JP5078507B2 - Electronic component mounting method and apparatus - Google Patents

Description

The present invention relates to an electronic component mounting method and equipment for mounting electronic components on a printed circuit board, in particular prior to picking the electronic component from the feeder, and be able to get the center position of the electronic component in the cavity those concerning the electronic component mounting method and equipment.

  In an electronic component mounting machine that mounts electronic components on a printed circuit board, a feeder having a cavity for storing a plurality of electronic components at a predetermined interval is used, and the cavities are sequentially sent to the component supply position and supplied to the component supply position. The electronic component in the cavity is sucked by a suction nozzle, the suction nozzle is moved to a component mounting position where the printed board is positioned, and the electronic component is mounted at a predetermined position on the printed board.

  In this type of electronic component mounting machine, the electronic components are accommodated in the cavity. However, since a small gap is required between the cavity and the electronic component for removal, the electronic component is in the cavity. It is inevitable to move a small amount. In addition, in many cases, a plurality of feeders are arranged side by side on the apparatus main body, and one type of electronic component is supplied from each feeder, and the feeder is replaced when there is no electronic component to be supplied. It is inevitable that installation errors will occur.

  Therefore, even if the suction nozzle held by the nozzle holder is positioned at a predetermined position in order to suck the electronic component supplied to the component supply position, the relative position is more or less between the suction nozzle and the electronic component. An error occurs. In this case, when the electronic component is relatively large, there is no problem in attracting the electronic component by the suction nozzle even if some relative position error occurs, but the electronic component is particularly small. In some cases, even with a slight relative position error, the suction part of the suction nozzle may be detached from the suction surface of the electronic component, making it impossible to pick up, or even if it is picked up, it will be picked up in an abnormal posture and accurate to the printed circuit board. There was a fear that it could not be installed.

In order to solve such a problem, an electronic component take-out apparatus as described in Patent Document 1 is conventionally known. In the device described in Patent Document 1, the electronic component supplied to the component supply position is imaged by the reference mark camera (152) before the electronic component (20) is taken out from the feeder (30), and the reference mark camera (152) is used. By acquiring the relative position error of the component with respect to the mark camera and correcting the component receiving position of the component holding head (60) based on the acquired relative position error, a suction error or abnormal suction by the suction nozzle (114) is avoided. It is something that can be done.
JP 2003-347794 A (paragraph 0042, FIG. 2)

  However, in the device described in Patent Document 1 described above, the electronic component supplied to the component supply position is imaged from above by the reference mark camera. It is necessary to retreat from above the position. Therefore, after imaging the electronic component by the reference mark camera, it is necessary to retract the reference mark camera from above the component supply position and simultaneously position the suction nozzle above the component supply position to correct the position. Therefore, there has been a problem that a loss time occurs in the mounting operation of the electronic component.

The present invention has been made in view of the related art problems so that the electronic component in the cavity supplied to the component supply position can be imaged by the component camera from below the cavity before the electronic component is sucked from the feeder. It is an object of the present invention to provide an electronic component mounting method and apparatus .

In order to solve the above problems, a feature of the electronic component mounting method according to claim 1 is that a body tape is provided, and a carrier tape having a cavity for accommodating a plurality of electronic components at predetermined intervals is wound around the main body frame. A rotating supply reel can be attached, and the carrier tape is fed at a predetermined pitch by feeding means, and has a feeder that sequentially feeds the electronic components in the cavity to the component feeding position, and before the electronic components are sucked from the feeder The electronic component in the cavity supplied to the component supply position is imaged by the component camera from below the cavity, the center position of the electronic component is obtained based on the captured image, and then the electronic component is centered by the suction nozzle. Adsorption and mounting on a printed circuit board.
The electronic component mounting method according to claim 2 is characterized in that, in claim 1, a reference mark is provided in the vicinity of the component supply position, the reference mark is imaged by a reference mark camera, and the center of the component camera with respect to the mounting apparatus main body. This is to correct the position error of the position.

The electronic component mounting device according to claim 3 includes a main body frame, and a supply reel on which a carrier tape having a cavity for storing a plurality of electronic components at a predetermined interval can be attached to the main body frame . A feeder that feeds the carrier tape at a predetermined pitch by feeding means, and sequentially supplies the electronic components in the cavity to the component supply position; and illumination light from above the electronic components in the cavity that are supplied to the component supply position. Irradiation means for irradiating, a component camera for imaging an electronic component in the cavity supplied to the component supply position from below, an image processing means for processing an image of the electronic component captured by the component camera, and the image The center position of the electronic component acquired by the image processing by the processing means is sucked and a suction nozzle to be mounted on the printed circuit board is maintained. The it is that constituted by the nozzle holder.

A feature of an electronic component mounting apparatus according to a fourth aspect is that, in the second aspect, the component camera is built in the feeder.

The electronic component mounting apparatus according to claim 5 is characterized in that, in claim 2, the component camera is disposed outside the feeder, and images the electronic component in the cavity from below through a mirror. It is that you are.

The electronic component mounting apparatus according to a sixth aspect is the electronic component mounting apparatus according to the second or third aspect, wherein the feeder is provided with a reference mark in the vicinity of the component supply position, and includes a reference mark camera for imaging the reference mark. The position error of the center position of the component camera with respect to the mounting apparatus body is corrected by imaging the reference mark by the reference mark camera.

A feature of the electronic component mounting apparatus according to a seventh aspect is that in any one of the second to fifth aspects, the irradiation unit is provided in the suction nozzle.

According to the electronic component mounting method of claim 1, a supply reel around which a carrier tape having a cavity for accommodating a plurality of electronic components at a predetermined interval can be attached to the main body frame, and the carrier tape is fed by the feeding means. The feeder has a feeder that feeds the electronic components in a predetermined pitch and sequentially supplies the electronic components in the cavity to the component supply position, and the electronic components in the cavity supplied to the component supply position before sucking the electronic components from the component supply position of the feeder The center position of the electronic component is obtained from the lower part of the cavity with the component camera, and then the center position of the electronic component is sucked by the suction nozzle and mounted on the printed circuit board. The center position of the electronic component can be stably adsorbed by the adsorption nozzle, and the adsorption rate can be improved.
According to the electronic component mounting method of the second aspect, since the reference mark provided in the vicinity of the component supply position is imaged by the reference mark camera, the position error of the center position of the component camera with respect to the mounting apparatus body is corrected. Depending on the center position of the component camera, the center position of the electronic component in the cavity with respect to the mounting apparatus body can be accurately obtained regardless of the position error of the component camera due to the attachment error of the feeder.

  In addition, since the electronic component is imaged from below the cavity, the conventional sequential operation of the imaging of the electronic component and the suction operation of the suction nozzle becomes unnecessary, and the suction operation by the suction nozzle is asynchronous with the inside of the cavity. The center position of the electronic component can be acquired, and the machine operation rate can be improved. Further, in some cases, it is possible to make the suction nozzle stand by at the upper position of the electronic component supplied to the component supply position during imaging of the electronic component, thereby immediately after obtaining the center position of the electronic component. Electronic parts can be sucked by the suction nozzle.

According to the electronic component mounting apparatus of the third aspect , a supply reel around which a carrier tape having a cavity for accommodating a plurality of electronic components at predetermined intervals can be attached to the main body frame, and the carrier tape is fed by the feeding means. A feeder that feeds the electronic components in the cavity to the component supply position sequentially by sending out a predetermined pitch, an irradiation means for irradiating illumination light from above the electronic components in the cavity supplied to the component supply position, and a component supply position A component camera that images the electronic component in the supplied cavity from below, an image processing unit that processes an image of the electronic component captured by the component camera, and a center position of the electronic component acquired by image processing by the image processing unit Since it is composed of a nozzle holder that holds the suction nozzle that is sucked and mounted on the printed circuit board, the center of the electronic component Place the stable can be adsorbed by the suction nozzle, it is possible to embody the electronic component mounting apparatus capable of improving the adsorption rate. In addition, by imaging the electronic component from below the cavity, it is possible to acquire the center position of the electronic component in the cavity asynchronously with the suction operation by the suction nozzle, and the electronic component that can improve the machine operating rate A mounting device can be embodied.

According to the electronic component mounting apparatus of the fourth aspect , since the component camera is built in the feeder, it is not necessary to install the component camera between the component supply position and the component mounting position, and the electronic component can be installed at the shortest distance. Can be mounted, and the machine can be made compact.

According to the electronic component mounting apparatus of the fifth aspect , the component camera is disposed outside the feeder, and images the electronic component in the cavity from below via the mirror. It is possible to eliminate the need for position correction of the center position of the component camera. In addition, the number of component cameras can be reduced, the complicated installation work for mounting the component cameras at predetermined positions in the feeder can be eliminated, and the component cameras need not be built into the feeder. There is no restriction on the size.

According to the electronic component mounting apparatus of the sixth aspect , the feeder is provided with the reference mark in the vicinity of the component supply position, and the position error of the center position of the component camera with respect to the mounting apparatus main body is determined by the reference mark camera that images the reference mark. Therefore, by correcting the position of the nozzle holder according to the position error, the center position of the electronic component in the cavity with respect to the mounting apparatus body can be obtained regardless of the position error of the component camera due to the attachment error of the feeder. Can be obtained accurately.

According to the electronic component mounting apparatus of the seventh aspect , since the irradiation unit is provided in the suction nozzle, a special space for providing the irradiation unit can be eliminated, and illumination light can be irradiated from directly above the electronic component. Thus, the projection image of the electronic component can be obtained accurately.

  A first embodiment of an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings. As shown in FIG. 1, the electronic component mounting apparatus according to the embodiment includes a component supply device 70, a board transfer device 60, and a component transfer mounting 50.

  The component supply apparatus 70 is configured by arranging a plurality of feeders 71 side by side in the X-axis direction on the mounting apparatus body 40, and each feeder 71 is set to be replaceable with the mounting apparatus body 40. The feeder 71 is wound around the supply reel 73, a main body frame 72 that can be connected to a connection portion (not shown) provided in the mounting apparatus main body 40, a supply reel 73 that is detachably attached to the rear portion of the main body frame 72, and the supply reel 73. A carrier tape 75 (see FIG. 2) is provided. As shown in FIGS. 2, 3, and 4, the carrier tape 75 is formed with cavities 76 that accommodate the electronic components P at regular intervals, and the upper openings of the cavities 76 are usually attached to the carrier tape 75. The electronic tape P is taped by the carrier tape 75 and the cover tape 77. The cover tape 77 is peeled off before a component supply position 74 described later and discharged to a predetermined position.

  The carrier tape 75 is guided to the main body frame 72 by feed means 79 (see FIG. 5) including a motor 79b connected to a sprocket 79a engaged with a feed hole 78 formed in the carrier tape 75 through a gear mechanism. The electronic components P sent out by a predetermined pitch and housed in the cavity 76 are sequentially supplied to the component supply position 74 at the tip of the main body frame 72. As shown in FIG. 4, an opening 72 a for taking out the electronic component P from the cavity 76 is formed in the upper portion of the main body frame 72 corresponding to the component supply position 74.

  As shown in FIGS. 4 and 5, the main body frame 72 includes a component camera 31 including a CCD camera that images the electronic component P in the cavity 76 supplied to the component supply position 74 from below. It is built in a predetermined position below. A reference mark 32 is provided in the vicinity of the component supply position 74 on the upper surface of the main body frame 72, and the reference mark 32 is disposed at a position offset from the center position 31 a of the component camera 31 by a certain amount. That is, as shown in FIG. 4, the center position 31a of the component camera 31 is positioned at a position offset from the reference mark 32 by, for example, a distance + X1 in the X-axis direction and a distance −Y1 in the Y-axis direction. . The reference mark 32 is read by a reference mark camera 33, which will be described later, so that a positional deviation of the reference mark 32 with respect to the mounting apparatus main body 40, in other words, an attachment error of the feeder 71 with respect to the mounting apparatus main body 40 can be detected. Thus, the position coordinates of the center position 31a of the component camera 31 built in the main body frame 72 can be corrected.

  The feeder 71 set in the mounting apparatus main body 40 is replaced when the electronic component P to be supplied is exhausted or when the type of the electronic component P is changed. When the feeder 71 is set at a predetermined connection portion of the mounting apparatus main body 40, a control unit provided in the feeder 71 and a control device 80 of the electronic component mounting apparatus described later are communicably connected by connectors, and from the feeder 71 side. The image information captured by the component camera 31 is transmitted to the control device 80 of the electronic component mounting apparatus.

  The substrate transport device 60 transports the printed circuit board in the X-axis direction, and is a so-called double conveyor type in which the first transport device 61 and the second transport device 62 are arranged in two rows. The first transport device 61 and the second transport device 62 have a pair of guide rails 64a, 64b, 65a, 65b arranged on the base 63 in parallel and facing each other in parallel, and the guide rails 64a, 64b. , 65a, 65b, and a pair of conveyor belts (not shown) that support and convey the printed circuit boards that are guided by each other. Further, the substrate transport device 60 is provided with a clamp device (not shown) that lifts and clamps the printed circuit board that has been transported to a predetermined position, and the printed circuit board is positioned and clamped at a predetermined position of the mounting position.

  The component transfer device 50 is of the XY robot type, is mounted on the mounting device main body 40 and disposed above the substrate transfer device 60 and the component supply device 70, and extends in the Y-axis direction along the guide rail 12a. A movable Y-axis slide 12 is provided. As shown in FIG. 6, the Y-axis slide 12 is moved in the Y-axis direction by a ball screw mechanism having a ball screw 11 a connected to the output shaft of the Y-axis servomotor 11. An X-axis slide 13 is guided by the Y-axis slide 12 so as to be movable in the X-axis direction orthogonal to the Y-axis direction. An X-axis servo motor 14 is installed on the Y-axis slide 12, and the X-axis slide 13 is moved in the X-axis direction by a ball screw mechanism (not shown) connected to the output shaft of the X-axis servo motor 14.

  On the X-axis slide 13, an electronic component mounting head 10 that sucks and mounts the electronic component P on the printed circuit board, and a reference mark camera 33 that images the reference mark 32 applied to the feeder 71 are mounted. The electronic component mounting head 10 includes a rotatable nozzle holder 17 constituting a revolver head. As shown in FIG. 7, a plurality of spindles 18 are held in the nozzle holder 17 so as to be able to reciprocate in the vertical direction (Z-axis direction), and a suction nozzle 20 is attached to the lower end of the spindle 18. Each spindle 18 is biased upward by a compression spring (not shown), thereby normally holding the suction nozzle 20 at the rising end position.

  The nozzle holder 17 is intermittently rotated so that each spindle 18 stops at a predetermined angular position by a holder rotating servomotor 21 installed on the X-axis slide 13. The spindle 18 stopped at the predetermined angular position is resisted against the spring force of the compression spring by the nozzle lowering lever 25 being lowered by the rotation of the feed screw 24 driven by the nozzle raising / lowering servomotor 22 in one direction. It is lowered together with the suction nozzle 20. When the nozzle lowering lever 25 is raised by the rotation of the feed screw 24 in the opposite direction, the spindle 18 and the suction nozzle 20 are raised by the spring force of the compression spring. Each spindle 18 is rotationally connected to a θ-axis servomotor 23 through a gear mechanism, and the θ-axis servomotor 23 can adjust the angles of the spindle 18 and the suction nozzle 20 all at once.

  The nozzle holder 17 is provided with irradiation means 30 (see FIG. 5) for irradiating illumination light from above the electronic component P in the cavity 76 supplied to the component supply position 74. When illumination light is irradiated onto the cavity 76 from above by the irradiation means 30, the illumination light passes through a thin film of the carrier tape 75 and enters the component camera 31 built in the feeder 71. At this time, since the illumination light is blocked by the electronic component P housed in the cavity 76, the image captured by the component camera 31 is a projection image P1 in which the electronic component P portion is black, as shown in FIG. The cavity 76 part of the peripheral part P2 becomes white. Actually, since the bottom surface of the cavity 76 has a slight thickness, the cavity 76 portion is slightly colored gray, but there is a clear density difference from the black color representing the electronic component P. There is no problem in processing the P image.

  In this way, a so-called backlight in which illumination light is irradiated from above the electronic component P in the cavity 76 supplied to the component supply position 74 and the projected image is captured by the component camera 31 disposed below the electronic component P. By imaging the electronic component P by the method, it is possible to acquire an image of the electronic component P at the component supply position 74 while the nozzle holder 17 is waiting above the component supply position 74. Therefore, it is possible to immediately shift to the suction operation by the suction nozzle 20 after the image processing.

  The electronic component mounting apparatus includes a control device 80 illustrated in FIG. 8, and the control device 80 is mainly configured by a CPU 81, a ROM 82, a RAM 83, and a computer 84 having a bus connecting them. Further, an input / output interface 85 is connected to the bus, and the X-axis servo motor 14, the Y-axis servo motor 11, the holder rotating servo motor 21, the nozzle raising / lowering servo motor 22, and the like via the drive circuits 86 to 90. A θ-axis servomotor 23 is connected. The control device 80 is connected to an image processing computer 91, a component camera 31, and a reference mark camera 33 that constitute an image processing means. The control device 80 is further connected to an input device 93 having a keyboard for inputting data and a display device for displaying data, and the component cameras 31 respectively built in the feeder 71 via the input device 93. The offset data (+ X1, -Y1) and the like are input to the reference mark 32 and stored in the ROM 82. These data are stored for each feeder 71.

  Next, the operation in the above embodiment will be described. When the electronic component P is mounted on the printed circuit board, the sprocket 79a is driven by the feeding means 79 provided in the feeder 71 that houses the electronic component P to be mounted on the printed circuit board. As a result, the carrier tape 75 is fed out by a predetermined pitch, and the electronic components P accommodated in the cavity 76 are supplied one by one to the component supply position 74. The electronic component P in the cavity 76 supplied to the component supply position 74 is irradiated with illumination light by the irradiation means 30 from above, and the projection image P1 of the electronic component P transmitted through the carrier tape 75 and its peripheral portion P2 are The image is taken by the component camera 31 built in the feeder 71 at a position below the component supply position 74.

  In addition, since it is considered that the position coordinate of the center position 31a of the component camera 31 has an error with respect to the mechanical origin of the mounting apparatus main body 40 due to an attachment error of the feeder 71 set in the mounting apparatus main body 40. In the present embodiment, when the feeder 71 is set on the mounting apparatus main body 40, the reference mark 32 provided on the feeder 71 is imaged by the reference mark camera 33 provided on the X-axis slide 13, and the feeder is captured. 71, the position error in the X-axis direction and the Y-axis direction, that is, the position error of the center position 31a of the component camera 31 is acquired, and the position error amount is stored in the ROM 82 of the computer 84 together with the unique number of the feeder 71. ing.

  When the projection image P1 of the electronic component P supplied to the component supply position 74 is captured by the component camera 31, image data acquired by the imaging is transmitted from the control unit of the feeder 71 to the control device 80 for image processing. Processed by the computer 91. In the image processing computer 91, as shown in FIG. 10, the reference image P <b> 11 at the normal position of the electronic component P stored in advance is compared with the captured image P <b> 12 captured by the component camera 31, and the electronic in the cavity 76 is compared. The error of the center position O1, O2 of the part P and the error of the inclination are acquired. In FIG. 10, it is assumed that the center position O2 of the captured image P12 has an error of + X2 in the X-axis direction and −Y2 in the Y-axis direction with respect to the center position O1 of the reference image P11, and there is no tilt error. Show.

  In this case, it is also possible to perform image processing by the feeder alone by the control unit of the feeder 71 and transmit the calculated center position data of the electronic component P to the control device 80 on the electronic component mounting apparatus side.

  Based on the position error amount (+ X2, −Y2) of the electronic component P with respect to the component camera 31, an apparent correction amount for sucking the center position 31a of the electronic component P with no inclination by the suction nozzle 20 is calculated. Is done. At this time, since the offset amount (+ X1, −Y1) of the component camera 31 with respect to the reference mark 32 is acquired in advance, the positional error amount of the component camera 31 is added to the apparent correction amount, and the actual correction amount is calculated. Is done.

  That is, if the position of the reference mark 32 acquired by the reference mark camera 33 is deviated from the normal position by ΔX0 in the + X axis direction of FIG. Based on the offset amount (ΔX0) acquired by the reference mark camera 33 and the offset amount (+ X2, −Y2) acquired by the component camera 31 in the offset amount (+ X1, −Y1) of the component camera 31 with respect to 32, The correction amount of the nozzle holder 17 is determined.

  Based on the correction amount, the control device 80 controls the X-axis servo motor 14 and the Y-axis servo motor 11 to correct the position of the nozzle holder 17. Thereby, the center position of the electronic component P supplied to the component supply position 74 can be sucked by the suction nozzle 20. Thereafter, the nozzle holder 17 is transferred to the component mounting position, and the electronic component P sucked by the suction nozzle 20 is mounted on the printed board.

  As a result, the electronic component P can be reliably picked up by the suction nozzle 20, and the electronic component P can be placed at a predetermined position on the printed circuit board without performing image processing by the component camera after the electronic component P is picked up by the suction nozzle 20. It will be possible to install it accurately.

  The reference mark camera 33 detects the position of an unillustrated board mark provided on the printed board that is carried and positioned at the predetermined position by the board transfer device 60, thereby providing an electronic component P on the printed board. At the time of mounting, the position of the nozzle holder 17 can be corrected according to the position of the substrate mark.

  According to the first embodiment described above, before the electronic component P is sucked from the feeder 71 by the suction nozzle 20, the electronic component P in the cavity 76 supplied to the component supply position 74 is moved from below the cavity 76. Since the center position of the electronic component P is acquired by the camera 31 based on the captured image, and then the center position of the electronic component P is sucked by the suction nozzle 20 and mounted on the printed circuit board. The center position of the component P can be stably adsorbed by the adsorption nozzle 20, and the adsorption rate can be improved.

  In addition, since the electronic component P is imaged from below the cavity 76, the conventional sequential operation of the imaging of the electronic component and the suction operation of the suction nozzle is unnecessary, and asynchronously with the suction operation by the suction nozzle 20, The center position of the electronic component P in the cavity 76 can be acquired, and the machine operating rate can be improved. In some cases, the suction nozzle 20 can be placed on standby above the electronic component P supplied to the component supply position 74 while the electronic component P is being imaged. After the acquisition, the electronic component P can be immediately sucked by the suction nozzle 20.

  Further, according to the first embodiment described above, since the component camera 31 is built in the feeder 71, there is no need to install a component camera between the component supply position and the component mounting position, and the shortest distance is achieved. This makes it possible to mount electronic components and to make the machine compact.

  Furthermore, according to the first embodiment described above, the feeder 71 is provided with the reference mark 32 in the vicinity of the component supply position 74, and the reference mark camera 33 that images the reference mark 32 allows the mounting device main body 40 (machine). Since the position error of the component camera 31 with respect to the origin) is acquired, the position of the nozzle holder 17 is corrected according to the position error, so that the mounting is performed regardless of the position error of the component camera 25 due to the attachment error of the feeder 71. The center position of the electronic component P in the cavity 76 with respect to the apparatus main body 40 can be accurately acquired.

  In addition, according to the first embodiment described above, the feeder 71 is wound around the main body frame 72 and the supply reel 73 that can be attached to the main body frame 72 and accommodates a plurality of electronic components P at predetermined intervals. The feeding means 79 for feeding the carrier tape 75 having the cavity 76 so as to sequentially supply the electronic components P in the cavity 76 to the component supply position 74, and the cavity 76 built in the main body frame 72 and supplied to the component supply position 74. Since the electronic device P is equipped with a component camera 25 that images the electronic component P from below, the central position of the electronic component P can be acquired by the component camera 25 built in the feeder 71 only by setting the feeder 71 on the mounting apparatus body 40. Can do.

  Therefore, even the extremely small electronic component P can be reliably attracted by the suction nozzle 20, and it is possible to avoid the occurrence of suction mistakes and abnormal suction by the suction nozzle 20, thereby improving the operating rate of the electronic component mounting device. be able to.

  FIG. 11 shows a second embodiment of the present invention, in which the irradiation means 130 is integrally attached to the suction nozzle 20. That is, a disk-shaped light-emitting holding body 35 is provided concentrically and integrally on the suction nozzle 20, and a light-emitting body 36 composed of a number of LEDs is attached to the lower surface of the light-emitting holding body 35.

  According to the second embodiment, even when the suction nozzle 20 is waiting above the component supply position 74, the cavity 76 supplied to the component supply position 74 by the irradiation means 130 provided in the suction nozzle 20. It becomes possible to easily irradiate illumination light from directly above the internal electronic component P, and the component camera 31 can accurately capture the projection image of the electronic component P.

  FIG. 12 shows a third embodiment of the present invention, in which the component camera 31 that images the electronic component P in the cavity 76 from below the cavity 76 is mounted on the mounting device body 40 side where the feeder 71 is mounted. Are arranged. That is, instead of incorporating the component camera 31 in the feeder 71, the component camera 31 is attached to the mounting apparatus main body 40 to which the feeder 71 is mounted so as to face the front end side of the feeder 71, and the projected image of the electronic component P is 45 in the feeder 71. An image is taken by the component camera 31 through a mirror (reflecting plate) 37 that is inclined at a certain angle. In FIG. 12, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  According to the third embodiment, since the component camera 31 is installed not on the feeder 71 but on the mounting device main body 40 side, the component camera 31 is detachably mounted on the mounting device main body 40 as described in the first embodiment. There is no need to consider the attachment error of the feeder 71, and the reference mark 32 provided on the feeder 71 is imaged by the reference mark camera 33, and the process of correcting the error amount can be made unnecessary.

  Moreover, according to the third embodiment, since it is not necessary to provide the component cameras 31 for each feeder 71, the number of the component cameras 31 can be reduced and the component cameras 31 can be attached at predetermined positions in the feeder 71. In addition, since the component camera 31 is built in the feeder 71, the size of the component camera 31 is not restricted.

  Further, FIG. 13 shows a fourth embodiment of the present invention, in which the electronic component P is not taken out from the cavity 76 of the carrier tape 75 of the feeder 71 by the suction nozzle 20, but the cavity 76 of the carrier tape 75. Further, the electronic component P is dropped on the white transparent plate, the electronic component P on the white transparent plate is imaged by a component camera and image processing is performed, and the center position of the electronic component P is picked up by the suction nozzle 20. Is.

  Hereinafter, the fourth embodiment will be described in more detail with reference to FIG. In the fourth embodiment, the feeder 71 is turned upside down so that the carrier tape 75 is fed along the lower surface of the main body frame 72, that is, the cavity 76 containing the electronic component P is opened downward. In this posture, the mounting device body 40 is set to be replaceable. The electronic component P accommodated in the cavity 76 of the feeder 71 is dropped from the opening 72a (see FIG. 4) onto the conveyor belt 100 made of a white transparent plate at the component supply position 74.

  The conveyor belt 100 is an endless belt and is stretched between the driving roller 101 and the driven roller 102. The conveyor belt 100 is intermittently driven by a motor (not shown) connected to the drive belt 101, and the electronic components P dropped on the conveyor belt 100 are sequentially conveyed to the component pickup position 103 by the intermittent drive of the conveyor belt 100. It is like that.

  An irradiation unit 30 is disposed below the conveyor belt 100 corresponding to the component pickup position 103, and a camera unit 105 provided with a component camera 31 is positioned above the conveyor belt 100. ing. Illumination light emitted from the irradiation means 30 is partially blocked by the electronic component P on the conveyance belt 100 conveyed to the component pick-up position 103, passes through the conveyance belt 100, and is transmitted by the component camera 31 provided in the camera unit 105. The projection image of the electronic component P can be taken. The camera unit 105 may be mounted on the X-axis slide 13 (see FIG. 6), or may be moved on the XY plane independently of the X-axis slide 13.

  Then, as described in the first embodiment, the image data acquired by the imaging of the component camera 31 is sent to the image processing computer 91 (see FIG. 8) for processing, and the normal position of the electronic component P As a result of the comparison with the reference image, the error of the center position and the inclination of the electronic component P on the conveyor belt 100 conveyed to the component pickup position 103 is acquired. Thereafter, the nozzle holder 17 provided with the suction nozzle 20 is positioned after being corrected by an error amount on the component pickup position 103, and the suction nozzle 20 is lowered to suck the center position of the electronic component P.

  According to the fourth embodiment described above, since the electronic component P on the transport belt 100 can be sucked by the suction nozzle 20, the electronic component P can be compared with the case where the electronic component P is sucked from the cavity 76. Can be easily taken out.

  As mentioned above, although the electronic component mounting apparatus of this invention was demonstrated according to 1st thru | or 4th embodiment, this invention is not restrict | limited to these, Unless it is contrary to the technical idea of this invention, Needless to say, the present invention can be applied with appropriate changes.

It is a perspective view of the electronic component mounting apparatus shown in the first embodiment of the present invention. It is a figure which shows the carrier tape part of a feeder. It is sectional drawing cut | disconnected along the 3-3 line of FIG. It is a top view of the front-end | tip part of a feeder. It is a side view of the front-end | tip part of a feeder. It is a perspective view which shows the principal part of an electronic component mounting apparatus. It is a perspective view which shows an example of an electronic component mounting head. It is a block diagram which shows a control apparatus. It is a figure which shows the image of the electronic component imaged with the component camera. It is a figure which shows the comparison with a reference | standard image and a captured image. It is a figure which shows the 2nd Embodiment of this invention. It is a figure which shows the 3rd Embodiment of this invention. It is a figure which shows the 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting head, 12 ... Y-axis slide, 13 ... X-axis slide, 17 ... Nozzle holder, 20 ... Suction nozzle, 30, 130 ... Irradiation means, 31 ... Component camera, 32 ... Reference mark, 33 ... Reference mark Camera ... 37 ... Mirror, 40 ... Mounting device body, 50 ... Component transfer device, 60 ... Substrate transport device, 70 ... Component supply device, 71 ... Feeder, 73 ... Supply reel, 74 ... Component supply position, 75 ... Carrier tape , 76 ... cavity, 79 ... feeding means, 80 ... control device, 91 ... image processing means (image processing computer).

Claims (7)

A main body frame is provided, and a supply reel wound with a carrier tape having a cavity for accommodating a plurality of electronic components at a predetermined interval can be attached to the main body frame, and the carrier tape is sent out by a predetermined pitch by a feeding means. A feeder for sequentially supplying electronic components in the cavity to a component supply position;
Before picking the electronic component from the component supply position of the feeder, the electronic component in the cavity of the supplied to the component supply position, imaged by the component camera from below of the cavity,
Obtain the center position of the electronic component based on the captured image,
Thereafter, the center position of the electronic component is sucked by a suction nozzle and mounted on a printed circuit board. 2. The reference mark according to claim 1, wherein a reference mark is provided in the vicinity of the component supply position, the reference mark is imaged by a reference mark camera, and a position error of the center position of the component camera with respect to the mounting apparatus main body is corrected. Electronic component mounting method. A main body frame is provided, and a supply reel wound with a carrier tape having a cavity for accommodating a plurality of electronic components at a predetermined interval can be attached to the main body frame, and the carrier tape is sent out by a predetermined pitch by a feeding means. A feeder for sequentially supplying electronic components in the cavity to a component supply position;
Irradiation means for irradiating illumination light from above the electronic component in the cavity supplied to the component supply position;
A component camera that images the electronic components in the cavity supplied to the component supply position from below;
Image processing means for processing an image of an electronic component imaged by the component camera;
A nozzle holder that sucks the center position of the electronic component acquired by image processing by the image processing means and holds a suction nozzle to be mounted on a printed circuit board;
An electronic component mounting apparatus characterized by comprising: 4. The electronic component mounting apparatus according to claim 3 , wherein the component camera is built in the feeder. 4. The electronic component mounting apparatus according to claim 3 , wherein the component camera is disposed outside the feeder and images the electronic component in the cavity from below via a mirror. 5. The feeder according to claim 3 or 4 , wherein the feeder is provided with a reference mark in the vicinity of the component supply position, and includes a reference mark camera that images the reference mark, and the reference mark camera captures the reference mark. An electronic component mounting apparatus, wherein a position error of a center position of the component camera with respect to the apparatus main body is corrected. In to claims 3 any one of claims 6, electronic component mounting apparatus characterized by comprising said illumination means to said suction nozzle.

Images