JP3315255B2 - Resin molding method for semiconductor device, carrier frame used therefor, and resin molding device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a BGA (Ball Grid Arra).
The present invention relates to a resin molding method for a semiconductor device in which one side of a circuit board such as y) is resin-molded, a carrier frame used for the method, and a resin molding device.

[0002]

2. Description of the Related Art In a BGA, a semiconductor chip is mounted on one surface of a printed circuit board having a wiring pattern formed on both surfaces, and is resin-molded on one surface, and a spherical solder ball is mounted as an external connection terminal on the other surface. It is a semiconductor device. Conventionally, when manufacturing a BGA, from a large-sized printed circuit board on which a predetermined wiring pattern is formed, a board formed in a strip shape so that a plurality of individual circuit boards can be formed is created, and the strip-shaped board is formed on the board. They are transported and processed during the process of mounting a semiconductor chip or performing resin molding.

FIGS. 8 and 9 show a conventional method of resin-molding the substrate 5 formed in a strip shape. This resin molding method is a method of extending a runner path on the substrate 5, filling the cavity with the molding resin from the gate, and molding the resin in the same manner as in the case of normal resin molding of a lead frame. 8 and 9 show a state after the resin molding. Reference numeral 6 denotes a molded product gate that adheres to and remains on the substrate 5, and reference numeral 7 denotes a resin molded portion.

[0004]

After the resin molding of the substrate 5 as described above, the molded product gate 6 is removed from the substrate 5, but as shown in FIG. If the molded product gate 6 is adhered to the substrate 5 for a long time, the substrate 5 is damaged when the molded product gate 6 is removed.
In addition, there is also a problem that the resin flash 8 remains around the molded product gate 6, which causes a product defect.

As described above, when resin molding is performed on one side of a conventional BGA, there is a problem that the resin flash remains on the substrate surface. However, the problem that the resin flash remains is not limited to the BGA but on a substrate used as a product. A similar problem occurs in the case of a method of manufacturing a semiconductor device in which a gate is directly attached to a semiconductor device and resin molding is performed. The present invention is directed to a resin molding method for a semiconductor device capable of eliminating the cause of a defect in producing such a single-sided resin molded semiconductor device and producing a suitable resin molded semiconductor device, and a carrier frame and a resin used therefor. An object is to provide a molding device.

[0006]

The present invention has the following arrangement to achieve the above object. That is, in a resin molding method for a semiconductor device manufactured by resin-molding a semiconductor chip mounting surface of an individual circuit board on which a semiconductor chip is mounted , the circuit is placed at a holding position for holding the individual circuit board.
A through hole having the same shape as the resin mold area on the semiconductor chip mounting surface of the substrate is provided, and the resin mold area and the through hole are provided.
Align the through hole with the periphery of the semiconductor chip mounting surface
Parts on one surface of the carrier <br/> Afure arm holding means is provided for holding the abutment surface, said half via the holding means
A mold gate for resin injection extending to the edge of the through hole is provided on the other surface of the carrier frame, holding a circuit board on which the conductive chip is mounted, and the through hole on the other surface is provided. After the carrier frame and the circuit board are sandwiched between a mold having a cavity recessed in accordance with the position and a mold for supporting the circuit board, a molding resin is injected into the through-hole and the cavity recess to form a resin mold. It is characterized by doing.

A carrier frame for use in the resin molding method for a semiconductor device according to claim 1, wherein the semiconductor chip mounting surface of the circuit board is held at a holding position for holding an individual circuit board on which a semiconductor chip is mounted. A through hole having the same shape as that of the resin mold region is provided, and holding means for aligning the resin mold region and the through hole and holding a peripheral portion of the semiconductor chip mounting surface as a contact surface is provided. It is characterized by. In addition, the holding means cuts and raises the locking claw integrally with the carrier frame at a position for holding the side surface of the circuit board, and forms the locking claw in the middle of the locking claw according to the thickness of the circuit board. A bent portion for supporting the side surface and pressing and holding the substrate against the carrier frame is provided. Further, the inner wall surface of the through hole is formed in a tapered surface in which a surface holding the circuit board is open. Also,
An air vent groove is formed on an edge of the through hole on a surface opposite to a surface with which a peripheral edge of the semiconductor chip mounting surface abuts.

[0008] The circuit board mounting the semiconductor chip pieces, the through-hole of the same shape as the resin mold region of the semiconductor <br/> body chip mounting surface of the circuit board to the holding position for holding the circuit board
It is formed in a strip shape provided, the resin molding area
And the through-hole are aligned with each other and the semiconductor chip is mounted.
Holding means for holding the peripheral edge of the surface as an abutting surface;
On one side of the carrier frame has, via the holding means
A resin mold for clamping the carrier frame and the circuit board with a molding die and resin molding the semiconductor chip mounting surface, wherein an opening is formed in one of an upper die and a lower die of the molding die. A cavity recess in which the size of the peripheral portion of the portion is set equal to or smaller than the size of the peripheral portion of the through-hole; and a mold gate communicating with the cavity recess. A concave portion is provided as an escape space for the substrate. Further, an air vent is provided in one of the upper mold and the lower mold.

[0009]

In the resin molding method for a semiconductor device according to the present invention, a carrier frame provided with a through-hole with a peripheral portion of a semiconductor chip mounting surface of a circuit board formed into individual pieces as a contact surface.
Twice circuit board held to the resin mold by clamping the carrier frame and the circuit board in the mold. For carrier frame
Align the resin mold area and the through hole
The periphery of the semiconductor chip mounting surface of the circuit board as the contact surface
A holding means for holding is provided.
By holding the circuit board, the resin
The semiconductor chip is aligned with the shield region and the through hole.
The periphery of the mounting surface is held against the carrier frame
You. At the time of resin molding, a gate is arranged on the other surface of the carrier frame which is not in contact with the circuit board, and the resin is filled. As a result, the molded product gate adheres to the other surface of the carrier frame, and is molded without directly contacting the substrate surface of the circuit board. The carrier frame is provided with through holes in accordance with the circuit board placement position.A plurality of circuit boards are aligned and placed on the carrier frame, and the same as when a conventional strip-shaped lead frame is resin-molded. Resin molding. In the resin molding apparatus, the carrier frame and the circuit board are clamped by the upper mold and the lower mold, and resin is filled into the through holes and the cavity recesses of the carrier frame, and the semiconductor chip mounting surface of the circuit board is resin-molded.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The embodiment is an example in which the present invention is applied to the manufacture of a BGA, and shows a method of holding a BGA substrate 10 on a carrier frame 20 and performing single-sided resin molding. FIG. 1 is a plan view showing a state in which the circuit board 10 is held on the carrier frame 20 and molded with resin, FIG. 2 is a sectional view, and FIG. 3 is a perspective view showing a BGA after resin molding. As shown in FIG. 1, in this embodiment, a plurality of individual circuit boards 10 are held at predetermined positions of a carrier frame 20 and a region slightly inside the edge of each circuit board 10 is resin-molded. The circuit board 10 is formed in a size to be used as a final product, is provided with a predetermined wiring pattern, has a semiconductor chip mounted thereon, and the wiring pattern and the semiconductor chip are electrically connected by wire bonding or the like.

As shown in FIG. 2, the circuit board 10 is resin-molded on the lower surface of the carrier frame 20 while holding the periphery of the semiconductor chip mounting surface as a contact surface. When resin molding, the carrier frame 20 holding the circuit board 10 is used.
A mold gate is arranged on the other surface of the carrier frame 20 with respect to one surface of the carrier frame 20 and resin molding is performed.
Is provided. The through-hole 20a forms a part of a cavity that forms a part of the outer surface of the resin mold part 7 at the time of resin molding. In the embodiment, the resin mold portion 7 is formed in a rectangular shape, and the through hole 20a is formed in a rectangular shape in accordance with the rectangular shape. However, when the resin is molded into a circular shape or the like depending on a product, the shape of the through hole 20a is adjusted in accordance with the shape. Set.

When the circuit board 10 is held by the carrier frame 20 and resin-molded, the circuit board 10 must be accurately positioned with respect to a mold. For this reason, in the embodiment, a guide hole 26 is provided at a side edge of the carrier frame 20 for positioning the carrier frame 20 with respect to the mold, and the circuit board 10 is positioned and held with respect to the carrier frame 20. Locking claw 28
Was cut and raised in the carrier frame 20.

[0013] As shown in FIG.
A bent portion 28a is provided halfway according to the thickness of 0, and is provided so as to support the side surface of the circuit board 10 and press the circuit board 10 against the frame surface of the carrier frame 5. In the embodiment, as shown in FIG. 1, one locking claw 28 is provided on each of the four sides of the circuit board 10, and the circuit board 10 is supported by the four sides. The distal end of the locking claw 28 is formed to be open outward, and the circuit board 10 can be detached by elastically pushing the locking claw 28 outward.

The circuit board 10 can be more securely held by widening the locking claws 28, and more securely held by providing a plurality of locking claws 28 on one side of the circuit board 10. can do. The method of holding the circuit board 10 on the carrier frame 20 is not only a method of cutting and raising the locking claws 28 on the carrier frame 20 as described above, but also a stepped locking pin formed separately from the carrier frame 20. The circuit board 10 may be engaged with the carrier frame 20 while standing on the frame 20 and positioning the circuit board 10 with the engagement pins. These locking claws 28, locking pins and the like function as holding means for positioning and holding the circuit board 10 on the carrier frame 20.

In FIG. 2, the circuit board 10 is arranged below the carrier frame 20. However, when the circuit board 10 is arranged on the upper side of the carrier frame 20 by inverting the vertical direction of the carrier frame 20, resin molding is performed. In this case, the circuit board 10 only needs to be positioned, and there is no need to press the circuit board 10 against the carrier frame 20 to lock it. In that case, the locking claw is simply cut up and
It is only necessary to abut on the side surface of the zero to enable positioning. The holding means is a concept including the case where only the positioning operation is performed.

The carrier frame 20 is formed in a predetermined strip shape using a metal plate, and is formed by forming a guide hole, a through hole 20a, a locking claw 28, and the like. It is set appropriately according to the size and the number of the circuit boards 10 to be formed. Note that the carrier frame 20 can be made of a heat-resistant thermoplastic resin such as PPS instead of a metal plate. In this case, the carrier frame 20 can be formed by resin molding.
Further, when removing the circuit board 10 from the carrier frame 20, the resin adhering to the inner wall surface of the through hole 20a is separated from the carrier frame 20.
It is preferable that the shape of the inner wall surface of the through hole 20a is formed in a tapered surface in which the surface holding the circuit board 10 is open so that the through hole 20a can be easily removed.

FIG. 5 shows a configuration of a resin molding apparatus for performing resin molding on one side while holding the circuit board 10 on the carrier frame 20 and a resin molding method. The figure shows a state in which the upper frame 30 and the lower mold 32 of the mold are opened, and the carrier frame 20 is carried between the upper mold 30 and the lower mold 32. In the mold of the present embodiment, a cavity recess 34 for resin molding is provided in the upper mold 30, a mold gate 36 communicating with the cavity recess 34 is provided in each of the cavity recesses 34, and the lower mold 32 has an escape of the circuit board 10. Recess 38 is provided. The concave portion 38 may be larger than the plane size of the circuit board 10, but the depth of the concave portion 38 is set to be slightly clamped so that no gap is formed between the carrier frame 20 and the circuit board 10 due to the resin pressure. In addition,
In addition to the concave portion 38, a concave portion 39 for the locking claw 28 to escape is formed in the lower die 32. The cavity recesses 34 together with the through holes 20a provided in the carrier frame 20 constitute a cavity filled with resin.

In the embodiment, the shape of the opening of the cavity concave portion 34 is formed in a rectangular shape according to the shape of the through hole 20a. Note that the size of the peripheral portion of the opening is a maximum of the through hole 20a.
Is preferably set to be slightly smaller than the size of the through hole 20a. This is because the circuit board 10 is removed by removing the resin mold portion 7 from the through hole 20a after the resin molding, so that the removing operation can be easily performed. This is so that 10 can be removed. In the embodiment, the size of the cavity recess 34 is made smaller by about 0.2 mm than the peripheral edge of the through hole 20a in consideration of the displacement of the carrier frame 20 and the like. Note that the gate portion was set to be smaller by about 0.05 mm because of breakage.

The operation of resin molding the circuit board 10 is as follows.
The carrier frame 20 is positioned and arranged on the lower mold 32 from the state shown in FIG. 5, the carrier frame 20 and the circuit board 10 are clamped by the upper mold 30 and the lower mold 32, and the resin is injected into the cavity from the mold gate 36. By filling. After the resin molding, the resin molded portion 7 and the carrier frame 20 are released from the mold by the ejector pins 40, and the single-side resin-molded circuit board 10 is taken out together with the carrier frame 20. Since the molded product runner 24 and the molded product gate 6 are attached to the carrier frame 20, the molded product runner 24 and the molded product gate 6 are separated and removed, and the circuit board 10 is removed from the carrier frame 20.

FIG. 3 is a perspective view of a single semiconductor device with the circuit board 10 removed from the carrier frame 20. As shown in the figure, the resin mold portion 7 is provided on one surface of the circuit board 10, and has a shape in which a step portion 7a is provided below. The step portion 7a is a portion formed by setting the opening range of the cavity concave portion 34 to be slightly smaller than the through-hole 20a, and the thickness of the carrier frame 20 appears as a step. The carrier frame 20 may have a suitable thickness, but usually has a thickness of about 0.15 mm to 0.20 mm. Since the step portion 7a is formed so thin, it does not hinder the product.

FIG. 4 shows a resin mold portion 7 and a molded product gate 6.
The connection with is shown enlarged. In the case of using the resin molding method of this embodiment, the circuit board 10 is disposed below the carrier frame 20 as described above, and the resin is filled into the through holes 20a from above the carrier frame 20 having the through holes 20a. Since resin molding is used, resin molding is performed in a state where the molded product gate 6 does not directly contact the circuit board 10. That is, in the case of the resin molding method of this embodiment, the molded product gate 6 and the molded product runner 2
4 is adhered to the carrier frame 20 and is resin-molded. Even if the resin burrs 8 are formed on the carrier frame 20 as shown in FIG. 1, the cut end face 7b of the molded product gate 6 as shown in FIG. The resin remains only on the outer surface of the resin mold portion 7 and no resin flash remains on the circuit board 10.

When a resin is filled into the cavity to mold the resin, it is common to provide an air vent on the surface of the mold to release air from the cavity and discharge voids of the resin. In the embodiment, as shown in FIG. 1, air vents A were provided so as to be connected to three corners of the resin mold part 7. In the case of resin molding, the void resin is discharged to the air vent portion. In the embodiment, the void resin is discharged onto the carrier frame 20.
This is effective in that it does not adversely affect the performance. Also, there is an effect that clogging of the air vent can be prevented with respect to the mold. As described above, the resin molding method according to the present embodiment is also effective in terms of the air vent.

In the above embodiment, an air vent is provided in the mold, but an air vent can be provided in the carrier frame 20 instead of the air vent in the mold. FIG. 6 is a plan view in which an air vent groove 42 is provided in the carrier frame 20 for air venting, and FIG. 7 shows how resin molding is performed using the carrier frame 20 in which the air vent groove 42 is provided. In this embodiment, as shown in FIG. 6, an air vent groove 42 is provided outward from a corner of the resin mold part 7, and the carrier frame 20 is clamped without providing an air vent in the upper mold 30 in a mold. Perform resin molding. Reference numeral 30a denotes a relief portion of the die provided on the upper die 30 for reliably clamping the periphery of the cavity concave portion 34 when clamping the circuit board 10 and the carrier frame 20.

As described above, according to the resin molding method for a semiconductor device according to the present invention, although a slight step portion 7a is formed at the base of the resin molding portion 7 as shown in FIG. In this case, the resin burr is
Can be prevented from remaining on the resin mold surface or damaging the circuit board 10 when the molded article runner 24 and the molded article gate 6 are removed from the circuit board 10.
Non-defective products can be reliably manufactured. In the above embodiment, the BGA has been described as an example. However, the present method is not limited to the BGA, but can be similarly applied to a product in which a gate is extended on a substrate and one-side resin molding is performed.

In the resin molding method of the above embodiment, as shown in FIG. 5, the circuit board 10 is held under the carrier frame 20, the cavity 30 is provided in the upper mold 30, and the circuit board is provided in the lower mold 32. Although the resin mold is performed by providing a recess 38 for releasing the circuit board 10, the circuit board 10 is mounted on the upper side of the carrier frame 20 by turning the carrier frame 20 upside down.
It is also possible to carry out resin molding in such a manner that the concave portion 38 is provided in the upper die 30 and the cavity concave portion 34 is provided in the lower die 32. In this case, as in the above embodiment, the locking claw 2
It is not necessary to provide the bent portion 28a on the 8 so that the circuit board 10 can be supported, and a locking portion having only an operation of positioning the circuit board 10 on the carrier frame 20 may be formed.

[0026]

According to the resin molding method for a semiconductor device according to the present invention, as described above, resin molding can be performed without attaching a molded product gate to a circuit board. When the molded product gate is removed from the circuit board, it is possible to preferably prevent the occurrence of a defect such as damage to the circuit board. Further, by using the carrier frame according to the present invention, it is possible to efficiently perform resin molding on an individual circuit board. Also,
ADVANTAGE OF THE INVENTION According to the resin molding apparatus which concerns on this invention, there exists a remarkable effect that the individual circuit board is attached to a carrier frame, and resin molding can be performed suitably.

[Brief description of the drawings]

FIG. 1 is a plan view showing a state in which a circuit board is set on a carrier frame and resin-molded.

FIG. 2 is a cross-sectional view of a state where a circuit board is set on a carrier frame and resin-molded.

FIG. 3 is a perspective view of a single-sided resin-molded circuit board.

FIG. 4 is an enlarged cross-sectional view showing a connection portion between a resin mold portion and a molded product gate.

FIG. 5 is an explanatory diagram showing a configuration of a resin molding device for resin-molding a circuit board held on a carrier frame.

FIG. 6 is a plan view showing an embodiment in which an air vent groove is provided in a carrier frame.

FIG. 7 is an explanatory view showing a configuration of a resin molding device for resin-molding a carrier frame provided with an air vent groove.

FIG. 8 is a plan view showing a conventional example in which a circuit board formed in a strip shape is resin-molded.

FIG. 9 is an enlarged sectional view showing a connection portion between a circuit board and a molded product gate.

[Explanation of symbols]

 Reference Signs List 5 substrate 6 molded product gate 6a stepped portion 7 resin molded portion 8, 9 resin beam 10 circuit board 20 carrier frame 20a through hole 22 molded product 24 molded product runner 26 guide hole 28 locking claw 30 upper die 32 lower die 34 cavity Recess 36 Mold gate 38 Recess 40 Ejector pin 42 Air vent groove

Continued on the front page (72) Inventor Mitsutoshi Higashi, 711, Kurita-sha, Toshida, Nagano-shi, Nagano Prefecture Inside Shinko Electric Industries Co., Ltd. (56) References JP-A-57-128930 (JP, A) JP-A-62-30353 (JP, A) JP-A-2-129933 (JP, A) JP-A-7-135231 (JP, A) A) JP-A-7-142520 (JP, A) JP-A-7-161748 (JP, A) JP-A 56-5563 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) ) H01L 21/56

Claims (7)

(57) [Claims] 1. A resin molding method for a semiconductor device in which a semiconductor chip mounting surface of a discrete circuit board on which a semiconductor chip is mounted is manufactured by resin molding, wherein the circuit board is held at a holding position for retaining the discrete circuit board. A through hole having the same shape as the resin mold area on the semiconductor chip mounting surface is provided, and the resin mold area, the through hole,
To align the peripheral edge of the semiconductor chip mounting surface.
The semiconductor chip is provided on one surface of the carrier frame provided with holding means for holding as a contact surface via the holding means.
Holding a circuit board with a chip mounted thereon, and disposing a mold gate for resin injection extending to the edge of the through hole on the other surface of the carrier frame;
After the carrier frame and the circuit board are sandwiched between a mold having a cavity recessed in accordance with the position of the through hole on the other surface and a mold for supporting the circuit board, the mold is provided in the through hole and the cavity recess. A resin molding method for a semiconductor device, comprising: injecting a molding resin to perform resin molding. 2. A carrier frame used in the resin molding method for a semiconductor device according to claim 1, wherein a semiconductor chip mounting surface of the circuit board is held at a holding position for holding an individual circuit board on which a semiconductor chip is mounted. A through hole having the same shape as that of the resin mold region is provided, and holding means for aligning the resin mold region and the through hole and holding a peripheral portion of the semiconductor chip mounting surface as a contact surface is provided. Characteristic carrier frame. 3. The holding means cuts and raises a locking claw integrally with the carrier frame at a position for holding the side surface of the circuit board, and forms the locking claw in the middle of the locking claw according to the thickness of the circuit board. 3. The carrier frame according to claim 2, wherein a bent portion for supporting a side surface of the circuit board and pressing and holding the board against the carrier frame is provided. 4. The carrier frame according to claim 2, wherein an inner wall surface of the through hole is formed as a tapered surface in which a surface holding the circuit board is open. 5. The carrier frame according to claim 2, wherein an air vent groove is formed in an edge of the through hole on a surface of the semiconductor chip mounting surface opposite to a surface with which the peripheral edge abuts. 6. The circuit board mounted with a semiconductor chip pieces, the through-hole of the same shape as the resin mold region of the semiconductor <br/> body chip mounting surface of the circuit board to the holding position for holding the circuit board
It is formed in a strip shape provided, the resin molding area
And the through-hole are aligned with each other and the semiconductor chip is mounted.
Holding means for holding the peripheral edge of the surface as an abutting surface;
On one side of the carrier frame has, via the holding means
A resin mold for clamping the carrier frame and the circuit board with a mold, and resin-molding the semiconductor chip mounting surface, wherein an opening is formed in one of an upper mold and a lower mold of the mold. A cavity recess in which the size of the peripheral portion of the portion is set to be equal to or smaller than the size of the peripheral portion of the through-hole; and a mold gate communicating with the cavity recess. A resin molding device having a concave portion as an escape space for a substrate. 7. The resin molding apparatus according to claim 6, wherein an air vent is provided in one of the upper mold and the lower mold.