JP4731524B2 - Equipment - Google Patents

Description

  The present invention relates to a profile device that automatically performs a profile operation between two members.

  Conventionally, when assembling industrial products, etc., gripping devices that handle parts according to their shapes have been used. For example, workpieces with surfaces that are inclined with respect to the suction pad can be reliably sucked and held without changing the posture. A suction holding device has been proposed (see, for example, Patent Document 1).

On the other hand, when assembling a power system control amplifier (for example, an inverter amplifier), when attaching the chassis to the power module, the worker moves the chassis and power module coated with heat-dissipating grease by his / her own hands. It was positioned and fixed after wandering. In other words, after heat-dissipating grease is screen-printed on the chassis, the assembly surface of the chassis and the assembly surface of the power module are pasted together, and the operator manually scrubs the chassis and power module so that these surfaces are aligned. After positioning by hand, it was positioned and fixed.
JP 2004-202690 A

  However, according to the above-described conventional technique, after scrubbing to some extent and hand-manipulating, they are peeled off, visually confirming the spread state of the heat dissipating grease, and manually scrubbing again. And by repeating this, the chassis and the power module were manually arranged. For this reason, a uniform stress is not applied to the chassis and the power module, and the heat radiation grease does not spread uniformly on the assembly surface of the chassis and the assembly surface of the power module. In this case, the degree of adhesion between the chassis and the power module does not increase.

  A chip is mounted in the power module, and the chip generates heat when driven. If the adhesion between the chassis and the power module is low and there is no heat dissipation grease at the position corresponding to the chip on the power module assembly surface, the heat generated by the chip in the power module can be efficiently released to the chassis. However, there was a problem that the power module substrate was broken (cracked) due to thermal stress.

  In addition, when manually allocating the chassis and power module, there are individual differences depending on the person performing the work, and even individual workers have individual differences for each work, so there is uniform heat dissipation characteristics without individual differences. It was not possible to manufacture a power control amplifier having In addition, the follow-up work by the manual scrubbing operation is time-consuming work.

  The present invention has been made in view of the above, and for example, two members such as a chassis and a power module have good adhesion with an adhesive sandwiched between the assembly surfaces of the two members. An object is to obtain a tracing device that can be automatically adjusted and has a simple configuration.

  In order to solve the above-described problems and achieve the object, the profile device according to the present invention automatically performs profile operation with an adhesive sandwiched between the assembly surface of the first member and the assembly surface of the second member. A base substrate having a substantially horizontal upper surface, a holding means that is spaced apart upward from the upper surface of the base substrate, and is disposed above the holding means. A gripping means for gripping the second member in correspondence with a position where the first member is held, and a gripping means disposed on the base substrate and performing the following operation, the gripping means being substantially vertical and substantially horizontal with the top surface of the base substrate. A support means for supporting movement in a direction, and a vertical movement means arranged on the base substrate and moving the gripping means in a substantially vertical direction with respect to the upper surface of the base substrate, and separating the gripping means from each other when performing a tracing operation. In the state where the second member is placed on the mounting surface of the first member by the vertical movement means so that the adhesive is sandwiched between the assembly surface of the second member and the mounting surface of the first member, Vibrating means that vibrates in a substantially horizontal direction and performs an operation following the assembly surface of the first member and the assembly surface of the second member is provided.

  According to the present invention, the scrubbing operation can be automatically performed in a state where the adhesive is sandwiched between the assembly surface of the first member and the assembly surface of the second member. There is an effect that the assembled surfaces of the two members can be automatically and efficiently aligned with each other with good adhesion.

  For example, when the first member is a chassis, the second member is a power module, and the adhesive is heat dissipating grease, uniform stress is applied to the chassis and the power module by mechanically automatically changing in this way. The heat dissipating grease is spread evenly on the assembly surface of the chassis and the assembly surface of the power module, and the heat dissipating grease is surely placed at the position corresponding to the chip on the assembly surface of the power module. It can arrange | position and there exists an effect that the adhesiveness of the assembly surface of a chassis and the assembly surface of a power module can be improved.

  By improving the adhesion between the assembly surface of the chassis and the assembly surface of the power module, the heat generated by the chip in the power module can be efficiently released to the chassis, and the power module board is destroyed by thermal stress. There is an effect that a high-quality inverter amplifier in which (cracks) are prevented can be manufactured. In addition, by automatically mechanically arranging, there is an effect that an inverter amplifier having a uniform heat dissipation characteristic without individual differences as in manual work can be efficiently manufactured.

  Embodiments of the apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably.

Embodiment FIGS. 1-1 to 1-3 are diagrams showing a schematic configuration of an apparatus according to an embodiment of the present invention. FIG. 1-1 is a top view, and FIG. The side view seen from the direction of arrow A in FIG. 1-3 is a side view seen from the direction of arrow B in FIG. 1-1.

  The apparatus according to the present embodiment makes the assembly surface of the chassis (first member) 1 and the assembly surface of the power module (second member) 3 uniform when assembling an inverter amplifier that is a power control amplifier. It is a device that automatically performs a profile operation. Specifically, when assembling the inverter amplifier as shown in FIG. 1-4, the heat dissipating grease 5 as an adhesive is sandwiched between the assembly surface 1 a of the chassis 1 and the assembly surface 3 a of the power module 3. By performing the scrubbing operation, the assembly surface 3a of the power module 3 and the assembly surface 1a of the chassis 1 are made to coincide.

  Such a tracing apparatus according to the present embodiment includes a base substrate 11, a holding unit 13, a gripping unit 15, a support unit 17, a vertical direction moving unit 19, and a vibrating unit 21. The base substrate 11 has a substantially horizontal upper surface, and is a base substrate for supporting the power module 3, the grip portion 15, the support portion 17, and the vertical direction moving portion 19. The holding unit 13 is arranged at a predetermined position in a state of being separated upward from the upper surface of the base substrate 11 by a moving mechanism (not shown), for example, and holds the chassis 1 fixedly. The holding unit 13 may be fixed at a predetermined position.

  The holding part 15 is arranged further above the holding part 13 in the upper part of the base substrate 11, and holds the power module 3 corresponding to the position where the chassis 1 is held in the upper part of the base board 11. The gripping part 15 includes a gripping part 15a and a gripping part 15b that have a substantially U-shape. The gripping part 15a and the gripping part 15b are connected by two cylinder parts 15e provided on the inner wall part of the gripping part 15a. Further, a gripping portion 15a, a gripping portion 15b, and an inner wall portion are provided with a support chuck 15c and a support chuck 15d, respectively. By inserting the power module 3 between the support chuck 15c and the support chuck 15d, Hold module 3. Further, the gripping portion 15a and the gripping portion 15b are connected by a rail guide 15f.

  When gripping the power module 3, first, the two cylinder portions 15e are extended in the Y direction as shown in FIG. 1-1 to widen the space between the grip portions 15a and 15b. A groove 3b for chucking is provided on the side surface on the chucking side of the power module 3 in accordance with the positions of the support chuck 15c and the support chuck 15d. The support chuck 15c and the support chuck 15d are aligned and positioned in the chucking groove 3b, and the two cylinder parts 15e are contracted in the Y direction as shown in FIG. Grab.

  For example, one support portion 17 is disposed at each of four corners on the base substrate 11, and supports the grip portion 15 so as to be movable in a substantially vertical direction and a substantially horizontal direction with respect to the upper surface of the base substrate 11. However, the basic position of the support portion 17 is set in advance, and the amount of movement in the substantially vertical direction and the substantially horizontal direction is set in advance so as to be regulated to the amount of movement of the power module 3 in the follow-up operation. That is, the support portion 17 is given a degree of freedom to move in a substantially vertical direction and a substantially horizontal direction by a predetermined amount in advance.

  For example, as shown in FIG. 2, the support portion 17 is a linear guide including a substantially cylindrical linear bush 17a and a substantially cylindrical linear shaft 17b having a substantially cylindrical hollow portion for allowing the linear bush 17a to pass therethrough. The grip portion 15 can be moved in a substantially horizontal direction by providing a wider gap 17d between the linear bush 17a and the linear shaft 17b.

  Further, the linear shaft 17b penetrates to the lower part of the base substrate 11, and has a stopper 17c at the tip so as not to come off from the base substrate 11. In addition, although the case where four linear guides are used as the support part 17 is described here, the number of linear guides is not particularly limited as long as the number of linear guides is three or more and the function as the support part 17 can be exhibited. .

  The vertical direction moving unit 19 is disposed on the base substrate 11 and moves the gripping unit 15 in a direction substantially perpendicular to the upper surface of the base substrate 11 (Z direction). The vertical movement part 19 is a cylinder, for example, and a stopper 19b is provided at the upper end of the piston part 19a. The stopper 19b is provided to prevent the piston portion 19a from being detached from the float member 19c provided at the end of the piston portion 19a with the grip portions 15a and 15b, and the grip portions 15a and 15b from being detached.

  The height of the vertical movement unit 19 includes, for example, a position where the gripping unit 15 grips the power module 3 before the leveling operation (see FIG. 3A) and a position where the leveling operation is performed (see FIG. 3-2). ) And a position (see FIG. 3C) where the grip 15 with the power module 3 removed is lifted after the leveling operation of the grip 15 that grips the power module 3.

  The vibration unit 21 is a vibration unit that performs a scrub operation by vibrating the base substrate 11 in a substantially horizontal direction. The scrubbing operation is performed in a state where the assembly surface 3a of the power module 3 is placed on the mounting surface 1a of the chassis 1 with the heat dissipating grease interposed therebetween by the vertical movement unit 19. As a result, the mounting surface 1a of the chassis 1 and the assembly surface 3a of the power module 3 can be aligned.

  Next, the operation of the apparatus according to the present embodiment configured as described above will be described. First, as shown in FIG. 1-1, first, the two cylinder portions 15e are extended in the Y direction to widen the space between the grip portion 15a and the grip portion 15b, and the support chuck 15c and the support chuck are inserted into the chucking groove of the power module 3. The power module 3 is gripped by the gripping portion 15 by positioning together with 15d and contracting the two cylinder portions 15e in the Y direction as shown in FIG.

  Next, the gripping part 15 is moved upward (retracted) using the cylinder which is the vertical movement part 19. Next, the holding part 13 which fixedly holds the chassis 1 is moved according to the position of the power module 3 held by the holding part 15 by, for example, a moving mechanism (not shown). Here, on the mounting surface 1a of the chassis 1, for example, as shown in FIG. 4, heat radiation grease 5 is applied in a plurality of lines by a dispenser or the like.

  Next, the cylinder which is the vertical direction moving part 19 is lowered and the gripping part 15 is moved downward to place the assembly surface 3 a of the power module 3 on the mounting surface 1 a of the chassis 1. That is, the heat release grease is sandwiched between the assembly surface 3 a of the power module 3 and the mounting surface 1 a of the chassis 1. At this time, even after the power module 3 is placed on the mounting surface 1a of the chassis 1, the cylinder is lowered by a predetermined amount. The influence of the cylinder on the power module 3 (gripping part 15) is eliminated, and only the weight of the power module 3 and the weight of the gripping part 15 are applied to the chassis 1. And only the own weight of the power module 3 and the own weight of the holding part 15 are applied also to the support part 17.

  In this state, the entire base substrate 11 is vibrated in a substantially horizontal direction (X direction) by the vibration unit 21 to perform a scrub operation. The power module 3 moves in a substantially vertical direction and a substantially horizontal direction within a range of degrees of freedom given in advance by the weight of the power module 3 and the gripping part 15 and the vibration of the scrubbing operation. Follow the chassis 1. In the case of the linear guide described above, the linear shaft 17b moves in a substantially vertical direction and a substantially horizontal direction within the range of the gap 17d between the linear bush 17a and the linear shaft 17b. It will be.

  By the scrubbing operation described above, the mounting surface 1a of the chassis 1 and the assembly surface 3a of the power module 3 can be made to be in a state of sandwiching heat radiation grease.

  According to the tracing apparatus according to the present embodiment as described above, the scrubbing operation is automatically performed with the heat dissipating grease 5 sandwiched between the assembly surface 1a of the chassis 1 and the assembly surface 3a of the power module 3. The assembly surface 1a of the chassis 1 and the assembly surface 3a of the power module 3 can be automatically and efficiently aligned with good adhesion.

  By mechanically and automatically arranging in this way, it is possible to execute a leveling operation by applying uniform stress to the chassis and the power module, and heat dissipation grease is applied to the assembly surface 1a of the chassis and the assembly surface 3a of the power module. The heat spreader grease can be surely disposed at the position corresponding to the chip on the assembly surface 3a of the power module, and the degree of adhesion between the assembly surface 1a of the chassis and the assembly surface 3a of the power module can be improved. it can.

  Further, by improving the adhesion between the assembly surface 1a of the chassis and the assembly surface 3a of the power module, the heat generated by the chip in the power module can be efficiently released to the chassis, and the substrate of the power module 3 is heated. It is possible to manufacture a high-quality inverter amplifier in which breakage (crack) due to stress is prevented.

  In addition, according to the tracing apparatus according to the present embodiment, it is possible to efficiently produce an inverter amplifier having uniform heat dissipation characteristics without individual differences as in the case of manual work by performing automatic mechanical sorting. Can do.

  As shown in FIG. 5, the holding unit 13 has a disk shape capable of fixing a plurality of chassis 1, and the disk-shaped holding unit 13 is rotated after the completion of the tracing operation of one chassis 1. By arranging the chassis 1 in a predetermined position, a plurality of leveling operations can be efficiently performed.

  As described above, the profiler according to the present invention automatically arranges the assembly surfaces of these two members with good adhesion with the adhesive sandwiched between the assembly surfaces of the two members. Useful for.

It is a top view which shows schematic structure of the tracing apparatus concerning embodiment of this invention. It is a figure which shows schematic structure of the tracing apparatus concerning embodiment of this invention, and is the side view seen from the direction of arrow A in FIGS. 1-1. It is a figure which shows schematic structure of the tracing apparatus concerning embodiment of this invention, and is the side view seen from the direction of arrow B in FIGS. 1-1. It is a figure which shows an example of the inverter amplifier assembled by performing a follow-up operation | movement with the follow-up apparatus concerning embodiment of this invention. It is sectional drawing for demonstrating an example of a structure of the linear guide which is a support part of the tracing apparatus concerning embodiment of this invention. It is a side view for demonstrating an example of the height position of the vertical direction moving part concerning embodiment of this invention. It is a side view for demonstrating an example of the height position of the vertical direction moving part concerning embodiment of this invention. It is a side view for demonstrating an example of the height position of the vertical direction moving part concerning embodiment of this invention. It is a top view for demonstrating the state which apply | coated several linear heat dissipation grease on the attachment surface of the chassis. It is a figure which shows an example of the shape of a holding | maintenance part, and is a figure which shows a disk shaped holding | maintenance part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chassis 3 Power module 3a Assembly surface 3b Chucking groove 5 Radiation grease 11 Base board 13 Holding part 15 Holding part 15a Holding part 15b Holding part 15c Support chuck 15d Support chuck 15e Cylinder part 15f Rail guide 17 Support part 17a Linear bush 17b Linear Shaft 17c Stopper 17d Clearance 19 Vertical movement part 19a Piston part 19b Stopper 19c Float member 21 Vibration part

Claims (4)

An apparatus for performing a profiling operation automatically with an adhesive sandwiched between an assembly surface of the first member and an assembly surface of the second member,
A base substrate having a substantially horizontal upper surface;
A holding means that is arranged spaced apart upward from the upper surface of the base substrate and holds the first member;
A gripping means disposed above the holding means and gripping the second member in correspondence with a position where the first member is held;
A support means disposed on the base substrate and supporting the gripping means so as to be movable in a substantially vertical direction and a substantially horizontal direction with respect to the upper surface of the base substrate when performing a follow-up operation;
A vertical movement means disposed on the base substrate and moving the gripping means in a substantially vertical direction with respect to the upper surface of the base substrate and performing a follow operation;
The base substrate is placed in a state where the second member is placed on the attachment surface of the first member so that the adhesive is sandwiched between the assembly surface of the second member and the attachment surface of the first member. Vibration means for vibrating in a substantially horizontal direction and performing an operation following the assembly surface of the first member and the assembly surface of the second member;
A profiler characterized by comprising: The first member is a chassis, the second member is a power module, and the adhesive is heat dissipation grease;
The profiling device according to claim 1. The support means is a linear guide including a linear bush provided on the base substrate and a linear shaft partially inserted into the linear bush and connected to the gripping means, and the linear shaft is the base substrate. Having a gap between the linear bush and the linear shaft that gives a degree of freedom to move in a substantially vertical direction and a substantially horizontal direction with respect to the upper surface of
The profiling device according to claim 1. The stress applied to the first member during vibration by the vibration means is the weight of the second member and the weight of the gripping means;
The profiling device according to claim 1.

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