JP3429943B2 - Method and apparatus for separating laminated chip components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for separating laminated chip parts, and more specifically, to a state in which a plurality of laminated chip parts constituting a green laminated block are adhered to each other. Is solved (separated), or adjacent laminated chip parts are aligned (separated) at a predetermined distance.

[0002]

2. Description of the Related Art In order to manufacture laminated chip parts such as dielectric filters, chip capacitors and chip transformers, first, a large number of dielectric ceramic sheets (green sheets) are used.
Are laminated and integrated to form a flat dielectric block 1 as shown in FIG. It should be noted that a conductive paste having a predetermined pattern is printed on the surface of a predetermined object among the green sheets constituting the dielectric block 1.

Since many chip parts (multilayer chip parts 2) are usually manufactured simultaneously from one dielectric block 1, the pattern formed on the surface of the green sheet constitutes one multilevel chip part. The conductor pattern has a shape repeated in the vertical and horizontal directions. Therefore, as shown in the drawing, the parts constituting the laminated chip component 2 are formed in an aligned state in the vertical and horizontal directions.

Therefore, cutting blades are inserted into the dielectric block 1 at equal intervals in the lateral direction to make incisions, and then the cutting blade is rotated 90 degrees to insert the cutting blades at equal intervals in the vertical direction. And make a notch. At this time, the position at which the cutting blade is inserted is determined based on the marker provided at the predetermined position on the blank 4 at the boundary between the adjacent laminated chip components 2. Then, when the cutting blade is first inserted in the horizontal direction, if the separated portions are separated or fall down, the next cutting in the vertical direction cannot be performed, so the blade width of the cutting blade is larger than that of the dielectric block 1. Also keep it short. Therefore, even after the cutting blades are inserted in the vertical and horizontal directions to divide the dielectric block 1 into two units of laminated chip parts, an endless frame portion (blank) remains around the dielectric block 1.

That is, the dielectric block 1 is a frame-shaped blank which is not used as a laminated chip component existing around the portion of the laminated chip component formation region 3 in which a large number of laminated chip components 2 are formed in the central portion. It is divided into 4. By the blank 4, the laminated chip components 2 once separated by the cutting blade are also kept in contact with each other without being separated from each other.

Therefore, the blank 4 is then manually removed from the laminated chip component forming region 3 and removed. Further, the laminated chip component forming area 3 is bent to separate each laminated chip component 2 one by one. Then, since it is necessary to perform printing on the side surfaces of the laminated chip components 2 that are separated from each other, the separated laminated chip components are arranged on the upper surface of the transport tray for the printing machine. At this time, it is preferable to orient the laminated chip components 2 in the same direction and arrange them so as to be aligned in the vertical and horizontal directions while being separated from each other by a predetermined distance so that a printing process performed as a post process can be easily performed. Then, each layered chip component 2 is transported to the printing machine together with the transport tray, and the printing process is performed on the surface of each layered chip component 2.

[0007]

However, the above-mentioned conventional method for separating laminated chip parts has the following problems. That is, the dielectric block 1 is in the green state and is therefore soft. Therefore, if an excessive force is applied during manual bending, the laminated chip component 2 may be deformed, resulting in a defective product.

Further, since it is in the green state, even if the cutting blade is used for the separation in the previous step, the laminated chip components 2 contacting each other by the blank 4 are re-adhered to each other and are hardly separated from each other. And as time goes by, the adhesive strength becomes stronger. Therefore, they are adhered to each other and integrated so that they are difficult to separate and separate. Therefore, when the blank 4 is manually removed or the laminated chip components 2 are separated / separated from each other, it is inevitable that a large amount of force is applied to separate the laminated chip components 2 from each other, and the above-mentioned problem is further reduced. It occurs remarkably.

Further, when arranging the laminated chip parts on a carrying tray for a printing machine, it is troublesome and time-consuming to manually arrange the laminated chip parts 2 at equal intervals in the vertical and horizontal directions and to align the respective directions. It takes. Further, since the laminated chip component 2 is very small (about several mm square), the orientation may be wrong, and in such a case, if the side face printing is performed as it is, it will be a defective product.

The present invention has been made in view of the above background, and an object of the present invention is to solve the above-mentioned problems and to adhere and adhere the laminated chip parts to each other without deforming the laminated block in the green state. To eliminate the sticky state,
Furthermore, it is another object of the present invention to provide a method and apparatus for separating a laminated chip component that can quickly and accurately separate and align the laminated chip component from the laminated block.

[0011]

In order to achieve the above-mentioned object, in the method of separating a laminated chip component according to the present invention, a blank having a frame shape is provided around the blank, and the region surrounded by the blank has a vertical and horizontal direction. Multiple layered chip parts are arranged in the direction,
In addition, the notch is formed in advance at the position where each laminated chip component is partitioned, but an unsintered laminated block in which adjacent laminated chip components are in an adhesive state with each other is treated, and the following 2 treatments are performed. (Claim 1).

First Treatment While sandwiching the blank from both the front and back sides, the blank is moved from the region by at least the thickness of the laminated block in the thickness direction with respect to the region.

Second Treatment Among the plurality of laminated chip components, every other one in the vertical direction and the lateral direction corresponds to the corresponding laminated chip component with the upper pin from the surface side and the rest of the laminated components. The pins are brought into contact with the chip component from the back side, and in that state, the lower pins located on both the front and back sides are moved forward relatively, and the adjacent laminated chip components are moved in the opposite direction in the thickness direction to adhere. Cancel the state.

The first processing and the second processing may be performed at the same time, or one of them may be performed first. Then, by performing the first process, the blank is separated from the laminated chip component and removed. Therefore, there is no control from the outer periphery for a large number of laminated chip components. By further performing the second treatment, the adjacent laminated chip component is moved to the opposite side in the thickness direction,
The sticky state is eliminated. And since the first treatment is performed as described above and there is no suppression from the outer periphery by the blank,
The tacky state that has been resolved is retained, and the tacky state does not reappear even if they are in contact with each other. Therefore, the separation process of releasing the adhesive state is completed.

On the other hand, as another solving means, there is a separating method in which a plurality of laminated chip parts arranged in contact with each other in the vertical and horizontal directions in a horizontal plane are aligned in the vertical and horizontal directions at a predetermined distance. Of the plurality of layered chip components, one row of layered chip components arranged in the lateral direction is held and the process of transferring to the next placement location is repeatedly performed for each column, and adjacent to each other when the transfer is performed. The first processing step in which the laminated chip components in each row in the horizontal direction are separated from each other in the vertical direction by a predetermined distance, and the first processing step is executed to transfer the plurality of vertically separated chips. With respect to the laminated chip component, while holding one row of laminated chip components arranged in the horizontal direction, the process of transferring to the next placement location is repeatedly performed for each column, and when the transferring is performed, the adjacent chip components The laminated chip component of each column countercurrent to laterally perform a second processing step which is separated as much as a predetermined distance (claim 2).

That is, by carrying out the first processing step, one row of laminated chip components lined up in the X-axis direction is held at the same time, so that they are transferred to the extension tray while maintaining the aligned state in the one row direction. To be Then, when they are placed on the expansion tray, they are separated by a predetermined distance in the Y-axis direction. Therefore, when they are transferred to the expansion tray, the adjacent laminated chip components are in contact with each other in the X-axis direction and in the Y-axis direction. Leave at regular intervals. As a result, when viewed in the Y-axis direction, the laminated chip components are arranged in a straight line (the distance corresponding to the above-described predetermined distance is increased).

By executing the second processing step, one line of laminated chip components arranged linearly at a predetermined interval in the Y-axis direction is held and transferred to the next area. The alignment in the Y-axis direction is maintained during transfer. Then, since they are placed at predetermined intervals in the X-axis direction at the time of transfer, by performing the first and second processing steps, they are separated into aligned states separated by a predetermined distance in the X and Y directions. It

Then, a plurality of laminated chip parts which are in contact with each other in a state where the adhesive state is released in the horizontal and vertical directions in the horizontal plane, which are obtained by executing the separating method according to the above-mentioned claim 1, are claimed. When the separation method described in 2 is executed, a plurality of laminated chip components can be automatically separated from a laminated block with a blank into an aligned state in which they are separated from each other by a predetermined distance.

As an apparatus for carrying out claim 3, a frame-shaped blank is provided in the periphery, and a plurality of layered chip parts are arranged in the vertical and horizontal directions in a region surrounded by the blank, and , By pressing in the thickness direction against the respective parts of the unsintered laminated block in which adjacent laminated chip components are in a mutually adhesive state, although notches are formed in advance at the positions where the respective laminated chip components are partitioned, A first separating device for removing the blank and releasing the adhering state of the adjacent laminated chip components and a plurality of laminated chip components arranged in contact with each other in the horizontal and vertical directions in a horizontal plane are predetermined in the vertical and horizontal directions, respectively. A second separating device aligned in a state of being separated by a distance.

Then, the first separating device is defined by claim 1.
A plurality of upper pins for performing the process shown in FIG. 3 that are protruded downward so as to be able to contact the predetermined laminated chip component, a mechanism for moving the upper pins up and down, and a blank arranged on the outer periphery. An upper die having an abuttable upper blank removing portion, a plurality of lower pins protruding upward, a lower receiving portion that is pushed down by a force received from the upper pins, and a lower receiving portion arranged on the outer periphery. And a lower mold having a lower blank removal portion capable of contacting the blank.

The second separating device is for carrying out the process according to claim 2 and holds an X-axis head for holding an X-axis row of a plurality of laminated chip components forming a laminated chip component forming region. A head having a Y-axis head for adsorbing the Y-axis row of a plurality of laminated chip parts, a moving means for moving the head to an arbitrary three-dimensional position, and a laminated chip part moved by the head. An expansion tray for temporally arranging them apart from each other in the Y-axis direction is provided (claim 4).

Preferably, a receiving plate (in the embodiment, a "sliding plate") whose tip can be inclined is attached to the lower mold. When the lower die is horizontally moved and is positioned below the upper die, the tip of the receiving plate is inclined, and the lower die is moved in the opposite direction to move the lower plate. It is to keep the receiving plate horizontal when it is located below the upper mold. In this way, the blank removed by the first separating device can be removed to the outside through the receiving plate.

The term "separation" as used in the present invention means not only that the laminated chip parts in contact with each other are separated, but even if they are in contact with each other, the green state (sticky) It also means releasing the adhesive state.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a laminated block separating device and a laminated block separating method according to the present invention will be described in detail.
FIG. 1 shows an embodiment of a separation device according to the present invention. In the present embodiment, as shown in FIG. 9, a notch is formed along the shape of the laminated chip component 2 in the previous step, the periphery is surrounded by the blank 4, and a large number of laminated chip components 2 are mutually adhered to each other by adhesive force in the central portion. This is a device for removing the blank 4 from the laminated block 1 in close contact with each other and weakening the adhesive force between the adjacent laminated chip components 2 to separate the laminated chip components 2 into a state in which they are easily separated from each other. .

The separating device 10 includes an upper mold 11 that moves up and down.
And the lower die 12. And the lower mold 12
With the laminated block 1 placed on the upper die 11, the upper die 11 moves downward to sandwich the laminated block 1 between the two dies 11 and 12 and press the die 11 vertically with a predetermined pressure.

Each of the molds 11 and 12 has a mechanism portion that abuts and removes the blank 4 and a mechanism portion that abuts the laminated chip component forming region 3 and separates the laminated chip components 2. Both are able to go up and down independently.

First, the side of the upper die 11 will be described. The upper blank removing portion 1 that abuts the blank 4 on the outermost periphery thereof.
6 is provided. The upper blank removing portion 16 is formed in a rectangular tube shape having an opening at the top and bottom, and the bottom surface thereof serves as a blank suction portion 16 a that abuts the blank 4 of the laminated block 1. The blank suction portion 16a has an inwardly projecting flange portion, and the upper surface on the tip side thereof serves as a locking surface 16b. Further, a suction hole 16c extending vertically is formed in the upper blank removing portion 16, and the lower end of the suction hole 16c is opened to the blank suction portion 16a. And
The upper end of the suction hole 16c is connected to a vacuum pump (not shown).

A mechanism for contacting the layered chip component forming region 3 and separating each layered chip component 2 is housed in the upper blank removing section 16 so as to be movable up and down relatively. That is, first, the quadrangular prismatic upper body 13 having an outer shape substantially matching the inner peripheral shape of the upper blank removing portion 16 is movably housed in the vertical direction.

The upper body 13 has a flat rectangular recess 13a having a relatively large area formed on the bottom surface thereof, and a flat rectangular recess 13b having a relatively small area formed at the center of the upper surface of the upper body 13. ing. The upper opening portion of the concave portion 13b is slightly widened to form a step portion 13c. Further, a through hole 13 penetrating the center of the upper body 13
d is formed, and the recess 13a and the recess 13b communicate with each other through the through hole 13d.

A flat rectangular base plate 14 is inserted and arranged in the recess 13a so as to be movable up and down. The outer shape of the base plate 14 is the same as or slightly smaller than the inner shape of the recess 13a, and the wall thickness thereof is thinner than the depth of the recess 13a. As a result, the base plate 14 can be moved up and down in the recess 13a. And, on the bottom surface of the base plate 14,
A large number of upper pins 14a are arranged in a staggered pattern. That is, as shown in FIG. 2, each upper pin 14a is arranged at a position facing each laminated chip component 2 of the laminated block 1, and in the horizontal example, every other pin is arranged at the same time as the nth column and n + 1. In the row, the positions are shifted laterally by one laminated chip component.

Further, on the lower surface of the upper body 13, an upper pedestal 15 having a hole 15a at a position facing the upper pin 14a is attached and integrated. As a result, the opening of the recess 13a is closed by the upper pedestal 15, and the base plate 14 is stored in the recess 13a.

The upper pedestal 15 is formed in a flat rectangular shape, and a flange portion 16b projecting outward over the entire circumference is formed on the outer peripheral edge of the upper end of the upper pedestal 15. This flange 16
The portion b is joined to the bottom surface of the upper body 13. The outer shape of the flange portion 16b is substantially the same as the outer shape of the lower surface of the upper body 13, and the outer shape of the lower end of the upper pedestal 15 is the blank suction portion 1 on the bottom surface of the upper blank removing portion 16.
The shape of the inner peripheral edge of 6a is substantially the same. As a result, the lower end of the upper pedestal 15 has the blank removing portion 16
It is exposed through the bottom opening.

Further, in the normal state with no load, as shown in FIG. 1, the lower end surface of the pedestal 15 and the blank removing portion 16 are provided.
The blank suction portion 16a is located on the same plane, and a predetermined gap is formed between the locking surface 16b of the blank suction portion 16a and the flange portion 15b of the upper pedestal 15. As a result, the blank removing portion 16 can be moved upward relative to the upper body 13 by a distance corresponding to the gap.

Furthermore, the thickness of the upper pedestal 15 is smaller than the length of the upper pin 14a. This allows
When the base plate 14 descends and contacts the upper surface of the upper pedestal 15, the lower ends of the upper pins 14 a project from the bottom surface of the upper pedestal 15.

The base plate 14 is moved up and down by a cylinder or an air press. Specifically, the driving force of the cylinder or the air press is transmitted through a power transmission mechanism as described below. There is. That is, the lower end of the connecting rod 17 is attached to the center of the upper surface of the base plate 14 via the attachment plate 18. The connecting rod 17 is thrustably inserted into a through hole 13d formed in the upper body 13, and the upper end thereof is a recess 13b.
It is located inside. Then, the upper end of the connecting rod 17 is attached to the locking plate 19. The outer shape of the locking plate 19 is matched with the inner shape of a space which is formed in the upper opening portion of the concave portion 13b and is located in the space.

Further, the recess 13 is formed on the upper surface of the upper body 13.
A stopper 21 is attached to cover the outer peripheral edge of b and prevent the locking plate 19 from coming off. As a result, this stopper 2
The locking plate 19 comes to move between the inner peripheral edge portion of 1 and the step portion 13c on the opening side of the recess 13b.

Further, a connecting member 20 for connecting to a drive source such as a cylinder rod is attached to the upper surface of the locking plate 19. Furthermore, the upper portion of the connecting rod 17 is inserted into the coil spring 22, and both ends of the coil spring 22 are provided on the bottom surface of the recess 13b and the locking plate 19.
Is in contact with. As a result, when there is no load, the elastic force of the coil spring 22 urges the locking plate 19 upward. Therefore, as shown in FIG. 1, the base plate 14 rises, and the lower end of the upper pin 14a and the lower surface of the upper pedestal 15 are held in the same state. And
When the cylinder extends, the locking plate 19 moves downward while compressing and deforming the coil spring 22, and the connecting rod 17 and the base plate 14 follow the movement. As a result, the upper pin 14 a comes to project from the upper pedestal 15.

It should be noted that the upper die 11 is designed to be largely moved up and down by a drive mechanism different from the raising and lowering movement of the base plate 14 (upper pin 14a) based on the cylinder described above.

Next, the structure of the lower die 12 will be described. The structure of the lower mold 12 is basically the same as the structure of the upper mold 11 described above. That is, the lower blank removing section 26 is provided at the outermost periphery, and the blank push-up section 26a formed on the upper surface thereof and the upper blank removing section 16 described above.
The blank 4 of the laminated block 1 is sandwiched between the blank suction portion 16a and the blank suction portion 16a.
In addition, the suction hole 26c is also provided in the lower blank removing section 26.
Is formed, and suction is possible.

Then, the lower main body 23 is housed in the lower blank removing section 26 so as to be vertically movable relative to each other, and the base plate 24 is vertically moved in a recess 23a formed in the upper surface of the lower main body 23. It is arranged as possible. Then, the flange portion 25b of the lower pedestal 25 is joined to the upper surface of the lower body 23 so as to close the recess 23.

A large number of lower pins 24a are formed upright at predetermined positions on the upper surface of the base plate 24, and the lower pins 24a are inserted and arranged in the holes 25a formed in the lower pedestal 25. The layout of the lower pins 24a is also zigzag like the upper pins 14a, and is arranged at a position facing each laminated chip component 2 of the laminated block 1, and every other one in a horizontal example. At the same time, in the n-th row and the (n + 1) -th row, the arrangement positions are horizontally shifted by one laminated chip component. Further, the lower pin 24a is located at a position where the upper pin 14a is not formed. As a result, when attention is paid to one horizontal row or one vertical row of the laminated chip component forming region 3, the upper pin 14a and the lower pin 2 are adjacent to the adjacent laminated chip component 2.
4a and 4a come into contact with each other alternately. Then, each laminated chip component 2 has a corresponding upper pin 14a and lower pedestal 2
5 or between the lower pin 24a and the upper pedestal 15 from above and below.

Further, the flange 25b formed at the lower end of the lower pedestal 25 is in contact with the locking surface 26b of the lower blank suction portion 26 to restrain the movement, which is similar to the upper mold 11. . However, in the lower die 12, as shown in FIG. 1, in the normal state with no load, the flange portion 25b and the locking surface 26b have already contacted each other, and in this state, the blank suction portion 26a and the lower pedestal 25 In addition, the upper surfaces of the lower pins 24a are located on the same plane.

Further, on the lower surface of the base plate 24,
The mounting plate 28 is adhered, and the connecting rod 2 is provided below the mounting plate 28.
7, the locking plate 29, and the connecting member 30 are sequentially connected. Then, the connecting rod 27 is inserted in the through hole 23d formed in the center axis of the lower main body 23 so as to be capable of thrust movement. Further, the locking plate 29 is housed in a recess 23 b formed on the lower surface of the lower body 23, and the stopper 31 and the step portion 23.
It is possible to move between c. Furthermore, the connecting rod 2
7 is also the same as that of the upper die 11 in that both ends of the coil spring 32 arranged coaxially with 7 are in contact with the bottom surface of the recess 23b and the locking plate 29.

However, in the upper mold 11, the drive source (cylinder) is connected to the connecting member 20 and transmitted to the upper pin 24a (base plate 24), but on the lower mold 12 side, the connecting member 30 is connected. Is a fixed system with no drive source connected. That is, when the upper pin 24a is lowered, the pressing force is transmitted to the lower pedestal 25 via the laminated chip component 2, and the lower pedestal 25 is moved downward. However, since the base plate 24 is fixed, it does not move downward, and the lower pin 24a also retains its position. Therefore, the lower pin 24a relatively rises and projects from the upper surface of the lower pedestal 25.

The power from the drive source (cylinder or the like) on the lower die 12 side is transmitted to the lower blank removing section 26 to move it upward. And
The pressing force generated by the rise is transmitted to the upper blank remover 16 via the blank 4, and the upper blank remover 16 can be raised.

Next, the separation device 10 of the above-described embodiment
An example of the embodiment of the separating method of the present invention for removing the blank of the laminated block and separating each laminated chip component will be described with reference to FIG. In the present embodiment, the work of removing the blank and the work of separating the laminated chip component are performed at the same time, but in order to make the method of the work easier to understand, FIG. 3 (an explanatory view until the blank is removed) and FIG. (Illustrated separately until the separation).

First, as shown in FIG. 3A, since there is no load, the lower surface of the upper pedestal 15 and the lower surface of the blank suction section 16a provided in the upper blank removing section 16 are on the same plane. Located in. Similarly, the upper surface of the lower plate 25 and the upper surface of the blank push-up portion 26a provided in the lower blank removing portion 26 are located on the same plane. The upper die 11 is located at an upper position and is separated from the lower die 12.

In this state, on the upper surface of the lower mold 12 (the upper surface of the lower plate 25 and the upper surface of the lower blank removing portion 26),
The laminated block 1 is arranged. At this time, the laminated block 1
The blank 4 constituting the above is arranged so as to be located above the blank push-up portion 26a ((A) of the same figure). Then, the blank 4 portion is suction-held through the suction hole 26c in the lower blank removing portion 26 so that the position does not shift.

Next, the upper mold 11 is lowered to move the upper mold 1
The laminated block 1 is sandwiched between 1 and the lower die 12. As a result, the blank 4 comes into contact with the upper and lower blank removing portions 16 and 26 on both sides thereof, and the laminated chip component forming region 3 is
The upper and lower pedestals 15 and 25 are in contact with both surfaces thereof. At this time, the suction hole 1 formed in the upper blank removing portion 16
The blank 4 is sucked through 6c (FIG. 2 (B)).

Then, the lower blank removing section 26 is raised upward. Then, the pushing force is transmitted to the blank suction section 16a of the upper blank removal section 16 via the blank 4. Since the blank removing parts 16 and 26 can be moved up and down independently of the pedestals 15 and 25 and the like arranged in the inner peripheral space thereof, the upper blanks based on the pushing force. The removal unit 16 moves up. Therefore, the blank 4 clamped between the blank push-up part 26a and the blank suction part 16a also moves up accordingly. But,
Both cradle 15 and 25 do not move, so that cradle 1
The layered chip component forming region 3 sandwiched between 5, 25 does not move either. Therefore, only the blank 4 rises, so that the adhesive state of the laminated chip component forming region 3 and the blank 4 is released and separated. Then, the blank 4 is completely separated because the ascending distance is moved by more than the thickness of the laminated block 1 (for example, about 2.5 mm) (for example, about 5 mm) (FIG. 3C).

On the other hand, at the same time as the blank separating step shown in FIGS. 4B to 4C, a separating process is also performed between the adjacent laminated chip components 2 as shown in FIG. That is, FIG. 3 (B)
4A is an enlarged view of the periphery of the laminated block 1 in the state shown in FIG. 4A, and the periphery of the laminated block 1 in the state shown in FIG. And Fig. 4
It looks like (B). Then, as shown in FIG.
As can be seen by comparing (B), the upper blank removing portion 16 and the lower blank removing portion 26 are elevated to separate the blank 4 from the laminated chip component forming region 3.

On the other hand, paying attention to the layered chip component forming region 3, as shown in FIG. 4A, the lower end of the upper pin 14a is located on the same plane as the lower surface of the upper pedestal 15 and the lower pin 24a. The upper end is located on the same plane as the upper surface of the lower pedestal 25. Therefore, in this state, the laminated block 1 is uniformly applied with pressure from above and below to maintain a flat state.

The upper pins 14a located above the layered chip component forming area 3 contact every other layered chip component 2 in the vertical and horizontal directions, and between the upper pin 14a and the lower pedestal 25, the layered chip component is formed. Hold 2 In addition, the laminated chip component 2 that does not contact the upper pin 14a has the lower pin 24
It is sandwiched between a and the upper pedestal 15.

Then, the base plate 14 (the upper pin 1
4a) is operated to operate the cylinder or the like to move the base plate 14 (upper pin 14a) downward. The moving distance at this time is shorter (for example, about 0.5 mm) than the thickness of the laminated block 1 (about 2.5 mm). Along with this downward movement, the lower pedestal 25 and the lower main body 23 also move downward. Since the connecting member 30 is fixed, the coil spring 32 is compressed and deformed, and the lower pin 24a does not descend. Therefore, the laminated chip component 2 sandwiched between the lower pin 24 a and the upper pedestal 15
Maintains its position without moving and the upper pin 14
a and the laminated chip component 2 sandwiched by the lower pedestal 25 move downward. Therefore, the height positions of the adjacent laminated chip components 2 are displaced from each other, so that the laminated chip components 2 are separated from each other in an adhesive state and separated (FIG. 8B).

Then, the entire upper die 11 is raised. At this time, since the blank 4 is sucked by the suction hole 16c, the blank 4 is lifted while being held by the upper blank remover 16 (FIG. 2D). Further, when the upper pin 14a rises, the pressing force applied to the lower pedestal 25 transmitted through the laminated chip component 2 is released, so that the coil spring 32 expands due to the elastic restoring force, and the lower main body 23, The lower pedestal 25 is lifted, whereby the initial state in which the upper ends of the lower pins 24a and the upper surface of the lower pedestal 25 are located on the same plane is restored.

Then, by moving the lower die 12 horizontally as described later, the laminated chip component forming region 3 separated into a plurality of laminated chip components is left on the upper surface of the lower pedestal 25 (the same figure). (E)).

By the above-mentioned method, the adjacent laminated chip parts 2 can be separated from each other (in a state where the adhesive strength is reduced). Since the blank 4 is removed, there is no force to press the laminated chip components 2 from each other with a predetermined force from the outer periphery, so that the separated state is maintained.

At this time, the positions of the separated multilayer chip parts are still adjacent to each other, but in order to easily perform the printing work for manufacturing the dielectric filter or the like, the multilayer chip parts are slightly separated from each other. At a distance,
Further, it is desirable that the laminated chip component arrangement positions are aligned in the vertical and horizontal directions.

Therefore, in the present invention, the above-mentioned separating device (first separating device) 10 is provided, and further, the adjacent laminated chip components are predetermined so that the arrangement position of the laminated chip components can be easily conveyed to the printing machine. Provided is a separation device for laminated chip parts, which is provided with a second separation device which can be aligned in the vertical and horizontal directions while being separated by a distance.

That is, FIGS. 5 to 7 show an embodiment of the separation device for such a laminated chip component. As shown in the figure, the work table 33 is attached to the upper surface of the work table 33 having a substantially plate shape.
A base 34 having the same shape as the surface shape and having a predetermined thickness is provided so that the surface of the base 34 has a flat surface without irregularities. The above-described first separating device 10 is arranged at a predetermined position on the upper surface of the base 34.

As shown, the first separation device 10 is
The top plate 3 is attached to the upper ends of the four pillars 35 arranged at the apexes of the rectangle.
6 is supported, and the above-mentioned upper mold 11 and lower mold 12 are arranged in the space formed by the pillar 35 and the top plate 36. Then, the cylinder 37 attached to the top plate 36
As a result, the entire upper die 11 is moved up and down. The base plate 14 (upper pin 14a) is moved up and down by the coupling 38 on the upper surface of the upper mold 11.

Further, although the lower die 12 does not change its height position as described above, it can move in the horizontal direction and can move to the outside of the space formed by the columns 35 and the top plate 36. There is. That is, the lower mold 12 has the base 34.
It is arranged on a guide rail 39 installed on the upper surface of, and can be moved forward and backward along the guide rail 39.

Then, the cylinder rod 42 of the cylinder 41 installed on the base 34 via the two substantially L-shaped fittings 40 is connected to the side surface of the lower die 12 so that the cylinder rod 42 reciprocates. Lower mold 1 following movement
2 moves forward and backward. That is, when the cylinder rod 42 is completely projected, the lower die 12 is located below the upper die 11, and in the state where the cylinder rod 42 is housed in the cylinder 41, as shown in FIG. The lower mold 12 is a pillar 35
It is set to be located outside.

Further, one end 43a of a substantially L-shaped sliding plate 43 is attached to the side surface of the lower die 12 opposite to the attachment surface of the cylinder rod 42. This sliding plate 43 has a hinge portion 43b provided at an intermediate portion so that the other end 4
The 3c side has two horizontal postures, as shown in FIG. 5, and two downwardly inclined postures, as indicated by the chain double-dashed line in the figure. That is, as shown in the figure, when the lower die 12 is completely pulled out, the other end 43c of the sliding plate 43 is attached to the upper end of the first support rod 45a that is erected on the base 34. It is supported by the roller 46a and its downward movement is restrained, so that its plate surface is kept horizontal. on the other hand,
The lower die 12 moves to the right side from the state shown in the drawing and moves to the upper die 11
When it is located below, the hinge part 43b is located outside (on the right side in the drawing) of the first roller 46a, so that the other end 43c of the sliding plate 43 rotates clockwise about the hinge part 43b. It slopes downward. And the other end 43
c is supported by the second roller 46b attached to the upper end of the second support rod 45b, further lowering is suppressed, and the inclined state of a predetermined angle is maintained. Further, in this example, the tray 47 is placed outside the second support rod 45b,
The blank that has slid down on the sliding plate 43 is temporarily stored.

On the other hand, the workbench 50 is arranged at a predetermined position on the upper surface of the base 34, that is, in the extension direction of the guide rail 39. The workbench 50 is vertically long and has a first surface on the upper surface thereof.
The extension tray 51 and the transfer tray 52 are arranged in this order from the separation device 10 side. The height of the upper surface of the work table 50 is substantially equal to the height of the upper surface of the lower mold 12. That is, the extension tray 51 and the transfer tray 52 are arranged so that the upper surfaces thereof have substantially the same height as the lower mold 12.

The extension tray 51 has a plurality of grooves 54 extending in the X-axis direction on the upper surface thereof. The grooves 54 have the same length and are formed at equal distances in the Y-axis direction. In this specification, as shown in FIGS.
The vertical direction orthogonal to the plane of the base 34 is the Z axis, the moving direction of the lower die 12 is the X axis, and the direction orthogonal to both axes is the Y axis.
It has an axis. Furthermore, the first separating device 10 of each groove 54
The side is open. Further, on the upper surface of the expansion tray 51 adjacent to the end portion on the opposite side of each groove 54, there is formed a strip-shaped projection 55 which is slightly higher than the upper surface of the expansion tray 51. The protrusion 55 is formed so as to extend in the Y-axis direction.

Then, the laminated chip part 2 is placed in the groove 54.
By inserting, the plurality of layered chip components 2 can be arranged in a line in the X-axis direction. Therefore, the groove 5
The width of 4 is set to be substantially the same as or slightly wider than the width of the laminated chip component 2. Further, in this example, the sum of the depth of the groove 54 and the height of the protrusion 55 is used as the separation target multilayer chip component 2
Is smaller than the thickness of. This allows
As shown in FIG. 7, when the layered chip component 2 is inserted into the groove 54, the upper end of the layered chip component 2 is projected above the protrusion 55, and the insertion in the groove 54 and the groove 5 are performed.
It is designed so that it can be taken out smoothly from 4.

The carrying tray 52 is the expansion tray 51.
The shape is a flat rectangular shape that is longer in the X-axis direction than the shape.

In the present invention, the laminated chip component 2 in which the adhering state of the adjacent laminated chip components 2 arranged on the lower die 12 is released is transferred to the extension tray 51,
Further, the laminated chip components 2 located on the extension tray 51 are transferred to the transfer tray 52, and the adjacent laminated chip components 2 are separated from each other at the time of the transfer.
The transfer processing of the laminated chip component 2 is performed by the three-axis robot 6
It is set to 0.

That is, as is well known, the three-axis robot 60 mounts the actuator on the X-axis moving device 61 including an X-axis rail for moving the actuator in the X-axis direction and its driving device. A Y-axis moving device 62 including a Y-axis rail for moving in the axial direction and a drive device for the Y-rail is attached, and the entire Y-axis moving device 62 can be moved in the X-axis direction. Further, the Y-axis moving device 62 includes
Attach the Z-axis moving device 63 and set the Z-axis moving device 63 to Y
It is movable in the axial direction. A vacuum head 66, which is an actuator, is attached to the Z-axis moving device 63 via a connecting plate 65. That is,
The upper end of the connecting plate 65 is fixed to a slider 63a that is movably mounted on a Z-axis rail that is a part of the Z-axis moving device 63. A vacuum head 66 is attached to the lower end of the connecting plate 65.

The vacuum head 66 is fixed to the connecting plate 51 by an X-shaped first head mounting portion 67a.
A shaft head 66a and a Y-axis head 66b attached to the connecting plate 51 by a second head attachment portion 67b provided in a rectangular parallelepiped shape are provided, and each head 66a, 66b is connected to a vacuum pump (not shown) and has a predetermined shape. At different timings, suction can be performed independently, and the laminated chip component 2 that contacts the heads 66a and 66b can be sucked and held. The trays 51 and 52, the triaxial robot 60, and the like described above form a second separating device.

Next, an embodiment of the separating method according to the present invention will be described by using the embodiment of the separating device for laminated chip parts described above. First, the first separating device 10 is operated to remove the blank of the laminated block 1 and release the adhesive state between the adjacent laminated chip components 2. That is, the cylinder 41 is operated to store the cylinder rod 42 in the cylinder, and the lower die 12 is pulled out. Then, on the exposed lower die 12, the laminated block 1 in which a notch is formed at a predetermined position in advance in a previous step as shown in FIG. 9 is installed while being aligned. Next, the cylinder 41 is operated in the opposite manner to cause the cylinder rod 42 to project, and the lower die 12 is positioned below the upper die 11. In that state, the first separation device 10
Is operated to adsorb the blank 4 to the upper mold 11 side, and the laminated chip component 2 in which the close contact state is eliminated is held on the lower mold 12. Since the process is the same as that described above, detailed description will be omitted.

Next, the second separating device is operated to separate the layered chip parts from each other and to perform a separating step of aligning them. That is, the cylinder 41 is operated in the direction in which the cylinder rod 42 is housed, and the lower die 12 is moved from below the upper die 11 toward the work table 35. As a result, the lower mold 12 is positioned as shown in FIGS.
Below the table, there is a sliding plate 34 that moves in conjunction with the lower mold 12.
However, it is positioned while maintaining the horizontal state. And upper mold 1
The suction process of 1 is stopped. Then, the blank sucked by the upper mold 11 is separated from the upper mold 11 and is positioned on the sliding plate 43. The blank is arranged at a position apart from the hinge portion 43b on the slide plate 43 in the direction opposite to the lower mold 12.

Then, the three-axis robot 60 is operated to move the vacuum head 66 above the lower die 12.
At this time, the X-axis head 66a forming the vacuum head 66 is moved so as to be located above the laminated chip component forming region and above the laminated chip components 2 arranged in a row in the predetermined X direction. In this example, since the transfer is performed in order from the end, as shown in FIG. 8, the X-axis head 66a is opposed to the uppermost row of the laminated chip components 2 in the drawing. And Z
The X-axis head 66a is moved downward and stabbed by operating the axis movement device 63, and brought into contact with the laminated chip component 2 in the first row. In this state, suction is performed to cause the X-axis head 66a to adsorb the laminated chip component 2.

Then, by operating the three-axis robot 60,
An X-axis head 66a that adsorbs a single-row laminated chip component 2
Are moved to the upper surface of the extension tray 51. In particular,
It is located above the corresponding groove 54 of the expansion tray 51.
Then, one row of the laminated chip components 2 is inserted into the groove 54. To insert the laminated chip component 2, the laminated chip component 2 is inserted from the front side of the protrusion 55, and the laminated chip component 2 is inserted into the groove 54.
Move toward 5 side. Then, the process is repeated until it abuts the protrusion 55.

While the X-axis head 66a is reciprocatingly moved between the lower die 12 and the extension tray 51, the above processing is sequentially performed for each row (in the illustrated example, the numerical processing is performed in the order of numbers). Then, by inserting each layered chip component into the corresponding groove 54, the rows of adjacent layered chip components are separated by a distance corresponding to the interval between the adjacent grooves 54. As a result, the tips of the laminated chip components 2 in each row come into contact with the protrusions 55, so that the alignment of each row is performed and they are aligned with a predetermined distance also in the Y-axis direction (FIG. 8).
(B)). In this way, when all the laminated chip parts 2 are transferred from the lower die 12 to the extension tray 51, the laminated chip parts 2 are separated by a predetermined distance in the Y-axis direction and contact each other in the X-axis direction. Will be lined up.

Next, the three-axis robot 60 is operated and Y
The shaft head 66b is located above the laminated chip components 2 arranged on the upper surface of the extension tray 51. Specifically, it is placed on a predetermined row of laminated chip components arranged in the Y-axis direction (adjacent laminated chip components are separated). In this state, the Z-axis moving device 63 is operated to lower the vacuum head (Y-axis head 66b) and bring it into contact with the facing laminated chip component 2. As a result, the layered chip component 2 is sucked and held by the value Y-axis head.

Then, the Z-axis moving device 63 is operated in the opposite direction to raise the vacuum head 66, and the X-axis moving device 61 is operated to move the vacuum head (Y-axis head 66b) to the first position. It is moved to the separation device 10 side. As a result, the layered chip component 2 rises diagonally rearward (on the side opposite to the protrusion 55). Further, as shown in (B) and (C) of the figure, the transfer of the laminated chip components in each row in the Y-axis direction is performed as follows:
Repeat from the rear side. Therefore, each groove 5 in the extension tray 51
When each layered chip component 2 is pulled up from 4, it rises while alternating with the layered chip components adjacent in front of it, so that it can be smoothly pulled up from the groove, and the remaining layered chip component 2 is left in the groove 54. It remains stored inside in an aligned state.

Then, the vacuum head 66 is moved above the carrying tray 52, and the suction of the Y-axis head 66b is stopped. Then, each laminated chip component sucked by the Y-axis head 66b is separated from the Y-axis head 66b, and one row parallel to the Y-axis direction of the laminated chip component formation region is arranged on the upper surface of the transport tray 52. At this time, when arranging each row on the carrying tray 52, as shown in FIG. 8C, they are arranged with a predetermined distance in the X-axis direction.

Therefore, the laminated chip components 2 are separated in the aligned state in which they are separated by a predetermined distance in the X and Y directions.
They are arranged on the upper surface of the carrier tray 52. After that, each laminated chip component 2 is moved together with the carrying tray 52,
Used in the next printing process.

Then, a new laminated block is arranged on the upper surface of the lower mold 12, and the lower mold 12 is moved below the upper mold 11. Along with this, the sliding plate 43 attached to the lower mold 12 also moves, and the hinge portion 43b is positioned outside the first roller 46a. Then, the sliding plate 43
Is bent, and the other end 43c is inclined downward. Therefore, the blank arranged on the upper surface of the slide plate 43 slides down and is removed.

In each of the above-described embodiments, the first separating device 10 alone and the two examples in which the first separating device and the second separating device are both mounted have been described, but the present invention is not limited to this. Of course, only the second separation device alone and the part of the separation method using the second separation device may be used.

[0083]

As described above, in the method and apparatus for separating a laminated chip component according to the present invention, the blank is removed, and at the same time, the height positions of the adjacent laminated chip components are shifted once by It is possible to release the adhesive force between the matched laminated chip parts. Moreover, since the force applied to the laminated block is in the thickness direction, the laminated block does not bend, and the laminated chip component can be moved without applying an extra force.

At this time, all the laminated chip parts in the rows parallel to the X axis are moved, and the rows parallel to each X axis are moved by a predetermined distance, and the lamination of the rows parallel to the Y axis is performed. Since all the chip components are moved and the rows parallel to each Y axis are moved by a predetermined distance, the laminated chip components are finally moved to a position separated by a predetermined distance from the X axis,
It is arranged in alignment with the Y axis. Therefore, it becomes easy to perform the printing operation on each laminated chip component, the manufacturing time for manufacturing the dielectric filter and the like is shortened, and the productivity is improved.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a separation device of a separation device for layered chip parts according to the present invention.

FIG. 2 is a diagram for explaining a blank removal method in the method of separating a layered chip component according to the present invention.

FIG. 3 is a diagram showing a forming position of an upper pin.

FIG. 4 is a diagram for explaining a method of separating a laminated chip component according to the present invention.

FIG. 5 is a front view showing a form of a separation device for laminated chip parts according to the present invention.

FIG. 6 is a plan view showing a form of a layered chip component separating apparatus according to the present invention.

FIG. 7 is an enlarged view of the surface of the extension tray.

FIG. 8 is a diagram illustrating the operation of the second separation device.

FIG. 9 is a diagram showing an aligned state of the laminated chip components before separation.

[Explanation of symbols]

10 Separation device (first separation device) 11 Upper mold 12 Lower mold 14 Base plate 14a Upper pin 16 Upper blank remover 24 base plate 24a Lower pin 25 Lower cradle 26 Lower blank removal section 51 Expansion tray 52 Carry tray 66 vacuum head 66a X-axis head 66b Y-axis head

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-5-283281 (JP, A) JP-A-3-173108 (JP, A) JP-A-3-157910 (JP, A) JP-A-3- 151615 (JP, A) JP 64-46905 (JP, A) JP 59-177913 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01G 4/00-13 / 00

Claims (5)

(57) [Claims] 1. A frame-shaped blank (4) is provided on the periphery, and a plurality of layered chip components (2) are arranged in the vertical and horizontal directions in a region (3) surrounded by the blank, and each layered. For the unsintered laminated block (1) in which the notch is formed in advance at the position where the chip parts are partitioned, but the adjacent laminated chip parts are in an adhesive state with each other, the blank is sandwiched from both front and back surfaces, and The region (3) is moved in the thickness direction at least by the thickness of the laminated block to be separated from the region. On the other hand, among the plurality of laminated chip components, every other one in the vertical direction and in the horizontal direction. The upper side pin (14a) is brought into contact with the laminated chip component from the front side thereof, and the pin is brought into contact with the remaining laminated chip component from the rear side thereof. By relatively forward movement of the lower pins (24a) located on the side, a method of separating the laminated chip component which is adapted to release the tacky state by moving in the opposite direction the laminated chip component adjacent in the thickness direction. 2. A separation method for arranging a plurality of layered chip components (2) arranged in contact with each other in a horizontal and vertical directions in a horizontal plane in a state of being separated from each other by a predetermined distance in the vertical and horizontal directions. Among the laminated chip components, while holding one row of the laminated chip components arranged in the horizontal direction, the process of transferring to the next placement location (51) is repeated for each column,
In addition, when the transfer is performed, the laminated chip components in each adjacent row in the horizontal direction are vertically separated by a predetermined distance.
And a plurality of stacked chip components that have been transferred by performing the first processing step and are separated in the vertical direction, while holding one row of the stacked chip components arranged in the horizontal direction, Secondly, the process of transferring to the next arrangement location (52) is repeatedly performed in a unit of one column, and when the transferring is performed, the laminated chip components of adjacent vertical columns are horizontally separated by a predetermined distance. And a method for separating a laminated chip component, the method comprising the steps of. 3. The method according to claim 2, wherein a plurality of layered chip parts, which are obtained by executing the separation method according to claim 1 and contact each other in a state where the adhesive state is released in the horizontal and vertical directions in a horizontal plane.
A method for separating a laminated chip component, the method being such that the separation method described in (4) is executed. 4. A frame-shaped blank (4) is provided on the periphery, and a plurality of layered chip parts (2) are arranged in the vertical and horizontal directions in a region (3) surrounded by the blank, and each layered. By pressing in the thickness direction against the respective parts of the unsintered laminated block (1) in which adjacent laminated chip components are in a mutually adhered state, although notches are formed in advance at the positions where the chip components are partitioned, A first separating device (10) for removing the blank and releasing the adhering state of the adjacent laminated chip parts, and a plurality of laminated chip parts arranged in contact with each other in the horizontal and vertical directions in a horizontal plane. Second separating devices aligned in a state of being separated from each other by a predetermined distance, wherein the first separating device includes a plurality of upper pins protruding downward so as to be able to contact the predetermined multilayer chip component. (1
4a) and a mechanism (17,
19, 20, 22), an upper die (11) having an upper blank removing portion (16) arranged on the outer circumference and capable of contacting the blank, and a plurality of lower pins (24a) protruding upward. )
And a lower die (12) having a lower receiving portion (25) pushed down by a force received from the upper pin, and a lower blank removing portion (26) arranged on the outer periphery and capable of contacting the blank. And the second separation device has a layered chip component formation region (3)
(66) having an X-axis head (66a) that holds the X-axis row of the plurality of layered chip components (2) that compose the above, and a Y-axis head (66b) that attracts the Y-axis row of the plurality of layered chip components A moving means (60) for moving the head to an arbitrary three-dimensional position, and an extension for temporarily aligning the laminated chip parts moved by the head in a state of being separated in the Y-axis direction. A separating device for laminated chip parts, comprising: a tray (51). 5. The lower mold has a receiving plate (43) whose tip can be tilted, and when the lower mold is horizontally moved to be positioned below the upper mold, the receiving plate has a front end. Is inclined, and the lower die is moved in the opposite direction, and when the receiving plate is located below the upper die, the receiving plate is maintained in a horizontal state. Separation device for laminated chip parts.