JP4569020B2 - Electrical connection method, electrical connection device, and electronic apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical connection method, an electrical connection device, and an electronic apparatus for electrically and reliably connecting a first member and a second member.
[0002]
[Prior art]
As an example of electronic equipment, an organic electroluminescent element and a mobile phone are given as examples.
In recent years, display devices using organic electroluminescent elements (organic electroluminescent elements, hereinafter referred to as organic EL elements) as light emitting elements have attracted attention.
In this type of conventional display device, a transparent electrode serving as an anode is formed in a stripe shape on a transparent glass substrate. On the striped transparent electrode, an organic layer is formed in a perpendicular direction. This organic layer consists of a hole transport layer and a light emitting layer. A cathode is formed on the organic layer. By doing in this way, the organic EL element is formed in the position where a transparent electrode and a cathode cross, respectively, and these light emitting areas are formed by arranging these organic EL elements vertically and horizontally. The peripheral part of the glass substrate has an electrode part for connecting the light emitting area to the drive circuit.
[0003]
When a positive voltage is applied to the transparent electrode that is the anode and a negative voltage is applied to the cathode, holes injected from the transparent electrode reach the light emitting layer through the hole transport layer. On the other hand, electrons injected from the cathode reach the light emitting layer. As a result, electron-hole recombination occurs in the light emitting layer, so that light having a predetermined wavelength is generated, and the light is emitted to the outside from the transparent glass substrate.
In this type of display device, a flexible wiring board for connection to the outside and a driver IC (integrated circuit) for driving are applied to the electrodes on the glass substrate, and an ACF (anisotropic conductive film) is applied by applying heat. Is electrically connected.
[0004]
As another example of the electronic device, a mobile phone is taken. A battery is detachably attached to the back side of the casing of the mobile phone. This battery is supplied with power when mounted on the main body, and the battery can be charged from the outside. This type of battery has a case and a battery body. The battery body is housed in a case, and the two electrode extraction portions of the battery body are resistance-welded to the tab, and then the tab is soldered to the substrate in the case. The soldering work using such a tab is manually performed by an operator.
[0005]
[Problems to be solved by the invention]
In the case of an organic electroluminescent element, since it is electrically connected using ACF which is an elastic body, it is necessary to apply heat of at least 100 and several tens of degrees during this electrical connection. This may cause thermal damage to the organic electroluminescent element.
In the case of a battery, since the electrode of the battery body and the substrate are electrically connected using the tab as the connecting member as described above, it is difficult to reduce the size of the battery, and the soldering work There is also a problem that the heat in the battery affects the battery body.
Accordingly, the present invention provides an electrical connection method, an electrical connection device, and an electronic device that can solve the above-described problems and can electrically and reliably connect the first member and the second member in the electronic device without causing damage due to heat. The purpose is to do.
[0006]
[Means for Solving the Problems]
  The invention of claim 1A protruding surface protruding from the main surface of the substrate of the substrate having a through hole and a conductor portion protruding above the through hole and the electrode are welded by ultrasonic vibration welding, The substrate and the electrodeConnect electricallyRuIt is an electrical connection method. In claim 1,substrateWhenWith electrodesWhen electrically connectingsubstrateConductor formed onProjecting surface protruding from the main surface of the boardWhenWith electrodesThe ultrasonic vibrationweldingByWeld the substrate and electrodeConnect electrically. Thereby, it can electrically connect reliably, without giving a heat | fever at the time of an electrical connection operation | work. Moreover, there is no need for members such as tabs and ACF,substrateFormed intoTheConductor partProjecting surface protruding from the main surface of the boardWhenelectrodeCan be directly electrically connected to each other, so that downsizing can be achieved. Since electrical connection can be performed without applying heat, electrical connection at room temperature is possible, and since an elastic body such as an ACF or a tab is not interposed, electrical connection reliability can be improved. Since the electrical connection is performed without applying heat, the energy during the connection can be reduced, and the cost can be reduced.
[0008]
  Claim2The invention of claim1In the electrical connection method according to claim 1,ThruIn the hall,Bumps are formed.
[0009]
  Claim3The electrical connection method according to claim 1, whereinsubstrateThe conductor part of,With CuFormedThe aboveelectrodeIs,Ni or AlFormedThe
[0010]
  Claim4The electrical connection method according to claim 1, whereinsubstrateThe conductor part of,With AuFormedThe aboveelectrodeIs,Glass substrateElectrodeAndTheGlass substrateElectrodeIs,AusoIs formed.
[0011]
  Claim5The invention of claim4In the electrical connection method according to claim 1,substrateThe Au of,The glass substrate formed on the Ni baseOf electrodeThe Au is,It is formed on a Ni base.
[0012]
  Claim6The electrical connection method according to claim 1, whereinsubstrateThe conductor part formed onWhenAboveWith electrodesThe ultrasonic vibrationweldingByWeldBefore electrical connection, the conductor portion and the conductorWith electrodesIs activated by plasma treatment. Claim6ThensubstrateAnd conductor parts formed onWith electrodesThe ultrasonic vibrationweldingByWeldBefore making an electrical connection,electrodeIs activated by plasma treatment. As a result, the conductor part andWith electrodesBy activating each surface ofsubstrateConductor part andWith electrodesThe electrical connection reliability can be improved.
[0013]
  Claim7The invention ofA substrate having a through hole and having a conductor portion projecting from the through hole; and a projecting surface of the conductor portion projecting from the main surface of the substrate.Ultrasonic vibrationweldingByWelded with the substrateElectrically connectedWith electrodesIt is an electrical connection device. Claim7ThensubstrateWhenWith electrodesWhen electrically connectingsubstrateAnd conductor parts formed onWith electrodesThe ultrasonic vibrationweldingConnect electrically. Thereby, it can electrically connect reliably, without giving a heat | fever at the time of an electrical connection operation | work. Moreover, there is no need for members such as tabs and ACF,substrateConductor part formed onelectrodeCan be directly electrically connected to each other, so that downsizing can be achieved. Since electrical connection can be performed without applying heat, electrical connection at room temperature is possible, and since an elastic body such as an ACF or a tab is not interposed, electrical connection reliability can be improved. Since the electrical connection is performed without applying heat, the energy during the connection can be reduced, and the cost can be reduced.
[0014]
  Claim8The invention ofA substrate having a through-hole and having a conductor portion protruding from the through-hole, and a protruding surface of the conductor portion protruding from the main surface of the substrate by welding by ultrasonic vibration welding, With electrically connected electrodesAn electronic device having an electrical connection device. Claim8ThensubstrateWhenWith electrodesWhen electrically connectingsubstrateAnd conductor parts formed onWith electrodesThe ultrasonic vibrationweldingByWeldConnect electrically. Thereby, it can electrically connect reliably, without giving a heat | fever at the time of an electrical connection operation | work. Moreover, there is no need for members such as tabs and ACF,substrateConductor part formed onelectrodeCan be directly electrically connected to each other, so that downsizing can be achieved. Since electrical connection can be performed without applying heat, electrical connection at room temperature is possible, and since an elastic body such as an ACF or a tab is not interposed, electrical connection reliability can be improved. Since the electrical connection is performed without applying heat, the energy during the connection can be reduced, and the cost can be reduced.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
The embodiment described below is a preferred specific example of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention is particularly limited in the following description. Unless otherwise stated, the present invention is not limited to these forms.
[0016]
Embodiment 1
1 and 2 show a mobile phone as an example of an electronic device. In this example, a single battery 100 is detachably attached to the mobile phone 10.
The cellular phone 10 includes a housing 12 and one battery (battery) 100, a display unit 16, an antenna 14, a speaker 22, a microphone 20, an operation unit 18, and the like. The battery 100 is a battery for supplying power to the mobile phone 10.
The housing 12 has a front part 24 and a rear part 26. As shown in FIG. 2, a battery 100 is detachably attached to the lower surface of the rear portion 26 and to the back surface of the front portion 24.
The display part 16 is a part which displays various information, for example, can use a liquid crystal display device. The speaker 22 is for listening to voice, and the microphone 20 is a part for inputting the voice of the operator.
The operation unit 18 includes a numeric keypad 18C, a button 18A for making a call, a button 18B for hanging up, and the like.
[0017]
FIG. 3 shows a structural example of the battery 100 of FIG.
The battery 100 in FIG. 3 generally includes an upper case 30, a lower case 32, a battery body 34, a substrate 36, an electrical connection unit 40, electrical connection units 42 and 44, and a label 46.
[0018]
FIG. 4 shows an enlarged structure of the upper case 30, the lower case 32, the battery main body (also referred to as a cell) 34, the substrate 36, the electrical connection portion 40, and the electrical connection portions 42 and 44.
The upper case 30 and the lower case 32 are containers for accommodating the battery main body 34 and the substrate 36, and the material thereof is, for example, plastic, specifically ABS (acrylonitrile butadiene styrene), PC (polycarbonate), PC / ABS (polycarbonate). / Acrylonitrile butadiene styrene), PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), modified PPE (polyphenylene ether) and other resins.
3 is affixed to the outer surface 30B of the upper case 30, and the label 46 describes the characteristics of the battery 100 and other information.
[0019]
FIG. 5A and FIG. 5B show examples of the shape of the battery main body 34.
The battery body 34 in FIG. 5 has electrode extraction portions 50 and 52. The electrode extraction part 50 is a negative electrode, for example, made of nickel, and the other electrode extraction part 52 is a positive electrode, for example, made of aluminum.
The battery body 34 is a battery that can be charged and discharged many times, such as a lithium ion battery, a lithium polymer battery, or a solid polymer battery. The battery body 34 is sealed by a case.
[0020]
3 and 4 is a substrate disposed between the upper case 30 and the lower case 32. The substrate 36 is, for example, rectangular and has a protection circuit for protecting the battery body 34. And has electrical connection portions 42 and 44.
The protection circuit for the substrate 36 can define an upper limit voltage during charging or a lower limit voltage during discharge for safety.
The substrate 36 is made of, for example, a glass epoxy substrate, a paper phenol substrate, a flexible printed wiring board, a liquid crystal polymer substrate, a ceramic substrate, or the like.
[0021]
Electrical connections 42 and 44 are electrically joined to the substrate 36 shown in FIGS. 3 and 4 by soldering, for example, through a reflow furnace. The electrical connecting portions 42 and 44 are made of, for example, a conductive metal material such as a copper plate, a phosphor bronze plate, a beryllium copper plate, or a tin plate, as shown in FIG. It is a member.
[0022]
3 is located at a position corresponding to the electrode extraction portion 50 on the substrate 36, and the electric connection portion 44 is located at a position corresponding to the electrode extraction portion 52 on the substrate 36. .
As a result, the electrode lead-out portion 50 is connected to a predetermined position of the conductive pattern of the substrate 36 via the electric connection portion 42, and the electrode lead-out portion 52 is connected to a predetermined position of the conductive pattern of the substrate 36 via the electric connection portion 44. Electrically connected.
The electrode lead-out portions 50 and 52 need to be surely and easily electrically connected to the substrate 36 side through the corresponding electrical connection portions 42 and 44 without applying heat. That is, a phenomenon in which the electrode lead-out portion is electrically connected to the substrate side by soldering manually as conventionally performed, and heat is transferred to the battery main body 34 side to damage the battery main body 34. Need to avoid.
[0023]
FIG. 6 shows ultrasonic vibration for electrically connecting the electrical connection portion 42 (or electrical connection portion 44) of the substrate 36 and the electrode extraction portion 50 (or electrode extraction portion 52) of the battery by ultrasonic vibration welding. 1 shows a welding device.
Here, the substrate 36 corresponds to a first member, and the electrical connection portions 42 and 44 correspond to a conductor portion of the first member. The electrode extraction parts 50 and 52 correspond to a second member.
The electrode take-out portions 50 and 52 having relatively weak mechanical strength are mounted on the fixed base 400. On the electrode extraction part 50 and the electrode extraction part 52, the electrical connection part 42 and the electrical connection part 44 of the corresponding substrate 36 are mounted, respectively.
[0024]
Thereafter, the ultrasonic vibration welding apparatus 410 includes the fixed base 400, the pressing part 420, and the ultrasonic generation source 430. The pressing portion 420 is pressed against the electrical connecting portion 42 and the electrical connecting portion 44 along the PS direction. The pressing unit 420 generates an amplitude in the E direction, that is, in a direction orthogonal to the pressing direction PS, by supplying voltage from the ultrasonic wave generation source 430.
The electrode connecting portion 50 and the electrode extracting portion 52 corresponding to the electric connecting portion 42 and the electric connecting portion 44 are solid-phase bonded by rubbing the welding interface by applying a relatively low pressure and strong ultrasonic vibration at room temperature. Therefore, it is possible to stably perform an ideal electrical connection without any heat and without loss of heat. In other words, the weld interface is rubbed to mechanically clean the oxide film and adhering impurities, and sudden plastic flow occurs, so that the electrode connecting portions 50 and 52 corresponding to the electrical connecting portions 42 and 44 are in a solid state. Will be combined. The electrical connection portion 42 and the electrode extraction portion 50 constitute an electrical connection device 600, and the electrical connection portion 44 and the electrode extraction portion 52 constitute an electrical connection device 600.
In the case of such joining, since it can be performed at room temperature, the electrode extraction portions 50 and 52 are not heated, and therefore there is no influence of heat on the battery body 34 shown in FIG. In addition, since it is not necessary to use a conventional elastic member such as a tab, the battery and the mobile phone can be reduced in size and the number of parts can be reduced.
[0025]
As shown in FIG. 6, the electrical connection portions 42 and 44 are formed by applying Cu plating 530 in the vicinity of the hole 500 and the wiring pattern 510 formed in the substrate 36. The wiring pattern 510 is also Cu, for example. As the substrate 36, for example, a flexible printed wiring board (FPC) can be used.
The electrode lead-out part 50 is a negative electrode as described above, and is made of nickel, for example. Another electrode lead-out portion 52 is a positive electrode and is made of, for example, aluminum.
20 and 21 show more specific examples of the ultrasonic vibration welding apparatus 410.
The pressing portion 410 can be pushed down in the PS direction by the operation of the actuator 411 or raised in the opposite direction.
[0026]
FIG. 7 shows an example of another electrical connection method for obtaining the electrical connection device 600.
In the example of the electrical connection method of FIG. 7, before electrically connecting the conductor part of the first member and the second member by ultrasonic vibration in the manner of FIG. 6, the conductor part of the first member and the second member are connected. The plasma treatment is performed to activate the conductor portion of the first member and the surface of the second member.
[0027]
Specifically, as shown in FIG. 7A, a plasma irradiator 700 is prepared, and the plasma 710 irradiated from the plasma irradiator 700 is converted into an electrical connection portion 42, as shown in FIG. Irradiation is performed on the bonding surface 99 side of the 44 Cu plating 530.
This activates the surface of the Cu plating 530 and improves the wettability of the Cu plating 530.
Similarly, as shown in FIG. 7B, plasma 710 is irradiated from the plasma irradiator 700 to the electrode take-out portions 50 and 52 of the battery body, and the surfaces of the electrode take-out portions 50 and 52 are activated to improve the wettability. Improve.
[0028]
Next, as shown in FIG. 7 (C), in the same manner as in FIG. 6, the electrical connection is performed by lightly pressing along the pressing force direction PS through the pressing portion 420 and applying vibration in the E direction. The electrode lead-out portions 50 and 52 corresponding to the portions 42 and 44 are electrically and reliably connected to each other at room temperature.
Thus, before joining by ultrasonic vibration, the wettability of the Cu plating 530 of the electrical connection portions 42 and 44 of the substrate 36 to be joined is improved in advance, and the wettability of the electrode extraction portions 50 and 52 is improved. Also, the reliability of bonding at the time of bonding by ultrasonic vibration shown in FIG. 7C can be improved.
[0029]
FIG. 8 shows another embodiment of the electrical connection device 600.
As shown in FIG. 8, a through hole 500 is formed in the substrate 36, and a wiring pattern 510 is formed in the vicinity of the through hole 500. A Cu plating 530 </ b> A is formed so as to fill the through hole 500 across the through hole 500 and the wiring pattern 510. The Cu plating 530A is a bump. This Cu plating 530A is directly and reliably connected to the electrode lead-out part 50 or 52 of the battery body by the electrical connection method shown in FIG. 6 or the electrical connection method shown in FIG. be able to.
[0030]
FIG. 9 shows another electrical connection device 800 of the present invention. For example, a plurality of through holes 500 are provided in the substrate 36, and the through patterns 500 and the wiring patterns 510 in the vicinity thereof are respectively provided. Cu plating 530 is formed. In this way, a plurality of Cu platings 530 are formed on the substrate 36, and the electrical connection method shown in FIG. 6 or FIG. By connecting electrically at room temperature using the electrical connection method shown in (2), it is possible to connect more reliably with a large mechanical connection strength.
[0031]
FIG. 10 shows still another embodiment of the present invention. The substrate 36 corresponding to the first member has no through hole and is formed with a Cu bump 530B protruding from the conductor pattern 510A. The Cu bump 530B is electrically and mechanically applied to the battery electrode lead-out portions 50 and 52 using the electrical connection method shown in FIG. 6 or the electrical connection method shown in FIG. A direct connection can be ensured.
[0032]
Of course, a plurality of bumps 530A and 530B of the embodiment shown in FIGS. 8 and 10 may be formed on the substrate as shown in FIG.
As described above, the electrical connection portions 42 and 44 as the conductor portions of the substrate 36 that is the first member do not use solder for the electrode extraction portions 50 and 52 of the battery main body that is the second member, and at room temperature. Thus, there is a great merit that it is possible to connect directly without using an elastic body reliably and electrically without being affected by heat.
[0033]
Embodiment 2
FIG. 11 shows another example of the electronic apparatus of the present invention.
This electronic device 1010 is, for example, a television receiver. A housing 1012 of the electronic device 1010 includes a display device 1020. The display device 1020 is a display device having an organic electroluminescent element (hereinafter referred to as an organic EL element), and has, for example, a large display surface. For example, the display device 1020 is a display device having a size of 75 inches or more.
The display device 1020 has an organic EL unit 1022 shown in FIG.
[0034]
FIG. 13 is an exploded perspective view showing a part of the organic EL unit 1022 of FIG. 12 in an enlarged manner. The organic EL unit 1022 has a plurality of IC (integrated circuit) substrates 1030 and one organic EL panel 1040. The organic EL panel 1040 has a front surface 1040A and a back surface 1040B in the illustrated example of FIG.
Each IC substrate 1030 has one or a plurality of driver ICs 1034. Each of these driver ICs 1034 can be electrically and mechanically connected to an electrical connection portion on the back surface 1040B side of the organic EL panel 1040 using a flexible wiring board 1050. Each IC substrate 1030 can be electrically connected to each other by another flexible substrate 1051.
The driver IC 1034 of each IC substrate 1030 can drive, for example, a large organic EL panel 1040 by dividing it into divided surfaces 1041 as indicated by broken lines.
[0035]
The reason why the organic EL panel 1040 having such a large area is divided into a plurality of divided surfaces 1041 and driven by the driver IC 1034 of the IC substrate 1030 is as follows.
That is, by driving the organic EL panel 1040 having a large area by dividing it into a plurality of dividing surfaces 1041, the length of the drive wiring from each IC substrate 1030 to the dividing surface 1041 at the corresponding position is shortened. This is because even when the display screen is enlarged, the voltage drop due to the wiring resistance can be eliminated and the display drive of the organic EL panel 1040 can be performed stably.
Then, in comparison with the case where the large-sized IC substrate 1030 is provided in accordance with the area of the organic EL panel 1040 having a large area, each of the IC substrates 1030 is divided into the divided surfaces 1041 and temporarily arranged. Even if the operation of the driver IC 1034 of the IC substrate 1030 becomes defective, it is only necessary to remove and replace the IC substrate 1030 of the corresponding section surface 1041, so that there is an advantage that the cost during maintenance can be reduced. .
[0036]
FIG. 14 and FIG. 15 show structural examples of the organic EL panel 1040. An organic EL panel 1040 shown in an enlarged scale in FIG. 15 has a display area 1060 and an electrical connection area 1070. The display area 1060 is a portion formed by a dimension D and dimensions D1, D2, D3, D4. The electrical connection region 1070 has a region formed with dimensions D5 and D6 and a region formed with dimensions D7 and D8.
An alignment mark 1064 for positioning is formed at the end of the organic EL panel 1040. The alignment mark 1064 has, for example, a square shape.
The electrical connection region 1070 has, for example, a plurality of round connection points P.
[0037]
Here, a structural example of the organic EL element 1080 of the organic EL panel 1040 will be described with reference to FIGS.
In the organic EL panel 1040, transparent electrodes 1122 serving as anodes are formed in stripes on a transparent substrate 1121, and an organic EL film 1123 composed of a hole transport layer and a light emitting layer is orthogonal to the transparent electrodes 1122. And forming the cathode 1124 on the organic EL film 1123, thereby forming the organic EL elements 1080 at positions where the transparent electrode 1122 and the cathode 1124 intersect. As shown in FIG. 15, the transparent substrate 1121 includes a display area 1060 which is a light emitting area in which these organic EL elements 1080 are arranged vertically and horizontally, and the electrical connection area 1070 described above for connecting the light emitting area to a drive circuit. Is forming.
[0038]
In such an organic EL panel 1040, an insulating layer is usually provided between the transparent electrodes 1122, thereby preventing a short circuit between the transparent electrodes 1122 and further a short circuit between the transparent electrode 1122 and the cathode 1124. Has been.
As an organic EL element configured at a position where the transparent electrode 1122 and the cathode 1124 intersect, for example, there is a single hetero type organic EL element 1080 shown in FIG.
In this organic EL element 1080, an anode made of a transparent electrode 1122 such as ITO (Indium tin oxide) is provided on a transparent substrate 1121 such as a glass substrate, and an organic EL made of a hole transport layer 1123a and a light emitting layer 1123b. A membrane 1123 and a cathode 1124 are provided.
[0039]
In the organic EL element 1080, when a positive voltage is applied to the transparent anode 1122 from the battery 1030 and a negative voltage is applied to the cathode 1124, holes injected from the transparent anode 1122 pass through the hole transport layer 1123a and the light emitting layer 1123b. The electrons injected from the cathode 1124 reach the light emitting layer 1123b, and electron-hole recombination occurs in the light emitting layer 1123b. At this time, light having a predetermined wavelength is generated and emitted from the transparent substrate 1121 side as indicated by an arrow in FIG.
[0040]
Next, an example of a cross-sectional structure of the organic EL element 1080 will be described with reference to FIG.
As the transparent substrate 1121, for example, a glass substrate or a plastic substrate can be used.
In the case of a glass substrate, for example, soda glass, non-alkali glass, quartz glass, and the like.
In the case of a plastic substrate, for example, PC (polycarbonate), fluorine PI (polyimide), PMMA (acrylic resin), PET (polyethylene terephthalate), PAR (polyarylate), PES (polyether sulfone), PEN (polyether nitrile) , Cyclo-olefin resin and the like are used.
[0041]
A gas barrier film 1140 is formed on the front and back surfaces of the transparent substrate 1121. The gas barrier film 1140 prevents the gas such as moisture and oxygen from entering the element and prevents the organic EL element 1080 from being deteriorated. It is desirable that the gas barrier film 1140 be provided with antireflection characteristics, whereby the gas barrier film 1140 suppresses reflection of the generated light on the transparent substrate 1121 to be an excellent organic EL element with high transmittance. Can do.
[0042]
An auxiliary electrode 1142 is formed on one gas barrier film 1140.
The auxiliary electrode 1142 is made of, for example, chromium and is formed in, for example, a comb shape. The auxiliary electrode 1142 is provided to reduce the resistance value.
A transparent electrode 1122 is formed on the auxiliary electrode 1142. The transparent electrode 1122 is formed, for example, in a stripe shape, is an anode, is a portion to which a positive voltage is applied, and is, for example, an ITO film (Indium tin oxide film).
[0043]
A first insulating layer 1150 is formed on the transparent electrode 1122. An organic EL film 1123 is formed on the first insulating layer 1150. The organic EL film 1123 has a multilayer structure in which a hole transport layer and a light emitting layer are stacked. A cathode (cathode electrode) 1124 is formed on the first insulating layer 1150 and the organic EL film 1123.
The first insulating layer 1150 is made of, for example, SiN, and has a gas barrier function against moisture and oxygen as well as electrical insulation. By providing this gas barrier function, the intrusion of moisture and oxygen into the element is prevented, and deterioration of the organic EL film 1123 is prevented.
[0044]
The cathode 1124 serves as the cathode of the organic EL film 1123 and is formed larger than the organic EL film 1123. The cathode 1124 is made of, for example, lithium fluoride (LiF).
A second insulating layer 1155 is formed on the first insulating layer 1150 and the cathode 1124. The second insulating layer 1155 is formed over the entire element, and is made of, for example, SiN, AlN, or the like. The second insulating layer 1155 has not only an insulating property but also a gas barrier function against moisture and oxygen, thereby preventing moisture and oxygen from entering the element and preventing the organic EL film 1123 from deteriorating. Can do.
[0045]
Openings 1180 and 1181 are formed in the second insulating layer 1155 and the first insulating layer 1150 in FIG. The openings 1180 and 1181 are provided with electrode portions 1182 and 1183 made of conductive metal, for example, Ni.
A flexible wiring board 1050 is attached on the second insulating layer 1155 with an adhesive 1160 interposed therebetween. As the flexible wiring board 1050, for example, one made of PI (polyimide) PET (polyethylene terephthalate) can be adopted.
[0046]
The adhesive 1160 is, for example, a double-sided adhesive tape that is attached to the flexible wiring board 1050. A conductive metal film 1170 is provided in the openings 1161 and 1162 of the adhesive 1160. The conductive metal film 1170 is a metal formed on the electrode portions 1182 and 1183, and for example, Au can be adopted.
The conductive metal film 1170 and the electrode portion 1182 constitute an electrode 1200. The other conductive metal film 1170 and electrode portion 1183 constitute an electrode 1201. Each electrode 1200, 1201 is located at a connection point P of the electrical connection region 1070 shown in FIG.
[0047]
The flexible wiring board 1050 has holes 1210, and these holes 1210 are formed by surrounding portions 1214. In this peripheral portion 1214, a conductive connection portion 1220 is formed in advance. For example, Cu can be used for the conductive connection portion 1220. The conductive connection portion 1220 is electrically connected to the conductor pattern 1230 of the flexible wiring board 1050.
[0048]
In such an organic EL element 1080 or the organic EL panel 1040, when a current is applied between the transparent electrode 1122 serving as an anode and the cathode 1124 serving as a cathode electrode, holes injected from the cathode 1124 are converted into organic EL. While reaching the light emitting layer through the hole transport layer of the film, electrons injected from the transparent electrode 1122 reach the light emitting layer of the organic EL film 1123. Therefore, electron-hole recombination occurs in the light emitting layer.
At this time, light having a predetermined wavelength is generated, and this light L is emitted from the transparent substrate 1121 to the outside.
Note that the material of the conductive metal film 1170 is not limited to Au, and solder, Cu, or the like may be employed. Of course, it may be Au plating with Ni underlayer or the like.
In addition to Cu, Ag, carbon, or the like can be used as the material of the conductive connection portion 1220.
[0049]
FIG. 19 shows a portion 990 in the cross-sectional structure of FIG. FIG. 19 shows the vicinity of the hole 1210 of the flexible wiring board 1050 and the laminate 995.
Although the stacked body 995 is simplified in illustration, an electrode 1200 is provided on the stacked body 995. The electrode 1200 is a laminate of a conductive metal film 1170 and an electrode portion 1182 (or electrode portion 1183) which is a Ni base. The conductive metal film 1170 is made of Au, for example, and is formed on the electrode portion 1182 that is the Ni base.
A transparent substrate 1121 of the stacked body 995 shown in FIG. 18 is mounted on the fixed base 400.
[0050]
The flexible wiring board 1050 has a base film 1151, and this base film 1151 is made of, for example, PI (polyimide). Cu plating 1530 is formed in the vicinity of the through hole (hole) 1210 of the base film 1151 and the Cu wiring pattern 1230. An Au plating 1570 is formed on the Cu plating 1530 via a Ni base 1550.
The Au plating 1570, the Ni base 1550, and the Cu plating 1530 constitute an electrical connection portion 1142. The electrical connection portion 1142 corresponds to the conductor portion of the first member. The flexible wiring board 1050 corresponds to a first member. On the other hand, the laminated body 995 corresponds to a second member. The electrical connection portion 1142 of the flexible wiring board 1050 and the electrode 1200 or the electrode 1201 constitute an electrical connection device 1600.
[0051]
In the embodiment of FIG. 19, the Ni base 1550 may or may not be provided under the Au plating 1570. Similarly, the Ni base 1182 of the conductive metal film 1170 may or may not be provided.
The electrical connection device 1600 can be reliably and easily connected to the electrical connection method shown in FIG. 6 or the electrical connection method shown in FIG. 7 without using solder and applying heat at room temperature.
[0052]
By applying either the electrical connection method of FIG. 6 or the electrical connection method of FIG. 7 to the connection of the electrical connection device 1600, the use of a conventionally used elastic member such as ACF becomes unnecessary, and the number of parts is reduced. It can be reduced and the size can be reduced.
[0053]
By the way, as an example of the electronic apparatus of the present invention, an organic EL element and a mobile phone are given as examples. It includes a camera, a notebook personal computer, a portable game machine, and the like.
In the embodiment of FIG. 10, the Cu bumps 530B may be provided on the electrode extraction portions 50 and 52 side of the battery body.
[0054]
22, 23 and 24 show another embodiment of the present invention.
FIG. 22 shows a modification of the embodiment of FIG. 8, in which the corrugated portion 53 </ b> A is formed in the electrode extraction portions 50 and 52, and the corrugated portion 420 </ b> F is also formed in the pressing portion 420. The structure of the substrate 36 is the same as in FIG.
23, the land 51R is provided on the substrate, the corrugated portion 420F is formed in the pressing portion 420, and the corrugated portion 53A is formed in the electrode extraction portions 50 and 52. 22 and 23, the waveform portion 420F and the waveform portion 53A have corresponding shapes.
FIG. 24 is a modified example of FIG. 10, and the Cu bump 530B is formed in the through hole 36H and the conductor portion 510A of the substrate 36.
[0055]
According to the embodiment of the present invention, since the electrical connection device is configured by ultrasonic vibration, bonding is possible at room temperature, and the surface is activated by irradiating the plasma with a plasma irradiator to electrically Connection reliability can be improved. Since electrical connection can be performed at room temperature, heat is not transmitted to, for example, the battery body or the organic EL element itself, and there is no fear of failure due to heat.
Since the electrical connection can be performed without interposing an elastic member such as an ACF or a tab, the electrical connection reliability can be improved, and the number of parts is reduced, so that space saving such as downsizing and thinning can be achieved.
Since the electrical connection is performed using the ultrasonic vibration, it is possible to remove it by applying the ultrasonic vibration again after being connected once, to replace it with another one, and to connect again.
[0056]
【The invention's effect】
As described above, according to the present invention, the conductor portion of the first member and the second member in the electronic device can be electrically and reliably connected without being damaged by heat.
[Brief description of the drawings]
FIG. 1 is a front view showing a mobile phone which is an example of an electronic apparatus according to the invention.
FIG. 2 is a rear view of the mobile phone of FIG.
3 is an exploded perspective view of a battery of the mobile phone of FIG. 1. FIG.
4 is an enlarged view of an exploded perspective view of the battery of FIG. 3. FIG.
FIG. 5 is a diagram showing a battery body.
FIG. 6 is a diagram showing an ultrasonic vibration welding apparatus and an electrical connection apparatus for realizing the electrical connection method of the present invention.
FIG. 7 is a view showing a plasma irradiator and an ultrasonic vibration welding apparatus for realizing another electrical connection method of the present invention.
FIG. 8 is a view showing another embodiment of the electrical connecting apparatus of the present invention.
FIG. 9 is a view showing still another embodiment of the electrical connecting apparatus of the present invention.
FIG. 10 is a view showing still another embodiment of the electrical connecting apparatus of the present invention.
FIG. 11 is a perspective view showing a display device which is another example of the electronic apparatus of the invention.
12 is a perspective view showing an organic EL unit of the display device of FIG.
FIG. 13 is a perspective view illustrating a configuration example of an organic EL unit.
FIG. 14 is a perspective view showing an organic EL panel.
FIG. 15 is a plan view showing an organic EL panel.
FIG. 16 is a perspective view showing a structural example of an organic EL panel.
FIGS. 17A and 17B are a plan view and an operation example of an organic EL panel. FIGS.
FIG. 18 is a cross-sectional view showing an example of electrical bonding between an organic EL panel and a flexible wiring board.
19 is a diagram showing an electrical connection method for electrically connecting the electrical connection device composed of the laminate of FIG. 18 and a flexible wiring board using an ultrasonic vibration welding apparatus.
FIG. 20 is a front view showing a specific example of an ultrasonic vibration welding apparatus.
FIG. 21 is a side view showing a specific example of an ultrasonic vibration welding apparatus.
FIG. 22 shows another embodiment of the present invention.
FIG. 23 is a diagram showing still another embodiment of the present invention.
FIG. 24 is a diagram showing still another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Mobile phone (electronic device), 36 ... Board | substrate (1st member), 42, 44 ... Electrical connection part (conductor part of 1st member), 50, 52 ... Electrode extraction part ( Second member), 410 ... ultrasonic vibration welding device, 600 ... electrical connection device

Claims (8)

A protruding surface protruding from the main surface of the substrate of the substrate having a through hole and a conductor portion protruding above the through hole and the electrode are welded by ultrasonic vibration welding, electrical connection how to electrically connect the substrate and the electrode. Wherein the through holes, electrical connection method according to claim 1 which bumps are formed. The conductor portion of the substrate is formed of Cu, the electrode, the electrical connection method according to claim 1 that is formed by Ni or Al. The conductor portion of the substrate is formed of Au, the electrode is an electrode of a glass substrate, the electrodes of the glass substrate, the electrical connection method according to claim 1, which is formed by Au. Wherein the Au substrate is formed on the Ni underlayer, the Au of the glass substrate of the electrode, the electrical connection method according to claim 4 which is formed on the Ni substrate. The conductor portion and the electrode are activated by plasma treatment before the conductor portion and the electrode formed on the substrate are welded and electrically connected by ultrasonic vibration welding. Electrical connection method. A substrate having a through hole and a conductor portion provided protruding from the through hole;
An electrical connection device comprising: an electrode that is welded by ultrasonic vibration welding to a protruding surface that protrudes from a main surface of the substrate of the conductor portion, and is electrically connected to the substrate . A substrate having a through-hole and having a conductor portion protruding from the through-hole, and a protruding surface of the conductor portion protruding from the main surface of the substrate by welding by ultrasonic vibration welding, An electronic device having an electrical connection device including an electrode to be electrically connected .

Images