JP3425894B2 - How to flatten the surface of a processed product - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for flattening the surface of a processed product such as a semiconductor device.

[0002]

2. Description of the Related Art Polishing and flattening (planariz) conventional products
ing) has been practiced with products such as polymeric substrates or polishing pads that are exposed to various operating conditions that affect the choice of substrate material. For example, the nature of the workpiece being polished, variations in polishing rate and pressure, the temperature rise that occurs during the polishing operation, and the nature of the polishing slurry used in the operation influences substrate selection.

The above conventional products generally have a multi-layout having non-uniform physical properties throughout their thickness.
er laminations) or stratified substrate
s). An example of a typical multi-layer pad that is widely used for polishing semiconductor devices is the Politex Supreme pad, available from Rodel Incorporat, Newark, Del.
ed) are commercially available. A typical Polytex Supreme pad is 1 mm made of polyester felt
Consists of a tough but elastic porous bottom layer from 2 to 2 mm thick and several layers containing polyurethane binder. about
A spongy, elastic microporous urethane layer of 0.05 mm to 0.3 mm thickness is laminated on top of the bottom layer. The top layer has vertical, sloping pores, with a vertical urethane structure (v with the slope of the pores narrowing toward the top of the pad.
ertical urethane structures). The top layer is extremely soft, porous and elastic. In a typical polishing operation, the top layer of such a multilayer pad wears rapidly. As the top layer wears and exposes subsequent layers, the polishing characteristics of the pad change resulting in uneven polishing rates, resulting in inhomogeneous polishing characteristics at the workpiece surface.

Conventional polymeric polishing pads are often
It has quality variations due to inaccurate control of polymerization and mixing and cutting and molding of the final pad product. Therefore,
Polishing characteristics, such as surface quality, raw material removal rate and planarization rate, imparted to the workpiece being polished vary significantly between pad batches.

[0005]

Therefore, the present invention is
An object is to provide a method for uniformly flattening the surface of a processed product.

[0006]

In order to solve the above-mentioned problems, the present invention takes the following technical means.

The method of flattening the surface of a work piece according to the present invention comprises impregnating a polymeric matrix with polymeric microelements having a plurality of void spaces so as to have a working surface and a sub-surface adjacent to said working surface. At least a part of the shell of the polymer microelements located adjacent to the work surface is opened by contacting the product with the working environment, and the opened polymer microelements are embedded in the sub-surface. The hardness is lower than that of the molecular microelements, and the working surface of the product is regenerated.

The shell of the polymer microelement may be opened by slicing, grinding, cutting or punching a part of the shell.

The polymer microelements located in the vicinity of the work surface have a hardness higher than that of the polymer microelements embedded in the sub-surface because at least a part of the shell is chemically changed depending on the work environment. Can be reduced.

A groove may be formed in a part of the work surface so that the rigidity is reduced when the work surface is brought into contact with the work environment.

The processed product may be a semiconductor device.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

The method of flattening the surface of a work piece of the present invention comprises impregnating a polymeric matrix with polymeric microelements having a plurality of void spaces so as to have a working surface and a sub-surface adjacent to said working surface. At least a part of the shell of the polymer microelements located adjacent to the work surface is opened by contacting the product with the working environment, and the opened polymer microelements are embedded in the sub-surface. The hardness is lower than that of the molecular microelement, and the working surface of the product is regenerated.

Referring to the attached drawings, generally like reference numerals indicate like elements, but FIGS.
Examples of products for use in the present invention are shown with the symbols 10, 110, 210, 310 and 410 in 5-9 and 11.

Product 10 is preferably a generally circular sheet or polishing pad 12, best seen in FIGS. 5 and 7. One of ordinary skill in the art will appreciate that the pad 12 can be, for example, generally square, rectangular, or any suitable shape, if desired.

The product 10 or the like can be used as a polishing pad itself, or a polishing slurry can be used as a semiconductor device,
Silicon device, crystal, glass, ceramic,
It can also be used as a substrate for polishing operations used to apply the desired surface finish to polymeric plastics, metals, stones or other surfaces. The polishing pad 12 comprising the product 10 and the like can be used with lubricating oils, coolants and various polishing slurries that are well known and readily available to those skilled in the art.
Typical components of such slurries include liquid media such as water or oil, abrasives such as aluminum oxide, silicon carbide, silicon dioxide, cerium oxide and garnet, bases, acids, salts, surfactants, Alternatively, it may include other agents, or combinations thereof, depending on the nature of the processed product.

The product 10 and the like are, for example, wrapping (lappin).
g), useful for modifying the surface (also not shown) of a workpiece (not shown) by a polishing operation such as planarization, polishing or molding. The workpieces to be polished should preferably consist of fragile materials such as quartz, silicon, glass, electronic and optical substrates and high density multilayer electronic devices. The work piece is a semiconductor device (not shown) consisting of multiple layers of polysilicon, thermal oxide, and metallic material, each layer being planarized before the subsequent layers are deposited thereon.

As best shown in FIG. 1, the product
10 is an aqueous fluid slurry impermeable polymeric matrix typically used in polishing and planarization operations 14
Consists of. The polymeric matrix 14 can be formed from urethanes, melamines, polyesters, polysulfones, polyvinyl acetates, fluorohydrocarbons, and the like, as well as their analogs, mixtures, copolymers and grafts. Those skilled in the art will appreciate that any other polymer that has sufficient toughness and rigidity against abrasive wear during the polishing operation can be used in a manner consistent with the spirit and scope of the present invention. Be done. In the presently preferred form, polymeric matrix 14 comprises a urethane polymer. The urethane polymer is preferably a polyether-based liquor such as a polyether-based urethane prepolymer, such as the product of the Adiprene species, which is commercially available from Uniroyal Chemical Co., Middlebury, Connecticut.
Idurethane). Preferred urethane prepolymer (liquid urethane) is about 9 to 9.3% by weight.
It contains the free isocyanate group. Other isocyanate bearing products and prepolymers can be used in a manner consistent with the spirit and scope of the present invention.

The urethane prepolymer preferably reacts with a polyfunctional hydroxyl compound or mixed functional compound such as a polyfunctional amine, diamine, triamine or hydroxyl / amine present in the urethane / urea crosslink network to form urea chemical bonds and It shall allow the formation of a cured / crosslinked polymer network. Presently preferred, urethane prepolymers are available from Anderson Development, Inc. of Adrian, Michigan.
Product "Curene (R) 442" from evelopment Co.)
Commercially available as 4,4'-methylene-bis [2-
Reacts with chloroaniline] (“MOCA”).

As best shown in FIG. 1, the polymeric matrix 14 is impregnated with a plurality of polymeric microelements 16. Preferably, at least some of the polymeric microelements are wholly flexible. Suitable polymeric microelements include inorganic salts, sugar and water soluble gums and resins. Examples of such polymeric microelements are polyvinyl alcohol, pectin, polyvinyl pyrrolidone, hydroxyethylcellulose, methylcellulose, hydropropylmethylcellulose, carboxymethylcellulose. ), Hydroxypropylcellulose, polyacrylic acids, polyacrylamides, polyethylene glycols
ethylene glycols), polyhydroxyetheracrylites, starch, maleic acid copolymers, polyethylene oxide, polyurethane (po)
lyurethanes), and combinations thereof. Microelements 16 can be chemically modified to alter solubility, swelling power, and other properties, such as by branching, blocking, and crosslinking.

In the presently preferred form, each of the polymeric microelements 16 has an average diameter of less than or equal to about 150 μm, and more preferably, an average diameter of about 10 μm. Those skilled in the art will appreciate that the average diameter of the microelements can vary and that the polymeric matrix 14 can be impregnated with microelements 16 of the same or different sizes or a mixture of different microelements 16 if desired.

In the presently preferred form, each of the polymeric microelements 16 is spaced from about 1 μm to about 100 μm. Preferably, the polymer microelement
The 16 should be evenly distributed by high shear mixing substantially throughout the polymeric matrix 14. The resulting composite mixture is transferred to a conventional mold before the viscosity of the reactive urethane polymer becomes too large to allow adequate blending with the polymeric mixture of microelements. Those skilled in the art will appreciate that different thermosetting plastics and curing agents can change the low viscosity window at different temperatures. The resulting mixture gels in the mold for about 15 minutes. Gel time may vary based on factors such as temperature and the choice of polymeric matrix and microelements. The mixture is then cured at about 200-225 ° F for about 4-6 hours and cooled to room temperature (about 70 ° F). The curing temperature may vary depending on, among other factors, the polymeric matrix and the type of microelement used.

The resulting product 10 is removed from the mold, cut, sliced, or the like to a desired thickness and then shaped to form the polishing pad 12. One of ordinary skill in the art will appreciate that the shaped mixture can be cut, sliced or otherwise processed according to the present invention to any thickness or shape as desired.

Depending on the intended use or operation, at least some of the polymeric microelements 16 may have an overall spherical shape, as shown in FIG. Preferably, such microspheres are hollow, with each sphere having a diameter of about 0.1 μm.
Shall have a shell with a thickness of.

As best shown in FIG. 1, each polymeric microelement 16 has a void space 22 therein.
At least some of the polymeric microelements 16 preferably have a plurality of void spaces 22 therein, as best shown in FIG. Each void space 22 generally contains gas at a pressure greater than atmospheric pressure to help maintain the structural integrity of each of the microelements 16 ′, 16 at both the working surface 18 and the sub-surface 24 of the polymeric matrix 14. I have to.

The polymeric microelements may have a permeable or pierceable shell 20, as best shown in FIG. 11, so that the void space 22 within the microelement 16 'is relative to the working environment. Open.

As best shown in FIG. 1, a preferred example of product 10 is one in which at least some polymeric microelements 16 'located on work surface 18 come into contact with a work environment (not shown) or an abrasive slurry. Soften. For example, water soluble cellulose ethers such as methyl cellulose dissolve as soon as they come into contact with the water of the aqueous polishing slurry.

In another preferred embodiment, as best shown in FIG. 1, at least some of the polymeric microelements 16 'located on the work surface 18 expand upon contact with the work environment. For example, long chain cellulose ether swells as soon as it comes into contact with the water of the aqueous polishing slurry.

Product 10 has a working surface 18 and an adjoining minor surface 24, as best shown in FIGS.
Preferably, working surface 18 has a thickness of about 5 μm to about 60 μm. The thickness of product 10 is preferably about 300μ in a direction generally perpendicular to the major plane of work surface 18 (not shown).
It shall be between m and approximately 400 μm.

An advantage of the present invention is that the polymeric microelements 16 'on the working surface 18 of the product 10 are open and embedded in the sub-surface 24 when the product 10 is in contact with the working environment. Hardness is reduced. In addition, the reduced hardness polymer microelement 16 'is a portion of the polymer matrix 14 surrounding the reduced hardness microelement.
The bearing capacity for 15 is reduced, thereby reducing the effective hardness of its surrounding portion 15 of the polymeric matrix. Thus, at least two levels of hardness are created in the product 10 with the working surface 18 generally softer than the sub-surface 24.

Another advantage of the present invention is that the sub-surface 24 immediately adjacent to the work surface 18 is a new work surface as the work surface 18 of the product wears, such as by contact with the surface of the work piece or the work environment. And the two hardness levels are continuously reproduced,
This allows for more uniform and consistent polishing of the workpiece and more uniform wear of the pad 12.

A specific example of the product 10 will be described below.
The present invention is not limited to the following examples.

[Specific Example 1 of Product] The polymer matrix was about 150 ° F., and 2997 g of Uniroyal Adiprene L-325 polyether urethane urethane prepolymer was added to 768 g of "Curene (R)". ) Four
42 "(4,4'-methylene-bis [2-chloroaniline]
"MOCA"). At this temperature, the urethane / polyfunctional amine mixture has a pot life ("low viscosity range") of about 2.5 minutes.

Expancel having a void space containing gas at a pressure greater than atmospheric pressure during this low viscosity region
551 DE (Expancel 551 DE) Hollow Polymer Microsphere 69g
Was blended at 3450 rpm to distribute the microspheres evenly throughout the polymer blend using the polymer blend and the high speed shear blending and mixing equipment of Rodel Inc. In the meantime it was transferred to a conventional mold and left for 15 minutes for gelling.

The mold was then placed in a curing oven, such as is commercially available from Koch Oven Corporation. Mix the mixture in the oven
Cured at 200 ° F for about 5 hours. After curing, the power to the oven was shut off and the mixture was allowed to cool in the oven for about 4-6 hours until the temperature of the molded article 10 was about 70 ° F (room temperature). The molded product was then cut to form a polishing pad. The resulting average distance between the polishing pad 12 microspheres was about 75 μm and about 300 μm.
It seems to be between μm.

As shown in FIG. 4, when a pad is used to planarize a typical semiconductor device having patterns or chips spaced about 1 mm apart, the planarization factor (μm ⁻¹ ) is Expancelcell. (Expancel) 20 with embedded microspheres
For a mil-thick urethane pad (indicated by a square symbol), it is four times larger than a similar urethane pad without microspheres (indicated by a circle symbol). In other words, FIG. 4 shows that when the urethane pad in which the microelement according to the present invention is embedded is used, the urethane pad without the microelement is
Shows that the device is planarized twice as fast.

As shown in FIG. 10, the specific gravity of the molded product decreases as the flow rate of the microspheres increases.
Generally, it is preferred that the specific gravity of the pad be from about 0.75 to about 0.8, which corresponds to a flow rate of Expancel microspheres of about 53 g / min.

[Specific Example 2 of Product] The polymer matrix is
2997 g of Uniroyal Adiprene L-325 (Unir
oyal Adiprene L-325) Urethane of 768g "Cure
ne (R) 442 MOCA "and mixed the urethane polymer with Air Products and Chemicals of Allentown, PA.
Was prepared by high speed shear compounding with 87 g of partially acetylated polyvinyl alcohol powder commercially available from Corporation. During low viscosity range (2.5
Min), the mixture was poured into a mold in a manner similar to that of the product of Example 1 and gelled to about 6 in an oven at about 225 ° F.
It was cured over time and allowed to reach room temperature. Because of the much faster reaction with urethane amine groups (MOCA amino groups), it seems that basically no reaction has occurred between the OH groups of the polyvinyl alcohol and the isocyanate groups of the urethane prepolymer.

[Specific Example 3 of Product] The polymer matrix is
3625 g of Adiprene L-213
Prepared in a manner similar to that of Example 1 by mixing with 930 g of "Curene (R) 442 MOCA". During the low viscosity region (approximately 2.5 minutes), Freeman Industries In, Tuckahoe, NY
58 g of pectin powder, commercially available from c.), was high speed shear compounded with the urethane polymer to evenly distribute the pectin powder throughout the urethane mixture. During low viscosity range (2.
5 minutes), the resulting urethane / pectin mixture was poured into a mold in a manner similar to that shown in Example 1,
Cured on gel at about 225 ° F for about 6 hours,
It was cooled down and processed.

[Specific Example 4 of Product] The polymer matrix
2997 g of Adiprene L-325 was added to BASF Chemicals Corp. of Parisipani, NJ or GAF Chemicals of Wayne, NJ.
It was prepared by mixing with 65 g of polyvinylpyrrolidone powder commercially available from Corp.) for about 30 seconds to make a homogeneous formulation. "Curene (R) 442 MOCA"
(768 g) was melted at a temperature of about 212 ° -228 ° F. and was fast shear compounded with the urethane / polyvinylpyrrolidone mixture and poured into the mold during the low viscosity region, ie before 2.5 minutes had elapsed. The resulting mixture was gelled in a manner similar to that shown in Example 1, heated at about 225 ° F for about 6 hours, and then cut into polishing pads.

[Product Example 5] The polymer matrix
3625 g of "Adiprene L-213" and 930 g of "Curen"
e (R) 442 MOCA ". 65 g of white, free-flowing hydroxyethylcellulose in the low viscosity range [Union Carbide Chem of Danbury, Connecticut]
commercially available from icals and Plastics Corp.) was blended with the urethane mixture. Hydroxyethylcellulose is insoluble in organic solvents but dissolves in warm or cold water. The complex mixture was then processed in a manner similar to that shown in Example 1.

In another example, best shown in FIGS. 5-9, the working surface 18 of the article 10 may further be provided with a mini or macro sized pattern or groove 26 with concave and / or convex portions or textured structures 28. it can. The grooves 26 can be formed in at least a portion of the work surface 18 by mechanical grooving methods such as machining, embossing, turning, polishing, copying and laser machining. Those skilled in the art will appreciate that the groove 26 can be formed by various other mechanical or chemical methods, such as etching.

Grooving the working surface 18 can expose up to 50% or more of the surface to facilitate removal of slag during polishing. In addition to this, the work surface
Grooving 18 enhances the polishing action by increasing the number of exposed microelements 16 'to the working environment. Grooves 26 can have various patterns, contours, grooves, spirals, radii,
It can be formed in dots or any other shape. Grooving the working surface 18 of the pad 12 results in a series of hardness changes on a microscale. For example, the textured structure 28 may be shaped to form a cone or tip with a hard core and a soft outer surface in addition to the harder subsurface 24.

Preferably, working structures 28 are spaced at a distance of between about 0.1 mm and about 10 mm and have a depth of between about 1 mm and about 10 mm. Generally, the work structure 28 has a first dimension.
It is preferred to have a length in the (first dimension) that is less than about 1000 times the average diameter of the polymeric microelements 16. It is also preferred that the textured structure 28 have a depth less than about 2000 times the average diameter of the polymeric microelements 16.

As best shown in FIGS. 5 and 6, the working surface 18 can be provided with mini-sized grooves containing a working structure 28 having a width between about 1000 μm and 5 mm. Although the mini-sized grooves shown in FIGS. 5 and 6 are eccentric patterns, those skilled in the art will appreciate that mini-sized grooves can be spiral or other patterns, including those described above.

As best shown in FIGS. 7 and 8, working surface 18 is a machined structure each having a width greater than about 5 mm.
Macro-sized grooves including 28 can be provided. Figure 7
Although the mini-sized grooves are generally rectangular grids, as shown at 8 and 8, those skilled in the art will appreciate that the mini-sized grooves can be formed in any pattern, including those described above, if desired. .

Macro-sized and mini-sized grooves can be formed by typical machining methods such as relief, turning, polishing, copying and laser machining, and various other methods known to those skilled in the art.

Product Example 6 Using a standard lathe and a single tip tool, overlaying circular and square grid patterns, respectively, on a work surface 18 vacuum mounted to the lathe or milling machine rotary plate. Thus, the working surface 18 shown in FIGS. 5 to 8 was cut. Ganged cut
ting tools) or serrated teeth
A conventional milling machine with custom-made cutting combs spaced at constant intervals was used to machine work surface 18 into the desired pattern.

As best shown in FIG. 5, an annular mini-sized groove was attached to the polishing pad to provide a 1.397 mm
Grooves having a pitch of (0.055 ″) are formed, each groove having a depth of 0.356 mm (0.014 ″). The shape of the groove is a buttress thread having an inclination of 60 degrees toward the inner diameter of the pad, as shown in FIG.

The square grid macro-sized grooves 28 shown in FIGS. 7 and 8 are machined on a horizontal milling machine and have a width of 0.8.
Make multiple squares with grooves of 13mm (0.032 ″) and depth of 0.635mm (0.025 ″), which allow 6.35mm (0.
025 ″) processing structure 28 is defined.

As best shown in FIG. 9, work surface 18
Is about 1000 μm and 5 generated by using carbon dioxide laser.
It is also possible to provide a mini-sized groove containing a working structure 28 with a width lying between mm. Preferably, the micro-sized grooves are made in the form of a debris pattern on the work surface 18. The "fractal Patter" defined here
n) ”means a repetitive pattern having repetitive processed structures in which the processed structures are different from each other. The debris pattern is Koch Island & Lake
Debris pattern Gosper Island
Deterministic or non-deterministic mathematical formulas such as transformations (“Gosper pattern”) (shown in FIG. 9)
s). Suitable fragment models include circular, spherical and Swiss cheese tremas, but those skilled in the art will appreciate that other suitable fragment patterns may be used in accordance with the present invention as needed. Preferably, the debris pattern is chaotic
Or use a random shape.

Product Example 7 As best shown in FIG. 9, grooves or minisize grooves were machined into polishing pad 12 using a typical carbon dioxide laser with a continuous wave output of 100 watts. . The power rating, power and beam focus are approximately 0.458 mm (0.018 ″) deep and approximately 0.127 mm (0.005 mm) deep.
″) Selected to cut a groove having a width of
The mini-sized groove is the Koch Island and
It was a Gosper Island variant of the Lake (Koch Island & Lake) fragment pattern. The debris pattern image was electronically read and programmed into a conventional computer numerical controller that controlled the movement of the laser beam to form a debris pattern on the working surface 18 of the pad 12. To prevent the accumulation of gas traces, an adhesive shield (adhesive
mask) was placed on the pad. At the same time, this adhesive shield also adheres to the edges of the groove.
) Also decreased.

Alternatively, or additionally, an isolating "mesa" pattern can be embossed on the work surface 18 to form mini-sized grooves. For example, a conventional 30 ton press can be used to apply about 25 tons of pressure to emboss a mini-sized groove on the working surface 18 of the pad 12. Heat can be applied to enhance the relief effect.

The method according to the invention for planarizing the surface of a semiconductor device, which makes use of the article 10 or less according to the invention, is generally described below.

1-3, the method generally comprises the initial step of providing an article 10 or 110 comprising a polymeric matrix 14. The polymer matrix 14 is impregnated with a plurality of polymer microelements 16. Details of the steps of providing the polymeric matrix 14 and impregnating the matrix 14 with the microelements 16 have been described above, and further discussion is considered unnecessary and appears to be endless.
Preferably, the working surface 18 of the product 10 or 110 is grooved,
It is assumed that the working structure 28 is formed to provide an enlarged work surface, and if the work surface is entirely flat, the microelements that are not normally exposed are exposed to the work environment.

The method provides that at least a portion of the working surface 18 of the product 10 or 110 is more than the polymeric microelement 16 located on the sub-surface 24 adjacent to the polymeric microelement 16 'on the working surface 18 of the product 10 or 110. The method further comprises the step of contacting the work environment so as to reduce the hardness. Work surface
A portion of the shell 20 of at least a portion of the polymeric microelements 16 located in the vicinity of 18 changes the portion of the shell 20 by at least one of slicing, grinding, cutting and punching the portion. Alternatively, the microelement 16 is opened by softening, and a part of the polymer microelement 16 'of the working surface 18 is located on the sub-surface 24.
Try to reduce the hardness. How to work surface 18
Details regarding whether the hardness of the polymeric element 16 'can be reduced in the above are considered to be unnecessary and without further discussion, which is considered further.

The method comprises the step of contacting a surface of a semiconductor device (not shown) (also not shown) with at least a portion of the work surface 18 of the product such that the surface of the semiconductor device is sufficiently planarized. Is further provided. The product 10 or polishing pad 12 is mounted on a conventional polishing machine as is well known to those skilled in the art. Preferably, the working surface 18 is oriented generally parallel to the surface of the semiconductor device to be planarized, for example with a linear or circular sliding contact to planarize or grind the surface of the semiconductor device as needed. Shall be moved.

As the working surface 18 of the pad 12 is ground in sliding contact with the surface of the semiconductor device, a portion of the sub-surface 24 is exposed and the microelements 16 of the sub-surface 24 are ground or chemically. It undergoes a change or is softened to form a new work surface 18 having physical properties similar to the previously ground work surface. Thus, the working surface 18 in contact with the surface of the semiconductor device is substantially continuously regenerated, exerting a consistent planarization or polishing action on the surface of the semiconductor device throughout.

The method according to the invention for reclaiming the work surface 18 of a product according to the invention is generally described below.

In FIG. 11, the method comprises the initial step of providing a product 410 or pad 12 with a polymeric matrix 14 and impregnating the matrix 14 with a plurality of polymeric microelements 16. The details of the steps of forming product 10 are described above and further discussion is considered unnecessary and appears to be endless.

The present method comprises the step of opening at least a portion of the shell 20 of at least a portion of the polymeric microelements 16 located near the working surface 18 by the open microelements 16 '.
The micro element 16 of FIG. The step of opening the polymeric microelements may comprise at least one of slicing, grinding, cutting and punching a portion of each shell 20 of the microelements 16. As best shown in FIG.
The shell 20 of the microelement 16 'on the working surface 18 is a combination part of which is shown in section in FIG.
Ned can be drilled by pommelgation and drilling device 30. The device 30 can be formed from any material that is sufficiently rigid to drill the work surface 18 and the microelements 16, such as stainless steel, aluminum or other metal. The device 30 comprises a plurality of sharp tools or needles 32 that pierce at least a portion of the shell 20 of the polymeric microelement 16 located near the working surface 18.

In addition to the needle 32, the device 30 comprises at least one, and preferably a plurality of pads 34, which prevent the needle 32 from overdrilling the working surface 18. Preferably, the needle 32 pierces the working surface 18 at a depth of about 60 μm,
One of ordinary skill in the art will appreciate that the perforation depth of device 30 can be any depth up or down from 60 μm as needed. For example, a long needle 32 can be used to drill a hole in the working surface 18 that reaches a depth greater than 60 μm.

Those skilled in the art will appreciate that the microelements 16 can be opened or the pads 12 can be pierced as many times as needed.

In another example, at least a portion of the shell 20 of the polymeric microelement 16 located proximate to the work surface 18 has a partially modified polymeric microelement 16 at the work surface 18 embedded in the sub-surface 24. The polymer microelement 16 is chemically changed or softened by the working environment so that the hardness thereof is lower than that of the polymer microelement 16. For example, polymer microelements
16 can be formed from water-soluble cellulose ether with methylcellulose or propylmethylcellulose hydroxide that is at least partially soluble when contacted with a working environment containing water.

From the foregoing description, the present invention reduces the effective stiffness of products that modify the surface of a workpiece, such as a semiconductor device, and polymeric microelements located on a portion of the work surface of such a product, It can be seen that the method comprises reclaiming the working surface of such a product and further planarizing the surface of the semiconductor device using such a product.
This product can be used to polish or planarize substrates and other processed products more quickly and uniformly.

It will be appreciated by those skilled in the art that other modifications can be made to the examples without departing from the broad inventive idea of the examples described above. Therefore, the present invention is not limited to the disclosed examples,
It is to be understood that all changes that come within the spirit and scope of the invention as defined by the appended claims are intended to be included.

[0067]

The method of flattening a processed product according to the present invention comprises:
Since the work surface of the product is regenerated and does not significantly change as the work surface comes into contact with the processed product as described above, the surface of the processed product can be uniformly flattened.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a product used in the present invention.

FIG. 2 is a schematic cross-sectional view of a modification of the product used in the present invention.

FIG. 3 is a schematic cross-sectional view showing a modified state of the product used in the present invention, showing a state in which the microelements on the product work surface expand when they contact the work environment.

FIG. 4 is a graph of planarization rate as a function of inter-pattern distance at the surface of a typical semiconductor device.

FIG. 5 is a schematic diagram of a modification of the mini-sized grooved pad used in the present invention.

6 is an enlarged partial cross-sectional view of the pad taken along line 6-6 of FIG.

FIG. 7 is a schematic diagram of a modification of the macro-sized grooved pad used in the present invention.

8 is an enlarged partial cross-sectional view of the pad taken along line 8-8 of FIG.

FIG. 9 is a modification of a fractal pattern mini-sized grooved pad used in the present invention.

FIG. 10 is a bar graph showing the specific gravity as a function of flow rate of the product microspheres used in the present invention.

FIG. 11 shows a part of a shell of a micro element on a work surface of a product used in the present invention, which is a pommel gate.
te) Schematic diagram of a device that pierces and pierces.

[Explanation of symbols]

10 products 18 Working surface 16 Polymer microelement 20 shell 24 Secondary surface 22 void space

Continued Front Page (72) Inventor Roberts John Ve. Eichi. USA Delaware 19702 New Work West Country Lane 17 (72) Inventor MacLaine Harry George USA Delaware 19709 Middletown Sugar Pine Drive 257 (72) Inventor Jensen Elmir William United States Delaware 19720 Newcastle South Dupont Ha Iway 325 (72) Inventor Badinger William Dee. 19713 New Work Berave Road, Delaware, United States 451 (56) Reference JP-A-2-232173 (JP, A) U.S. Patent 3928949 (US, A) (58) Fields investigated ( Int.Cl. ⁷ , DB name) B24B 37/00 C08J 5/14 C08J 7/00 H01L 21/304 622

Claims (4)

(57) [Claims] 1. A method of flattening the surface of a processed product, comprising: (a) supplying a processed product having a surface to be planarized; (b) supplying a product that changes the surface of the processed product; and (C) contacting the surface of the processed product with the product in the presence of an abrasive slurry; wherein the product has: (1) a void space, which itself is substantially the surface of the processed product. A plurality of polymer microelements that do not polish the polymer matrix, which are impregnated with the polymer matrix; (2) have a work surface and a sub-surface adjacent to the work surface; The polymeric microelements that open when exposed to the working environment reduce the hardness of the polymeric microelements located on the working surface to less than the hardness of the polymeric microelements embedded in the sub-surface; And By step (c), the working surface of the product is worn,
Thereby, the sub-surface is regenerated as a new work surface. 2. A method for flattening the surface of a processed product, comprising: (a) supplying a processed product having a surface to be planarized; (b) supplying a product that changes the surface of the processed product; and (C) contacting the surface of the processed product with the product in the presence of an abrasive slurry; wherein the product is: (1) a polymer that does not itself substantially polish the surface of the processed product. A plurality of microelements consisting of an impregnated polymer matrix; (2) having a work surface and a sub-surface adjacent to the work surface; (3) a polymer microelement located on the work surface by the step (c). However, when it contacts the working environment, it melts or swells,
As a result, the hardness of the polymer microelements located on the working surface is less than the hardness of the polymer microelements embedded in the sub-surface; and by the step (c), the working of the product is performed. The surface is worn,
Thereby, the sub-surface is regenerated as a new work surface. 3. The method according to claim 1, wherein the product is a product having a groove on a work surface. 4. The processed product is a semiconductor device,
The method according to claim 1.