JP4097187B2 - Connector and its mounting structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a connector which is an electric circuit component and a mounting structure thereof. More specifically, the present invention relates to a connector having a contact pin mounted on a circuit board and the like and connected to another circuit component by a spring force by a spring force and a mounting structure.
[0002]
[Prior art]
FIG. 8 shows the structure and mounting mode of a conventional connector. (A) is sectional drawing which shows the structure of the principal part (it is also called a probe pin) of a connector, 1a is a bottomed cylindrical metal case, 2 is a pin used as a contact, and a right end is a slightly large diameter collar part. 2a. In the metal case 1a, the pin 2 can slide, but the opening is narrowed to prevent the collar 2a from coming off. Reference numeral 3 denotes a spring member, which is normally a coil spring, and has a role of pressing the pin 2 outward and pressing the tip of the pin 2 with an appropriate force against another circuit board pattern or an electrode of an electronic component.
[0003]
FIGS. 8B and 8C are side views showing a conventional completed connector and its mounting structure, respectively. The completed connector 1 is assembled by connecting the electrode plate 9a to the metal case 1a by welding or the like and further insert-molding or press-fitting the probe pin of FIG. 8 (a) into the block-shaped resin molded body 9. is there. The connector 1 is placed on the circuit board 7 in an appropriate direction together with other electronic components (not shown), and a conductive pattern (not shown) on the surface and the electrode plate 9a are connected and fixed by solder 8 or the like. The
[0004]
[Problems to be solved by the invention]
The conventional connector of FIG. 8 has several problems. First, the probe pins must be manufactured and assembled one by one. Further, if the mounting form is different as shown in FIGS. 8B and 8C, the mold of the resin molded body must be changed. Also, the probe pin must be insert-molded or press-fitted into the resin molding. Also, connection to the electrode plate must be made. All of these are factors in increasing the manufacturing man-hour and cost of the finished connector. This is the first problem to be solved.
[0005]
Therefore, the applicant and the inventor of the present invention have made the invention described in Japanese Patent Application No. 2002-064568 in order to solve the first problem. The main points of the embodiment are shown in FIGS. Although the invention of this application corresponds to the most recent prior art of the present invention, it is not always known, so it will be referred to as a reference example avoiding the name of the prior art.
[0006]
FIG. 6 shows an example of a completed single connector as an embodiment of a reference example, (a) is a central sectional view, (b) is a front view which is a pin side surface, and (c) is a back view. is there. The same symbols are assigned to elements common to the conventional example.
[0007]
In FIG. 6, the case of the completed connector 1 is obtained by laminating and fixing the board A4, the board B5, and the board C6. The pin hole 4b of the board A4 exposes only the tip of the pin 2, and the pin 2 The coil spring that is the spring member 3 for pressing the portion 2a and the pin 2 toward the substrate A4 is accommodated in the flange portion 5b having a slightly larger diameter so that the pin 2 can slide. The substrate C6 encloses these, and each substrate forms a connector housing. A part of the spring member 3 is inserted into the deep hole 2b provided in the pin 2 to shorten the overall length of the connector 1. The substrate A4 has a main role of preventing pin removal, and the substrate C6 has a main role of enclosing the pin mechanism, so the thickness is relatively thin, and the substrate B5 is relatively thick because it houses the pin mechanism.
[0008]
As shown in the front view (b) and back view (c) of FIG. 6, through holes 4a appear at the four corners of the substrate A4, and part of the through holes 6a (about one quarter) appear at the four corners of the substrate C6. Yes. All or part of the conductive film formed on the inner surface of each through hole is electrically connected by contact with the spring member 3 and the pin 2 via the conductive pattern on the surface of each substrate. Further, a back pattern 6c is provided on the back surface of the substrate C6 and is connected to the conductive film of the through hole 6a.
[0009]
The connector 1 of the reference example is manufactured at the same time by a so-called multi-cavity manufacturing method and finally separated. That is, the substrate A4, the substrate B5, and the substrate C6 are each an assembled substrate in which the final shape is arranged in a plane in the vertical and horizontal directions and the conductive film is formed in the initial stage of manufacture (details are given in Japanese Patent Application No. 2002-64568). The pin 2 and then the spring member 3 are first inserted into each of a large number of holes in the collective substrate A, and then the collective substrate B and the collective substrate C are sequentially laminated and bonded to the collective substrate A. The assembled connector is formed, and this is cut off by a cutting plane perpendicular to the vertical and horizontal board surfaces passing through the middle of each pin. The through hole is provided at a portion where the cut surfaces intersect to expose the inner surface electrode. The connector of the reference example has an effect that the manufacturing cost per one can be significantly reduced by the multi-piece manufacturing / assembling method as compared with the conventional example.
[0010]
FIGS. 7A, 7B, and 7C are front views showing a state where an example of the connector of the reference example is solder-mounted on a circuit board. (A) erects the connector 1 separated into a single unit, and solders the inner surface conductive film (which serves as a side electrode for ensuring solder wetting) of the through hole of the substrate C6 with the solder 8. (B) is an example in which the cut surface of the collective connector is thinned and mounted as a double connector, and (c) is an example in which the connector 1 is mounted side by side.
[0011]
[Problems to be solved by the invention]
The conventional example has a second problem. In FIG. 8A, the length of the connector 1 is larger than the total length of the pin 2 including the flange 2a plus the length of the spring member, and the circuit board as shown in (b) and (c). In the case of mounting upright on the board 7, the height H from the board surface becomes considerably large. If the total height H is greater than the height of the other electronic components mounted on the circuit board 7, these other electronic components are wasted between the other circuit boards having patterns and parts that the pins 2 come into contact with. Space is easily generated, and electronic devices are hampered in size and thickness.
[0012]
Further, in the reference example, the height H shown in FIG. 7A has an effect that a part of the spring member 3 can be inserted into the deep hole 2b of the pin 2 and the total height can be reduced. Since the electrode plate 9a is also unnecessary, it is easy to make it lower than the height H in the conventional example, but it is still not possible to make it lower than the total height of the connector, so there is still room for improvement.
[0013]
An object of the present invention is to provide a mounting structure and a mounting structure therefor in order to further reduce the overall height of the connector mounted on the circuit board while maintaining the manufacturing cost reduction effect due to the multi-cavity as in the reference example. It is to provide an applicable connector structure.
[0014]
[Means for Solving the Problems]
In order to achieve the above object, the connector of the present invention has the following features.
(1) a conductor pin flange urged in a projecting direction by a spring and a cylindrical housing that houses the spring and with a projecting portion that projects in two directions opposite to the cylindrical shape , The surface of the housing has a conductor film that connects the conductor pins and the surface of the overhang portion, and the housing is obtained by cutting and separating two assembled substrates joined together . The overhanging portion is formed on one side of the collective substrate by the cutting, and the conductor film reaches the inner surface of a through hole provided in the overhanging portion .
[0015]
In order to achieve the above object, the connector of the present invention may further include at least one of the following features.
(2) In the connector according to (1), the projecting portion is a lower end portion of the tubular portion farthest from the conductor pin, an upper end portion closest to the conductor pin, or an intermediate portion between the upper end portion and the lower end portion. Being formed in either.
(3) In the connector according to (1) or (2), the casing is formed as a connector that is connected by being not cut at the middle of the adjacent cylinders.
(4) In the connector according to (3), the casing is formed as a connected connector by leaving a protruding portion in the middle of the adjacent cylindrical shapes.
[0016]
In order to achieve the above object, the connector mounting structure of the present invention has the following characteristics.
(5) Using the connector according to any one of (1) to (4), the surface of the housing has a conductor film that connects the conductor pin and the surface of the housing, The circuit board on which the connector is mounted penetrates, and the conductor film provided on a part of the surface of the overhanging part of the housing or a part of the surface of the housing is connected and fixed to the pattern of the circuit board.
[0017]
FIG. 1 shows an example of an embodiment of a connector according to the present invention, where (a) is a plan view, (b) is a side view, (c) is a front view, and (d) is a cross-sectional view. In the following, the symbols given to the respective parts of the drawings of the present invention are the same as those in the conventional example and the reference example.
In the completed connector 1, the board A4 made of an insulating material and the board B5 made of a molded resin material laminated and adhered to the board A5 are formed in the inner flange 5b (bottomed) of the pin 2 A housing for housing the flange 2a and the spring member 3 is formed. Although the substrate B5 has an upright portion 5a and an overhang portion 5c and has a shape with irregularities instead of a simple flat plate shape, the name of the substrate is given because there are various modifications.
[0018]
The spring member 3 is inserted into the deep hole 2b of the pin 2 while being slightly compressed, and biases the pin 2 in the distal direction (upward direction). Through holes provided on the inner surface of the pin hole 4b of the substrate A, the inner surface and bottom inner surface of the flange hole 5b of the substrate B5, the upper surface of the upright portion 5a, the left and right sides, the upper surface of the overhang portion 5c, and the left and right ends of the overhang portion 5c. A conductive film 5e is formed on the inner side surface of the hole 5d (cut into a semicircle) by electroless plating (shown as a dot in the outline). These conductive films are connected continuously or electrically, and since there is a portion that contacts the pin 2 and the metal spring member 3, an electric signal applied to the tip of the pin 2 is transmitted to the outside of the connector housing. I tell you. In addition, the circuit board 7 shown with the dashed-two dotted line has shown the positional relationship with the connector after mounting.
[0019]
2A, 2B, and 2C are partial cross-sectional views showing three examples of the embodiment of the connector mounting according to the present invention. (A) is a basic form using a single connector. A rectangular hole 7a is provided in the circuit board 7 so that the upright portion 5a of the connector 1 can penetrate, and the connector 1 is inserted from the back surface of the circuit board 7 (shown in cross section). Then, the protruding portion 5 c is brought into contact with the lower surface of the substrate, and the conductive film on the inner surface of the through hole 5 d and the circuit pattern (not shown) on the back surface of the circuit substrate 7 are connected by the solder 8. (In actuality, the circuit board 7 is faced downward, the connector 1 faced downward is inserted into the rectangular hole 7a, and soldering is performed using a reflow furnace.)
[0020]
With this mounting structure, the height H from the board surface to the top of the pin 2 is much smaller than the total height H of the reference example because the thickness of the circuit board 7 and the thickness of the overhang portion 5c are reduced from the total length of the connector 1. can do. (B) and (c) are mounted as a double connector by thinning the cut surface when the connector assembled in the assembled state is cut and separated. In (b), the cut surfaces 10a and 11a (FIGS. 3 and 4) in the middle of the upright portion are thinned out, and in (c), the cut surface 11b (through the center of the through hole 5d) in the middle of the overhang portion is thinned out. Connected. The fact that the total height is low is the same as (a).
[0021]
Next, a manufacturing method of an example of the embodiment of the connector of the present invention will be described with reference to FIGS. FIG. 3 shows a collective substrate A40 in an example of an embodiment of the connector of the present invention, FIG. 4 shows a collective substrate B50, both of which are (a) a plan view, (b) a sectional view, and FIG. 4 (c). Is a front view. As shown in both figures (a), the collective substrate A40 and the collective substrate B50 accommodate the pin 2 and the spring member 3 between them, align the pin hole 4b and the flange hole 5b, and heat-resistant adhesion After the two substrates are bonded or bonded together by a sheet or the like, the collective substrates A40 and B50 are cut using a dicer or a slicing machine along the cut surfaces 10a, 10b, 11a, and 11b (all perpendicular to the paper surface). The collective connector is separated into a number of single connectors.
[0022]
The cut surface 11b divides the through hole 5c to expose the inner conductive film as a side electrode of the connector. Further, as described, the cut surface is appropriately thinned out from the illustrated example to obtain a large number of connectors each having an arbitrary number of connectors. FIG. 5 is a schematic explanatory diagram of an assembling process before cutting the collective substrate in an example of the embodiment of the connector of the present invention. First, the aggregate substrate A40 is placed downward, and the pins 2 are inserted into each of the numerous pin holes 4b as indicated by arrows 70, then the spring member 3 is inserted, and the aggregate substrate B50 facing downward is stacked and bonded. (Join).
[0023]
Then cut. 3 and 4, the cut surfaces 10a and 11a of the cut surfaces 10a and 10b of the collective substrate A40 and the cut surfaces 11a and 11b of the collective substrate B50 coincide with each other. Although the cut surfaces 10b and 11b do not coincide with each other, the respective cutting directions and depths are changed, or unnecessary portions 40a of the collective substrate A40 are first removed (the cut surfaces after joining with the collective substrate 50). 10b is removed by cutting, or unnecessary parts are removed by punching rectangular holes leaving the used part and its peripheral frame part before joining, or a strip-shaped aggregate board A without unnecessary parts 40a in advance is removed. The aggregate substrate B50 is cut from the upper surface of the upright portion of the aggregate substrate B (a method such as bonding one row at a time) is cut (the cut surface 11). ) Will be.
[0024]
As mentioned above, each example of the embodiment of the connector and the connector mounting structure of the present invention has been described. However, the embodiment of the present invention is not limited to the above example. For example, instead of molding the substrate B5 integrally with the overhanging portion, the substrate having only the through hole for accommodating the pin flange and the spring member, and the bottom plate integrated with the overhanging portion (in the reference example of FIG. 6A) The substrate C6 may be formed in a deformed shape). Further, the connection between the pattern on the circuit board and the connector is not necessarily performed only by the protruding portion, and may be performed by using the pattern on the side surface of the housing.
[0025]
Further, although not shown in the drawings, the position where the projecting portion is provided is not limited to the lowermost end (the farthest position from the pin) of the housing, and may be a connector provided at the center or the uppermost end of the housing, for example. . (In the case of being provided at the uppermost end, the substrate A4 and the overhanging portion are integrated in the described embodiment.) Further, in these cases, mounting from the back surface of the circuit board is possible as in the described embodiment. However, by placing the overhang on the surface (pin side) of the circuit board and connecting it to the pattern on the surface of the circuit board, the total height H can be increased by sinking or penetrating the lower part of the housing into the hole provided in the circuit board. A small mounting structure is also possible.
[0026]
【The invention's effect】
In the present invention, a mounting structure in which a connector is passed through a hole provided in a circuit board while restricting the position of the housing by an overhang portion and a connector having a multi-cavity shape structure suitable for the mounting structure are provided. The manufacturing cost can be reduced and the overall height of the connector at the time of mounting can be reduced. As a result, the electronic device to which the present invention is applied is extremely effective in reducing the size, thickness and cost.
[Brief description of the drawings]
FIG. 1 shows an example of an embodiment of a connector according to the present invention, in which (a) is a plan view, (b) is a side view, (c) is a front view, and (d) is a cross-sectional view.
FIGS. 2A, 2B, and 2C are partial cross-sectional views showing three examples of embodiments of the connector mounting according to the present invention, respectively.
FIGS. 3A and 3B show a collective substrate A in an example of an embodiment of the connector of the present invention, where FIG. 3A is a plan view and FIG. 3B is a cross-sectional view.
4A and 4B show a collective substrate B in an example of an embodiment of the connector of the present invention, in which FIG. 4A is a plan view, FIG. 4B is a cross-sectional view, and FIG.
FIG. 5 is an explanatory diagram of an assembly process of an example of an embodiment of the connector of the present invention.
FIG. 6 shows a reference example of a connector on which the present invention is based, in which (a) is a sectional view, (b) is a front view, and (c) is a back view.
FIGS. 7A and 7B are front views showing three examples of a form of implementation of a reference example. FIGS.
8A and 8B show a conventional connector, in which FIG. 8A is a sectional view thereof, and FIGS. 8B and 8C are partial sectional views showing two examples of the mounting form.
[Explanation of symbols]
1 connector 1a metal case 2 pin 2a flange 2b deep hole 3 spring member 4 substrate A
4a Through hole 4b Pin hole 5 Substrate B
5a Upright portion 5b Gutter hole 5c Overhang portion 5d Through hole 5e Conductive film 6 Substrate C
6a Through hole 7 Circuit board 7a Rectangular hole 8 Solder 9 Resin molded body 9a Electrode plates 10a, 10b, 11a, 11b Cut surface 40 Assembly board A
40a Unnecessary part 50 Collective board B
70 Arrow H Height

Claims (5)

A conductor pin flange urged in a projecting direction by a spring and a cylindrical housing that houses the spring and with a projecting portion that projects in two directions opposite to the cylindrical shape ; with the surface having a conductive film which connects the conductor pin and the surface of the projecting portion, the housing has been obtained by cutting and separating the two sets substrate bonded together after bonding, the overhanging The connector is formed on one side of the collective substrate by the cutting, and the conductor film reaches an inner surface of a through hole provided in the projecting portion . 2. The connector according to claim 1, wherein the projecting portion is one of a lower end portion farthest from the conductor pin of the cylindrical portion, an upper end portion closest to the conductor pin, or an intermediate portion between the upper end portion and the lower end portion. A connector characterized by being formed into. 3. The connector according to claim 1 or 2, wherein the casing is formed by not being cut between adjacent cylindrical shapes. The connector according to claim 3, wherein the casing has a protruding portion left in the middle of the adjacent cylindrical shapes. 5. The connector according to claim 1, wherein a surface of the casing has a conductor film connecting the conductor pin and the surface of the casing, and the casing mounts the connector. A connector penetrating the board and connecting and fixing a conductor film provided on a part of the surface of the overhanging part of the casing or a part of the surface of the casing and the pattern of the circuit board Mounting structure.

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