JP4376326B2 - Socket for electrical parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical component socket for detachably holding an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”).
[0002]
[Prior art]
Conventionally, as this type of “socket for electrical parts”, as shown in FIGS. 11 and 12, there is an IC socket 2 that detachably holds an IC package 1 that is an “electrical part”.
[0003]
The IC package 1 is called a so-called gull wing type, and a plurality of IC leads 1b which are “terminals” project in a crank shape from the rectangular package body 1a to the side.
[0004]
On the other hand, in the IC socket 2, a mounting portion 3a for mounting the IC package 1 is formed on the socket body 3, and a guide portion 3b for positioning the rectangular IC package 1 at a predetermined position is provided in the IC package 1. Are provided corresponding to each corner. Further, a partition wall portion 3c protruding upward is formed around the mounting portion 3a, and a plurality of slits 3d are formed at a predetermined pitch in the partition wall portion 3c.
[0005]
The socket body 3 is provided with a plurality of elastically deformable contact pins 4 that are separated from and in contact with the IC leads 1 b of the IC package 1. The contact pin 4 has a movable contact piece 4a that is separated from and connected to the IC lead 1b. The movable contact piece 4a is attached to and detached from the upper surface of the IC lead 1b of the IC package 1. Each contact pin 4 is inserted into each slit 3d of the partition wall 3c so as to be movable up and down.
[0006]
Further, the socket body 3 is provided with an upper operating member (not shown) that can move up and down. The upper operating member is moved down against the urging force of the spring and the contact pin 4 to thereby move the contact pin. 4 is elastically deformed to move the movable contact piece 4a away from the IC lead 1b, and by raising the upper operation member, the spring portion is restored by the elastic force so that the movable contact piece 4a is shown in FIG. As shown in FIG. 11, the upper surface of the IC lead 1b is contacted and pressed from above, and the contact pin 4 and the IC lead 1b are electrically connected.
[0007]
[Problems to be solved by the invention]
However, in such a conventional device, with the miniaturization of the IC package 1, a large number of IC leads 1b protruding from the package body 1a tend to be narrower and narrower. In other words, unless the width of each IC lead 1b is reduced, a large number of IC leads 1b cannot be arranged at regular intervals. Therefore, when the IC package 1 is placed on the placement portion 3a of the socket body 3, the narrow IC lead 1b of the IC package 1 is formed on the peripheral portion of the placement portion 3a. The IC lead 1b may be deformed or damaged, or a seating failure may occur.
[0008]
Therefore, the present invention provides an electrical component socket that prevents terminals of electrical components such as IC packages from entering the slits of the partition wall of the socket body, and prevents deformation and damage of the terminals and poor seating. It is an issue.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is a socket main body having a mounting portion for mounting an electric component, and a plurality of terminals attached to the socket main body and detachable from the terminals of the electric component. A contact pin, and an upper operation member provided on the socket body so as to be movable up and down. The contact pin has a curved spring part that is elastically deformed, and contacts the terminal at the tip of the spring part. A movable contact piece having a movable contact portion is formed, and a partition wall portion having a slit into which the spring portion of the contact pin and the movable contact piece are inserted around the mounting portion is formed on the socket body. is formed, by vertically moving the upper operating member, said movable contact piece is displaced in socket for electrical parts that is to be disjunctive in the terminal, the contact pin, the Sri The width of the movable contact piece to be inserted into bets top, is formed thinner than the width of the spring portion to be inserted into the slit bottom, wherein each slit, the slit top of the movable contact piece is inserted, the electrical component terminal The slit lower portion into which the spring portion is inserted is wider than the slit upper portion and the spring portion of the spring portion is formed. It is characterized in that it is a socket for electric parts formed slightly wider than the width .
[0010]
According to a second aspect of the present invention, in addition to the configuration of the first aspect, a slit middle portion between the upper portion of the slit and the lower portion of the slit is configured so that the upper portion of the slit and the lower portion of the slit are smoothly continued. It is formed in the taper shape which the downward direction spreads.
[0011]
According to a third aspect of the present invention, in addition to the configuration according to the first or second aspect, the upper portion of the slit is set such that the width on the placement portion side before the electrical component is placed is narrower than the width of the terminal The contact pin is formed in a tapered shape so as to expand as it moves away from the mounting portion, while the contact pin is formed in a tapered shape with a movable contact piece inserted into the upper portion of the slit.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0013]
Embodiment 1 of the Invention
1 to 9 show a first embodiment of the present invention.
[0014]
First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”. This IC socket 11 is used to perform a performance test of the IC package 12 that is an “electrical component”. The IC lead 12b as the “terminal” 12 is electrically connected to the printed wiring board (not shown) of the measuring instrument (tester).
[0015]
As shown in FIGS. 1 and 9, etc., this IC package 12 is a so-called gull wing type. A large number of IC leads 12b are formed from two opposite sides of a rectangular package body 12a to the side. It protrudes like a crank.
[0016]
On the other hand, the IC socket 11 generally includes a socket body 13 mounted on a printed wiring board. The socket body 13 is formed with a mounting portion 13a on which the IC package 12 is mounted, and an IC. Guide portions 13b for positioning the package 12 at predetermined positions are provided corresponding to the respective corner portions of the package body 12a. A partition wall 13c is formed around the mounting portion 13a between the guide portions 13b, and a number of slits 13d are formed at predetermined intervals in the partition wall 13c (details will be described later). .
[0017]
The socket body 13 is provided with a plurality of elastically deformable contact pins 15 that are separated from and in contact with the IC leads 12b, and a rectangular frame-like upper operation member 16 that elastically deforms the contact pins 15. It can be moved up and down.
[0018]
The contact pin 15 is formed of a material having a spring property and excellent conductivity as shown in FIGS. 1, 2, 5, 5 and 6 and the like, and is located outside the mounting portion 13a of the socket body 13. It is press-fitted into and arranged. Specifically, the contact pin 15 has a base portion 15a, a lead portion 15b is projected downward from the base portion 15a, the lead portion 15b is press-fitted into the socket body 13, and the socket body of the lead portion 15b. A portion protruding downward from 13 is electrically connected to the printed wiring board. Further, a movable piece 15d is formed above the base portion 15a via a curved spring portion 15c, and an arm portion 15e extending inward is formed on the movable piece 15d. The movable contact piece 15f is formed inward. The tip of the movable contact piece 15f is brought into contact with the upper surface of the IC lead 12b of the IC package 12 so as to be conducted. Furthermore, an operating piece 15g is provided on the movable piece 15d so as to protrude upward from the outside. The width H1 of the movable contact piece 15f of the contact pin 15 is formed to be thinner than the width H2 of the spring portion 15c or the like (see FIG. 6).
[0019]
A part of the contact pin 15 is inserted into the slit 13 d of the socket body 13. Specifically, as shown in FIGS. 5, 7, 8, and the like, the slit 13 has a width H <b> 3 of the slit upper portion 13 e above the upper surface of the mounting portion 13 a (the movable contact piece 15 f of the contact pin 15. Is slightly narrower than the width H4 of the IC lead 12b. Further, the width H5 of the slit lower portion 13f (slightly wider than the width H2 of the spring portion 15c of the contact pin 15) is formed wider than the width H3 of the slit upper portion 13e, and between the slit upper portion 13e and the slit lower portion 13f. The intermediate portion 13g is formed in a tapered shape in which the lower portion is widened so that the slit upper portion 13e and the slit lower portion 13f are smoothly continuous.
[0020]
A spring portion 15c of the contact pin 15 is inserted into the slit lower portion 13f, and a movable contact piece 15f (a portion having a width H1) is inserted into the slit upper portion 13e and the intermediate portion 13g.
[0021]
And the front-end | tip part of the movable contact piece 15f of the contact pin 15 protrudes in the mounting part 13a side, as shown in FIG. This tip is in contact with the upper surface of the IC lead 12b.
[0022]
Further, as shown in FIG. 1 and the like, the upper operation member 16 has an opening 16a of a size into which the IC package 12 can be inserted. The IC package 12 is inserted through the opening 16a, and the socket body 13 is inserted. It mounts on the mounting part 13a. As shown in FIG. 4, the upper operation member 16 is arranged on the socket body 13 so as to be movable up and down, and is biased upward by a spring 17, and the locking claw 16b is attached to the socket at the highest position. The upper operation member 16 is prevented from coming off by being locked to the locked portion 13h of the main body 13. Further, the upper operation member 16 is formed with a cam portion 16c slidably in contact with the operation piece 15g of the contact pin 15. By lowering the upper operation member 16, the operation piece 15g of the contact pin 15 is camped. When pressed by the portion 16c, the spring portion 15c is elastically deformed, and the movable contact piece 15f is displaced obliquely outward and upward so as to be separated from the IC lead 12b. Further, when the upper operation member 16 is raised, it operates in reverse to the above, and the movable contact piece 15f is displaced downward by the elastic force of the spring portion 15c, and this movable contact piece 15f is the upper surface of the IC lead 12b. It is made to contact and be conducted.
[0023]
Next, a method of using the IC socket 11 having such a configuration will be described.
[0024]
First, the lead portions 15b of the contact pins 15 of the IC socket 11 are inserted into the insertion holes of the printed wiring board and soldered in advance, thereby arranging the plurality of IC sockets 11 on the printed wiring board.
[0025]
Then, the IC package 12 is set and electrically connected to the IC socket 11 by, for example, an automatic machine as follows.
[0026]
That is, the upper operating member 16 is pushed downward by the automatic machine while holding the IC package 12 against the urging force of the spring 17 and the contact pin 15. Then, the contact pin operation piece 15g is pressed by the cam portion 16c of the upper operation member 16, the spring portion 15c is elastically deformed, and the movable contact piece 15f is displaced obliquely upward and opened to the maximum, so that the IC package can be opened. 12 is retracted from the insertion range (see FIG. 2).
[0027]
In this state, the IC package 12 is released from the automatic machine and placed on the placement portion 13 a of the socket body 13. At this time, it is desirable that the IC package 12 is placed at a predetermined position of the placement portion 13a of the socket body 13, but there is a case where the IC package 12 is slightly shifted. In such a case, the movable contact piece 15f is displaced obliquely upward as shown in FIG. 2, and the slit upper portion 13e is opened. Therefore, conventionally, there is a possibility that the IC lead 12b enters the slit upper portion 13e of the socket body 13. However, according to the present invention, since the width H3 of the slit upper portion 13e is formed narrower than the width H4 of the IC lead 12b, the IC lead 12b is prevented from entering the slit upper portion 13e of the socket body 13. . Therefore, deformation and damage of the IC lead 12b are prevented.
[0028]
Then, the IC package 12 is corrected in the horizontal state, and the IC package 12 is positioned in the lateral direction by the guide portion 13b or the like, and the IC package 12 is securely placed at a predetermined position of the placement portion 13a. Will be.
[0029]
Next, when the pressing force of the upper operating member 16 by the automatic machine is released, the upper operating member 16 rises due to the urging force of the spring 17 and the like, and the movable contact piece 15f of the contact pin 15 returns by the elastic force of the spring portion 15c. At the same time, when the upper operating member 16 is moved up to a predetermined position, the movable contact piece 15f of the contact pin 15 is brought into contact with and electrically connected to the upper surface of the predetermined IC lead 12b of the positioned IC package 12. The Rukoto.
[0030]
By the way, the contact pin 15 is formed so that the width H1 on the movable contact piece 15f side is narrower than the width H2 on the spring portion 15c side, and the movable contact piece 15f side is above the slit of the socket body 13 formed with a narrow width H3. Since it is inserted into 13e, there are the following advantages.
[0031]
That is, if the size of the IC package 12 is reduced without changing the number of the IC leads 12b, the width H4 of the IC lead 12b is inevitably narrowed, and the IC lead 12b is prevented from entering. The width H3 of the slit upper part 13e of the main body 13 needs to be formed narrower. Therefore, in order to insert the movable contact piece 15f of the contact pin 15 into the slit upper portion 13e having the narrow width H3, the width H1 of the movable contact piece 15f is considerably reduced. If the spring portion 15c is formed with the same width as the width H1 of the movable contact piece 15f, the spring force becomes weak. Therefore, the width H2 of the spring portion 15c is made wider than the width H1 of the movable contact piece 15f to ensure the spring force, and at the same time, the movable contact piece 15f can be inserted into the slit upper portion 13e.
[0032]
Further, considering the moldability of the slit 13d of the socket body 13, the width H3 of the slit upper portion 13e is narrow, the width H5 of the slit lower portion 13f is wider than that, and the space between the slit upper portion 13e and the slit lower portion 13f is between. Since the taper-shaped intermediate portion 13g is continuous, the moldability is better when the resin is injection-molded than when the entire slit 13d is formed with the width H3.
[0033]
[Embodiment 2 of the Invention]
FIG. 10 shows a second embodiment of the present invention. This figure is a plan view showing a state in which the contact pin 15 is inserted into the slit upper portion 13 e of the socket body 13.
[0034]
According to this figure, the slit upper portion 13e of the socket body 13 is formed such that the width H6 on the mounting portion 13a side (inner side) is narrower than the width H4 of the IC lead 12b so that the IC lead 12b does not enter. The outer width H7 of the slit upper portion 13e is formed wider than the inner width H6, and is formed in a tapered shape so as to increase as the distance from the mounting portion 13a increases.
[0035]
Corresponding to this taper shape, the movable contact piece 15f of the contact pin 15 is also tapered.
[0036]
Thus, if the movable contact piece 15f is formed in a smooth taper shape, the manufacturing is relatively easy.
[0037]
Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.
[0038]
In the above embodiments, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices. Further, the contact pin 15 of the first and second embodiments has the movable contact piece 15f and no fixed contact piece, but has the fixed contact piece. Also, a so-called two-point contact type contact pin that holds the terminal of the electrical component from above and below with the movable contact piece may be used.
[0039]
【The invention's effect】
As described above, according to the invention described in each claim, the width of the upper slit portion of the socket body is set to be narrower than the width of the terminal of the electrical component placed on the placement portion of the socket body. When placing a part on the placement part, the terminals of the electrical parts do not enter the socket body slit, so that deformation of the terminal and poor seating can be prevented, and the width of the lower part of the slit is lower than the width of the upper part of the slit. The width of the movable contact piece inserted into the upper part of the contact pin of the contact pin is made thinner than the width of the spring part inserted into the lower part of the slit, so that the size of the IC package can be reduced without changing the number of IC leads. Therefore, the width of the spring part can be made wider than the width of the movable contact piece to ensure the spring force, and at the same time, the movable contact piece can be inserted into the upper part of the slit.
[0040]
According to the second aspect of the present invention, in addition to the above effect, the width of the upper portion of the slit is narrow, the width of the lower portion of the slit is wider, and a taper-shaped intermediate portion is formed between the upper portion of the slit and the lower portion of the slit. Therefore, in comparison with the case where the entire slit is formed to have the same width in accordance with the narrow width of the upper portion of the slit, the moldability is better when performing injection molding of the resin.
[0041]
According to the invention described in claim 3, in addition to the above-described effect, the slit upper portion is set such that the width on the mounting portion side on which the electrical component is placed is set narrower than the width of the terminal, and widens as the distance from the placement portion increases. On the other hand, since the contact pin is formed in a tapered shape with the movable contact piece inserted into the upper part of the slit, the terminal of the electrical component such as an IC package is more securely connected to the partition wall of the socket body. A practically beneficial effect that can be prevented from entering the slit of the part is exhibited.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of an IC socket according to Embodiment 1 of the present invention.
FIG. 2 is a longitudinal sectional view showing a state in which the upper operation member according to the first embodiment is in a lowest position.
FIG. 3 is a plan view of the IC socket according to the first embodiment.
4 is a side view of a half of the IC socket according to the first embodiment. FIG.
FIG. 5 is a perspective view showing a state in which the contact pin according to the first embodiment is inserted into the slit of the socket body.
6 is a perspective view of the contact pin according to the first embodiment when viewed obliquely from below. FIG.
7 is a perspective view showing a slit or the like of the socket body according to the first embodiment. FIG.
8 is a perspective view of FIG. 7 as viewed from the direction of arrow X, according to the first embodiment. FIG.
9A and 9B are diagrams showing the IC package according to the first embodiment, where FIG. 9A is a plan view of the IC package, and FIG. 9B is an enlarged view of a Y portion of FIG. 9A;
FIG. 10 is a plan view showing a state in which a contact pin is inserted into a socket body, showing Embodiment 2 of the present invention.
FIG. 11 is an enlarged sectional view showing a state in which a contact pin is in contact with an IC lead showing a conventional example.
FIG. 12 is a perspective view showing a slit or the like of the socket body showing the conventional example.
[Explanation of symbols]
11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a Package body
12b IC lead (terminal)
13 Socket body
13a Mounting part
13b Guide section
13c Bulkhead
13d slit
13e top
15 Contact pin
15a base
15b Lead part
15c Spring part
15d movable piece
15e Arm part
15f movable contact
15g operation piece
16 Upper control member
H1 Contact pin movable contact width
H3 slit top width
H4 IC lead width

Claims (3)

A socket body having a placement portion for placing an electrical component, a plurality of contact pins attached to the socket body and attachable to and detachable from terminals of the electrical component, and an upper operation provided on the socket body to be movable up and down The contact pin is formed with a curved spring portion that is elastically deformed and a movable contact piece that has a movable contact portion that contacts the terminal at the tip of the spring portion, The socket body has a partition wall having a slit into which the spring portion of the contact pin and the movable contact piece are inserted around the mounting portion, and the movable contact member is moved up and down to move the movable contact member. In the socket for electrical parts in which the piece is displaced so as to be separated from the terminal,
The contact pin is formed such that the width of the movable contact piece inserted into the upper part of the slit is thinner than the width of the spring part inserted into the lower part of the slit,
Each of the slits is formed such that the slit upper portion into which the movable contact piece is inserted is formed to be narrower than the width of the terminal of the electrical component, and slightly wider than the width of the movable contact piece , and the spring portion. A socket for an electrical component , wherein a lower slit portion is inserted wider than the upper slit portion and slightly wider than the spring portion .   The slit middle part between the slit upper part and the slit lower part is formed in a tapered shape in which the lower part is widened so that the slit upper part and the slit lower part are smoothly continuous. Socket for electrical parts as described.   The slit upper portion is formed in a tapered shape so that the width on the mounting portion side on which the electrical component is placed is set narrower than the width of the terminal and widens as the distance from the mounting portion increases. 3. The electrical component socket according to claim 1, wherein the contact pin is formed such that a movable contact piece inserted into the upper portion of the slit has a tapered shape.

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