JP4144347B2 - Multilayer board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer substrate in which a plurality of resin films made of a thermoplastic resin are laminated, and particularly to a multilayer substrate on which a heating element is arranged.
[0002]
[Prior art]
FIG. 4 shows the arrangement of the heating elements on the conventional substrate. In FIG. 4, reference numeral 1 denotes a conventional substrate, reference numeral 2 denotes a heating element, reference numeral 3 denotes a heat sink, and reference numeral 4 denotes a housing.
[0003]
In the conventional substrate 1 shown in FIG. 4, the heating element 2 attached to one surface of the heat sink 3 is attached to the end portion of the substrate 1 together with the heat sink 3, and the other surface of the heat sink 3 is connected to the housing 4. Has been. Thereby, the heat generated in the heat generating element 2 is radiated to the housing 4 via the heat sink 3.
[0004]
On the other hand, a manufacturing method of a multilayer substrate manufactured by laminating a resin film made of a thermoplastic resin is disclosed in JP 2000-38464 A (Patent Document 1). According to the method for manufacturing a multilayer substrate disclosed in Patent Document 1, a resin film made of a thermoplastic resin on which a conductor pattern is formed is prepared, a plurality of resin films are laminated, and then heated at a predetermined temperature and pressure. While applying pressure. Thereby, adjacent resin films are fused and integrated to manufacture a multilayer substrate. Using this manufacturing method, the rigid multilayer substrate 110 shown in the schematic cross-sectional view of FIG. 5 can be manufactured. The multilayer substrate 110 of FIG. 5 is obtained by laminating and laminating the thermally conductive metal substrate 30 together with the resin film 1p, and a patent application has already been filed for this invention (application number 2001-239641).
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-38464 [0006]
[Problems to be solved by the invention]
As shown in FIG. 4, when a heating element is arranged on a conventional substrate, the heating element 2 is attached to the end of the substrate 1 together with the heat sink 3 in order to effectively dissipate the heat generated by the heating element 2. Therefore, for example, a power supply circuit using a heat generating element must be arranged at the end of the substrate 1, and a wiring pattern is formed to supply power to elements arranged in other parts. However, since the power supply circuit is disposed at the end portion of the substrate 1, in such a circuit design, the wiring is inevitably long, the loss due to the wiring pattern increases, and the power supply efficiency cannot be sufficiently exhibited. There is. Further, when the wiring becomes long, it is easily affected by external noise. As described above, when the heating element 2 is arranged on the conventional substrate 1, there is a limitation in circuit design, and there is a problem due to a long wiring.
[0007]
On the other hand, in the multilayer substrate 110 of FIG. 5, the heat conductive metal substrate 30 is bonded to the entire surface of the resin film 1 p, and the heat conductive metal substrate 30 is not disposed even if the heating element 2 is disposed in the center of the multilayer substrate 110. The heat generated in the heat generating element 2 can be radiated through. However, in the multilayer substrate 110 of FIG. 5, if other elements are arranged around the heat generating element 2, heat generated in the heat generating element 2 is transmitted to the other elements through the heat conductive metal substrate 30, which is not preferable. .
[0008]
Accordingly, an object of the present invention is a multilayer substrate on which heating elements are arranged, and restrictions on the arrangement of the heating elements are reduced, so that the degree of freedom in circuit design is high, and the thermal influence on the surrounding elements of the heating elements is suppressed. It is to provide a multi-layer board has.
[0009]
[Means for Solving the Problems]
The invention described in claim 1 is a multilayer substrate in which a plurality of resin films made of a thermoplastic resin are laminated, and a part of a resin base material in which the plurality of resin films are bonded to each other. A metal plate is inserted, a part of the metal plate protrudes from the resin base material in a direction parallel to the laminated surface, and a heating element is disposed on the surface of the resin base material of the portion where the metal plate is inserted, The protrusion part protruded in the direction parallel to the lamination surface of a metal plate is connected with a housing | casing by the fixing tool, It is characterized by the above-mentioned.
[0010]
According to this, a metal plate is inserted into a part of the resin base material, and the heating element is arranged on the surface of the resin base material where the metal plate is inserted. For this reason, the heat generated by the heating element is transmitted to the metal plate inserted in the resin base material, and is effective to the housing through a part of the metal plate protruding in a direction parallel to the laminated surface from the resin base material. Heat can be released. In addition, since the metal plate is inserted only in a part of the resin base material, by arranging another element on the surface of the resin base material where the metal plate is not inserted, it is Thermal effects can be suppressed.
[0011]
As described above, the multilayer substrate of the present invention inserts a metal plate into a part of the resin base material to enable local heat dissipation. The metal plate can be inserted at an arbitrary position of the resin base material, and there is no particular restriction on the arrangement of the heat generating elements. Therefore, the multilayer substrate of the present invention has a high degree of freedom in circuit design.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a multilayer substrate and a manufacturing method thereof according to the present invention will be described with reference to the drawings.
[0016]
FIG. 1 is a perspective view of a multilayer substrate 100 of the present invention. In the multilayer substrate 100, reference numeral 1p is a resin base material in which a plurality of resin films made of a thermoplastic resin are bonded to each other. In the multilayer substrate 100 of FIG. 1, a metal plate 30p is inserted into a part of the resin base material 1p. Further, the heating element 2 is arranged on the surface of the resin base material 1p at the insertion portion of the metal plate 30p. In the multilayer substrate 100 of FIG. 1, a part of the metal plate 30p protrudes from the resin base material 1p and is exposed from the resin base material 1p. In practice, in the multilayer substrate 100 of FIG. 1, a conductor pattern for wiring is formed on the surface and inside of the resin base material 1p, but the illustration is omitted for simplicity.
[0017]
In the multilayer substrate 100 of FIG. 1, the heat generated in the heating element 2 is transmitted to the metal plate 30p inserted into a part of the resin base material 1p, and passes through the protruding portion of the metal plate 30p from the resin base material 1p. Heat is dissipated in the space. Thus, when the heat generated in the heating element 2 is radiated into the space, it is preferable that the area of the protruding portion of the metal plate 30p is large.
[0018]
In the multilayer substrate 100 of FIG. 1, the metal plate 30p is inserted only in a part of the resin base material 1p. For this reason, as shown in FIG. 1, the other element 6 is arrange | positioned on the resin base material 1p surface of the part in which the metal plate 30p is not inserted, and the thermal influence on the element 6 from the heat generating element 2 is suppressed. Can do.
[0019]
The multilayer substrate 100 of FIG. 1 allows the local heat dissipation by inserting the metal plate 30p into a part of the resin base material 1p as described above. The metal plate 30p can be inserted into an arbitrary position of the resin base material 1p. Therefore, there is no particular restriction on the arrangement of the heating elements 2, and the multilayer substrate 100 of FIG. 1 has a high degree of freedom in circuit design.
[0020]
FIG. 2 shows another heat dissipation method using the multilayer substrate of the present invention. FIG. 2 is a cross-sectional view of the multilayer substrate 101 and the housing 4. In the multilayer substrate 101 of FIG. 2, the tip of the metal plate 30p protruding from the resin base material 1p is connected to the housing 4 by a fixture 4f. Therefore, in the multilayer substrate 100 of FIG. 2, the heat generated in the heat generating element 2 is transmitted from the metal plate 30p to the housing 4 by heat conduction, and the heat is radiated from the housing 4 into the space. Therefore, in the case of the multilayer substrate 100 of FIG. 2, the housing 4 serves as a heat radiating plate, so that the heat generated by the heating element 2 can be radiated more effectively.
[0021]
3 (a) to 3 (c) are cross-sectional views for each process showing the method for manufacturing the multilayer substrate 102 of the present invention.
[0022]
First, as shown in FIG. 3A, conductor pattern films 10, 11, 12, and 13 are prepared in which a predetermined conductor pattern made of a metal foil is formed on a resin film 1p made of a thermoplastic resin.
[0023]
The resin film 1p is a resin base material of the multilayer substrate 102. As a thermoplastic resin of the material, for example, liquid crystal polymer (LCP), polyether ether ketone, polyether ether ketone / polyetherimide mixture, polyphenylene sulfide, heat A plastic polyimide resin or the like is used.
[0024]
The conductor pattern 1a is a metal foil pattern formed by etching a metal foil. As a material for the metal foil, for example, gold (Au), silver (Ag), copper (Cu), aluminum (Al) or the like having good conductivity is used. The bonding of the resin film 1p and the metal foil is performed by laminating and heating and pressing.
[0025]
In the conductor pattern films 10, 11, 12, and 13 shown in FIG. 3A, holes having the conductor pattern 1a as a bottom surface are formed, and a metal paste that is the conductor pattern 1b is filled in the holes. The metal paste 1b is a paste obtained by adding a binder resin or an organic solvent to copper (Cu) and tin (Sn) metal particles and kneading them. The metal paste 1b may be a paste containing metal particles of gold (Au) and tin (Sn), or silver (Ag) and tin (Sn).
[0026]
In FIG. 3A, a metal plate 30p processed to a predetermined size and shape is prepared. As a material of the metal plate 30p, for example, copper (Cu), aluminum (Al), or the like with good thermal conductivity is used.
[0027]
The conductor pattern films 10, 11, 12, 13 and the metal plate 30p prepared as described above are laminated in a predetermined arrangement as shown in FIG. In addition, in order to reduce the surface unevenness of the multilayer substrate after manufacture, a spacer made of the resin film 1p filled with only the resin film 1p or the metal paste 1b for connecting the upper and lower conductive patterns 1a is used as the metal plate 30p. You may arrange in the same layer.
[0028]
Next, as shown in FIG. 3 (b), the conductive pattern films 10, 11, 12, 13 and the metal plate 30p laminated as shown in FIG. 3 (a) are attached to the adhesion preventing film 51, the buffer material 52, and the metal. The heater 55 is inserted through a plate 53 between a pair of hot press plates 54 embedded therein, and heated and pressurized.
[0029]
The adhesion preventing film 51 prevents the resin film 1p during heating / pressurization from adhering to the surrounding members or scratching the resin film 1p and the conductor pattern 1a. For example, a polyimide film or the like is used. It is done. The buffer material 52 is for applying a uniform pressure to the laminate. For example, a material obtained by cutting a metal such as stainless steel into a fiber shape and molding the fiber metal into a plate shape having a thickness of about 1 mm is used. The metal plate 53 is for preventing the hot press plate 54 from being damaged. For example, a plate made of stainless steel (SUS) or titanium (Ti) with a thickness of about 2 mm is used.
[0030]
After arranging the laminate and each of the press members, the heater 55 is first heated, and the whole is heated at 200 ° C. for 5 minutes without applying pressure. Next, a pressure of 20 kg / cm ² is applied to the laminate through a hot press plate 54 by a press machine (not shown). Next, the whole temperature is set to 250 to 350 ° C., and heated and pressurized for 10 to 30 minutes. Heating and pressurization may be performed in the air, but preferably performed in a vacuum in order to suppress oxidation of the conductor pattern 1a.
[0031]
With the above heating and pressurization, the conductor pattern films 10, 11, 12, 13 and the metal plate 30p are bonded and bonded together, and the metal paste 1b is sintered.
[0032]
As a result, the multilayer substrate 102 shown in FIG. 3C in which the metal plate 30p is inserted into a part of the resin base material 1p formed by bonding the conductor pattern films 10, 11, 12, and 13 is manufactured. Next, in the multilayer substrate 102 manufactured as described above, the heating element 2 is mounted on the surface of the resin base material 1p where the metal plate 30p is inserted.
[0033]
In the above manufacturing method, the metal plate 30p was laminated together with the conductor pattern films 10, 11, 12, and 13 from the beginning to manufacture the multilayer substrate 102. Not limited to this, a thermoplastic resin and a non-adhesive sheet are inserted into the insertion position of the metal plate 30p, heated and pressurized, and after the non-adhesive sheet is peeled off, the metal plate 30p is inserted to form a multilayer substrate. It may be manufactured.
[0034]
The above manufacturing method uses the same process as the conventional multilayer substrate manufacturing method described in FIG. 5 to manufacture a multilayer substrate in which a metal plate is inserted into a part of a resin base material made of a thermoplastic resin. It is. Accordingly, the multilayer substrate can be manufactured at low cost without adding a new process.
[0035]
(Other embodiments)
In the above-described embodiment, a part of the metal plate 30p protrudes from the resin base material 1p of the multilayer substrates 100 and 101 of FIGS. 1 and 2, and the heat generated in the heating element 2 is radiated through the protruding portion. An example is shown. The present invention is not limited to this, and the metal plate 30p inserted into the resin base material 1p does not protrude from the resin base material 1p, so that an opening is formed in the resin base material 1p and a part of the metal plate 30p is exposed. It may be. Also in this case, the heat generated in the heating element 2 can be radiated from a part of the exposed metal plate 30p. Such a multilayer substrate can be manufactured, for example, by forming openings at predetermined positions of the conductor pattern films 12 and 13 below the metal plate 30p in FIG.
[Brief description of the drawings]
FIG. 1 is a perspective view of a multilayer substrate of the present invention.
FIG. 2 is a cross-sectional view of a multilayer substrate and a housing, and is a diagram showing another heat dissipation method using the multilayer substrate of the present invention.
FIGS. 3A to 3C are cross-sectional views showing a process for producing a multilayer substrate according to the present invention. FIGS.
FIG. 4 is a view showing a state of arrangement of heating elements on a conventional substrate.
FIG. 5 is a schematic cross-sectional view of a rigid multilayer substrate.
[Explanation of symbols]
100, 101, 102, 110 Multilayer substrate 1p Resin base material (resin film)
1a Conductor pattern (metal foil pattern)
1b Conductor pattern (metal paste)
2 Heating element 30p Metal plate 4 Housing 4f Fixing tool 6 Other elements

Claims (1)

A multilayer substrate in which a plurality of resin films made of a thermoplastic resin are laminated,
A metal plate is inserted into a part of the resin base material in which the plurality of resin films are bonded to each other, and a part of the metal plate protrudes from the resin base material in a direction parallel to the laminated surface. The heating element is arranged on the surface of the resin base material where the is inserted,
A multi-layer substrate, wherein a protruding portion protruding in a direction parallel to the laminated surface of the metal plates is connected to a housing by a fixture.

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