JP4121509B2 - Communication device and method for manufacturing communication device - Google Patents

Description

  The present invention relates to a communication device in which a heat radiating portion of a communication amplifier module that generates heat is attached to an inner wall of a casing as a heat dissipation measure, and particularly relates to simplification of assembly.

One of the communication devices to which the above-described heat dissipation measures are taken is a PHS (Personal Handyphone System) base station device.
Patent Document 1 below discloses an example of the internal structure of a PHS base station apparatus.
Currently, PHS base station apparatuses are mainly provided with an adaptive array antenna including a plurality of antennas, and a plurality of communication amplifier modules corresponding to the respective antennas are housed in the casings.

FIG. 14 is a cross-sectional view showing the internal structure of a conventional base station apparatus in which a plurality of communication amplifier modules are housed.
The casing of the base station apparatus 100 is a combination of the casing main body 102 and the lid 103.
Since the base station apparatus 100 is mainly installed in places exposed to wind and rain at high places such as utility poles, the casing is designed to be as compact and lightweight as possible, and to be rustproof and waterproof. Has been made. Generally, a box made of a lightweight material having high electrical and thermal conductivity, such as aluminum, is used as a casing.

As shown in FIG. 14, a plurality of communication amplifier modules 200 are attached to the bottom surface 112 of the housing body 102 and the ceiling surface 113 of the lid 103.
This is because the heat generated during operation of each communication amplifier module 200 is cooled by the casing in contact with the outside air, and the ground of the communication amplifier module is strengthened. Further, the communication amplifier module 200 is attached not only to the bottom surface 112 but also to the ceiling surface 103 because the casing is made as compact as possible. Therefore, if the ceiling surface 103 is not used, all communication amplifiers are used. This is because the module 200 cannot be attached to the inner wall of the housing.

The casing of the communication amplifier module 200 is generally made of a metal having high thermal conductivity. Although it can be said that the entire housing of the communication amplifier module 200 is a heat radiating unit that radiates heat generated inside, the communication amplifier that is closely attached to the inner wall of the base station device 100 is used in this specification. One surface of the housing of the module 200 is referred to as a heat dissipation surface.
Each communication amplifier module 200 is screwed so that its heat radiating surface 201 is in close contact with the inner wall of the base station apparatus 100, but the screw holes are waterproof from the base station apparatus 100 casing. It does not penetrate through.

The base 300 is attached to the bottom surface 112, and a control board 400 for controlling each communication amplifier module 200 is attached to the top surface 301.
Each communication amplifier module 200 attached to the inner wall of the housing is harness-connected by a control board 400 attached to the base 300 and a wiring cable 500. Thereafter, the housing body 102 and the lid body 103 are joined with screws, and the inside of the housing is sealed.
Japanese Patent No. 3349445

However, the base station apparatus shown in FIG. 14 has the following problems in assembly work.
First, since the communication amplifier module 200 handles high-frequency signals, the wiring cable 500 is preferably as short as possible. However, in order to connect the communication amplifier module 200 screwed to the lid 103 and the control board 400 with a harness. If the wiring cable 500 is not lengthened to some extent, there is a problem that it is difficult to connect.

Further, when the wiring cable 500 is lengthened, there is a possibility that the wiring cable 500 bent when the lid 103 and the housing body 102 are joined may be caught in the joint portion between the lid 103 and the housing body 102. .
The problems in the assembly work as described above are not limited to the PHS base station device, but include, for example, a communication device (for example, a cable TV media converter or a communication device having a plurality of communication amplifier modules and power supplies in a box-type housing). This may also occur in the assembly of submarine cable repeaters.

  Accordingly, an object of the present invention is to solve the above-described problems and provide a communication device that can be easily assembled and a method for manufacturing the communication device.

  In order to achieve the above object, a communication device according to the present invention includes a plurality of communication amplifier modules each having a heat radiating portion connected to a control board by wiring, and the heat radiating portion is in close contact with the inner wall of the housing. The housing is housed in a housing together with the control board, and the housing is configured by a combination of a lid body provided with a through hole and the housing body, and some of the plurality of communication amplifier modules have their heat radiating portions. The remaining communication amplifier module is screwed in and tightened with a screw that is inserted into the through hole and whose head is rotatably locked to the outer surface of the lid body. The heat radiating part is crimped to the lid body wall.

The communication amplifier module crimped to the lid body wall and the control board may be connected by a wire having a length that is approximately the shortest distance between the respective wiring connection portions.
In addition, the communication device according to the present invention includes a communication amplifier module and a power source, each of which is a heating element having a heat radiating portion, connected to the control substrate by wiring, and the heat radiating portion is in close contact with the inner wall of the housing. The casing is configured by a combination of a lid body provided with a through hole and the casing body, and any one of the heating elements has a heat radiating portion of the casing body. The remaining heating element is in close contact with the inner wall, and the heat dissipating part is inserted into the through-hole and tightened by screwing a screw whose head is rotatably locked to the outer surface of the lid body, so that the heat radiating portion is attached It is good also as making it press-fit to.

  The communication device manufacturing method according to the present invention includes a plurality of communication amplifier modules each having a heat dissipating part connected to the control board by wiring, and the heat dissipating part being in close contact with the inner wall of the casing together with the control board. A method of manufacturing a communication device housed in a housing composed of a combination of a lid and a housing body, wherein the heat radiation portions of several communication amplifier modules are in close contact with the inner wall of the housing body Mounting the control board and the remaining communication amplifier module on the housing body, wiring the control board and all the communication amplifier modules, and the second process. Then, a third step of closing the casing by covering the casing body with the lid, and after the third step, a screw is inserted into a through hole provided in the lid, and the screw is screwed And tighten the rest The heat radiation portion of the communication amplifier module characterized by comprising a fourth step of bonding the lid body wall.

  In the second step, the remaining communication amplifier module may be mounted on a base movable in the vertical direction from the bottom surface of the housing body.

  The communication device having the above-described configuration can crimp the heat radiation part of the communication amplifier module to the wall of the lid body by screwing in and tightening the screw from the outside after closing the casing. Thus, there is no need to lengthen the wiring connecting the communication amplifier module attached to the inner wall of the lid and the control board, and as a result, the wiring bite when joining the lid and the housing body. There is also an effect that it can be assembled easily without any interference.

In the communication device having the above-described configuration, the diameter of the through hole is larger than the shaft diameter of the screw passed through the through hole and smaller than the head diameter of the screw, and the through hole through which the screw is passed The inside of the housing may be sealed by covering the hole portion with a waterproof lid.
With this configuration, high accuracy is not required for positioning of the through-holes, so that the yield can be increased. Further, since the gap generated between the through hole and the inserted screw is covered with a waterproof lid to seal the inside of the housing, it is suitable, for example, for a PHS base station apparatus requiring waterproofness.

  Moreover, if the manufacturing method of the said communication apparatus is used, components can be sequentially mounted in a housing | casing by a stacking system, and the heating element attached to the ceiling surface of the box-type housing | casing like the conventional assembly method There is no need to lengthen the wiring connecting between the control board and the control board, and as a result, there is no biting of the wiring when joining the lid and the housing body, and the communication device can be easily assembled. There is an effect.

Hereinafter, a PHS base station apparatus according to an embodiment of the present invention will be described with reference to the drawings.
<Appearance of base station apparatus 1>
FIG. 1 is a three-dimensional perspective view showing the appearance of the base station apparatus 1.
The base station apparatus 1 has a housing formed by joining a housing body 2 and a lid body 3 with screws.
The side surface 20 of the housing body 2 is provided with eight connection terminals for connecting to the eight antennas constituting the adaptive array antenna, respectively, and the other side surface (not shown in part). The fin for heat dissipation is formed. In addition, the upper surface 30 and the lower surface 40 of the lid 3 are also formed with fins for heat dissipation.

<Assembly procedure of base station apparatus 1>
Next, the flow of the assembling procedure of the base station apparatus 1 will be described mainly using FIGS. 3, 4, 7 to 9, 11 and 12.
FIG. 2 is a plan view of the housing body 2 as viewed from above. FIGS. 3, 4, 7 to 9, 11, and 12 show the housing at the AA ′ line shown in FIG. It is the figure which showed the cross section of the housing | casing at the time of cut | disconnecting vertically.

The housing body 2 is a box-shaped housing that opens upward, and a guide groove 6 composed of two rectangular parallelepiped-shaped protrusions is formed on the inner wall of the side surface at a predetermined position shown in FIG. Eight are formed so as to be in the vertical direction.
Further, 24 screw holes for screwing the communication amplifier module 5 are formed on the bottom surface 21 of the housing body 2 (6 screw holes for one communication amplifier module × 4 modules = 24). (Not shown).

First, four communication amplifier modules 5 are screwed to the bottom surface of the casing body 2 so that the respective heat radiation surfaces 51 are in close contact with the bottom surface.
The heat radiation surface 51 is also a ground connection surface.
After the communication amplifier module 5 is screwed to the bottom surface of the housing body 2, the base 7 is disposed on the bottom surface from above the housing body 2 as shown in FIG. 4.

FIG. 5 is a plan view of the casing body 2 as viewed from above in a state where the two bases 7 are arranged on the casing body 2, and FIG. 6 is a three-dimensional perspective view of the base 7.
As shown in FIG. 6, the base 7 includes a top plate 71, a middle plate 72, and left and right leg plates 74, and a rectangular parallelepiped convex portion 73 is perpendicular to the outer surface of each of the left and right leg plates 74. Two are provided in each direction.

On the top surface of the top plate 71, screw holes for the communication amplifier module 9 to be screwed are formed.
A control board 8 for controlling the communication amplifier modules 5 and 9 is mounted on the upper surface of the middle plate 72.
As shown in FIG. 5, the base 7 is disposed on the bottom surface of the housing body 2 with the convex portions 73 sandwiched along the guide grooves 6.

After the two bases 7 are arranged, as shown in FIG. 7, the communication amplifier module 5 screwed to the bottom surface and the control board 8 are harness-connected by the wiring cable 10.
Next, as shown in FIG. 8, the communication amplifier module 9 is screwed to the upper surface of the top plate 71 of the base 7, and the communication amplifier module 9 and the control board 8 are harness-connected by the wiring cable 10. Although not shown, two communication amplifier modules 9 are screwed to the upper surface of one top plate 71. That is, a total of four communication amplifier modules 9 are screwed to the two tables 7.

Each communication amplifier module 9 has a heat radiating surface 91 and two screw holes 92 on the surface opposite to the surface fixed to the top plate 7 with screws.
Next, as shown in FIG. 9, the lid 3 is put on the opening of the housing body 2, and the lid is covered with screws. Then, the screw 11 is passed through the through hole 31 drilled in the main surface of the lid 3, and the screw 11 is screwed into the screw hole 92 provided in the communication amplifier module 9 inside the housing.

FIG. 10 is an enlarged view of a cross section of the screw hole 92 provided in the through hole 31 and the communication amplifier module 9.
As shown in the figure, the diameter y of the through hole 31 is larger than the shaft diameter x of the screw 11 and smaller than the head diameter z of the screw 11. Thereby, since the high precision is not requested | required for positioning of the through-hole 31, a yield can be improved.

Each communication amplifier module 9 is lifted upward together with the base 7 as shown in FIG. 11 by simultaneously screwing and tightening the screws 11 for each base 7 that is screwed. As a result, the heat radiating surface 91 of each communication amplifier module 9 is pressure-bonded to the ceiling surface of the lid 3.
After all the screws 11 are screwed, the flat waterproof lid 4 is screwed from the outside of the main surface of the lid 3 so as to cover the periphery of the through-hole 31 as shown in FIG. This is performed from the viewpoint of waterproofing because a gap is generated between the through hole 31 and the screw 11. In addition, it is desirable that packing rubber is attached to the periphery of the through hole 31 or the periphery of the lower surface of the waterproof lid 4.

As described above, since the base station device 1 can be easily assembled by a so-called stacking method in which components are sequentially mounted from the lower layer to the upper layer, compared to the conventional assembly method, Assembling efficiency is good.
In addition, after closing the base station device 1 casing, the heat radiation surface 91 of the communication amplifier module 9 can be screwed in close contact with the ceiling surface of the lid 3 by tightening screws from the outside of the casing. Therefore, it is not necessary to lengthen the wiring as in the conventional assembly method, and as a result, the biting of the wiring that occurs when the lid 3 and the housing body 2 are joined does not occur.
<Supplement>
Note that the present invention is not limited to the base station apparatus 1 described above. The following are also included in the present invention.
(1) FIG. 13 is a diagram showing a cross section of the casing of the base station device 1A. The base station apparatus 1A shown in the figure is different from the base station apparatus 1 described above in that the communication amplifier module 9A does not have the screw hole 92, but instead has a screw hole 71A corresponding to the screw 11A in the base 7A. Is a point provided.

In addition, each of the communication amplifier module and the base is provided with a screw hole corresponding to a screw inserted from the outside, and the screw is screwed in from the outside of the housing to be tightened. It may be moved upward to bring the heat dissipation surface into close contact with the inner wall of the housing. Moreover, the stand is not necessarily required and may not be necessary.
(2) In the present invention, in addition to the PHS base station apparatus, for example, a communication apparatus provided with a plurality of communication amplifier modules in a box-type housing (for example, a cable TV media converter, a submarine cable relay, etc.) Alternatively, the present invention can also be applied to an electronic device including a plurality of heating elements such as an amplifier and a power source in a box-shaped housing.

  The present invention can be applied to an electronic device in which a heating element is attached to the inner wall of a housing as a heat dissipation measure.

2 is a three-dimensional perspective view showing an appearance of a base station device 1. FIG. It is the top view which looked at the housing body 2 from the upper side. It is the figure which showed the housing | casing cross section of the base station apparatus 1 used in order to demonstrate the assembly stage of the base station apparatus 1. FIG. It is the figure which showed the housing | casing cross section of the base station apparatus 1 used in order to demonstrate the assembly stage of the base station apparatus 1. FIG. It is the top view which looked at the housing body 2 from the top in the state where two stands 7 are arranged. 3 is a three-dimensional perspective view of a table 7. FIG. It is the figure which showed the housing | casing cross section of the base station apparatus 1 used in order to demonstrate the assembly stage of the base station apparatus 1. FIG. It is the figure which showed the housing | casing cross section of the base station apparatus 1 used in order to demonstrate the assembly stage of the base station apparatus 1. FIG. It is the figure which showed the housing | casing cross section of the base station apparatus 1 used in order to demonstrate the assembly stage of the base station apparatus 1. FIG. It is the figure which expanded the cross section of the through-hole 31 and the screw hole 92. FIG. It is the figure which showed the housing | casing cross section of the base station apparatus 1 used in order to demonstrate the assembly stage of the base station apparatus 1. FIG. It is the figure which showed the housing | casing cross section of the base station apparatus 1 used in order to demonstrate the assembly stage of the base station apparatus 1. FIG. It is the figure which showed the cross section of the housing | casing of 1 A of base station apparatuses. It is the figure which showed the internal structure of the conventional base station apparatus in which the several amplifier module for communication was accommodated in the cross section.

Explanation of symbols

1, 1A, 100 Base station apparatus 2, 102 Case body 3, 3A, 103 Lid 4, 4A Waterproof lid 5, 9, 9A, 200 Communication amplifier module 6 Guide groove 7, 7A, 300 units 8, 400 Control Substrate 10, 500 Wiring cable 11, 11A Screw 20 Side surface 21, 112 Bottom surface 30 Upper surface 31 Through hole 40 Lower surface 51, 91, 201 Heat radiation surface 71 Top plate 72 Middle plate 73 Projection 74 Leg plate 71A, 92 Screw hole
113 Ceiling

Claims (5)

A plurality of communication amplifier modules having a heat dissipating section;
A main body housing for storing a plurality of communication amplifier modules;
In the communication device that covers the main body housing and is composed of a lid provided with a through hole ,
At least one of the plurality of communication amplifier modules is fixed, and includes a base that is housed in a main body housing,
At least one of the plurality of communication amplifier modules not fixed to the base is fixed in a state where the heat radiating portion is in contact with the inner wall of the main body housing,
By fixing and screwing the screw housed in the main body housing into the lid body by screwing and tightening a screw inserted through the through-hole and having the head rotatably engaged with the outer surface of the lid body, A communication device , wherein a heat radiation part of the fixed communication amplifier module is crimped to an inner wall of a lid . A control board is arranged on the table,
By tightening the screw, the base is drawn to the lid, and the communication amplifier module fixed to the main body casing and the control board are connected by wiring between the respective wiring connection portions. . The diameter of the through hole is larger than the shaft diameter of the screw passed through the through hole and smaller than the head diameter of the screw.
The communication device according to claim 1, wherein a portion of the through-hole through which the screw is passed is covered with a waterproof lid to seal the inside of the housing. A plurality of communication amplifier modules having a heat radiating portion are configured by a combination of a lid and a housing body together with a control board in a state where the communication amplifier module is connected to the control board by wiring and the heat radiating portion is in close contact with the inner wall of the housing. A method of manufacturing a communication device housed in a housing,
A first step of attaching at least one heat dissipating portion of the plurality of communication amplifier modules in close contact with the inner wall of the housing body; and
One of the communication amplifier modules other than the control board and the inner wall of the housing body in the first step is mounted on a base housed in the housing body, and the control board and all the communication amplifiers are mounted. A second step of wiring connection to the module;
After the second step, a third step of closing the casing by covering the casing body with the lid,
After the third step, a screw is inserted into a through-hole provided in the lid body, and the screw is screwed and tightened, whereby the heat radiating portion of the remaining communication amplifier module is crimped to the lid body wall. And a fourth step of fixing the table to the lid side . A method for manufacturing a communication device, comprising: 6. The method of manufacturing a communication device according to claim 5, wherein, in the second step, the remaining communication amplifier module is mounted on a base movable in a vertical direction from the bottom surface of the housing body.

Images