JP2994826B2 - Thermoelectric conversion element - Google Patents
Thermoelectric conversion elementInfo
- Publication number
- JP2994826B2 JP2994826B2 JP3316291A JP31629191A JP2994826B2 JP 2994826 B2 JP2994826 B2 JP 2994826B2 JP 3316291 A JP3316291 A JP 3316291A JP 31629191 A JP31629191 A JP 31629191A JP 2994826 B2 JP2994826 B2 JP 2994826B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric conversion
- conversion element
- foil
- electrode
- specific resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Die Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱電変換素子に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric conversion element.
【０００２】[0002]
【従来の技術とその課題】従来よりＰｂ−Ｔｅよりなる
熱電変換素子本体は、Ｃｕ電極と接合されることになる
が、この熱電変換素子とＣｕ電極との間にはＴｉ箔を挿
入して昇温・加圧することにより拡散・接合が行なわれ
ている。2. Description of the Related Art Conventionally, a thermoelectric conversion element main body made of Pb-Te is joined to a Cu electrode. A Ti foil is inserted between the thermoelectric conversion element and the Cu electrode. Diffusion and bonding are performed by raising the temperature and applying pressure.
【０００３】この場合、熱電変換素子の性能は、次式で
示される性能指数Ｚで示され、この性能指数が大きくな
る程効率が良いことが判明している。 Ｚ＝α2 ／ρ・Ｋ（α：ゼーベック係数、ρ：比抵抗、
Ｋ：熱伝導率）In this case, the performance of the thermoelectric conversion element is represented by a performance index Z expressed by the following equation, and it has been found that the efficiency increases as the performance index increases. Z = α 2 / ρ · K (α: Seebeck coefficient, ρ: specific resistance,
K: thermal conductivity)
【０００４】上述のＴｉ箔を挿入した熱電変換素子にあ
っては、ゼーベック係数については素子単体のものと大
差はないが、比抵抗については素子単体よりかなり大き
な値となる。したがって、従来の構成では、性能指数が
大幅に低下し効率が悪くなってしまっていた。[0004] In the above-described thermoelectric conversion element into which the Ti foil is inserted, the Seebeck coefficient is not much different from that of the element alone, but the specific resistance is considerably larger than that of the element alone. Therefore, in the conventional configuration, the figure of merit is greatly reduced and the efficiency is deteriorated.
【０００５】本発明は、上述の問題に鑑み、性能指数を
向上させるようにした熱電変換素子の提供を目的とす
る。[0005] In view of the above problems, an object of the present invention is to provide a thermoelectric conversion element having an improved figure of merit.
【０００６】[0006]
【課題を解決するための手段】上述の目的を達成する本
発明は、Ｐｂ−Ｔｅ素子本体とＣｕ電極との間にＡｕ箔
を挿入し、昇温・加圧することを特徴とする。To achieve the above object, the present invention provides an Au foil between a Pb-Te element body and a Cu electrode.
Is inserted, and the temperature is increased and pressurized .
【０００７】[0007]
【作用】Ｐｂ−Ｔｅよりなる素子本体とＣｕ電極との間
にＡｕ箔を挿入して拡散・接合させたことにより、有害
な反応生成物が生じず、接合部分での比抵抗がＰｂ−Ｔ
ｅ素子単体より増加しないようにできた。Since the Au foil is inserted between the element body made of Pb-Te and the Cu electrode for diffusion and bonding, no harmful reaction products are generated, and the specific resistance at the bonding portion is reduced to Pb-T.
It was possible to prevent the increase from the e-element alone.
【０００８】[0008]
【実施例】ここで、図１を参照して本発明の実施例を説
明する。図１において、１はＰｂ−Ｔｅよりなる熱電変
換素子本体であり、この本体１を挾んで両側にＡｕ箔３
を介してＣｕ電極２が接合されている。この場合、Ａｕ
箔３は昇温・加圧され拡散・接合によりＰｂ−Ｔｅ本体
１とＣｕ電極２とを接合する。An embodiment of the present invention will now be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a thermoelectric conversion element main body made of Pb-Te.
Is connected to the Cu electrode 2. In this case, Au
The foil 3 is heated and pressurized to join the Pb-Te body 1 and the Cu electrode 2 by diffusion and joining.
【０００９】（具体例）ここで、具体例を説明するに、
Ｐｂ−Ｔｅ本体１は断面縦横４mm高さ８．５mmの４角柱
体であり、Ｃｕ電極２は１mm厚さの板であり、本例では
Ａｕ箔は厚さ１００μｍであって、Ａｒ雰囲気中で６７
０℃〜７００℃の温度、面圧０．９MPaにて接合した。
熱電変換素子本体単体と、Ｔｉ箔挿入、Ａｕ箔挿入の各
例について性能指数を求めた。熱電変換素子単体の比抵
抗は２．７×１０-4Ωcmでありゼーベック係数２３０μ
ｖ／℃であるとき性能指数は１．９×１０-2（１／℃）
であり、従来のＴｉ箔を挿入した構造にあっては比抵抗
は２．６×１０-3Ωcmとなり、ゼーベック係数は１７０
μｖ／℃であり、性能指数は１．１×１０-3（１／℃）
となった。本実施例によるＡｕ箔を挿入した場合には比
抵抗が１．３×１０-3Ωcmにもなりゼーベック係数が２
００μｖ／℃となるため、性能指数は３．１×１０
-3（１／℃）となった。(Specific Example) Here, a specific example will be described.
The Pb-Te main body 1 is a quadrangular prism having a cross section of 4 mm and a height of 8.5 mm and a height of 8.5 mm. The Cu electrode 2 is a plate having a thickness of 1 mm. 67
Bonding was performed at a temperature of 0 ° C. to 700 ° C. and a surface pressure of 0.9 MPa.
A figure of merit was obtained for each of the thermoelectric conversion element main body alone, the Ti foil insertion, and the Au foil insertion. The specific resistance of the thermoelectric conversion element alone is 2.7 × 10 −4 Ωcm, and the Seebeck coefficient is 230 μm.
When it is v / ° C, the figure of merit is 1.9 × 10 -2 (1 / ° C).
In the structure in which the conventional Ti foil is inserted, the specific resistance is 2.6 × 10 −3 Ωcm and the Seebeck coefficient is 170
μv / ° C., and the figure of merit is 1.1 × 10 −3 (1 / ° C.)
It became. When the Au foil according to this embodiment is inserted, the specific resistance becomes 1.3 × 10 −3 Ωcm and the Seebeck coefficient becomes 2
Since it is 00 μv / ° C., the figure of merit is 3.1 × 10
-3 (1 / ° C.).
【００１０】[0010]
【発明の効果】以上説明したように本発明によれば、ゼ
ーベック係数については素子単体と差がなく、比抵抗に
ついても、従来よりも小さい接合体が、製作できるた
め、性能指数の高い接合体を実現できる。よって、効率
の良い熱電変換素子が得られる。As described above, according to the present invention, there is no difference in the Seebeck coefficient from the element alone, and a joined body having a smaller specific resistance than the conventional one can be manufactured. Can be realized. Therefore, an efficient thermoelectric conversion element can be obtained.
【図１】本実施例の断面構成図。FIG. 1 is a cross-sectional configuration diagram of the present embodiment.
１ Ｐｂ−Ｔｅ熱電変換素子本体 ２ Ｃｕ電極 ３ Ａｕ箔 Reference Signs List 1 Pb-Te thermoelectric conversion element main body 2 Cu electrode 3 Au foil
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平５−327030（ＪＰ，Ａ) 特開 平５−55638（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 35/08 H01L 35/16 H01L 35/32 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-327030 (JP, A) JP-A-5-55638 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H01L 35/08 H01L 35/16 H01L 35/32
Claims (1)
Ａｕ箔を挿入し、昇温・加圧することにより上記Ｐｂ−
Ｔｅ素子本体と上記Ｃｕ電極とを拡散・接合したことを
特徴とする熱電変換素子。1. Between a Pb-Te element body and a Cu electrode
By inserting Au foil and raising the temperature and pressure, the above Pb-
The fact that the Te element body and the Cu electrode were diffused and joined
Characteristic thermoelectric conversion element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3316291A JP2994826B2 (en) | 1991-11-29 | 1991-11-29 | Thermoelectric conversion element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3316291A JP2994826B2 (en) | 1991-11-29 | 1991-11-29 | Thermoelectric conversion element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05152615A JPH05152615A (en) | 1993-06-18 |
| JP2994826B2 true JP2994826B2 (en) | 1999-12-27 |
Family
ID=18075478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3316291A Expired - Fee Related JP2994826B2 (en) | 1991-11-29 | 1991-11-29 | Thermoelectric conversion element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2994826B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002246658A (en) * | 2001-02-21 | 2002-08-30 | Toyo Kohan Co Ltd | Joining method and joined body of Zn-Sb-based thermoelectric material |
| JP4883846B2 (en) * | 2001-06-11 | 2012-02-22 | ユニチカ株式会社 | Thermoelectric conversion module for high temperature |
| JP2006073632A (en) * | 2004-08-31 | 2006-03-16 | Toshiba Corp | Thermoelectric conversion device and method of manufacturing thermoelectric conversion device |
-
1991
- 1991-11-29 JP JP3316291A patent/JP2994826B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05152615A (en) | 1993-06-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19990921 |
|
| LAPS | Cancellation because of no payment of annual fees |