JP2723756B2 - Board dismantling machine for printed wiring boards - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for disassembling a printed wiring board by fixing the printed wiring boards superposed in a printed wiring board manufacturing process with an adhesive tape, cutting the adhesive tape after completion of piercing. The present invention relates to a board dismantling machine.

[0002]

2. Description of the Related Art A conventional board dismantling machine for printed wiring boards is shown in FIG.
As shown in the cross-sectional view of FIG. 1, a transport belt 5 for transporting the stack 1 horizontally, a substrate holding unit 2 for holding and fixing the transported stack 1 and a substrate presser 3 raised and lowered by a presser cylinder 4, and an upper plate 21, printed wiring board 20, lower board 22
End mill 11 for cutting the adhesive tape 6 to which the adhesive is fixed, a spindle 13 disposed below the cutting end mill 11 for rotating the cutting end mill 11, and a spindle moving cylinder for pressing the spindle 13 against the lower plate 22 14 and a dust collecting hood 12 that covers the cutting end mill 11 and collects cutting chips, and the disassembling method of cutting the adhesive tape 6 with the cutting end mill 11 has been adopted.

[0003]

The conventional dismantling machine described above has the following disadvantages.

(1) When cutting an adhesive tape, a cutting noise generated between a lower plate and a cutting end mill is loud, and there is a problem that a worker's motivation to work is lowered and a working environment is deteriorated.

(2) Of the chips generated from the lower plate by cutting, chips that could not be collected completely adhere to the device, the printed wiring board, and the lower plate, causing early deterioration of device parts, temporary stoppage of the device, It causes troubles such as defects such as scratches and dents on the printed wiring board.

(3) The life of the cutting end mill is short and the running cost is high.

(4) It is difficult to adjust the angle of the cutting end mill, so that the adhesive tape cannot be cut, so that the apparatus is temporarily stopped or the printed wiring board is cut.

[0008]

According to a first aspect of the present invention, there is provided a board dismantling machine for a printed wiring board, wherein an arbitrary number of printed wiring boards for punching are sandwiched between an upper plate and a lower plate, and an end face is fixed with an adhesive tape. A transport belt for transporting the stack consisting of
It has a stopper for positioning the conveyed stack, a substrate presser and a substrate fixing portion for holding and fixing the positioned stack, and a cutter for moving along the side surface of the lower plate of the stack and cutting the adhesive tape. I have.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a sectional view thereof. In the present invention, the upper plate 21, the lower plate 22, and the plurality of printed wiring boards 20
, A transport belt 5 for transporting the stack 1, a stopper 10 for positioning the transported stack 1 on the transport belt 5, and holding and fixing the stack 1 positioned on the transport belt 5. The substrate fixing portion 2, the substrate presser 3, and a cutter 7 for cutting the adhesive tape 6
And a cutter moving cylinder 8 for moving the cutter 7 along the transport belt 5 and a cutter rotating cylinder 9 for pressing the cutter 7 against the lower plate 22.

Next, the operation of the substrate dismantling machine of the present invention will be described. The stack 1 is carried in by the transport belt 5 and positioned by the stopper 10. After transporting and positioning the stack 1, the presser cylinder 4 shown in FIGS. 1 and 2 is driven to raise the substrate presser 3, and the stack 1 is pinched and fixed by the substrate fixing unit 2 and the substrate presser 3. Next, the cutter rotation cylinder 9 is driven, and the cutter 7 is rotated so that the adhesive tape 6 is rotated.
To one end. Next, the adhesive tape 6 is cut by sliding the cutter 7 along the end surface of the lower plate 22 by the width of the adhesive tape by the cutter moving cylinder 8. After cutting, the cutter 7 rotates 180 ° and separates from the lower plate 22.

By performing this operation simultaneously at a plurality of locations where the adhesive tape 6 is adhered, the lower plate 22 and the printed wiring board 20 and the upper plate 21 are separated. Next, the substrate presser 3 is lowered by releasing the driving of the presser cylinder 4, and the stack 1 is positioned on the transport belt 5. The conveyor belt 5 is driven again, the stack 1 after the disassembly is discharged, and the undismantled stack 1 is loaded and positioned, thereby completing a series of operations.

[0012]

As described above, the present invention has the following effects.

(1) Since the sound during the disassembly operation is low, the work environment can be improved without lowering the worker's willingness to work.

(2) Since almost no chips are generated, the life of the device parts is prolonged, and the stoppage of the device, defects such as scratches and dents on the printed wiring board are reduced.

(3) Compared with the conventional cutting end mill, the cutter has a longer life and the running cost is lower.

(4) Even if the cutter is incorrectly adjusted, only the lower plate is cut, and the printed wiring board is not cut. Therefore, the cutter can be easily adjusted, and the defective printed wiring board can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a sectional view of FIG.

FIG. 3 is a sectional view showing a conventional dismantling machine.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Stack 2 Substrate fixing part 3 Substrate holding 4 Holding cylinder 5 Conveying belt 6 Adhesive tape 7 Cutter 8 Cutter moving cylinder 9 Cutter rotating cylinder 10 Stopper 11 Cutting end mill 12 Dust collecting hood 13 Spindle 14 Spindle moving cylinder 20 Print wiring Plate 21 Upper plate 22 Lower plate

 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-56-56330 (JP, A) JP-A-53-148165 (JP, U) JP-A-2-7995 (JP, U)

Claims (1)

(57) [Claims] 1. A transport belt for transporting a stack of printed wiring boards, which are stacked in an arbitrary number for punching, sandwiched between an upper plate and a lower plate and having an end face fixed with an adhesive tape in a horizontal direction. A stopper for positioning the stack,
A board dismantling machine for a printed wiring board, comprising: a board presser and a board fixing portion for holding and fixing a positioned stack; and a cutter that moves along a side surface of a lower plate of the stack and cuts an adhesive tape.