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JP4960984B2 - Display device - Google Patents

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JP4960984B2
JP4960984B2 JP2009073009A JP2009073009A JP4960984B2 JP 4960984 B2 JP4960984 B2 JP 4960984B2 JP 2009073009 A JP2009073009 A JP 2009073009A JP 2009073009 A JP2009073009 A JP 2009073009A JP 4960984 B2 JP4960984 B2 JP 4960984B2
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wiring film
film
electrode wiring
sustain electrode
scan electrode
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JP2010225481A (en
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悟 高澤
暁 石橋
忠 増田
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Ulvac Inc
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Ulvac Inc
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Description

本発明は、ＰＤＰの表示装置に関する。   The present invention relates to a display device for a PDP.

従来より、ＰＤＰやＬＣＤ等のブラックマトリクスには、Ｃｒ酸化物と、金属Ｃｒ膜の積層膜が用いられている。しかし、Ｃｒは環境に悪影響を与える有害物質であるから、Ｃｒ以外の材料の使用が求められている。
表示装置のうち、例えばＰＤＰは放電により発光する際、ブラックマトリクスが高温に加熱される。このような装置では、熱に弱い樹脂材料は使用できない。
Ｃｒ以外の金属材料としては、例えば、銅酸化物（又は銅合金酸化物）の膜の上に銅膜を積層した積層膜でも、ブラックマトリクスの効果は得られる。
しかし、表示装置の製造工程では、ブラックマトリクス形成後、加熱処理を行なう場合があり、その加熱処理で下層の銅酸化物は、酸素が上層の銅膜に拡散し、還元されてしまう。銅酸化物膜が還元されると黒色から銅色（茶色）に変色して遮光性が劣化する上、ガラス基板への密着性が低くなり、ブラックマトリクスが基板から剥がれやすくなる。 Conventionally, a laminated film of a Cr oxide and a metal Cr film is used for a black matrix such as PDP or LCD. However, since Cr is a harmful substance that adversely affects the environment, the use of materials other than Cr is required.
Among the display devices, for example, when a PDP emits light by discharge, the black matrix is heated to a high temperature. In such an apparatus, a heat-sensitive resin material cannot be used.
As a metal material other than Cr, for example, a black film effect can be obtained even in a laminated film in which a copper film is laminated on a copper oxide (or copper alloy oxide) film.
However, in the manufacturing process of the display device, heat treatment may be performed after the black matrix is formed, and oxygen is diffused into the upper copper film and reduced in the lower copper oxide by the heat treatment. When the copper oxide film is reduced, the color changes from black to copper (brown) and the light shielding property is deteriorated. Further, the adhesion to the glass substrate is lowered, and the black matrix is easily peeled off from the substrate.

特開平１１−３５２３１０号公報JP-A-11-352310 特開平２０００−２５１７４４号公報Japanese Unexamined Patent Publication No. 2000-251744 特開平２００４−３９５７５号公報Japanese Patent Laid-Open No. 2004-39575 特開平２００４−６３２４７号公報JP-A-2004-63247

本発明は上記課題を解決するためになされたものであり、その目的は環境に悪影響を与えずに、密着性と遮光性に優れたブラックマトリックスと低抵抗である電極の両方の特性を合わせもつ技術を提供するものである。   The present invention has been made to solve the above-mentioned problems, and its purpose is to combine the characteristics of both a black matrix excellent in adhesion and light shielding properties and an electrode having low resistance without adversely affecting the environment. Provide technology.

上記課題を解決するために本発明は表示装置であって、それぞれ細長に形成され、第一の基板本体上に複数本平行に交互に配置された走査電極用配線膜と維持電極用配線膜と、前記走査電極用配線膜と前記維持電極用配線膜の間に配置され、前記走査電極用配線膜と前記維持電極用配線膜にそれぞれ電気的に接続された透明な走査電極膜と透明な維持電極膜の一対から成る画素電極とが設けられた第一のパネルと、前記第一のパネルに対して平行にされた第二の基板本体上に、前記走査電極用配線膜と前記維持電極用配線膜とが延びる方向とは交叉する方向に延びる互いに離間した複数の隔壁と、隣接する前記隔壁間に位置する蛍光体とが設けられた第二のパネルと、を有するＰＤＰ表示装置であって、前記走査電極用配線膜と前記維持電極用配線膜は、ニッケル又はＦｅのいずれか一方を主成分とする金属酸化物を主成分とし、前記第一の基板本体の表面に接触して配置された密着層と、銅又はアルミニウムのいずれか一方を主成分とし、前記密着層の表面に接触して配置された金属層とを有し、前記第一、第二のパネル間には放電ガスが配置され、前記走査電極用配線膜と前記維持電極用配線膜との間に生じた放電によって前記放電ガスがプラズマ化され、発生した紫外線で前記蛍光体が発光するＰＤＰ表示装置である。
また、本発明は、前記画素電極の片側に位置する前記走査電極用配線膜と、反対側に位置する前記維持電極用配線膜から、前記画素電極と前記画素電極の間に、前記密着層と前記金属層とを有する走査電極用補助配線膜と維持電極用補助配線膜がそれぞれ、互いに非接触の状態で延ばされたＰＤＰ表示装置である。
また、本発明は、前記走査電極用配線膜と前記維持電極用配線膜はブラックマトリクスを形成するＰＤＰ表示装置である。 In order to solve the above problems, the present invention is a display device, each of which is formed in an elongated shape, and a plurality of scan electrode wiring films and sustain electrode wiring films alternately arranged in parallel on the first substrate body, A transparent scanning electrode film disposed between the scanning electrode wiring film and the sustaining electrode wiring film and electrically connected to the scanning electrode wiring film and the sustaining electrode wiring film, respectively; On the first panel provided with a pixel electrode composed of a pair of electrode films, and on the second substrate body parallel to the first panel, the wiring film for the scan electrode and the sustain electrode A PDP display device comprising: a plurality of spaced apart partition walls extending in a direction intersecting with a direction in which a wiring film extends; and a second panel provided with a phosphor positioned between the adjacent partition walls. The scan electrode wiring film and the sustain electrode The wiring film is mainly composed of a metal oxide mainly composed of either nickel or Fe, and has an adhesion layer disposed in contact with the surface of the first substrate body and either one of copper or aluminum. And a metal layer disposed in contact with the surface of the adhesion layer, a discharge gas is disposed between the first and second panels, and the scan electrode wiring film and the sustain layer In the PDP display device, the discharge gas is turned into plasma by the discharge generated between the electrode wiring film and the phosphor emits light by the generated ultraviolet rays.
In addition, the present invention provides an adhesive layer between the pixel electrode and the pixel electrode from the scan electrode wiring film located on one side of the pixel electrode and the sustain electrode wiring film located on the opposite side. Each of the scan electrode auxiliary wiring film and the sustain electrode auxiliary wiring film having the metal layer is a PDP display device extended in a non-contact state.
The present invention is the PDP display device in which the scan electrode wiring film and the sustain electrode wiring film form a black matrix.

本発明は表示装置であって、密着層と金属層の積層膜は、密着層側からも金属層側からも黒色のブラックマトリクスに見える。
ガラス基板の表面にニッケル酸化物膜（膜厚５０ｎｍ）を形成し、ニッケル酸化物膜の透過率を求め、更に、ニッケル酸化物膜の表面に銅膜（膜厚３００ｎｍ）を成膜して、反射率を求めた。
図５の符号Ｌnはニッケル酸化物膜の透過率と波長との関係を示す曲線であり、ニッケル酸化物膜は可視領域の広い範囲で透過率が低く、遮光性が高いことが分かる。従って、密着層は遮光部材として機能する。
図６の符号Ｌcは銅膜単層の場合の反射率を示し、同図の符号Ｌcnは銅膜とニッケル酸化物膜の積層膜の反射率をそれぞれ示す。銅膜単層だと反射率は高いが、銅膜とニッケル酸化物膜を積層すれば、各界面で反射光が減衰され、反射率が低下することが分かる。
本発明の表示装置は、ニッケル酸化物を主成分とする密着層と、銅を主成分とするバス電極が積層され、ブラックマトリックスが形成されているから、ブラックマトリックスは遮光性と反射防止性の両方に優れている。 The present invention is a display device, and a laminated film of an adhesion layer and a metal layer appears as a black black matrix from both the adhesion layer side and the metal layer side.
A nickel oxide film (film thickness 50 nm) is formed on the surface of the glass substrate, the transmittance of the nickel oxide film is obtained, and a copper film (film thickness 300 nm) is further formed on the surface of the nickel oxide film, The reflectance was determined.
The symbol L n in FIG. 5 is a curve showing the relationship between the transmittance and wavelength of the nickel oxide film, and it can be seen that the nickel oxide film has a low transmittance and a high light shielding property in a wide range of the visible region. Therefore, the adhesion layer functions as a light shielding member.
The symbol L c in FIG. 6 indicates the reflectance in the case of a copper film single layer, and the symbol L cn in FIG. 6 indicates the reflectance of the laminated film of the copper film and the nickel oxide film, respectively. When the copper film is a single layer, the reflectance is high. However, if the copper film and the nickel oxide film are laminated, the reflected light is attenuated at each interface, and the reflectance is lowered.
In the display device of the present invention, since the adhesion layer mainly composed of nickel oxide and the bus electrode mainly composed of copper are laminated and the black matrix is formed, the black matrix is light-shielding and anti-reflective. Both are excellent.

ブラックマトリックスにＣｒを用いないから環境に悪影響を与えない。
密着層は基板本体に対する密着性が高いから、ブラックマトリックスが剥離し難い。走査電極用配線膜と維持電極用配線膜はブラックマトリックスの機能を兼ね備えるから、ブラックマトリックスと配線膜を別々に形成する場合に比べて、製造工程を簡略でき、画素間隔を短縮したＰＤＰを形成できる。
製造工程でブラックマトリックスが加熱されても、金属酸化物は還元されず、遮光性と密着性が劣化しない。 Since Cr is not used in the black matrix, the environment is not adversely affected.
Since the adhesion layer has high adhesion to the substrate body, the black matrix is difficult to peel off. Since the scan electrode wiring film and the sustain electrode wiring film have the function of a black matrix, the manufacturing process can be simplified and a PDP with a reduced pixel interval can be formed compared to the case where the black matrix and the wiring film are formed separately. .
Even when the black matrix is heated in the manufacturing process, the metal oxide is not reduced, and the light-shielding property and adhesion are not deteriorated.

ＰＤＰの断面図Cross section of PDP 第一の基板の模式的な平面図Schematic plan view of the first substrate ＰＤＰの模式的な斜視図Schematic perspective view of PDP （ａ）〜（ｃ）：第一の基板の製造工程図(A)-(c): Manufacturing process diagram of first substrate ニッケル酸化物膜に対する波長と透過率の関係を示すグラフGraph showing the relationship between wavelength and transmittance for nickel oxide films 銅膜及び積層膜に対する波長と反射率の関係を示すグラフGraph showing the relationship between wavelength and reflectance for copper films and laminated films

図１の符号１は本発明の表示装置の一例であるＰＤＰ（プラズマディスプレイパネル）の断面図を示しており、図２は、平面図を示している。図１は図２のＡ−Ａ切断線断面図と、後述する図３のＢ−Ｂ線切断線断面図に相当する。
ＰＤＰ１は第一、第二のパネル１０、２０を有しており、第一、第二のパネル１０、２０は、板状の第一、第二の基板本体１１、２１をそれぞれ有している。 Reference numeral 1 in FIG. 1 shows a sectional view of a plasma display panel (PDP) as an example of the display device of the present invention, and FIG. 2 shows a plan view. 1 corresponds to a cross-sectional view taken along a line AA in FIG. 2 and a cross-sectional view taken along a line BB in FIG. 3 to be described later.
The PDP 1 has first and second panels 10 and 20, and the first and second panels 10 and 20 have plate-like first and second substrate bodies 11 and 21, respectively. .

＜平面形状＞
第一、第二の基板本体１１、２１は、互いに対向して配置されており、第一の基板本体１１の両面のうちの第二の基板本体２１に対面する面には、所定形状(ここでは四角形)の走査電極膜１５ａと、走査電極膜１５ａと同形状で走査電極膜１５ａとは絶縁された維持電極膜１５ｂとが複数個ずつ配置されている。
走査電極膜１５ａは、第一の基板本体１１上で複数個が一列に並べられており、その並べられた列は複数本が互いに平行に配置されている。また、維持電極膜１５ｂは、走査電極膜１５ａと同様に、複数個が一列に並べられ、その列が、複数本互いに平行に配置されている。
走査電極膜１５ａが並べられた列と、維持電極膜１５ｂが並べられた列は互いに平行に交互に配置されており、交互に配置された走査電極膜１５ａの列と維持電極膜１５ｂの列の間隔は、長距離と短距離を交互に繰り返すように配置されている。
短距離で隣接する走査電極膜１５ａの列中と維持電極膜１５ｂの列中では、走査電極膜１５ａと維持電極膜１５ｂとが一個ずつ隣接し、一対の走査電極膜１５ａと維持電極膜１５ｂとから成る画素電極３５を構成しており、画素電極３５を構成する走査電極膜１５ａと維持電極膜１５ｂの間に電圧を印加すると、後述するように、その間に放電が発生するようにされている。
長距離で隣接する走査電極膜１５ａの列と維持電極膜１５ｂの列の間には、走査電極膜１５ａの列に隣接して細長の走査電極用配線膜３３ａと、維持電極膜１５ｂの列に隣接して細長の維持電極用配線膜３３ｂとが配置されている。
走査電極用配線膜３３ａと維持電極用配線膜３３ｂとは、走査電極膜１５ａと維持電極膜１５ｂの列と平行に配置されている。
走査電極膜１５ａと走査電極用配線膜３３ａの間には、走査電極１５ａの一部から成り、走査電極用配線膜３３ａに接触した走査電極接続部３４ａが設けられており、維持電極膜１５ｂと維持電極用配線膜３３ｂの間には、維持電極膜１５ｂの一部から成り、維持電極用配線膜３３ｂに接触した維持電極接続部３４ｂが設けられている。 <Plane shape>
The first and second substrate bodies 11 and 21 are disposed to face each other, and a surface of the first substrate body 11 that faces the second substrate body 21 has a predetermined shape (here, In this case, a plurality of scan electrode films 15a each having the same shape as the scan electrode film 15a and insulated from the scan electrode film 15a are arranged.
A plurality of scanning electrode films 15a are arranged in a line on the first substrate body 11, and a plurality of the arranged lines are arranged in parallel to each other. Further, like the scanning electrode film 15a, a plurality of sustain electrode films 15b are arranged in a line, and the plurality of lines are arranged in parallel to each other.
The columns in which the scan electrode films 15a are arranged and the columns in which the sustain electrode films 15b are arranged are alternately arranged in parallel with each other, and the columns of the alternately arranged scan electrode films 15a and the columns of the sustain electrode films 15b are arranged. The intervals are arranged so that long distances and short distances are alternately repeated.
In the rows of scan electrode films 15a and sustain electrode films 15b that are adjacent at a short distance, one scan electrode film 15a and one sustain electrode film 15b are adjacent to each other, and a pair of scan electrode films 15a and sustain electrode films 15b When a voltage is applied between the scan electrode film 15a and the sustain electrode film 15b constituting the pixel electrode 35, a discharge is generated between them as will be described later. .
Between the column of the scan electrode film 15a and the column of the sustain electrode film 15b that are adjacent at a long distance, the column of the elongated scan electrode wiring film 33a and the column of the sustain electrode film 15b are adjacent to the column of the scan electrode film 15a. An elongated sustain electrode wiring film 33b is disposed adjacently.
Scan electrode wiring film 33a and sustain electrode wiring film 33b are arranged in parallel to the columns of scan electrode film 15a and sustain electrode film 15b.
Between the scan electrode film 15a and the scan electrode wiring film 33a, there is provided a scan electrode connecting portion 34a that is part of the scan electrode 15a and is in contact with the scan electrode wiring film 33a. Between the sustain electrode wiring film 33b, there is provided a sustain electrode connecting portion 34b that is part of the sustain electrode film 15b and is in contact with the sustain electrode wiring film 33b.

走査電極接続部３４ａと維持電極接続部３４ｂは、走査電極接続部３４ａと維持電極接続部３４ｂによって、走査電極用配線膜３３ａと維持電極用配線膜３３ｂにそれぞれ電気的に接続されている。
また、一列中の走査電極膜１５ａと走査電極膜１５ａの間には、その列に隣接する走査電極用配線膜３３ａに接触する走査電極用補助配線膜３６ａが配置されており、同様に、一列中の維持電極膜１５ｂと維持電極膜１５ｂの間には、その列に隣接する維持電極用配線膜３３ｂに接触する維持電極用補助配線膜３６ｂが配置されている。
ここでは、走査電極用補助配線膜３６ａと維持電極用補助配線膜３６ｂは、維持電極用配線膜３３ｂと走査電極用配線膜３３ａとにそれぞれ接続されており、走査電極用補助配線膜３６ａと維持電極用補助配線膜３６ｂは離間し、電気的に絶縁されている。
走査電極用配線膜３３ａと、維持電極用配線膜３３ｂと、走査電極用補助配線膜３６ａと、維持電極用補助配線膜３６ｂとは、後述する様に、黒色に見えるブラックマトリクスとして用いられている。符号３０は、そのブラックマトリクスを示している。
各画素電極３５は、走査電極用補助配線膜３６ａと維持電極用補助配線膜３６ｂとが離間する部分を除いてブラックマトリクス３０によって取り囲まれており、反射光が発生せず、迷光等が隣接する画素間で侵入し合わないようになっている。 Scan electrode connecting portion 34a and sustain electrode connecting portion 34b are electrically connected to scan electrode wiring film 33a and sustain electrode wiring film 33b by scan electrode connecting portion 34a and sustain electrode connecting portion 34b, respectively.
Further, between the scanning electrode film 15a and the scanning electrode film 15a in one row, a scanning electrode auxiliary wiring film 36a that is in contact with the scanning electrode wiring film 33a adjacent to the row is disposed. Between the sustain electrode film 15b and the sustain electrode film 15b, the sustain electrode auxiliary wiring film 36b that contacts the sustain electrode wiring film 33b adjacent to the column is disposed.
Here, the scan electrode auxiliary wiring film 36a and the sustain electrode auxiliary wiring film 36b are connected to the sustain electrode wiring film 33b and the scan electrode wiring film 33a, respectively, and are connected to the scan electrode auxiliary wiring film 36a. The electrode auxiliary wiring film 36b is spaced apart and electrically insulated.
The scan electrode wiring film 33a, the sustain electrode wiring film 33b, the scan electrode auxiliary wiring film 36a, and the sustain electrode auxiliary wiring film 36b are used as a black matrix that looks black as described later. . Reference numeral 30 indicates the black matrix.
Each pixel electrode 35 is surrounded by the black matrix 30 except for a portion where the scan electrode auxiliary wiring film 36a and the sustain electrode auxiliary wiring film 36b are separated from each other, so that no reflected light is generated and stray light or the like is adjacent thereto. It prevents intrusion between pixels.

＜断面構造＞
次に、各配線膜３３ａ、３３ｂ、３６ａ、３６ｂの断面構造を説明すると、走査電極用配線膜３３ａと維持電極用配線膜３３ｂと走査電極用補助配線膜３６ａと維持電極用補助配線膜３６ｂの断面構造は同一であり、第一の基板本体１１表面に密着配置された密着層３１と、密着層３１表面に密着配置された金属層３２とを有している。
密着層３１はニッケル酸化物（ＮｉＯx）を主成分とし、金属層３２は銅を主成分とし、金属層３２が低抵抗になっている。尚、主成分とは含有量が５０質量％以上の成分を指す。
第一の基板本体１１は透明なガラス基板である。銅はガラスに対する密着性が低いが、ニッケル酸化物は銅とガラスの両方に密着性が高く、密着層３１により金属層３２が第一の基板本体１１に固定され、ブラックマトリクス３０が剥がれ難くなっている。 <Cross-section structure>
Next, the cross-sectional structure of each of the wiring films 33a, 33b, 36a, 36b will be described. The scan electrode wiring film 33a, the sustain electrode wiring film 33b, the scan electrode auxiliary wiring film 36a, and the sustain electrode auxiliary wiring film 36b. The cross-sectional structure is the same, and includes an adhesion layer 31 disposed in close contact with the surface of the first substrate body 11 and a metal layer 32 disposed in close contact with the surface of the adhesion layer 31.
The adhesion layer 31 is mainly composed of nickel oxide (NiO x ), the metal layer 32 is mainly composed of copper, and the metal layer 32 has a low resistance. The main component refers to a component having a content of 50% by mass or more.
The first substrate body 11 is a transparent glass substrate. Copper has low adhesion to glass, but nickel oxide has high adhesion to both copper and glass. The metal layer 32 is fixed to the first substrate body 11 by the adhesion layer 31, and the black matrix 30 is difficult to peel off. ing.

図３はＰＤＰ１の内部を説明するための斜視図である。ここでは走査電極用配線膜３３ａと維持電極用配線膜３３ｂは一本ずつだけ図示され、残りは省略されている。
第二のパネル２０では、第二の基板本体２１の面のうちの第一の基板本体１１に対面する面には、直線状に延びる細長のアドレス電極膜(第二の電極)２５が互いに平行に配置されている。
第二のパネル２０のアドレス電極膜２５の伸びる方向が、第一のパネル１０の走査電極用配線膜３３ａと維持電極用配線膜３３ｂの伸びる方向に対して直角になるように第一のパネル１０と第二のパネル２０が配置されており、一本のアドレス電極膜２５に対して対向する位置に、列とは直角な行方向に並んだ画素電極３５が位置している。
アドレス電極膜２５上には、ガラス等の誘電体膜から成る絶縁性を有する誘電体層２２が配置されている。誘電体層２２上には、細長の隔壁２７が、アドレス電極膜２５とアドレス電極膜２５の間の位置にアドレス電極膜２５と平行に配置されている。 FIG. 3 is a perspective view for explaining the inside of the PDP 1. Here, only one scanning electrode wiring film 33a and one sustain electrode wiring film 33b are shown, and the rest are omitted.
In the second panel 20, elongated address electrode films (second electrodes) 25 extending in a straight line are parallel to each other on the surface of the second substrate body 21 that faces the first substrate body 11. Is arranged.
The first panel 10 is formed such that the extending direction of the address electrode film 25 of the second panel 20 is perpendicular to the extending direction of the scan electrode wiring film 33a and the sustain electrode wiring film 33b of the first panel 10. The second panel 20 is disposed, and pixel electrodes 35 arranged in a row direction perpendicular to the columns are located at positions facing one address electrode film 25.
An insulating dielectric layer 22 made of a dielectric film such as glass is disposed on the address electrode film 25. On the dielectric layer 22, an elongated partition wall 27 is disposed in parallel with the address electrode film 25 at a position between the address electrode film 25 and the address electrode film 25.

第一のパネル１０では、各電極膜１５ａ、１５ｂや各配線膜３３ａ、３３ｂ、３６ａ、３６ｂは、誘電体層１２内に埋設されており、誘電体層１２の表面には、ＭｇＯ、ＳｒＯ、ＣａＯ等のアルカリ土類金属酸化物薄膜から成る保護膜１３が形成されている。
第一のパネル１０は、第二のパネル２０の隔壁２７上に乗せられており、第一、第二のパネル１０、２０の間の空間は、隔壁２７によって複数の領域に区分けされている。
第一、第二のパネル１０、２０の間の空間には、希ガス等の放電ガスが封入されている。また、隔壁２７の側面や、隔壁２７と隔壁２７の間の底面には、Ｒ、Ｇ、Ｂ各色の蛍光体２６Ｒ、２６Ｇ、２６Ｂが隔壁２７の間ごとに一色配置されている。 In the first panel 10, each electrode film 15a, 15b and each wiring film 33a, 33b, 36a, 36b are embedded in the dielectric layer 12, and MgO, SrO, A protective film 13 made of an alkaline earth metal oxide thin film such as CaO is formed.
The first panel 10 is placed on the partition wall 27 of the second panel 20, and the space between the first and second panels 10 and 20 is divided into a plurality of regions by the partition wall 27.
A discharge gas such as a rare gas is sealed in the space between the first and second panels 10 and 20. Further, phosphors 26R, 26G, and 26B of each color of R, G, and B are arranged in a single color between the partition walls 27 on the side surfaces of the partition walls 27 and the bottom surface between the partition walls 27 and 27.

各走査電極用配線膜３３ａと、維持電極用配線膜３３ｂと、各アドレス電極膜２５の長手方向の端部は、第一又は第二の基板本体１１、２１の縁付近までそれぞれ導出されており、導出された端部では外部機器の配線にそれぞれ電気的に接続されている。各走査電極用配線膜３３ａと、各維持電極用配線膜３３ｂと、各アドレス電極膜２５には、外部機器からそれぞれ個別に電圧が印加されるようになっており、電圧を印加する走査電極用配線膜３３ａと維持電極用配線膜３３ｂとアドレス電極膜２５を選択できるようになっている。
走査電極用配線膜３３ａと維持電極用配線膜３３ｂに印加された電圧は、走査電極接続部３４ａと維持電極接続部３４ｂを介して、その走査電極用配線膜３３ａや維持電極用配線膜３３ｂに接続された走査電極膜１５ａと維持電極膜１５ｂにそれぞれ印加される。
走査電極膜１５ａと、維持電極膜１５ｂ、走査電極接続部３４ａと、維持電極接続部３４ｂは、ＩＴＯ等の透明な導電膜によって構成されている。 The longitudinal ends of the scan electrode wiring films 33a, the sustain electrode wiring films 33b, and the address electrode films 25 are led out to the vicinity of the edges of the first or second substrate bodies 11 and 21, respectively. The lead-out ends are electrically connected to the wiring of external devices. A voltage is individually applied to each scan electrode wiring film 33a, each sustain electrode wiring film 33b, and each address electrode film 25 from an external device. The wiring film 33a, the sustain electrode wiring film 33b, and the address electrode film 25 can be selected.
The voltage applied to the scan electrode wiring film 33a and the sustain electrode wiring film 33b is applied to the scan electrode wiring film 33a and the sustain electrode wiring film 33b via the scan electrode connection part 34a and the sustain electrode connection part 34b. The voltage is applied to the connected scan electrode film 15a and sustain electrode film 15b, respectively.
Scan electrode film 15a, sustain electrode film 15b, scan electrode connecting portion 34a, and sustain electrode connecting portion 34b are made of a transparent conductive film such as ITO.

次に、本発明の表示装置の製造工程について説明する。
先ず、ニッケルターゲットが配置され、真空雰囲気にされたスパッタリング装置内に第一の基板本体１１を搬入し、真空排気しながら化学構造中に酸素原子を含有する酸化ガス（Ｏ2、ＣＯ2等）と、スパッタガス（Ａｒ等の希ガス）をスパッタリング装置内に導入し、酸化ガスを含有するスパッタ雰囲気中で、ニッケルを主成分とするニッケルターゲットをスパッタリングし、第一の基板本体１１の片面にニッケル酸化物膜から成る密着層３１を形成する。
化学構造中に酸素原子を有する酸化ガスの代わりに、化学構造中に窒素原子を有する窒化ガス（例えばＮ2）を希ガスから成るスパッタリングガスに添加してニッケルターゲットをスパッタリングし、ニッケル窒化物膜からなる密着層３１を形成してもよいし、酸化ガスと窒化ガスの両方をスパッタリングガスに添加してニッケルターゲットをスパッタリングし、ニッケル窒化物とニッケル酸化物の混合物から成る密着層３１を形成してもよい。
次に、銅ターゲットが配置され、真空雰囲気にされたスパッタリング装置内に、密着層３１を形成した第一の基板本体１１を搬入し、真空排気しながらスパッタリングガスを導入し、銅ターゲットをスパッタリングし、密着層３１の表面に、銅膜から成る金属層３２を形成する。図４(ａ)はその状態を示している。
次に、密着層３１と金属層３２とが積層された膜の表面に、パターニングされたレジスト膜を形成し、エッチング液によって銅とニッケル酸化物を連続的に溶解させることで、密着層３１と金属層３２を部分的に除去し、パターニングする。 Next, the manufacturing process of the display device of the present invention will be described.
First, a nickel target is placed and a first substrate main body 11 is carried into a sputtering apparatus in a vacuum atmosphere, and an oxidizing gas containing oxygen atoms in its chemical structure (O 2 , CO 2, etc.) while evacuating. Then, a sputtering gas (a rare gas such as Ar) is introduced into the sputtering apparatus, a nickel target containing nickel as a main component is sputtered in a sputtering atmosphere containing an oxidizing gas, and one surface of the first substrate body 11 is sputtered. An adhesion layer 31 made of a nickel oxide film is formed.
A nickel nitride film is formed by sputtering a nickel target by adding a nitriding gas (for example, N 2 ) having a nitrogen atom in the chemical structure to a sputtering gas comprising a rare gas instead of the oxidizing gas having an oxygen atom in the chemical structure. The adhesion layer 31 may be formed, or both the oxidizing gas and the nitriding gas may be added to the sputtering gas and the nickel target may be sputtered to form the adhesion layer 31 composed of a mixture of nickel nitride and nickel oxide. May be.
Next, the first substrate body 11 on which the adhesion layer 31 is formed is carried into a sputtering apparatus in which a copper target is placed and in a vacuum atmosphere, a sputtering gas is introduced while evacuating, and the copper target is sputtered. A metal layer 32 made of a copper film is formed on the surface of the adhesion layer 31. FIG. 4A shows this state.
Next, a patterned resist film is formed on the surface of the film in which the adhesion layer 31 and the metal layer 32 are laminated, and copper and nickel oxide are continuously dissolved with an etching solution, thereby the adhesion layer 31 and The metal layer 32 is partially removed and patterned.

図４(ｂ)は、密着層３１と金属層３２のパターニングによって、走査電極用配線膜３３ａと維持電極用配線膜３３ｂ、及び同図には不図示の走査電極用補助配線膜３６ａと維持電極用補助配線膜３６ｂとが形成され、レジスト膜が除去された状態である。
次に、ＩＴＯやＩＺＯ等の透明導電材料のターゲットが配置され、真空雰囲気にされたスパッタリング装置内に、走査電極用配線膜３３ａや維持電極用配線膜３３ｂ等が形成された第一の基板本体１１を搬入し、真空排気しながらスパッタリングガスを導入し、透明導電材料をスパッタリングし、第一の基板本体１１の走査電極用配線膜３３ａや維持電極用配線膜３３ｂ等が形成された表面に透明導電膜を形成する。
次いで、透明導電膜上に所定形状にパターニングされたレジスト膜を配置し、エッチングによって透明導電膜を部分的に除去してパターニングし、同図(ｃ)に示すように、透明導電膜から成る走査電極膜１５ａ、維持電極膜１５ｂ、走査電極接続部３４ａ、維持電極接続部３４ｂを形成する。
次に、走査電極用配線膜３３ａ、維持電極用配線膜３３ｂや走査電極膜１５ａ、維持電極膜１５ｂ等が形成された第一の基板本体１１上に、図１に示すように、誘電体層１２と保護膜１３を形成し第一のパネル１０を得て、第二のパネル２０と対面させ、ＰＤＰ１を得る。
誘電体層１２の成膜は例えば、ガラスフリット（ガラスペースト）を塗布、焼成して形成される。保護膜１３は、例えば、ＭｇＯと、ＣａＯと、ＳｒＯ等の蒸着材料を蒸発させる蒸着法で形成され、成膜後に保護膜１３を加熱してアニール処理を行なうこともある。
更に、第一、第二のパネル１０、２０を貼り合せる前に、脱ガス等の目的で、第一のパネル１０を加熱することもある。このように、ブラックマトリクス３０は、ＰＤＰ１の製造工程で加熱される。
密着層３１を、例えばＣｕＯのようなニッケル以外の金属酸化物で構成すると、加熱により酸化物中の酸素が上層の金属層３２に移動し、金属層３２の電気抵抗が上がるだけでなく、密着層３１が第一の基板本体１１から剥がれやすくなる。 FIG. 4B shows the scanning electrode wiring film 33a and the sustain electrode wiring film 33b by patterning the adhesion layer 31 and the metal layer 32, and the scanning electrode auxiliary wiring film 36a and the sustain electrode not shown in the figure. The auxiliary wiring film 36b is formed and the resist film is removed.
Next, a first substrate body in which a transparent conductive material target such as ITO or IZO is arranged and a scanning electrode wiring film 33a, a sustain electrode wiring film 33b, etc. are formed in a sputtering apparatus in a vacuum atmosphere 11 is introduced, a sputtering gas is introduced while evacuating, and a transparent conductive material is sputtered, and the surface of the first substrate body 11 on which the scan electrode wiring film 33a, the sustain electrode wiring film 33b and the like are formed is transparent. A conductive film is formed.
Next, a resist film patterned in a predetermined shape is placed on the transparent conductive film, and the transparent conductive film is partially removed by etching and patterned. As shown in FIG. The electrode film 15a, the sustain electrode film 15b, the scan electrode connection portion 34a, and the sustain electrode connection portion 34b are formed.
Next, as shown in FIG. 1, a dielectric layer is formed on the first substrate body 11 on which the scan electrode wiring film 33a, the sustain electrode wiring film 33b, the scan electrode film 15a, the sustain electrode film 15b, and the like are formed. 12 and the protective film 13 are formed to obtain the first panel 10 and face the second panel 20 to obtain the PDP 1.
The dielectric layer 12 is formed, for example, by applying and baking glass frit (glass paste). For example, the protective film 13 is formed by a vapor deposition method that evaporates a vapor deposition material such as MgO, CaO, and SrO, and the protective film 13 may be heated and annealed after the film is formed.
Furthermore, before bonding the first and second panels 10 and 20, the first panel 10 may be heated for the purpose of degassing or the like. Thus, the black matrix 30 is heated in the manufacturing process of the PDP 1.
When the adhesion layer 31 is made of a metal oxide other than nickel, such as CuO, oxygen in the oxide moves to the upper metal layer 32 by heating, and not only the electric resistance of the metal layer 32 increases but also the adhesion The layer 31 is easily peeled off from the first substrate body 11.

本発明では、密着層３１がニッケル酸化物を主成分とする。ニッケル酸化物はＣｕＯ等に比べて加熱による還元が起こり難い。従って、本発明の表示装置はブラックマトリクス３０の剥離が起こり難く、金属層３２も低抵抗のままである。   In the present invention, the adhesion layer 31 contains nickel oxide as a main component. Nickel oxide is less likely to be reduced by heating than CuO or the like. Therefore, in the display device of the present invention, the black matrix 30 is hardly peeled off, and the metal layer 32 also has a low resistance.

なお、上記実施例では、密着層３１と金属層３２を形成した後、パターニングしたが、密着層３１を形成した後、パターンニングし、次いで、金属層３２を形成し、パターニングして走査電極用配線膜３３ａ、維持電極用配線膜３３ｂ、走査電極用補助配線膜３６ａ、維持電極用補助配線膜３６ｂを形成してもよい。
密着層３１の成膜には、ニッケルを主成分とするニッケルターゲットに替え、ニッケル酸化物を主成分とするニッケル酸化物ターゲットやニッケル窒化物を主成分とするニッケル窒化物ターゲットを用いて、ニッケル酸化膜又はニッケル窒化膜を形成してもよい。更に、ニッケルに代えて鉄を使用することもできる。
また、金属層３２は、銅と、銅以外の添加金属とを含有する銅合金で構成することもできる。また、銅に代えてＡｌを使用することもできる。 In the above embodiment, the adhesion layer 31 and the metal layer 32 are formed and then patterned. However, after the adhesion layer 31 is formed, patterning is performed, and then the metal layer 32 is formed and patterned for the scan electrode. The wiring film 33a, the sustain electrode wiring film 33b, the scan electrode auxiliary wiring film 36a, and the sustain electrode auxiliary wiring film 36b may be formed.
The adhesion layer 31 is formed by using a nickel oxide target mainly composed of nickel oxide or a nickel nitride target mainly composed of nickel nitride instead of a nickel target mainly composed of nickel. An oxide film or a nickel nitride film may be formed. Furthermore, iron can be used instead of nickel.
Moreover, the metal layer 32 can also be comprised with the copper alloy containing copper and additional metals other than copper. Also, Al can be used instead of copper.

本発明の表示装置はＰＤＰ１に限定されず、液晶ディスプレイ、有機ＥＬディスプレイも本発明には含まれるが、本発明のブラックマトリクスは、樹脂材料等からなるブラックマトリクスに比べて耐熱性に優れているので、放電によりブラックマトリクスが高温に加熱されやすいＰＤＰに特に適している。   The display device of the present invention is not limited to the PDP 1, and a liquid crystal display and an organic EL display are also included in the present invention. However, the black matrix of the present invention is superior in heat resistance compared to a black matrix made of a resin material or the like. Therefore, it is particularly suitable for a PDP in which the black matrix is easily heated to a high temperature by discharge.

１……ＰＤＰ（表示装置） １０……第一のパネル １１……第一の基板本体 １５ａ……走査電極膜 １５ｂ……維持電極膜 ２０……第二のパネル ２１……第二の基板本体 ２５……アドレス電極膜 ３０……ブラックマトリクス ３１……密着層 ３２……金属層   DESCRIPTION OF SYMBOLS 1 ... PDP (display apparatus) 10 ... 1st panel 11 ... 1st board | substrate body 15a .... Scan electrode film 15b ... Sustain electrode film 20 ... 2nd panel 21 ... 2nd board | substrate body 25 …… Address electrode film 30 …… Black matrix 31 …… Adhesion layer 32 …… Metal layer

Claims (3)

それぞれ細長に形成され、第一の基板本体上に複数本平行に交互に配置された走査電極用配線膜と維持電極用配線膜と、前記走査電極用配線膜と前記維持電極用配線膜の間に配置され、前記走査電極用配線膜と前記維持電極用配線膜にそれぞれ電気的に接続された透明な走査電極膜と透明な維持電極膜の一対から成る画素電極とが設けられた第一のパネルと、
前記第一のパネルに対して平行にされた第二の基板本体上に、前記走査電極用配線膜と前記維持電極用配線膜とが延びる方向とは交叉する方向に延びる互いに離間した複数の隔壁と、隣接する前記隔壁間に位置する蛍光体とが設けられた第二のパネルと、を有するＰＤＰ表示装置であって、
前記走査電極用配線膜と前記維持電極用配線膜は、ニッケル又はＦｅのいずれか一方を主成分とする金属酸化物を主成分とし、前記第一の基板本体の表面に接触して配置された密着層と、銅又はアルミニウムのいずれか一方を主成分とし、前記密着層の表面に接触して配置された金属層とを有し、
前記第一、第二のパネル間には放電ガスが配置され、前記走査電極用配線膜と前記維持電極用配線膜との間に生じた放電によって前記放電ガスがプラズマ化され、発生した紫外線で前記蛍光体が発光するＰＤＰ表示装置。 A plurality of scan electrode wiring films and sustain electrode wiring films that are formed in an elongated shape and are alternately arranged in parallel on the first substrate body, and between the scan electrode wiring film and the sustain electrode wiring film. A transparent scanning electrode film electrically connected to the scanning electrode wiring film and the sustaining electrode wiring film, respectively, and a pixel electrode comprising a pair of transparent sustaining electrode films. A panel,
A plurality of spaced apart partition walls extending on a second substrate body parallel to the first panel and extending in a direction intersecting with a direction in which the scan electrode wiring film and the sustain electrode wiring film extend. And a second panel provided with a phosphor positioned between the adjacent partition walls, and a PDP display device,
The scan electrode wiring film and the sustain electrode wiring film are mainly composed of a metal oxide mainly composed of either nickel or Fe, and are disposed in contact with the surface of the first substrate body. An adhesion layer and a metal layer mainly composed of either copper or aluminum and disposed in contact with the surface of the adhesion layer;
A discharge gas is disposed between the first and second panels, and the discharge gas is turned into plasma by the discharge generated between the scan electrode wiring film and the sustain electrode wiring film. A PDP display device in which the phosphor emits light. 前記画素電極の片側に位置する前記走査電極用配線膜と、反対側に位置する前記維持電極用配線膜から、前記画素電極と前記画素電極の間に、前記密着層と前記金属層とを有する走査電極用補助配線膜と維持電極用補助配線膜がそれぞれ、互いに非接触の状態で延ばされた請求項１記載のＰＤＰ表示装置。   From the scan electrode wiring film located on one side of the pixel electrode and the sustain electrode wiring film located on the opposite side, the adhesion layer and the metal layer are provided between the pixel electrode and the pixel electrode. The PDP display device according to claim 1, wherein the scan electrode auxiliary wiring film and the sustain electrode auxiliary wiring film are each extended in a non-contact state. 前記走査電極用配線膜と前記維持電極用配線膜はブラックマトリクスを形成する請求項１又は請求項２のいずれか１項記載のＰＤＰ表示装置。   The PDP display device according to claim 1, wherein the scan electrode wiring film and the sustain electrode wiring film form a black matrix.
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