance) on the surface of the IC chip easily passes through the cushion member due to the suction force. Damage to the chip surface is avoided.

This is, for example, on the IC chip surface as shown in FIG.
If there is a foreign matter such as a Si piece, this Si piece can pass through the cushion member by negative pressure suction (see FIG. 3). It can be removed.

According to a preferable configuration, the cushion member
The IC chip suction surface becomes a smooth surface without barbs, and damage to the IC chip surface is more reliably avoided, and negative pressure suction of dust is done smoothly through the open cell structure through hole.

〔Example〕

 Hereinafter, the present invention will be described with reference to the drawings.

FIG. 4 is a diagram showing a first embodiment of a semiconductor manufacturing apparatus according to the present invention.

In FIG. 4, 4 is a collet, and the collet 4 has a cylindrical body 5 in which a negative pressure communication passage 5a is formed. A suction port 5b is formed at one end of the communication path 5a, and a holder portion 5c is formed around the suction port 5b. A cushion member 6 is attached to the holder portion 5c.

Here, it is preferable to use, for example, a sponge body, a sponge, or a soft urethane foam for the cushion member 6. In short, it is flexible and has a large number of cores (air bubbles or cavities) formed inside, and some of the cores communicate with each other, and at least the size of the cores or the opening of the communication part is foreign matter. It is sufficient that the size is equivalent to the size (for example, if the foreign matter is a Si piece, about 500 μφ).

Therefore, the cushion member 6 that meets these conditions has a through hole having a size that allows the Si piece attached to the surface of the IC chip to pass therethrough, and has flexibility.

According to this structure, the cushion member 6
Since the IC chip is sucked, the impact during suction can be mitigated. Further, since the IC chip can be held on the surface, the corner of the IC chip is not damaged. Further, when foreign matter is present on the surface of the IC chip, the foreign matter passes through the cushion member 6 and is sucked under negative pressure, so that various effects such as damage to the chip surface due to the foreign matter can be obtained.

The present invention can also be applied to conventional plane collets and pyramid collets.

FIG. 5 shows an example of application of the semiconductor manufacturing apparatus according to the present invention to a pyramid collet, in which the suction member 2b of the (pyramid) collet 2 is made of the same cushion material 10 as that of the first embodiment. Is attached. Further, FIG. 6 shows an example of application of the semiconductor manufacturing apparatus according to the present invention to a flat collet, showing a suction port 1b of a (flat) collet 1.
A cushion member 20 made of the same material as that of the first embodiment is attached to. According to the second and third embodiments, the cushion member 1 is provided on the conventional pyramid and flat collet.
It can be easily repaired by simply installing 0 and 20, which is preferable in terms of cost and reuse of existing equipment.

Incidentally, the collet according to the present invention is, of course, the one provided in the dicing device, but in addition to this, for example, a dedicated needle such as an injection needle for manually picking up an IC chip is also used for the collet. Applicable. In short, the present invention can be applied to any device that sucks and holds an IC chip by negative pressure, for example, a pickup collet in a die bonding process.

7 to 9 are diagrams of semiconductor manufacturing equipment according to the present invention.
FIG. 7 is a diagram showing each of six embodiments, and FIG.
An opening 6a is formed in the cushion member 6 of the embodiment, FIG. 8 is an opening 10a formed in the cushion member 10 of the second embodiment, and FIG. 9 is an opening in the cushion member 20 of the third embodiment. 20a is formed, and the fourth to
According to the sixth embodiment, the opening 6a which is sufficiently larger than the core,
Since 10a and 20a are formed, dust on the chip surface, such as Si pieces, can be more effectively sucked and relatively large dust can also be sucked.

Here, at least a part of the surface of each of the cushion members 6, 10, 20 is a non-cut surface, and the non-cut surface is an IC.
It is preferably used as a chip adsorption surface. That is, for example, a sponge produced by pouring a foamable material into a mold has a shape sufficiently larger than the tip of the collet, and therefore a cutting process with a cutter or the like is required to obtain a desired shape. However, the cut surface of the cut and processed sponge is not smooth and has thorn-shaped irregularities, so that there is concern about damage to the IC chip surface due to the thorns. If the surface that was in contact with the mold (non-cut processing surface) is used as is as the chip suction surface, the above concerns can be eliminated.

Further, it is preferable that the cushion members 6, 10 and 20 have an open cell structure which will be described below, because negative pressure suction of dust can be smoothly performed. That is, for example, the sponge has a closed cell structure in which a large number of cells are partitioned by a thin film (general sponge), and an open cell structure in which only a part of the thin film between cells is formed (for example, manufactured by INOAC). Malt filter). When the above is used as the cushion member, although the initial dust suction can be performed without any trouble, there is a drawback that the suction efficiency is reduced due to an increase in the residual dust. On the other hand, when is used for the cushion member, residual dust is not generated (or even if it is generated, it is a small amount), so that there is an effect that the suction efficiency can be favorably maintained for a long time.

〔The invention's effect〕

According to the present invention, since the IC chip is sucked under negative pressure through the cushion member, damage to the chip surface and chip angle loss due to dust during pickup can be avoided.

[Brief description of drawings]

1 to 3 are diagrams for explaining the principle of the present invention. FIG. 1 is a diagram showing the principle of the invention, FIG. 2 is a diagram showing foreign matter on the IC chip, and FIG. It is a figure which shows a foreign material. FIG. 4 is a block diagram showing the first embodiment of the semiconductor manufacturing apparatus according to the present invention. FIG. 5 is a configuration diagram showing a second embodiment of the semiconductor manufacturing apparatus according to the present invention. FIG. 6 is a configuration diagram showing a third embodiment of the semiconductor manufacturing apparatus according to the present invention. FIG. 7 is a block diagram showing a fourth embodiment of the semiconductor manufacturing apparatus according to the present invention. FIG. 8 is a block diagram showing a fifth embodiment of the semiconductor manufacturing apparatus according to the present invention. FIG. 9 is a block diagram showing a sixth embodiment of the semiconductor manufacturing apparatus according to the present invention. 10 to 12 are diagrams showing a conventional example, FIG. 10 is a process diagram showing the dicing process, FIG. 11 is a configuration diagram of the flat collet, and FIG. 12 is a configuration diagram of the pyramid collet. 4 ... Collet, 5b ... Suction port, 6, 10, 20 ... Cushion member.

Claims (3)

(57) [Claims] 1. A semiconductor manufacturing apparatus having a suction port for sucking an IC chip cut out from a wafer by a negative pressure, the suction port having a size such that Si pieces adhering to the surface of the IC chip can pass through. A semiconductor manufacturing apparatus, wherein a through hole and a cushion member having flexibility are provided, and an IC chip is sucked through the cushion member. 2. The semiconductor manufacturing apparatus according to claim 1, wherein at least a part of the surface of the cushion member is a non-cut surface, and the non-cut surface is used as an IC chip suction surface. 3. The semiconductor manufacturing apparatus according to claim 1, wherein the through hole of the cushion member has an open cell structure.