JP3477910B2 - Optical guide member and optical pickup - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element, an optical disk and the like.
Optical pickup for recording or reproducing information to and from
It relates to a manufacturing method. 2. Description of the Related Art Conventionally, information recording or
There is a demand for miniaturization of optical disc devices for reproduction, and optical
Optical pickups can be made smaller by reducing the number of
Attempts to reduce weight have been made. Small optical pickup
Lightening not only reduces the overall size of the device, but also reduces access time.
This is advantageous for improving the performance such as shortening the time. In recent years, optical pickup
Hologram optical pickup as a means to reduce the size and weight of the
Use of the
You. [0003] However, the above-mentioned
In the conventional configuration, the distance from the light source to the recording medium is long,
Because there are many independent optical members between
There is a limit to miniaturization of packaging
Had a problem. The present invention relates to an optical pickup packaging.
The purpose is to reduce the size. [0005] In order to achieve this object,
The light source and the incident direction of the light emitted from the light source.
A light guide member having a plurality of inclined surfaces;
Receives light and converts received optical signals into electrical signals.
The light means, the light source, the light guide member and the light receiving means are housed.
A light guide member for receiving light from the light source.
The light is reflected by the inclined surface of the
There is a configuration to guide the light reflected from the body to the light receiving means.
are doing. According to this configuration, the optical pickup is maintained while maintaining the conventional performance.
Dramatic miniaturization of backup packaging
Can be. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first optical pickup according to an embodiment of the present invention will now be described.
The packaging of the
You. FIGS. 1 and 2 show an embodiment of the present invention.
To indicate the optical pickup packaging configuration
FIG. Reference numeral 1 denotes a light source, and the light source 1 is a semiconductor laser.
Various lasers such as gas lasers such as He-Ne
It is. Here, the smallest of these, the whole device is small
Output of several mW to several tens of mW at a low unit price
It is preferable to use a semiconductor laser having the following. Semiconductor
The material of the laser is AlGaAs, InGaAsP, I
nGaAlP, ZnSe, GaN, etc. are considered, where
Is the most commonly used, inexpensive AlGaAs
Using. When performing high-density recording,
Can be made smaller, and AlGaAs
InGaAlP, ZnSe, etc., whose wavelength is shorter than s
It is preferable to use the semiconductor laser described above. Reference numeral 2 denotes a submount, and submount 2
Has a rectangular parallelepiped or plate shape, and a light source
1 is attached. This submount 2 is a light source 1
To dissipate the heat generated by the light source 1
have. Heat is applied to join submount 2 and light source 1
Considering conductivity etc., Au-Sn, Sn-Pb, In etc.
Method of pressure-bonding high temperature foil (several μm to several tens μm)
Preferably, it is used. Light source 1 and submount 2
If it is not mounted substantially horizontally, it causes aberration of the optical system.
Therefore, at the time of joining, the light source 1
It is preferred that the device be mounted approximately horizontally at a predetermined height
No. Further, the lower surface of the light source 1 is
An electrode surface 2a is provided so as to be in gaseous contact. This
The electrode surface 2a for supplying power to the light source 1
Consider the conductivity and corrosion resistance of the metal film that constitutes a.
It is preferable to use a thin film of Au. Further submount
2 is a problem such as heat generated by the light source 1 or attachment to the light source 1
The heat conductivity is high and the coefficient of linear expansion is
(About 6.5 × 10 ^-6 / ° C) is preferred. Concrete
Typically, the coefficient of linear expansion is 3 to 10 × 10 ^-6 / ° C, thermal conductivity
Is 100 w / mK or more, for example, AlN, Si
C, T-cBN, Cu / W, Cu / Mo, Si, etc.
Very high thermal conductivity when using high power lasers
Use diamonds when you have to comb
Is preferred. Linear expansion coefficient of light source 1 and submount 2
Are the same or close to each other, light source 1 and sub
The occurrence of distortion between the mounts 2 can be suppressed.
Then, the mounting portion between the light source 1 and the submount 2 may come off,
It is possible to prevent inconveniences such as cracks in the light source 1.
Wear. However, if it is out of this range, light source 1 and
A large distortion occurs between the submounts 2 and the light source
1 and the submount 2 may come off,
The possibility of cracks and the like increases. Also submount
By making the thermal conductivity of
The heat generated by the source 1 can be efficiently released to the outside
You. However, if the thermal conductivity is below this limit,
Since it is difficult for the heat generated by the light source 1 to escape to the outside,
As the temperature rises, the output of the light source 1 decreases,
If the life is shortened, or in the worst case, the light source 1 is destroyed
Inconveniences such as inconvenience tend to occur. In this embodiment, the ratio
Relatively inexpensive and very good in either of these two properties
AlN was used. Furthermore, light is applied to the upper surface of the submount 2.
From the submount 2 to improve the connection with the source 1
A thin film is formed in the order of Ti, Pt, and Au toward the light source 1
Preferably. 3 is a block, and block 3 is basically a block.
It has a rectangular parallelepiped shape and has a large projection 3a on its side.
The submount 2 is mounted on the upper surface. This
Block 3 is also the light source 1
Due to the heat generated and the problem of attachment to the submount 2,
High conductivity and linear expansion coefficient close to that of submount 2
Material such as the material shown in the submount 2 material example
Using Mo, Cu, Fe, Kovar, 42 alloy, etc.
Preferably. However, the requirement for these property values
Is not so severe compared to submount 2
Therefore, it is preferable to make the selection in consideration of the cost. here
It is very inexpensive compared to AlN, and has relatively superior properties.
The block 3 was formed of a material such as Cu, Mo or the like. Also
The joint between the block 3 and the submount 2 requires thermal conductivity etc.
In consideration of this, it is the same as the case of submount 2 and light source 1.
Thus, Au-Sn, Sn-Pb, I
n and other foils (thickness of several μm to several tens μm)
Is preferred. Reference numeral 4 denotes a heat sink, and the heat sink 4 is generated by the light source 1.
And transmitted through the submount 2 and block 3 by conduction.
It has the function of releasing the heat that has come out to the outside,
Various members forming the optical pickup are placed on the
It is a substrate for caging. Block 3 is row
And fixed to the upper surface of the heat sink 4 by soldering with cream
Is done. The material of the heat sink 4 is C, which has high thermal conductivity.
u, Al, Fe and the like can be considered. In this case, the submount 2 and the block 3
Were formed separately, but the output of the light source 1 was high.
If higher thermal conductivity is required for these components,
These parts are integrally formed to improve conductivity
Is preferred. In this case, those materials are made of AlN or the like.
It is preferable to use one having extremely high thermal conductivity. The block 3 is larger than the submount 2.
It is desirable to increase the contact area with the heat sink 4
Good. The light source 1 needs to have high accuracy with respect to the optical axis.
Required, the upper surface of the submount 2 is horizontal with high accuracy.
It is preferable that Therefore, submount 2, block
Pay close attention to the mounting of the heat sink 3 and the heat sink 4
Is preferred. Reference numeral 5 denotes a light guide member.
It has a rectangular parallelepiped shape, and has a first slope 5a,
A total of three slopes, a second slope 5b and a third slope 5c;
It has five V-shaped grooves 5d. And on the first slope 5a
Converts the light emitted from the light source into zero-order diffracted light (hereinafter referred to as main beam).
Beam) and ± 1st-order diffracted light (hereinafter referred to as side beam)
And a reflection type diffraction grating 6 for separating the
You. However, tracking methods other than the three-beam method (for example,
When using the push-pull method, there is no diffraction grating 6
Is also good. In addition, the light from the light source 1 is incident on the second slope 5b.
Freely convert the diffusion angle of emitted light to the diffusion angle of light
And the output light is integrated along the way
Ideal spherical wave with wavefront aberration removed
By reflecting the returned light with the diffusion angle conversion hologram 7
A reflection film 8 and a reflection film 126 for guiding to a predetermined position;
Whether to transmit the main beam and side beam from the child 6
Or the first beam splitter film 9 that reflects or
Astigmatism generating hologram formed by reflection hologram
10 are formed. However, the recording medium surface
(For example, when the output of the light source 1 is large,
(The rotational linear velocity is slow, etc.)
You don't have to. In this case, the diffusion angle conversion hologram 7
The diffraction grating 6 may be provided at a different position. Also remove the wavefront aberration
The function of removing the hologram is not limited to the diffusion angle conversion hologram 7;
It may be provided on an optical member (for example, an objective lens or the like). Third
The returned light is applied to the first beam splitter 5c on the slope 5c.
Similarly to the film 9, the second via which is transmitted or reflected is provided.
The beam splitter film 11 reflects light waves of a specific component.
The polarized light separating film 12 and reflected light
A reflection film 125 for guiding to the position is formed. Also a light guy
The door member 5 is adhered on its side to the projection 3a of the block 3.
Have been. Great bonding strength for the bonding material used for this
Degree, workability that can be fixed at any moment, before and after curing
Small changes in volume due to changes in volume and changes in temperature and humidity
That is, conditions such as low shrinkage are required, and
To improve workability and stability of the joint surface
Can be. Here, ultraviolet rays are irradiated as such a bonding material
Then, a UV adhesive which is instantly cured by using the adhesive was used. Ma
Alternatively, a moisture-absorbing-curing instant adhesive may be used. More enough
In order to have the mounting strength, the block 3 and the light
The contact area (S) between the guide members 5 is S> 1 mm ^Two To be
Is preferred. Reference numeral 13 denotes a light receiving element, and the light receiving element 13 has a plate shape.
Composed of various electrical circuits formed on semiconductor wafers
And is attached to the bottom surface of the light guide member 5.
You. Attachment of light receiving element 13 and light guide member 5
High adhesive strength, workability that can be fixed in a short time,
Volume change before and after curing and volume change due to temperature and humidity
Conditions such as low shrinkage, that is, low shrinkage, are required.
Filling improves workability and stability of the joint surface.
You. Here, ultraviolet rays are applied as such a bonding material.
UV curing with particularly good workability due to instant curing
An adhesive was used. Even if a moisture-absorbing and curing instant adhesive is used,
good. The light receiving element 13 is emitted from the light source 1 and is
Optical signal reflected back from the recording member 5 or the recording medium
It has a plurality of light receiving units for receiving light. Detected by this light receiver
The converted optical signal is converted to an electrical signal according to the amount of light.
You. This electric signal has the magnitude of the current value at the beginning of the conversion.
However, this current is very weak and noise
There is a disadvantage that it is easy to pick up. Because of this
Converts current value to correlated voltage value as light receiving element 13
An IV amplifier having the function of amplifying by amplification is formed.
It is preferable to use one. However, the incident frequency of light
On the other hand, good response of the output voltage is required.
By forming this IV amplifier in the light receiving element 13,
To reduce the loss of electrical signals and to provide an external OP amplifier
It is not necessary to provide
Further, the received information is signaled on the surface of the light receiving element 13.
A plurality of thin films of Al etc.
An electrode 13a is provided. Reference numeral 14 denotes a package.
On the upper surface of the heat radiating plate 4, the above-described block 3 and the light guide member 5,
It is provided so as to surround the light receiving element 13 and the like.
Out of the light receiving element 13 and the power of the light source 1
Lead frame 14a used for power supply etc. is molded
Have been. The shape of this package 14 is hollow at the center
It has a rectangular parallelepiped shape and a lead frame 1
On the inner surface of the package 14 on the side where 4a is molded
Are steps 14 so that the feet 14b of the lead frame are exposed.
c is provided. Note that the outer shape of the package 14
May be cylindrical or the like. And the light receiving element 13
Provided on the package 14 to extract electrical signals from
Foot 1 of the lead frame exposed on the step 14c
4b and a plurality of electrodes provided on the surface of the light receiving element 13
13a with a wire 14d formed of Au, Al, or the like.
They are connected by ear bonding. In addition, the light source 1
In order to supply the light source, the upper surface of the light source 1 and the package 14 are provided.
Of the lead frame exposed on the step 14c
b with the wire 14d and further sub-mount
On the upper surface of the light source 1 so as to make electrical contact with the lower surface of the light source 1.
Electrode surface 2a and the package 14
With the lead frame feet 14b exposed on the step 14c
Is also wire bonded with wire 14d
More connected. The material of the package 14 is low
Excellent water absorption and low outgassing properties are required
However, here, the most common type of IC mold
A thermosetting resin such as a epoxy resin is used. Also Lee
The material of the frame 14a is Cu, 42 alloy, F
Use a metal such as e plated with Ag, Au, etc.
And many. Here, Cu is plated with Ni, and A
A u-plated one was used. With package 14
Large adhesive strength, low for mounting between heat sink 4
Has properties such as water absorption and high airtightness (low leak characteristics)
Use a bonding material. This makes the joint surface and joint position stable
Into the optical pickup packaging
Of impurities can be prevented. Here a little
Although it takes time to bond, these properties are excellent and inexpensive
A oxy-based adhesive was used. Reference numeral 15 denotes a shell, and the shell 15 is also a package.
The outside that cuts through the center of the rectangular parallelepiped like page 14
And its horizontal cross section is
It has almost the same shape. In addition, the material
Low absorption to prevent impurities from entering the caging.
Characteristics such as aqueous properties and low outgassing properties are required. here
Polybutylene terephthalate, which has excellent properties,
Lower PBT) was used. However, especially strength and dimensional accuracy
When superior characteristics are required, it is better than PBT
Even if an LCP which is expensive but has excellent properties is used
good. And the adhesion between the shell 15 and the package 14 is
Similar to the mounting of the package 14 and the heat sink 4 described above.
For that reason, an epoxy-based adhesive was used. This shell 1
5 instead of using 5
Instead of being higher than the light guide member 5
Is also good. Reference numeral 16 denotes a cover member.
Dirt, dust, etc. adhere to the guide member 5, the light receiving element 13, etc.
Epoxy on the top of the shell 15
It is attached with a system adhesive. Also cover member
Examples of 16 materials include BK-7, FK-1, and K-3.
Glass, urethane, polycarbonate, acrylic, etc.
It is preferable to use a resin or the like having a high light transmittance.
When reading magneto-optical signals, the light transmittance is high and
It is not preferable to use a member having birefringence. Further
Both the upper and lower surfaces of the cover member 16 are anti-reflective to prevent reflection.
A stop film 16a is formed. This antireflection film 16a is made of M
gF _Two It is preferable to form with such materials. But hippo
-When reflection on the surface of the member 16 does not matter much
Need not be provided with an anti-reflection film 16a. Between the cover member 16 and the light guide member 5,
As for the positional relationship, the space between them and the space
It is considered that it is provided. When contacting both, light
The guide member 5 is connected to the bottom of the cover member 16 by an epoxy-based material.
It is attached with an adhesive or a UV adhesive. Cover at this time
The thickness (t1) of the member 16 is set to 0.3 ≦ t1 ≦ 3.0 (m
m) is preferable. The reason for this is that
Is a light guide member that is installed when it is thinner than this
Cover member for weight of 5 etc. and tension when adhesive is hardened
16 is not endurable and may be damaged. Also
As for the upper limit, the cover member 16 has a refractive index
Because the light is converging and the light does not spread
As a result, the cover member 16 and the collimator lens (no
Limited optical system) or objective lens (finite optical system)
Case), the distance to
This is disadvantageous for downsizing the backup unit.
By using such a configuration, the optical pickup package
The caging height can be made lower, and sufficient mounting strength is maintained.
However, the pickup unit can be downsized.
Wear. Where a space is provided between the two
Sets the thickness (t2) of the cover member 16 to 0.1 ≦ t2 ≦
3.0 (mm), between the cover member 16 and the light guide member 5
The distance (d) between them is also 0.1 ≦ d ≦ 3.0 (mm).
Is preferred. The reason for this is that
Unlike the previous example, if the light guide member 5 is attached
It is only necessary to withstand external factors such as vibration
It is. As for d, the smaller the better, the better
However, the accuracy error during assembly cannot be reduced to 0.1 mm or less.
In this case, the cover member 16 may be
There is a risk of contact with the guide member 5 and breakage. this
The light guide member 5 and the light source
Mounting relative position between 1, submount 2 and block 3
Block 3 or submount while improving placement accuracy
2 can be brought into thermal contact with other members.
As a result, the heat generated by the light source 1 can be easily released to the outside.
Can be. In the packaging of the optical pickup,
From the viewpoint of preventing oxidation of the light source 1 and the light receiving element 13,
N as dry antioxidant gas _Two Gas, Ar, N
It is preferable to fill an inert gas such as e or He. So
In the case of, the gap existing between the heat sink 4 and the light receiving element 13
17 with small shrinkage, low water absorption, high airtightness (excellent
(E.g., epoxy)
It must be filled with a system potting agent or solder. this
Thereby, the inside airtightness can be improved. This place
The cover member 16 separates the inside and outside of the packaging
Will also have the function of By using the configuration shown above,
The heat generated by the light source 1 can be easily released to the outside.
And two openings on both sides of the packaging.
This makes it easy to enclose the antioxidant gas.
Can be. In the optical system, the light source 1 and the light guide unit
Correct the relative positional relationship between the material 5 and the light receiving element 13 and
Because they can be held firmly, their position shifts
No erroneous operation, extra optical aberration, etc., occur. Next, an optical pickup according to an embodiment of the present invention will be described.
The operation of the tip will be described with reference to the drawings. Figure
3 shows the operation of the optical pickup in one embodiment of the present invention.
FIG. 4 is a conceptual diagram showing an optical pickup according to an embodiment of the present invention.
FIG. In FIGS. 3 and 4, the sub
Mounted horizontally via und 2 and block 3
The laser light emitted horizontally from the light source 1 has a plurality of parallel light beams.
From the surface 5f of the light guide member 5 having the slope, the light guide member
5 and is formed on the second slope 5 b of the light guide member 5.
The angle of diffusion of the outgoing light relative to the angle of diffusion of the incident and incident light
Reflection-type hologram with hologram conversion function
Reach 7 The diffusion angle conversion hologram 7 is
Incident on the divergence angle conversion hologram 7 of the exit light of
The divergence angle conversion hologram is
7 can freely convert the angle of diffusion of the reflected light from
You. Further, the diffusion angle is converted by the diffusion angle conversion hologram 7.
It can also be converted to parallel light, which it does not have. Also the same
As shown in FIG. 3 by the diffusion angle conversion hologram 7
Wave obtained by integrating the luminous flux after exiting the light guide member 5 along the way
The ideal spherical wave 30 from which the surface aberration has been removed is obtained. Accordingly
Thus, the light incident on the objective lens 26 becomes an ideal spherical wave 30.
Focus on the recording medium 27 by the objective lens 26.
The size becomes almost the size of the diffraction limit.
Can be reliably recorded or reproduced. The diffusion angle is converted by the diffusion angle conversion hologram 7.
The converted and reflected light is formed on the first slope 5a.
The main beam and the side beam are reflected by the reflection type diffraction grating 6.
And divided into Main generated by diffraction grating 6
Beam and side beam are first beam splitter film
9 (first beam splitter film with polarization selectivity)
Incident. Light incident on the first beam splitter film 9
Light transmitted through the first beam splitter film 9 is light
Used as power monitor light of the light emitted from source 1
You. In addition, a film reflecting the first beam splitter film 9 is provided.
The in-beam and the side beam are applied to the surface 5 of the light guide member 5.
e and the cover glass (not shown)
Incident on the lens 26, and is recorded by the focusing action of the objective lens 26.
An image is formed on the information recording surface 27a of the recording medium 27. At this time,
Beams of two side beams on the information recording surface 27a
Spots 29a and 29c are the beams of the main beam.
An image is formed at an almost symmetrical position around the pot 29b.
You. Main beam and side with respect to information recording surface 27a
Due to the beam spots 29b and 29a, 29c of the beam
Information recording or reproduction signal and tracking,
The reading of the so-called servo signal is performed. The information recording surface 27a of the recording medium 27
The reflected main beam and side beam return light
Object lens 26, cover glass, surface 5e of light guide member 5
Again, and again on the second slope 5b of the light guide member 5.
The light is incident on the formed first beam splitter film 9.
The first beam splitter film 9 is perpendicular to the light incident surface.
Light having a direct vibration component (hereinafter simply referred to as S-polarized component)
Has a constant reflectance with respect to the
Almost 100% transmittance for P-polarized light component)
Having. The first beam of the return light from the recording medium 27 is
The light transmitted through the beam splitter film 9 is
Formed on a third slope 5c parallel to the first slope 5a
Second beam splitter film 11 (second polarization selectivity)
(A certain beam splitter film). Second beam
The splitter film 11 and the first beam splitter film 9
Similarly, it has a constant reflectance for the S-polarized component, and
It has almost 100% transmittance for the components. Here, the second beam splitter film 11
The transmitted light 117 of the incident light flux will be described. Transparent
The over-light 117 is generated by the V-groove substrate 3 laminated on the third slope 5c.
Incident on 1. FIG. 5 shows an optical pickup according to an embodiment of the present invention.
FIG. 4 shows a perspective view of a V-groove substrate of a backup. For V-groove substrate 31
Is a V-shaped groove (hereinafter referred to as V-shaped groove) 5d
The third slope 5 is formed by shaping or cutting.
c. Second beam splitter film 1
The transmitted light 117 from No. 1 is reflected by the reflection film in the groove of the V-groove substrate 31.
The light is reflected by the formed reflecting surface 31a. FIG. 6 shows an optical pick-up according to an embodiment of the present invention.
It is a figure which shows the light receiving part arrangement | positioning and signal processing of an up. V groove
The reflected light 120 from the reflecting surface 31a of the substrate 31 is the third oblique light.
The light enters the polarization separation film 12 formed on the surface 5c. reflected light
120 P-polarized light component is almost 10
0% transmission and further on the second slope 5b of the light guide member 5.
The light is reflected by the formed reflective film 8 and
The light reaches the light receiving unit 170. On the other hand, the reflection surface of the V-groove substrate 31
The S-polarized light component of the reflected light 120 from the light 31a
2 reflects almost 100%, and receives light on the light receiving element 13
The unit 171 is reached. Next, the light enters the second beam splitter film 11.
The reflected light 123 of the emitted light flux will be described. Anti
The light 123 is a reflection type hologram on the second slope 5b.
The light is incident on the formed astigmatism generating hologram 10. This
Here, the reflected light 123 is reflected while generating astigmatism, and
Is reflected by the reflection film 125 on the third slope 5c,
After being reflected by the reflection film 126 on the surface 5b, the main beam
The return light of the
The return light of the beam is transmitted to the light receiving portions 176 and 17 on the light receiving element 13.
Reach 7 Next, the light enters the second beam splitter film 11.
The reflected light 123 of the emitted light flux will be described. Anti
The light 123 is a reflection type hologram on the second slope 5b.
The light is incident on the formed astigmatism generating hologram 10. This
Here, the reflected light 123 is reflected while generating astigmatism, and
Is reflected by the reflection film 125 on the third slope 5c,
After being reflected by the reflection film 126 on the surface 5b, the main beam
The return light of the
The return light of the beam is transmitted to the light receiving portions 176 and 17 on the light receiving element 13.
Reach 7 The following has a structure different from that of the above-described embodiment.
The operation of the light guide member 5 will be described with reference to the drawings.
I will tell. FIG. 7 shows an optical pickup according to an embodiment of the present invention.
FIG. 8 is an optical pick-up according to an embodiment of the present invention.
It is a top view of an up. The optical pickup in this embodiment is a block
301, sub-mount 302, light source 303, diffusion angle change
Replacement hologram 306, diffraction grating 307, objective lens 30
9, the first beam splitter film 308, the second beam
The arrangement of the splitter film 316, light receiving element 319, etc. is the same
However, instead of the V-groove substrate of the above-described embodiment, the first oblique
Surface 305a, second slope 305b, and third slope 305
波長 wavelength plate 31 on fourth slope 305 d parallel to c
8 is laminated. In this embodiment, the light source 303 is used to
The light path up to 310 and the second
The path to the beam splitter film 316 is the same as that of the above-described embodiment.
Are equivalent. FIG. 9 shows an optical pick-up according to an embodiment of the present invention.
It is a figure which shows the light receiving part arrangement | positioning and signal processing of an up. second
The transmitted light 317 from the beam splitter film 316 of the
波長 wavelength plate 318 stacked on four slopes 305d
Incident on. The transmitted light 317 is transmitted by the half-wave plate 318.
The polarization direction is rotated by 45 degrees, and the first slope 305a and the
Second slope 305b, third slope 305c, and fourth slope
Polarized light formed on the fifth slope 305e parallel to 305d
The separation film 321 is linearly polarized at 45 degrees with respect to the incident surface.
And the P-polarized light component is
The minute light is transmitted, and the S-polarized light component is reflected. Polarization separation film 32
The P-polarized component transmitted through 1 reaches the light receiving section 370. one
On the other hand, the S-polarized light component reflected by the polarization separation film 321
The emitted light 320 is reflected by the reflective film 322 on the third slope 305c.
Reflected, and then received after passing through the half-wave plate 318
The unit 371 is reached. Next, the second beam splitter film 316
The reflected light 323 of the incident light flux will be described.
The reflected light 323 is a reflection type hologram on the second slope 305b.
Incident on the astigmatism generating hologram 324 formed by the ram
I do. Here, the reflected light 323 is reflected while generating astigmatism.
And is further reflected by the reflective film 325 on the third slope 305c.
Reflected by the reflective film 326 on the second slope 305b.
Then, the return light of the main beam is transmitted to the light receiving section on the light receiving element 319.
At 372, the return light of the side beam is reflected on the light receiving element 319.
The light reaches the light receiving units 376 and 377. Next, the second light pipe according to the embodiment of the present invention will be described.
Refer to the figure for the packaging configuration of the backup.
I will explain it. 10 to 12 show one embodiment of the present invention.
Diagram showing the configuration of the optical pickup packaging in FIG.
It is. However, the part with the same name as the first packaging
As for the material, only the parts having a different configuration from the first embodiment
Will be described. Reference numeral 18 denotes a ceramic package,
The package 18 is the same as the package 14 in the first embodiment.
The heat plate 4 also serves as a function. Therefore, high thermal conductivity
Material such as AlN or Al _Two O _Three It is effective to form
This is preferable because heat can be efficiently released. This embodiment
Used AlN, which has a particularly high thermal conductivity,
Al if necessary _Two O _Three It is cheap to use
It is preferable because of its value. Its structure is based on ceramic.
The three boards are laminated, and the substrates 18a,
18b and 18c. Each substrate 18a,
Electric signals and light from the light receiving element 13 are provided to 18b and 18c.
The patterns used for power supply of the source 1 are the top, bottom,
It is printed on the side (through hole etc.). Also based
An electric signal from the light receiving element 13 is guided to the upper surface of the plate 18b.
Electrode 18e for bonding wires for
Block 3 is fixed with cream solder etc.
ing. Further, these substrates 18a, 18b, 18c
Through holes 19a, 19b, 19c are formed respectively.
You. These through holes 19a, 19b, 19c are electrically connected.
They can be arranged in series as long as they are
It can be labara. These through holes 19a, 19b, 19
On the inner surface of c, is there a conductive material such as Au for power supply?
Is formed on the substrate 18a.
Surface and the lower surface of the substrate 18c are electrically connected.
You. The upper surface of the substrate 18a and the lower surface of the substrate 18c are electrically connected.
In addition, as a method of connecting
Pour paste such as gust
It may be fired together with the cage 18. In addition, through hole 1
When manufacturing on the side of ceramic package 18 without providing 9
A through hole or the like formed in the hole may be used. this
When the method is used, the step of providing the through hole 19 is omitted.
Wear. After the various formations described above are completed,
To produce a ceramic package 18. Reference numeral 20 denotes a terminal, and the terminal 20 is a power source for the light source 1.
Is to supply. The two terminals 20 are connected to the substrate 18c.
It is brazed to the electrode on the lower surface,
Via the inner Au surface, pins or through holes, etc.
An electrode is electrically connected to the electrode 18d formed on the upper surface of the substrate 18a.
It is long. The other end of the terminal 20 is connected to the light source 1.
In the case of emitting light with high output,
linked. The power supply to the light source 1 is formed on the substrate 18a.
The formed electrode 18d and the electrode formed on the upper surface of the light source 1
(Not shown) and the bottom surface of the light source 1
An electrode 2a formed on the upper surface of the submount 2 is connected to a wire
This is performed by bonding. Reference numeral 22 denotes a cap, and the cap 22 is a light guide.
And is provided so as to cover the
Dirt, dust, etc. enter inside, and the light guide member 5 and the light receiving element
It has a function of preventing a problem from occurring in the child 13 and the like. Ki
The material of the cap 22 is metal or resin.
Easy connection with the Mick Package 18 and low cost
Anything can be used as long as it is fixed.
Especially when the cap 22 is made of metal,
Expects to work to suppress unnecessary radiation generated by power supply circuit 21 etc.
The cap 22 is made of Kovar, 42 alloy, Cu
And the like. A package for preventing the light source 1 from being oxidized
When purging the inside of the housing, the light guide member 5 and the
Potting gap between lamic packages 18
Seal with a chemical or solder, and then N _Two Oxidation of gas, etc.
By attaching the cap 22 in a prevention gas atmosphere,
Do Next, the ceramic package 18 and the cap
A description will be given of the attachment of the 22. Ceramic package
The attachment of the cap 18 and the cap 22 directly
Adhesion using a xy-based adhesive, soldering, etc.
Good, but that didn't get enough air tightness
The UV adhesive used inside heats up when soldering.
Is often adversely affected. Therefore, in this embodiment,
Ring 2 between the Mick package 18 and the cap 22
Preferably, 3 is interposed. With this configuration, the ceramic
Electric welding between the package 18 and the cap 22.
It is possible to join by using this method
The sealability of the part is improved, and the temperature of the joint at the time of joining
Need not be raised. Ring 23 is a ceramic
Provided on the uppermost substrate 18a of the package 18.
The shape is almost a square ring shape.
The cross section is rectangular. The material is Kovar,
It is preferable to use metals such as 42 alloy and Cu. C
Mounting between the lamic package 18 and the ring 23
First faces the ring 23 of the ceramic package 18
A thin film of metallized tungsten on the surface
Nickel plating on the top
Are joined to each other by Ag brazing or the like. Change
On the ring 23 joined as described above.
To form an Au surface thereon. And cap 2
The surface facing the ring 23 is also plated with nickel.
The ring 23 and the cap 22
Ring 2 with an elder (a type of electric resistance welder)
The attachment between 3 and cap 22 takes place. The ceramic package 1 described above
In the packaging using the 8, the role of the heat sink
By using the ceramic package 18 which also serves as light
Dissipates heat generated from source 1 etc. more efficiently to the outside
be able to. And terminal 20 is a ceramic package
18, the light source 1 and the high-frequency superimposed power supply
Since the distance required for connection to the circuit 21 can be shortened,
High frequency superimposed power supply circuit by laying power supply lines and signal lines
Unnecessary radiation emitted from 21 can be suppressed. In addition,
Unwanted radiation is further suppressed by using metal for the pump 22
Can be In this embodiment, the block 3 and the light guide unit are used.
Material 5 was bonded and integrated, but these were separated
May be provided on the ceramic package 18. This
In the case of, the position between the light guide member 5 and the light receiving element 13 is determined.
Is easier. Further, the light receiving element 13 includes the light guide member 5.
Was attached to the bottom of the
If not, take it on the ceramic package 18
You can put it on. The ceramic package 18
Here, three ceramic substrates are bonded together (three-layer structure
), But not two-layer structure
It may be a layer or a layer. 4 due to manufacturing reasons, etc.
It is also conceivable to have more than one layer. Next, the third optical pin according to the embodiment of the present invention will be described.
Refer to the figure for the packaging configuration of the backup.
I will explain it. 13 to 15 show an embodiment of the present invention.
Diagram showing the configuration of the optical pickup packaging in FIG.
It is. However, same as the first and second packaging
The members with the names are shown in FIGS. 1 and 10 to 12.
Only different parts from the embodiment will be described. Reference numeral 24 denotes a stem.
The mount 2 and the light guide member 5 are placed or held.
By using a material with high thermal conductivity,
Very efficiently dissipate the heat generated by the light source 1
Can be. Such materials include Kovar and 42 alloy
Metal such as Al _Two O _Three Use ceramic such as AlN
Is preferred. In this embodiment, Kovar is used.
The light guide member 5 is attached to the side surface 24a of the stem 24.
Attached. When this member is installed at an angle,
Optical aberrations increase, preventing normal optical pickup
You. Accordingly, the side portion 24a has high perpendicularity and flatness.
Required. Here, the inclination of the side portion 24a is 90 ° ±
0.5 °. Furthermore, to realize this precise processing
In this embodiment, the side surface 24a of the stem 24 is
Precisely processed by Domill etc. Further stem 24 and light guide
The contact area (S) between the members 5 is S> 1 mm ^Two To do
Is preferred. With this configuration, the stem 24
And the light guide member 5 can be bonded sufficiently firmly.
When a large vibration is transmitted from the stem 24,
The door member 5 does not come off. The light guide member 5 is
To the side surface of the block 3 placed on the
May be. A step 24b is formed on the outer peripheral portion of the upper surface of the stem 24.
Is provided so that the side wall of the step 24b
The cap 22 is fitted. How to attach them
Although it depends on the material of the stem 24, in general, in FIG.
The connection between the ring 23 and the cap 22 in the embodiment shown is explained.
Resistance welding or metal
Use an adhesive such as epoxy or UV, or braze,
It is conceivable to use a method using padding or the like. Reference numeral 25 denotes a package.
Lead frame 14a, light receiving element 13, and light receiving element 13
And the lead frame 14a are wire bonded.
Au wire or the like is molded. For package 25
Then, the light receiving element 13 made of Si is molded.
The light passing through the light guide member 5 and the light
Taking into account what must be led to
Linear expansion coefficient close to Si, low water absorption, transparent and transparent
Optical properties such as refractive index and refractive index should be stable
You. Here, urethane resin is used as such a material.
Was. And the attachment of the package 25 and the stem 24
Do. At this time, the light guide member 5 and the light receiving element
The error of the distance from the element 13 must be 50 μm or less.
However, this adjustment involves directly connecting the light guide member 5 to the package.
It may be carried out by placing it on the
By adjusting the height of the side wall 25a of the cage 25,
You can go. Installation is epoxy adhesive or U
V-adhesive may be used, or cream solder
It does not matter. As described above, in this embodiment, the step
The submount 2 directly on the stem 24 using the
The heat transmitted from the light source 1 by conduction is
Can efficiently escape to the system 24 and solve thermal problems.
Can be Further, the light receiving element 13 is mounted on the package
Due to the molding, the light receiving element 13
Deterioration of light receiving characteristics due to oxidation or adhesion of dust
Etc. can be prevented. The light receiving element 13 is mounted on the package 25.
The light receiving element 1 is not
3 may be placed and fixed on the package 25,
It may be attached to the bottom of the light guide member 5. in this case
Even if the material of the package 25 is a colored material,
Consider using an inexpensive epoxy resin, etc.
available. Also, to prevent oxidation of the light source 1, a package
When purging the inside of the housing, the light guide member 5 and the
Seal the gap between the
After N _Two Cap 22 in an antioxidant gas atmosphere such as gas
This is done by attaching The configurations shown in the above three embodiments are
In addition, for example, in the first embodiment, the light receiving element 13 is connected to the light guide.
13 to 15 instead of being bonded to the
It can be used by molding in a package as in the
Of course it doesn't matter. In this case, deterioration of the characteristics of the light receiving element 13 is prevented.
Can be passed. Also, a metal stem 24 and a metal key
With the cap 22 as in the embodiment shown in FIGS.
If the whole packaging is included, a high-frequency superposition circuit
In addition, unnecessary radiation can be greatly suppressed. Next, the light having the configuration as described above
Regarding the method of manufacturing pickup packaging,
The first embodiment will be described in order. FIGS. 16 to 20 show an embodiment of the present invention.
Showing the manufacturing procedure of the optical pickup packaging
It is. First, light source 1, submount 2 and blower
Assemble block 3 (hereinafter referred to as LD block). Braid
Before standing, especially the side surface 3b of the projection 3a of the block 3
And make sure it is perpendicular to the heat sink 4
Need to be kept. Submount 2 and block 3
Punching out a plated AlN plate or using a dicing saw
It is produced by cutting out using such as. At that time
Wrap when the degree, degree of flatness and degree of verticality are not sufficient
Processing or the like may be performed. Submount light source 1
2. Attach to the predetermined position. Mounting is Au-Sn,
A foil having a thickness of several μm to several tens μm such as Sn-Pb, In, etc.
This is performed by a method such as pressure bonding at a high temperature. Normally
At the same time, submount 2 and block 3
Perform in the same manner. However, light source 1 and submount
2 and the submount 2 and block 3
If the installation is done in a different way,
It is necessary to install them sequentially. Note that these members
A film of Ti or Pt is formed on the bonding surface of
It is preferable to form a film of u and join it there. Special
For mounting between the light source 1 and the submount 2
The use of the method leads to an improvement in the reliability of the light source 1.
Is very preferred. Also, when assembling these components
In order to prevent the light aberration from increasing,
The light emitting surface and the side surface 3b of the protrusion 3a of the block 3 are substantially
It is parallel and the error of distance between both sides is less than 10μm
You have to be careful. Make the error value like this
As a result, variations in product characteristics can be suppressed.
You. Next, the LD block assembled in this manner is
Attach to the specified position of the heat sink 4 in the specified state
You. Although methods such as soldering are used for attachment,
At this time, the joint used for assembling the LD block
Be careful not to melt the material and reduce the assembly accuracy.
Need to be First by not melting
Optical pipes that can maintain the assembly accuracy and do not malfunction
Production of backup units becomes possible. Same at this time
Next, a Ti film is formed on the bonding surface, and Ni or P
forming a film of t, further forming a film of Au thereon,
Therefore, it is preferable to join them. However, not much here
Since high bonding strength is not required, Ti-Au, Ti
It may be joined by a film of -Ni. As another assembling method, the block 3 and the
The above-mentioned various thin films are formed on the hot plate 4 in advance, and then A
g Attach the block 3 and the heat sink 4 with a wax or the like.
Remove the mount 2 with cream solder or the various foils described above.
Attach the light source 1 with the various foils described above.
It is also conceivable that Next, the heat sink 4 incorporating the LD block
The package 14 is mounted on a predetermined position. Installation
An epoxy-based adhesive is used for this. And light receiving element 1
3 is set in a package 14 and each signal of the light receiving element 13 is
Extraction electrodes and corresponding lead frame feet
14b with the wire 14d. This
The length of the wire 14d used for wire bonding
Is often adjusted because the position of the light receiving element 13 is finely adjusted later.
It is preferable to keep it a little longer. Also at this time
Light for the power source of the light source 1 is transmitted through the upper surface of the light source 1 and the Au surface.
Electrode surface 2a of submount 2 in contact with the bottom of source 1
And the lead 14b of the lead frame and the wire 14d
And wire bonding is performed. In this case,
The optical element 13 dissipates heat only by wire bonding
It is attached and fixed to the plate 4 or the light guide member 5.
Not. Next, the light guide member 5 is connected to the side of the block 3.
3b. This installation has very high accuracy
Please refer to the figure for the method here.
This will be described in detail. FIG. 21 shows an embodiment of the present invention.
Shows the discrepancy between the 0th order light and the 1st order light observed by the CCD
FIG. 22 shows a CCD according to an embodiment of the present invention.
A conceptual diagram showing the coincidence between the observed 0th order light and 1st order light,
FIG. 23 is a conceptual diagram of an observation experiment in one embodiment of the present invention.
Is shown. First, a light guide held by air tweezers, etc.
Moving the sliding member 5 along the side surface 3b of the block 3.
To roughly align. At this time, the light guide member 5
Or at least the side portion 3b of the block 3
A UV adhesive is applied to one of them. Then the light source
Power is supplied to the light guide member 1 to emit light to guide the light to the light guide member 5.
Enter. The light introduced into the light guide member 5 is divergent angle conversion
In the program 7, the light is separated into the 0th-order diffracted light and the 1st-order diffracted light,
Thereafter, the light exits from the surface 5e of the light guide member 5.
The emitted light is collimated by a collimator lens (not shown) and an objective.
Pass through the lens 26 at the position where the recording medium 27 should be
Image. At this time, if the light source 1 and the light guide member 5
If the target position is correct, the hologram 7
0th order diffracted light and 1st order diffracted light differ only in the depth of focus
And focuses on the same point.
Then FIG. As shown in the figure, it looks concentric. Again
The relative position between the light source 1 and the light guide member 5 must be correct.
Then, the zero-order diffracted light converted by the diffusion angle conversion hologram 7
Depth of focus and focus point are different from
Therefore, on the recording medium 27, FIG. Different as shown
It becomes two circles. By taking advantage of this fact,
Set charge-coupled device camera 32 (hereinafter referred to as CCD)
To measure the difference between the 0th-order diffracted light and the 1st-order diffracted light,
Feedback the deviation width and deviation direction, and adjust to the amount.
And the light guide member 5 is viewed from the CCD 32 as two component lights.
Is moved so that the image of the image becomes a concentric circle. This allows light
The position of the guide member 5 with respect to the light source 1 is determined very accurately.
Can be Thus, the position of the light guide member 5
After making the decision, irradiate UV light to solidify the UV adhesive
You. In addition, even if it is not a UV adhesive for fixing,
A method of applying an instant adhesive after the determination is also conceivable. On the spot
Type that does not whiten during drying so as not to block light
Use something. When using this adhesive, irradiate ultraviolet rays.
The step of projecting can be omitted. As a positioning method, the first-order diffracted light is
Optical aberrations are measured using a wavefront aberration measuring instrument, etc.
There is also a possibility of positioning to minimize
You. However, the three-beam method is used as the tracking signal detection method
Side beam incident on wavefront aberration measuring instrument
To measure three different lights at the same time.
Therefore, it is difficult to use this method. Next, the light receiving element 13 is moved to a predetermined position on the heat sink 4.
Attach to Also in this case, the light is reflected by the recording medium 27 again.
Incoming light is not correctly guided on each light receiving part of the light receiving element 13
Between the light receiving element 13 and the light guide member 5
Precise relative positioning is required. This alignment
Before explaining the method of the shift,
Focus error signal detection by astigmatism method and this embodiment
The state of astigmatism in will be described with reference to the drawings. FIGS. 24 to 26 show that the recording medium 27 is in focus.
Position, the recording medium 27 is closer to the in-focus position.
When the recording medium 27 moves away from the in-focus position.
FIG. 3 is an external view of an astigmatic light beam according to an embodiment of the present invention.
You. FIGS. 27 to 29 correspond to FIGS. 24 to 26, respectively.
Receiving light generated by astigmatism generating hologram 10
Light receiving units 172a, 172b, 1 provided on element 13
It is the figure which showed the spot shape in 72c and 172d. The astigmatism generating hologram 10 is
7 is in the in-focus position, the
The first focal point 178 is shifted downstream of the light receiving section 172 to the second focal point 1
79 in the x-axis direction as shown in FIGS.
And the y-axis direction, the y-axis direction at the position of the first focal point 178
Line images on the x-axis at the position of the second focal point 179
Will be tied. Also, the recording medium 27 is at the in-focus position.
In the case, each of the x-axis and y-axis directions generated by astigmatism
Spot diameters are equal, resulting in a circular spot shape
The astigmatism generating hologram 10 is designed at the position. The focus error signal is transmitted to the light receiving section 172a,
172b, 172c, and 172d.
The voltage converted by the V amplifier) is I172
a, I172b, I172c, and I172d, FIG.
As can be seen from the circuit diagram of
You. F. E. FIG. = (I172a + I172c)-
(I172b + I172d) When the recording medium 27 is at the in-focus position,
As can be seen, each spot diameter in the x-axis and y-axis directions
172a
172c and the total received light amount at 172b and 172d.
The focus error signal is
It becomes the formula of. F. E. FIG. = 0 when the recording medium 27 is closer than the in-focus position, as shown in FIG.
The first focus generated by the astigmatism generating hologram 10
The point 178 and the second focus 179 are far from the focus error detecting element.
Therefore, the light receiving sections 172a, 172b, 172c, 172
The spot shape on d is in the y-axis direction as shown in FIG.
It becomes an elliptical light beam having a long axis and the light receiving units 172a and 172c
Is larger than the light receiving amounts of the light receiving sections 172b and 172d.
The focus error signal is given by the following equation. F. E> 0 when the recording medium 27 is separated from the in-focus position, as shown in FIG.
Focus generated by the astigmatism generating hologram 10
178 and the second focal point 179 are the astigmatism generating hologram 10
172a, 172b, 172c, 1
The spot shape on 72d is in the x-axis direction as shown in FIG.
It becomes an elliptical light beam having a long axis in the direction, and the light receiving portions 172b, 17
The amount of light received by 2d is smaller than the amount of light received by light receivers 172a and 172c.
The focus error signal is given by the following equation. F. E <0 The focus error signal detection method as described above is astigmatism.
Known as the law. Therefore, in this embodiment, light is received using this principle.
The element 13 is positioned. Ie some way
(Here, the light receiving element 1 is inserted through the hole provided in the heat sink 4.
3 uses air tweezers to adsorb the back)
Holds the optical element 13 and enables fine adjustment of the installation position.
Further, a reflector (not shown) is installed at the position of the recording medium 27.
Keep it. At this time, the bottom of the light guide member 5 or the light receiving element
A UV adhesive is applied to the upper surface of the child 13 in advance. It
First, receive the intensity of the light reflected back by the reflector.
It is monitored by the light receiving sections 170 and 171 of the optical element 13 and the like.
To determine a rough optimal position. And then divided into four
Light receiving units 172a and 172 of the light receiving unit 172
2b, 172c, and 172d (receiving)
While monitoring each (proportional to the amount of light).
Vibration is intentionally made parallel to the optical axis by using a piezoelectric element or the like. This
As a result, the reflection plate moves closer to or farther from the light receiving element 13.
It will be distracted. At this time, the light receiving section 172a,
The light amounts of 172b, 172c, and 172d are almost equal, respectively.
If the light receiving element 13 is moved so that
Precise positioning of light receiving element 13 with respect to member 5 is possible
Become. The signals from the light receiving units 172a and 172b at this time are
The state of the signal is shown in FIGS. Receive light in this way
After the element 13 is positioned, the device is irradiated with ultraviolet light to make UV contact.
The adhesive solidifies. And then holes for air tweezers
Epoxy potting agent to seal
The gap 17 is closed using solder. As a fixing method, in addition to the UV adhesive,
It is also conceivable to use an interposed adhesive. In this case positioning
Later, an instant adhesive is applied. When dry as instant adhesive
It is preferable to use a non-whitening type. Ma
Bonding between the block 3 and the light guide member 5
UV bonding is applied to both the adhesive between the guide member 5 and the light receiving element 13.
When using an adhesive, a space between the light source 1 and the light guide member 5 is used.
Positioning between the light guide member 5 and the light receiving element 13
Irradiate UV light after both positioning is completed or not
After the UV bonding of the block 3 and the light guide member 5 is completed,
Apply UV adhesive between light guide member 5 and light receiving element 13
I do. It is to be noted that the recording medium 2 was actually
7 is arranged, and the recording medium 27 is rotated to generate surface runout.
Then, the position may be adjusted accordingly. Further here
Is the positioning of the light source 1 and the light guide member 5, and the light guide portion
About the positioning method between the material 5 and the light receiving element 13
The method of making the light source 1 emit light has been described.
Image recognition of each part using CCD etc.
Recognize the product and the reference position, and determine the relative position
It is also conceivable to position them so as to have dimensions. Finally, in another step, an epoxy-based adhesive
Attach the cover member 16 to the upper surface of the shell 15 by using
The bottom surface of the integrated member is
Mount on top of Epoxy type connection is mainly used for installation.
Use an adhesive. In addition, this work _Two , He, Ne, Ar
By performing in a dry antioxidant gas atmosphere such as
Purging inside the optical pickup packaging
it can. According to the manufacturing method described above,
The optical pickup packaging is completed. like this
By using a simple manufacturing method, the light
Packaging of Optical Pickup with Id Member 5
Can be performed more easily and precisely, improving yield.
Can be raised. Next, an optical pickup according to an embodiment of the present invention will be described.
FIGS. 10 to 10 show the manufacturing method of
An example of the configuration shown in FIG. 12 will be described. However, the above
The description of the same parts as in the embodiment is omitted. FIGS. 32 to 36 show an embodiment of the present invention.
Showing the manufacturing procedure of optical pickup packaging
FIG. First, the LD block will be described. This L
The D block is mounted on the substrate 18b of the ceramic package 18.
Mount on top. For installation, such as cream soldering
A method is used. At this time, the adhesive part of the LD block melts.
Care must be taken to ensure that they do not shift. Note that
The submount 2 is directly mounted on the substrate 18a without using the block 3.
Or mount on top of 18b
You. In this case, the light guide member of the ceramic package 18
5. The flatness and parallelism of the contact surface with 5 must be high.
No. Next, the manufacturing procedure of the ceramic package 18
Will be described. First press-molded to the prescribed shape
Only three substrates 18a, 18b,
Power supply on the top, bottom or side of each 18c
A supply electrode (not shown), a signal detected by the light receiving element 13;
Pattern electrode (not shown)
A pattern for attaching the ring 23 is formed. Change
Through hole so that the terminal 20 and the light source 1 are electrically connected to each other.
19 ( FIG. The pattern is also provided on the inner surface.
Or by embedding a metal paste such as W
Good. Each pattern is basically a metal film such as W
To Where there is a need for further electrical contact,
Has formed. And these three substrates 18a, 18b,
18c are stacked and fired, and Ni plating
A layer is formed and provided on the through hole 19 for taking in power.
The terminal 20 is soldered to the electrode surface
Attach by brazing etc. and further solder ring 23
Or mounted on the substrate 18a by Ag brazing, etc.
Ni plating again, and Au plating on the ceramic
The lock package 18 is completed. Thereafter, similarly to the above-described embodiment, the wire bonder is used.
Block after positioning the light guide member 5
3 and after positioning the light receiving element 13
It is attached to the bottom surface of the guide member 5. Opening of the substrate 18c
The gap 17 between the mouth and the light receiving element 13 is also an epoxy
Seal with a setting agent or the like. Then on the ring 23
With the cap 22 on it, electric resistance welding, cold welding
Or by soldering. Manufacturing as above
Complete the optical pickup packaging by the procedure
You. The cap 22 is made of metal and the cover member 16
When is made of glass, the cap 22 and the cover member 16
Glass bonding is used as the bonding method with
It is preferable from the viewpoint of low rate. According to the manufacturing method described above,
The optical pickup packaging is completed. like this
By using a simple manufacturing method, the light
Packaging of Optical Pickup with Id Member 5
Can be performed more easily and precisely, improving yield.
Can be raised. Next, an optical pickup according to an embodiment of the present invention will be described.
FIGS. 13 to 13 show the method of manufacturing
An example of the configuration shown in FIG. 15 will be described. But above
The description of the same parts as those of the first embodiment will be omitted. FIGS. 37 to 41 show one embodiment of the present invention.
Showing the manufacturing procedure of the optical pickup packaging
It is. First, it consists of a light source 1 and a submount 2.
Attach LD block to specified position of stem 24
You. At this time, the light emitting surface of the light source 1 and the light guide member 5 are removed.
The inner wall of the stem 24 serving as a mounting surface is parallel to the
Take care that the error in the distance between the two surfaces is 10 μm.
I have to. The light is applied to the side surface 24a of the stem 24.
The guide member 5 is aligned in the same manner as in the above embodiment.
And then attach it. In addition, a predetermined
A terminal 20 for supplying power is attached to the position. This
The terminal 20 is attached at a predetermined position on the stem 24.
A hole that penetrates the stem 24 is provided in the center of the hole.
0 ends slightly above the top of stem 24
The terminal 20 is placed on the terminal 20 and the linear expansion coefficient is
Pour an insulator such as glass similar to that of the material of the stem 24
Insulated and fixed. Further, the light guide member 5 and the stay
Contact the stem 24 except the mounting surface
Not so easy to purge this part later
For perfect airtightness by pouring epoxy resin etc.
Seal to keep. Next, the package 25 is attached to the stem 24.
I can. The light receiving element 13 and the package
The frame 14a is molded. This package
The manufacturing procedure of the page 25 is as follows.
Apply an adhesive such as Ag epoxy to the predetermined position in advance.
Then, the light receiving element 13 is placed and fixed thereon. And wa
The electrode surface of the light receiving element 13 and the lead frame are
Wire bonding is performed between the legs 14b of the arm. This place
In this case, unlike the previous embodiment, it is not necessary to use a longer Au wire.
No. After that, put the lead frame 14a in the molding machine and
Urethane with high transmittance and stable transmittance and refractive index
Transfer molding with resin
You. The urethane tree used in the package 25 here
Fat is transparent, so light other than the component you want to detect
There is a possibility of entering the child 13. So here we detect
Package so that light outside the target does not enter the light receiving element 13.
Surfaces other than the entrance of reflected light around the mold material of page 25
Is subjected to stray light treatment such as satin finish. More
The terminal 20 can be taken out of the package 25 into the die 25.
As described above. The package 25
Surface facing the system 24 or package of the stem 24
Epoxy on at least one of the surfaces facing 25
System adhesive or UV adhesive, etc.
While moving the whole package 25 by the method shown in the embodiment,
After adjusting the position, the stem 24 and the package 25 are
A cap to which the cover member 16 has been attached and which has been adhered.
22 is attached to the stem 24 in a nitrogen gas atmosphere,
Pickup packaging is completed. According to the manufacturing method described above,
The optical pickup packaging is completed. like this
By using a simple manufacturing method, the light
Packaging of Optical Pickup with Id Member 5
Can be performed more easily and precisely, improving yield.
Can be raised. The manufacturing method shown in the above three embodiments
If the configuration is used in combination, for example,
In the first embodiment shown, the light receiving element is bonded to the light guide member.
Instead, as in the embodiment shown in FIGS.
Although it is molded in the package, etc.
Naturally, the manufacturing methods will be used in combination. According to the present invention, an optical pickup package is provided.
The light source, light guide member, light receiving element, and storage member
By comparing with magneto-optical disks,
1/50 volume reduction compared to conventional optical pickups
We were able to. In addition, using bases and holding members
The heat generated by the light source can be released more efficiently to the outside
Therefore, malfunction and destruction of the light source can be prevented.
Also, by covering the top of the package with a cover member,
It can reduce the adhesion of dust etc. inside the package.
To prevent excessive refraction of light and malfunction and deterioration of the light receiving element.
And easy purging inside the package
Will be able to do it. Further, a part of the storage member is made of a light-transmitting material.
Packaged by configuring and sealing the inside of the storage container
It can prevent dust from adhering to the inside and
Deterioration of properties can also be prevented. Between the through hole of the base and the light receiving means
Seals the airtightness inside the packaging.
Can increase the ingress of dirt and dust and oxidation of each component
And deterioration can be prevented. Furthermore, the heat transfer of the holding member
Generated at the light source by setting the conductivity to 100 w / mK or more
Heat can be efficiently dissipated.
No adverse effects are caused. Further, the light source and the base on which the holding member is mounted are in contact with the base.
The storage member with the continuous member molded is joined, and
The receiving member is arranged in a predetermined positional relationship, and the connecting member and the light receiving means are arranged.
And the light guide member inside the storage member
And the storage member is joined to the holding member and the light receiving means.
Optical pick-up characterized by joining a cover member
By using the manufacturing method of the
Packaging of optical pickup with guide member
Can be performed more easily and precisely, improving yield.
Can be raised.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a configuration of an optical pickup in one embodiment of the present invention. FIG. 2 is a cross-sectional view showing a configuration of an optical pickup in one embodiment of the present invention. FIG. 3 is a conceptual diagram of the operation of the optical pickup in one embodiment of the present invention. FIG. 4 is a plan view of the optical pickup in one embodiment of the present invention.
FIG. 6 is a perspective view of a groove substrate. FIG. 6 is a view showing the arrangement of light receiving portions and signal processing of an optical pickup according to an embodiment of the present invention. FIG. 7 is a side view of the optical pickup according to an embodiment of the present invention. FIG. 9 is a plan view of an optical pickup according to an embodiment of the present invention. FIG. 9 is a diagram showing a light receiving portion arrangement and signal processing of the optical pickup according to an embodiment of the present invention. FIG. FIG. 11 is a diagram showing a configuration of an optical pickup in one embodiment of the present invention. FIG. 12 is a diagram showing a configuration of an optical pickup in one embodiment of the present invention. FIG. 14 is a view showing a configuration of an optical pickup in one embodiment of the present invention. FIG. 14 is a view showing a configuration of an optical pickup in one embodiment of the present invention. FIG. 15 is a view showing a configuration of an optical pickup packaging in one embodiment of the present invention. FIG. 16 is a view showing a manufacturing procedure of the optical pickup packaging in one embodiment of the present invention. FIG. 18 is a view showing a manufacturing procedure of an optical pickup packaging in one embodiment of the present invention. FIG. 18 is a view showing a manufacturing procedure of an optical pickup packaging in one embodiment of the present invention. FIG. 20 is a view showing a manufacturing procedure of the packaging of the pickup. FIG. 20 is a view showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention. FIG. 22 is a conceptual diagram showing a mismatch between the first order light and the zero order light. FIG. 22 is a conceptual diagram showing a match between the zero order light and the first order light observed by the CCD in one embodiment of the present invention. 23 is a conceptual diagram of an observation experiment in one embodiment of the present invention. FIG. 24 is an external view of an astigmatic light beam in one embodiment of the present invention. FIG. 25 is an external view of an astigmatic light beam in one embodiment of the present invention. FIG. 26 is an external view of an astigmatic light beam in one embodiment of the present invention. FIG. 27 is a diagram showing a spot shape of a beam on a light receiving sensor in one embodiment of the present invention. FIG. 29 is a diagram showing a beam spot shape on a light receiving sensor in one embodiment. FIG. 29 is a diagram showing a beam spot shape on a light receiving sensor in one embodiment of the present invention. FIG. 31 is a diagram showing a sensor light amount on a light receiving sensor in an example. FIG. 31 is a diagram showing a sensor light amount on a light receiving sensor in one embodiment of the present invention. FIG. 32 is an optical pickup package in one embodiment of the present invention. Manufacturing procedures FIG. 33 is a view showing a manufacturing procedure of the optical pickup packaging in one embodiment of the present invention. FIG. 34 is a view showing a manufacturing procedure of the optical pickup packaging in one embodiment of the present invention. FIG. 36 is a view showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention. FIG. 36 is a view showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention. FIG. 38 is a view showing a manufacturing procedure of the optical pickup packaging in FIG. 38. FIG. 38 is a view showing a manufacturing procedure of the optical pickup packaging in one embodiment of the present invention. FIG. 39 is an optical pickup packaging in one embodiment of the present invention. FIG. 40 is a view showing a manufacturing procedure of the optical pickup in one embodiment of the present invention. 1 is a view showing a manufacturing procedure of an optical pickup packaging according to an embodiment of the present invention. [Description of References] 1 light source 2 submount 2a electrode surface 3 block 3a protrusion 3b side surface 4 heat sink 5 light guide member 5a One slope 5b Second slope 5c Third slope 5d V-shaped groove 5e Surface 5f Surface 6 Diffraction grating 7 Diffusion angle conversion hologram 8 Reflection film 9 First beam splitter film 10 Astigmatism generation hologram 11 Second beam Splitter film 12 Polarization separation film 13 Light receiving element 13a Electrode 14 Package 14a Lead frame 14b Lead frame foot 14c Step 14d Wire 15 Shell 16 Cover member 16a Antireflection film 17 Gap 18 Ceramic package 18a, 18b, 18c Substrate 18d Electrode 18e Electrode 19 , 19a, 19b, 19c Through hole 20 Terminal 2 High frequency superimposed power supply circuit 22 Cap 23 Ring 24 Stem 24a Side surface 24b Step 25 Package 25a Side wall 26 Objective lens 27 Recording medium 27a Information recording surface 28 Second beam splitter films 29a, 29b, 29c Beam spot 30 Ideal spherical wave 31 V Groove substrate 31a Reflecting surface 32 CCD 117 Transmitted light 119 Sensor substrate 120 Reflected light 121 Polarization separating film 122 Reflecting film 123 Reflected light 125 Reflecting film 126 Reflecting film 170, 171, 172, 172a, 172b, 172
c, 172d, 176, 177 Light receiving section 301 Block 302 Submount 303 Light source 304 Light guide member 305a First slope 305b Second slope 305c Third slope 305d Fourth slope 305e Fifth slope 306 Diffusion angle conversion hologram 307 Diffraction grating 308 First beam splitter film 309 Objective lens 310 Recording medium 316 Second beam splitter film 317 Transmitted light 318 Half-wave plate 319 Light receiving element 320 Reflected light 321 Polarization separating film 322 Reflecting film 323 Reflected light 324 Non Point aberration generating holograms 325, 326 Reflective films 370, 371, 372, 376, 377 Light receiving section

──────────────────────────────────────────────────の Continued on the front page (72) Inventor Tatsuya Hiwatari 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (56) References JP-A-6-203420 (JP, A) JP-A-6-251411 (JP, A) JP-A-5-257003 (JP, A) JP-A-4-241235 (JP, A) JP-A-6-68537 (JP, A) JP-A-61-243964 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G11B ^7/ 12-7/22

Claims (1)

(57) [Claims] [Claim 1] An incident light incident on an incident surface from a light source is externally transmitted.
Light from the bottom
Led to a step, inclined to the light emitted from the light source
A light guide member including a plurality of inclined surfaces therein , wherein the plurality of inclined surfaces couple the incident light with a main beam.
The first diffraction grating on which the first diffraction grating generated with the
Surface and diffusion angle conversion for converting the diffusion angle of light emitted from the light source
Hologram and first beam splitter having polarization selectivity
Astigmatism generating hologram that generates astigmatism with film
A second slope on which a constant reflective film is formed,
Polarization selectivity for light transmitted through one-beam splitter film
Forming a second beam splitter film having a polarization separation film
V-shaped groove having a third inclined surface and a reflecting surface formed
And a slope formed by the V-groove substrate.
Id member. 2. The method according to claim 1, wherein the light incident on the incident surface from the light source is transmitted to an external device.
Light from the bottom
Led to a step, inclined to the light emitted from the light source
A light guide member including a plurality of inclined surfaces therein , wherein the plurality of inclined surfaces couple the incident light with a main beam.
The first diffraction grating on which the first diffraction grating generated with the
Surface and diffusion angle conversion for converting the diffusion angle of light emitted from the light source
Hologram and first beam splitter having polarization selectivity
Astigmatism generating hologram that generates astigmatism with film
A second slope on which a constant reflective film is formed,
Polarization selectivity for light transmitted through one-beam splitter film
Forming a second beam splitter film having reflection and a reflection film
Third slope and a fourth slope in which a half-wave plate is laminated in parallel.
And a fifth slope on which a polarization separation film is formed.
Light guide member characterized by the following. 3. A light source and mounting the light source at a predetermined position.
And a block member for supplying power to the light source,
A light guide member internally having a plurality of inclined surfaces inclined with respect to light emitted from the light source, and a plurality of light receiving elements;
Light receiving means, and the light emitted from the light source is
Incident on the entrance surface of the light guide member and emitted to the outside,
The light incident on the light guide member from outside is the light guide
Optical pickup guided from the bottom surface of the member to the light receiving means
A is, the plurality of inclined surfaces, the incident light of the main beam and rhinoceros
The first diffraction grating on which the first diffraction grating generated with the
Surface and diffusion angle conversion for converting the diffusion angle of light emitted from the light source
Hologram and first beam splitter having polarization selectivity
Astigmatism generating hologram that generates astigmatism with film
A second slope on which a constant reflective film is formed,
Polarization selectivity for light transmitted through one-beam splitter film
Forming a second beam splitter film having a polarization separation film
V-shaped groove having a third inclined surface and a reflecting surface formed
And an inclined surface of the V-groove substrate.
Backup. 4. A light source and mounting the light source at a predetermined position.
And a block member for supplying power to the light source,
A light guide member internally having a plurality of inclined surfaces inclined with respect to light emitted from the light source, and a plurality of light receiving elements;
Light receiving means, and the light emitted from the light source is
Incident on the entrance surface of the light guide member and emitted to the outside,
The light incident on the light guide member from outside is the light guide
Optical pickup guided from the bottom surface of the member to the light receiving means
A is, the plurality of inclined surfaces, the incident light of the main beam and rhinoceros
The first diffraction grating on which the first diffraction grating generated with the
Surface and diffusion angle conversion for converting the diffusion angle of light emitted from the light source
Hologram and first beam splitter having polarization selectivity
Astigmatism generating hologram that generates astigmatism with film
A second slope on which a constant reflective film is formed,
Polarization selectivity for light transmitted through one-beam splitter film
Forming a second beam splitter film having reflection and a reflection film
Third slope and a fourth slope in which a half-wave plate is laminated in parallel.
And a fifth slope on which a polarization separation film is formed.
An optical pickup that features. 5. The light according to claim 3 or claim 4.
A pickup for fixing the block member and a package,
The light guide member and the light guide member are bonded together.
The package is bonded to the light guide member and
An optical pickup characterized by having a tip attached. 6. A pattern for electrically connecting said package.
Characteristic is a ceramic package with
The optical pickup according to claim 5, wherein 7. The cap is formed of a metal,
Attach the package and the cap between them
The package and the carrier with a metal ring
It is characterized in that it is attached by brazing or welding
The optical pickup according to claim 5, wherein 8. The light according to claim 3 or claim 4.
A pickup, wherein the block member is attached to a stem;
Adhere the material to the stem and mold the light receiving element in advance
Attach the package to the stem
Optical pick characterized by a cap attached to the stem
up. 10. The package is mounted on a lead frame.
The light receiving element is fixed to the
And the light receiving element and the lead frame.
9. The method according to claim 8, wherein the rubber member is molded from a transparent resin.
Optical pickup. 11. The cap and the stem may be respectively
Formed of metal, and the stem and the cap
The attachment is performed by interposing a metal ring between them.
Welding the package and the cap, brazing, Iida
9. The device according to claim 8, wherein the mounting is performed by any one of the methods.
Optical pickup as described.