JP5493389B2 - Circuit board for light emitting element, light emitting device, and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light-emitting element circuit board and a light-emitting device used for a lighting fixture, a direct-type backlight of a large-sized liquid crystal television, a light guide plate-type backlight of a mobile phone, a moving image illumination auxiliary light source, and other general consumer light sources. The present invention relates to a manufacturing method thereof.

A surface-mounted light-emitting device using a light-emitting element emits light of a bright color that is small and power efficient. In addition, since this light emitting element is a semiconductor element, there is no fear of a broken ball. Further, it has excellent initial driving characteristics and is strong against vibration and repeated on / off lighting. Because of such excellent characteristics, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources. As this light emitting device, a device in which a light emitting element is mounted on a circuit board is used.
As a circuit board for a light emitting element on which a conventional light emitting element is mounted, a glass epoxy wiring board in which a white pigment such as titanium oxide is dispersed in a varnish mainly composed of an aromatic epoxy resin to ensure light reflectance is disclosed ( For example, see Patent Documents 1 to 3). Moreover, the board | substrate which laminated | stacked the white polyimide film and copper foil is disclosed (for example, refer patent document 4).

JP-A-10-202789 JP 2003-152295 A JP 2005-101047 A JP 2008-169237 A

In recent years, output of light emitting elements has been rapidly increased. Therefore, the conventional circuit board for light emitting elements is likely to be deteriorated or discolored by heat caused by light from the light emitting elements. A light-emitting device using such a circuit board for light-emitting elements has a problem that light emission intensity decreases and color unevenness occurs. A thermosetting resin having good light resistance and heat resistance can be varnished and applied to a circuit board, but it is not easy to increase the film thickness to the extent that it has sufficient light shielding properties. In addition, a thermosetting resin having good light resistance and heat resistance has a problem that it is difficult to produce a substrate by itself because the mechanical strength tends to be extremely low.
Accordingly, an object of the present invention is to provide a circuit board for a light-emitting element, a light-emitting device, and a method for manufacturing the same, which can maintain stable light-emitting characteristics for a long time.

  A circuit board for a light-emitting element according to the present invention is a circuit board for a light-emitting element in which a conductive member is formed on an insulating substrate and the light-emitting element is placed. A resin molded body made of a thermosetting resin containing a filler is provided in a filling portion other than the portion where the member is disposed. Accordingly, it is possible to provide a circuit board for a light emitting element that can prevent deterioration and discoloration of the insulating substrate and can maintain stable light emission characteristics for a long period of time.

  The upper surface of the resin molded body is preferably a flat surface having substantially the same height as the upper surface of the conductive member. Thereby, color unevenness can be reduced.

  The thickness of the resin molded body is preferably 50 μm or more. Thereby, deterioration and discoloration of an insulating substrate can be reduced.

  The light-emitting device according to the present invention is a light-emitting device in which a conductive member is formed on an insulating substrate and a light-emitting element is placed thereon, and the conductive member is disposed on the insulating substrate. A resin molded body made of a thermosetting resin containing a filler is provided in a filling portion other than the portion that is formed. Accordingly, it is possible to provide a light emitting device that can prevent deterioration and discoloration of the insulating substrate and can maintain stable light emission characteristics for a long period of time.

  The upper surface of the resin molded body is preferably a flat surface having substantially the same height as the upper surface of the conductive member. Thereby, the color unevenness of the light emitting device can be reduced.

  The thickness of the resin molded body is preferably 50 μm or more. Thereby, deterioration and discoloration of the insulating substrate due to light from the light emitting element can be reduced.

  On the circuit board, it may be made of the same material as that of the resin molded body and may have a wall portion surrounding the light emitting element. By using a thermosetting resin for the wall portion, a light emitting device having excellent heat resistance, light resistance, adhesion, and the like can be provided. Further, the mechanical strength of the light emitting device can be increased by integrally molding the resin molded body and the wall portion.

  The method for manufacturing a circuit board for a light-emitting element according to the present invention includes a first step of forming a conductive member on an insulating substrate, and a step on the insulating substrate other than a portion where the conductive member is formed. And a second step of forming a resin molded body from a thermosetting resin containing a filler. Thereby, deterioration and discoloration of an insulating substrate can be prevented.

  The resin molded body is preferably molded by transfer molding. As a result, it is difficult to form a complicated shape by injection molding, whereas a molded body having a complicated shape can be formed by transfer molding. In particular, the resin molding can be easily molded on the insulating substrate other than the portion where the conductive member is formed.

  The thickness of the conductive member is preferably 50 μm or more. Thereby, resin can be efficiently filled on the insulating substrate other than the portion where the conductive member is formed.

  The method for manufacturing a light emitting device according to the present invention includes a first step of forming a conductive member on an insulating substrate, and a filler on the insulating substrate other than a portion where the conductive member is formed. And a second step of forming a resin molded body from a thermosetting resin containing the same. In the second step, a wall portion surrounding the light emitting element is formed simultaneously with the resin molded body. Thereby, a manufacturing method can be simplified. By integrally molding the resin molded body and the wall portion, a light emitting device with high mechanical strength can be obtained.

  The resin molded body is preferably molded by transfer molding. While it is difficult to form a complicated shape by injection molding, a molded body having a complicated shape can be formed by a transfer mold.

  The thickness of the conductive member is preferably 50 μm or more. Thereby, resin can be efficiently filled on the insulating substrate other than the portion where the conductive member is formed.

  ADVANTAGE OF THE INVENTION According to this invention, the circuit board for light emitting elements which can maintain the stable light emission characteristic for a long period of time, a light-emitting device, and those manufacturing methods can be provided.

It is a schematic sectional drawing which shows the circuit board for light emitting elements which concerns on 1st Embodiment of this invention. It is a schematic plan view which shows the circuit board for light emitting elements which concerns on 1st Embodiment of this invention. It is a schematic sectional drawing which shows the light-emitting device which concerns on 1st Embodiment of this invention. 1 is a schematic plan view showing a light emitting device according to a first embodiment of the present invention. It is a schematic sectional drawing which shows the manufacturing process of the light-emitting device which concerns on 1st Embodiment of this invention. It is a schematic sectional drawing which shows the light-emitting device which concerns on 2nd Embodiment of this invention. It is a schematic plan view which shows the light-emitting device which concerns on 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing process of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the light-emitting device which concerns on 3rd Embodiment of this invention. It is a schematic plan view which shows the light-emitting device which concerns on 3rd Embodiment of this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment.

<First Embodiment>
FIG. 1 is a schematic cross-sectional view showing a circuit board for a light emitting device according to a first embodiment of the present invention. FIG. 2 is a schematic plan view showing the circuit board for light emitting device according to the first embodiment of the present invention.

  The light emitting element circuit board 100 according to the present embodiment includes an insulating substrate 110, a conductive member 120, and a resin molded body 130. The conductive member 120 is made of metal and is formed on the insulating substrate 110. The conductive member 120 is patterned on the upper surface of the insulating substrate 110. The thickness of the conductive member 120 is not particularly limited and is preferably as thick as possible. On the insulating substrate 110, the resin molded body 130 is provided in the filling portion 140 other than the portion where the conductive member 120 is formed. The resin molded body 130 is made of a thermosetting resin containing a filler. The upper surface of the resin molded body 130 is substantially the same height as the upper surface of the conductive member 120 and does not protrude from the conductive member 120. The upper surface of the resin molded body 130 is preferably a flat surface having substantially the same height as the upper surface of the conductive member 120. Thereby, stable light emission characteristics can be obtained. Moreover, it is preferable that the thickness of the resin molding 130 is 50 micrometers or more. Thereby, deterioration and discoloration of the insulating substrate 110 due to light from the light emitting element can be reduced. The side surface of the conductive member 120 has a so-called overhang shape dug below the conductive member 120. Thereby, the resin molding 130 can be firmly adhered.

(Insulating substrate)
The insulating substrate is a plate-like member, and a conductive member is disposed on the upper surface. The insulating substrate is not particularly limited as long as it is a material having appropriate mechanical strength and insulating properties. Examples thereof include a glass epoxy substrate, a glass composite substrate, a paper phenol substrate, a BT resin substrate, a flexible printed substrate, a substrate formed by extrusion molding a thermoplastic engineering polymer, or a combination thereof. The insulating substrate preferably has a linear expansion coefficient close to that of metal, particularly copper or copper alloy. An anchor hole penetrating from the upper surface to the lower surface may be provided in the insulating substrate. The anchor hole is preferably provided at a position where the conductive member is formed. Further, the insulating substrate may have a multilayer structure having a conductive member inside. The thickness of the insulating substrate is not particularly limited, but is preferably 40 μm or more. Thereby, the mechanical strength of a circuit board and a light-emitting device can be raised.

(Conductive member)
The conductive member is a member disposed on at least the insulating substrate, and has a function as an electrode for energizing the light emitting element. The conductive member is formed in a predetermined pattern shape on the insulating substrate. The pattern of the conductive member can be formed by performing an etching process, for example. The conductive member may be formed on the upper surface and the lower surface of the insulating substrate.
When the light emitting device circuit board is separated into individual light emitting devices, the conductive member is provided on each of the two opposite sides of the light emitting device having a substantially square shape when viewed from above. It is provided so as to be sandwiched between them. Thus, the two conductive members function as a pair of positive and negative electrodes.

The shape of the upper surface of the conductive member can be various shapes such as a substantially square shape, a polygonal shape, a corrugated shape, or a shape having a notch. In addition, the region where the light emitting element is placed is preferably a flat surface. In addition to the light-emitting element, a protective element or the like can be placed.
The thickness of the conductive member is not particularly limited and is preferably as thick as possible. Specifically, it is preferably 50 μm or more. When the thickness of the conductive member is less than 50 μm, clogging tends to occur when the resin molded body is molded by transfer molding.
The side surface of the conductive member may be a vertical surface, but preferably has a so-called overhang shape dug below the conductive member. Thereby, a resin molding can be firmly stuck. As a method for forming an overhang shape, for example, it can be formed by a subtractive method using chemical etching.

  The conductive member is preferably formed of at least one selected from the group consisting of copper, copper alloys, and iron alloys, for example. The surface of the conductive member may be plated with metal such as silver, a silver alloy, gold, or palladium.

(Resin molding)
The resin molded body is made of a thermosetting resin containing a filler. Further, it is preferable that 60% or more of light having a wavelength equal to the wavelength of light emitted from the light emitting element can be shielded, more preferably 90% or more can be shielded. The resin molded body is provided in a filling portion that is a portion on the insulating substrate where the conductive member is not formed. By providing the resin molded body in the filling portion, it is possible to prevent light from the light emitting element from leaking to the insulating substrate side from a region other than the portion where the conductive member is formed.

  The upper surface of the resin molded body is preferably a flat surface. In particular, a flat surface having substantially the same height as the upper surface of the conductive member is preferable. Thereby, the color unevenness of the light emitting device can be reduced. The thickness of the resin molded body may be a thickness that can suppress light leakage to the insulating substrate side, and is preferably 50 μm or more, for example. Thereby, deterioration of the insulating substrate due to light from the light emitting element can be prevented. It is preferable that the resin molded body is formed on all of the upper surface of the insulating substrate except for the region where the conductive member is formed.

The resin molded body only needs to be able to block light from the light emitting element as described above, and preferably has a small difference in linear expansion coefficient from the conductive member or the insulating substrate. As a preferable material, a thermosetting resin can be used. Specifically, it is formed of at least one selected from the group consisting of an epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, and a urethane resin. Is preferred. Particularly preferred are epoxy resins, modified epoxy resins, silicone resins, and modified silicone resins. Among epoxy resins, modified epoxy resins, acrylate resins, and urethane resins, those that do not contain an aromatic component in the monomer molecule are more preferable.
Then, by mixing fine particles such as TiO ₂ , SiO ₂ , Al ₂ O ₃ , MgO, MgCO ₃ , CaCO ₃ , Mg (OH) ₂ , and Ca (OH) ₂ as fillers in these resins, light can be transmitted. The rate is adjusted so that about 60% or more of the light from the light emitting element is shielded, more preferably, about 90% or more is shielded. The resin molded body is preferably shielded by reflecting light. Therefore, it is preferable that the reflectance with respect to the light from the light emitting element is 60% or more, more preferably 90% or more.

The linear expansion coefficient of the resin molded body is preferably controlled so that the difference from the linear expansion coefficient of the conductive member is small. The difference is preferably 50% or less. For example, when copper is used as the conductive member, the linear expansion coefficient of the resin molded body is preferably 17 ppm ± 50%. In this case, it is preferable that the volume concentration of the filler in the resin molding is in the range of 75% to 85%. Thereby, the difference between the linear expansion coefficient of the resin molded body and the linear expansion coefficient of the conductive member is reduced, and the warpage caused by the difference in the linear expansion coefficient can be reduced. Moreover, it is preferable to control the linear expansion coefficient of the resin molding so that the difference from the linear expansion coefficient of the insulating substrate is small. Thereby, the curvature of the circuit board for light emitting elements can be decreased. By reducing the warpage, internal damage such as cutting of the conductive wire can be reduced, and the positional deviation at the time of singulation can be suppressed, and manufacturing can be performed with high yield. In addition to the filler described above, the resin molded body may contain a light diffusing agent, each color pigment, a fluorescent material, a reflective material, a light shielding material, an antioxidant material, and the like.
The resin molded body preferably contains a white pigment. The white pigment is not particularly limited as long as it is a colorless and transparent powder having a refractive index different from that of the resin. The white pigment preferably has an average particle size of 0.1 μm or more and less than 5 μm. The white pigment may be added as long as it does not hinder the flow of the thermosetting resin during transfer molding.

(Light emitting device)
The light emitting device according to this embodiment will be described. FIG. 3 is a schematic cross-sectional view showing the light emitting device according to the first embodiment of the present invention. FIG. 4 is a schematic plan view showing the light emitting device according to the first embodiment of the present invention.
The light emitting device 200 according to the present embodiment includes an insulating substrate 110, a conductive member 120, a resin molded body 130, a light emitting element 170, and a sealing member 180. The conductive member 120 is made of metal and is formed on the insulating substrate 110. The conductive member 120 is patterned on the upper surface of the insulating substrate 110. The thickness of the conductive member 120 is not particularly limited and is preferably as thick as possible. On the insulating substrate 110, the resin molded body 130 is provided in the filling portion 140 other than the portion where the conductive member 120 is formed. The resin molded body 130 is made of a thermosetting resin containing a filler. The upper surface of the resin molded body 130 has substantially the same height as the upper surface of the conductive member 120 and does not protrude from the conductive member 120. The upper surface of the resin molded body 130 is preferably a flat surface having substantially the same height as the upper surface of the conductive member 120. Thereby, stable light emission characteristics can be obtained. Moreover, it is preferable that the thickness of the resin molding 130 is 50 micrometers or more. Thereby, deterioration and discoloration of the insulating substrate 110 due to light from the light emitting element 170 can be reduced. The light emitting element 170 is placed on a light emitting element circuit board including the insulating substrate 110, the conductive member 120, and the resin molded body 130. On the light emitting element circuit board, a sealing resin made of a translucent resin for sealing the light emitting element 170 is provided. The sealing member 180 can contain a fluorescent material.
The shape of the light emitting device 200 is not particularly limited, but may be a polygonal shape such as a substantially rectangular parallelepiped, a substantially cube, or a substantially hexagonal column.

(Light emitting element)
Various light emitting elements such as light emitting diodes and semiconductor laser elements can be used. A light emitting element having an arbitrary wavelength can be selected. The composition, emission color, size, number, and the like of the light emitting element to be used can be appropriately selected according to the purpose. In addition, the shape and size of the conductive member and the resin molded body can be changed as appropriate in accordance with the size and number of light emitting elements to be used.

In the case of a light-emitting device having a fluorescent material, a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferable. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal. Further, a light-emitting element that outputs not only light in the visible light region but also ultraviolet rays and infrared rays can be obtained. Furthermore, a light receiving element or the like can be mounted together with the light emitting element.

(Sealing member)
The sealing member covers the light emitting element and is provided so as to come into contact with the conductive member. The light emitting element, the light receiving element, the protective element, and further the electronic component such as the conductive wire, dust, moisture, Is a member that protects against external force.

As a material for the sealing member, a material having a light-transmitting property capable of transmitting light from the light-emitting element and having light resistance that is not easily deteriorated by them is preferable. Specific examples of the material include a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, an acrylic resin composition, and the like having a light-transmitting insulating property that can transmit light from a light-emitting element. A resin composition can be mentioned. Furthermore, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin containing at least one of these resins can also be used.
Furthermore, it is not limited to these organic materials, and inorganic materials such as glass and silica sol can also be used. In addition to such materials, a colorant, a light diffusing agent, a light reflecting material, a fluorescent material, and the like can be included as desired. The filling amount of the sealing member may be an amount that covers the electronic component.

  The shape of the outer surface of the sealing member can be variously selected according to the light distribution characteristics. For example, the directivity can be adjusted by making the upper surface into a convex lens shape, a concave lens shape, a Fresnel lens shape, or the like. In addition to the sealing member, a lens member may be provided separately.

(Fluorescent substance)
The sealing member can also contain a fluorescent member that emits light having a different wavelength by absorbing at least part of the light from the light emitting element.

  As the fluorescent member, it is more efficient to convert the light from the light emitting element into a longer wavelength. However, the present invention is not limited to this, and various fluorescent members such as one that converts light from the light emitting element into a short wavelength or one that further converts light converted by another fluorescent member can be used. Such a fluorescent member may be formed of a single layer of a single type of fluorescent material or a single layer in which two or more types of fluorescent materials are mixed. Two or more single layers containing the same may be laminated, or two or more single layers each containing two or more kinds of fluorescent substances may be laminated.

As the fluorescent member, for example, when a semiconductor light-emitting element having a nitride-based semiconductor as a light-emitting layer is used as the light-emitting element, any member that absorbs light from the light-emitting element and converts it into light of a different wavelength may be used. For example, nitride phosphors / oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce, more specifically, Eu-activated α or β sialon phosphors, various alkaline earths Metal nitride silicate phosphors, lanthanoid elements such as Eu, alkaline earth metal halogenapatite phosphors mainly activated by transition metal elements such as Mn, alkaline earth halosilicate phosphors, alkaline earths Metal silicate phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal silicate, alkaline earth metal sulfide, alkaline earth metal thiogallate, alkaline earth metal Rare earth aluminate, rare earth silicate or E mainly activated by lanthanoid elements such as silicon nitride, germanate, or Ce It is preferably at least one selected from organic and organic complexes mainly activated by a lanthanoid element such as u. Preferably, Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, which is a rare earth aluminate phosphor mainly activated by a lanthanoid element such as Ce. Y ₃ (Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce, (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ is a YAG phosphor represented by a composition formula. Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu, or the like. Furthermore, phosphors other than the above phosphors and having the same performance, function, and effect can be used.

(Production method)
Hereinafter, a method for manufacturing the light emitting device according to this embodiment will be described. FIG. 5 is a schematic cross-sectional view showing the method for manufacturing the light emitting device according to the first embodiment of the present invention.

A thin film of a conductive member 120 such as a copper foil is attached to the plate-like insulating substrate 110. Further, chemical etching is performed on the conductive member 120 to form a desired pattern. As a result, a plurality of conductive members 120 spaced from each other are patterned on the insulating substrate 110.
In addition to a method of forming the pattern of the conductive member 120 by chemical etching, a plurality of conductive members 120 processed in advance into a desired shape are prepared, and the conductive substrate 120 is separated from each other so as to be separated from each other. It may be pasted on.
Silver plating or the like may be applied to the surface of the conductive member 120.

  Next, a resin molded body 130 that can reflect light from the light emitting element is provided. The resin molding can be formed by transfer molding.

  When the resin molded body 130 is formed by transfer molding, the insulating substrate 110 on which the pattern of the conductive member 120 is formed is sandwiched between molds 190 including an upper mold 192 and a lower mold 194. By sandwiching between the upper mold 192 and the lower mold 194, a space corresponding to the resin molded body 130 is provided between the upper surface of the insulating substrate 110 exposed from the conductive member 120 and the mold 190.

  A thermosetting resin containing a filler is poured into a mold 190 sandwiched between the upper mold 192 and the lower mold 194 by a transfer molding process.

  In the transfer molding process, a pellet-shaped thermosetting resin having a predetermined size is placed in a predetermined container. Pressure is applied to the predetermined container. A molten thermosetting resin is poured into a portion sandwiched between the upper mold 192 and the lower mold 194 connected from the predetermined container. The upper mold 192 and the lower mold 194 are heated to a predetermined temperature, and the poured thermosetting resin is cured. This series of processes is called a transfer molding process.

  The filler to be contained in the thermosetting resin is preferably used because the average particle size is 10 μm or more because high filling is possible and the occurrence of short shots can be prevented. At this time, the thickness of the conductive member 120 is preferably 50 μm or more. If the thickness of the conductive member 120 is less than 50 μm, clogging is likely to occur when the thermosetting resin is poured, and the conductive member 120 may not be sufficiently filled. By setting the thickness of the conductive member 120 to 50 μm or more, the yield of the transfer molding process can be increased.

The poured thermosetting resin is heated and cured. Thereby, the resin molding using a thermosetting resin is shape | molded. As a result, the circuit board 100 for a light-emitting element having excellent heat resistance, light resistance, adhesion, and the like can be obtained. After curing, the light emitting element circuit board 100 can be obtained by removing from the mold.
When the curing is insufficient, the post-curing is performed to improve the mechanical strength of the resin molded body to such an extent that no work problems occur.

  In order to mount the light emitting element 170, the upper mold 192 and the lower mold 194 are removed. In the case where the curing is insufficient, it is preferable to improve the mechanical strength of the resin molded body to such an extent that post-curing is performed and no problem occurs in work.

  Next, the light emitting element 170 is bonded onto the conductive member 120 using a bonding member (not shown), and connected to the conductive member 120 using a conductive wire. Although the light emitting element having positive and negative electrodes on the same surface side is used here, a light emitting element having positive and negative electrodes formed on different surfaces can also be used. Further, the light emitting element may be mounted face-down without using a wire.

  Thereafter, the sealing member 180 is formed by a method such as transfer molding, potting or printing so as to cover the light emitting element 170 and the conductive wire. Here, the sealing member 180 has a single-layer structure, but may have a multilayer structure of two or more layers.

  Through the above steps, an assembly of light emitting devices can be obtained. Next, the light emitting device 200 can be obtained by cutting the light emitting device assembly at predetermined positions into individual pieces. Various methods such as dicing with a blade and dicing with a laser beam can be used as the method of dividing into pieces.

In addition, when dividing into pieces, you may cut | disconnect in the position containing an electroconductive member, and may cut | disconnect in the position spaced apart from an electroconductive member. When the conductive member is cut at a position including the conductive member, the conductive member is exposed also on the side surface of the light emitting device, and solder or the like is easily joined. Also, when cutting at a position away from the conductive member, since only the resin such as a resin molded body or a sealing member is cut, it is compared to cutting the conductive member (metal) and the resin together. And can be easily cut.
The step of separating the assembly of the light emitting devices can be performed after the step of mounting the light emitting element, or after removing the mold and before the step of mounting the light emitting element.

Second Embodiment
FIG. 6 is a schematic cross-sectional view showing a light emitting device according to the second embodiment of the present invention. FIG. 7 is a schematic plan view showing a light emitting device according to the second embodiment of the present invention. The light emitting device according to the second embodiment differs from the light emitting device of the first embodiment described above in the arrangement of the reflecting member and the light transmissive member. The same members as those of the first embodiment are denoted by the same reference numerals, and the description overlapping with that of the first embodiment may be omitted.
The light emitting device 201 according to this embodiment includes an insulating substrate 110, a conductive member 120 formed on the insulating substrate 110, a resin molded body 130, a light emitting element 170, and a sealing member 180. . The resin molded body 130 is made of a thermosetting resin containing a filler, and is provided in the filling portion 140 other than the portion where the conductive member 120 is formed on the upper surface of the insulating substrate 110. On the light emitting element circuit board, there is a wall portion 150 surrounding the light emitting element 170. The light emitting device 201 according to the present embodiment includes a concave portion 160 that includes the upper surface of the light emitting element circuit board and the inner wall surface of the wall portion 150. The upper surface of the light emitting element circuit board is the bottom surface of the recess 160, and the inner wall surface of the wall 150 is the side surface of the recess 160. The light emitting element is disposed in the recess 160 and is electrically connected to the conductive member 120 exposed on the bottom surface of the recess 160 via a wire. It is preferable that the recess 160 extends in the opening direction. Thereby, the light from the light emitting element 170 can be efficiently extracted in the opening direction of the recess 160. The opening shape of the recess 160 can be a substantially circular shape, a substantially elliptical shape, a substantially polygonal shape, or the like. A sealing member 180 that covers the light emitting element 170 is disposed in the recess 160. The sealing member 180 can contain a fluorescent material.
In the light emitting device 201 according to the present embodiment, the wall 150 is integrally formed with the resin molded body 130. Thereby, the mechanical strength of the light emitting device can be increased.

(Method for Manufacturing Light-Emitting Device According to Second Embodiment)
FIG. 8 is a schematic cross-sectional view showing the method for manufacturing the light emitting device according to the second embodiment.
In this manufacturing method, a method for simultaneously molding a resin molded body and a wall portion will be described.

  The upper mold 192 is formed with a recess 192a corresponding to the wall portion of the light emitting device. In addition, a protruding portion 192 b is formed in a portion of the upper mold 192 corresponding to the concave portion of the light emitting device so as to contact the conductive member 120.

A thermosetting resin is poured into the space sandwiched between the upper mold 192 and the lower mold 194 by a transfer molding process to mold the resin molded body 130 and the wall 150.
Thus, by simultaneously molding the resin molded body 130 and the wall portion 150, the manufacturing method can be simplified.
<Third Embodiment>
FIG. 9 is a schematic cross-sectional view showing a light emitting device according to the third embodiment of the present invention. FIG. 10 is a schematic plan view showing a light emitting device according to the third embodiment of the present invention. The light emitting device according to the third embodiment differs from the light emitting device according to the first embodiment described above in the arrangement of the reflecting member and the light transmissive member. The same members as those of the first embodiment are denoted by the same reference numerals, and the description overlapping with that of the first embodiment may be omitted.
The light emitting device 202 according to this embodiment includes an insulating substrate 110, a conductive member 120 formed on the insulating substrate 110, a resin molded body 130, a light emitting element 170, and a sealing member 180. . The resin molded body 130 is made of a thermosetting resin containing a filler, and is provided in the filling portion 140 other than the portion where the conductive member 120 is formed on the upper surface of the insulating substrate 110. On the light emitting element circuit board, there is a wall portion 150 surrounding the light emitting element 170. The light emitting device according to the present embodiment includes a concave portion 160 that includes the upper surface of the circuit board for light emitting elements and the inner wall surface of the wall portion 150. The upper surface of the light emitting element circuit board is the bottom surface of the recess 160, and the inner wall surface of the wall 150 is the side surface of the recess 160. The light emitting element 170 is disposed in the recess 160 and is electrically connected to the conductive member 120 exposed on the bottom surface of the recess 160 via a wire. It is preferable that the recess 160 extends in the opening direction. Thereby, the light from the light emitting element 170 can be efficiently extracted in the opening direction of the recess 160. The opening shape of the recess 160 can be a substantially circular shape, a substantially elliptical shape, a substantially polygonal shape, or the like. In the present embodiment, the outer diameter of the wall 150 is smaller than the width of the light emitting device 202. A sealing resin 180 made of a translucent resin that covers the wall 150 and seals the light emitting element 170 is provided on the circuit board 100. The sealing member 180 can contain a fluorescent material. The sealing member 180 has a cylindrical lens shape on the upper surface. Thereby, the directivity characteristic of the light radiate | emitted to the opening direction of the recessed part 160 can be adjusted.

  The light-emitting device of the present invention can be used as a lighting fixture, a display, a backlight of a mobile phone, a flashlight of a camera, a moving image illumination auxiliary light source, and the like.

DESCRIPTION OF SYMBOLS 100 Circuit board 110 for light emitting elements Insulating board | substrate 120 Conductive member 130 Resin molding 140 Filling part 150 Wall part 160 Recess 170 Light emitting element 180 Sealing member 190 Mold 192 Upper mold 192a Recess 192b Projection part 194 Lower mold 200 Light emitting device

Claims (13)

A light emitting element circuit board in which a conductive member having a thickness of 50 μm or more is disposed on an insulating substrate, and a light emitting element is placed on the conductive member ,
The side surface of the conductive member has a shape dug below the conductive member,
The insulating substrate is a glass epoxy substrate, a glass composite substrate, a paper phenol substrate, a BT resin substrate, a flexible printed substrate, a substrate formed by extruding a thermoplastic engineering polymer, or a combination thereof,
The insulating substrate is provided with a resin molded body made of a thermosetting resin containing a filler in a filling portion other than a portion where a conductive member is disposed,
The resin molded body has a thickness of 50 μm or more, can block 60% or more of light having a wavelength equal to the wavelength of light emitted from the light emitting element to be mounted , and is formed on the upper surface of the insulating substrate. A circuit board for a light emitting element, which is provided only on the side.   2. The circuit board for a light emitting element according to claim 1, wherein the upper surface of the resin molded body is a flat surface having substantially the same height as the upper surface of the conductive member.   The light emitting element circuit board according to claim 2, wherein an upper surface of the light emitting element circuit board is a flat surface constituted by an upper surface of the resin molded body and an upper surface of the conductive member.   The circuit board for light emitting elements according to claim 1, further comprising a wall portion that is made of the same material as the resin molded body and surrounds the light emitting elements on the circuit board for light emitting elements. A light emitting element circuit board in which a conductive member having a thickness of 50 μm or more is disposed on an insulating substrate, and a light emitting element is placed on the conductive member ,
The insulating substrate is a glass epoxy substrate, a glass composite substrate, a paper phenol substrate, a BT resin substrate, a flexible printed substrate, a substrate formed by extruding a thermoplastic engineering polymer, or a combination thereof,
The insulating substrate is provided with a resin molded body made of a thermosetting resin containing a filler in a filling portion other than a portion where a conductive member is disposed,
The resin molded body has a thickness of 50 μm or more, can block 60% or more of light having a wavelength equal to the wavelength of light emitted from the light emitting element to be mounted , and is formed on the upper surface of the insulating substrate. Only on the side,
A circuit board for a light-emitting element, comprising a wall portion integrally formed with the resin molded body and surrounding the light-emitting element. The light emitting element circuit board according to claim 5 , wherein an outer diameter of the wall portion is smaller than a width of the light emitting element circuit board. The circuit board for a light-emitting element according to claim 5, wherein the side surface of the conductive member has a shape dug below the conductive member. On the light emitting element circuit board according to any one of claims 1 to 7, wherein the light emitting element is mounted, the light emitting device characterized by comprising sealed by a sealing member. A first step of forming a conductive member having a thickness of 50 μm or more on an insulating substrate;
The upper surface of the conductive member and the lower surface of the insulating substrate are sandwiched between an upper mold and a lower mold, and a thermosetting containing a filler on the insulating substrate other than a portion where the conductive member is formed. A second step of forming a resin molded body by transfer molding with a conductive resin,
The insulating substrate is a glass epoxy substrate, a glass composite substrate, a paper phenol substrate, a BT resin substrate, a flexible printed substrate, a substrate formed by extruding a thermoplastic engineering polymer, or a combination thereof,
The resin molded body is capable of shielding 60% or more of light having a wavelength equal to the wavelength of light emitted from the light emitting element to be placed;
In the second step, a wall portion surrounding the light emitting element is formed at the same time as the resin molded body . The method for manufacturing a light emitting element circuit board according to claim 9, wherein an outer diameter of the wall portion is smaller than a width of the light emitting element circuit board. A first step of forming a conductive member having a thickness of 50 μm or more on an insulating substrate;
The upper surface of the conductive member and the lower surface of the insulating substrate are sandwiched between an upper mold and a lower mold, and a thermosetting containing a filler on the insulating substrate other than a portion where the conductive member is formed. A second step of forming a resin molded body by transfer molding with a conductive resin,
The insulating substrate is a glass epoxy substrate, a glass composite substrate, a paper phenol substrate, a BT resin substrate, a flexible printed substrate, a substrate formed by extruding a thermoplastic engineering polymer, or a combination thereof,
The resin molded body is capable of shielding 60% or more of light having a wavelength equal to the wavelength of light emitted from the light emitting element to be placed;
Wherein in the second step, the upper surface of the circuit board for the light-emitting element, the resin molded body upper surface and the conductive light emission element circuit you and forming a flat surface formed on the upper surface of the member A method for manufacturing a substrate. The light emitting device according to any one of claims 9 to 11, wherein, in the first step, a side surface of the conductive member is formed into a shape dug below the conductive member by chemical etching. A method of manufacturing a circuit board. It has a 3rd process of mounting the light emitting element on the circuit board for light emitting elements manufactured by the manufacturing method of the circuit board for light emitting elements according to any one of claims 9 to 12. A method for manufacturing a light emitting device.

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