JP3101029B2 - Liquid material feeder for vaporization - Google Patents
Liquid material feeder for vaporizationInfo
- Publication number
- JP3101029B2 JP3101029B2 JP03311590A JP31159091A JP3101029B2 JP 3101029 B2 JP3101029 B2 JP 3101029B2 JP 03311590 A JP03311590 A JP 03311590A JP 31159091 A JP31159091 A JP 31159091A JP 3101029 B2 JP3101029 B2 JP 3101029B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid material
- liquid
- raw material
- flow path
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Chemical Vapour Deposition (AREA)
- Flow Control (AREA)
- Measuring Volume Flow (AREA)
- Degasification And Air Bubble Elimination (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、半導体製造プロセス
における液体原料の高精度供給、特にTEOS (Tetra
Ethyl Ortho Silicate)を始めとする薄膜形成用液体原
料の高精度流量制御や、化学工業分野における液体
(例えば、アルコール類、有機酸類)の高精度移送、特
に次工程が減圧状態にある反応炉などの場合の高精度移
送に最適な気化用液体原料供給器の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-precision supply of a liquid raw material in a semiconductor manufacturing process, and more particularly to a method of supplying a TEOS (Tetra
Ethyl Ortho Silicate) and other high-precision flow control of thin film forming liquid raw materials
The present invention relates to improvement of a liquid material supply device for vaporization which is most suitable for high-precision transfer of (for example, alcohols and organic acids), particularly for a high-precision transfer in a reactor or the like in which the next step is in a reduced pressure state.
【0002】[0002]
【従来の技術】以下、半導体製造のCVDプロセスを例
にとって説明する。半導体ウェハーの層間絶縁膜材料と
して、最近、気化用液体原料としてTEOSが特に注目
されつつある。その理由として、従来の減圧CVDを
使用した(SiH4)の堆積メカニズムと異なり、表面反応律
速であり、そのためにステップカバレッジが良好である
事、SiH4は極めて反応性が高く、爆発事故を発生する
可能性が高いが、これに対してTEOSは安全性が高
く、保存も容易である事、将来、原料として低コスト
化が期待出来るためである。2. Description of the Related Art Hereinafter, a CVD process for manufacturing a semiconductor will be described as an example. As an interlayer insulating film material for semiconductor wafers, TEOS has recently been receiving particular attention as a liquid material for vaporization. The reason for this is that, unlike the deposition mechanism of (SiH 4 ) using conventional low-pressure CVD, the surface reaction is rate-determining, so that step coverage is good, and SiH 4 is extremely reactive, causing an explosion accident. On the other hand, TEOS is highly safe and easy to store, and is expected to reduce costs as a raw material in the future.
【0003】さて、このような液体原料を使用する場
合、以下のような重大な問題がある。即ち、液体原料に
は、その性質上ある程度の気体が溶存している。溶存ガ
スの溶存量はその液体原料の種類、温度、液体原料にか
かる圧力によって変わる。気化用液体原料供給器によっ
て液体原料の流量を制御すると、液体原料が気化用液体
原料供給器内の流路を流れて行く間に微細な温度変化や
圧力変化を受けて溶存ガスが気泡化し、液体原料中に混
入する。[0003] When such a liquid raw material is used, there are the following serious problems. That is, a certain amount of gas is dissolved in the liquid raw material due to its properties. The amount of dissolved gas depends on the type, temperature, and pressure applied to the liquid material. When the flow rate of the liquid raw material is controlled by the liquid raw material supply device for vaporization, the dissolved gas is bubbled due to a minute temperature change or pressure change while the liquid raw material flows through the flow path in the liquid raw material supply device for vaporization, Mixed into liquid raw materials.
【0004】このような気泡が液体原料と共に流れてい
る場合には大きな問題を引き起こさないのであるが、気
泡が流路に引っ掛かって液体原料の流れを阻害すると重
大な問題を引き起こすことになる。即ち、センサ管に気
泡が引っ掛かるとセンサ管に液体原料が流れなくなり、
バイパス管を通って液体原料は流れ続けているのにセン
サ部からの出力信号は流量が0となる。[0004] When such bubbles flow together with the liquid raw material, no serious problem is caused. However, if the bubbles are caught in the flow path and hinder the flow of the liquid raw material, a serious problem will be caused. That is, when air bubbles are caught on the sensor tube, the liquid material stops flowing into the sensor tube,
Although the liquid raw material continues to flow through the bypass pipe, the flow rate of the output signal from the sensor unit becomes zero.
【0005】又、気泡が累積して大きな泡となると、次
工程に供給される液体原料が泡の分だけ途切れる事にな
り、流量制御が不安定となる。[0005] Further, if the bubbles accumulate and become large bubbles, the liquid raw material supplied to the next step is interrupted by the amount of the bubbles, and the flow rate control becomes unstable.
【0006】[0006]
【発明が解決しようとする課題】本発明の課題は、TE
OSのような液体原料の供給に際して、たとえ液体原料
中に気泡が発生しても気泡が原料タンク側に容易に抜け
てしまい、流路の途中で引っ掛かったり、気泡が累積し
て大きな気泡にならないようにして供給することであ
る。An object of the present invention is to provide a TE
When supplying a liquid material such as an OS, even if bubbles are generated in the liquid material, the bubbles easily escape to the material tank side, and are not caught in the middle of the flow path, and the bubbles do not accumulate to become large bubbles. It is to supply in this way.
【0007】[0007]
【課題を解決するための手段】本発明の気化用液体原料
供給器(A)は、前記課題を達成するために請求項1に示
すように、 毛細管で構成され、内部を流れる液体原料(L)の質
量流量を測定するセンサ管(1)と、 センサ管(1)内を流れる液体原料(L)に比例して液体
原料(L)を流すことの出来るバイパス管(2)と、 前記センサ管(1)から又はセンサ管(1)とバイパス管
(2)から流出した液体原料(L)の供給量を制御する流量制
御弁(3)とで構成された気化用液体原料供給器(A)におい
て、 供給器(A)内に設けられた液体原料(L)の流路の内、
水平流路(H)の液体原料流入側を流出側より高くなるよ
うに下り傾斜に水平流路(H)を形成した事を特徴とする
ものである。According to a first aspect of the present invention, there is provided a liquid material supply device for vaporization (A) comprising a capillary tube and a liquid material (L) flowing through the inside thereof. ), A sensor pipe (1) for measuring the mass flow rate, a bypass pipe (2) through which the liquid raw material (L) can flow in proportion to the liquid raw material (L) flowing through the sensor pipe (1), and the sensor From pipe (1) or sensor pipe (1) and bypass pipe
And a flow control valve (3) for controlling the supply amount of the liquid raw material (L) flowing out from (2), the liquid provided in the supply (A) in the liquid raw material supply device (A) for vaporization. In the flow path of the raw material (L),
The horizontal flow path (H) is characterized in that the horizontal flow path (H) is formed so as to be inclined downward so that the liquid material inflow side of the horizontal flow path (H) is higher than the outflow side.
【0008】これにより、水平流路(H)においては液体
原料(L)の流れに逆らって気泡(13)は上昇して行き、水
平流路(H)中で滞留する事がなく、微小気泡(13)の累積
による液体原料(L)の途切れが発生しない。Accordingly, in the horizontal flow path (H), the bubbles (13) rise against the flow of the liquid raw material (L), and do not stay in the horizontal flow path (H). There is no interruption of the liquid raw material (L) due to the accumulation of (13).
【0009】又、バイパス部分においては、請求項2に
示すように、 毛細管で構成され、内部を流れる液体原料(L)の質
量流量を測定するセンサ管(1)と、 センサ管(1)内を流れる液体原料(L)に比例して液体
原料(L)を流すことの出来るバイパス管(2)と、 前記センサ管(1)から又はセンサ管(1)とバイパス管
(2)から流出した液体原料(L)の供給量を制御する流量制
御弁(3)とで構成された気化用液体原料供給器(A)におい
て、 バイパス管(2)の流路が縦方向となるようにバイパ
ス管(2)をバイパス管収納孔(4)内に配置し、 バイパス管収納孔(4)の天井面(5)に液体原料流入口
(6)を設け、且つ、液体原料流入口(6)に向かって登り傾
斜となるように天井面(5)を形成した事を特徴とする。In the bypass portion, a sensor tube (1) for measuring a mass flow rate of the liquid raw material (L) flowing through the inside of the sensor tube (1) is constituted by a capillary tube. A bypass pipe (2) through which the liquid raw material (L) can flow in proportion to the liquid raw material (L) flowing through the sensor pipe (1) or from the sensor pipe (1) and the bypass pipe
In the vaporizing liquid material supply device (A) composed of a flow control valve (3) for controlling the supply amount of the liquid material (L) flowing out from (2), the flow path of the bypass pipe (2) is vertical. The bypass pipe (2) is placed in the bypass pipe storage hole (4) so that the liquid material inflows into the ceiling surface (5) of the bypass pipe storage hole (4).
(6) is provided, and the ceiling surface (5) is formed so as to be inclined upward toward the liquid material inlet (6).
【0010】これにより、バイパス部分で発生した気泡
(13)はバイパス管(2)中に滞留する事なく上昇し、且
つ、登り傾斜に形成された天井面(5)に沿って液体原料
流入口(6)に流れ込み、バイパス管収納孔(4)内にも気泡
(13)が滞留しない構造になっている。As a result, air bubbles generated in the bypass portion
(13) rises without stagnation in the bypass pipe (2), and flows into the liquid material inlet (6) along the ceiling surface (5) formed on the ascending slope, and the bypass pipe housing hole (4 Bubbles inside
(13) does not stay.
【0011】[0011]
【実施例】以下、本発明を図示実施例に従って詳述す
る。図1は気化用液体原料供給器(A)の断面図、図2は
気化用液体原料供給器(A)の平面図である。図1におい
て、(A)は気化用液体原料供給器、(T)は原料タンクであ
り、気化用液体原料供給器(A)は原料タンク(T)の直下に
配置されており、原料タンク(T)の底部に設けられた垂
直供給管(7)と気化用液体原料供給器(A)の上面に設けら
れた原料受給管(8)とが接続されて原料タンク(T)内の液
体原料(L)が気化用液体原料供給器(A)に供給されるよう
になっている。BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a cross-sectional view of the vaporizing liquid raw material supplier (A), and FIG. 2 is a plan view of the vaporizing liquid raw material supplier (A). In FIG. 1, (A) is a liquid material supply device for vaporization, (T) is a material tank, and the liquid material supply device for vaporization (A) is disposed immediately below the material tank (T). The vertical feed pipe (7) provided at the bottom of (T) and the raw material receiving pipe (8) provided on the upper surface of the vaporizing liquid raw material feeder (A) are connected, and the liquid raw material in the raw material tank (T) is connected. (L) is supplied to the vaporizing liquid raw material supply device (A).
【0012】図中、(1)はセンサ管で極く細い毛細管
で構成されており、ボディ(9)の最下部に水平に配設
されており、その上流側が前記原料受給管(8)に連通
する主垂直流路(10)から分岐したセンサ部上流側接
続管(11)と接続しており、その下流側がバイパス管
収納孔(4)の合流底部(12)に連通するセンサ部下
流側接続管(15)と接続しており、実線矢印方向に液
体原料(L)が流れ、破線矢印方向に気泡(13)が流
れるようになっている。(Ru)(Rd)は感熱センサ
で、センサ管(1)の適当に離れた2点にそれぞれ設け
られている。その下方にはヒートシンク(14)を介し
て周囲温度検出抵抗(Rtu)(Rtd)が設置されて
いる。前記センサ部上流側接続管(11)の水平流路
(H)は、液体原料流入側が流出側より高くなるように
下り傾斜に水平流路(H)を形成されており、センサ部
上流側接続管(11)内で発生した気泡(13)は水平
流路(H)に滞留する事なく、上昇して主垂直流路(1
0)に流れ込むようになっている。In the figure, (1) is a sensor tube which is formed of an extremely thin capillary and is horizontally arranged at the lowermost part of the body (9), and its upstream side is connected to the raw material receiving pipe (8). It is connected to a sensor section upstream connection pipe (11) branched from the main vertical flow path (10) communicating therewith, and the downstream side thereof is downstream of the sensor section communicating with the junction bottom (12) of the bypass pipe housing hole (4). The liquid source (L) flows in the direction of the solid line arrow, and the bubbles (13) flow in the direction of the broken line arrow. (Ru) and (Rd) are thermal sensors, which are respectively provided at two appropriately separated points of the sensor tube (1). Ambient temperature sensing resistor (R t u) (R t d) is disposed through the heat sink (14) is in its lower. The horizontal flow path (H) of the sensor section upstream connection pipe (11) has a horizontal flow path (H) formed so as to be inclined downward so that the liquid raw material inflow side is higher than the outflow side. The bubbles (13) generated in the pipe (11) rise and rise in the main vertical flow path (1) without staying in the horizontal flow path (H).
0).
【0013】バイパス管(2)は、センサ管(1)を流れる液
体原料(L)に比例して液体原料(L)を大量に流すことの出
来るもので、バイパス管収納孔(4)内に縦方向に収納さ
れており、バイパス孔が垂直方向に配置されている。バ
イパス管収納孔(4)の天井面(5)は主垂直流路(10)に連通
しており、その天井面(5)は、天井面(5)に形成された液
体原料流入口(6)に向かって登り傾斜となるように形成
されており、バイパス部で発生した気泡(13)が天井部分
で滞留する事なく上昇して主垂直流路(10)を通して原料
タンク(T)に流入するようにしてある。The bypass pipe (2) is capable of flowing a large amount of the liquid raw material (L) in proportion to the liquid raw material (L) flowing through the sensor pipe (1). The bypass holes are accommodated in the vertical direction, and the bypass holes are arranged in the vertical direction. The ceiling surface (5) of the bypass pipe housing hole (4) communicates with the main vertical flow path (10), and the ceiling surface (5) is connected to the liquid material inlet (6) formed on the ceiling surface (5). ), And the air bubbles (13) generated in the bypass section rise without stagnation in the ceiling and flow into the raw material tank (T) through the main vertical flow path (10). I have to do it.
【0014】バイパス管収納孔(4)の下部はバイパス管
(2)の出口とセンサー管の出口に連通するセンサ部下流
側接続管(15)とが合流する合流底部(12)となっており、
この合流底部(12)と流量制御弁(3)側の弁室(18)とが水
平流路の1つである合流水平流路(H1)に連通している。The lower part of the bypass pipe housing hole (4) is a bypass pipe.
The outlet of (2) and the sensor section downstream connecting pipe (15) communicating with the outlet of the sensor pipe are the merging bottom (12) where they merge,
The merging bottom (12) and the valve chamber (18) on the side of the flow control valve (3) communicate with a merging horizontal flow path (H 1 ), which is one of the horizontal flow paths.
【0015】流量制御弁(3)は、ハウジングブロック(1
6)中に水平にて収納されており、弁開度をピエゾアクチ
ュエータ又はソレノイドアクチュエータなどのアクチュ
エータ(17)で精密に制御するようになっており、合流底
部(12)から弁室(18)に流入した液体原料(L)の気化器(図
示せず)への供給量を正確に制御するようになってい
る。The flow control valve (3) is connected to the housing block (1).
6) It is stored horizontally inside, and the valve opening is precisely controlled by an actuator (17) such as a piezo actuator or a solenoid actuator, and from the junction bottom (12) to the valve chamber (18). The supply amount of the inflowing liquid raw material (L) to a vaporizer (not shown) is accurately controlled.
【0016】弁室(18)から導出した供給流路(19)は、図
1に示すように気化用液体原料供給器(A)の側面に出、
液体原料気化器に接続される。液体原料気化器は、反応
炉(図示せず)、例えばCVD装置のような半導体製造装
置に接続されており、液体原料気化器中で搬送ガスによ
って気化された原料ガスが供給されるようになってい
る。The supply flow path (19) led out of the valve chamber (18) exits to the side of the vaporizing liquid raw material supply device (A) as shown in FIG.
Connected to liquid source vaporizer. The liquid source vaporizer is connected to a reaction furnace (not shown), for example, a semiconductor manufacturing apparatus such as a CVD apparatus, so that the source gas vaporized by the carrier gas in the liquid source vaporizer is supplied. ing.
【0017】原料タンク(T)は加圧ガス源(20)に接続さ
れており、圧力計(21)を見ながら圧力調整器(22)で原料
タンク(T)内のガス圧力を調整している。The raw material tank (T) is connected to a pressurized gas source (20), and the gas pressure in the raw material tank (T) is adjusted by a pressure regulator (22) while watching a pressure gauge (21). I have.
【0018】而して、ヘリウムや窒素などの不活性ガス
を原料タンク(T)の上部空間に供給して原料タンク(T)内
の気圧を上げ、原料タンク(T)内の液体原料(L)を気化用
液体原料供給器(A)に供給する。すると垂直供給管(7)、
原料受給管(8)を通して液体原料(L)が流下し、主垂直流
路(10)へ流入する。主垂直流路(10)に流入した液体原料
(L)の一部は分岐してセンサ部上流側接続管(11)、セン
サ管(1)、センサ部下流側接続管(15)を通って合流底部
(12)に入り、一方、主垂直流路(10)に入った液体原料
(L)の大部分はバイパス管(2)を通って合流底部(12)に入
り、合流水平流路(H)を通って弁室(18)に入る。Thus, an inert gas such as helium or nitrogen is supplied to the upper space of the raw material tank (T) to increase the pressure in the raw material tank (T), and the liquid raw material (L) in the raw material tank (T) is increased. ) Is supplied to the liquid material supply device for vaporization (A). Then vertical supply pipe (7),
The liquid raw material (L) flows down through the raw material receiving pipe (8) and flows into the main vertical flow path (10). Liquid raw material that has flowed into the main vertical flow path (10)
A part of (L) branches and passes through the sensor part upstream connection pipe (11), the sensor pipe (1), the sensor part downstream connection pipe (15), and joins the bottom part.
(12), while the liquid raw material enters the main vertical channel (10)
Most of (L) enters the junction bottom (12) through the bypass pipe (2) and enters the valve chamber (18) through the junction horizontal flow path (H).
【0019】演算装置(23)は、センサ管(1)を流通して
いる液体原料(L)の質量流量を演算し、流量制御弁(3)の
弁開度を決定し、アクチュエータ(17)を操作する。これ
により、予め設定されている質量流量の液体原料(L)が
弁室(18)から供給流路(19)へ流出し、液体原料気化器
(図示せず)へ供給される。液体原料気化器(図示せず)に
流入した液体原料(L)は搬送ガスと接触して気化され、
反応炉などへ供給される。The arithmetic unit (23) calculates the mass flow rate of the liquid raw material (L) flowing through the sensor tube (1), determines the valve opening of the flow control valve (3), and sets the actuator (17) Operate. Thereby, the liquid material (L) having a preset mass flow rate flows out of the valve chamber (18) to the supply flow path (19), and the liquid material vaporizer
(Not shown). The liquid raw material (L) flowing into the liquid raw material vaporizer (not shown) is contacted with the carrier gas and vaporized,
It is supplied to a reaction furnace and the like.
【0020】さて、このように液体原料(L)は厳密に制
御されて液体原料気化器(図示せず)へ供給されるのであ
るが、気化用液体原料供給器(A)内の流路は、垂直、水
平又は直径の太い部分、弁など可動部分が存在するも
の、熱が加わる部分など流通条件が様々であり、流路内
の液体原料(L)に加わる条件がそれぞれ相違するもので
あり、溶存ガスが気泡化する事がある。この気泡(13)は
液体原料(L)より比重が軽いので上昇するが、垂直流路
では引っ掛かる事なく上昇して行く。水平流路(H)では
液体原料流入側を流出側より高くなるように下り傾斜に
形成してあるため、液体原料(L)の流下方向と反対側に
気泡(13)は移動して行き、水平流路(H)内に滞留しな
い。As described above, the liquid raw material (L) is strictly controlled and supplied to a liquid raw material vaporizer (not shown). There are various flow conditions, such as vertical, horizontal or thick parts, movable parts such as valves, and parts to which heat is applied, and the conditions applied to the liquid raw material (L) in the flow path are different. In addition, the dissolved gas may be bubbled. The bubbles (13) rise because they have a lower specific gravity than the liquid raw material (L), but rise in the vertical channel without being caught. In the horizontal flow path (H), the liquid material inflow side is formed so as to be inclined downward so as to be higher than the outflow side, so that the bubbles (13) move to the side opposite to the flow direction of the liquid material (L), Does not stay in the horizontal flow path (H).
【0021】バイパス管収納孔(4)の部分でも気泡発生
が起こるが、バイパス管(2)は垂直に設置されているた
めにバイパス孔内で発生した気泡(13)は上昇してバイパ
ス管(2)内に滞留しない。そして、上昇した気泡(13)
は、液体原料流入口(6)に向かって登り傾斜となるよう
に形成された天井面(5)に沿って上昇し、主垂直流路(1
0)に流れ込み、原料タンク(T)へと抜けていく。Air bubbles also occur in the bypass pipe housing hole (4). However, since the bypass pipe (2) is installed vertically, the air bubbles (13) generated in the bypass hole rise and rise to the bypass pipe ( 2) Do not stay inside. And the rising bubble (13)
Rises along the ceiling surface (5) formed so as to be inclined upward toward the liquid material inlet (6), and the main vertical flow path (1
It flows into 0) and goes out to the raw material tank (T).
【0022】又、センサ部下流側接続管(15)中でも気泡
化が起こる可能性があり、又、弁室(18)内でも気泡化が
起こる事があり、この部分で発生した気泡(13)は上昇し
て合流底部(12)に入り、続いて、バイパス管(2)を通っ
て上昇し、前述と同じ経路を通って原料タンク(T)に流
入する。Also, there is a possibility that air bubbles may occur in the downstream connection pipe (15) of the sensor part, and air bubbles may also occur in the valve chamber (18). Rises into the junction bottom (12), then rises through the bypass pipe (2), and flows into the raw material tank (T) through the same path as described above.
【0023】このようにして、流路中で発生した気泡(1
3)は総て上昇して原料タンク(T)に戻り、流路の途中で
引っ掛かって液体原料(L)の流通を阻害したり、累積し
て大きな気泡(13)を形成し液体原料(L)の供給を途切れ
させたりするという事がない。In this manner, the bubbles (1
3) are all raised and returned to the raw material tank (T), and are caught in the middle of the flow path, obstructing the flow of the liquid raw material (L) or accumulating to form large bubbles (13) to form the liquid raw material (L). ) Supply is not interrupted.
【0024】[0024]
【発明の効果】本発明の気化用液体原料供給器は、請求
項(1)に示すように、供給器内に設けられた液体原料流
路の内、水平流路の液体原料流入側を流出側より高くな
るように下り傾斜に水平流路を形成してあるので、垂直
流路中で発生した気泡は勿論、水平流路で発生した気泡
も総て上昇して原料タンクに戻り、流路の途中で引っ掛
かって液体原料の流通を阻害したり、累積して大きな気
泡を形成し液体原料の供給を途切れさせたりするという
事がないという利点がある。According to the present invention, there is provided a liquid material supply device for vaporization according to the present invention, wherein the liquid material flows out of the liquid material inflow side of the horizontal flow passage among the liquid material flow passages provided in the supply device. Since the horizontal flow path is formed so as to be lower than the side, the bubbles generated in the vertical flow path as well as the bubbles generated in the horizontal flow path all rise and return to the raw material tank, There is an advantage that the flow of the liquid raw material is not hindered by being caught in the middle of the process, and the supply of the liquid raw material is not interrupted due to accumulation of large bubbles.
【0025】又、請求項(2)では、バイパス管の流路が
縦方向となるようにバイパス管をバイパス管収納孔内に
配置し、バイパス管収納孔の天井面に液体原料流入口を
設け、且つ、液体原料流入口に向かって登り傾斜となる
ように天井面を形成してあるので、バイパス管内で発生
した気泡も総て上昇し、更に登り傾斜に形成された天井
面に沿って気泡が上昇して液体原料流入口に流れ込み、
バイパス管収納孔内に気泡が滞留するというような事が
なく、ここでも液体原料の流通を阻害したり、累積して
大きな気泡を形成し液体原料の供給を途切れさせたりす
るという事がないという利点がある。In the present invention, the bypass pipe is arranged in the bypass pipe receiving hole such that the flow path of the bypass pipe is vertical, and the liquid material inlet is provided on the ceiling surface of the bypass pipe receiving hole. In addition, since the ceiling surface is formed so as to be inclined upward toward the liquid raw material inlet, all the bubbles generated in the bypass pipe also rise, and furthermore, the bubbles are formed along the ceiling surface formed with the upward inclination. Rises and flows into the liquid material inlet,
There is no such thing as bubbles staying in the bypass pipe storage hole, and there is no hindrance to the flow of the liquid material here, and there is no interruption of the supply of the liquid material by forming large bubbles by accumulation. There are advantages.
【図面の簡単な説明】[Brief description of the drawings]
【図1】本発明の気化用液体原料供給器の正断面図FIG. 1 is a front sectional view of a liquid material supply device for vaporization of the present invention.
【図2】本発明の気化用液体原料供給器の平面図FIG. 2 is a plan view of a liquid material supply device for vaporization of the present invention.
(A)…気化用液体原料供給器 (L)…液体原料 (H)…水平流路 (1)…センサ管 (2)…バイパス管 (3)…流量制御弁 (4)…バイパス管収納
孔 (5)…天井面 (6)…液体原料流入口 (13)…気泡(A) Liquid material feeder for vaporization (L) Liquid material (H) Horizontal flow path (1) Sensor pipe (2) Bypass pipe (3) Flow control valve (4) Bypass pipe storage hole (5)… Ceiling surface (6)… Liquid material inlet (13)… Bubbles
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) C23C 16/00 - 16/56 B01D 19/00 G01F 1/00 - 9/02 G05D 7/00 - 7/06 H01L 21/205 ──────────────────────────────────────────────────続 き Continuation of front page (58) Field surveyed (Int.Cl. 7 , DB name) C23C 16/00-16/56 B01D 19/00 G01F 1/00-9/02 G05D 7/00-7 / 06 H01L 21/205
Claims (2)
体原料の質量流量を測定するセンサ管と、センサ管内を
流れる液体原料に比例して液体原料を流すことの出来る
バイパス管と、前記センサ管から又はセンサ管とバイパ
ス管から流出した液体原料の供給量を制御する流量制御
弁とで構成された気化用液体原料供給器において、 供給器内に設けられた液体原料流路の内、水平流路の液
体原料流入側を流出側より高くなるように下り傾斜に水
平流路を形成した事を特徴とした気化用液体原料供給
器。A sensor tube configured by a capillary tube for measuring a mass flow rate of a liquid material flowing through the sensor tube; a bypass tube capable of flowing the liquid material in proportion to the liquid material flowing through the sensor tube; Alternatively, in a liquid material supply device for vaporization constituted by a sensor pipe and a flow rate control valve for controlling a supply amount of the liquid material flowing out from the bypass pipe, a horizontal flow path is provided in a liquid material flow path provided in the supply apparatus. A horizontal flow path is formed so as to be inclined downward so that the inflow side of the liquid material is higher than the outflow side.
体原料の質量流量を測定するセンサ管と、センサ管内を
流れる液体原料に比例して液体原料を流すことの出来る
バイパス管と、前記センサ管から又はセンサ管とバイパ
ス管から流出した液体原料の供給量を制御する流量制御
弁とで構成された気化用液体原料供給器において、 バイパス管の流路が縦方向となるようにバイパス管をバ
イパス管収納孔内に配置し、バイパス管収納孔の天井面
に液体原料流入口を設け、且つ、液体原料流入口に向か
って登り傾斜となるように天井面を形成した事を特徴と
した気化用液体原料供給器。2. A sensor tube configured by a capillary tube for measuring a mass flow rate of a liquid material flowing through the sensor tube; a bypass tube capable of flowing the liquid material in proportion to the liquid material flowing through the sensor tube; Alternatively, in a vaporizing liquid material supply device composed of a sensor pipe and a flow rate control valve for controlling a supply amount of liquid material flowing out of the bypass pipe, the bypass pipe is connected so that the flow path of the bypass pipe is vertical. A liquid for vaporization characterized by being disposed in a storage hole, providing a liquid material inlet at a ceiling surface of the bypass pipe storage hole, and forming a ceiling surface so as to be inclined upward toward the liquid material inlet. Raw material feeder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03311590A JP3101029B2 (en) | 1991-10-29 | 1991-10-29 | Liquid material feeder for vaporization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03311590A JP3101029B2 (en) | 1991-10-29 | 1991-10-29 | Liquid material feeder for vaporization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05117862A JPH05117862A (en) | 1993-05-14 |
| JP3101029B2 true JP3101029B2 (en) | 2000-10-23 |
Family
ID=18019075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03311590A Expired - Lifetime JP3101029B2 (en) | 1991-10-29 | 1991-10-29 | Liquid material feeder for vaporization |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3101029B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8328938B2 (en) | 2008-08-21 | 2012-12-11 | United Microelectronics Corp. | Buffer apparatus and thin film deposition system |
| SG160262A1 (en) * | 2008-10-02 | 2010-04-29 | United Microelectronics Corp | Buffer apparatus and thin film deposition system |
-
1991
- 1991-10-29 JP JP03311590A patent/JP3101029B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05117862A (en) | 1993-05-14 |
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