JP3790963B2 - Heat sensitive planographic printing plate - Google Patents
Heat sensitive planographic printing plate Download PDFInfo
- Publication number
- JP3790963B2 JP3790963B2 JP2002028423A JP2002028423A JP3790963B2 JP 3790963 B2 JP3790963 B2 JP 3790963B2 JP 2002028423 A JP2002028423 A JP 2002028423A JP 2002028423 A JP2002028423 A JP 2002028423A JP 3790963 B2 JP3790963 B2 JP 3790963B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- hydrophilic
- resin
- printing plate
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007639 printing Methods 0.000 title claims abstract description 79
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 37
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 37
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 8
- 239000010936 titanium Substances 0.000 claims abstract description 8
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims abstract description 6
- 229910052742 iron Inorganic materials 0.000 claims abstract description 6
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 6
- 239000011777 magnesium Substances 0.000 claims abstract description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 5
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 5
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 4
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052796 boron Inorganic materials 0.000 claims abstract description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000011248 coating agent Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 2
- -1 thin Chemical compound 0.000 abstract description 50
- 239000002245 particle Substances 0.000 abstract description 9
- 230000035945 sensitivity Effects 0.000 abstract description 8
- 229910052723 transition metal Inorganic materials 0.000 abstract description 2
- 150000003624 transition metals Chemical class 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 50
- 239000011347 resin Substances 0.000 description 50
- 238000000034 method Methods 0.000 description 28
- 239000000049 pigment Substances 0.000 description 25
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 22
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- 239000000975 dye Substances 0.000 description 20
- 239000002243 precursor Substances 0.000 description 20
- 239000003431 cross linking reagent Substances 0.000 description 18
- 239000002904 solvent Substances 0.000 description 17
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 15
- 238000004132 cross linking Methods 0.000 description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 239000007864 aqueous solution Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 12
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 12
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 11
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000003921 oil Substances 0.000 description 9
- 229920000620 organic polymer Polymers 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 229920001519 homopolymer Polymers 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 6
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 6
- 150000001299 aldehydes Chemical class 0.000 description 6
- 229910052783 alkali metal Inorganic materials 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 6
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 6
- 230000007062 hydrolysis Effects 0.000 description 6
- 238000006460 hydrolysis reaction Methods 0.000 description 6
- 150000002576 ketones Chemical class 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000007788 roughening Methods 0.000 description 6
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 5
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical class OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 5
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 150000004679 hydroxides Chemical class 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000011572 manganese Substances 0.000 description 5
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 5
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 5
- 229940079877 pyrogallol Drugs 0.000 description 5
- 229920003987 resole Polymers 0.000 description 5
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 5
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 229920002125 Sokalan® Polymers 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000007743 anodising Methods 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 4
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- 229910052802 copper Inorganic materials 0.000 description 4
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- 229930003836 cresol Natural products 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
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Abstract
Description
【0001】
【発明の属する技術分野】
本発明は、コンピュータ・ツウ・プレート(CTP)システム用の現像不要の平版印刷版用原板に関する。より詳しくは、デジタル信号に基づいた赤外線走査露光による画像記録が可能であり、画像記録したものは従来のような液体による現像工程を経ることなしに、そのまま印刷機に装着して印刷することが可能な感熱性平版印刷版用原板に関する。
【0002】
【従来の技術】
従来、平版印刷版の作製は、中間材料であるリスフィルムを介して印刷版用原板に露光するシステムで行われてきた。しかし、近年の印刷分野におけるデジタル化の急速な進展とともに、印刷版作製工程は、コンピュータに入力し編集されたデジタルデータを印刷版用原板に直接出力するCTPシステムに変わりつつある。その中で、一層の工程合理化を目指して、露光後、現像処理することなしにそのまま印刷機に装着して印刷が行える現像不要の平版印刷版用原板が研究、開発されている。例えば、日本印刷学会誌、36巻148〜163頁(1999)には現像不要CTP刷版として種々の方法が記載されている。
【0003】
有望な方法の一つは、半導体レーザ、YAGレーザ等の固体高出力赤外線レーザで露光し、光を熱に変換する光熱変換剤で発熱させ、露光部分を分解蒸発させるアブレーションを利用した方法である。すなわち、親油性のインキ受容性表面又はインキ受容層を有する基板上に親水層を設け、親水層をアブレーション除去する方法である。
【0004】
WO94/18005号には、親油性レーザー光吸収層の上に架橋した親水層を設け、この親水層をアブレーションする印刷版が記載されている。この親水層は、ポリビニルアルコールをテトラエトキシ珪素の加水分解物で架橋し、二酸化チタン粒子を含有させたものからなり、親水層の膜強度向上を図ったものである。この技術により耐刷力は向上する。しかし、汚れにくさについては不十分で、さらなる改良が必要であった。
【0005】
WO98/40212号及びWO99/19143号には、基板上にインキ受容層、及びシリカなどのコロイドをアミノプロピルトリエトキシシランなどの架橋剤で架橋したものを主成分とする親水層を有し、現像なしで印刷機に装着できる平版印刷版用原板が記載されている。この親水層は、炭化水素基を極力少なくして印刷汚れに対する耐性を高め、架橋剤でコロイドを架橋することにより耐刷力の向上を図っている。しかしながら、この技術では耐刷力は数千枚と不十分であった。
【0006】
更に従来のアブレーションを利用した平版印刷版用原板では、アブレーションカスが飛散してレーザー露光装置や光源を汚染する問題があった。そのため、これらの装置にはアブレーションカスを捕捉する装置の付加が必要があったが、捕捉装置によっても汚染を十分に取り除くことは困難であった。
【0007】
これに対して特開2001−96936号には、インキ受容性表面を有するか又はインキ受容層が塗布された基板上に、加熱部が印刷時湿し水又はインキによって容易に除去される親水層、及び必要に応じて光熱変換剤を含有する水溶性オーバーコート層を有する感熱性平版印刷版用原板によって、良好な耐刷性及び汚れ難さが得られ、更にアブレーションカスの飛散抑制によりレーザー露光装置や光源の汚染が防止されることが記載されている。
【0008】
【発明が解決しようとする課題】
しかしながら上記の改良技術によってもなお、さらなる高耐刷への要求には不十分であった。本発明の課題は、この問題を解決することである。すなわち、露光後処理を行うことなく直接印刷機に装着して印刷することが可能であり、アブレーションカスの飛散によるレーザー露光装置や光源の汚染が防止され、高感度で、汚れ難さに優れ、さらに高耐刷な感熱性平版印刷版用原板を提供することにある。
【0009】
【課題を解決するための手段】
本発明の課題を解決する手段は、下記の通りである。粗面化され、陽極酸化皮膜を有するアルミニウム基板上に、(1)インキ受容層、(2)ベリリウム、マグネシウム、アルミニウム、ケイ素、チタン、硼素、ゲルマニウム、スズ、ジルコニウム、鉄、バナジウム、アンチモンおよび遷移金属から選択される少なくとも一つの元素のコロイド粒子状酸化物または水酸化物を含有する親水層、並びに(3)印刷機上で除去可能な親水性オーバーコート層をこの順に有する感熱性平版印刷版用原板であって、インキ受容層の乾燥塗布量0.5g/m2未満であり、陽極酸化皮膜量が3.2g/m 2 以上、5.0g/m2未満であることを特徴とする感熱性平版印刷版用原板。
【0010】
本発明の層構成の平版印刷版用原板の場合、高耐刷化のためには、親油性のインキ受容層と相反する性質の親水層との接着の強化が必要であった。そのためには、インキ受容層を0.5g/m2未満の薄層にすることによって支持体表面の砂目粗さをトレースした粗面化インキ受容層表面を形成し、そのアンカー効果を利用することが考えられた。しかし、インキ受容層の薄層化は、インキ受容層の断熱性を弱め、露光によって発生した熱をアルミニウム支持体に拡散し易くし、感度を低下させる新たな問題を生じた。本発明者は、この問題を詳細に検討した結果、アルミニウム表面の陽極酸化皮膜が皮膜量3.2g/m 2 以上5.0g/m2未満という特定の範囲で良好な断熱性を有することを見出し、この断熱性を利用することで、上記問題を解決でき、本発明に至った。
【0011】
【発明の実施の形態】
以下、本発明の実施の形態について詳細に説明する。なお、%は特に断りのない限り重量%を示す。
【0012】
本発明の支持体は、粗面化され、陽極酸化皮膜を有するアルミニウム基板である。原料のアルミニウム板は、従来より公知公用の素材のアルミニウム板を適宜に利用することができる。すなわち、原料アルミニウム板は、純アルミニウム板あるいはアルミニウムを主成分とし、微量の異元素を含む合金板である。アルミニウム合金に含まれる異元素には、ケイ素、鉄、マンガン、銅、マグネシウム、クロム、亜鉛、ビスマス、ニッケル、チタンなどがある。合金中の異元素の含有量は10%以下である。また、DC鋳造法を用いたアルミニウム鋳塊からのアルミニウム板でも、連続鋳造法による鋳塊からのアルミニウム板であっても良い。
【0013】
本発明に用いられる上記アルミニウム基板の厚みは0.05〜0.6mm、好ましくは0.1〜0.4mm、特に好ましくは0.15〜0.3mmである。
【0014】
アルミニウム板表面の粗面化処理は、種々の方法で行うことができる。例えば、機械的に粗面化する方法、電気化学的に表面を溶解粗面化する方法、化学的に表面を選択溶解させる方法、あるいはこれらの方法のうち2種以上の組み合わせによって行うことができる。機械的方法としては、ボール研磨法、ブラシ研磨法、ブラスト研磨法、バフ研磨法などの公知の方法を用いることができる。化学的方法としては、特開昭54−31187号公報に記載されているような鉱酸のアルミニウム塩の飽和水溶液に浸漬する方法が適している。また、電気化学的な粗面化法としては塩酸又は硝酸などの酸を含む電解液中で交流又は直流により行う方法がある。また、特開昭54−63902号に開示されているように混合酸を用いた電解粗面化方法も利用することができる。
【0015】
粗面化されたアルミニウム板は、必要に応じて水酸化カリウムや水酸化ナトリウムなどの水溶液によるアルカリエッチング処理をされ、さらに中和処理された後、陽極酸化処理を施される。
【0016】
アルミニウム板の陽極酸化処理に用いられる電解質としては、多孔質酸化皮膜を形成する種々の電解質の使用が可能で、一般的には、硫酸、リン酸、蓚酸、クロム酸、スルファミン酸、ベンゼンスルホン酸、あるいは、それらの混酸が用いられる。これらの電解質の濃度は電解質の種類によって適宜決められる。
【0017】
陽極酸化の処理条件は、用いる電解質により種々変わるので一概に特定し得ないが、一般的には、電解質の濃度が1〜80%溶液、液温は5〜70℃、電流密度5〜60A/dm2、電圧1〜100V、電解時間10秒〜50分の範囲であれば適当である。これらの陽極酸化処理の中でも、特に、英国特許1,412,768号公報に記載されている硫酸中で高電流密度で陽極酸化する方法及び米国特許3,511,661号公報に記載されているリン酸を電解浴として陽極酸化する方法が好ましい。
【0018】
本発明のアルミニウム基板の酸化皮膜量は、3.2g/m 2 以上、5.0g/m2未満である。より好ましくは3.2〜4.5g/m2、最も好ましくは3.5〜4.0g/m2である。この範囲内で良好な断熱効果が得られる。酸化皮膜量が3.2g/m 2 未満では断熱効果が不十分であり、一方、5.0g/m2以上でも断熱効果が不十分となる。5.0g/m2以上で断熱効果が不十分となるのは、酸化皮膜量が大となるのに伴い酸化皮膜ポアの開口部での口径が拡大して、インキ受容層がポア中に入り込み、ポア中の空気による断熱を妨げ、支持体への熱の拡散を促進するためではないかと推定される。
【0019】
本発明で用いられる基板としては、上記のような表面処理をされた陽極酸化皮膜を有する基板そのままでも良いが、上層との接着性、断熱性などの一層の改良のため、必要に応じて、特開2001−253181号に記載されている陽極酸化皮膜のマイクロポアの封孔処理、特開2001−322365号に記載されている親水性化合物を含有する水溶液に浸漬する表面親水化処理などを適宜選択して行うことができる。
【0020】
上記親水化処理のための好適な親水性化合物として、ポリビニルホスホン酸、スルホン酸基をもつ化合物、糖類化合物、クエン酸、アルカリ金属珪酸塩、フッ化ジルコニウムカリウム、リン酸塩/無機フッ素化合物などが挙げられる。
【0021】
上記のようにして得られたアルミニウム基板の表面粗さは、中心線平均粗さRaが0.45μm以上が好ましく、0.48μm以上がより好ましく、0.52μm以上が特に好ましい。Ra値の上限は、その上に塗布するインキ受容層の塗布厚とも関係するので一概に決めがたいが、一般的には約0.7μmまでが好ましい。この範囲内で、インキ受容層表面を親水層と良好な接着性を示す粗面にすることができる。
【0022】
本発明に用いられるインキ受容層は、有機高分子を含有する。有機高分子としては、溶媒に可溶で、親油性の被膜を形成できるものである。さらには、上層である親水層の塗布溶媒に不溶であることが望ましいが、場合によっては一部上層の塗布溶媒に膨潤するものが、親水層との接着性に優れ、望ましい場合がある。その他、親水層の塗布溶媒に可溶な有機高分子を用いる場合には、架橋剤を添加する等の工夫をして、インキ受容層を硬化させておくことが望ましい。
【0023】
有用な有機高分子としては、ポリエステル、ポリウレタン、ポリウレア、ポリイミド、ポリシロキサン、ポリカーボネート、フェノキシ樹脂、エポキシ樹脂、ノボラック樹脂、レゾール樹脂、フェノール化合物とアセトンとの縮合樹脂、ポリビニルアセテート、アクリル樹脂及びその共重合体、ポリビニルフェノール、ポリビニルハロゲン化フェノール、メタクリル樹脂及びその共重合体、アクリルアミド共重合体、メタクリルアミド共重合体、ポリビニルフォルマール、ポリアミド、ポリビニルブチラール、ポリスチレン、セルロースエステル樹脂、ポリ塩化ビニルやポリ塩化ビニリデン等を挙げることができる。
【0024】
これらの中で、より好ましい化合物として、側鎖にヒドロキシル基、カルボキシル基、スルホンアミド基やトリアルコキシシリル基を有する樹脂が、基板や上層の親水層との接着性に優れ、場合によって架橋剤で容易に硬化するので望ましい。
【0025】
その他、アクリロニトリル共重合体、ポリウレタン、側鎖にスルホンアミド基を有する共重合体や側鎖にヒドロキシル基を有する共重合体をジアゾ樹脂によって光硬化させたものが好ましい。
【0026】
本発明のインキ受容層に好適なエポキシ樹脂としては、例えば、ビスフェノールA/エピクロロヒドリン重付加物、ビスフェノールF/エピクロロヒドリン重付加物、ハロゲン化ビスフェノールA/エピクロロヒドリン重付加物、ビフェニル型ビスフェノール/エピクロロヒドリン重付加物、ノボラック樹脂/エピクロロヒドリン重付加物などを挙げることができる。具体的には、ジャパンエポキシレジン製のエピコート1001(軟化点68℃、Mn約900)、エピコート1007(軟化点128℃、Mn約2900)、エピコート1009(軟化点144℃、Mn約3750)、エピコート1010(軟化点169℃、Mn約5500)、エピコート1100L(軟化点149℃)、エピコートYX31575(軟化点130℃)などを挙げることができる。
【0027】
ノボラック樹脂及びレゾール樹脂としては、フェノール、クレゾール(m−クレゾール、p−クレゾール、m/p混合クレゾール)、フェノール/クレゾール(m−クレゾール、p−クレゾール、m/p混合クレゾール)、フェノール変性キシレン、t−ブチルフェノール、オクチルフェノール、レゾルシノール、ピロガロール、カテコール、クロロフェノール(m−Cl、p−Cl)、ブロモフェノール(m−Br、p−Br)、サリチル酸、フロログルシノールなどと、アルデヒド、例えば、ホルムアルデヒド、パラホルムアルデヒドなどとの付加縮合物を挙げることができる。
【0028】
その他の好適な高分子化合物として以下(1)〜(12)に示すモノマーをその構成単位とする通常1〜20万の平均分子量を持つ共重合体を挙げることができる。
【0029】
(1)芳香族ヒドロキシ基を有するアクリルアミド類、メタクリルアミド類、アクリル酸エステル類、メタクリル酸エステル類及びヒドロキシスチレン類、例えばN−(4−ヒドロキシフェニル)アクリルアミド又はN−(4−ヒドロキシフェニル)メタクリルアミド、o−、m−及びp−ヒドロキシスチレン、o−、m−及びp−ヒドロキシフェニルアクリレート又はメタクリレート、
【0030】
(2)脂肪族ヒドロキシ基を有するアクリル酸エステル類及びメタクリル酸エステル類、例えば、2−ヒドロキシエチルアクリレート又は2−ヒドロキシエチルメタクリレート、
【0031】
(3)アクリル酸メチル、アクリル酸エチル、アクリル酸プロピル、アクリル酸ブチル、アクリル酸アミル、アクリル酸ヘキシル、アクリル酸シクロヘキシル、アクリル酸オクチル、アクリル酸フェニル、アクリル酸ベンジル、アクリル酸−2−クロロエチル、アクリル酸4−ヒドロキシブチル、グリシジルアクリレート、N,N−ジメチルアミノエチルアクリレートなどのアクリル酸エステル、
【0032】
(4)メタクリル酸メチル、メタクリル酸エチル、メタクリル酸プロピル、メタクリル酸ブチル、メタクリル酸アミル、メタクリル酸ヘキシル、メタクリル酸シクロヘキシル、メタクリル酸オクチル、メタクリル酸フェニル、メタクリル酸ベンジル、メタクリル酸−2−クロロエチル、メタクリル酸4−ヒドロキシブチル、グリシジルメタクリレート、N,N−ジメチルアミノエチルメタクリレートなどのメタクリル酸エステル、
【0033】
(5)アクリルアミド、メタクリルアミド、N−メチロールアクリルアミド、N−メチロールメタクリルアミド、N−エチルアクリルアミド、N−エチルメタクリルアミド、N−ヘキシルアクリルアミド、N−ヘキシルメタクリルアミド、N−シクロヘキシルアクリルアミド、N−シクロヘキシルメタクリルアミド、N−ヒドロキシエチルアクリルアミド、N−ヒドロキシエチルアクリルアミド、N−フェニルアクリルアミド、N−フェニルメタクリルアミド、N−ベンジルアクリルアミド、N−ベンジルメタクリルアミド、N−ニトロフェニルアクリルアミド、N−ニトロフェニルメタクリルアミド、N−エチル−N−フェニルアクリルアミド及びN−エチル−N−フェニルメタクリルアミドなどのアクリルアミドもしくはメタクリルアミド、
【0034】
(6)エチルビニルエーテル、2−クロロエチルビニルエーテル、ヒドロキシエチルビニルエーテル、プロピルビニルエーテル、ブチルビニルエーテル、オクチルビニルエーテル、フェニルビニルエーテルなどのビニルエーテル、
【0035】
(7)ビニルアセテート、ビニルクロロアセテート、ビニルブチレート、安息香酸ビニルなどのビニルエステル、
【0036】
(8)スチレン、メチルスチレン、クロロメチルスチレンなどのスチレン類、
【0037】
(9)メチルビニルケトン、エチルビニルケトン、プロピルビニルケトン、フェニルビニルケトンなどのビニルケトン、
【0038】
(10)エチレン、プロピレン、イソブチレン、ブタジエン、イソプレンなどのオレフィン、
【0039】
(11)N−ビニルピロリドン、N−ビニルカルバゾール、4−ビニルピリジン、アクリロニトリル、メタクリロニトリルなど、
【0040】
(12)N−(o−アミノスルホニルフェニル)アクリルアミド、N−(m−アミノスルホニルフェニル)アクリルアミド、N−(p−アミノスルホニルフェニル)アクリルアミド、N−〔1−(3−アミノスルホニル)ナフチル〕アクリルアミド、N−(2−アミノスルホニルエチル)アクリルアミドなどのアクリルアミド類、N−(o−アミノスルホニルフェニル)メタクリルアミド、N−(m−アミノスルホニルフェニル)メタクリルアミド、N−(p−アミノスルホニルフェニル)メタクリルアミド、N−〔1−(3−アミノスルホニル)ナフチル〕メタクリルアミド、N−(2−アミノスルホニルエチル)メタクリルアミドなどのスルホンアミド基含有アクリルアミド又はメタクリルアミド類、また、o−アミノスルホニルフェニルアクリレート、m−アミノスルホニルフェニルアクリレート、p−アミノスルホニルフェニルアクリレート、1−(3−アミノスルホニルフェニルナフチル)アクリレート、o−アミノスルホニルフェニルメタクリレート、m−アミノスルホニルフェニルメタクリレート、p−アミノスルホニルフェニルメタクリレート、1−(3−アミノスルホニルフェニルナフチル)メタクリレートなどのスルホンアミド基含有アクリル酸エステル又はメタクリル酸エステル類。
【0041】
これらの有機高分子を適当な溶媒に溶解させて、基板上に塗布乾燥させインキ受容層を基板上に設けることができる。有機高分子のみを溶媒に溶解させて用いることもできるが、架橋剤、接着助剤、着色剤、塗布面状改良剤、可塑剤を必要に応じて添加することができる。その他、露光後のプリントアウト画像を形成させるための加熱発色系あるいは消色系添加剤が添加されてもよい。
【0042】
有機高分子を架橋させる架橋剤としては、例えば、ジアゾ樹脂、芳香族アジド化合物、エポキシ樹脂、イソシアネート化合物、ブロックイソシアネート化合物、テトラアルコキシ珪素の初期加水分解縮合物、グリオキザール、アルデヒド化合物やメチロール化合物を挙げることができる。
【0043】
接着助剤としては、上記ジアゾ樹脂が基板及び親水層との接着に優れるが、この他にシランカップリング剤、イソシアネート化合物、チタン系カップリング剤も有用である。
【0044】
着色剤としては、通常の染料や顔料が用いられるが、特にローダミン6G塩化物、ローダミンB塩化物、クリスタルバイオレット、マラカイトグリーンシュウ酸塩、キニザリン、2−(α−ナフチル)−5−フェニルオキサゾールなどが挙げられる。他の染料として具体的には、オイルイエロー#101、オイルイエロー#103、オイルピンク#312、オイルグリーンBG、オイルブルーBOS、オイルブルー#603、オイルブラックBY、オイルブラックBS、オイルブラックT−505(以上、オリエント化学工業(株)製)、ビクトリアピュアブルー、クリスタルバイオレット(CI42555)、メチルバイオレット(CI42535)、エチルバイオレット、メチレンブルー(CI52015)、パテントピュアブルー(住友三国化学社製)、ブリリアントブルー、メチルグリーン、エリスリシンB、ベーシックフクシン、m−クレゾールパープル、オーラミン、4−p−ジエチルアミノフェニルイミナフトキノン、シアノ−p−ジエチルアミノフェニルアセトアニリドなどに代表されるトリフェニルメタン系、ジフェニルメタン系、オキサジン系、キサンテン系、イミノナフトキノン系、アゾメチン系又はアントラキノン系の染料あるいは特開昭62−293247号公報、特開平9−179290号公報に記載されている染料を挙げることができる。
【0045】
上記色素は、インキ受容層中に添加される場合は受容層の全固形分に対し、通常約0.02〜10%、より好ましくは約0.1〜5%の割合ある。
【0046】
さらに、塗布面状改良剤としてよく知られた化合物であるフッ素系界面活性剤やシリコン系界面活性剤も用いることができる。具体的にはパーフルオロアルキル基やジメチルシロキサン基を有する界面活性剤が塗布面上を整えることで有用である。
【0047】
さらに、本発明のインキ受容層には必要に応じ、塗膜の柔軟性等を付与するために可塑剤が加えられる。例えば、ポリエチレングリコール、クエン酸トリブチル、フタル酸ジエチル、フタル酸ジブチル、フクル酸ジヘキシル、フタル酸ジオクチル、リン酸トリクレジル、リン酸トリブチル、リン酸トリオクチル、オレイン酸テトラヒドロフルフリル、アクリル酸又はメタクリル酸のオリゴマー及びポリマー等が用いられる。
【0048】
さらに、本発明のインキ受容層に添加できる発色又は消色系焼き出し用の添加剤としては、例えば、ジアゾ化合物やジフェニルヨードニウム塩のような熱酸発生剤とロイコ染料(ロイコマラカイトグリーン、ロイコクリスタルバイオレット、クリスタルバイオレットのラクトン体等)やPH変色染料(例えば、エチルバイオレット、ビクトリアピュアーブルーBOH等の染料)が組み合わせて用いられる。その他、EP897134号明細書に記載されているような、酸発色染料と酸性バインダーの組合わせも有効である。この場合、加熱によって染料を形成している会合状態の結合が切れ、ラクトン体が形成して有色から無色に変化する。これらの添加剤の添加割合は、好ましくはインキ受容層固形分に対し10%以下、より好ましくは5%以下である。
【0049】
上記インキ受容層を塗布する溶媒としては、アルコール類(メタノール、エタノール、プロピルアルコール、エチレングリコール、ジエチレングリコール、プロピレングリコール、ジプロピレングリコール、エチレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル等)、エーテル類(テトラヒドロフラン、エチレングリコールジメチルエーテル、プロピレングリコールジメチルエーテル、テトラヒドロピラン等)、ケトン類(アセトン、メチルエチルケトン、アセチルアセトン等)、エステル類(酢酸メチル、酢酸エチル、エチレングリコールモノメチルエーテルモノアセテート、ガンマーブチロラクトン、乳酸メチル、乳酸エチル等)、アミド類(ホルムアミド、N−メチルホルムアミド、ピロリドン、N−メチルピロリドン等)等を用いることができる。これらの溶媒は、単独あるいは混合して使用される。塗布液中の上記インキ受容層成分(添加剤を含む全固形分)の濃度は、好ましくは1〜50%である。その他、上記のような有機溶媒からの塗布ばかりでなく、水性エマルジョンからも被膜を形成させることができる。この場合の濃度は5%から50%が好ましい。
【0050】
本発明のインキ受容層の乾燥塗布量は、0.5g/m2で未満である。好ましい乾燥塗布量の下限は、0.2g/m2であり、より好ましくは0.3g/m2である。この範囲内でインキ受容層表面を親水層と良好な接着性を示す粗面にでき、良好な耐刷性が得られる。
【0051】
本発明の親水層は、ベリリウム、マグネシウム、アルミニウム、ケイ素、チタン、硼素、ゲルマニウム、スズ、ジルコニウム、鉄、バナジウム、アンチモン及び遷移金属から選択された少なくとも一つの元素のコロイド粒子状酸化物又は水酸化物を含有する。
【0052】
これらの元素のコロイド粒子状酸化物又は水酸化物は、上記元素のハロゲン化物やアルコキシ化合物の加水分解、あるいは、水酸化物の縮合など種々の公知の方法によってコロイド分散液の分散相、すなわち、コロイド粒子として作られる。親水層を設けるための親水層塗布液に添加する場合は、コロイド分散液の状態で添加できる。
【0053】
これらの元素の酸化物又は水酸化物のうち、特に好ましいものは、アルミニウム、ケイ素、チタン及びジルコニウムから選択された少なくとも一つの元素の酸化物又は水酸化物である。
【0054】
これらの元素の酸化物又は水酸化物のコロイド粒子は、コロイドの粒径として、シリカの場合5〜100nmの球形のものが好適である。10〜50nmの球状粒子が、50〜400nmの長さに連なったパールネックレス状のコロイド粒子も用いることができる。アルミニウムの酸化物又は水酸化物のコロイド粒子のように100nm×10nmのような羽毛状のものも有効である。これらのコロイド分散液は、日産化学工業(株)などの市販品を購入することもできる。
【0055】
これらのコロイド粒子の分散媒としては、水のほかに、メタノール、エタノール、エチレングリコールモノメチルエーテル、メチルエチルケトンなどの有機溶媒も有用である。
【0056】
本発明の親水層には、上記コロイド粒子と共に、親水性樹脂を用いることができる。親水性樹脂を用いることにより親水層の皮膜性を強化し、耐刷性を向上できる。親水性樹脂としては、例えばヒドロキシル、カルボキシル、ヒドロキシエチル、ヒドロキシプロピル、アミノ、アミノエチル、アミノプロピル、カルボキシメチルなどの親水基を有するものが好ましい。
【0057】
具体的な親水性樹脂として、アラビアゴム、カゼイン、ゼラチン、澱粉誘導体、カルボキシメチルセルロース及びそれらのナトリウム塩、セルロースアセテート、アルギン酸ナトリウム、酢酸ビニル−マレイン酸コポリマー、スチレン−マレイン酸コポリマー、ポリアクリル酸及びそれらの塩、ポリメタクリル酸及びそれらの塩、ヒドロキシエチルメタクリレートのホモポリマー及びコポリマー、ヒドロキシエチルアクリレートのホモポリマー及びコポリマー、ヒドロキシプロピルメタクリレートのホモポリマー及びコポリマー、ヒドロキシプロピルアクリレートのホモポリマー及びコポリマー、ヒドロキシブチルメタクリレートのホモポリマー及びコポリマー、ヒドロキシブチルアクリレートのホモポリマー及びコポリマー、ポリエチレングリコール、ポリプロピレンオキシド、ポリビニルアルコール、ならびに加水分解度が少なくとも60%、好ましくは少なくとも80%の加水分解ポリビニルアセテート、ポリビニルホルマール、ポリビニルブチラール、ポリビニルピロリドン、アクリルアミドのホモポリマー及びコポリマー、メタクリルアミドのホモポリマー及びポリマー、N−メチロールアクリルアミドのホモポリマー及びコポリマー等を挙げることができる。
【0058】
これらの親水性樹脂の添加割合は、親水層固形分の40%以下が好ましく、20%以下がより好ましい。
【0059】
また、本発明の親水層には、芳香族水酸基を有する樹脂を用いることもできる。芳香族水酸基を有する樹脂を用いた場合は、親水層の皮膜性の向上と同時に、刷り出しの着肉性を改良することができる。芳香族水酸基を有する樹脂としては、メタノールに25℃で5%以上溶解するものが好ましく、例えば、ノボラック樹脂、レゾール樹脂、ポリビニルフェノール樹脂、ケトンピロガロール樹脂等のアルカリ可溶性樹脂が挙げられる。
【0060】
好ましいノボラック樹脂としては、フェノール、o−クレゾール、m−クレゾール、p−クレゾール、2,5−キシレノール、及び3,5−キシレノール、レゾルシンから選ばれる少なくとも1種の水酸基含有芳香族化合物を、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒドなどのアルデヒドの中から選ばれる少なくとも1種と酸性触媒下で付加縮合したノボラック樹脂が挙げられる。ホルムアルデヒド及びアセトアルデヒドの代わりに、それぞれパラホルムアルデヒド及びパラアルデヒドを使用してもよい。
【0061】
その中でも、m−クレゾール:p−クレゾール:2,5−キシレノール:3,5−キシレノール:レゾルシンの混合割合がモル比で40〜100:0〜50:0〜20:0〜20:0〜20の混合物、又は、フェノール:m−クレゾール:p−クレゾールの混合割合がモル比で1〜100:0〜70:0〜60の混合物とアルデヒドとの付加縮合物であるノボラック樹脂が好ましい。アルデヒドの中でも、特にホルムアルデヒドが好ましい。ノボラック樹脂の重量平均分子量は、好ましくは1,000〜15,000、さらに好ましくは1,500〜10,000のものが用いられる。
【0062】
好ましいレゾール樹脂としては、フェノール、m−クレゾール、o−クレゾール、p−クレゾール、2,5−キシレノール、3,5−キシレノール、レゾルシン、ピロガロール、ビス−(4−ヒドロキシフェニル)メタン、ビスフェノール−A、o−エチルフェノール、m−エチルフェノール、p−エチルフェノール、プロピルフェノール、n−ブチルフェノール、t−ブチルフェノール、1−ナフトール、2−ナフトール等の水酸基含有芳香族炭化水素類やその他の2個以上の水酸基を有する多核芳香族炭化水素類の少なくとも1種を、アルカリ性触媒下、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ベンズアルデヒド、フルフラール等のアルデヒド、及びアセトン、メチルエチルケトン、メチルイソブチルケトンなどのケトンから選ばれた少なくとも1種のアルデヒド又はケトンと付加縮合させたものが挙げられる。
【0063】
ホルムアルデヒド及びアセトアルデヒドの代わりに、それぞれパラホルムアルデヒド及びパラアルデヒドを使用してもよい。レゾール樹脂の重量平均分子量は、好ましくは500〜10,000、特に好ましくは1,000〜5,000である。
【0064】
好ましいポリビニルフェノール樹脂としては、o−ヒドロキシスチレン、m−ヒドロキシスチレン、p−ヒドロキシスチレン、2−(o−ヒドロキシフェニル)プロピレン、2−(m−ヒドロキシフェニル)プロピレン、2−(p−ヒドロキシフェニル)プロピレンなどのヒドロキシスチレン類の単独又は2種以上の共重合体が挙げられる。ヒドロキシスチレン類は、芳香環に塩素、臭素、ヨウ素、フッ素等のハロゲンあるいは炭素数1〜4個のアルキル基等の置換基を有していてもよく、従って、ポリビニルフェノール類としては、芳香環にハロゲン又は炭素数1〜4個のアルキル基を有していても良いポリビニルフェノールが挙げられる。
【0065】
このほかに、o−ヒドロキシスチレン、m−ヒドロキシスチレン、p−ヒドロキシスチレン、2−(o−ヒドロキシフェニル)プロピレン、2−(m−ヒドロキシフェニル)プロピレン、2−(p−ヒドロキシフェニル)プロピレンなどのヒドロキシスチレン類に、メタクリル酸、アクリル酸、メタクリル酸アルキルエステルやアクリル酸アルキルエステルを共重合したものも有用である。
ポリビニルフェノール樹脂は、通常、置換基を有していてもよいヒドロキシスチレンを、単独で又は2種以上を、ラジカル重合開始剤又はカチオン重合開始剤の存在下で重合することにより得られる。かかるポリビニルフェノール樹脂は、一部水素添加を行なったものでもよい。また、t−ブトキシカルボニル基、ピラニル基、フラニル基などで、ポリビニルフェノール樹脂の一部の水酸基を保護した樹脂でもよい。ポリビニルフェノール樹脂の重量平均分子量は、好ましくは1,000〜100,000、特に好ましくは1,500〜50,000である。
【0066】
ケトンピロガロール樹脂としては、アセトンピロガロール樹脂が特に有用である。
【0067】
これらの芳香族水酸基を有する樹脂の添加割合は、好ましくは親水層固形分の20%以下、より好ましくは12%以下である。
【0068】
本発明の親水層には、コロイド状酸化物又は水酸化物の架橋を促進する架橋剤を添加しても良い。そのような架橋剤としては、テトラアルコキシシランの初期加水分解縮合物、トリアルコキシシリルプロピル−N,N,N−トリアルキルアンモニウムハライド、又は、アミノプロピルトリアルコキシシランが好ましい。その添加割合は、親水層固形分の5%以下が好ましい。
【0069】
さらに、本発明の親水層には、印刷時の耐刷力を増加させる目的で、上記の親水性樹脂あるいは芳香族水酸基を有する樹脂の架橋剤を添加してもよい。この様な架橋剤としては、ホルムアルデヒド、グリオキザール、ポリイソシアネート、テトラアルコキシシランの初期加水分解・縮合物、ジメチロール尿素及びヘキサメチロールメラミンを挙げることができる。
【0070】
さらに、本発明の親水層には、塗布の面状を良化させるため、良く知られたフッ素系界面活性剤、シリコン系界面活性剤、ポリオキシエチレン系界面活性剤などを添加しても良い。
【0071】
本発明の親水層は、上記各成分を溶剤に溶解又は分散した溶液を調製し、塗布により設けられる。親水層塗布液の主溶剤としては、水、及び、メタノール、エタノール、プロパノールなどの低沸点アルコールが単独又は混合物として用いられる。
【0072】
本発明では高耐刷化のため、この主溶剤にインキ受容層の親油性高分子を溶解する溶剤を添加することができる。このような溶剤としては、特開2001−180141号に記載の有機溶剤が挙げられる。この有機高分子の良溶剤は、インキ受容層に用いる個々の有機高分子によって異なるので特定しがたいが、一般的には、アルコール類(エチレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル等)、エーテル類(テトラヒドロフラン、エチレングリコールジメチルエーテル、プロピレングリコールジメチルエーテル、テトラヒドロピラン等)、ケトン類(アセトン、メチルエチルケトン、メチルイソブチルケトン、アセチルアセトン、シクロヘキサノン等)、エステル類(酢酸メチル、酢酸エチル、酢酸イソブチル、エチレングリコールモノメチルモノアセテート等)、アミド類(ホルムアミド、N−メチルホルムアミド、ピロリドン、N−メチルピロリドン等)、ガンマーブチロラクトン、乳酸メチル、乳酸エチル等の中から選ばれた溶剤である。
【0073】
インキ受容層の親油性高分子を溶解する溶剤の含有量は、好ましくは、親水層塗布液全溶剤の0.4〜40%である。より好ましくは0.4〜20%である。
【0074】
本発明の親水層の乾燥塗布量は、好ましくは0.2〜0.8g/m2、より好ましくは0.3〜0.5g/m2である。この範囲内で、機上現像性の低下や感度低下を起こすことなく、親水層の良好な保水性が得られる。
【0075】
本発明の感熱性平版印刷版用原板は、アブレーションによるカス発生の防止、及び保存や取り扱い時の親油性物質による親水層汚染や傷付きや、素手で取り扱ったときの指紋跡付着防止のため、親水層上に親水性オーバーコート層を設けることができる。
【0076】
本発明に使用される親水性オーバーコート層は印刷機上で除去可能なものであり、水溶性樹脂、又は水溶性樹脂を部分的に架橋した水膨潤性樹脂から選ばれた樹脂を含有する。
【0077】
かかる水溶性樹脂は、水溶性の天然高分子及び合成高分子から選ばれ、架橋剤とともに用い、塗布乾燥された皮膜がフィルム形成能を有するものである。
【0078】
好適な水溶性樹脂の具体例としては、天然高分子では、アラビアガム、水溶性大豆多糖類、繊維素誘導体(例えば、カルボキシメチルセルローズ、カルボキシエチルセルローズ、メチルセルローズ等)、その変性体、ホワイトデキストリン、プルラン、酵素分解エーテル化デキストリン等、合成高分子では、ポリビニルアルコール(ポリ酢酸ビニルの加水分解率65%以上のもの)、ポリアクリル酸、そのアルカリ金属塩もしくはアミン塩、ポリアクリル酸共重合体、そのアルカリ金属塩もしくはアミン塩、ポリメタクリル酸、そのアルカリ金属塩もしくはアミン塩、ビニルアルコール/アクリル酸共重合体及びそのアルカリ金属塩もしくはアミン塩、ポリアクリルアミド、その共重合体、ポリヒドロキシエチルアクリレート、ポリビニルピロリドン、その共重合体、ポリビニルメチルエーテル、ビニルメチルエーテル/無水マレイン酸共重合体、ポリ−2−アクリルアミド−2−メチル−1−プロパンスルホン酸、そのアルカリ金属塩もしくはアミン塩、ポリ−2−アクリルアミド−2−メチル−1−プロパンスルホン酸共重合体、そのアルカリ金属塩もしくはアミン塩、等を挙げることができる。また、目的に応じて、これらの樹脂を二種以上混合して用いることもできる。しかし、本発明はこれらの例に限定されるものではない。
【0079】
水溶性樹脂の少なくとも1種以上を部分架橋し、親水層上にオーバーコート層を形成する場合、架橋は、水溶性樹脂の有する反応性官能基を用いて架橋反応することにより行われる。架橋反応は、共有結合性の架橋であっても、イオン結合性の架橋であってもよい。
【0080】
架橋により、オーバーコート層表面の粘着性が低下して取り扱い性がよくなるが、架橋が進み過ぎるとオーバーコート層が親油性に変化して、印刷機上におけるオーバーコート層の除去が困難になるので、適度な部分架橋が好ましい。
【0081】
好ましい部分架橋の程度は、25℃の水中に印刷版用原板を浸したときに、30秒〜10分間では親水性オーバーコート層が溶出せず残存しているが、10分以上では溶出が認められる程度である。
【0082】
架橋反応に用いられる化合物としては、架橋性を有する公知の多官能性化合物が挙げられ、ポリエポキシ化合物、ポリイソシアネート化合物、ポリアルコキシシリル化合物、多価金属塩化合物、ポリアミン化合物、アルデヒド化合物、ヒドラジンなどが挙げられ、該架橋反応は公知の触媒を添加し、反応を促進することもできる。
【0083】
架橋性を有する公知の多官能性化合物の具体例としては、下記の化合物が挙げられる。
【0084】
ポリエポキシ化合物の具体例としては、グリセリンポリグリシジルエーテル、ポリエチレングリコールジグリシジルエーテル、ポリプロピレングリコールジグリシジルエーテル、トリメチロールプロパンポリグリシジルエーテル、トリメチロールプロパンポリグリシジルエーテル、ソルビトールポリグリシジルエーテル、ビスフェノール類もしくはそれらの水素添加物とエピハロヒドリンとのポリ縮合物、などが挙げられる。
【0085】
ポリアミンの具体例としては、エチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、ヘキサメチレンジアミン、プロピレンジアミン、ポリエチレンイミン、ポリアミドアミンなどが挙げられる。
【0086】
ポリイソシアネート化合物の具体例としては、トリレンジイソシアネート、ジフェニルメタンイソシアネート、液状ジフェニルメタンジイソシアネート、ポリメチレンポリフェニルイソシアネート、キシリレンジイソシアネート、ナフタリン−1,5−ジイソシアネート、シクロヘキサンフェニレンジイソシアネート、イソプロピルベンゼン−2,4−ジイソシアネート、などの芳香族イソシアネート、ヘキサメチレンジイソシアネート、デカメチレンジイソシアネートなどの脂肪族イソシアネート、シクロヘキシルジイソシアネート、イソホロンジイソシアネートなどの脂環族ジイソシアネート、またポリプロピレングリコール/トリレンジイソシアネート付加反応物などが挙げられる。
【0087】
シラン化合物としては、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリエトキシシラン、フェニルトリエトキシシラン、ビニルトリエトキシシラン、γ−アミノプロピルトリエトキシシラン、N−(β−アミノエチル)−γ−アミノプロピルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、ジメチルジメトキシシラン、ジメチルジエトキシシラン、ジフェニルジエトキシシラン、3−クロロプロピルメチルジメトキシシラン、ビニルトリス(メチルエチルケトオキシム)シラン、メチルトリス(メチルエチルケトオキシム)シラン、ビニルトリアセトキシシラン、など。
【0088】
チタネート化合物としては、テトラエチルオルトシリケート、ビス(ジオクチルパイロホスフェート)エチレンチタネート、イソプロピルトリアクタノイルチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルイソステアロイルジアクリルチタネート、イソプロピル(ジオクチルホスフェート)チタネート)、イソプロピルトリクミルフェニルチタネート、イソプロピルトリ(N−アミノエチルアミノエチル)チタネート、ジクミルフェニルオキシアセテートチタネート、ジイソステアロイルエチレンチタネート、イソプロピルトリインステアロイルチタネート、イソプロピルトリドデシルベンゼンスルホニルチタネート、イソプロピルトリス(ジオクチルホスフェート)チタネート、テトライソプロピルビス(ジオクチルホスファイト)チタネート、テトラオクチルビス(ジトリジシルホスファイト)チタネート、テトラ(2、2ージアリルオキシメチル−1−ブチル)ビス(ジトリデシルホスファイトチタネート、ビス(ジオクチルパイロホスフェート)オキシアセテートチタネート、ビス(ジオクチルパイロホスフェート)オキシアセテートチタネート、など。
【0089】
アルデヒド化合物としては、ホルムアルデヒド、アセトアルデヒド、プロピルアルデヒド、ブチルアルデヒド、グリオキサール、グルタルアルデヒド、テレフタルアルデヒド、など。
【0090】
多価金属塩化合物としては、亜鉛、カルシウム、マグネシウム、バリウム、ストロンチウム、コバルト、マンガン、ニッケル等の金属の水溶性塩が挙げられる。
【0091】
これらの架橋剤は単独又は2種以上を混合して使用することが可能である。これらの架橋剤のうち特に好ましい架橋剤は、水溶性の架橋剤であるが、非水溶性のものは分散剤によって水に分散して使用することができる。
【0092】
特に好ましい水溶性樹脂と架橋剤の組み合わせとしては、カルボン酸含有水溶性樹脂/多価金属化合物、カルボン酸含有水溶性樹脂/水溶性エポキシ樹脂、水酸基含有樹脂/ジアルデヒド類を挙げられる。
【0093】
架橋剤の好適な添加量は、水溶性樹脂の0.5〜10%である。この範囲内で印刷機上でのオーバーコート層の除去性を損なうことなく、良好な耐水性が得られる。
【0094】
その他、オーバーコート層には塗布の均一性を確保する目的で、水溶液塗布の場合には主に非イオン系界面活性剤を添加することができる。この様な非イオン界面活性剤の具体例としては、ソルビタントリステアレート、ソルビタンモノパルミテート、ソルビタントリオレート、ステアリン酸モノグリセリド、ポリオキシエチレンノニルフェニルエーテル、ポリオキシエチレンドデシルエーテル等を挙げることが出来る。
【0095】
上記非イオン界面活性剤のオーバーコート層の全固形物中に占める割合は、0.05〜5%が好ましい。
【0096】
本発明のオーバーコート層の乾燥塗布量は、0.1〜4.0g/m2が好ましく、0.1〜1.0g/m2が更に好ましく、0.10〜0.25g/m2が特に好ましい。この範囲内で、印刷機上でのオーバーコート層の除去性を損なうことなく、アブレーションカスの発生防止、良好な汚れや傷付き防止、及び指紋跡付着防止ができる。
【0097】
本発明のインキ受容層、親水層及びオーバーコート層の少なくとも一つの層には、感度を高めるため、光を熱に変換させる機能の光熱変換剤が含有される。光熱変換剤としては、赤外線、中でも近赤外線(波長700〜2000nm)を吸収する物質であればよく、種々の公知の顔料、染料又は色素、及び金属微粒子を用いることができる。
【0098】
例えば、特開2001−301350号、日本印刷学会誌、38卷35〜40頁(2001)「新イメージング材料、2.近赤外線吸収色素」等に記載の顔料、染料又は色素、及び金属微粒子が好適に用いられる。顔料及び金属微粒子は、必要に応じて、公知の表面処理を施したものを用いることができる。
【0099】
染料又は色素として、より具体的には、米国特許4756993号、同4973572号、特開平10−268512号、同11−235883号、特公平5−13514号、同5−19702号、特開2001−347765号等に記載のシアニン色素、ポリメチン色素、アゾメチン色素、スクアリリウム色素、ピリリウム及びチオピリリウム塩系染料、ジチオール金属錯体、フタロシアニン色素等が挙げられる。特に好ましいものとしては、シアニン色素、スクワリリウム色素、ピリリウム塩、フタロシアニン色素が挙げられる。
【0100】
顔料としては、不溶性アゾ顔料、アゾレーキ顔料、縮合アゾ顔料、キレートアゾ顔料、フタロシアニン系顔料、アントラキノン系顔料、ペリレン及びペリノン系顔料、チオインジゴ系顔料、キナクリドン系顔料、ジオキサジン系顔料、イソインドリノン系顔料、キノフタロン系顔料、染付けレーキ顔料、アジン顔料、ニトロソ顔料、ニトロ顔料、天然顔料、蛍光顔料、無機顔料、カーボンブラック等が使用できる。中でもカーボンブラックが特に好ましい。
【0101】
金属微粒子としてはAg、Au、Cu、Sb、Ge及びPbの微粒子が好ましく、Ag、Au及びCuの微粒子がより好ましい。
【0102】
光熱変換剤の添加割合は、親水層では、親水層固形分の1〜50%が好ましく、オーバーコート層では、オーバーコート層固形分2〜50%が好ましく、インキ受容層では、インキ受容層固形分の20%以下が好ましい。これらの範囲で、各層の膜強度を損なうことなく、良好な感度が得られる。
【0103】
本発明の感熱性平版印刷版用原板は、熱により画像形成される。具体的には、熱記録ヘッド等による直接画像様記録、赤外線レーザによる走査露光、キセノン放電灯などの高照度フラッシュ露光や赤外線ランプ露光などが用いられるが、波長700〜1200nmの赤外線を放射する半導体レーザ、YAGレーザ等の固体高出力赤外線レーザによる露光が好適である。
【0104】
画像露光された本発明の印刷版用原板は、それ以上の処理なしに印刷機に装着することができる。インキと湿し水を用いて印刷を開始すると、オーバーコート層は湿し水によって除去されると同時に露光部の親水層も除去され、その下のインキ受容層にインキが着肉し印刷が開始される。
【0105】
【実施例】
以下、実施例により本発明を詳細に説明するが、本発明はこれらに限定されるものではない。
【0106】
実施例1
[アルミニウム基板の作製]
アルミニウム99.5%に、銅を0.01%、チタンを0.03%、鉄を0.3%、ケイ素を0.1%含有するJISA1050アルミニウム材の厚み0.30mm圧延板を、400メッシュのパミストン(共立窯業製)の20%水性懸濁液と回転ナイロンブラシ(6,10−ナイロン)とを用いてその表面を砂目立てした後、よく水で洗浄した。これを15%水酸化ナトリウム水溶液(アルミニウム4.5%含有)に浸漬してアルミニウムの溶解量が8g/m2になるようにエッチングした後、流水で水洗した。更に、1%硝酸水溶液で中和し、次に0.7%硝酸水溶液(アルミニウム0.5%含有)中で、陽極時電圧10.5V、陰極時電圧9.3Vの矩形波交番波形電圧(電流比r=0.90、特公昭58−5796号公報実施例に記載されている電流波形)を用いて240C/dm2の陽極時電気量で電解粗面化処理を行った。水洗後、35℃の10%水酸化ナトリウム水溶液中に浸漬してアルミニウム溶解量が0.9g/m2になるようにエッチングした後、水洗した。次に、50℃、30%の硫酸水溶液中に浸漬し、デスマットした後、水洗した。
【0107】
更に、53℃の硫酸9%水溶液(アルミニウム0.6%含有)中で直流電流を用いて多孔性陽極酸化皮膜形成処理を行った。すなわち、電解時間を33秒とし、電流密度の調節により、陽極酸化皮膜量3.7g/m2とした。次いで水洗、乾燥し、アルミニウム基板を得た。得られた基板の中心線平均粗さRaは0.53μmであった。
【0108】
[感熱性平版印刷版用原板の作製]
メチルエチルケトン13.5g、プロピレングリコールモノメチルエーテル27.0gの混合溶媒中に、光熱変換剤(下記IR−1)0.3g、エピコート1009(エポキシ樹脂、ジャパンエポキシレジン製)1.2g、エピコート1001(エポキシ樹脂、ジャパンエポキシレジン製)0.3gを溶解させた後、上記のアルミニウム基板に塗布液量が12cm3/m2になるようバーコーターで塗布した。その後、100℃、1分間加熱乾燥し、乾燥塗布量0.42g/m2のインキ受容層を得た。
【0109】
次に、メタノール19.4g、乳酸メチル0.1gからなる混合溶媒中に、メタノールシリカゾル(10〜20nmのシリカ粒子を30%含有するメタノール溶液からなるコロイド、日産化学工業製)3.0gを加え、続いてポリアクリル酸(重量平均分子量25万、和光純薬工業製)0.1gを溶解させた後、インキ受容層上に塗布液量が12cm3/m2になるようバーコーターで塗布した。その後、100℃、1分間加熱乾燥し、乾燥塗布量0.40g/m2の親水層を得た。
【0110】
上記親水層上に、アラビヤガムの28%水溶液1.5g、光熱変換剤(下記のIR−2)0.042g、及びエマレックス#710(界面活性剤、日本エマルジョン製)の10%水溶液0.168g、酢酸マグネシウム4水和物(和光純薬工業製)の10%水溶液0.03g、水30.06gからなる水溶液を塗布液量が12cm3/m2になるようバーコーターで塗布後100℃、1.5分間加熱乾燥し、乾燥塗布量0.15g/m2のオーバーコート層を設け、感熱性平版印刷版用原板を作製した。
【0111】
【化1】
【0112】
[露光及び印刷評価]
上記の平版印刷版用原板をCreoScitex社製のトレンドセッター3244VXに取り付け、240mJ/cm2のエネルギーを照射し潜像を形成した。露光後の版面観察で、アブレーションによりカスが飛散した形跡はほとんど見られなかった。
【0113】
次に潜像を形成した原板をハイデルベルグ社製SOR−M印刷機に取り付け、4容量%IF102(富士写真フイルム製)水溶液からなる湿し水とGEOS−G(N)墨インキ(大日本インキ化学製)を用い印刷したところ、刷り出しの20枚程度でオーバーコート層と露光部の親水層が取り除かれた。続けて印刷し、2万部の汚れのない良好な印刷物を得られた。
【0114】
比較例1
陽極酸化皮膜形成処理の電流密度を調整して陽極酸化皮膜量を2.0g/m2としたアルミニウム基板を用いた以外は実施例1と同様に、感熱性平版印刷版用原板の作製した。露光・印刷評価を実施例1と同様に行ったところ、刷り出しから1000枚を過ぎても画像部にインキが着肉しなかった。印刷版の画像部を走査型電子顕微鏡で観察した結果、親水層が部分的に残っており、インキ受容層の露出が十分でないことが分かった。刷り出し20枚程度で良好な印刷物を得るには、露光エネルギーを270mJ/m2に上げる必要があった。
【0115】
比較例2
陽極酸化皮膜形成処理の電流密度を調整して陽極酸化皮膜量を6.0g/m2としたアルミニウム基板を用いた以外は実施例1と同様に、感熱性平版印刷版用原板の作製及び露光・印刷評価を行ったところ、刷り出しから1000枚を過ぎても画像部にインキが着肉しなかった。印刷版の画像部を走査型電子顕微鏡で観察した結果、親水層が部分的に残っており、インキ受容層の露出が十分でないことが分かった。刷り出し20枚程度で良好な印刷物を得るには、露光エネルギーを270mJ/m2に上げる必要があった。
【0116】
以上の結果から、本発明の感熱性平版印刷版用原板は、感度が高く、アブレーションによるカスの飛散が防止され、印刷での汚れ難さが良好で、高耐刷であることが分かる。
【0117】
【発明の効果】
本発明によれば、デジタル信号に基づいた走査露光による製版が可能であり、露光後、処理を行うことなく直接印刷機に装着して印刷することができ、アブレーションカスの飛散によるレーザー露光装置や光源の汚染が防止され、高感度で、汚れ難さに優れ、さらに高耐刷な感熱性平版印刷版用原板を提供できる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a development-free lithographic printing plate precursor for a computer-to-plate (CTP) system. More specifically, image recording by infrared scanning exposure based on a digital signal is possible, and the recorded image can be directly mounted on a printing machine and printed without going through a conventional liquid development process. The present invention relates to a thermosensitive lithographic printing plate precursor.
[0002]
[Prior art]
Conventionally, the production of a lithographic printing plate has been performed by a system that exposes an original plate for a printing plate through a lith film that is an intermediate material. However, with the rapid progress of digitization in the printing field in recent years, the printing plate preparation process is changing to a CTP system that directly outputs digital data input to a computer and edited to a printing plate master. In order to further streamline the process, development-free lithographic printing plate precursors that can be directly mounted on a printing press and printed without being developed after exposure have been researched and developed. For example, various methods are described as development-free CTP printing plates in Journal of the Japan Printing Society, Vol. 36, pages 148-163 (1999).
[0003]
One promising method is a method using ablation in which exposure is performed with a solid-state high-power infrared laser such as a semiconductor laser or YAG laser, heat is generated with a photothermal conversion agent that converts light into heat, and the exposed portion is decomposed and evaporated. . That is, a hydrophilic layer is provided on a substrate having an oleophilic ink-receptive surface or an ink-receptive layer, and the hydrophilic layer is ablated and removed.
[0004]
WO94 / 18005 describes a printing plate in which a hydrophilic layer crosslinked is provided on an oleophilic laser light absorbing layer, and this hydrophilic layer is ablated. This hydrophilic layer is formed by cross-linking polyvinyl alcohol with a hydrolyzate of tetraethoxy silicon and containing titanium dioxide particles, and is intended to improve the film strength of the hydrophilic layer. This technique improves printing durability. However, the resistance to soiling was insufficient and further improvement was required.
[0005]
WO98 / 40212 and WO99 / 19143 have an ink-receiving layer on a substrate and a hydrophilic layer mainly composed of a colloid such as silica crosslinked with a crosslinking agent such as aminopropyltriethoxysilane. A lithographic printing plate precursor that can be mounted on a printing machine without a printer is described. This hydrophilic layer increases the resistance to printing stains by reducing the number of hydrocarbon groups as much as possible, and improves the printing durability by crosslinking the colloid with a crosslinking agent. However, with this technique, the printing durability is insufficient, such as several thousand sheets.
[0006]
Furthermore, the conventional lithographic printing plate precursor using ablation has a problem that the ablation residue is scattered to contaminate the laser exposure apparatus and the light source. For this reason, it is necessary to add a device for capturing the ablation residue to these devices, but it has been difficult to sufficiently remove the contamination even with the capturing device.
[0007]
On the other hand, JP-A-2001-96936 discloses a hydrophilic layer having an ink-receptive surface or having a heating part easily removed by dampening water or ink during printing on a substrate on which an ink-receptive layer is applied. With a heat-sensitive lithographic printing plate precursor having a water-soluble overcoat layer containing a photothermal conversion agent, if necessary, good printing durability and stain resistance can be obtained, and laser exposure can be achieved by suppressing scattering of ablation residue. It is described that contamination of the device and the light source is prevented.
[0008]
[Problems to be solved by the invention]
However, the above-described improved technology is still insufficient for the demand for higher printing durability. The object of the present invention is to solve this problem. In other words, it is possible to print directly attached to a printing machine without performing post-exposure processing, contamination of the laser exposure apparatus and light source due to scattering of ablation residue is prevented, high sensitivity, excellent stain resistance, Another object of the present invention is to provide a heat-sensitive lithographic printing plate precursor having a high printing durability.
[0009]
[Means for Solving the Problems]
Means for solving the problems of the present invention are as follows. (1) ink-receptive layer, (2) beryllium, magnesium, aluminum, silicon, titanium, boron, germanium, tin, zirconium, iron, vanadium, antimony and transition on a roughened aluminum substrate having an anodized film A heat-sensitive lithographic printing plate having a hydrophilic layer containing a colloidal particulate oxide or hydroxide of at least one element selected from metals, and (3) a hydrophilic overcoat layer removable on the printing machine in this order For an ink receiving layer with a dry coating amount of 0.5 g / m2The amount of anodized film is less than3.2 g / m 2 more than5.0 g / m2A heat-sensitive lithographic printing plate precursor characterized by being less than
[0010]
In the case of the lithographic printing plate precursor having the layer structure of the present invention, in order to increase the printing durability, it is necessary to enhance the adhesion between the lipophilic ink-receiving layer and the hydrophilic layer having the opposite property. For that purpose, the ink receiving layer is 0.5 g / m.2It was considered that the surface of the roughened ink-receptive layer was formed by tracing the grain roughness of the support surface by using a thin layer of less than that, and the anchor effect was used. However, the thinning of the ink receiving layer has caused new problems that weaken the heat insulating property of the ink receiving layer, facilitate the diffusion of heat generated by exposure to the aluminum support, and lower the sensitivity. As a result of detailed examination of this problem, the present inventor has found that the anodized film on the aluminum surface has a coating amount.3.2 g / m 2 more than5.0 g / m2It has been found that it has a good heat insulating property in a specific range of less than, and by utilizing this heat insulating property, the above problems can be solved and the present invention has been achieved.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail. In addition,% shows weight% unless there is particular notice.
[0012]
The support of the present invention is a roughened aluminum substrate having an anodized film. As the raw material aluminum plate, conventionally known and publicly available aluminum plates can be appropriately used. That is, the raw material aluminum plate is a pure aluminum plate or an alloy plate containing aluminum as a main component and a trace amount of foreign elements. Examples of foreign elements contained in the aluminum alloy include silicon, iron, manganese, copper, magnesium, chromium, zinc, bismuth, nickel, and titanium. The content of foreign elements in the alloy is 10% or less. Further, it may be an aluminum plate from an aluminum ingot using a DC casting method or an aluminum plate from an ingot by a continuous casting method.
[0013]
The thickness of the aluminum substrate used in the present invention is 0.05 to 0.6 mm, preferably 0.1 to 0.4 mm, and particularly preferably 0.15 to 0.3 mm.
[0014]
The roughening treatment on the surface of the aluminum plate can be performed by various methods. For example, it can be carried out by a method of roughening mechanically, a method of dissolving and roughening the surface electrochemically, a method of selectively dissolving the surface chemically, or a combination of two or more of these methods. . As the mechanical method, a known method such as a ball polishing method, a brush polishing method, a blast polishing method, or a buff polishing method can be used. As a chemical method, a method of immersing in a saturated aqueous solution of an aluminum salt of a mineral acid as described in JP-A No. 54-31187 is suitable. In addition, as an electrochemical surface roughening method, there is a method of performing alternating current or direct current in an electrolytic solution containing an acid such as hydrochloric acid or nitric acid. Further, as disclosed in JP-A-54-63902, an electrolytic surface roughening method using a mixed acid can also be used.
[0015]
The roughened aluminum plate is subjected to an alkali etching treatment with an aqueous solution of potassium hydroxide, sodium hydroxide or the like as necessary, further neutralized, and then anodized.
[0016]
As an electrolyte used for anodizing treatment of an aluminum plate, various electrolytes that form a porous oxide film can be used. Generally, sulfuric acid, phosphoric acid, oxalic acid, chromic acid, sulfamic acid, benzenesulfonic acid are used. Alternatively, a mixed acid thereof is used. The concentration of these electrolytes is appropriately determined depending on the type of electrolyte.
[0017]
The treatment conditions for anodization vary depending on the electrolyte used and cannot be specified. However, in general, the electrolyte concentration is 1 to 80% solution, the liquid temperature is 5 to 70 ° C., and the current density is 5 to 60 A / day. dm2, voltage of 1 to 100 V, and electrolysis time of 10 seconds to 50 minutes are suitable. Among these anodizing treatments, in particular, the method of anodizing at high current density in sulfuric acid described in British Patent 1,412,768 and described in US Pat. No. 3,511,661. A method of anodizing phosphoric acid as an electrolytic bath is preferred.
[0018]
The amount of oxide film of the aluminum substrate of the present invention is3.2 g / m 2 more than5.0 g / m2Is less than. More preferably 3.2 to 4.5 g / m2, Most preferably 3.5 to 4.0 g / m2It is. A good heat insulation effect can be obtained within this range. The amount of oxide film is3.2 g / m 2 Less thanInsufficiency is insufficient, while 5.0 g / m2Even above, the heat insulation effect becomes insufficient. 5.0 g / m2The thermal insulation effect is insufficient as described above because the diameter of the oxide film pore opening increases as the amount of the oxide film increases, and the ink receiving layer enters the pores. It is presumed to prevent heat insulation and promote the diffusion of heat to the support.
[0019]
As the substrate used in the present invention, the substrate having the anodized film subjected to the surface treatment as described above may be used as it is, but for further improvement such as adhesion to the upper layer and heat insulation, as necessary, As appropriate, micropore sealing treatment of an anodized film described in JP-A No. 2001-253181, surface hydrophilization treatment immersed in an aqueous solution containing a hydrophilic compound described in JP-A No. 2001-322365, etc. You can choose to do it.
[0020]
Suitable hydrophilic compounds for the hydrophilization treatment include polyvinylphosphonic acid, sulfonic acid group-containing compounds, saccharide compounds, citric acid, alkali metal silicates, potassium zirconium fluoride, phosphate / inorganic fluorine compounds, and the like. Can be mentioned.
[0021]
As for the surface roughness of the aluminum substrate obtained as described above, the center line average roughness Ra is preferably 0.45 μm or more, more preferably 0.48 μm or more, and particularly preferably 0.52 μm or more. The upper limit of the Ra value is related to the coating thickness of the ink receiving layer to be coated thereon, and thus cannot be determined in general, but generally it is preferably up to about 0.7 μm. Within this range, the surface of the ink receiving layer can be a rough surface exhibiting good adhesion to the hydrophilic layer.
[0022]
The ink receiving layer used in the present invention contains an organic polymer. The organic polymer is soluble in a solvent and can form a lipophilic film. Furthermore, it is desirable that it is insoluble in the coating solvent for the upper hydrophilic layer, but in some cases, a part that swells in the coating solvent for the upper layer is excellent in adhesion to the hydrophilic layer and may be desirable. In addition, when an organic polymer that is soluble in the coating solvent for the hydrophilic layer is used, it is desirable to cure the ink receiving layer by adding a cross-linking agent.
[0023]
Useful organic polymers include polyester, polyurethane, polyurea, polyimide, polysiloxane, polycarbonate, phenoxy resin, epoxy resin, novolac resin, resole resin, condensation resin of phenol compound and acetone, polyvinyl acetate, acrylic resin Polymer, polyvinylphenol, polyvinyl halogenated phenol, methacrylic resin and its copolymer, acrylamide copolymer, methacrylamide copolymer, polyvinyl formal, polyamide, polyvinyl butyral, polystyrene, cellulose ester resin, polyvinyl chloride and poly And vinylidene chloride.
[0024]
Among these, as a more preferable compound, a resin having a hydroxyl group, a carboxyl group, a sulfonamide group or a trialkoxysilyl group in the side chain is excellent in adhesion to a substrate or an upper hydrophilic layer, and in some cases, a crosslinking agent. Desirable because it hardens easily.
[0025]
In addition, an acrylonitrile copolymer, polyurethane, a copolymer having a sulfonamide group in the side chain, or a copolymer having a hydroxyl group in the side chain and photocured with a diazo resin is preferable.
[0026]
Examples of the epoxy resin suitable for the ink receiving layer of the present invention include bisphenol A / epichlorohydrin polyaddition, bisphenol F / epichlorohydrin polyaddition, and halogenated bisphenol A / epichlorohydrin polyaddition. And biphenyl type bisphenol / epichlorohydrin polyadduct, novolac resin / epichlorohydrin polyadduct, and the like. Specifically, Epicoat 1001 (softening point 68 ° C., Mn about 900) made by Japan Epoxy Resin, Epicoat 1007 (softening point 128 ° C., Mn about 2900), Epicoat 1009 (softening point 144 ° C., Mn about 3750), Epicoat 1010 (softening point 169 ° C., Mn about 5500), Epicoat 1100L (softening point 149 ° C.), Epicoat YX31575 (softening point 130 ° C.), and the like.
[0027]
As novolak resin and resol resin, phenol, cresol (m-cresol, p-cresol, m / p mixed cresol), phenol / cresol (m-cresol, p-cresol, m / p mixed cresol), phenol-modified xylene, t-butylphenol, octylphenol, resorcinol, pyrogallol, catechol, chlorophenol (m-Cl, p-Cl), bromophenol (m-Br, p-Br), salicylic acid, phloroglucinol and the like, and aldehydes such as formaldehyde, An addition condensate with paraformaldehyde and the like can be mentioned.
[0028]
Examples of other suitable polymer compounds include copolymers having an average molecular weight of usually 1 to 200,000 having the monomers shown in (1) to (12) below as structural units.
[0029]
(1) Acrylamides, methacrylamides, acrylic esters, methacrylic esters and hydroxystyrenes having an aromatic hydroxy group, such as N- (4-hydroxyphenyl) acrylamide or N- (4-hydroxyphenyl) methacryl Amide, o-, m- and p-hydroxystyrene, o-, m- and p-hydroxyphenyl acrylate or methacrylate,
[0030]
(2) Acrylic acid esters and methacrylic acid esters having an aliphatic hydroxy group, such as 2-hydroxyethyl acrylate or 2-hydroxyethyl methacrylate,
[0031]
(3) Methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, amyl acrylate, hexyl acrylate, cyclohexyl acrylate, octyl acrylate, phenyl acrylate, benzyl acrylate, 2-chloroethyl acrylate, Acrylic acid esters such as 4-hydroxybutyl acrylate, glycidyl acrylate, N, N-dimethylaminoethyl acrylate,
[0032]
(4) Methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, amyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, octyl methacrylate, phenyl methacrylate, benzyl methacrylate, 2-chloroethyl methacrylate, Methacrylic acid esters such as 4-hydroxybutyl methacrylate, glycidyl methacrylate, N, N-dimethylaminoethyl methacrylate,
[0033]
(5) Acrylamide, methacrylamide, N-methylol acrylamide, N-methylol methacrylamide, N-ethyl acrylamide, N-ethyl methacrylamide, N-hexyl acrylamide, N-hexyl methacrylamide, N-cyclohexyl acrylamide, N-cyclohexyl methacryl Amide, N-hydroxyethylacrylamide, N-hydroxyethylacrylamide, N-phenylacrylamide, N-phenylmethacrylamide, N-benzylacrylamide, N-benzylmethacrylamide, N-nitrophenylacrylamide, N-nitrophenylmethacrylamide, N Acrylamide or methacrylamido such as ethyl-N-phenylacrylamide and N-ethyl-N-phenylmethacrylamide ,
[0034]
(6) Vinyl ethers such as ethyl vinyl ether, 2-chloroethyl vinyl ether, hydroxyethyl vinyl ether, propyl vinyl ether, butyl vinyl ether, octyl vinyl ether, phenyl vinyl ether,
[0035]
(7) Vinyl esters such as vinyl acetate, vinyl chloroacetate, vinyl butyrate, vinyl benzoate,
[0036]
(8) Styrenes such as styrene, methylstyrene, chloromethylstyrene,
[0037]
(9) Vinyl ketones such as methyl vinyl ketone, ethyl vinyl ketone, propyl vinyl ketone, phenyl vinyl ketone,
[0038]
(10) Olefin such as ethylene, propylene, isobutylene, butadiene, isoprene,
[0039]
(11) N-vinylpyrrolidone, N-vinylcarbazole, 4-vinylpyridine, acrylonitrile, methacrylonitrile, etc.
[0040]
(12) N- (o-aminosulfonylphenyl) acrylamide, N- (m-aminosulfonylphenyl) acrylamide, N- (p-aminosulfonylphenyl) acrylamide, N- [1- (3-aminosulfonyl) naphthyl] acrylamide Acrylamides such as N- (2-aminosulfonylethyl) acrylamide, N- (o-aminosulfonylphenyl) methacrylamide, N- (m-aminosulfonylphenyl) methacrylamide, N- (p-aminosulfonylphenyl) methacryl Sulfonamide group-containing acrylamide or methacrylamide such as amide, N- [1- (3-aminosulfonyl) naphthyl] methacrylamide, N- (2-aminosulfonylethyl) methacrylamide, and o-aminosulfonylpheny Acrylate, m-aminosulfonylphenyl acrylate, p-aminosulfonylphenyl acrylate, 1- (3-aminosulfonylphenylnaphthyl) acrylate, o-aminosulfonylphenyl methacrylate, m-aminosulfonylphenyl methacrylate, p-aminosulfonylphenyl methacrylate, 1 -Sulfonamide group-containing acrylic ester or methacrylic ester such as (3-aminosulfonylphenylnaphthyl) methacrylate.
[0041]
These organic polymers can be dissolved in an appropriate solvent, applied onto the substrate and dried, and the ink receiving layer can be provided on the substrate. Although it is possible to use only an organic polymer dissolved in a solvent, a crosslinking agent, an adhesion assistant, a colorant, a coating surface condition improver, and a plasticizer can be added as necessary. In addition, a heating coloring or decoloring additive for forming a printout image after exposure may be added.
[0042]
Examples of the crosslinking agent for crosslinking the organic polymer include diazo resins, aromatic azide compounds, epoxy resins, isocyanate compounds, blocked isocyanate compounds, tetraalkoxysilicon initial hydrolysis condensates, glyoxal, aldehyde compounds, and methylol compounds. be able to.
[0043]
As the adhesion assistant, the diazo resin is excellent in adhesion to the substrate and the hydrophilic layer. In addition, a silane coupling agent, an isocyanate compound, and a titanium coupling agent are also useful.
[0044]
As the colorant, ordinary dyes and pigments are used, and in particular, rhodamine 6G chloride, rhodamine B chloride, crystal violet, malachite green oxalate, quinizarin, 2- (α-naphthyl) -5-phenyloxazole and the like. Is mentioned. Specific examples of other dyes include oil yellow # 101, oil yellow # 103, oil pink # 312, oil green BG, oil blue BOS, oil blue # 603, oil black BY, oil black BS, and oil black T-505. (Oriental Chemical Industries, Ltd.), Victoria Pure Blue, Crystal Violet (CI 42555), Methyl Violet (CI 42535), Ethyl Violet, Methylene Blue (CI 522015), Patent Pure Blue (manufactured by Sumitomo Sankoku Chemical Co., Ltd.), Brilliant Blue, Methyl green, erythricin B, basic fuchsin, m-cresol purple, auramine, 4-p-diethylaminophenyliminaftquinone, cyano-p-diethylaminophenylacetanilide Triphenylmethane, diphenylmethane, oxazine, xanthene, iminonaphthoquinone, azomethine or anthraquinone dyes represented by JP-A-62-293247 or JP-A-9-179290. Can be mentioned.
[0045]
When the coloring matter is added to the ink receiving layer, it is usually in a proportion of about 0.02 to 10%, more preferably about 0.1 to 5%, based on the total solid content of the receiving layer.
[0046]
Furthermore, fluorine-based surfactants and silicon-based surfactants, which are well-known compounds as coating surface condition improvers, can also be used. Specifically, a surfactant having a perfluoroalkyl group or a dimethylsiloxane group is useful by adjusting the coating surface.
[0047]
Furthermore, a plasticizer is added to the ink receiving layer of the present invention, if necessary, in order to impart flexibility and the like of the coating film. For example, polyethylene glycol, tributyl citrate, diethyl phthalate, dibutyl phthalate, dihexyl fukurate, dioctyl phthalate, tricresyl phosphate, tributyl phosphate, trioctyl phosphate, tetrahydrofurfuryl oleate, oligomers of acrylic acid or methacrylic acid And polymers are used.
[0048]
Further, examples of additives for coloring or decoloring printing that can be added to the ink receiving layer of the present invention include thermal acid generators such as diazo compounds and diphenyliodonium salts and leuco dyes (leucomalachite green, leucocrystal). Violet, crystal violet lactone, etc.) and PH discoloring dyes (for example, dyes such as ethyl violet and Victoria pure blue BOH) are used in combination. In addition, a combination of an acid coloring dye and an acidic binder as described in EP 897134 is also effective. In this case, the association state forming the dye is broken by heating, and a lactone body is formed to change from colored to colorless. The addition ratio of these additives is preferably 10% or less, more preferably 5% or less, based on the solid content of the ink receiving layer.
[0049]
Solvents for applying the ink receiving layer include alcohols (methanol, ethanol, propyl alcohol, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl ether, etc.) , Ethers (tetrahydrofuran, ethylene glycol dimethyl ether, propylene glycol dimethyl ether, tetrahydropyran, etc.), ketones (acetone, methyl ethyl ketone, acetylacetone, etc.), esters (methyl acetate, ethyl acetate, ethylene glycol monomethyl ether monoacetate, gamma-butyrolactone, lactic acid) Methyl, ethyl lactate, etc.), amides (formamide, N- Chill formamide, pyrrolidone, N- methylpyrrolidone), or the like can be used. These solvents are used alone or in combination. The concentration of the ink receiving layer component (total solid content including additives) in the coating solution is preferably 1 to 50%. In addition, the film can be formed not only from the organic solvent as described above but also from an aqueous emulsion. In this case, the concentration is preferably 5% to 50%.
[0050]
The dry coating amount of the ink receiving layer of the present invention is 0.5 g / m.2Is less than. The lower limit of the preferable dry coating amount is 0.2 g / m.2And more preferably 0.3 g / m2It is. Within this range, the surface of the ink receiving layer can be a rough surface exhibiting good adhesion to the hydrophilic layer, and good printing durability can be obtained.
[0051]
The hydrophilic layer of the present invention comprises a colloidal particulate oxide or hydroxide of at least one element selected from beryllium, magnesium, aluminum, silicon, titanium, boron, germanium, tin, zirconium, iron, vanadium, antimony and transition metals. Contains products.
[0052]
The colloidal particulate oxides or hydroxides of these elements are dispersed phases of the colloidal dispersion by various known methods such as hydrolysis of halides or alkoxy compounds of the above elements or condensation of hydroxides, that is, Made as colloidal particles. When added to a hydrophilic layer coating solution for providing a hydrophilic layer, it can be added in the state of a colloidal dispersion.
[0053]
Of these oxides or hydroxides of these elements, particularly preferred are oxides or hydroxides of at least one element selected from aluminum, silicon, titanium and zirconium.
[0054]
The colloidal particles of the oxides or hydroxides of these elements preferably have a spherical particle diameter of 5 to 100 nm in the case of silica. A pearl necklace-like colloidal particle in which spherical particles of 10 to 50 nm are continuous in a length of 50 to 400 nm can also be used. Feather-shaped particles such as 100 nm × 10 nm, such as aluminum oxide or hydroxide colloidal particles, are also effective. Commercially available products such as Nissan Chemical Industries, Ltd. can be purchased for these colloidal dispersions.
[0055]
As a dispersion medium for these colloidal particles, in addition to water, organic solvents such as methanol, ethanol, ethylene glycol monomethyl ether, and methyl ethyl ketone are also useful.
[0056]
In the hydrophilic layer of the present invention, a hydrophilic resin can be used together with the colloidal particles. By using the hydrophilic resin, the film property of the hydrophilic layer can be enhanced and the printing durability can be improved. As the hydrophilic resin, those having a hydrophilic group such as hydroxyl, carboxyl, hydroxyethyl, hydroxypropyl, amino, aminoethyl, aminopropyl, carboxymethyl and the like are preferable.
[0057]
Specific examples of hydrophilic resins include gum arabic, casein, gelatin, starch derivatives, carboxymethylcellulose and sodium salts thereof, cellulose acetate, sodium alginate, vinyl acetate-maleic acid copolymer, styrene-maleic acid copolymer, polyacrylic acid and the like Salts, polymethacrylic acid and their salts, homopolymers and copolymers of hydroxyethyl methacrylate, homopolymers and copolymers of hydroxyethyl acrylate, homopolymers and copolymers of hydroxypropyl methacrylate, homopolymers and copolymers of hydroxypropyl acrylate, hydroxybutyl methacrylate Homopolymers and copolymers, hydroxybutyl acrylate homopolymers and copolymers, polyethylene Recall, polypropylene oxide, polyvinyl alcohol, and hydrolyzed polyvinyl acetate, polyvinyl formal, polyvinyl butyral, polyvinyl pyrrolidone, acrylamide homopolymers and copolymers, methacrylamide homopolymers having a degree of hydrolysis of at least 60%, preferably at least 80% Examples thereof include polymers, homopolymers and copolymers of N-methylolacrylamide.
[0058]
The addition ratio of these hydrophilic resins is preferably 40% or less, more preferably 20% or less, based on the solid content of the hydrophilic layer.
[0059]
Moreover, the resin which has an aromatic hydroxyl group can also be used for the hydrophilic layer of this invention. In the case of using a resin having an aromatic hydroxyl group, it is possible to improve the imprinting property of printing as well as improving the film property of the hydrophilic layer. The resin having an aromatic hydroxyl group is preferably one that dissolves in methanol at 5% or more at 25 ° C., and examples thereof include alkali-soluble resins such as novolac resin, resol resin, polyvinylphenol resin, and ketone pyrogallol resin.
[0060]
Preferred novolak resins include phenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, and at least one hydroxyl group-containing aromatic compound selected from 3,5-xylenol and resorcin, formaldehyde, Examples thereof include novolak resins obtained by addition condensation with at least one selected from aldehydes such as acetaldehyde and propionaldehyde under an acidic catalyst. Paraformaldehyde and paraaldehyde may be used in place of formaldehyde and acetaldehyde, respectively.
[0061]
Among them, the mixing ratio of m-cresol: p-cresol: 2,5-xylenol: 3,5-xylenol: resorcin is 40 to 100: 0 to 50: 0 to 20: 0 to 20: 0 to 20 in molar ratio. Or a novolak resin which is an addition condensate of a mixture of phenol: m-cresol: p-cresol with a molar ratio of 1-100: 0 to 70: 0-60 and an aldehyde. Of the aldehydes, formaldehyde is particularly preferable. The novolak resin has a weight average molecular weight of preferably 1,000 to 15,000, more preferably 1,500 to 10,000.
[0062]
Preferred resole resins include phenol, m-cresol, o-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, resorcin, pyrogallol, bis- (4-hydroxyphenyl) methane, bisphenol-A, Hydroxyl-containing aromatic hydrocarbons such as o-ethylphenol, m-ethylphenol, p-ethylphenol, propylphenol, n-butylphenol, t-butylphenol, 1-naphthol and 2-naphthol, and other two or more hydroxyl groups At least one kind of polynuclear aromatic hydrocarbons having an aldehyde such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, furfural, etc., and acetone, methyl ethyl ketone, methyl isobutyl ketone, etc. Those engaged at least one aldehyde or ketone and the additional condensation selected from ketones.
[0063]
Paraformaldehyde and paraaldehyde may be used in place of formaldehyde and acetaldehyde, respectively. The weight average molecular weight of the resole resin is preferably 500 to 10,000, particularly preferably 1,000 to 5,000.
[0064]
Preferred polyvinylphenol resins include o-hydroxystyrene, m-hydroxystyrene, p-hydroxystyrene, 2- (o-hydroxyphenyl) propylene, 2- (m-hydroxyphenyl) propylene, 2- (p-hydroxyphenyl). Examples thereof include single or two or more copolymers of hydroxystyrenes such as propylene. Hydroxystyrenes may have a substituent such as a halogen such as chlorine, bromine, iodine, fluorine or an alkyl group having 1 to 4 carbon atoms in the aromatic ring. And polyvinylphenol which may have a halogen or an alkyl group having 1 to 4 carbon atoms.
[0065]
In addition, o-hydroxystyrene, m-hydroxystyrene, p-hydroxystyrene, 2- (o-hydroxyphenyl) propylene, 2- (m-hydroxyphenyl) propylene, 2- (p-hydroxyphenyl) propylene, etc. Copolymers of hydroxystyrenes with methacrylic acid, acrylic acid, methacrylic acid alkyl esters and acrylic acid alkyl esters are also useful.
The polyvinylphenol resin is usually obtained by polymerizing hydroxystyrene, which may have a substituent, alone or in the presence of a radical polymerization initiator or a cationic polymerization initiator. Such polyvinyl phenol resin may be partially hydrogenated. Moreover, the resin which protected some hydroxyl groups of polyvinyl phenol resin by t-butoxycarbonyl group, a pyranyl group, a furanyl group, etc. may be sufficient. The weight average molecular weight of the polyvinylphenol resin is preferably 1,000 to 100,000, particularly preferably 1,500 to 50,000.
[0066]
As the ketone pyrogallol resin, acetone pyrogallol resin is particularly useful.
[0067]
The addition ratio of the resin having an aromatic hydroxyl group is preferably 20% or less, more preferably 12% or less, based on the solid content of the hydrophilic layer.
[0068]
A cross-linking agent that promotes cross-linking of the colloidal oxide or hydroxide may be added to the hydrophilic layer of the present invention. As such a crosslinking agent, an initial hydrolysis condensate of tetraalkoxysilane, trialkoxysilylpropyl-N, N, N-trialkylammonium halide, or aminopropyltrialkoxysilane is preferable. The addition ratio is preferably 5% or less of the solid content of the hydrophilic layer.
[0069]
Furthermore, the hydrophilic layer of the present invention may be added with the above-mentioned hydrophilic resin or a resin crosslinking agent having an aromatic hydroxyl group for the purpose of increasing the printing durability during printing. Examples of such a crosslinking agent include formaldehyde, glyoxal, polyisocyanate, initial hydrolysis / condensation product of tetraalkoxysilane, dimethylol urea and hexamethylol melamine.
[0070]
Furthermore, in order to improve the surface state of the coating, a well-known fluorine-based surfactant, silicon-based surfactant, polyoxyethylene-based surfactant, or the like may be added to the hydrophilic layer of the present invention. .
[0071]
The hydrophilic layer of the present invention is provided by preparing a solution prepared by dissolving or dispersing each of the above components in a solvent and applying the solution. As the main solvent of the hydrophilic layer coating solution, water and low-boiling alcohols such as methanol, ethanol, and propanol are used alone or as a mixture.
[0072]
In the present invention, a solvent capable of dissolving the lipophilic polymer of the ink receiving layer can be added to the main solvent for high printing durability. Examples of such a solvent include organic solvents described in JP-A No. 2001-180141. The good solvent of this organic polymer is difficult to specify because it varies depending on the individual organic polymer used in the ink-receiving layer, but generally alcohols (ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl) Ethers), ethers (tetrahydrofuran, ethylene glycol dimethyl ether, propylene glycol dimethyl ether, tetrahydropyran, etc.), ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetylacetone, cyclohexanone, etc.), esters (methyl acetate, ethyl acetate, isobutyl acetate) , Ethylene glycol monomethyl monoacetate, etc.), amides (formamide, N-methylformamide, pyrrolidone, N-methylpyrrolidone, etc.), cancer Butyrolactone, a methyl lactate, a solvent selected from among such ethyl lactate.
[0073]
The content of the solvent that dissolves the lipophilic polymer in the ink receiving layer is preferably 0.4 to 40% of the total solvent of the hydrophilic layer coating solution. More preferably, it is 0.4 to 20%.
[0074]
The dry coating amount of the hydrophilic layer of the present invention is preferably 0.2 to 0.8 g / m.2, More preferably 0.3 to 0.5 g / m2It is. Within this range, good water retention of the hydrophilic layer can be obtained without causing deterioration in on-press developability and sensitivity.
[0075]
The heat-sensitive lithographic printing plate precursor of the present invention prevents the generation of residue due to ablation, and prevents contamination of the hydrophilic layer due to lipophilic substances during storage and handling, as well as prevention of adhesion of fingerprint marks when handled with bare hands. A hydrophilic overcoat layer can be provided on the hydrophilic layer.
[0076]
The hydrophilic overcoat layer used in the present invention can be removed on a printing press and contains a water-soluble resin or a resin selected from water-swellable resins obtained by partially crosslinking a water-soluble resin.
[0077]
Such a water-soluble resin is selected from water-soluble natural polymers and synthetic polymers, and is used together with a crosslinking agent, and a coated and dried film has a film forming ability.
[0078]
Specific examples of suitable water-soluble resins include natural gums, gum arabic, water-soluble soybean polysaccharide, fiber derivatives (eg, carboxymethyl cellulose, carboxyethyl cellulose, methyl cellulose, etc.), modified products thereof, white dextrin Synthetic polymers such as pullulan, enzymatically decomposed etherified dextrin, polyvinyl alcohol (polyvinyl acetate having a hydrolysis rate of 65% or more), polyacrylic acid, alkali metal salt or amine salt thereof, polyacrylic acid copolymer , Its alkali metal salt or amine salt, polymethacrylic acid, its alkali metal salt or amine salt, vinyl alcohol / acrylic acid copolymer and its alkali metal salt or amine salt, polyacrylamide, its copolymer, polyhydroxyethyl acrylate , Polyvinylpi Lidon, copolymers thereof, polyvinyl methyl ether, vinyl methyl ether / maleic anhydride copolymer, poly-2-acrylamido-2-methyl-1-propanesulfonic acid, alkali metal salts or amine salts thereof, poly-2- Examples include acrylamido-2-methyl-1-propanesulfonic acid copolymer, alkali metal salt or amine salt thereof. Further, two or more kinds of these resins can be mixed and used depending on the purpose. However, the present invention is not limited to these examples.
[0079]
When at least one or more of the water-soluble resins are partially crosslinked to form an overcoat layer on the hydrophilic layer, the crosslinking is performed by a crosslinking reaction using a reactive functional group possessed by the water-soluble resin. The crosslinking reaction may be a covalent bond or an ionic bond.
[0080]
Crosslinking reduces the adhesiveness of the overcoat layer surface and improves handling, but if the crosslinking proceeds too much, the overcoat layer changes to oleophilic, making it difficult to remove the overcoat layer on the printing press. Appropriate partial cross-linking is preferred.
[0081]
The preferred degree of partial cross-linking is that when the printing plate precursor is immersed in water at 25 ° C., the hydrophilic overcoat layer does not elute for 30 seconds to 10 minutes, but elution is observed for 10 minutes or more. To the extent that
[0082]
Examples of the compound used for the crosslinking reaction include known polyfunctional compounds having crosslinking properties, such as polyepoxy compounds, polyisocyanate compounds, polyalkoxysilyl compounds, polyvalent metal salt compounds, polyamine compounds, aldehyde compounds, hydrazine, etc. In the crosslinking reaction, a known catalyst may be added to accelerate the reaction.
[0083]
Specific examples of known polyfunctional compounds having crosslinkability include the following compounds.
[0084]
Specific examples of polyepoxy compounds include glycerin polyglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, trimethylolpropane polyglycidyl ether, trimethylolpropane polyglycidyl ether, sorbitol polyglycidyl ether, bisphenols or their And polycondensates of hydrogenated products and epihalohydrins.
[0085]
Specific examples of the polyamine include ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, hexamethylenediamine, propylenediamine, polyethyleneimine, and polyamidoamine.
[0086]
Specific examples of the polyisocyanate compound include tolylene diisocyanate, diphenylmethane isocyanate, liquid diphenylmethane diisocyanate, polymethylene polyphenyl isocyanate, xylylene diisocyanate, naphthalene-1,5-diisocyanate, cyclohexanephenylene diisocyanate, isopropylbenzene-2,4-diisocyanate. And the like, aliphatic isocyanates such as hexamethylene diisocyanate and decamethylene diisocyanate, alicyclic diisocyanates such as cyclohexyl diisocyanate and isophorone diisocyanate, and polypropylene glycol / tolylene diisocyanate addition reactants.
[0087]
As the silane compound, methyltrimethoxysilane, methyltriethoxysilane, ethyltriethoxysilane, phenyltriethoxysilane, vinyltriethoxysilane, γ-aminopropyltriethoxysilane, N- (β-aminoethyl) -γ-amino Propyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, dimethyldimethoxysilane , Dimethyldiethoxysilane, diphenyldiethoxysilane, 3-chloropropylmethyldimethoxysilane, vinyltris (methylethylketoxime) silane, methyltris (methylethylketoxime) silane, Sulfonyl triacetoxy silane, and the like.
[0088]
Titanate compounds include tetraethylorthosilicate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltoreactor noyl titanate, isopropyl dimethacrylisostearoyl titanate, isopropylisostearoyl diacryl titanate, isopropyl (dioctyl phosphate) titanate), isopropyl tricumylphenyl Titanate, isopropyl tri (N-aminoethylaminoethyl) titanate, dicumylphenyloxyacetate titanate, diisostearoyl ethylene titanate, isopropyl triinstearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl tris (dioctyl phosphate) titanate, tetraisopropyl Screw Dioctyl phosphite) titanate, tetraoctyl bis (ditridisyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl phosphite titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, Bis (dioctyl pyrophosphate) oxyacetate titanate, etc.
[0089]
Examples of aldehyde compounds include formaldehyde, acetaldehyde, propyl aldehyde, butyraldehyde, glyoxal, glutaraldehyde, terephthalaldehyde, and the like.
[0090]
Examples of the polyvalent metal salt compound include water-soluble salts of metals such as zinc, calcium, magnesium, barium, strontium, cobalt, manganese and nickel.
[0091]
These crosslinking agents can be used alone or in admixture of two or more. Among these cross-linking agents, a particularly preferable cross-linking agent is a water-soluble cross-linking agent, but a water-insoluble cross-linking agent can be used by being dispersed in water with a dispersant.
[0092]
Particularly preferred combinations of water-soluble resins and crosslinking agents include carboxylic acid-containing water-soluble resins / polyvalent metal compounds, carboxylic acid-containing water-soluble resins / water-soluble epoxy resins, and hydroxyl group-containing resins / dialdehydes.
[0093]
A suitable addition amount of the crosslinking agent is 0.5 to 10% of the water-soluble resin. Within this range, good water resistance can be obtained without impairing the removability of the overcoat layer on the printing press.
[0094]
In addition, a nonionic surfactant can be mainly added to the overcoat layer in the case of aqueous solution coating for the purpose of ensuring the uniformity of coating. Specific examples of such nonionic surfactants include sorbitan tristearate, sorbitan monopalmitate, sorbitan trioleate, stearic acid monoglyceride, polyoxyethylene nonylphenyl ether, polyoxyethylene dodecyl ether and the like. .
[0095]
The proportion of the nonionic surfactant in the total solids of the overcoat layer is preferably 0.05 to 5%.
[0096]
The dry coating amount of the overcoat layer of the present invention is 0.1 to 4.0 g / m.2Is preferable, 0.1 to 1.0 g / m2Is more preferable, 0.10 to 0.25 g / m2Is particularly preferred. Within this range, it is possible to prevent generation of ablation residue, good dirt and scratches, and prevention of fingerprint mark adhesion without impairing the removability of the overcoat layer on the printing press.
[0097]
At least one of the ink receiving layer, the hydrophilic layer and the overcoat layer of the present invention contains a photothermal conversion agent having a function of converting light into heat in order to increase sensitivity. As a photothermal conversion agent, what is necessary is just a substance which absorbs infrared rays, especially near infrared rays (wavelength 700-2000 nm), and various well-known pigments, dyes or pigment | dyes, and metal fine particles can be used.
[0098]
For example, the pigments, dyes or dyes, and metal fine particles described in JP-A No. 2001-301350, Journal of the Japan Printing Society, 38-35-40 (2001) “New imaging materials, 2. Near-infrared absorbing dyes” and the like are suitable. Used for. As the pigment and the metal fine particles, those subjected to a known surface treatment can be used as necessary.
[0099]
More specifically, as dyes or pigments, U.S. Pat. Nos. 4,756,993 and 4,973,572, JP-A-10-268512, JP-A-11-235883, JP-B-5-13514, JP-A-5-19702, JP-A-2001-2001 Examples thereof include cyanine dyes, polymethine dyes, azomethine dyes, squarylium dyes, pyrylium and thiopyrylium salt dyes, dithiol metal complexes, and phthalocyanine dyes described in No. 347765. Particularly preferred are cyanine dyes, squarylium dyes, pyrylium salts, and phthalocyanine dyes.
[0100]
Examples of the pigment include insoluble azo pigments, azo lake pigments, condensed azo pigments, chelate azo pigments, phthalocyanine pigments, anthraquinone pigments, perylene and perinone pigments, thioindigo pigments, quinacridone pigments, dioxazine pigments, isoindolinone pigments, Kinophthalone pigments, dyed lake pigments, azine pigments, nitroso pigments, nitro pigments, natural pigments, fluorescent pigments, inorganic pigments, carbon black, and the like can be used. Among these, carbon black is particularly preferable.
[0101]
As the metal fine particles, fine particles of Ag, Au, Cu, Sb, Ge and Pb are preferable, and fine particles of Ag, Au and Cu are more preferable.
[0102]
The addition ratio of the photothermal conversion agent is preferably 1 to 50% of the solid content of the hydrophilic layer in the hydrophilic layer, preferably 2 to 50% of the solid content of the overcoat layer in the overcoat layer, and the ink receiving layer solid in the ink receiving layer. 20% or less is preferable. Within these ranges, good sensitivity can be obtained without impairing the film strength of each layer.
[0103]
The heat-sensitive lithographic printing plate precursor of the present invention is image-formed by heat. Specifically, direct image-like recording using a thermal recording head, scanning exposure using an infrared laser, high-illuminance flash exposure such as a xenon discharge lamp, infrared lamp exposure, and the like are used, but a semiconductor that emits infrared light having a wavelength of 700 to 1200 nm. Exposure by a solid high-power infrared laser such as a laser or a YAG laser is suitable.
[0104]
The image-exposed printing plate precursor of the present invention can be mounted on a printing machine without further processing. When printing is started using ink and fountain solution, the overcoat layer is removed by the fountain solution and the hydrophilic layer in the exposed area is also removed, and the ink is deposited on the ink receiving layer below it and printing starts. Is done.
[0105]
【Example】
EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these.
[0106]
Example 1
[Preparation of aluminum substrate]
A 400 mm mesh rolled sheet of JIS A1050 aluminum material containing 99.5% aluminum, 0.01% copper, 0.03% titanium, 0.3% iron and 0.1% silicon. After using a 20% aqueous suspension of Pamiston (manufactured by Kyoritsu Ceramics) and a rotating nylon brush (6,10-nylon), the surface was grained and washed thoroughly with water. This is immersed in a 15% aqueous sodium hydroxide solution (containing 4.5% aluminum), and the amount of aluminum dissolved is 8 g / m.2After etching to become, it was washed with running water. Further, neutralize with a 1% nitric acid aqueous solution, and then in a 0.7% nitric acid aqueous solution (containing 0.5% aluminum), a rectangular alternating voltage with an anode voltage of 10.5 V and a cathode voltage of 9.3 V ( Current ratio r = 0.90, current waveform described in Japanese Patent Publication No. 58-5796 Example) 240 C / dm2Electrolytic surface roughening treatment was performed with the amount of electricity at the time of anode. After washing with water, the aluminum dissolution amount is 0.9 g / m by dipping in a 10% aqueous sodium hydroxide solution at 35 ° C.2After etching to become, it was washed with water. Next, it was immersed in a 30% sulfuric acid aqueous solution at 50 ° C., desmutted, and washed with water.
[0107]
Further, a porous anodic oxide film forming treatment was performed using a direct current in a 9% sulfuric acid aqueous solution (containing 0.6% aluminum) at 53 ° C. That is, the electrolysis time was 33 seconds, and the amount of anodized film was 3.7 g / m by adjusting the current density.2It was. Subsequently, it was washed with water and dried to obtain an aluminum substrate. The centerline average roughness Ra of the obtained substrate was 0.53 μm.
[0108]
[Preparation of heat-sensitive lithographic printing plate precursor]
In a mixed solvent of 13.5 g of methyl ethyl ketone and 27.0 g of propylene glycol monomethyl ether, 0.3 g of a photothermal conversion agent (IR-1 below), 1.2 g of Epicoat 1009 (epoxy resin, manufactured by Japan Epoxy Resin), and Epicoat 1001 (epoxy) Resin, manufactured by Japan Epoxy Resin) 0.3g is dissolved, and the amount of coating solution is 12cm on the aluminum substrate.Three/ M2It was applied with a bar coater. Thereafter, it was dried by heating at 100 ° C for 1 minute, and the dry coating amount was 0.42 g / m2An ink receiving layer was obtained.
[0109]
Next, in a mixed solvent composed of 19.4 g of methanol and 0.1 g of methyl lactate, 3.0 g of methanol silica sol (a colloid composed of a methanol solution containing 30% silica particles of 10 to 20 nm, manufactured by Nissan Chemical Industries) was added. Subsequently, 0.1 g of polyacrylic acid (weight average molecular weight 250,000, manufactured by Wako Pure Chemical Industries, Ltd.) was dissolved, and then the coating liquid amount was 12 cm on the ink receiving layer.Three/ M2It was applied with a bar coater. Thereafter, it was dried by heating at 100 ° C. for 1 minute, and the dry coating amount was 0.40 g / m.2A hydrophilic layer was obtained.
[0110]
On the hydrophilic layer, 1.5 g of 28% aqueous solution of arabic gum, 0.042 g of photothermal conversion agent (IR-2 below), and 0.168 g of 10% aqueous solution of Emarex # 710 (surfactant, manufactured by Nippon Emulsion) An aqueous solution composed of 0.03 g of 10% aqueous solution of magnesium acetate tetrahydrate (manufactured by Wako Pure Chemical Industries, Ltd.) and 30.06 g of water was applied in an amount of 12 cm.Three/ M2After coating with a bar coater, heat-dry at 100 ° C. for 1.5 minutes, and dry coating amount of 0.15 g / m2An overcoat layer was provided to prepare a thermosensitive lithographic printing plate precursor.
[0111]
[Chemical 1]
[0112]
[Exposure and printing evaluation]
The above lithographic printing plate precursor is attached to a trend setter 3244VX manufactured by CreoScitex, 240 mJ / cm2A latent image was formed by irradiating the energy. In the plate surface observation after the exposure, there was almost no evidence of residue scattering due to ablation.
[0113]
Next, the original plate on which the latent image was formed was attached to a SOR-M printing machine manufactured by Heidelberg, and dampening water and GEOS-G (N) black ink (Dainippon Ink Chemical Co., Ltd.) consisting of a 4% by volume IF102 (Fuji Photo Film) aqueous solution. As a result, the overcoat layer and the hydrophilic layer in the exposed area were removed after printing about 20 sheets. The printing was continued to obtain 20,000 copies of a good printed material without smudges.
[0114]
Comparative Example 1
Adjust the current density of the anodic oxide film formation treatment to adjust the anodic oxide film amount to 2.0 g / m2A heat-sensitive lithographic printing plate precursor was prepared in the same manner as in Example 1 except that the aluminum substrate was used. When the exposure / printing evaluation was carried out in the same manner as in Example 1, the ink did not deposit on the image area even after 1000 sheets were printed. As a result of observing the image portion of the printing plate with a scanning electron microscope, it was found that the hydrophilic layer partially remained and the ink receiving layer was not sufficiently exposed. An exposure energy of 270 mJ / m is required to obtain a good printed product with about 20 printed images.2It was necessary to raise it.
[0115]
Comparative Example 2
The amount of anodized film is adjusted to 6.0 g / m by adjusting the current density of the anodized film forming process.2In the same manner as in Example 1 except that the aluminum substrate was used, a heat-sensitive lithographic printing plate precursor was prepared and subjected to exposure / printing evaluation. As a result, ink remained on the image area even after 1000 sheets were printed. I didn't meat. As a result of observing the image portion of the printing plate with a scanning electron microscope, it was found that the hydrophilic layer partially remained and the ink receiving layer was not sufficiently exposed. An exposure energy of 270 mJ / m is required to obtain a good printed product with about 20 printed images.2It was necessary to raise it.
[0116]
From the above results, it can be seen that the heat-sensitive lithographic printing plate precursor of the present invention has high sensitivity, prevents scattering of debris due to ablation, has good stain resistance in printing, and has high printing durability.
[0117]
【The invention's effect】
According to the present invention, plate making by scanning exposure based on a digital signal is possible, and after exposure, it can be directly mounted on a printing machine without processing and printing can be performed. It is possible to provide a heat-sensitive lithographic printing plate precursor that prevents contamination of the light source, has high sensitivity, is excellent in stain resistance, and has high printing durability.
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